Electronic equipment comprising at least one thermoelectric module, corresponding electronic system

Abstract

Electronic equipment comprising a support (2) and at least one component (3), at least one thermoelectric module (7) being associated with the component, the module being shaped as a block comprising two main heat exchange faces, the module being integrated at least in part in the support so that a first of its two main faces is in contact with at least one of the faces of the component, either directly or via at least one connection (10) made of at least thermally conductive material. Corresponding electronic system. FIGURE OF THE ABSTRACT: Fig. 1

Description

Title of the invention: Electronic equipment comprising at least one thermoelectric module, corresponding electronic system

[0001] The invention relates to electronic equipment comprising at least one thermoelectric module.

[0002] The invention also relates to an electronic system comprising such equipment.

[0003] BACKGROUND OF THE INVENTION

[0004] Climate change is a major concern for many legislative and regulatory bodies around the world. Indeed, various restrictions on carbon emissions have been, are being, or will be adopted by various states. In particular, an ambitious standard applies both to new types of aircraft and those in circulation requiring the implementation of technological solutions in order to make them compliant with current regulations. Civil aviation has been mobilizing for several years now to make a contribution to the fight against climate change.

[0005] Technological research efforts have already made it possible to significantly improve the environmental performance of aircraft. The Applicant takes into consideration the impact factors in all phases of design and development to obtain less energy-intensive, more environmentally friendly aeronautical components and products whose integration and use in civil aviation have moderate environmental consequences with the aim of improving the energy efficiency of aircraft.

[0006] Consequently, the Applicant is constantly working to reduce its negative climate impact by using methods and operating virtuous development and manufacturing processes and minimizing greenhouse gas emissions to the minimum possible in order to reduce the environmental footprint of its activity.

[0007] This sustained research and development work covers new generations of aircraft engines, the lightening of aircraft, particularly through the materials used and lighter on-board equipment, the development of the use of electrical technologies to ensure propulsion, and, as essential complements to technological progress, aeronautical biofuels.

[0008] However, in aircraft, electronic equipment and systems tend to give off heat, which generally requires them to be associated with re- bulky and energy-consuming cooling, such as fans or air conditioners.

[0009] SUBJECT OF THE INVENTION

[0010] One aim of the invention is to propose electronic equipment which is more environmentally friendly.

[0011] An aim of the invention is to propose an electronic system comprising such equipment. Summary of the invention

[0012] For this purpose, electronic equipment is provided comprising at least one support and at least one component.

[0013] According to the invention, the equipment comprises at least one thermoelectric module which is associated with the component and which is shaped into a block comprising two main heat exchange faces, the module being integrated at least in part in the support so that a first of its two main faces is in contact with at least one of the faces of the component, either directly or via at least one connection made of at least thermally conductive material.

[0014] Thus, by integrating a thermoelectric module into the support itself, it is easier to ensure thermal exchanges with the component.

[0015] Since the thermal exchanges between the component and the thermoelectric module are local, they prove to be more efficient and faster.

[0016] The invention therefore proves to be more environmentally friendly.

[0017] In addition, premature aging of the associated component is limited (due, for example, to its heating if the module was not present). This improves the performance of the electronic equipment over time.

[0018] The invention is thus the result of technological research aimed at very significantly improving the performance of aircraft and, in this sense, contributes to reducing the environmental impact of aircraft.

[0019] For the present application, it is recalled that a “thermoelectric module” is a module allowing the Peltier effect to be implemented: when the module is electrically powered, it generates a temperature difference so that one of its main faces is hot and the other cold. Conversely, such a module also allows the Seebeck effect to be implemented: when a temperature gradient is applied to the module, it generates an electric current. The thermoelectric module thus comprises one or more of the thermoelectric materials allowing the implementation of the two aforementioned effects.

[0020] For the present application, by "direct contact" between an element A and an element B, it is meant that the element A touches the element B without an intermediate macroscopic part C. Of course, when the element A and the element B are in direct contact, a possible layer of fixing material (for example layer of sintering material, in particular silver or copper sintering, or layer of crosslinking material, for example a thermally conductive glue, or layer of soldering material) may be present between element A and element B in order to fix said elements together. This layer is obviously not comparable to an intermediate macroscopic part C.

[0021] Optionally the module is fully integrated into the support.

[0022] Optionally, the equipment includes thermal regulation means associated with the module.

[0023] Optionally, the thermal regulation means are arranged at least partly inside the support.

[0024] Optionally, the module is in direct contact with at least one element of the thermal regulation means.

[0025] Optionally, the thermal regulation means comprise a drain made of thermally conductive material.

[0026] Optionally, the thermal regulation means comprise a thermal reference interface, the module being in contact with said thermal reference interface, either directly or via a connection made of thermally conductive material.

[0027] Optionally, the component is a first component, the equipment being configured to allow the temperature regulation of a group comprising the first component and at least one second component.

[0028] Optionally, the module is a first module associated with the first component, the equipment comprising a second module associated with the second component.

[0029] Optionally, the support is a first support, at least one of the components being carried by a second support of the electronic equipment.

[0030] Optionally, the equipment includes a third support carrying the second module.

[0031] Optionally the first module, the first component, the second component and the second module are superimposed so as to form a stack.

[0032] Optionally the first module implements the Peltier effect and the second module the Seebeck effect.

[0033] Optionally, the module is a first module, the equipment comprising a second module associated with another face of the component, the first module, the component and the second module being superimposed so as to form a stack.

[0034] Optionally the equipment is a power module.

[0035] The invention also relates to an electronic system comprising equipment as mentioned above, the electronic system being an aircraft electronic system.

[0036] Other characteristics and advantages of the invention will emerge from reading the following description of particular and non-limiting embodiments of the invention. Brief description of the drawings

[0037] Reference will be made to the accompanying drawings, among which:

[0038] [Fig-1] [Fig.l] is a sectional view of electronic equipment according to a first embodiment of the invention;

[0039] [Fig.2] [Fig.2] is a sectional view of electronic equipment according to a second embodiment of the invention, sectional view associated with a zoom of a part of said equipment;

[0040] [Fig.3] [Fig.3] is a sectional view of electronic equipment according to a third embodiment of the invention;

[0041] [Fig.4] [Fig.4] is a sectional view of electronic equipment according to a fourth embodiment of the invention;

[0042] [Fig.5] [Fig.5] is a sectional view of electronic equipment according to a fifth embodiment of the invention;

[0043] [Fig.6] [Fig.6] is a sectional view of electronic equipment according to a sixth embodiment of the invention;

[0044] [Fig.7] [Fig.7] is a sectional view of electronic equipment according to a seventh embodiment of the invention, sectional view associated with a zoom of a part of said equipment;

[0045] [Fig.8] [Fig.8] is a sectional view of electronic equipment according to a eighth embodiment of the invention;

[0046] [Fig.9] [Fig.9] is a sectional view of electronic equipment according to a ninth embodiment of the invention. DETAILED DESCRIPTION OF THE INVENTION

[0047] In [Fig.l] is shown an electronic equipment 1 according to a first embodiment, the equipment comprising a support 2. The support 2 carries at least one component 3, here on its upper face 4. The component 3 here comprises two main faces, a first face 5 facing the outside of the support 2 and a second face 6 facing the support 2. The component 3 is linked to the support at its second face 6.

[0048] According to the invention, the component 3 is associated with a thermoelectric module 7.

[0049] As indicated above, a thermoelectric module 7 can implement the effect Peltier: when the thermoelectric module 7 is electrically powered, it generates a temperature difference so as to present a hot zone and a cold zone. By reversing the direction of the current passing through the thermoelectric module 7, the role of said zones is reversed and the hot zone becomes the cold zone and in payment. To ensure optimized heat transfer with the exterior, the thermoelectric module 7 is preferably configured so as to minimize thermal losses at the exterior / hot zone interface on the one hand and the exterior / cold zone interface on the other hand. In particular, the thermoelectric module 7 is configured so as to minimize thermal resistance at the exterior / hot zone interface on the one hand and the exterior / cold zone interface on the other hand. Optionally, the component 3 is fixed to the support 2 via the module 7. Typically the second face 6 of the component 3 is fixed to the module 7 for example by sintering, for example by silver or copper-based sintering, by crosslinking, for example a thermally conductive glue, or by soldering.

[0050] The module 7 is directly fixed to the support 2 by sintering, for example by silver or copper-based sintering, by crosslinking, for example a thermally conductive glue, or by soldering. Preferably, the material fixing the component 3 to the support 2 and / or the material fixing the module 7 to the support 2 is electrically conductive and / or thermally conductive.

[0051] In a manner known per se, the support 2 is shaped so as to be able to conduct an electric current. This is how the component 3 can be electrically powered. Different options are thus known.

[0052] The component 3 can thus be electrically powered by the support 2 and / or by the module 7. This power supply of the component 3 by the support 2 and / or the module 7 is applicable for all the other embodiments of the present application.

[0053] For example, the support 2 is a printed circuit board: it thus comprises an electrically insulating substrate provided with one or more tracks and / or one or more vias made of electrically conductive material which make it possible to conduct the current through the support 2 to the component 3 and / or to the module 7.

[0054] According to a first option, the support 2 is shaped to power the component 3 (without intervention of the module 7) on the one hand and to power the module 7 on the other hand. The electrical power supply of the component 3 and the module 7 by the support 2 is therefore independent.

[0055] According to a second option, the support 2 is shaped to power the module 7 without directly powering the component 3. It is then the module 7 which transmits the electric current into the component 3. For this purpose, the material allowing the module 7 to be fixed to the support 1, on the one hand, and the component 3 to the module 7, on the other hand, is made of an electrically conductive material in order to allow the electrical power supply of the component 3 by the support 2 and the module 7 (due to its thermoelectric nature, the module 7 can in fact play the role of an electrical conductor between the support 2 and the component 3).

[0056] 3 for example by means of one or more electrically conductors passing through it, the module 7 thus passively powers the component 3). In addition, the material used to fix the module 7 to the support 1, on the one hand, and the component 3 to the module 7, on the other hand, is made of an electrically conductive material and is also thermally conductive.

[0057] The use of such a material makes it possible to limit the electrical resistance at the interfaces of the hot and cold zones of the module 7 with the exterior and thus to optimize the thermal exchanges with the exterior. To this end, it is sought that the material has an electrical resistance less than or equal to one milliohm.

[0058] According to a third option, the support 2 is shaped to power the component 3 without powering the module 7. It is then the component 3 which retranscribes the electric current into the module 7. For this purpose, the material making it possible to fix the module 7 to the support 1, on the one hand, and the component 3 to the module 7, on the other hand, is made of an electrically conductive material. Furthermore, the material making it possible to fix the module 7 to the support 1, on the one hand, and the component 3 to the module 7, on the other hand, is made of an electrically conductive material and is also thermally conductive.

[0059] The module 7 is shaped as a block comprising two main faces for heat exchange with the exterior, 8, 9. The module 7 is shaped so that its two faces 8, 9 are parallel to each other.

[0060] Due to its thermoelectric characteristics, when the module 7 is electrically powered, a temperature differential appears between its two main faces so that the module thus has a so-called “cold” face and a so-called “hot” face, the hot face (respectively the cold face) being a first of the two main faces of the module (respectively the second of the two main faces of the module) depending on the direction of circulation of the current in the module 7.

[0061] It is therefore understood that in order to benefit from the thermoelectric characteristics of the module 7, the module 7 must be electrically powered with a particular direction of current flow depending on whether the face of the module 7 is desired to be “hot” and the one desired to be “cold” (the fact that it plays the role of an electrical conductor for the component 3 is independent of this dedicated power supply).

[0062] In [Fig.l] an electrical assembly is thus schematically represented allowing the module 7 to be voluntarily electrically powered.

[0063] For the other figures, in order to facilitate reading, this electrical assembly will not necessarily be shown. It will be understood, however, that it is present in the different embodiments described in the present application and can be implemented for all embodiments. This power supply of the module 7 by the support 2 (either directly or by means of an additional element and by example via a component 3) is applicable for all other embodiments of the present application so that these explanations will not be repeated below.

[0064] In the present case, the module 7 associated with the component 3 is therefore used so as to cool it.

[0065] The face 8 of the module 7 which is in contact with the second face 6 of the component 3 is thus the cold face. Optionally, this face 8 is in direct contact with the second face 6 of the component 3.

[0066] Thus in the present case, the current arrives via the support 2 to first reach the face 6 of the module 7. The current then passes through the module 7 and then exits via the face 8 of the module 7, to supply the component 3 before being evacuated by the support 2 and consequently forming a loop.

[0067] Powering a thermoelectric module so that one of its faces is hot and the other cold is well known in the prior art and will not be detailed further here.

[0068] In order to ensure heat evacuation outside the support, the electronic equipment 1 comprises thermal regulation means in contact with the hot face of the module, here the face 9.

[0069] The thermal regulation means are or comprise a bus (and for example a bus bar) and / or a heat pipe and / or a cover and / or a hood made of thermally conductive material (and for example metal or even graphene) and / or a heat sink and / or any other type of heat sink and / or heating depending on the intended application.

[0070] In the present case, the thermal regulation means comprise a heat drain 10. Optionally, the face 9 is in direct contact with the heat drain 10. Typically, the face 9 is fixed to the heat drain 10, for example by sintering, for example by silver or copper-based sintering, by crosslinking, for example a thermally conductive glue, or by brazing.

[0071] The heat drain 10 is made of a thermally conductive material such as, for example, metal such as copper, silver, aluminum, gold, palladium, nickel, etc.

[0072] The heat drain 10 is here shaped so that its thickness is much less than its two other dimensions. The heat drain 10 is for example shaped into a rod, a plate, a wafer, etc.

[0073] The heat drain 10 extends for example inside the support 2 so as to open at only one end outside the support 2. The heat drain 10 extends for example rectilinearly inside the support 2.

[0074] Preferably, the heat drain 10 is sized to protrude on either side of the main face of the associated module 7 (the main face 9 in this case). along at least one dimension.

[0075] According to one option, the module 7 is arranged only partly in the support 2. For this purpose, the support 2 comprises a housing 11 opening at one end at the level of the upper main face 4 of the support 2. In the present case, the housing 11 comprises an opposite end open onto the heat drain 10.

[0076] The module 7 is here arranged in the housing 11 so that its upper face, the face 8, protrudes from the upper main face 4 of the support 2. On the other hand, its lower face, the face 9, is entirely arranged in the support 2. Typically between 30 and 95% of the module 7 is arranged inside the support 2 and for example between 50 and 90%.

[0077] In the first embodiment thus described, the component 3 is in direct contact with the module 7 which is itself in direct contact with the heat sink 10 (by the layers of fixing materials as indicated above).

[0078] We thus have the following succession of layers (layers of fixing material aside) over the height of the electronic equipment 1 at the level of the component 3: component 3 / module 7 / thermal drain 10 / support 2. According to a first variant of the first embodiment, the component 3 can be arranged on the lower face 12 of the support 2 and not on its upper face 4 (as visible for example in [Fig.3]).

[0079] If the module 7 is fixed to the support 1, it will preferably be fixed by means of a material that is at least thermally conductive (and possibly also electrically conductive depending on the way in which the module 7 is electrically powered).

[0080] According to a second variant of the first embodiment (optionally combinable with the first variant mentioned above), although here the module 7 is associated with the component 3 so as to cool the component, the module 7 can be associated with the component 3 so as to heat it. In this case, it will be sufficient to modify the direction of circulation of the current of the electrical power supply of the module 7 so that the face 9 of the module is the cold face and so that the face 8 of the module is the hot face.

[0081] In [Fig. 2] is shown an electronic equipment 1 according to a second embodiment, the electronic equipment 1 comprising a support 2. The support 2 is a printed circuit board which carries at least one component 3, here on its upper face 4. The component 3 here comprises two main faces, a first face 5 facing the outside of the support and a second face 6 facing the support. The component 3 is connected to the support 2 at its second face 6.

[0082] Component 3 is associated with a thermoelectric module 7.

[0083] Optionally, the component 3 is directly fixed to the support 2. Typically the second face 6 is directly fixed to the support for example by sintering, for example by sintering based on silver, copper, etc. by crosslinking, for example by a thermally conductive glue, or by soldering.

[0084] The module 7 is shaped as a block comprising two main faces for heat exchange with the exterior. The module 7 is shaped so that its two faces are parallel to each other. As already indicated, the module 7 is electrically powered (for example via the support 2 and optionally also via the component 3) so that a temperature differential appears between its two main faces. The module 7 thus has a so-called "cold" face and a so-called "hot" face, the hot face (respectively the cold face) being a first of the two main faces of the module (respectively the second of the two main faces of the module) according to the direction of circulation of the current in the module.

[0085] In the present case, the module 7 is associated with the component 3 so as to cool it. The face 8 which is in contact with the second face 6 of the component 3 is thus here the cold face.

[0086] Optionally, the face 8 is in contact with the second face 6 of the component 3 via at least one thermally conductive connection 13. Preferably, the connection 13 is also electrically conductive: in this way the component 3 can be electrically powered and thermally regulated via the same connection 13.

[0087] This simplifies the electronic equipment 1.

[0088] Alternatively, at least two links 13 can connect the component 3 to the module 7, one being thermally conductive and the other being electrically conductive.

[0089] The connection 13 is for example a track and / or a via. The connection 13 is for example made of metal and for example copper, silver, aluminum, gold, palladium, nickel

[0090] The connection 13 is thus in direct contact on the one hand with the component 3 (here the second main face 6 of the component 3) and on the other hand in direct contact with the module 7 (here the face 8 of the module 7).

[0091] Preferably, the face 8 is in contact with the second face 6 of the component 3 via a multitude of connections 13 which thus form here a “forest” of vias.

[0092] The different connections 13 are for example identical to each other.

[0093] The different connections 13 extend for example identically parallel to each other others.

[0094] The different connections 13 extend for example orthogonally to the second main face 6 of the component 3 and to the face 8 of the module 7, while extending between these two faces 6, 8.

[0095] In order to ensure heat evacuation outside the support 2, the electronic equipment 1 comprises thermal regulation means in contact with the hot face of the module 7.

[0096] The thermal regulation means are or comprise a bus (and for example a bus bar) and / or a heat pipe and / or a cover and / or a hood made of thermally conductive material and / or a heat sink and / or any other type of heat sink and / or heating depending on the intended application.

[0097] In the present case, the thermal regulation means comprise a thermal drain 10. Optionally, the face 9 is in direct contact with the thermal drain 10.

[0098] The heat sink 10 is made of a thermally conductive material such as, for example, metal such as copper, silver, aluminum, gold, palladium, nickel, etc.

[0099] The heat drain 10 is here shaped so that its thickness is much less than its other two dimensions. The heat drain 10 is for example shaped into a rod, a plate, a wafer, etc.

[0100] The heat drain 10 extends for example inside the support 2 so as to open at only one end outside the support 2. The heat drain 10 extends for example rectilinearly inside the support 2.

[0101] Preferably, the heat drain 10 is sized to protrude on either side of the main face of the associated module 7 (the main face 9 in the present case) according to at least one dimension.

[0102] According to one option, the module 7 is arranged entirely in the support 2. For this purpose, the support 2 comprises a housing 11 which does not open out at the level of the upper main face 4 of the support and the lower main face 12. In the present case, the housing 11 comprises an end open on the heat drain 10 and an opposite end open on the second strip 15.

[0103] In the second embodiment thus described, the component 3 is in direct contact with the connection 13 which is itself in direct contact with the module 7 which is itself in direct contact with the heat drain 10.

[0104] We thus have the following succession of layers over the height of the electronic equipment 1 at the level of the component 3 (layers of fixing material aside): component 3 / connection 13 / module 7 / thermal drain 10 / support 2.

[0105] According to a first variant of the second embodiment, the component 3 can be arranged on the lower face 12 of the support 2 and not on its upper face 4.

[0106] According to a second variant of the second embodiment (optionally combinable with the first variant mentioned above), although here the module 7 is associated with the component 3 so as to cool the component 3, the module 7 can be associated with the component 3 so as to heat it. In this case, it will be sufficient to modify the direction of circulation of the current of the electrical power supply of the module 7 so that the face 9 of the module is the cold face and so that the face 8 of the module is the hot face.

[0107] Of course, the same support can comprise several module / component pairs. [Fig. 3] thus illustrates a third embodiment in which a first module 7a / component 3a pair according to the first embodiment and a second module 7b / component 3b pair according to the second embodiment are arranged on the same support 2. In the case of [Fig. 3], one of the pairs is associated with the upper face 4 of the module 3 and the other of the pairs with its lower face 12 but of course the two pairs can be associated with the same face of the support 2 (upper 4 or lower 12).

[0108] Furthermore, the same component can be associated with several modules so that the component is in contact (direct and / or by a connection made of at least thermally conductive material) with at least two thermoelectric modules. [Fig. 4] thus illustrates a fourth embodiment in which the same component 3 is associated with a first module 7 and a second module 17. For example, the first module 7 / component 3 pair is the same as that described for the first embodiment (this is of course an option and the first module 7 / component 3 pair could be, for example, that described for the second embodiment).

[0109] The second module 17 is here identical to the first module 7.

[0110] The second module 17 thus has two main faces, namely a face 18 and one side 19.

[0111] Optionally, the face 18 of the second module 17 is the one in contact with the first face 5 of the component 3.

[0112] For example, face 18 is in direct contact with the first face 5 of component 3.

[0113] Optionally the second module 17 is configured so that the face 18 is the cold side and side 19 the hot side.

[0114] As indicated previously, the first module 7 and the second module 17 are electrically powered so that each can participate in the cooling of the component 3. The direction of circulation passing through each of the modules must therefore be defined accordingly. The power supply of the first module 7 can be done by inserting electrically conductive tracks and / or vias in the support 2 and / or the component 3 and / or through the second module 17. The power supply of the second module 17 can be done by inserting electrically conductive tracks and / or vias in the support 2 and / or the component 3 and / or through the first module 7.

[0115] Component 3 is thus sandwiched between the two modules 7, 17.

[0116] The second module 17 is located here entirely outside the support 2. The second module 17 therefore evacuates the heat by contact with the environment external to the support 2 (for example by convection and / or radiation).

[0117] In the fourth embodiment thus described, the component 3 is in contact direct with the two modules 7, 17 associated with it.

[0118] We thus have the following succession of layers over the height of the electronic equipment 1 at the component level (layers of fixing material aside): second module 17 / component 3 / first module 7 / thermal drain 10 / support 2.

[0119] According to a first variant of the fourth embodiment, the component 3 can be arranged on the lower face 12 of the support 2 and not on its upper face 4.

[0120] According to a second variant of the fourth embodiment (optionally combinable with the first variant mentioned above), although here the modules 7, 17 are associated with the component 3 so as to cool the component 3, the modules 7, 17 can be associated with the component 3 so as to heat it. In this case, it will be sufficient to modify the direction of circulation of the current of the electrical power supply of the module 7 and that of the electrical power supply of the module 17 so that the faces 9 and 19 are the cold faces and so that the faces 8 and 18 are the hot faces.

[0121] According to a third variant of the fourth embodiment (optionally combinable with the first variant mentioned above), although here the two modules 7, 17 are associated with the component 3 so as to cool the component 3, one of the modules 7, 17 may be associated with the component 3 to cool it and the other of the modules 7, 17 may be associated with the component 3 to heat it. In this case, it will be sufficient to modify the direction of circulation of the current of the power supply of the module 7 and / or the direction of circulation of the current of the power supply of the module 17 so that the faces 9 and 18 are the cold (or hot) faces and so that the faces 8 and 19 are the hot (or cold) faces.

[0122] It will thus be possible to operate module 7 or module 17 alternately depending on the desired objective.

[0123] [Fig.5] illustrates a fifth embodiment which is identical to the fourth embodiment except that the second module 17 does not exchange heat directly with the external environment but exchanges heat with solid thermal regulation means 21 which may or may not be part of the electronic equipment.

[0124] Said thermal regulation means 21 are or comprise for example a bus (and for example a bus bar) and / or a heat pipe and / or a cover and / or a hood made of thermally conductive material (and for example metal or even graphene) and / or a heat sink and / or any other type of heat sink and / or heating depending on the intended application.

[0125] For example, at least part of the thermal regulation means 21 are in direct contact with the face 19 of the second module 17 opposite the face 18 fixed to the component 3.

[0126] The thermal regulation means in direct contact with said face 19 of the second module 17 may have a width and / or a length smaller than that of said face. As a variant, the thermal regulation means in direct contact with said face 19 of the second module 17 may have a width and / or a length similar to those of said face. As a further variant, the thermal regulation means in direct contact with said face 19 of the second module 17 may have a width and / or a length greater than those of said face.

[0127] [Fig. 6] illustrates a sixth embodiment which is identical to the fourth embodiment except that the component 3 is not arranged at one of the faces of the support 2 but is arranged entirely inside the support 2. The second module 17 is then arranged only partly inside the support 2 and no longer entirely outside the support 2.

[0128] The second module 17 is here arranged so that its face (opposite to that in contact with the component 3) protrudes from the upper main face 4 of the support 2. On the other hand, its face in contact with the component 3 is entirely arranged in the support 2. Typically between 30 and 95% of the second module 17 is arranged inside the support 2 and for example between 50 and 90%.

[0129] According to a first variant of this sixth embodiment, the second module 17 does not evacuate the heat by contact with the environment external to the support 2 (for example by convection and / or radiation) but evacuates the heat by means of thermal regulation as was proposed in the fifth embodiment.

[0130] According to a second variant of this sixth embodiment, the second module 17 can also be arranged entirely inside the support 2 like the first module 7. The second module 17 is then associated with thermal regulation means arranged at least partly inside the support 2 like the first module 7.

[0131] [Fig.7] illustrates a seventh embodiment which is identical to that of the sixth embodiment except that the first module 7 is not in direct contact with the thermal regulation means but is in contact by at least one thermally conductive connection 20.

[0132] The connection 20 is for example the same as the connection 13 described for the second embodiment.

[0133] Preferably, the module 7 is in direct contact with the thermal regulation means by a multitude of connections 20, and preferably by a multitude of connections 20 all identical to the connections 13 of the second embodiment.

[0134] The thermal regulation means associated with the first module 7 are arranged entirely inside the support 2 or only partly inside the support 2 or entirely outside the support 2.

[0135] The thermal regulation means are or comprise, for example, a bus (and for example a bus bar) and / or a heat pipe and / or a cover and / or a hood made of thermally conductive material (and for example metal or even graphene) and / or a heat sink and / or any other type of heat sink and / or heating depending on the intended application.

[0136] [Fig.8] illustrates an eighth embodiment which is identical to that of the first embodiment except that the component 3 is not carried by the same support 2 as the module 7.

[0137] The electronic equipment 1 thus comprises the support 2 carrying the module 7 as well as an additional support 22 carrying the component 3. The support 22 can be identical or different from the support 2. The support 22 can thus be a printed circuit card.

[0138] The two supports 2 and 22 are connected to each other at least by the connection between the module 7 and the component 3.

[0139] In this eighth embodiment thus described, the component 3 is in direct contact with the support 22 on the one hand and the module 7 on the other hand. As for the module 7, it is logically in direct contact with the component 3 on the one hand and in direct contact with the support 2 on the other hand.

[0140] We thus have the following succession of layers over the height of the electronic equipment 1 at the component level (layers of fixing material aside): second support 22 / component 3 / module 7 / first support 2.

[0141] Module 7 can both cool and heat component 3 depending on the direction of the current of its power supply.

[0142] The component 3 is thus sandwiched between the support 22 on the one hand and the module 7 on the other hand.

[0143] Furthermore, it is understood here that the thermal regulation is carried out by the support not carrying the component 3, here the support 2.

[0144] For this purpose, the electronic equipment comprises thermal regulation means 21 linked to the module 7.

[0145] The thermal regulation means are or comprise, for example, a bus (and for example a bus bar) and / or a heat pipe and / or a cover and / or a hood made of thermally conductive material (and for example metal or even graphene) and / or a heat sink and / or any other type of heat sink and / or heating depending on the intended application.

[0146] [Fig.9] illustrates a ninth embodiment which is identical to that of the eighth embodiment except that the electronic equipment 1 has a greater number of elements: the electronic equipment 1 thus comprises two components 3a, 3b (instead of just one), two modules 7, 17 (instead of just one) and three supports 2, 22, 32 (instead of two).

[0147] The electronic equipment 1 is then, for example, a power electronic module (performing the function of a rectifier, an inverter, a dimmer, a chopper, etc.). The supports 2 and 32 are, for example, printed circuit boards. The support 22 is, for example, composed of one or more metal layers stacked on top of each other. The components 3 are, for example, power electronic components.

[0148] More precisely, the support 22 carries the first component 3a on a first of its main faces and the second component 3b on a second of its main faces. The two components 3a, 3b can be offset from each other or, on the contrary, extend one above the other so as to be superimposed (and separated by the support 22). The first component 3a is in direct contact with the support 22 on the one hand and the module 7 on the other hand. As for the module 7, it is logically in direct contact with the first component 3a on the one hand and in direct contact with the support 2 on the other hand.

[0149] The second component 3b is in direct contact with the support 22 on the one hand and the module 17 on the other. As for the module 17, it is logically in direct contact with the second component 3b on the one hand and in direct contact with the third support 32 on the other hand.

[0150] We thus have the following succession of layers over the height of the electronic equipment 1 at the level of the components (layers of fixing material aside): first support 2 / first module 7 / first component 3a / second support 22 / second component 3b / second module 17 / third support 32.

[0151] The first module 7 can both cool and heat the first component 3a depending on the direction of the current of the power supply which concerns it and / or the second module 17 can both cool and heat the second component 3b depending on the direction of the current of the power supply which concerns it.

[0152] The component 3a is thus “sandwiched” between the support 22 on the one hand and the module 7 on the other hand and the component 3b is thus “sandwiched” between the support 22 on the one hand and the module 17 on the other hand.

[0153] Furthermore, it is understood here that the regulation is carried out by the supports not carrying the component, here support 2 and support 32.

[0154] For this purpose, the electronic equipment comprises thermal regulation means 23 linked to module 7 on the one hand and to module 17 on the other hand.

[0155] The thermal regulation means 23 are or comprise, for example, a bus (and for example a bus bar) and / or a heat pipe and / or a cover and / or a hood made of thermally conductive material (and for example metal or even graphene) and / or a heat sink and / or any other type of heat sink and / or heating depending on the intended application.

[0156] When the electronic equipment comprises at least one module associated with at least one component of said equipment, the thermal regulation means can be configured to allow monitoring of the temperature of the component and / or regulation of this temperature. It is understood that this is possible regardless of the configuration of the electronic equipment (the various figures illustrating possible non-limiting configurations in which the electronic equipment comprises at least one component and at least one module).

[0157] According to a first option, the thermal regulation means may comprise at least one sensor making it possible to estimate the temperature of the component as well as at least one calculation member (of the controller or calculator type) communicating with the sensor. Depending on the information transmitted by the sensor, the calculation member may adapt the intensity and / or the direction of the current of the electrical power supply of the module associated with the component. As a replacement or in addition, the sensor may measure the temperature difference between the two faces of the module to adapt the intensity and / or the direction of the current of the electrical power supply of the module so that the component is maintained at a set temperature.

[0158] According to a second option, the face of the module opposite that linked to the component is in contact with a reference thermal interface of the thermal regulation means (either directly or by an intermediate element such as an element of the thermal regulation means and for example a heat sink). The reference thermal interface is at a given reference temperature which imposes said reference temperature on the opposite face. The temperature difference between the opposite face of the module and that in contact with the component generates an electric current. By measuring this electric current, it is then possible to estimate the difference between the two faces of the module. It is thus possible to act at the level of the module (by modifying for example the intensity and / or the direction of the current of the power supply concerning it) to modify the temperature difference between its two faces if desired.

[0159] The reference thermal interface can be brazing, sintering (in copper, in silver), bonding (based on thermally conductive glue), a layer (in graphite, in graphene, in aluminum alloy, in silicon alloy), a silicone-based mattress, etc.

[0160] What has just been said for a module / component pair is of course applicable to another configuration. In particular when the electronic equipment comprises at least two modules each associated with at least one component of said equipment, the thermal regulation means can be configured to allow the monitoring of a temperature difference between the two components and / or a regulation of this temperature difference. It is understood that this is possible whatever the configuration of the electronic equipment ([Fig.3] and [Fig.9] illustrating confi possible non-limiting configurations in which the electronic equipment comprises at least two components and at least two modules).

[0161] According to a first option, the thermal regulation means may comprise at least one sensor making it possible to estimate the temperature of the 1st component and the temperature of the 2nd component as well as at least one calculation member (of the controller or calculator type) communicating with the sensor. Depending on the information transmitted by the sensor, the calculation member may adapt the intensity and / or the direction of the current of the electrical power supply of the module associated with the 1st component and / or the module associated with the 2nd component so that the two components are maintained at a set temperature difference (potentially equal to zero).As a replacement or in addition, the sensor can measure the temperature difference between the two faces of the module associated with the 1st component and / or the module associated with the 2nd component to adapt the intensity and / or the direction of the current of the power supply of the module associated with the 1st component and / or the module associated with the 2nd component so that the two components are maintained at a set temperature difference (potentially equal to zero).

[0162] According to a second option, the face (of at least one of the modules - for example the first module) opposite that linked to the associated component (in the example, the first module) is in contact with a reference thermal interface of the thermal regulation means (either directly or by an intermediate element such as an element of the thermal regulation means and for example a heat sink). The reference thermal interface can be brazing, sintering (in copper, in silver), bonding (based on thermally conductive glue), a layer (in graphite, in graphene, in aluminum alloy, in silicon alloy), a silicone-based mattress, etc.

[0163] The reference thermal interface is at a given reference temperature which imposes said reference temperature on the opposite face. The temperature difference between the opposite face of the first module and that in contact with the first component generates an electric current. By measuring this electric current, it is then possible to estimate the difference between the two faces of the first module and therefore the temperature of the first component. Therefore, by comparing this data with data relating to the temperature of the second component, it is possible to estimate the temperature differential between the two components. It is thus possible: - act at the level of the first module (for example by modifying the intensity and / or the direction of the current of the power supply concerning it), and / or - act at the level of the second module (for example by modifying the intensity and / or the direction of the current of the power supply concerning it),

[0164] so that a difference between the temperature of the first component and the temperature of the second component is maintained at a given set temperature difference (the set temperature difference can be equal to zero).

[0165] It is of course understood that what has been said for a pair of two modules / group of two components is applicable to another configuration and for example to a pair configuration of a group of at least two modules / group of at least two components.

[0166] Of course, the invention is not limited to the embodiments described but encompasses any variant falling within the scope of the invention as defined by the claims.

[0167] In particular, whatever the embodiment considered, the thermally conductive connection may be different from that indicated. For example, said connection may not also be electrically conductive. If one or more additional electrically conductive connections are then necessary to be able to power one or more elements of the electronic equipment, one or more electrical insulation barriers will optionally be arranged in the electronic equipment between the thermally conductive connection(s) and the electrically conductive connection(s) (the barriers being, for example, based on SiO2, AIN, etc.).

[0168] .

[0169] Whatever the embodiment considered, the same module may be associated with several components so that the module is in contact (directly or by an at least thermally conductive connection) with at least two components.

[0170] Whatever the embodiment considered, although here the support is a printed circuit board or a board composed of one or more metal layers, the support may more generally be a substrate.

[0171] Whatever the embodiment considered, when at least two elements (module, component, support, etc.) are said to be “stacked”, this means that they can be in direct contact with each other or be separated by another element (module, component, support, etc.).

[0172] Whatever the embodiment considered, when at least one element (module, component, support, etc.) is said to be “sandwiched” between two other elements (module, component, support, etc.), this means that the three elements considered can be in direct contact with each other or be separated (for at least two of them) by another element (module, component, support, etc.).

[0173] Whatever the embodiment considered, the fixing between an element A (module, component, support, etc.) and an element B (module, component, support, etc.) may be ensured by sintering, by crosslinking, by brazing, etc.

[0174] The conductive tracks and / or the vias and / or any other means allowing to electrically and / or thermally connect an element A (module, component, support, etc.) and a element B (module, component, support, etc.) may themselves be associated with dedicated thermal regulation means. The thermal regulation means are or include, for example, a bus (and for example a bus bar) and / or a heat pipe and / or a cover and / or a hood made of thermally conductive material (and for example metal or even graphene) and / or a heat sink and / or any other type of heat sink and / or heater depending on the intended application.

[0175] Whatever the embodiment considered: - The module may have a width and / or length and / or thickness smaller than that of the associated component. - The module may have a width and / or length substantially similar to that of the associated component. - For example, the main face of the module in contact (directly or by a connection that is at least thermally conductive) with the face of the component has dimensions similar to those of the component but the thickness of the module is less than that of the said component. - For example, the main face of the module in contact (directly or by an at least thermally conductive connection) with the face of the component has dimensions smaller than those of the component and the thickness of the module is also less than that of the said component.

[0176] Whatever the embodiment considered, the component may be arranged entirely outside the support, only partly inside the support or entirely inside the support.

[0177] Whatever the embodiment considered, the module may be arranged entirely outside the support, only partly inside the support or entirely inside the support.

[0178] Whatever the embodiment considered, at least one of the thermal regulation elements may be arranged entirely outside the support, only partly inside the support or entirely inside the support.

[0179] Whatever the embodiment considered, if the equipment comprises several modules, the second module may be arranged entirely outside the support, only partly inside the support or entirely inside the support.

[0180] The different embodiments can be combined with each other. For example, although the third embodiment proposes to associate with the same support a first module / component pair according to the first embodiment and a second module / component pair according to the second embodiment, the same support can be associated with any first module / component pair described and with any second module / component pair described (the first pair and the second couple which may also be identical to each other). Furthermore, the seventh embodiment (in which the module is in contact by an at least thermally conductive connection to the thermal regulation means) can be combined with the various other modes so that for any embodiment considered the module can be in direct contact or in contact by an at least thermally conductive connection with the thermal regulation means.

[0181] Regardless of the embodiment considered, the thermal regulation means may be arranged entirely outside the support, only partly inside the support or entirely inside the support. When the thermal regulation means are arranged outside the support, they may be fixed to one of the faces of the support or be fixed thereto indirectly via the associated module.

[0182] Whatever the embodiment considered, the electronic equipment may be a power supply module, a power module, etc. and / or may be integrated into an electronic system such as a motor, an actuator, an intelligent actuator, an intelligent motor, etc. The electronic system may in turn be optionally integrated into an aircraft, for example an electric aircraft.

[0183] Whatever the embodiment considered, the component may be of any type, such as for example a chip, a CMS element (for “surface mounted component” or SMD for “surface mounted device” in English), a package (CMS package or not), a Quad Fiat No-leads package (QFN) or a Dual-Flat No-leads package (DFN), a matrix of pellets (or LGA for the English Land Grid Array), a sensor (such as a gyrometer), a memory, a computing device, an amplification component, etc.

[0184] Whatever the embodiment considered, the module may be a semiconductor module, i.e. include a pn junction, or may be any other module making it possible to develop the desired thermoelectric effect.

[0185] Whatever the embodiment considered, although here the module is always used by being electrically powered to regulate the temperature of the associated component, the module may also be powered to generate an electric current under the effect of a thermal gradient which will be applied to it via the component (for example so that the electric current generated by the module is reused for the electrical power supply of another component and / or another module or is used to regulate this thermal gradient or is used to regulate the thermal gradient of another module, etc.). In this case, the thermal regulation means which are potentially associated with it will also play the role of electrical conductor and / or additional electrical conduction means will be used.

[0186] Whatever the embodiment considered, one or more elements may be interposed between each thermoelectric module / component pair considered.

[0187] Whatever the embodiment considered, the electronic equipment can be shaped to allow the temperature of a component and / or a module to be regulated.

[0188] It is understood in particular that depending on the direction of the current of the power supply of the module, the component can be heated or cooled, and that by increasing or lowering the intensity of the current, the component can be heated more or less or cooled more or less. Alternatively, it is also possible to act not on the current but on the temperature of the face of the module opposite that connected to the component that one wishes to thermally regulate.

[0189] Whatever the embodiment considered, the electronic equipment can be shaped to allow the temperature regulation of a group of at least two components and / or a group of at least two modules and / or a group of at least one component and one module.

[0190] It is understood in particular that depending on the direction of the current of the electrical supply of at least one of the modules associated with said group, it is possible to heat or, on the contrary, cool at least one of the elements of said group, and that by increasing or lowering the intensity of the current, it is possible to heat or cool said element more or less so that the temperatures between the different elements within the group are maintained at the same set temperature difference (potentially equal to zero). Alternatively, it is also possible to act not on the current of at least one of the modules associated with the group but to act on the temperature of the face of the module opposite that connected to the element that it is desired to thermally regulate.

[0191] Whatever the embodiment envisaged, the electrical power supply of an element A (module, component, etc.) may be provided by an electrically conductive track, by a via (by nature a via is electrically conductive), by another element B (module, component, etc.) but also by one of the thermal regulation means of the electronic equipment if said means is also electrically conductive. For example, whatever the embodiment envisaged, at least one metal drain may be used to electrically power the element A while also being used to thermally regulate said element A.

[0192] Whatever the embodiment envisaged, the electrical supply of an element A (module, component, etc.) may also make it possible to supply an element B (module, component, etc.) at the same time.

[0193] Whatever the embodiment envisaged, the thermal regulation means of an element A (module, component, etc.) may also make it possible to regulate an element B (module, component, etc.) at the same time.

Claims

Claims

1. Electronic equipment comprising at least one support (2) and at least one component (3), the equipment being characterized in that it comprises at least one thermoelectric module (7) which is associated with the component and which is shaped into a block comprising two main heat exchange faces, the module being integrated at least in part in the support so that a first of its two main faces is in contact with at least one of the faces of the component, either directly or via at least one connection (13) made of at least thermally conductive material. in which the module is a first module, the equipment comprising a second module associated with another face of the component, the first module, the component and the second module being superimposed so as to form a stack, or in which the support is a first support, the first support carrying the module and the equipment comprising a second support (22) carrying the component.

2. Equipment according to claim 1, in which the module (7) is fully integrated into the support (2).

3. Equipment according to claim 1 or claim 2, comprising thermal regulation means associated with the module (2).

4. Equipment according to claim 3, in which the thermal regulation means are arranged at least partly inside the support (2).

5. Equipment according to claim 3 or claim 4, in which the module is in direct contact with at least one element of the thermal regulation means.

6. Equipment according to one of claims 3 to 5, in which the thermal regulation means comprise a drain (10) made of thermally conductive material.

7. Equipment according to one of claims 3 to 6, in which the thermal regulation means comprise a thermal reference interface, the module (7) being in contact with said thermal reference interface, either directly or via a connection made of thermally conductive material.

8. Electronic equipment according to one of claims 1 to 7 pre- preceding, in which the component is a first component (3a), the equipment being shaped to allow temperature regulation of a group comprising the first component and at least one second component (3b).

9. Electronic equipment according to claim 8, wherein the module is a first module (7) associated with the first component, the equipment comprising a second module (17) associated with the second component.

10. Electronic equipment according to claim 8 or claim 9, wherein the support is a first support (2), at least one of the components being carried by a second support (22) of the electronic equipment.

11. Electronic equipment according to claim 9 and according to claim 10, comprising a third support (32) carrying the second module.

12. Electronic equipment according to one of claims 9 to 11, in which the first module (7) implements the Peltier effect and the second module (17) the Seebeck effect.

13. Equipment according to one of the preceding claims, in which the equipment is a power module.

14. Electronic system comprising equipment according to one of the preceding claims 1 to 13, the electronic system being an aircraft electronic system.

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