Method of producing a device comprising interconnections

Abstract

Title: Method for producing a device comprising interconnections The invention relates to a method for producing a device comprising a support (10) having a first face (100) and at least one second face (200) not parallel to the first face (100), and at least one metal connection (21) connecting said first and second faces (100, 200), said method successively comprising: A production of the support (10) by additive manufacturing, by providing in the support (10) at least one hole (11) opening onto the first and second faces (100, 200), A filling of the at least one hole (11) with a metal paste, said filling comprising a first filling by injection of the metal paste into said at least one hole (11), An annealing of the metal paste so as to form the metal connection (21). The invention also relates to a device manufactured by such a method. Figure for the abstract: Fig. 2

Description

Title of the invention: Method for producing a device comprising interconnections Technical field

[0001] The present invention relates, in general, to a method of forming metallic interconnections within a support, more particularly complex metallic interconnections within a ceramic-based support. STATE OF THE ART

[0002] Ceramic metallization processes allow the creation of metal tracks and metal interconnections on and in ceramic supports.

[0003] The simplest way to form this type of metal interconnections is to drill a hole through the ceramic, for example by laser, and then to perform a metal plating on the walls of the hole, for example by chemical metallization. Another way to form the metal interconnections is to provide a hole directly during the manufacture of the ceramic support, for example during manufacture by co-sintering the ceramic and the metal interconnections. This process nevertheless remains more complex to implement.

[0004] The document "Gerges T. et al., Rapid 3D-Plastronics prototyping by selective metallization of 3D printed parts, Additive Manufacturing 73, 103673 (2023)" discloses a method based on 3D printing of supports, to form metal tracks and vias more quickly and economically. However, the metallization of the vias remains difficult to achieve using this method, particularly for vias with large form factors. Electrical continuity of the vias is not systematically obtained. This method is not completely reliable for forming metal interconnections in complex supports.

[0005] There is therefore a need for a method of producing a support, in particular a ceramic support, comprising metallic interconnections, which is reliable and less complex to implement.

[0006] An objective of the present invention is to meet this need and to at least partially overcome the drawbacks mentioned above.

[0007] An objective of the present invention is to propose a method for producing a device comprising a support and at least one metal connection connecting two faces of the support, which is reliable and / or which is easy to implement.

[0008] Other objects, features and advantages of the present invention will become apparent from a consideration of the following description and accompanying drawings. It is understood that other advantages may be incorporated. SUMMARY

[0009] To achieve this objective, according to one embodiment, a method is provided for producing a device comprising a support having a first face and at least one second face preferably not parallel to the first face, and at least one metal connection connecting said first and second faces of the support, said method successively comprising: - Production of the support by additive manufacturing, by providing in the support at least one hole opening onto the first and second faces of the support, said at least one hole being intended to accommodate the at least one metal connection, - A filling of the at least one hole with a metal paste, configured to form a portion of continuous metal paste between an inlet orifice and an outlet orifice of the at least one hole, said filling comprising a first filling by injection of the metal paste into said at least one hole, - Annealing of the metal paste so as to form at least one metal connection.

[0010] The support forms a mold into which the metal paste is injected. It is not necessary to resort to machining of the support to define the patterns of metal interconnections and metal tracks. The support directly includes these patterns in the form of holes and hollow reliefs, after additive manufacturing.

[0011] The injection advantageously makes it possible to push the metal paste from an inlet orifice of the hole at the first face to an outlet orifice of the hole at the second face. The metal paste is thus better distributed along the hole. The method makes it possible to reliably obtain metal interconnections having good material continuity.

[0012] The method according to the invention advantageously makes it possible to obtain a support, typically ceramic-based, comprising metallic interconnections passing through the support from one face of the support to another.

[0013] According to one aspect, the invention also relates to a device comprising a support, preferably ceramic-based, and at least one metal connection or interconnection passing through said support and connecting two non-parallel faces of the support, forming an elbow. The metal connection(s) may connect several faces of the support, for example three faces of the support, having complex elbow shapes, for example a T-shape. Such a device may advantageously be obtained by the method according to the invention.

[0014] Such a device can be advantageously used in the field of microelectronics or power electronics, for mounting and assembling electronic chips on the support. The invention also relates to an electronic system comprising such a device and at least one electronic chip connected to the metal connections of the device. The length of the through-metal connections according to the invention is minimized. The through-metal connections thus advantageously make it possible to limit the electrical oscillations or fluctuations of a signal, for example radiofrequency, emitted or received by a power electronic component. Different faces of the support can be connected via the metal connections running within the device according to the invention. This makes it possible to enrich the connectivity of the device. BRIEF DESCRIPTION OF THE FIGURES

[0015] The aims, objects, as well as the characteristics and advantages of the invention will emerge more clearly from the detailed description of embodiments thereof which are illustrated by the following accompanying drawings in which:

[0016] [Fig.l] [Fig.2] Figures 1 and 2 schematically illustrate in perspective steps of manufacturing a device comprising metal connections connecting two non-parallel faces of the support, and through metal connections, according to an embodiment of the present invention.

[0017] [Fig.3] [Fig.3] schematically illustrates the device according to the section plane AA' illustrated in [Fig.2], according to an embodiment of the present invention.

[0018] [Fig.4] [Fig.4] illustrates an annealing diagram for forming the connections metallic parts of the device, according to an embodiment of the present invention.

[0019] [Fig.5] [Fig.5] schematically illustrates a support comprising holes having a T-shape, according to an embodiment of the present invention.

[0020] [Fig.6] [Fig.6] schematically illustrates in perspective a device comprising the bracket illustrated in [Fig.5], in which metal connections are formed at the T-holes, according to an embodiment of the present invention.

[0021] The drawings are given as examples and are not limiting of the invention. They constitute schematic representations of principle intended to facilitate the understanding of the invention and are not necessarily on the scale of practical applications. In particular, on the schematic diagrams, the thicknesses of the different layers and portions, and the dimensions of the patterns and holes are not necessarily representative of reality. DETAILED DESCRIPTION

[0022] Before commencing a detailed review of embodiments of the invention, optional features which may optionally be used in combination or alternatively are set out below:

[0023] According to one example, the embodiment of the support is configured so that the at least one hole has a bend within the support.

[0024] According to one example, the at least one hole has a first section on a first side of the elbow, and a second section on a second side of the elbow, the first section being larger than the second section. According to one example, the inlet orifice for filling is chosen on the first side of the elbow. This makes it possible to optimize the injection filling. The continuity of material of the injected material is improved.

[0025] According to one example, the production of the support is configured so that the at least one hole has a diameter strictly less than or equal to 1 mm, and / or a longitudinal dimension greater than 15 mm.

[0026] According to one example, the support has a third face substantially parallel to the first face and substantially orthogonal to the second face, and the production of the support is configured so that the at least one hole has a T shape opening onto the first, second and third faces of the support. Such a configuration makes it possible to enhance the connection possibilities of the device. Such a configuration is simpler to produce by additive manufacturing, and less expensive to produce than by drilling or etching the support, for example.

[0027] According to one example, the embodiment of the support is configured so as to provide at least one second hole opening onto the first and third faces of the support. According to this example, two types of holes coexist within the support: a first type of hole connecting two non-parallel faces of the support, and a second type of hole, also called "through", connecting two parallel faces of the support. This makes it possible to enhance the connection possibilities of the device.

[0028] According to one example, the first injection filling of the at least one hole is configured to also fill said at least one second hole.

[0029] According to an example, the method further comprises a second filling by screen printing of the at least one second hole, with a second metal paste. The filling of the different types of holes can be done by different techniques, or in a hybrid manner. The filling can comprise a first filling by injection of the first type of hole and a second filling by screen printing of the second type of hole. Alternatively or in combination, the filling can comprise a first filling by injection of the first type of hole and a second filling by injection of the second type of hole. The first and second fillings can be carried out simultaneously or successively. The first and second types of holes can be pre-filled during the first filling by injection and then completely filled during the second filling by screen printing. The second filling can complement the first filling for a given type of hole. The first type of hole, joining two non-parallel faces of the support, is systematically filled at least partially by injection.

[0030] According to one example, the second screen printing filling is carried out after the first injection filling of the at least one hole. The second screen printing filling optionally makes it possible to complete the first injection filling.

[0031] According to one example, the second filling of the at least one second hole is done while scraping the first and / or second faces of the support, simultaneously. A scraper is typically used to spread the metal paste and to scrape and equalize the level of metal paste in the at least one second hole. A front of metal paste moves in front of the scraper and is partially deposited in the at least one second hole, and possibly in the at least one partially filled hole by injection. The metal paste is removed from the face of the support at the rear of the scraper. The metal paste remains only in the holes of the support.

[0032] According to one example, the metal paste used for injection and the second metal paste used for screen printing are identical, and preferably correspond to the same silver-based metal paste. Such metal pastes are commercially available, in a standard manner. This makes it possible to reduce the cost of the process. The viscosity of the metal paste can be chosen according to the dimensions of the holes, their form factor and / or the flatness of the faces of the support.

[0033] According to one example, the method further comprises at least one scraping of the first face of the support and / or the second face of the support, so as to equalize a level of metal paste in the at least one hole with said first and / or second faces of the support bordering said at least one hole. This makes it possible to obtain connections flush with the face(s) of the support. The compactness of the device is improved. The integration of the device is improved.

[0034] According to one example, the method further comprises at least one polishing, for example a chemical-mechanical polishing, of the first face of the support and / or the second face of the support, after annealing the metal paste. This makes it possible to improve the flatness of the face(s) of the support and / or the leveling of the metal paste with the face(s) of the support in proximity. This makes it possible to improve the surface condition of the faces of the support and / or the exposed surfaces of the metal paste, for example with a view to subsequent soldering of an electronic chip on the metal connections.

[0035] According to one example, the support is made from ceramic.

[0036] According to one example, the production of the ceramic-based support is completely carried out before filling at least one hole, without any subsequent step to filling. The additive manufacturing of the ceramic support does not require any other manufacturing steps after the hole filling has started. There is no need to manage support formation steps during filling or after filling the hole with the metal paste, unlike processes involving co-manufacturing or co-sintering steps, for example for the manufacture of ceramic supports of the LTCC (acronym for "low-temperature-cofired ceramic") type. The process according to the invention is easier to implement.

[0037] According to one example, the filling of the at least one hole and / or the at least one second hole comprises a first filling step by injection then a second filling step by screen printing comprising scraping of the first and / or second faces of the support. The filling is completed during the second step. The completion is typically done during the scraping, by pushing the front of metal paste into the holes partially filled by injection. This makes it possible to improve the filling of the holes, and to form flush metal connections.

[0038] According to one example, at least one face of the support has a curved surface and the scraping of said face of the support is configured to follow this curved surface. The face may have a continuous curvature, a linear slope or a break in slope. The scraping may be advantageously adapted to different support profiles, for example to produce three-dimensional devices.

[0039] According to one example, the metal connections are configured to be connected to one or more electronic chips. The electronic chips are typically surface-mounted on the support.

[0040] According to one example, the device comprises a support having a first face and at least one second face not parallel to the first face, and at least one metal connection connecting said first and second faces of the support. Advantageously, the at least one metal connection has a bend within the support. This makes it possible to connect different non-parallel faces of the support in a versatile manner.

[0041] According to one example, the support has a third face substantially parallel to the first face and substantially orthogonal to the second face, and the at least one metal connection has a T shape opening onto the first, second and third faces of the support.

[0042] Unless incompatibility exists, it is understood that all of the above optional features may be combined to form an embodiment that is not necessarily illustrated or described. Such an embodiment is obviously not excluded from the invention. The characteristics and advantages of the method according to the invention may apply, mutatis mutandis, to the characteristics and advantages of the device or system according to the invention, and vice versa.

[0043] It is specified that, in the context of the present invention, the terms "on", "overcomes", "covers", "underlying", "facing" and their equivalents do not necessarily mean "in contact with". Thus, for example, the deposition or formation of a first layer on a second layer does not necessarily mean that the two layers are directly in contact with each other, but means that the first layer at least partially covers the second layer by being either directly in contact with it, or by being separated from it by at least one other layer or at least one other element.

[0044] A layer may also be composed of several sub-layers of the same material or of different materials.

[0045] By a substrate, a stack, a layer, an "A-based" element of a material A, a substrate, a stack, a layer, an element comprising this material A only or this material A and possibly other materials, for example alloy elements and / or doping elements.

[0046] A preferably orthonormal reference, comprising the x, y, z axes is shown in the attached figures.

[0047] In the present patent application, the thickness of a layer is taken in a direction normal to the main extension plane of the layer. Thus, a layer typically has a thickness along z. The terms "on", "overlies", "under", "underlying", "intercalated" refer to positions taken along the z direction.

[0048] The terms "vertical", "vertically" refer to a direction along z. The terms "horizontal", "horizontally", "lateral", "laterally" refer to a direction in the xy plane. Unless explicitly stated, thickness, height and depth are measured along z.

[0049] An element located "perpendicular" or "straight" to another element means that these two elements are both located on the same line perpendicular to a plane in which a lower or upper face of a substrate mainly extends, that is to say on the same line oriented vertically in the figures.

[0050] A longitudinal dimension of a hole is taken along a direction normal to the transverse section of the hole. When a hole has several straight or curved portions, its longitudinal dimension corresponds to the sum of the longitudinal dimensions of each portion.

[0051] Additive manufacturing is also referred to as 3D printing in the following, as a synonym.

[0052] In the context of the present invention, the metal paste has a viscosity compatible with the implementation of a standard injection and / or screen printing process. As such, the metal paste can also be considered as a metallic ink, for example screen printing ink. In the following, "metallic ink" and "metallic paste" are used interchangeably, as synonyms.

[0053] In the context of the present invention, the term "inject" means "pushing with a pressure greater than atmospheric pressure" a metallic paste or ink into the holes formed by 3D printing. The injection is typically done by means of a nozzle or an injector from an inlet orifice of the hole to an outlet orifice of the hole. The injection filling of the holes is configured to obtain a continuity of injected material. The continuous portion of injected material extends between the inlet and outlet orifices, preferably from the inlet orifice of the hole to the outlet orifice of the hole.

[0054] In the context of the present invention, the term "equalize" means "bring to the same level". The level of metallic paste or ink in the at least one hole thus typically has, after equalization, substantially the same level as the face of the support bordering said at least one hole. The free surface of the metallic ink then extends in extension of the face of the surrounding support. The equalization of the levels is understood to be within manufacturing tolerances. Thus, depending on the surface tension of the metallic ink, the free surface of the metallic ink may have a slight curvature projecting or hollowing from the face of the support. This free surface may also change during subsequent annealing. Those skilled in the art understand that scraping typically makes it possible to equalize the levels during the passage of the scraper, without prejudging the actual level of the ink after scraping.

[0055] Similarly, the term "flush" is understood to mean within manufacturing tolerances, and encompasses slight variations in levels between the face of the support and the surface of the metal connection formed after annealing.

[0056] The terms "substantially", "approximately", "of the order of" mean to within 10%, and preferably to within 5%. Furthermore, the terms "between ... and ..." and equivalents mean that the limits are included, unless otherwise stated.

[0057] [Fig.l] illustrates a ceramic support manufactured by 3D printing according to one embodiment of the method. This support 10 has a first face 100, a second face 200 substantially orthogonal to the first face 100, and a third face 300 substantially parallel to the first face 100. The support 10 comprises first holes 11 connecting the first face 100 and the second face 200, and second holes 12 connecting the first face 100 and the third face 300. The first holes 11 thus connect two non-parallel faces 100, 200 of the support 10 and form a first type of holes. The second holes 12 thus connect two parallel faces 100, 300 of the support 10 and form a second type of holes. The first holes 11 have a first orifice 111 on the first face 100, typically an inlet orifice for injection, and a second orifice 112 on the second face 200, typically an outlet orifice for injection. Each first hole 11 typically has, starting from the inlet orifice, a first straight portion, an elbow, a second straight portion opening onto the outlet orifice. The elbow is located within the support 10. The support may be ceramic-based, for example based on alumina or aluminum nitride. 3D printing advantageously makes it possible to directly produce the holes 11, 12 in the support 10, typically without removing material. First holes 11 of complex shape, comprising for example several elbows and / or several straight portions of different orientations, may in particular be advantageously produced.

[0058] The holes 12 may have transverse dimensions, taken here in the xy plane, of the order of several millimeters, or even a few tens of millimeters. The holes 11 may have a diameter of a few millimeters or less, for example a diameter less than 1 mm. The diameter or cross-section of the hole 11 is not necessarily constant along the hole 11. The inlet orifice 111 may typically have a cross-section, taken here in the xy plane, greater than the cross-section of the outlet orifice 112, taken here in the yz plane. This makes it possible to improve the injection of material into the hole 11. The support 10 manufactured by 3D printing advantageously forms a mold into which a metal paste is injected to form complex metal patterns or connections within the support 10.

[0059] [Fig.2] illustrates the device obtained after filling the holes 11, 12 of the support 10 with a metal paste. The metal paste preferably completely fills each hole 11, 12. It is flush with the faces 100, 200, 300 onto which the holes 11, 12 open. The holes 11 are at least partially filled by injecting the metal paste from the inlet orifices 111, during a first filling step. This makes it possible to obtain a continuous portion of metal paste between the inlet orifice 111 and the outlet orifice 112. The holes 12 may also be filled, at least partially during the first filling step, by injecting the metal paste. Alternatively or in addition, the holes 12 may be filled by screen printing during the first filling step, using a scraper.If necessary, when the holes 11 or 12 are not completely filled, a second filling step can be carried out in addition to the first filling step by injection and / or screen printing. The second filling step is typically carried out with the metallic paste or a metallic ink spread with a scraper, by screen printing. The ink or metallic paste is accumulated at the beveled end of the scraper, and pushed into the empty spaces of the holes 11, 12 as the scraper moves, for example along x. The metallic ink front pours into the empty spaces as the scraper moves, for example along x on the first face 100 of the support. The end of the scraper is then . typically in contact with the face 100. This prevents the metallic ink from remaining on the face 100 of the support. The scraper allows both to complete the filling of the holes 11, 12 and to remove the excess metallic ink. After the scraper has passed, the surface of the metallic paste filling the holes 11, 12 is substantially at the same level as the face concerned. The filling of the holes 11, 12 during the first filling step and / or during the second filling step can be done simultaneously.

[0060] The metallic paste has fluidic properties, typically a viscosity and a surface tension, compatible with dispensing by injection, via a nozzle or an injector. The metallic paste preferably also has fluidic properties compatible with spreading with a scraper. It also has good adhesion power with the support 10, typically with ceramics. It may comprise metallic nanoparticles, for example silver nanoparticles. The metallic ink may be chosen from standard metallic screen printing inks, for example a silver-based metallic ink from the Dycotec references DM-SIP-14001S or DM-SIP-14033. Other metallic ink formulations are conceivable, depending on the intended applications.

[0061] After filling the holes 11, 12, and preferably after equalizing the levels of metallic ink with the faces 100, 200, 300 of the support, a densification heat treatment is typically carried out. This heat treatment makes it possible to evaporate the solvents of the metallic ink and / or sinter the metallic nanoparticles to form the metallic connections 21, 22 ([Fig.2]). The metallic connections 22 are through, between the faces 100 and 300. The metallic connections 21 typically have, starting from the face 100 (inlet orifice), a first straight portion, an elbow, a second straight portion opening onto the face 200 (outlet orifice).

[0062] [Fig. 3] corresponds to a transverse section of the device along a median xy plane, referenced AA' in [Fig. 2]. The second straight portion of the metal connections 21 is visible on this section along AA'. A part of the bend of the metal connections 21 is also visible on this section along AA'. The diameter at the bend is here greater than the diameter of the second straight portion. In the continuity of the bend, the diameter of the first straight portion (not illustrated) is here greater than the diameter of the second straight portion.

[0063] [Fig.4] illustrates an example of heat treatment recommended for Dycotec metallic ink references. This heat treatment typically corresponds to a stabilized annealing at approximately 850°C for ten minutes, with controlled temperature rise and fall.

[0064] After annealing, an optional polishing step can be carried out on the faces 100 and / or 200 and / or 300 of the support, for example a chemical-mechanical polishing or a polishing with a diamond disc. This polishing can advantageously flatten the face(s) 100, 200, 300 of the support when these are not perfectly flat. Polishing can also make it possible to remove any silver paste residue outside the defined holes and / or to level the metal connections 21, 22. A perfectly flat surface, with well-defined flush metal connections, is thus advantageously obtained. Other post-annealing steps can also be carried out, for example to prepare the surface of the metal connections for subsequent brazing of components onto said metal connections. Chemical etching or plasma can, for example, be carried out.

[0065] Figures 5 and 6 illustrate another embodiment based on another configuration of support 10 manufactured by 3D printing.

[0066] [Fig.5] illustrates a support 10 comprising holes 11 of the first type and holes 12 of the second type, as previously. The holes 11 here have a T shape and connect the first, second and third faces 100, 200, 300. The holes 11 have a first orifice 111 at the first face 100, a second orifice 112 at the second face 200 and a third orifice 113 at the third face 300. For injecting the metal paste into the holes 11, at least one inlet orifice will be chosen from these three orifices 111, 112, 113, and preferably at least one outlet orifice from these three orifices 111, 112, 113. A second inlet orifice or a second outlet orifice may be chosen from these three orifices 111, 112, 113. One orifice from these three orifices 111, 112, 113 may optionally be plugged when injecting metal paste.The holes 12 connect the parallel faces 100, 300 of the support 10, as previously. Reinforcements 123 are provided here within the holes 12. These reinforcements 123 improve the mechanical strength of the support 10. These reinforcements 123 also stabilize the metal paste spread in the holes 12. The retention of the metal paste in the holes 12 is thus improved.

[0067] [Fig. 6] illustrates the device obtained after filling the holes 11, 12 of the support 10 with a metal paste. The filling is carried out as previously, at least partially by injection into the holes 11 of the first type, and by injection and / or screen printing into the holes 12 of the second type. The metal paste preferably completely fills each hole 11, 12. It is flush with the faces 100, 200, 300 onto which the holes 11, 12 open. The through-metal connections 22 are typically dedicated to the electrical supply of an electronic chip, and may correspond to a positive electrode V+, a negative electrode V- and a phase. The T-shaped metal connections 21 are typically dedicated to the control of the gate(s) of an electronic chip. The metal connections 21, 22 running within the ceramic support 10 advantageously have a reduced length, for example compared to metal tracks running on the support for example. This makes it possible to limit parasitic elements and thus reduce oscillations during switching.

[0068] It is clear from the above that the method according to the invention advantageously makes it possible to produce a device comprising a support and metal connections of complex shapes within said support. Such a device is particularly advantageous for limiting oscillations of electrical signals or partial discharges in power electronics modules. Such a device also requires fewer materials for manufacturing and less energy for operation. The energy and environmental impact of such a device is therefore advantageously reduced.

[0069] Other applications are conceivable, particularly in the field of metallization of ceramics. Watchmaking or jewelry systems can advantageously take advantage of such a device. The invention is not limited to the embodiments previously described.

Claims

Claims

1. Method for producing a device comprising a support (10) having a first face (100) and at least one second face (200) not parallel to the first face (100), and at least one metal connection (21) connecting said first and second faces (100, 200) of the support (10), said method successively comprising: • A production of the support (10) by additive manufacturing, by providing in the support (10) at least one hole (11) opening onto the first and second faces (100, 200) of the support (10), said at least one hole (11) being intended to receive the at least one metal connection (21), • A filling of the at least one hole (11) with a metal paste, configured to form a portion of continuous metal paste between an inlet orifice (111) and an outlet orifice (112) of the at least one hole (11), said filling comprising a first filling by injection of the metallic paste in said at least one hole (H),• Annealing the metal paste so as to form at least one metal connection (21).,

2. Method according to the preceding claim in which the production of the support (10) is configured so that the at least one hole (11) has a bend within the support (10).

3. Method according to the preceding claim in which the at least one hole (11) has a first section on a first side of the elbow, and a second section on a second side of the elbow, the first section being larger than the second section, and in which the inlet orifice (111) for filling is chosen on the first side of the elbow.

4. Method according to any one of the preceding claims in which the support (10) has a third face (300) substantially parallel to the first face (100) and substantially orthogonal to the second face (200), and the production of the support (10) is configured so that the at least one hole (11) has a T shape opening onto the first, second and third faces (100, 200, 300) of the support (10).

5. Method according to the preceding claim in which the production of the support (10) is configured so as to provide at least one second hole (12) opening onto the first and third faces (100, 300) of the support (10).

6. Method according to the preceding claim in which the first filling by injection of at least one hole (11) is configured to also fill said at least one second hole (12).

7. Method according to claim 5 further comprising a second filling by screen printing of the at least one second hole (12), with a second metallic paste.

8. Method according to the preceding claim in which the second filling by screen printing is carried out after the first filling by injection of the at least one hole (11).

9. Method according to any one of the two preceding claims in which the metallic paste used for injection and the second metallic paste used for screen printing are identical, and preferably correspond to the same silver-based metallic paste.

10. Method according to any one of the preceding claims in which the production of the support (10) is configured so that the at least one hole (11) has a diameter strictly less than or equal to 1 mm, and a longitudinal dimension greater than 15 mm.

11. A method according to any one of the preceding claims further comprising at least one scraping of the first face (100) of the support (10) and / or the second face (200) of the support (10), so as to equalize a level of metallic paste in the at least one hole (11) with said first and / or second faces (100, 200) of the support (10) bordering said at least one hole (11).

12. Method according to any one of the preceding claims further comprising at least one polishing of the first face (100) of the support (10) and / or of the second face (200) of the support (10), after annealing of the metal paste.

13. Method according to any one of the preceding claims in which the support (10) is made from ceramic.

14. A method according to the preceding claim, wherein the production of the ceramic-based support (10) is completely carried out before filling the at least one hole (11), without any subsequent step to the filling.

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