Metal-ceramic substrate and process for producing a metal-ceramic substrate

Abstract

A metal-ceramic substrate, which can be used as a circuit board and comprises - a ceramic element and - at least one component metallization bonded to the ceramic element, wherein: the component metallization is structured in order to form conductor tracks; the ceramic element comprises magnesium oxide; and a magnesium oxide proportion is greater than 60 wt.-%, preferably greater than 80% and especially preferably greater than 95 wt.-%.

Description

[0001] Metal-ceramic substrate and method for producing a metal-ceramic substrate

[0002] The present invention relates to a metal-ceramic substrate and a method for producing a metal-ceramic substrate.

[0003] Metal-ceramic substrates are well known as printed circuit boards or circuit boards from the prior art, for example from DE 10 2013 104 739 A1, DE 19 927 046 B4, and DE 10 2009 033 029 A1. Typically, connection pads for electrical components and conductor tracks are arranged on one component side of the metal-ceramic substrate or the metal-ceramic substrate, wherein the electrical components and the conductor tracks can be interconnected to form electrical circuits. Key components of the metal-ceramic substrates are an insulating layer, preferably made of a ceramic, and at least one metal layer bonded to the insulating layer. Due to their comparatively high insulation strengths, insulating layers made of ceramic have proven particularly advantageous in power electronics.By structuring the metal layer, conductor tracks and / or connection surfaces for the electrical components can then be realized.

[0004] Based on the prior art, the present invention has for its object to provide a metal-ceramic substrate which is further improved compared to the known metal-ceramic substrates, in particular with regard to thermal shock resistance of the bond between the metal layer and the ceramic element and dissipation of heat when heat is generated on the component side of the metal-ceramic substrate due to operation.

[0005] The present invention solves this problem with a metal-ceramic substrate according to claim 1 and a method for producing a metal-ceramic substrate according to claim 6. Further embodiments can be found in the dependent claims and the description. According to a first aspect of the present invention, a metal-ceramic substrate usable as a printed circuit board is provided, comprising

[0006] - a ceramic element and

[0007] - at least one component metallization which is bonded to the ceramic element, wherein the at least one component metallization is structured to form conductor tracks, wherein the ceramic element comprises magnesium oxide, wherein a proportion of magnesium oxide is greater than 60% by weight, preferably greater than 80% and particularly preferably greater than 95% by weight.

[0008] Compared to the metal-ceramic substrates known from the prior art, the metal-ceramic substrate uses a ceramic element with a comparatively high magnesium oxide content. In particular, the ceramic element consists essentially exclusively of magnesium oxide. By "consisting exclusively of magnesium oxide," the person skilled in the art understands in particular a magnesium oxide content that amounts to a value between 95% by weight and 100% by weight. It has surprisingly been found that magnesium oxide can be used to provide a ceramic element with a comparatively high thermal conductivity, which has a positive effect on the thermal shock resistance of the manufactured metal-ceramic substrate. This significantly improves the bonding process of the at least one metal layer to the ceramic element and the service life of the metal-ceramic substrate.In particular, it is provided that at least one metal layer is bonded to the ceramic element. After the bonding process, conductor tracks and / or connection pads are formed during structuring so that the metal-ceramic substrate can be used as a printed circuit board. The bonded and structured at least one metal layer then forms the component metallization. In particular, it has been found that the thermal expansion coefficient of magnesium oxide typically has a value between 11 x 10 '. 6 1 / K and 13 x 10 ' 61 / K and is thus comparatively close to that of copper, so that the difference between the thermal expansion coefficients is as small as possible, especially when a copper metal layer is bonded to the ceramic element. This has a positive effect on the thermal shock resistance and reduces the formation of thermomechanical stress during temperature changes. This significantly improves the service life of the metal-ceramic substrates, especially when used as circuit boards. Furthermore, it is preferably provided that the thermal conductivity assumes a value that is greater than 30 W / mK, particularly preferably between 40 and 59 W / mK, and particularly preferably between 55 and 59 W / mK.

[0009] Furthermore, magnesium oxide proves to be a comparatively cost-effective alternative to aluminum oxide or HPS ceramics, which at the same time have a comparatively high thermal conductivity.

[0010] Preferably, the component metallization has a first thickness and the back metallization, which is bonded to the ceramic element on the side opposite the component metallization, has a second thickness. The ceramic element has a third thickness. Preferably, the third thickness has a value between 100 pm and 1000 pm and the second and / or first thickness has a value between 200 and 800 pm. Particularly preferably, the second thickness and the first thickness correspond to one another in order to counteract any deflection during a bonding process of the at least one metal layer to the ceramic element. It is also conceivable for the third thickness to be smaller than the first thickness and / or second thickness.

[0011] Preferably, the ceramic element comprising magnesium oxide is doped with an accompanying material. In particular, the accompanying material is selected such that it does not impair the thermal conductivity, in particular does not lead to deviations in the thermal conductivity that are less than 50%, preferably less than 25%, and particularly preferably less than 20% of the thermal conductivity of the magnesium oxide. Preferably, the proportion of the accompanying material in the ceramic element assumes a value that is less than 10% by weight, in particular less than 5% by weight, and particularly preferably less than 3% by weight. This doping advantageously makes it possible to influence and, in particular, improve further properties of the magnesium oxide.For example, it is possible to increase the density or strength by adding the accompanying material, which also further increases the mechanical stability of the ceramic element. This, in turn, allows the ceramic element to be made thinner.

[0012] Accompanying materials that contribute to spinel formation, such as Al2O3, and / or reinforcement, such as ZrO2, are conceivable. The bonding ability to copper is preferably improved by an accompanying material such as copper or a mixture of copper and Al2O3. Due to their grain sizes and the associated strength, CaO and Y2O3 are also preferred accompanying materials. In particular, the use of ZrO2 has proven particularly advantageous for the material microstructure, as it leads to transformation strengthening.

[0013] Preferably, magnesium oxide has a density of between 3 and 4 g / cm 3, preferably a value between 3.1 and 3.8 g / cm 3 and particularly preferably between 3.35 and 3.58 g / cm 3 The density value refers to the value present in the manufactured metal-ceramic substrate. This provides a comparatively high-density magnesium oxide that advantageously exhibits high thermal conductivities.

[0014] Preferably, the ceramic element comprises a coating, in particular a ceramic coating, preferably an aluminum oxide coating, arranged between the ceramic element and the component metallization. This proves particularly advantageous during the bonding process because the resulting ceramic coating serves as an additional adhesion promoter and, in particular, contributes to surface hardening through spinel formation (magnesium aluminum oxide).

[0015] Conceivable materials for the at least one metal layer or the component metallization in the metal-ceramic substrate include copper, aluminum, molybdenum, tungsten, nickel, and / or their alloys, such as CuZr, AlSi, or AlMgSi, as well as laminates such as CuW, CuMo, CuAl, and / or AlCu, or MMC (metal matrix composite), such as CuW, CuM, or AlSiC. Furthermore, it is preferably provided that the at least one metal layer on the manufactured metal-ceramic substrate is surface-modified, in particular as component metallization. Possible surface modifications include, for example, sealing with a precious metal, in particular silver and / or gold, or (electroless) nickel or ENIG ("electroless nickel immersion gold"), or edge encapsulation on the metallization to suppress crack formation or crack widening.

[0016] According to a preferred embodiment of the present invention, a bonding layer is formed in the manufactured metal-ceramic substrate between the component metallization and the ceramic element, wherein an adhesion promoter layer of the bonding layer has a sheet resistance that is greater than 0.5 ohms / sq, preferably greater than 1 ohm / sq and particularly preferably greater than 2 ohms / sq or even greater than 15 ohms / sq. The sheet resistance is directly related to a proportion of active metal in the adhesion promoter layer, which is crucial for the bonding of the at least one metal layer to the ceramic element. The sheet resistance increases with a decreasing proportion of active metal in the bonding layer. A correspondingly high sheet resistance therefore corresponds to a low proportion of active metal in the adhesion promoter layer.

[0017] The sheet resistance does not depend on a single parameter, but can be influenced by the interaction of several parameters. For example, the purity of the active metal, the thickness of the bonding layer, and / or the surface roughness of the ceramic element also contribute to determining the sheet resistance. In particular, high sheet resistances can only be achieved through the interaction of at least two parameters.

[0018] It has been found that with an increasing proportion of active metal, the formation of brittle, intermetallic phases is promoted, which in turn is detrimental to the peel strength of the metal layer on the insulation layer. In other words: the claimed sheet resistances describe bonding layers whose peel strength is improved, i.e. increased, due to the reduced formation of brittle intermetallic phases. By specifically adjusting the claimed sheet resistances, particularly strong bonds between the at least one metal layer and the ceramic element can be achieved. Such an increased bond strength has a beneficial effect on the service life of the metal-ceramic substrate. To determine the sheet resistance, it is provided that the metal layer and, if applicable,a solder base layer is removed again, for example by etching. Using a four-point measurement, a sheet resistance is then measured on the outside or underside of the metal-ceramic substrate freed from the at least one metal layer and the solder base layer. In particular, the sheet resistance of a material sample is to be understood as its resistance relative to a square surface area. It is customary to designate the surface resistance with the unit ohm / sq(square). The physical unit of sheet resistance is ohm. Preferably, it is provided that a thickness of the bonding layer measured in the stacking direction, averaged over several measuring points within a predetermined area or in several areas that run or run parallel to the main extension plane, assumes a value that is less than 0.20 mm, preferably less than 10 pm and particularly preferably less than 20 pm.When referring to multiple areas, this specifically means that the at least one metal layer is divided into areas of as equal size as possible, and at least one value, preferably several measured values, for the thickness are recorded in each of these areas dividing the at least one metal layer. The thicknesses thus determined at different locations are arithmetically averaged.

[0019] Compared to the metal-ceramic substrates known from the prior art, a comparatively thin bonding layer is thus formed between the at least one metal layer and the ceramic element. In this case, it is provided that, in order to determine the relevant thickness of the bonding layer, the measured thicknesses are averaged over a large number of measuring points which lie within a predetermined or fixed area or areas. This advantageously takes into account the fact that the ceramic element is generally subject to undulation, i.e. the ceramic element is to be attributed a waviness. In particular, the person skilled in the art understands waviness to be a modulation of the generally flat course of the ceramic element, viewed over several millimeters or centimeters along a direction which runs parallel to the main plane of extension.This distinguishes such undulation from surface roughness of the ceramic element, which is usually also present on the ceramic element. By including such, generally unavoidable undulation of the ceramic element in the thickness determination, it is taken into account that the bonding layer may vary due to the undulation, in particular, it may be larger in the valley areas of the ceramic element than in the peak areas.

[0020] Preferably, a proportion of active metal in the adhesion promoter layer comprising an active metal is greater than 25 wt.%, preferably greater than 20 wt.% and particularly preferably greater than 15 wt.%.

[0021] The bonding layer is preferably formed flatly, in particular without interruption, i.e. continuously, between the at least one metal layer and the ceramic element. It is preferably provided that a ratio of an area in which no bonding layer is formed between the at least one metal layer and the ceramic element to the areas in which a bonding layer is formed between the at least one bonding layer and the ceramic element is less than 0.05 mm, preferably less than 0.02 mm and particularly preferably less than 0.007 mm. The person skilled in the art will understand in particular that in forming this ratio, the areas which are free of metal of the at least one metal layer due to the structuring are not taken into account.

[0022] In particular, it is intended that the component metallization be bonded using a direct bonding process. In this case, unlike an active soldering process, the structure is not weakened or only slightly weakened, resulting in a mechanically stable metal-ceramic substrate.

[0023] Furthermore, it is also conceivable for the component metallization to have a thickness greater than 0.4 mm, preferably greater than 1.0 mm, and particularly preferably greater than 1.5 mm. This advantageously ensures sufficient mechanical stability, even if the bonding process weakens the structure.

[0024] Preferably, the ceramic element has a thickness greater than 200 pm, preferably greater than 300 pm, and particularly preferably greater than 400 pm. This allows, particularly in conjunction with a comparatively thick metal layer, a mechanically particularly stable metal-ceramic substrate to be provided, which can be used in many applications.

[0025] Another object of the present invention is a method for producing a metal-ceramic substrate according to the present invention.

[0026] In particular, a method for producing a metal-ceramic substrate usable as a printed circuit board, in particular a metal-ceramic substrate according to one of the preceding claims, is provided, comprising:

[0027] - Providing a ceramic element comprising magnesium oxide and a metal layer,

[0028] - Bonding the metal layer to the ceramic element and

[0029] - Structuring the metal layer to form a component metallization. All advantages and properties described for the metal-ceramic substrate apply analogously to the method for producing the metal-ceramic substrate according to the invention, and vice versa. In particular, the method comprises providing a ceramic element with a specific surface roughness and / or producing a surface profile on the outside of the ceramic element.

[0030] Furthermore, it is preferably provided that the at least one metal layer and / or the at least one further metal layer is bonded to the ceramic element by means of an active soldering process and / or a hot isostatic pressing process and / or a DCB process.

[0031] For example, it is provided that a method for producing a metal-ceramic substrate is provided, comprising:

[0032] - Providing a soldering layer, in particular in the form of at least one soldering foil or brazing foil,

[0033] - coating the ceramic element and / or the at least one metal layer and / or the at least one solder layer with at least one active metal layer,

[0034] - Arranging the at least one solder layer between the ceramic element and the at least one metal layer along a stacking direction to form a solder system comprising the at least one solder layer and the at least one active metal layer, wherein a solder material of the at least one solder layer is preferably free of a melting point-lowering material or of a phosphorus-free material, and

[0035] - Bonding the at least one metal layer to the at least one ceramic layer via the soldering system by means of an active soldering process.

[0036] In particular, a multi-layer soldering system comprising at least one solder layer, preferably free of melting point-lowering elements, particularly preferably a phosphorus-free solder layer, and at least one active metal layer is provided. The separation of the at least one active metal layer and the at least one solder layer proves to be particularly advantageous because it enables comparatively thin solder layers to be realized, especially when the solder layer is a foil. For solder materials containing active metals, comparatively large solder layer thicknesses must otherwise be realized due to the brittle intermetallic phases or the high modulus of elasticity and high yield strength of common active metals and their intermetallic phases, which hinder the forming of the solder paste or solder layer, whereby the minimum layer thickness is limited by the manufacturing properties of the solder material containing active metal.Accordingly, for solder layers containing active metals, the minimum solder layer thickness is not determined by the minimum thickness required for the joining process, but rather by the technically feasible minimum solder layer thickness. As a result, this thicker, active-metal-containing solder layer is more expensive than thinner layers. The term "phosphorus-free" is understood by those skilled in the art to mean, in particular, that the phosphorus content in the solder layer is less than 1000 ppm, less than 500 ppm, and particularly preferably less than 200 ppm.

[0037] Preferably, the solder layer, especially the phosphorus-free solder layer, comprises several materials in addition to the pure metal. For example, indium is a component of the solder material used in the solder layer.

[0038] Furthermore, it is conceivable that the solder material for forming the solder layer is applied to the active metal layer and / or the at least one metal layer by physical and / or chemical vapor deposition and / or galvanically. This advantageously makes it possible to realize comparatively thin solder layers in the soldering system, particularly with a homogeneous distribution.

[0039] For example, in the production of the metal-ceramic substrate, in particular the metal-ceramic substrate, further steps are provided, comprising:

[0040] - Providing a ceramic element and a metal layer,

[0041] - Providing a gas-tight container enclosing the ceramic element, wherein the container is preferably formed from the metal layer or comprises the metal layer,

[0042] - Forming the metal-ceramic substrate by bonding the metal layer to the ceramic element by means of hot isostatic pressing, wherein, to form the metal-ceramic substrate, an active metal layer or a contact layer comprising an active metal is arranged at least in sections between the metal layer and the ceramic element to assist the bonding of the metal layer to the ceramic element. The container is preferably formed as a metal container consisting of a metal layer and / or a further metal layer. Alternatively, it is also conceivable that a glass container is used. In hot isostatic pressing, it is particularly provided that the bonding takes place by heating under pressure, during which the first and / or second metal layer of the metal container, in particular the subsequent metal layer of the metal-ceramic substrate and any eutectic layer occurring there, do not enter the melting phase.Accordingly, hot isostatic pressing requires lower temperatures than direct metal bonding processes, particularly DCB processes.

[0043] In comparison to the bonding of a metal layer to a ceramic layer by means of a solder material, which usually uses temperatures below the melting temperature of the at least one metal layer, the present procedure advantageously makes it possible to dispense with a solder base material and only requires an active metal. The use or utilization of pressure during hot isostatic pressing has also proven advantageous because it can reduce air inclusions or cavities between the first metal layer and / or the second metal layer on the one hand and the ceramic element on the other. As a result, the frequency of shrinkage cavities in the formed or manufactured metal-ceramic substrate can be reduced or even avoided. This has a beneficial effect on the quality of the bond between the metal layer and / or the second metal layer.the first and / or second metal layer of the metal container and the ceramic element. Furthermore, it is advantageously possible to simplify the "second etching" and avoid solder residues and silver migration.

[0044] It is also conceivable that during hot isostatic pressing an additional solder material is introduced between the ceramic element and the at least one metal layer, wherein a melting temperature of the additional solder material can be lower than the temperature at which the hot isostatic pressing is carried out, ie lower than the melting temperature of the at least one metal layer.

[0045] It is preferably provided that during hot isostatic pressing, the metal container is exposed in a heating and pressure device to a gas pressure between 100 and 2000 bar, preferably between 150 and 1200 bar and particularly preferably between 300 and 1000 bar and a process temperature of 300°C up to a melting temperature of the at least one metal layer, in particular up to a temperature below the melting temperature. It has advantageously been found that it is thus possible to bond a metal layer, i.e. a first and / or second metal layer of the metal container, to the ceramic element without the required temperatures of a direct metal bonding process, for example a DCB or a DAB process, and / or without a solder base material that is used in active soldering. In addition, the use or application of an appropriate gas pressure allows the possibility of producing a process that is as void-free as possible, i.e.to produce a metal-ceramic substrate without gas inclusions between the metal layer and the ceramic element. In particular, process parameters mentioned in DE 2013 113 734 A1 are used, and are hereby explicitly referenced.

[0046] Preferably, the metal layer is bonded via an active metal layer. In particular, this is a separate active metal layer whose active metal content is, or assumes, preferably more than 15% by weight, very preferably more than 35% by weight, and particularly preferably more than 80% by weight. This means that it is not a solder layer containing active metal, but rather a bonding layer or adhesion promoter layer that only uses active metal to create the bond between the metal layer and the ceramic element. Alternatively, it is preferably conceivable for the active metal layer to be applied as a separate layer in addition to a solder base material, with the active metal layer and solder base material forming a solder layer system. In particular, it proves advantageous if the active metal layer is applied and / or used as an active metal foil.

[0047] It is particularly preferred if this is done using pressure, especially during hot isostatic pressing, which can advantageously also increase the density of the magnesium oxide component in the ceramic element. For example, this makes it possible to increase the theoretical density of the magnesium oxide by 20%. The values ​​for the density of the magnesium oxide are compared before and after hot isostatic pressing. In other words, the bonding process also advantageously produces a high-density magnesium oxide.

[0048] Preferably, the at least one metal layer is bonded by means of hot isostatic pressing, wherein, in particular, the density in the ceramic element is increased by the bonding. Alternatively, it is conceivable that the at least one metal layer is bonded using a direct bonding process. For example, it is conceivable that an additional ceramic coating, as an adhesion promoter, surrounds the magnesium-comprising ceramic element, preferably by more than 75 wt. %, particularly preferably more than 85 wt. %, and particularly preferably more than 95 wt. %, and even completely surrounds it.

[0049] A ceramic coating made of aluminum oxide is particularly advantageous in this case.

[0050] Further advantages and features will become apparent from the following description of preferred embodiments of the subject matter of the invention with reference to the accompanying figures. They show:

[0051] Fig. 1 metal-ceramic substrate according to a first exemplary embodiment of the present invention;

[0052] Fig. 2 metal-ceramic substrate according to a second exemplary embodiment of the present invention;

[0053] Fig. 3 metal-ceramic substrate according to a third exemplary embodiment of the present invention;

[0054] Figure 1 shows a metal-ceramic substrate 1 according to a first exemplary embodiment of the present invention. Such metal-ceramic substrates 1 preferably serve as carriers or circuit boards for electronic or electrical components, to which at least one metal layer of the metal-ceramic substrate 1 can be bonded to form a component metallization 10 on the component side thereof. It is preferably provided that the component metallization 10 is structured to form corresponding conductor tracks and / or connection surfaces (not shown), i.e., in the manufactured metal-ceramic substrate 1, the component metallization 10 comprises a plurality of metal sections that are electrically insulated from one another.The component metallization 10, which extends essentially along a main extension plane HSE, and a ceramic element 30, which extends along the main extension plane HSE, are arranged one above the other along a stacking direction S running perpendicular to the main extension plane HSE and are preferably joined or connected to one another via a bonding layer 12. Preferably, the metal-ceramic substrate 1 comprises, in addition to the component metallization 10, at least one backside metallization 20, which, viewed in the stacking direction S, is arranged on the side of the ceramic element 30 opposite the component metallization 10 and is bonded to the ceramic element 30 via a further bonding layer 12'.

[0055] In this case, the at least one further metal layer 20 serves as a backside metallization 20, which counteracts a bending of the metal-ceramic substrate 1, in particular of the metal-ceramic element 1, and / or as a heat sink, which is designed to dissipate heat input caused by electrical or electronic components on the metal-ceramic substrate 1.

[0056] In particular, the metal-ceramic substrate 1 has a bonding layer 12 arranged between the at least one metal layer 10 and the ceramic element 30. It has proven advantageous if the thickness of the bonding layer 12 measured in the stacking direction S is comparatively thin. Furthermore, a comparatively thin thickness of the bonding layer 12 between the at least one metal layer 10 and the ceramic element 30 proves advantageous if an etching process is provided for the purpose of structuring the at least one metal layer 10. For example, this allows narrower isolation trenches, i.e., distances between individual metal sections of the at least one metal layer 10, to be realized.

[0057] Furthermore, the formation of a thinner bonding layer 12 proves to be advantageous in that it can further reduce the number of possible defects in the bonding layer 12 caused by material defects in a solder material that may be used.

[0058] In the example shown in Figure 1, the bonding layer 12 is in particular an adhesion promoter layer 13 comprising an active metal. In this case, the adhesion promoter layer 13 is preferably formed after bonding from a material composition comprising a compound of components of the ceramic element on the one hand and an active metal on the other. Since these are very brittle compounds, the thinnest possible design of this adhesion promoter layer 13 is advantageous for the adhesive strength of the at least one metal layer 10 on the ceramic element 30. For example, the adhesion promoter layer 13 can form the bonding layer 12 if, for example, an active metal layer, in particular an active metal foil, is arranged between the ceramic element 30 and the metal layer 10 for the bonding process and the bonding process is carried out via hot isostatic pressing.However, the adhesion promoter layer 13 can also be formed, for example, by an active metal layer, in particular an active metal foil, which is arranged between the ceramic element 30 and a solder base layer in order to create the bond between the metal layer 10 and the ceramic element 30 via the system of the active metal layer and the solder base layer. In this case, the adhesion promoter layer 13 forms part of the bonding layer 12.

[0059] The active metal layer preferably has an active metal content greater than 15 wt. %, particularly preferably greater than 35 wt. %, and particularly preferably greater than 80 wt. Thus, it is not a solder layer containing active metal that is used to bond the at least one metal layer. It is particularly preferred if only one active metal layer is arranged between the ceramic element 30 and the at least one metal layer during the bonding process.

[0060] In other words, for example, a solder base layer is dispensed with, which is additionally arranged next to the active metal layer between the ceramic element and the at least one metal layer when the soldering process is carried out to form the component metallization 10. In particular, it is provided that after the bonding of the at least one metal layer to form the component metallization 10, this at least one metal layer is structured, i.e., insulation trenches are introduced that separate individual metal sections of the component metallization 10 from one another in an insulating manner.

[0061] It has proven particularly advantageous to use magnesium oxide as the ceramic element 30. The proportion of magnesium oxide is preferably more than 60% by weight, more preferably more than 80% by weight, and particularly preferably more than 95% by weight. As a result, it is advantageously possible to use a comparatively inexpensive ceramic element which has a comparatively high thermal conductivity. In addition, the coefficient of thermal expansion is comparable to that of copper. This has a positive effect on the resistance to thermal shock, since thermal stresses develop less severely than with conventional ceramic materials. Alternatively, it is conceivable that the connection of the at least one metal layer to the ceramic element is carried out via an active solder, i.e. via a solder layer containing active metal. In this case, for example, the active metal proportion in the solder layer takes on a value which is less than 15% by weight.

[0062] It is particularly preferred if the bonding of the at least one metal layer to the ceramic element 30 consisting of magnesium oxide or comprising the magnesium oxide takes place under the application of pressure, if an active metal layer is arranged between the ceramic element 30 and the at least one metal layer, preferably only one active metal layer, i.e. the intermediate region between the ceramic element and at least one metal layer is free of a solder material or a solder base material. By applying pressure when bonding the metal layer to the ceramic element 30, it is also advantageously possible for the density of the magnesium oxide to be increased, for example to a value greater than 75 TD, particularly preferably greater than 85 TD and particularly preferably greater than 95 TD. The person skilled in the art understands TD to mean, in particular, the theoretical density, i.e.the smallest or tightest theoretically possible packing of the individual molecules in the solid of the ceramic element.

[0063] Furthermore, it is preferably provided that the component metallization has a first thickness D1, the back-side metallization has a second thickness D2 and the ceramic element has a third thickness. The first thickness D1, the second thickness D2 and the third thickness D3 are dimensioned parallel to the stacking direction S. It is preferably provided that the first thickness D1 substantially corresponds to the second thickness D2 in order to thereby create a desired symmetry which counteracts bending during production of the metal substrate. This is not absolutely necessary, for example, if the connection takes place as part of a pressing process, since in this case the pressing process already counteracts bending. However, with common soldering processes it proves to be particularly advantageous if the first thickness D1 and the second thickness D2 substantially correspond to one another.The third thickness D3 preferably has a value between 50 pm and 2 mm, preferably between 100 pm and 1000 pm and particularly preferably between 200 pm and 800 pm. The first thickness D1 and / or second thickness D2 preferably have a value between 100 pm and 1000 pm, particularly preferably between 200 pm and 800 pm and particularly preferably between 300 pm and 700 pm. Furthermore, it is particularly preferred if the third thickness D3 is greater than the first thickness D1 and / or second thickness D2. It is also conceivable that the third thickness D3 is smaller than the first thickness D1 and / or second thickness D2.

[0064] Preferably, the magnesium oxide has a density between 3 g / cm 3 and 4 g / cm 3 , particularly preferably between 3.15 and 3.7 g / cm 3 and particularly preferably between 3.3 and 3.56 g / cm 3Particularly preferably, the magnesium oxide in the ceramic element 30 has a proportion of 95 to 100%. This advantageously makes it possible to utilize the high thermal conductivities of the single crystal.

[0065] It is particularly preferred if the density of the magnesium oxide is increased by at least 20% by pressing.

[0066] Figure 2 shows a second embodiment of a metal-ceramic substrate 1 according to the present invention. In the embodiment shown here, the ceramic element 30 is surrounded, in particular completely surrounded, by a ceramic coating (for example, made of aluminum oxide Al2O3). This coating 30 serves the purpose of improving or simplifying the bonding of the at least one metal layer to the insulating body. This particularly benefits from the fact that surface hardening through spinel formation is possible, thus also enabling a DCB bond, i.e., a direct bond.

[0067] Figure 3 shows a third exemplary embodiment of a metal-ceramic substrate 1 according to the present invention. In the exemplary embodiment shown here, it is provided that the at least one metal layer and / or the at least one further metal layer is bonded to the ceramic element 30 via a direct bonding method, in particular directly to the ceramic element 30, which essentially comprises magnesium oxide. In particular, the same material specifications for the magnesium oxide apply to all exemplary embodiments shown here. It is particularly preferred if a doped magnesium oxide is used or provided as the ceramic element 30.

[0068] For example, an additional or accompanying material is used as doping, the proportion of which in the ceramic element 30 is less than 10 wt. %, particularly preferably less than 8 wt. %, and particularly preferably less than 5 wt. %. In particular, the accompanying material used for doping is selected such that it has the least possible influence on the thermal conductivity. This means that the accompanying material used for doping leads to a change in the thermal conductivity of the ceramic element, wherein the change is less than 5%, less than 2.5%, and particularly preferably less than 1% of the measured thermal conductivity in a pure magnesium oxide ceramic element with a comparable density.

[0069] List of reference symbols:

[0070] 1 metal-ceramic substrate

[0071] 10 Component metallization

[0072] 12 binding layer

[0073] 12' additional binding layer

[0074] 13 Adhesion promoter layer

[0075] 20 Backside metallization

[0076] 30 ceramic elements

[0077] 31 Coating

[0078] S Stacking direction

[0079] D1 first thickness

[0080] D2 second thickness

[0081] D3 third thickness

Claims

Claims 1. Metal-ceramic substrate (1) which can be used as a printed circuit board, comprising - a ceramic element (30) and - at least one component metallization (10) which is bonded to the ceramic element (30), wherein the at least one component metallization (10) is structured to form conductor tracks, wherein the ceramic element (30) comprises magnesium oxide and wherein a proportion of magnesium oxide in the ceramic element is greater than 60% by weight, preferably greater than 80% and particularly preferably greater than 95% by weight.

2. Metal-ceramic substrate (1) according to claim 1, wherein the ceramic element (30) comprising magnesium oxide is doped with an accompanying material.

3. Metal-ceramic substrate according to claim 2, wherein the accompanying material is selected such that it does not impair the thermal conductivity, in particular leads to deviations in the thermal conductivity which are less than 50%, preferably less than 25% and particularly preferably less than 20% of the thermal conductivity of the magnesium oxide 4. Metal-ceramic substrate according to claim 2 or 3, wherein the accompanying material is ZrO2.

5. Metal-ceramic substrate (1) according to one of the preceding claims, wherein the magnesium oxide has a density which is between 3 and 4 g / cm 3 , preferably a value between 3.1 and 3.8 g / cm 3 and particularly preferably between 3.35 and 3.58 g / cm 3 accepts.

6. Metal-ceramic substrate (1) according to one of the preceding claims, wherein the ceramic element (30) comprises a coating (31), preferably a coating comprising Al2O3, which is arranged between the ceramic element (30) and the component metallization (31).

7. Metal-ceramic substrate (1) according to one of the preceding claims, wherein in the manufactured metal-ceramic substrate (1) a bonding layer (12) is formed between the component metallization (10) and the ceramic element (12), wherein a The adhesion promoter layer (13) of the bonding layer (12) has a surface resistance which is greater than 0.5 Ohm / sq, preferably greater than 1 Ohm / sq and particularly preferably greater than 2 Ohm / sq or even greater than 10 Ohm / sq.

8. Metal-ceramic substrate (1) according to one of the preceding claims, wherein the component metallization (10) is bonded via a direct bonding method.

9. Metal-ceramic substrate (1) according to one of the preceding claims, wherein the component metallization (10) has a thickness which is greater than 0.4 mm, preferably greater than 1.0 mm and particularly preferably greater than 1.5 mm.

10. Metal-ceramic substrate (1) according to one of the preceding claims, wherein the ceramic element (12) has a thickness which is greater than 200 pm, preferably greater than 300 pm and particularly preferably greater than 400 pm.

11. A method for producing a metal-ceramic substrate (1) usable as a printed circuit board, in particular a metal-ceramic substrate (1) according to one of the preceding claims, comprising: - providing a ceramic element (30) comprising magnesium oxide and a metal layer, - Bonding the metal layer to the ceramic element (30) and - Structuring the metal layer to form a component metallization (10).

12. The method according to claim 11, wherein the metal layer is bonded via an active metal layer.

13. The method according to claim 11 or 12, wherein the at least one metal layer is bonded by means of hot isostatic pressing.

14. The method according to any one of claims 11 to 13, wherein a density in the ceramic element (30) is increased by the bonding.

15. The method according to claim 11, wherein the metal layer is bonded via a direct bonding method.

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