AUTOMOTIVE LIGHTING MODULE WITH OPTIMIZED COOLING EFFICIENCY

Abstract

AUTOMOBILE LIGHTING MODULE WITH OPTIMIZED COOLING EFFICIENCY The invention relates to a motor vehicle lighting device (1) comprising a light source (2) having a heat center (60) when the light source is switched on so as to emit a light beam, a printed circuit board (3) on which the light source is mounted and comprising at least: a resin layer (7), a layer of electrically conductive material (300) placed on the resin layer, said layer of electrically conductive material comprising a mounting region which receives the light source; a plurality of holes (31) made in the resin layer (7) and located below the mounting region, said plurality of holes (31) being arranged in at least one layer of holes opening onto the layer of electrically conductive material (300) so as to conduct the heat emitted by the light source (2) away from it.According to the invention, the density of the holes (31) in said plurality of holes decreases as the holes move away from the heat center (60) of the light source. Figure to be published with the abstract: Figure 6.

Claims

characterized in that said plurality of holes (31) is filled with thermally conductive material.

6. Luminous device (1) according to one of the preceding claims, characterized in that the printed circuit (3) is made of FR4 resin.

7. A light module (1) comprising a light device according to one of the preceding claims, comprising a heat sink on which the printed circuit board (3) is mounted, wherein: - the layer of electrically conductive material (300) laid on the resin layer (7) and comprising a mounting region which receives the light source (2) forms a first outer layer of the printed circuit board (3) arranged on a first side of the printed circuit board; - the printed circuit board (3) further comprises a second outer layer (300) arranged on a second side of the printed circuit board (3) opposite the first side and connected to the heat sink (4);characterized in that a hybrid adhesion layer is interposed between the printed circuit board (3) and the heat sink (4), the hybrid layer partly comprising a thermal grease (14) located below the mounting region and an adhesive (12) surrounding the thermal grease (14) and allowing the printed circuit board (3) to be bonded to the heat sink (4).;

8. Light module according to the preceding claim, characterized in that the heat sink comprises a metal block (41) arranged below the mounting region and in contact with the thermal grease.

9. Light module according to one of claims 7 or 8 characterized in that the light source (2) is a high-resolution light source.

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