Electronic component manufacturing process

Abstract

Method for manufacturing electronic components Method for manufacturing electronic components (100) with wettable sides from a substrate (301) a first face of which is covered by connection pads (107) and in which chips (103) are formed, the method comprising: - a step during which a metal grid (116), comprising connection pads (117) connected to each other by bars (118), is soldered onto the connection pads (107), - a step during which a layer of insulating resin (121) is formed on the substrate (301), the layer of insulating resin (121) surrounding the connection pads (117), - a step during which the chips (103) are separated from each other, the lateral part (117B) of the connection pads (117) and a part of the layer of insulating resin (121) forming the sides (119) of the components (100). Figure for abstract: Fig. 2E

Claims

the following steps: - Carry out the first step, - Form trenches (311) in the substrate (301), - Carry out the second step, - Remove the part of the resin layer (121) positioned both between the connection pads (117) and above the trenches (311), - Carry out the third step by thinning the second main face of the substrate (301) down to the trenches (311), - Deposit an additional resin layer (122) on the second face (303) of the substrate (301), - Cut the resin in the trenches (311).

8. Method according to any one of claims 1 to 5, comprising the following steps: - Carrying out the first step, - Fixing the assembly obtained in the first step on a support (400) comprising an adhesive layer (401) by gluing the metal grid (116) on the adhesive layer (401), - Carrying out the third step, - Carrying out the second step, - Cutting the resin in the trenches (311).

9. Method according to the preceding claim, in which, between the first step and the third step, the substrate (301) is thinned from a second face (303), and in which an additional resin layer (122) is deposited on the second face (303) of the substrate (301).

10. Electronic component (100) with wettable sides comprising a chip (103) protected by a package (109) comprising a first main face (115), sides (119) and a second main face (111), connection pads (117) being soldered on connection pads (117) of the chip (103) and a layer of insulating resin (121) partially surrounding the connection pads (117), a portion (117B) of the connection pads (117) and a portion of the layer of insulating resin (121) forming the sides (119) of the package (109).

11. Electronic component (100) according to claim 10, in which the connection pads (117) are soldered onto the connection pads (107) by means of a solder layer (105) made of Sn or a tin alloy, such as SnAg or SnAgCu, and in which the connection pads (107) are made of copper, optionally covered with a metal layer. [Fig. IA] FIG. 1A [Fig. IB] FIG. 1B [Fig. IC] FIG. 1C [Fig. 2A] 107 -305 [Fig. 2B] 116 [Fig. 2C] 117 117A 117B1 301 FIG. 2C 303 [Fig. 2D] 108 121 117A 117B FIG. 2D 107,301 [Fig. 3A] 305 311 303 FIG. 3A 117 FIG. 3B FIG. 3C [Fig. 3D] [Fig. 3E] [Fig. 3F] [Fig. 3G] FIG. 3G [Fig. 4A] FIG. 4A [Fig. 4B] FIG. 4B

Images