MANUFACTURE OF A HYBRID CONTACTLESS SMART CARD WITH SMD COMPONENTS AND EMBEDDED NFC ANTENNA

Abstract

A method for manufacturing a contactless smart card according to the present invention provides for obtaining a printed circuit module integrating CMS components forming a voltage rectifier bridge, arranging this module in a compensation hole provided in a conventional smart card substrate, then forming an NFC wire radiofrequency antenna by embedding a conductive wire in the mass of the substrate, the ends of which are soldered to input terminals of the module. Other electronic modules operating on direct current are then easily integrated into the card, electrical connections with the rectifier module also being made by embedding an electric wire in the mass of the substrate. The invention advantageously makes it possible to combine the reduced cost of conventional techniques for embedding a conductive wire by ultrasound to form a radiofrequency antenna and the flexibility of use of CMS components. Figure for abstract: Fig.4h

Description

Title of the invention: MANUFACTURE OF A HYBRID CONTACTLESS CHIP CARD WITH SMD COMPONENTS AND EMBEDDED NFC ANTENNA FIELD OF THE INVENTION

[0001] The invention relates to contactless smart cards provided with surface-mounted components. PRIOR TECHNIQUES

[0002] Contactless smart cards, with memory or microprocessor, are used in a growing number of applications, such as access control (buildings, public transport, shows, etc.) or payment. They mainly use radio frequency (RF) technology for near-field communication or "NFC", defined in particular through the NFCIP-1 (ISO / CEI 18092) and ISO / IEC 14443 standards.

[0003] NFC cards are widely deployed due to their low manufacturing cost and ease of use. Part of the manufacturing efficiency lies in the use of a wire antenna embedded or embedded in the card substrate, usually using ultrasonic technology.

[0004] A current trend is towards the incorporation of new electronic components into these NFC smart cards, in particular luminous components such as LED (or DEL) or OLED (for "organic light-emitting diode" in English) and their controllers. These light sources can, for example, operate as a user interface.

[0005] A significant portion of these new integrated components are surface-mounted components, i.e. components directly soldered to the surface of the printed circuit, unlike traditional components whose pins pass through the printed circuit and whose pins are subsequently soldered. Surface-mounted components or "CMS" or "SMD" (for "surface mounted device" in English) have many advantages: miniaturization, simpler printed circuits, improved component density, reduced costs, etc.

[0006] However, CMSs appear incompatible with traditional NFC cards where the wire antenna is embedded in the card substrate. Indeed, at the high soldering temperatures of CMS components, the substrate typically made of plastic (ABS - Acrylonitrile butadiene styrene, PVC - Polyvinyl chloride, PC - Polycarbonate, PET - Polyethylene terephthalate, PEEK - Polyetheretherketone, PEN - Polyethylene naphthalate) melts. Also, the CMSs are mounted on a traditional printed circuit board which is more resistant to heat (fibrous material such as FR4, or PI - Polyimide).

[0007] It is therefore conventional, in the presence of CMSs, to provide a traditional NFC antenna, i.e. directly printed or etched on the printed circuit. This solution is not satisfactory due in particular to an additional production cost, but also to a greater thickness of the card obtained.

[0008] There is then a need for new techniques for integrating surface-mounted components onto contactless smart cards. Statement of the invention

[0009] For this purpose, the invention relates to a method for manufacturing a contactless smart card, typically of the near field communication or NFC type, comprising the following steps: - obtain a printed circuit module integrating one or more surface-mounted components forming a voltage rectifier circuit, - place the printed circuit module forming the voltage rectifier circuit, in a compensation hole of the same dimension provided in a substrate, then - forming, by embedding conductive wires in the mass of the substrate, a wire radiofrequency antenna whose ends are soldered to associated (input) terminals of the printed circuit module forming a voltage rectifier circuit, as well as electrical connections between the printed circuit module forming a voltage rectifier circuit and one or more active device modules.

[0010] The term "module" or "printed circuit module" means a printed circuit or PCB (for "printed circuit board" in English) of reduced size compared to the substrate, such that it can be incorporated into the thickness of the substrate, at the level of a dedicated compensation hole or "punch".

[0011] "Inlay" also means that the conductive wire is embedded in the mass (generally plastic) of the substrate. Conventional techniques for inlaying a conductive wire are based on ultrasound. The substrate used is therefore suitable for such a technique, and therefore capable of softening and deforming under the action of ultrasound.

[0012] An "active device module" means a module comprising one or more active electronic devices / components. An active electronic device is typically, but not necessarily, a semiconductor component, for example an LED or OLED diode or a micro-sensor.

[0013] A smart card thus produced is not necessarily finished, but may be “semi-finished”, i.e. awaiting further finalization steps, such as for example the incorporation of other electronic components (chip, memory), the lamination of protective and customization layers.

[0014] By mounting the CMS components on a dedicated module, it is possible to integrate the latter into the substrate before producing the wire antenna. The soldering of the CMS components is thus always carried out away from the substrate dedicated to the ultrasonic inlay. In this way, the method makes it possible to produce a hybrid smart card, taking advantage of both the reduced costs of forming antennas by ultrasonic inlay and the wide variety of CMS components which offers higher integration rates.

[0015] Furthermore, the use of such a dedicated module forming a voltage rectifier circuit advantageously allows simplified integration, on the card, of one or more active devices operating on direct current DC (or similar). It is sufficient to connect each of these devices to the printed circuit module forming a voltage rectifier circuit.

[0016] Preferably, the embedding of a conductive wire forming an electrical connection to an active device module is carried out during the same step as the embedding of the wire radiofrequency antenna.

[0017] Correlatively, the invention also relates to a contactless chip card of the near field communication (NFC) type, comprising: - a substrate, - a printed circuit module integrating one or more surface-mounted components forming a voltage rectifier circuit, and arranged in a compensation hole of the same size provided in the substrate, and one or more active device modules, card in which a wire radiofrequency antenna is formed of a conductive wire embedded in the mass of the substrate, the ends of which are soldered to associated terminals of the printed circuit module forming a voltage rectifier circuit, in which electrical connections are formed between the printed circuit module forming a voltage rectifier circuit and one or more active device modules, by conductive wires embedded in the mass of the substrate.

[0018] Optional features of embodiments of the invention are defined in the appended claims. Some of these features are explained below with reference to a method, while they can be transposed into device features.

[0019] In one embodiment, the printed circuit module forming a voltage rectifier circuit is devoid of memory or microprocessor or microcontroller. This eliminates the risk of degradation of these components due to the thermal constraints of soldering the CMSs on the module. In other words, the PCB module can be dedicated to a single simple electronic function, realized using SMD components.

[0020] In particular, the surface-mounted components form a voltage rectifier bridge, also known as a full-wave or full-wave bridge rectifier.

[0021] In one embodiment, the formation of the wire radiofrequency antenna comprises embedding a conductive wire in the mass of the substrate, the ends of the conductive wire being arranged on the associated terminals of the printed circuit module, then soldered to said terminals.

[0022] If one end of the wire forming an electrical connection to an active device module can be arranged on an associated (output) terminal of the printed circuit module forming a voltage rectifier circuit, then soldered thereto, the other end of the wire forming a connection can be arranged on a dedicated terminal of the active device module, then soldered thereto. In this case, one of the active device modules is arranged in a compensation hole provided for this purpose in the substrate, before embedding a conductive wire forming an electrical connection with the printed circuit module forming a voltage rectifier circuit. This active device module can also comprise CMS components.

[0023] In a design variant that can be applied to another active device module, the conductive wire forming the electrical connection can be embedded before arranging this other active device module in the substrate. In this case, one end of an embedded conductive wire forming the electrical connection is exposed (the insulator forming the substrate is removed by any known means, in particular mechanical, machining, milling, laser, chemical, etc.) in a cavity of the substrate before arranging one of the active device modules therein. The electrical connection can in particular be made with a connection material such as ACF or ACP (anistropic conductive film, paste or glue) or any type of conductive paste, or even by direct soldering in the case where the active device or component is carried by a PCB.

[0024] Thanks to these variants, it is possible to achieve a hybrid integration of a large number of active device modules using a single rectifier circuit on the board, and in particular a hybrid integration of an LED module directly soldered to the inlaid wire and an OLED module attached by ACF bonding. The active device modules then comprise at least one light-emitting diode, organic or not. Brief description of the drawings

[0025] Other features and advantages of the invention will become apparent in the description below, illustrated by the attached figures which illustrate exemplary embodiments which are not limiting in nature.

[0026] [Fig. 1] illustrates a full-wave voltage rectifier bridge or "Graetz bridge full-wave rectifier circuit".

[0027] [Fig.2] schematically illustrates a contactless smart card according to embodiments of the invention.

[0028] [Fig. 3] illustrates, using a flowchart, steps of a method for manufacturing a contactless smart card, according to embodiments of the invention.

[0029] Figures 4a to 4h schematically illustrate the step-by-step manufacturing of a contactless smart card, according to embodiments of the invention.

[0030] [Fig.5] schematically illustrates the assembly of a module, typically OLED, using the ACF technique. DETAILED DESCRIPTION

[0031] A method for manufacturing a contactless chip card or "integrated circuit card" or "smart card" according to the present invention advantageously makes it possible to combine the reduced cost of conventional techniques for embedding a conductive wire by ultrasound to form a radiofrequency antenna, typically high-frequency to implement NFC communications, and the flexibility of use of surface-mounted components, due to their great variety, their miniaturization or even their reduced constraints for the PCB substrate.

[0032] If the smart card is said to be “contactless”, that is to say capable of communication by high-frequency link, typically 13.56 MHz (RFID or NFC), it can also be provided with conventional means of contact communication.

[0033] In the examples described below, reference is made, by way of illustration, to a module comprising such surface-mounted components (SMC) which performs an electronic NFC energy harvesting function (“NFC energy harvester” in English). The invention, however, applies to any type of module comprising SMC components having one or more electronic functions.

[0034] A major advantage of a module dedicated to the sole recovery of NFC energy is to make this electrical energy available to other components. It is thus possible to incorporate, in the card, any number of active device modules, for example LED diodes, to be powered by this NFC energy recovery module.

[0035] Such a CMS component module is devoid of memory or microprocessor or microcontroller, and forms a voltage rectifier circuit, typically a voltage rectifier bridge, also known as a full-wave bridge rectifier, converting the alternating voltage resulting from the NFC energy induced by the NFC antenna in the vicinity of an NFC reader.

[0036] Since the following description is based mainly on NFC energy harvesting and the provision of this energy to active device modules, other electronic modules (chip, microprocessor, etc.) exploiting contactless (or even contact) communications may also be present in the card even if they are not illustrated subsequently.

[0037] [Fig. 1] illustrates a full-wave voltage rectifier bridge or "full-wave rectifier circuit with Graetz bridge". As is known, it comprises four diodes DI to D4 connected in a bridge. The common point between the head-to-tail diodes DI and D4 and the common point between the head-to-tail diodes D2 and D3 form two input terminals PI, P2 of the alternating signal from the NFC antenna. The other two points of the bridge form the two output terminals P3 (negative terminal), P4 (positive terminal) of the rectified direct signal.

[0038] Optionally, a smoothing capacitor C is coupled in parallel with the output terminals P3 and P4, so as to smooth the DC voltage as illustrated in the signal shape reproduced in the Figure. For a rectified NFC signal, a capacitance greater than 100 pF, or even 150 pF, can be adapted.

[0039] [Fig.2] schematically illustrates a contactless smart card 100 according to embodiments of the invention.

[0040] The smart card 100 has, for example, the ID-1 dimensions of a credit card as defined in the ISO / IEC 7810 standard, namely 85.60 x 53.98 x 0.76 mm. Of course, other formats can be envisaged.

[0041] The card 100 comprises a substrate or support body 101 formed of a material capable of receiving a conductive wire by ultrasonic inlay. This material may be made of plastic, typically ABS - Acrylonitrile butadiene styrene, PVC - Polyvinyl chloride, PC - Polycarbonate, PET - Polyethylene terephthalate, PEEK - Polyetheretherketone or PEN - Polyethylene naphthalate. The substrate houses, in a compensation hole, a printed circuit module of the rectifier circuit type 110 integrating one or more surface-mounted components, and optionally one or more other active device modules 111-115, such as LED, OLED, also arranged in compensation holes or cavities produced by machining or equivalent technique and electrically connected to the rectifier module 110.

[0042] The example of the Figure illustrates two LED modules 111, 112 and two OLED panel type modules 113 and 114. Of course, a different number (one or more) of active device modules may be provided, as well as modules of different natures from LEDs and OLEDs, for example micro-sensors. Likewise, their spatial arrangements in the plane of the card 100 may be different from those illustrated in the figure.

[0043] The wired radiofrequency antenna 120 required for contactless communication, NFC type, is formed of a conductive wire embedded or embedded in the mass of the substrate 101, by conventional techniques based on ultrasound. In a known manner, the conductive wire is surrounded by an electrically insulating sheath. The wire can be embedded directly in the plastic forming the substrate or wound and then integrated into the latter. Also, the conductive wire typically forms a plurality of loops. The ends of the conductive wire 120 are arranged on the associated terminals PI, P4 of the rectifier module 110 and welded to said terminals. Thus the antenna is coupled to the rectifier module 110.

[0044] A pair of electrical connections 121-124 is also provided between the rectifier module 110 and each of the active device modules 111-114. Each pair may be formed of conductive wires also embedded in the mass of the substrate 101. Alternatively, certain pairs may be deposited (printing, etching) directly on the substrate.

[0045] The conductive wire is preferably an enameled copper wire with a diameter of 112 or 130 μm.

[0046] When the card 100 is brought close to an NFC reader, the magnetic coupling (induction) of their antennas allows the card to be powered by the reader. This electrical energy is alternating, generally of frequency 13.56 MHz. The rectifier module 110 operates as described in [Fig. 1] to rectify the alternating electrical signal received at terminals P1 and P2 into a rectified electrical signal at terminals P3 and P4 which can be considered as a substantially continuous DC signal. These terminals P3 and P4 supply the pairs of electrical links 121-124 and consequently the active device modules 111-114.

[0047] [Fig. 3] illustrates, using a flowchart, steps of a method for manufacturing a contactless smart card 100. This method is also described with reference to Figures 4 a to 4 h, which schematically illustrate the step-by-step manufacturing of this smart card.

[0048] In step 300, a printed circuit module integrating one or more SMD surface-mounted components is obtained. In the example above, the rectifier module 110 is obtained, which is composed of four diodes DI to D4 and a capacitor C, in addition to the terminals PI to P4.

[0049] In detail, a printed circuit PCB 400 is initially obtained in step 301 as illustrated for example in [Fig.4a]. The dimensions of the PCB 400 can for example be those of conventional smart card modules, namely 5.1 x 8.0 mm, in order to reuse existing industrial tools. Of course, other dimensions are possible within the framework of the invention.

[0050] As illustrated in [Fig.4a], the PCB module 400 already comprises a metallization layer (produced using conventional techniques), typically made of copper, deposited on a substrate, typically FR4 or a polyimide-based substrate. The metallization layer forms four metal terminals PI to P4 insulated from each other. In this example, each terminal extends in the form of substantially rectangular metal pads, along one of the sides of the rectangular PCB module 400.

[0051] The input terminals P1, P2 are arranged along the two long sides of the PCB module; the output terminals P3, P4 are arranged along the two short sides of the PCB module. The reverse is possible.

[0052] The terminals along the two short sides of the PCB module extend over the entire length of the sides, while those along the two long sides of the PCB module extend over only a central portion of their length. The reverse is also possible. Other spatial configurations of the terminals are also possible.

[0053] The output terminals P3, P4 have two respective arm-shaped extensions extending towards the center of the PCB module 400.

[0054] Optionally, electrolytic nickel plating can be carried out on the PCB module 400 in order to deposit or plate a thin layer of nickel on the terminals P1 to P4, and thus improve the strength and hardness of the PCB module 400.

[0055] The SMD components, here the diodes DI to D4 and the optional capacitor C, are mounted on the PCB module 400 at step 302. Conventional techniques for soldering the component legs are used here. As illustrated in [Fig.4b], a diode is surface mounted between each pair of terminals PI to P4 in accordance with the bridge diagram of [Fig.l]. In addition, the capacitor C is soldered between the two terminals P3 and P4, preferably between the terminal portions of their extensions extending towards the center of the PCB module 400.

[0056] At the end of step 302, the rectifier module 110 is obtained.

[0057] In step 310, one or more other electronic modules to be mounted on the card to chip 100 can be obtained, using techniques similar to those of step 300 or using other techniques. These electronic modules comprise, for example, active components.

[0058] In the example of [Fig.2], two LED modules 111, 112 and two OLED modules 113, 114 are obtained as shown in [Fig.4c]. Again, these modules may have standard dimensions 5.1 x 8.0 mm, or any other dimensioning.

[0059] In step 320, a substrate or support body or “inlay” or “prelam” or “prelaminated layer” 410 of card is obtained, which has one or more compensation holes (generally blind) 411, 412 or “punches” sized to receive all or part of the modules mentioned above.

[0060] In particular, a compensation hole 411 is provided to receive the rectifier module 110 obtained in step 300. It therefore has standard dimensions of 5.1 x 8.0 mm.

[0061] Each compensation hole can be formed using conventional techniques: mechanical removal of material (e.g. milling), machining, by laser, by chemical process, etc. Typically, the depth of the cavity forming the compensation hole is substantially equal to the thickness of the module to be inserted therein, for example 150 μm, it being noted that the thickness of the card core substrate is approximately 300 μm.

[0062] In the example of [Fig.4d], a compensation hole 411 is provided to receive the rectifier module 110, and two compensation holes 412 are provided to receive the LED modules 111, 112.

[0063] In step 330, these modules, therefore the rectifier module 110 and the LED modules 111, 112, are arranged in the corresponding compensation holes 411, 412 provided in the substrate 101. This assembly is illustrated in [Fig.4e].

[0064] In step 340, a copper conductive wire is embedded in the mass of the substrate 410 to form the NFC radiofrequency antenna, connect it to the rectifier module 110 and connect all of the modules provided to this rectifier module 110, a continuous power source for the latter.

[0065] The inlaying of the conductive wire can be carried out by any conventional technique based on ultrasound, in particular by the use of an ultrasonic head (sonotrode).

[0066] In detail, in step 341, a conductive wire 120 is embedded in the mass of the substrate 410 in the form of multiple loops, the ends of which are arranged on the input terminals PI and P2 of the rectifier module 110. These ends are then soldered to the terminals. This conductive wire forms the wire RF antenna of the card, as illustrated in [Fig.4f].

[0067] In step 342, conductive wires are also embedded in the mass of the substrate 410 to form DC (direct current) electrical connections between the rectifier module 110 and the other modules already arranged on the card but also to the location of other modules (the OLEDs 113, 114) to be arranged later. A pair of wires is provided for each module.

[0068] The pairs of electrical connections can be made in cascade, from one module to the next, as illustrated in [Fig.4g] by the connections 121 (between the rectifier module 110 and the LED 111), 122 (between the LED 111 and the LED 112) and 123 (between the LED 112 and the location 413 where the OLED 113 will be arranged) and / or be made in parallel from the rectifier module 110, as illustrated by the connections 121 (between the rectifier module 110 and the LED 111) and 124 (between the rectifier module 110 and the location 414 where the OLED 114 will be arranged). In particular, all of the connections 121 to 124 can be made in parallel from the rectifier module 110.

[0069] Similarly to step 341, the end of each wire leading to a module already in place (rectifier module 110 or LED 111, 112) is placed on the corresponding contact terminal and soldered to it.

[0070] The ends of the wires leading to the locations 413, 414 intended to subsequently receive modules may, for example, have a contact area or interconnection zone formed by zigzags (or close alternations) of the conductive wire.

[0071] At the end of step 342, a “semi-finished” smart card is obtained.

[0072] In step 350, the possible other modules (OLED 113 and 114 in the example) are integrated into the card. This includes, for example, in step 351, the development, at locations 413 and 414, of cavities with the dimensions of these other modules to accommodate them.

[0073] The contact pads made up of conductive wires and embedded in the substrate are exposed during the creation of the cavities, by any known means, in particular mechanical, machining or by laser, chemical or thermal attacks.

[0074] Then in step 352, the other modules are arranged in these cavities by any appropriate mounting technique, for example based on ACF or conductive glues or films.

[0075] In this respect, the OLED modules 113 and 114 are mounted by ACF technique as illustrated in [Fig.5]. In this figure, the cavity 513 with the dimensions of the OLED module 113 is formed by destructive machining of the substrate 101 until the conductive wire 123 is exposed at the contact pads P3 and P4 (because they are connected respectively to the pads P3 and P4 of the rectifier module 110). An ACF film is deposited on these contact pads before the OLED module 113 is inserted, thus making the electrical connection between the module and the contact pads.

[0076] This figure also illustrates that the depth of embedding of the conductive wires to form the contact pads can be adjusted to the z dimensions (height) of the module to be inserted. This adjustment is obtained for example by modifying the power of the ultrasound emitted by the sonotrode.

[0077] At the end of step 352, we obtain the “semi-finished” smart card of [Fig.4h] similar to [Fig.2].

[0078] The method of [Fig.3] ends with step 360 of finalizing the card. This step can involve a large number of operations, carried out in whole or in part.

[0079] It may comprise, for example, the addition of other electronic modules, typically a microprocessor module connected to the antenna 120 or to another antenna to communicate with the NFC reader.

[0080] It may also comprise the lamination of one or more protective and / or finishing layers on the front and back of the semi-finished smart card. These layers may include visual elements for customizing the smart card.

[0081] It can also include printing visual personalization elements on the smart card.

[0082] A contactless card according to the invention thus offers a solution for harvesting RF energy, NFC type, from a wired RF antenna embedded and embedded in the mass, which is capable of providing a direct current DC output to any number of integrated electronic modules operating in direct current, typically LEDs. This overcomes the constraint of known techniques which require mounting, on the same module, a rectifier diode per LED. Furthermore, this module approach allows the easy integration of modules such as OLED panels.

[0083] Although the present invention has been described above with reference to specific embodiments, the present invention is not limited to these specific embodiments, and modifications, which are within the scope of the present invention, will be apparent to those skilled in the art.

[0084] Numerous other modifications and variations will become apparent to those skilled in the art upon reference to the above illustrative embodiments, which are given by way of example only and do not limit the scope of the invention, which is determined solely by the appended claims. In particular, the different features of the different embodiments may be interchanged, where appropriate.

[0085] In the claims, the word "comprising" does not exclude other elements or steps, and the indefinite article "a" or "an" does not exclude a plurality. The mere fact that different features are recited in mutually different dependent claims does not indicate that a combination of those features cannot be used to advantage.

Claims

Claims

1. Method for manufacturing a contactless smart card of the near field communication, NFC type (100), comprising the following steps: - obtaining (300) a printed circuit module (110) integrating one or more surface-mounted components (D1-D4, C) forming a voltage rectifier bridge, - arranging (330) the printed circuit module forming a voltage rectifier bridge, in a compensation hole (411) of the same size provided in a substrate (410), then - forming (341), by embedding conductive wires in the mass of the substrate, a wire radiofrequency antenna (120) whose ends are soldered to associated terminals (PI, P2) of the printed circuit module forming a voltage rectifier bridge, as well as electrical connections (121-124) between the printed circuit module forming a voltage rectifier bridge and one or more active device modules (111-114).

2. The method of claim 1, wherein the printed circuit module (110) forming a voltage rectifier bridge is devoid of memory or microprocessor or microcontroller.

3. Method according to one of the preceding claims, in which the formation of the wire radiofrequency antenna (120) comprises the embedding of a conductive wire in the mass of the substrate, the ends of the conductive wire being arranged on the associated terminals (PI, P2) of the printed circuit module, then soldered to said terminals.

4. Method according to one of the preceding claims, in which one of the active device modules (111-112) is arranged in a compensation hole (412) provided for this purpose in the substrate (410), before inlaying (342) a conductive wire forming an electrical connection (121, 122) with the printed circuit module forming a voltage rectifier bridge.

5. Method according to one of the preceding claims, in which one end of an embedded conductive wire forming an electrical connection (123, 124) is exposed in a cavity (513) of the substrate before arranging one of the active device modules (113, 114) therein.

6. Method according to one of the preceding claims, in which the one or more active device modules (111-114) comprises at least one light-emitting diode, organic or not.

7. Contactless smart card of the near field communication, NFC type (100), comprising: - a substrate (410), - a printed circuit module (110) integrating one or more surface-mounted components (D1-D4, C) forming a voltage rectifier bridge, and arranged in a compensation hole (411) of the same size provided in the substrate, and one or more active device modules (111-114), card in which a wire radiofrequency antenna (120) is formed of a conductive wire embedded in the mass of the substrate, the ends of which are soldered to associated terminals (PI, P2) of the printed circuit module forming a voltage rectifier bridge, and in which electrical connections (121-124) are formed between the printed circuit module forming a voltage rectifier bridge and one or more active device modules (111-114), by conductive wires embedded in the mass of the substrate.

8. A card (100) according to claim 7, wherein the surface-mounted components (D1-D4, C) form a voltage rectifier bridge.

9. Card (100) according to claim 7 or 8, wherein the one or more active device modules (111-114) comprises at least one light-emitting diode, organic or not.

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