Electronic component comprising connection pillars

Abstract

Electronic component comprising connection pillars The present description relates to an electronic component (50), such as an electronic chip, comprising a semiconductor substrate (12) having first and second opposite faces (14, 16) and electrically conductive pillars (60), intended to be connected to an element external to the electronic component, an insulating layer (24) covering the second face (16) of the substrate (12), a first part of the electrically conductive pillars (60) projecting from the insulating layer (24) and a second part of the electrically conductive pillars (60) passing through the insulating layer and extending into the semiconductor substrate (12) to a depth less than the thickness of the semiconductor substrate (12). Figure for abstract: Fig. 2

Claims

8. An electronic component according to any preceding claim, wherein the second portion of the electrically conductive pillars (60) has a height of at least 5 pm.

9. A method of manufacturing an electronic component (50), such as an electronic chip, comprising a semiconductor substrate (12) having first and second opposite faces (14, 16) and electrically conductive pillars (60), intended to be connected to an element external to the electronic component, the method comprising the following steps: - forming an electrically insulating layer (24) on the second face (16) of the semiconductor substrate (12), - forming openings (82) passing through the insulating layer (24) and extending over a portion of the thickness of the semiconductor substrate (12), - forming the first portion of the electrically conductive pillars (60) by filling the openings (82) with an electrically conductive material, - forming the second portion of the electrically conductive pillars (60) from the first portion of the pillars.

10. A method according to claim 9, comprising, before filling the openings (82) with the electrically conductive material, a step of forming an electrically insulating layer (78) in the openings (82).

11. Method according to claim 10, comprising, between the step of forming an electrically insulating layer (78) and the step of filling the openings (82) with the electrically conductive material, a step of depositing an interface layer (70), preferably made of TiCu, in the openings (82). [Fig. 1] Fig. 1 [Fig. 2] [Fig. 3] [Fig. 4] '—12 [Fig. 5] [Fig. 6] [Fig. 7A] 22 ( 12 Fig. 7 A [Fig. 7B] Fig. 7B [Fig. 7C] Fig.7C [Fig. 7D] 12 Fig. 7D [Fig. 7E] Fig.7E [Fig. 7F] [Fig. 7G] Fig.7G

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