Activating agent, bonding layer curing agent, and repair process for integrated repair of hot end part

Abstract

The present invention relates to the field of repair of a hot end part of a heavy-duty gas turbine. Disclosed are an activating agent, bonding layer curing agent, and repair process for integrated repair of a hot end part. The activating agent compris-es at least the following elements, in percentage by mass: Cr (16.2%-19.7%), Co (19.1%-25.8%), Al (1.3%-2.8%), Ru (1.1%-2.9%),Ti( 10.1% -13.3%), Ta (0.2% -1.8%), Mo (4.2%-7.8%), Hf (0%-0.1%), Zr (0%-0.1%), Y (0%-0.1%), and Ce (0%-0.1%). The bond-ing layer curing agent comprises at least the following elements, in percentage by mass: Ni (25.0%-30.0%), Cr (25.0%-30.0%), Al(12.1%-14.9%), and X (0%-1.5%), where "X" is selected from one or a combination of Y, Ta, Hf, Zr, and Ce, and the balance is Co or / and inevitable impurity elements. The repair process mainly comprises defect grinding, base material framework shaping, bonding layer framework shaping, activating agent shaping, metallurgical temperature preservation, and post-treatment. According to the present invention, the high-temperature performance of a base material repair area can be improved, so that a bonding interface is in good connection and has high-strength bonding. In addition, the procedures of bonding layer removal and recoating on the surface of the hot end part are omitted, thus shortening the repair period, improving the repair efficiency, and saving repair costs.

Description

Technical Field

[0001] The present invention relates to the field of repair of hot-end components of heavy-duty gas turbines, in particular to an activator, a bonding layer curing agent and a repair process for integrated repair of hot-end components.Background of the Invention

[0002] Heavy-duty gas turbines are the core equipment in the fields of power generation and drive. They are known as the "pearl on the crown" of the equipment manufacturing industry and are a concentrated reflection of a country's industrial level. The working temperature of this type of equipment can reach above 1,000°C. The hot-end components are made of high-performance and high-value nickel / cobalt-based superalloys (such as turbine blades, burners, etc.). To further improve the temperature-bearing performance of these hot-end components and protect the components from damage in extreme environments, an MCrAlX coating or an MCrAlX coating + thermal barrier coating (TBC) is sprayed on the surface of these hot-end components. Where "M" can be various metals or metal combinations, such as Fe, Ni or Co; "X" is usually Y, and can also be selected from one or a combination of Y, Ta, Hf, Ti, Zr, etc. However, this protection is limited. During long-term service, foreign object impact, airflow scouring, thermal-cold fatigue, etc., can all cause coating peeling and damage to the base material, such as thinning and cracking.

[0003] Repairing the damaged hot-end components can significantly reduce the operation and maintenance costs of the unit. Usually, when repairing the hot-end components with thinning and cracking of the base material, the MCrAlX bonding coating and the thermal barrier coating on the surface need to be removed first, then the base material is remodeled for morphological and property remodeling, and then the coating is sprayed again. Coating stripping and re-spraying not only extend the repair cycle but also greatly increase the repair cost, usually accounting for more than 40% of the repair cost.Summary of the Invention

[0004] The objective of the present invention is to provide an activator for integrated repair of hot-end components, a bonding layer curing agent, and a repair process, addressing the aforementioned problems. The provided solution enhances the high-temperature performance of the base material within the repaired area, resulting in a well-bonded interface possessing high adhesive strength. This approach obviates the process steps of removing and reapplying the bonding layer on the surface of the hot-end components, thereby shortening the repair cycle, improving repair efficiency, and reducing overall repair costs.

[0005] The technical solution adopted by the present invention is as follows: An activator for integrated repair of hot-end components, the preparation of the activator comprises elements in at least the following percentages by mass: Cr (16.2%-19.7%), Co (19.1%-25.8%), Al (1.3%-2.8%), Ru (1.1%-2.9%), Ti (10.1%-13.3%), Ta (0.2%-1.8%), Mo (4.2%-7.8%), Hf (0%-0.1%), Zr (0%-0.1%), Y (0%-0.1% ), Ce (0%-0.1%), balance Ni and / or incidental impurities.

[0006] A bonding layer curing agent for integrated repair of hot-end components, wherein the preparation of the curing agent comprises elements in at least the following percentages by mass: Ni (25.0% -30.0%), Cr (25.0% -30.0%), Al (12.1% -14.9%), X (0% -1.5%);

[0007] Wherein, "X" is selected from one or a combination of Y, Ta, Hf, Zr, Ce, balance Co and / or incidental impurities.

[0008] A repair process for integrated repair of hot-end components, utilizing the activator for integrated repair of hot-end components and the bonding layer curing agent for integrated repair of hot-end components; said hot-end components comprise a base material and a bonding layer disposed on the surface of the base material, wherein the base material is a precipitation-strengthened nickel-based cast superalloy and the bonding layer is a NiCoCrAIX coating, where "X" is selected from Y, Ta, Hf, Ti, Zr, or any combination thereof; the process comprising the following steps: S1: Defect grinding; clean the damaged area of the hot-end component; S2: Modeling of base material framework; Mix the base material, curing agent, and binder in the required proportion, fill it into the damaged area of the hot-end component, and dry it to obtain the base material framework; S3: Modeling of bonding layer framework; Mix the bonding layer curing agent and the binder in the required proportion, fill it into the base material framework, and dry it to obtain the bonding layer framework; S4: Modeling of activator; Mix the activator and the binder in the required proportion, fill it in the square of the bonding layer framework, shape it into a "hill" shape, and then carry out the drying treatment; S5: Metallurgical heat preservation; Place the hot-end component that has completed step S4 in a vacuum environment with a vacuum degree better than 1×10 -3< Pa for heat preservation, and cool it with the furnace after the heat preservation is completed; S6: Post-treatment; perform a property recovery heat treatment on the hot-end component, having completed step S5, followed by shaping, to complete the repair of the damaged area on the hot-end component.

[0009] Furthermore, in step S2, the base material curing agent and the binder are mixed in a mass ratio of 20:1 to prepare a paste-like base material modeling paste. The base material modeling paste is dried to obtain the base material framework, and the surface of the base material framework is flush with the surface of the base material.

[0010] Furthermore, the base material curing agent is M-21 commercial alloy powder or titanium-removed GTD111 commercial customized alloy powder, and the particle size selection range is 85 µm to 106 µm.

[0011] Furthermore, in step S3, the bonding layer curing agent and the binder are mixed in a mass ratio of 20:1 to prepare a paste-like bonding layer modeling paste. The bonding layer modeling paste is dried to obtain the bonding layer framework, and the surface of the bonding layer framework is flush with the surface of the bonding layer.

[0012] Furthermore, in step S4, the dosage of the activator is about 60% to 80% of the weight of the base material framework.

[0013] Furthermore, the binder in steps S2, S3, and S4 is of the NICROBRAZ S-BINDR commercial type.

[0014] Furthermore, the drying environment for the drying treatment in steps S2, S3, and S4 is an atmospheric environment at 70°C, and the drying time is 1h to 2h.

[0015] Furthermore, the metallurgical heat preservation temperature is 1,170°C to 1,210°C, and the heat preservation time is 30 minutes to 45 minutes.

[0016] In summary, by virtue of the aforementioned technical solutions, the present invention offers the following beneficial effects: 1. Compared with traditional low-melting-point filler materials, the activator provided by the present invention, as a low-melting-point filler material, does not add high-concentration B, Si, Hf, and Zr as melting point inhibitors. Instead, it achieves alloy entropy by adjusting the mass ratio of superalloy strengthening elements to achieve the purpose of suppressing the melting point of the activator. The interface connection of the obtained base material repair area is good, and it does not contain low-melting-point B, Si, Hf, Zr-rich compounds and / or eutectic phases. The high-temperature performance of the base material repair area is significantly improved; 2. The activator used in the present invention can have various combinations according to the element content of the bonding layer of different hot-end components. When used in combination with the bonding layer curing agent provided by the present invention, the composition of the obtained bonding layer repair area is very close to that of the bonding layer of the hot-end component, and it also has a protective effect on the hot-end component. Moreover, the interface connection between the original bonding layer and the repaired bonding layer is good; 3. The repair process disclosed by the present invention can realize the integrated repair of the base material and the bonding layer of the damaged part without removing the bonding coating on the surface of the hot-end component. Compared with the existing repair processes, it omits the removal and re-spraying processes of the bonding layer on the surface of the hot-end component, greatly shortens the repair cycle, improves the repair efficiency, and saves the repair cost; 4. The base material repair area and the bonding layer repair area obtained through the repair process disclosed by the present invention are formed by integrated repair, so a high-strength connection between the base material repair area and the bonding layer repair area can be achieved. Brief Description of the Drawings

[0017] The present invention will be described in combination with embodiments and accompanying drawings, wherein: Fig. 1 is the structural diagram of the hot-end component to be repaired; Fig. 2 is the schematic diagram of the hot-end component in step S1; Fig. 3 is the schematic diagram of the hot-end component in step S2; Fig. 4 is the schematic diagram of the hot-end component in step S3; Fig. 5 is the schematic diagram of the hot-end component in step S4; Fig. 6 is the schematic diagram of the hot-end component in step S5; Fig. 7 is the schematic diagram of the hot-end component in step S6; Markings in the figures: 1 - base material; 2 - coating; 3 - damaged area of the hot-end component; 4 - base material framework; 5 - bonding layer framework; 6 - activator modeling paste.Detailed Description of Embodiments

[0018] All the features disclosed in the Description, or all the steps in the disclosed methods or processes, except for mutually exclusive features and / or steps, can be combined in any way.

[0019] Any feature disclosed in the Description can be replaced with other equivalent or similar features, unless otherwise specified. That is, unless particularly stated, each feature is just an example of a series of equivalent or similar features.Embodiment 1

[0020] An activator for the integrated repair of hot-end components. The preparation of the activator comprises elements in at least the following percentages by mass: Cr (16.2%-19.7%), Co (19.1%-25.8%), Al (I.3%-2.8%), Ru (1.1%-2.9%), Ti (I0.1%-13.3%), Ta (0.2%-1.8%), Mo (4.2%-7.8%), Hf (0%-0.1%), Zr (0%-0.1%), Y (0%-0.1%), Ce (0%-0.1%), balance Ni and / or incidental impurities.

[0021] In the present embodiment, the activator can be prepared by the atomization method. The particle size is in the range of 23 µm to 30 µm, and the melting temperature range is 1,120°C to 1,160°C. The activator will melt during metallurgical heat preservation.

[0022] It should be noted that the preparation of the activator by the atomization method is known to those skilled in the art, and its specific steps will not be described in detail in the Description.

[0023] For the activator proposed in the present embodiment, to further clearly elaborate and illustrate the technical solution of the present invention, the following non-restrictive implementations are provided, as shown in Table 1 in detail. Table 1 Implementations of the activatorActivator brandDFB-LDFB-0DFB-VDFB-ENiBa I.Ba I.Ba I.Ba I.Cr16.218.716.819.7Co19.121.825.823.8Al2.82.81.81.3Ru2.91.11.31.5Ti10.911.710.113.3Ta1.41.30.50.2Mo7.86.25.14.2Hf0.1\\\Zr\0.1\0.1Y0.10.1\\Ce\\0.1\Melting point1141°C1120°C1150°C1160°C

[0024] In the present embodiment, it can be known from Table 1 that high-concentration B, Si, Hf, and Zr are not added as melting point inhibitors in the activators DFB-L, DFB-O, DFB-V, and DFB-E. Instead, the alloy high entropy is achieved by adjusting the mass ratio of superalloy strengthening elements to achieve the purpose of suppress the melting point of the activator. Therefore, the interface connection of the obtained base material repair area is good, and it does not contain low-melting-point B, Si, Hf, Zr-rich compounds and / or eutectic phases. The high-temperature performance of the base material repair area is significantly improved.Embodiment 2

[0025] A bonding layer curing agent for the integrated repair of hot-end components, wherein the preparation of the bonding layer curing agent comprises elements in at least the following percentages by mass: Ni (25.0%-30.0%), Cr (25.0%-30.0%), Al (12.1%-14.9%), X (0%-1.5%); Wherein, "X" is selected from one or a combination of Y, Ta, Hf, Zr, and Ce, balance Co and / or incidental impurities.

[0026] In the present embodiment, the bonding layer curing agent can be prepared by the rotary motor method. The particle size of the prepared bonding layer curing agent ranges from 30 µm to 75 µm; the rotary electrode method is known to those skilled in the art and will not be described in detail in the Description.

[0027] For the bonding layer curing agent proposed in the present embodiment, to further clearly elaborate and illustrate the technical solution of the present invention, the following non-restrictive implementations are provided, as shown in Table 2 in detail. Table 2 Implementations of the bonding layer curing agentBonding layer curing agent brandDF-LDF-ODF-EDFB-QDFB-YCoBa I.Ba I.Ba I.Ba I.Ba I.Cr27.025.030.028.829.0Ni30.025.024.827.026.0Al14.913.812.113.614.2Y1.31.31.51.31.3Ta\0.2\\\Hf0.2\\\\Zr\\\0.2\Ce\\\\0.2Melting point1481°C1460°C1471°C1480°C1487°C

[0028] In the present embodiment, the activator used in Embodiment 1 can have various combinations according to the element content of the bonding layer of different hot-end components. When used in combination with the bonding layer curing agent, the composition of the obtained bonding layer repair area is very close to that of the bonding layer of the hot-end component, and it also has a protective effect on the hot-end component. Moreover, the interface connection between the original bonding layer and the repaired bonding layer is good;Embodiment 3

[0029] A repair process for integrated repair of hot-end components, utilizing the activator for integrated repair of hot-end components described in embodiment 1 and the bonding layer curing agent for integrated repair of hot-end components described in embodiment 2; the hot-end components comprise a base material 1 and a bonding layer 2 disposed on the surface of the base material 1, wherein the base material 1 is a precipitation-strengthened nickel-based cast superalloy, such as, but not limited to, Mar-M247, CM247LC, IN738LC, IN939, MGA2400, GTD-111, GTD-222, or other nickel-based alloys; and the bonding layer 2 is a NiCoCrAIX coating, where "X" is selected from Y, Ta, Hf, Ti, Zr, or any combination thereof; the process comprising the following steps: S1: Defect grinding; clean the damaged area 3 of the hot-end component; Remove the oxide layer of the damaged area 3 of the hot-end component by mechanical grinding. The length × width × height of the damaged area after grinding does not exceed 30mm × 5mm × 5mm. Place it in an alcohol or acetone solution for ultrasonic cleaning for 60 minutes, take it out and dry it for later use. S2: Modeling of base material framework 4. The specific steps, denoted as S21 through S25, are as follows: S21: Selection of modeling material for the base material framework 4; commercial alloy powder with a particle size of 85µm to 106µm or de-titanium GTD111 commercial customized alloy powder is selected as the base material curing agent; NICROBRAZ S-BINDR type commercial product is selected as the binder. S22: Preparation of the base material modeling paste; the base material curing agent and the binder are fully mixed in a mass ratio of 20:1 to prepare a paste-like base material modeling paste. S23: Filling of the base material modeling paste; the base material modeling paste is filled into the damaged area 3 of the hot-end component after grinding and cleaning in step S1, and the excess paste is scraped off until the height of the paste is flush with the surface of the hot-end component. S24: Drying treatment; the hot-end component filled with the base material modeling paste is placed in an atmospheric environment at 70°C and dried for 1h to 2 h to obtain the base material framework 4. An atmospheric furnace can be selected to provide the drying environment. S25: Shaping; the surface layer of the base material framework 4, with a thickness of 0.1mm to 1.0mm (equivalent to the thickness of the bonding layer), is scraped off with a shaping knife, so that the surface of the base material framework 4 is flush with the surface of the base material 1. S3: Modeling of bonding layer framework 5. The specific steps, denoted as S31 through S35, are as follows: S31: Selection of modeling material for the bonding layer framework 5; the bonding layer curing agent disclosed in embodiment 2 is selected; NICROBRAZ S-BINDR type commercial product is selected as the binder. S32: Preparation of the bonding layer modeling paste; the bonding layer curing agent and the binder are fully mixed in a mass ratio of 20:1 to prepare a paste-like bonding layer modeling paste. S33: Filling of the bonding layer modeling paste; the bonding layer modeling paste is filled into the part of the base material framework 4, scraped off in step S2. S34: Drying treatment; the hot-end component filled with the bonding layer modeling paste is placed in an atmospheric environment at 70°C and dried for 1h to 2h to obtain the bonding layer framework 5. An atmospheric furnace can be selected to provide the drying environment. S35: Material removal; the excess bonding layer framework 5 is scraped off using a shaping knife or other suitable tool until the surface of the bonding layer framework 5 is flush with the surface of the original bonding layer. S4: Modeling of activator. The specific steps, denoted as S41 through S44, are as follows: S41: Selection and dosage of modeling material for the activator; the activator disclosed in embodiment 1 is selected, and the dosage of the activator is 60% to 80% of the weight of the base material framework 4; NICROBRAZ S-BINDR type commercial product is selected as the binder. S42: Preparation of the activator modeling paste 6; the activator and the binder are fully mixed in a mass ratio of 20:1 to prepare a paste-like activator modeling paste 6. S43: Stacking of the activator modeling paste 6; the activator modeling paste 6 is placed directly above the bonding layer framework 5 in step S3 and shaped into a near "hill" shape. S44: Drying treatment; the hot-end component stacked with the activator modeling paste 6 is dried in an atmospheric environment at 70°C for 1h to 2h. An atmospheric furnace can be selected to provide the drying environment. S5: Metallurgical heat preservation; Place the hot-end component that has completed the cutting step in a vacuum environment with a vacuum degree better than 1×10 -3< Pa for heat preservation. The metallurgical heat-preservation temperature is 1,170°C to 1,210°C, and the heat-preservation time is 30 minutes - 45 minutes; after the heat-preservation is completed, cool with the furnace; a vacuum furnace can be selected to provide the vacuum environment; S6: Post-treatment; Perform a property recovery heat treatment on the hot-end component, having completed step S5. Perform shaping using a shaping knife to remove excess metal, thereby completing the integrated morphological and property remodeling of the damaged area encompassing the base material 1 and the bonding layer.

[0030] It should be noted that the paste state is viscous with low fluidity. When filling the base material modeling paste, the bonding layer paste, and the activator modeling paste 6, the filling position is stable, avoiding separation from the repair position. And the viscous base material modeling paste, the bonding layer paste, and the activator modeling paste 6 are more convenient to fill. particularly, the viscous state has certain fluidity. When the base material modeling paste, the bonding layer paste, and the activator modeling paste 6 are filled into the corresponding positions, due to their fluidity, they can change their own shapes according to the size of the filling position to meet the filling of irregular areas, and can be completely filled under the action of their own fluidity, reducing the existence of defect voids.

[0031] In the present embodiment, the integrated repair of the base material 1 and the bonding layer at the damaged part can be realized without removing the bonding coating 2 on the surface of the hot-end component. Compared with the repair process without using one or more of the features described herein, the removal and re-spraying processes of the bonding layer on the surface of the hot-end component are omitted, which greatly shortens the repair cycle, improves the repair efficiency, and saves the repair cost.

[0032] In the present embodiment, the base material repair area and the bonding layer repair area obtained through the aforementioned repair process are integrally repaired and formed, so a high-strength connection between the base material repair area and the bonding layer repair area can be realized.Embodiment 4

[0033] Based on embodiment 3, the specific implementation of the repair process on the N4 guide vane is proposed.

[0034] The base material 1 of the N4 guide vane is IN738LC, a precipitation-strengthened nickel-based cast superalloy with a nominal composition of Ni-16wt%Cr-8.5wt%Co-2.5wt%W-3.Swt%Al-3.5wt%Ti-1.7wt%Ta-1.7wt%Mo-0.8wt%Nb-0.09wt%C-0.01wt%B-0.05wt%Zr; the protective coating 2 (bonding layer) on the vane surface is NiCoCrAlY, with a chemical composition of Ni-28wt%Co-23wt%Cr-8.Swt%Al-0.6wt%Y.

[0035] The repair process is carried out according to the steps of embodiment 3, wherein: The selected base material curing agent is de-titanium GTD111 commercial customized alloy powder with a particle size of 85µm-106µm, and its composition is as follows: C(0.1wt%),Cr(14.0wt%),Co(9.Swt%),Mo(1.6wt%),W(3.8wt%),Ta(2.8wt%),Al(3.0wt%),Zr(0.02w t%),B(0.012wt%); The selected bonding layer curing agent is the bonding layer curing agent with the brand DFL in embodiment 2, with a particle size ranging from 30µm to 75µm; The selected activator is the activator with the brand DFB-L in embodiment 1, with a particle size ranging from 23µm to 30µm.

[0036] The thickness of the bonding layer framework 5 is 0.5mm.

[0037] The dosage of the activator is about 60% of the weight of the base material framework.

[0038] The metallurgical holding temperature is 1,190°C, and the holding time is 40 minutes.

[0039] After the repair is completed, the base material repair area is made into a tensile specimen. The tensile strength at room temperature is measured to be 875MPa, reaching 87.7% of the strength of the base material 1, and the high-temperature tensile strength at 900°C reaches 486MPa, reaching 85.9% of the strength of the base material 1.

[0040] After the repair is completed, EDS energy spectrum analysis is carried out on the bonding layer repair area, and the results are: Cr (22.7wt%), Co (23.6wt%), Al (9.9wt%), Ti (4.4wt%), Ta (O.7wt%), Hf (0.2wt%), Ru (1.2wt%), Mo (3.1wt%), Y (0.8wt%) ∘ Embodiment 5

[0041] On the basis of embodiment 3, the specific implementation of the repair process when repairing the Mar-m247 precipitation-strengthened nickel-based cast superalloy structural part with the NiCoCrAlY coating 2 (bonding layer) is proposed.

[0042] The nominal chemical composition of the Mar-m247 precipitation-strengthened nickel-based cast superalloy is Ni-8wt%Cr-10wt%Co-10wt%W-5.Swt%Al-1wt%Ti-3wt%Ta-1.5wt%Hf-0.6wt%Mo-0.15wt%C-0.015wt%B-0.03wt%Zr; the chemical composition of the NiCoCrAlY coating 2 is Ni-28wt%Co-25wt%Cr-8.8wt%Al-0.6wt%Y.

[0043] The repair process is carried out according to the steps of embodiment 3, wherein: The selected base material curing agent is M-21 commercial alloy powder with a particle size ranging from 75µm to 150µm, and its nominal chemical composition is: C (0.13wt%), B (0.02wt%), Cr (5.7wt%), Mo (2.0wt%), Al (6.0wt%), W (11.0wt%), Nb (1.5wt%), Zr (0.12wt%); The selected bonding layer curing agent is the bonding layer curing agent with the brand DFO in embodiment 2, with a particle size ranging from 30µm to 75µm; The selected activator is the activator with the brand DFB-0 in embodiment 1, with a particle size ranging from 23µm to 30µm.

[0044] The thickness of the bonding layer framework 5 is 0.5mm.

[0045] The dosage of the activator is about 65% of the weight of the base material framework 4.

[0046] The metallurgical holding temperature is 1,210°C, and the holding time is 30 minutes.

[0047] After the repair is completed, the base material repair area is made into a tensile specimen. The tensile strength at room temperature is measured to be 825MPa, reaching 84.9% of the strength of the base material 1, and the high-temperature tensile strength at 900°C reaches 491MPa, reaching 75.8% of the strength of the base material 1.

[0048] After the repair is completed, EDS energy spectrum analysis is carried out on the bonding layer repair area, and the results are: Cr (22.5wt%), Co (29.5wt%), Al (9.4wt%), Ti (4.7wt%), Ta (0.6wt%), Ru (0.4wt%), Y (0.8wt%).

[0049] The present invention is not limited to the foregoing specific implementation. The present invention expands to any new feature or any new combination disclosed in the Description, and steps in any new method or process or any new combination disclosed.

Claims

1. An activator for integrated repair of hot-end components, wherein the preparation of the activator comprises elements in at least the following percentages by mass: Cr (16.2%-19.7%), Co (19.1%-25.8%), Al (1.3%-2.8%), Ru (1.1%-2.9%), Ti (10.1%-13.3%), Ta (0.2%-1.8%), Mo (4.2%-7.8%), Hf (0%-0.1%), Zr (0%-0.1%), Y (0%-0.1%), Ce (0%-0.1%), balance Ni and / or incidental impurities.

2. The activator according to claim 1, wherein the preparation of the activator comprises elements in at least the following percentages by mass: Cr (16.2%), Co (19.1%), Al (2.8%), Ru (2.9%), Ti (10.9%), Ta (1.4%), Mo (7.8%), Hf (0.1%), Y (0.1%), balance Ni and / or incidental impurities.

3. The activator according to claim 1, wherein the preparation of the activator comprises elements in at least the following percentages by mass: Cr (18.7%), Co (21.8%), Al (2.8%), Ru (I.I%), Ti (11.7%), Ta (1.3%), Mo (6.2%), Zr (0.1%), Y (0.1%), balance Ni and / or incidental impurities.

4. The activator according to claim 1, wherein the preparation of the activator comprises elements in at least the following percentages by mass: Cr (16.8%), Co (25.8%), Al (1.8%), Ru (1.3%), Ti (10.1%), Ta (0.5%), Mo (5.1%), Ce (0.1%), balance Ni and / or incidental impurities.

5. The activator according to claim 1, wherein the preparation of the activator comprises elements in at least the following percentages by mass: Cr (19.7%), Co (23.8%), Al (1.3%), Ru (1.5%), Ti (13.3%), Ta (0.2%), Mo (4.2%), Zr (0.1%), balance Ni and / or incidental impurities.

6. The activator according to claim 1, wherein the melting point of the activator is 1,120°C to 1,160°C.

7. The activator according to claim 1, wherein the activator is prepared by an atomization method, and the particle size is 23 µm to 30 µm.

8. A bonding layer curing agent for integrated repair of hot-end components, used in combination with the activator for integrated repair of hot-end components according to any one of claims 1 to 7, wherein the preparation of the bonding layer curing agent comprises elements in at least the following percentages by mass: Ni (25.0%-30.0%), Cr (25.0%-30.0%), Al (12.1%-14.9%), X (0%-1.5%); wherein, "X" is selected from one or a combination of Y, Ta, Hf, Zr, Ce, balance Co and / or incidental impurities.

9. The bonding layer curing agent according to claim 8, wherein the preparation of the bonding layer curing agent comprises elements in at least the following percentages by mass: Ni (30.0%), Cr (27.0%), A1 (14.9%), Y (1.3%), HR (0.2%), balance Co and / or incidental impurities.

10. The bonding layer curing agent according to claim 8, wherein the preparation of the bonding layer curing agent comprises elements in at least the following percentages by mass: Ni (25.0%), Cr (25.0%), A1 (13.8%), Y (1.3%), Ta (0.2%), balance Co and / or incidental impurities.

11. The bonding layer curing agent according to claim 8, wherein the preparation of the bonding layer curing agent comprises elements in at least the following percentages by mass: Ni (24.8%), Cr (30.0%), Al (12.1%), Y (1.5%), balance Co and / or incidental impurities.

12. The bonding layer curing agent according to claim 8, wherein the preparation of the bonding layer curing agent comprises elements in at least the following percentages by mass: Ni (24.8%), Cr (30.0%), Al (12.1%), Y (1.5%), balance Co and / or incidental impurities.

13. The bonding layer curing agent according to claim 8, wherein the preparation of the bonding layer curing agent comprises elements in at least the following percentages by mass: Ni (27.0%), Cr (28.8%), A1 (13.6%), Y (1.3%), Zr (0.2%), balance Co and / or incidental impurities.

14. The bonding layer curing agent according to claim 8, wherein the preparation of the bonding layer curing agent comprises elements in at least the following percentages by mass: Ni (26.0%), Cr (29.0%), A1 (14.2%), Y (1.3%), Ce (0.2%), balance Co and / or incidental impurities.

15. The bonding layer curing agent according to claim 8, wherein the melting point of the bonding layer curing agent is 1,460°C to 1,487°C.

16. The bonding layer curing agent according to claim 8, wherein the bonding layer curing agent is prepared by a rotary motor method, and the particle size of the bonding layer curing agent ranges from 30 µm to 75 µm.

17. A repair process for integrated repair of hot-end components, wherein the activator for integrated repair of hot-end components according to any one of claims 1 to 7 and the bonding layer curing agent for integrated repair of hot-end components according to any one of claims 8 to 16 are used; the hot-end component comprises a base material (1) and a bonding layer on the surface of the base material (1), the base material (1) is a precipitation-strengthened nickel-based cast superalloy, and the bonding layer is a NiCoCrAlX coating (2), wherein "X" is selected from one or a combination of Y, Ta, Hf, Ti, Zr; the process comprises the following steps: S1: Defect grinding; clean the damaged area (3) of the hot-end component; S2: Modeling of base material framework (4); mix the base material curing agent and the binder in a required proportion and fill it into the damaged area (3) of the hot-end component, and dry it to obtain the base material framework (4); S3: Modeling of bonding layer framework (5); mix the bonding layer curing agent and the binder in a required proportion and fill it into the base material framework (4), and dry it to obtain the bonding layer framework (5); S4: Modeling of activator; mix the activator and the binder in a required proportion and fill it directly above the bonding layer framework (5), shape it into a "hill" shape and then carry out a drying treatment; S5: Metallurgical heat preservation; place the hot-end component that has completed step S4 in a vacuum environment with a vacuum degree better than 1×10-3 Pa for heat preservation, and after the heat preservation is completed, cool it with the furnace; S6: Post-treatment; perform a performance restoration heat treatment on the hot-end component that has completed step S5, and shape it to complete the repair of the damaged area (3) of the hot-end component.

18. The repair process according to claim 17, wherein in step S2, the base material curing agent and the binder are mixed in a mass ratio of 20:1 to prepare a paste-like base material modeling paste. The base material modeling paste is dried to obtain the base material framework (4), and the surface of the base material framework (4) is flush with the surface of the base material (1).

19. The repair process according to claim 18, wherein the base material curing agent is M-21 commercial alloy powder or de-titanium GTD111 commercial customized alloy powder, and the selected particle size range is 85 µm to 106 µm.

20. The repair process according to claim 17, wherein in step S3, the bonding layer curing agent and the binder are mixed in a mass ratio of 20:1 to prepare a paste-like bonding layer modeling paste. The bonding layer modeling paste is dried to obtain the bonding layer framework (5), and the surface of the bonding layer framework (5) is flush with the surface of the bonding layer.

21. The repair process according to claim 17, wherein in step S4, the amount of the activator used is 60% to 80% of the weight of the base material framework (4).

22. The repair process according to any one of claims 17-21, wherein the binder in steps S2, S3, and S4 is of the NICROBRAZS-BINDR commercial type.

23. The repair process according to any one of claims 17-21, wherein the drying environment for the drying treatment in steps S2, S3, and S4 is an atmospheric environment at 70°C, and the drying time is 1h to 2h.

24. The repair process according to claim 17, wherein the metallurgical heat preservation temperature is 1,170°C to 1,210°C, and the heat preservation time is 30 minutes to 45 minutes.

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