Electronic chip manufacturing process
FR3158589A1Pending Publication Date: 2025-07-25STMICROELECTRONICS INT NV
Patent Information
- Application Number
- FR2024000541
- Authority / Receiving Office
- FR · FR
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2024-01-19
- Publication Date
- 2025-07-25
Abstract
Method for manufacturing electronic chips The present description relates to a method for manufacturing an electronic chip (100) with passivated sides from a semiconductor substrate (110) of which a first face is covered by connection pads (107) and in which chips are formed, the method comprising the following steps: - depositing a protective layer on the first face of the substrate (110), - forming trenches or cavities between the chips, - depositing an insulating layer (121) in the trenches or in the cavities by deposition of atomic layers, - removing the protective layer (130). Figure for abstract: Fig. 1F
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Citation Information
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