Cooling device configured to cool an electronic component

Abstract

Title: Cooling Device Configured to Cool an Electronic Component The invention relates to a cooling device (3) configured to cool at least two electronic components (2) having different heights, the cooling device (3) comprising: a base (12) defining an enclosure (10) configured to receive, on a bottom (14) of the base (12), the electronic components (2), and to be filled with a dielectric fluid intended to immerse the electronic components (2), a lid (16) configured to cooperate with the base (12) to close the enclosure (10) and comprising at least two stepped zones (160) having different heights, the height of a zone (160) being the distance measured between the bottom (14) of the base (12) and the zone of the lid (16), so that once the electronic components (2) are placed in the enclosure (10),Fluid can flow into a space between the top (24a) of the electronic components (2) and the stepped areas (160) of the cover (16). Figure for the abstract: Fig. 1,

Description

Title of the invention: Cooling device configured to cool an electronic component

[0001] The present invention relates to a cooling device configured to cool an electronic component.

[0002] It is known, in the context of cooling electronic components or a power electronic board, such as that used in an inverter, to employ a coolant circulating in a plate that is in contact with the electronic board. Such a system involves a significant fluid flow rate and is energy-intensive. Moreover, the architecture of the electronic board can complicate access, in terms of cooling, to the hottest electronic components.

[0003] The present invention aims in particular to further improve the thermal regulation, in particular the cooling, of an electronic component.

[0004] The invention thus relates to a cooling device configured to cool at least two electronic components having different heights, the cooling device comprising: - a base defining an enclosure configured to receive, on a base surface, the electronic components, and to be filled with a dielectric fluid intended to immerse the electronic components, - a lid configured to cooperate with the base to close the enclosure and comprising at least two stepped zones of different heights, the height of a zone being the distance measured between the bottom of the base and the zone of the lid, so that once the electronic components are placed in the enclosure, fluid can flow into a space between the top of the electronic components and the stepped areas of the lid.

[0005] Thanks to the invention, the volume of dielectric fluid required to immerse the electronic component(s) is reduced because the height of the lid is adjusted according to the height of the electronic components. In particular, this reduces the volume of liquid between the top of the electronic components and the stepped areas of the lid.

[0006] In addition, the stepped zones of the cover make it possible to manage the speed of the dielectric fluid and to direct it towards the electronic components requiring cooling.

[0007] According to one aspect of the invention, the enclosure comprises at least one fluid inlet and at least one fluid outlet so that dielectric fluid can circulate within the enclosure according to a main flow direction from the fluid inlet towards the fluid outlet.

[0008] According to one aspect of the invention, the enclosure has a width greater than the width of the electronic component, so as to provide spaces on the sides of the electronic component to allow the passage of dielectric fluid.

[0009] According to one aspect of the invention, the base comprises a flat bottom (therefore not stepped).

[0010] According to one aspect of the invention, the electronic components are arranged consecutively along the main direction of flow of the dielectric fluid, which allows for series cooling of these electronic components by the dielectric fluid.

[0011] According to one aspect of the invention, at least one of the stepped areas of the lid is inclined relative to the bottom of the base.

[0012] According to one aspect of the invention, this stepped zone has an upstream edge which is at a greater height than the height of the downstream edge of this stepped zone.

[0013] Thus, when considering the main direction of flow of the dielectric fluid, the space between the top of this electronic component and the corresponding stepped area of ​​the cover has a greater height upstream than downstream.

[0014] Thus, the dielectric fluid can be accelerated in the main direction of fluid flow leaving the electronic component due to the decrease in height of the inclined stepped area of ​​the cover.

[0015] Alternatively, the stepped area of ​​the cover may be parallel to the bottom of the base, for example. In this case, this stepped area of ​​the cover is not inclined and forms a space of constant height between the top of the electronic component and this stepped area.

[0016] According to one aspect of the invention, at least one stepped area may be flat. For example, the stepped area may or may not be inclined relative to the plane of the base.

[0017] Alternatively, at least one tiered area may be convex.

[0018] According to one aspect of the invention, at least one tiered area comprises at least one relief.

[0019] According to one aspect of the invention, the relief extends from an upstream edge to a downstream edge of the corresponding stepped zone.

[0020] According to one aspect of the invention, in a cross-section obtained perpendicular to the main direction of flow of dielectric fluid, the stepped zone has reliefs.

[0021] According to one aspect of the invention, the reliefs include, for example, ribs.

[0022] According to one aspect of the invention, the reliefs in cross-section of the stepped area can form, for example, undulations or crenellations.

[0023] According to another aspect of the invention, all the stepped areas of the lid are inclined relative to the bottom of the base.

[0024] Alternatively, only some of the stepped areas of the lids are inclined relative to the base of the plinth.

[0025] Alternatively, all the stepped areas extend parallel to the bottom of the base.

[0026] For example, the first stepped zone of the lid may be flat and the following stepped zones, in the main direction of fluid flow, are inclined.

[0027] According to one aspect of the invention, all the stepped areas of the lid have different heights.

[0028] This is advantageous when electronic components of all different heights are placed in the enclosure.

[0029] In addition, the fact that the cover has stepped areas that adapt to the height of the associated electronic components makes it possible to reduce the flow space above the electronic components so that the amount of dielectric fluid needed to immerse the electronic components in the enclosure is relatively small.

[0030] According to one aspect of the invention, some of the tiered zones may have identical heights. For example, some of the tiered zones may also have the same inclination.

[0031] According to one aspect of the invention, the tiered zones of identical height are separated, for example, by a tiered zone of greater or lesser height.

[0032] According to one aspect of the invention, the base comprises a wall or walls configured to separate locations intended to each receive an electronic component.

[0033] Advantageously, these walls make it possible to limit, or even eliminate, dead zones for the dielectric fluid.

[0034] These dead zones are undesirable insofar as the fluid in these dead zones does not participate in heat exchanges and may have a temperature higher than the temperature of the flowing dielectric fluid.

[0035] Advantageously, the absence of dead zones makes it possible to reduce the amount of dielectric fluid required to cool the electronic components.

[0036] The presence of these walls thus ensures better performance of heat exchange and therefore better cooling of electronic components.

[0037] According to one aspect of the invention, these walls, between the different locations for the components, may have different heights or, alternatively, the same height.

[0038] For example, these walls can be higher when the electronic components on either side are of greater heights.

[0039] According to one aspect of the invention, the walls extend over the entire width of the base.

[0040] The width of the base is defined as the dimension measured parallel to the bottom of the base and perpendicular to the main direction of fluid flow in the enclosure.

[0041] According to one aspect of the invention, one or more turbulators configured to create turbulence in the fluid flow are placed in the enclosure. This increases the heat transfer coefficient.

[0042] According to one aspect of the invention, the cover may include, at the level of the fluid inlet of the enclosure, one or more dielectric fluid distribution orifices communicating with the dielectric fluid inlet.

[0043] According to one aspect of the invention, these dielectric fluid distribution orifices are configured to distribute fluid over the top of the electronic component.

[0044] According to one aspect of the invention, these orifices can be simple holes or be provided with nozzles configured to accelerate the fluid that is distributed.

[0045] According to one aspect of the invention, each tiered zone is associated with a single electronic component.

[0046] Alternatively, a tiered area may be provided to be above two or more electronic components.

[0047] According to one aspect of the invention, the consecutive tiered areas are separated by a step on the lid.

[0048] According to one aspect of the invention, the step can be located at the right side of the base wall.

[0049] According to one aspect of the invention, the step can be substantially perpendicular to the plane of the base.

[0050] Alternatively, the step may have an angle (in particular not a right angle) with respect to the plane of the base.

[0051] According to one aspect of the invention, the enclosure can receive one or more deflectors to direct the dielectric fluid along predetermined flow lines.

[0052] According to one aspect of the invention, the deflector is configured to deflect the dielectric fluid along at least one outer flow line and at least one inner flow line relative to the main flow direction.

[0053] The internal flow line directs the fluid along one side of the electronic component.

[0054] The external flow line, which runs along a side wall of the enclosure, allows the fluid to reach the electronic component that follows the previous electronic component that is followed by the fluid, substantially without thermal interaction with this previous electronic component.

[0055] Advantageously, the fluid directed by the external flow line has a relatively low temperature to efficiently cool the electronic component.

[0056] According to one aspect of the invention, at least two deflectors are positioned each upstream and on either side of an electronic component in the main direction of flow.

[0057] According to one aspect of the invention, at least two deflectors are positioned each downstream and on either side of an electronic component with respect to the main flow direction.

[0058] According to one aspect of the invention, the lid is made of metal, such as aluminum for example, by molding or stamping. Alternatively, the lid can be made of a plastic material.

[0059] The invention also relates to a system comprising at least two electronic components and a cooling device as described above, configured to cool the electronic components.

[0060] According to one aspect of the invention, the cooling device comprises the cover formed of at least two stepped zones allowing the fluid to flow into a space between the top of the electronic components and the stepped zones of the cover.

[0061] Other features, details and advantages of the invention will become clearer upon reading the following description on the one hand, and several illustrative and non-limiting examples of embodiments given with reference to the accompanying schematic drawings on the other hand, in which:

[0062] [Fig-1] Fig. 1 is a longitudinal cross-sectional view of a device cooling according to the invention;

[0063] [Fig.2] The [Fig.2] is a cross-sectional view of the cooling device illustrated in the [Fig.1];

[0064] [Fig.3] The [Fig.3] is a top view of the cooling device illustrated in [Fig.1].

[0065] The features, variations, and different embodiments of the invention can be combined with one another in various ways, provided they are not incompatible or mutually exclusive. In particular, variations of the invention may be imagined that do not include that a selection of features described subsequently in isolation from the other features described, if this selection of features is sufficient to confer a technical advantage and / or to differentiate the invention from the prior art.

[0066] Figure 1 shows a cooling device 3 which is part of a system 1 of the type forming an inverter, for example configured to be mounted on a motor vehicle. This system 1 comprises electronic components 2 of different heights arranged in a row (components 2a, 2b and 2c are noted in the order of the row), cooled by the cooling device 3.

[0067] The cooling device 3 includes a housing 10 formed of a lid 16 which cooperates with a base 12 to close this housing 10. This base 12 includes a flat bottom 14.

[0068] The enclosure 10 receives the electronic components 2 on the bottom 14 and can be filled with a dielectric fluid for immersing them. The enclosure 10 includes a fluid inlet 18 and a fluid outlet 19. The dielectric fluid flows in a main flow direction XP from the inlet 18 to the fluid outlet 19.

[0069] The cover 16 is made of metal, for example aluminum, and is produced by molding or stamping. It comprises several stepped zones 160, including three flat stepped zones 160a, 160b, 160c, each with a different height. Each stepped zone 160a, 160b, 160c is associated with a single electronic component 2a, 2b, 2c (stepped zone 160a is associated with electronic component 2a, stepped zone 160b with electronic component 2b, and stepped zone 160c with electronic component 2c). The height of each stepped zone 160 is the distance measured between the bottom 14 of the base 12 and the stepped zone 160 of the cover 16. Thus, these stepped zones 160a, 160b, 160c adapt to the height of the electronic components 2a, 2b, 2c associated with them, which makes it possible to reduce the flow space above the electronic components 2. In [Fig.1], the three electronic components 2a, 2b, 2c have different heights.Electronic component 2a has the smallest height of the three electronic components 2a, 2b, 2c. Electronic component 2b has the tallest height, and electronic component 2c has a height intermediate between that of electronic components 2a and 2c. The heights of the stepped zones 160a, 160b, 160c are adjusted accordingly.

[0070] It follows that the quantity of dielectric fluid required to immerse the electronic components 2a, 2b, 2c in the enclosure 10 is relatively small. Indeed, when the electronic components 2a, 2b, 2c are placed in the enclosure 10, fluid flows into a space between the apex 24 of the electronic components 2 and the stepped zones 160a, 160b, 160c of the cover 16. Thus, the immersion volume of the dielectric fluid is reduced and allows for optimization of the required dielectric fluid velocity.

[0071] In an alternative (not illustrated), a stepped area 160 is provided to be above two or more electronic components 2.

[0072] The cover 16 thus comprises a first stepped zone 160a parallel to the bottom 14 of the base 12. This first stepped zone 160a is not inclined. Thus, a space of constant height is formed between a vertex 24a of the electronic component 2a and this stepped zone 160a.

[0073] This stepped zone 160a is followed by two consecutive inclined stepped zones 160b, 160c. These inclined stepped zones 160b, 160c each have an upstream edge 161b, 161c respectively, and a downstream edge 162b, 162c respectively, in the principal flow direction XP. The upstream edge 161b, 161c has a greater height than the downstream edge 162b, 162c, relative to the bottom 14 of the bedrock 12.

[0074] In other words, when considering the direction of flow XP of the dielectric fluid, the space between the apex 24b of the electronic component 2b and the inclined stepped zone 160b has a greater height upstream than downstream. Thus, the dielectric fluid is accelerated when it leaves this electronic component 2b due to the decrease in height in the direction of fluid flow XP. This effect is also present for the electronic component 2c associated with the stepped zone 160c relative to the apex 24c.

[0075] Furthermore, the base 12 includes walls 30 that separate slots 39, each intended to receive an electronic component 2. The walls 30 limit the presence of dead zones for the dielectric fluid. These dead zones are undesirable because the dielectric fluid present in them does not participate in heat exchange and has a temperature higher than that of the dielectric fluid flowing elsewhere. Thus, the absence of dead zones reduces the amount of dielectric fluid required to cool the electronic components 2. Consequently, the presence of these walls 30 ensures better heat exchange performance and therefore better cooling of the electronic components 2.

[0076] These walls 30 have different heights. They are higher when the electronic components 2 on either side are taller. For example, wall 30a, which separates electrical components 2a and 2b, has a height equal to the height of component 2a. Wall 30c, which separates electrical components 2b and 2c, has a height equal to the height of electronic component 2c. These walls 30 extend across the entire width of the base 14. We call base width 12 the dimension measured parallel to the bottom 14 of base 12 and perpendicular to the main direction of flow of fluid XP in enclosure 10.

[0077] Furthermore, the cover 16 has, at the level of the fluid inlet 18, fluid distribution ports 20 which communicate with this fluid inlet 18. These fluid distribution ports 20 distribute dielectric fluid onto the top 24 of the electronic component 2. These distribution ports 20 are simple holes.

[0078] Alternatively, the distribution ports 20 are provided with nozzles which accelerate the dielectric fluid which is distributed.

[0079] The consecutive stepped areas 160 are separated by a step 164 on the cover 16. This step 164 is located at the right of the wall 30 of the base 12 and has a non-right angle with respect to the plane of the base 12, which gives it an inclination with respect to the electronic component 2 which it faces.

[0080] The step 164a located between the consecutive stepped zones 160a and 160b is inclined with respect to an upstream wall 21b of the electronic component 2b. The flow of the dielectric fluid rises the upstream wall 21b of the electronic component 2b in the direction of the flow of fluid XP between the two stepped zones 160a and 160b.

[0081] Alternatively, step 164 is substantially perpendicular to the plane of base 12.

[0082] Figure 2 shows the enclosure 10, which has a width greater than a width of the electronic component 2, which provides spaces 41 on the sides 22 of the electronic component 2 to allow the passage of dielectric fluid.

[0083] The stepped zone 160 of the lid 16 has reliefs 17, here ribs. These reliefs 17 extend from an upstream edge to a downstream edge of this stepped zone 160 in the main flow direction XP of the dielectric fluid.

[0084] Alternatively, these reliefs 17 form undulations or crenellations.

[0085] As illustrated in [Fig.3], the enclosure 10 receives deflectors 40 to direct the dielectric fluid along desired flow lines.

[0086] Two deflectors 40 are positioned upstream of the first electronic component 2a in the main flow direction XP.

[0087] Two other pairs of deflectors 40 are also positioned between two consecutive electronic components 2a and 2b, and respectively 2b and 2c.

[0088] Each deflector 40 is configured to deflect the dielectric fluid along an outer flow line 401 and an inner flow line 402 with respect to the main flow direction XP of the dielectric fluid.

[0089] The internal flow line 402 directs the fluid along one side 22a of the electronic component 2a.

[0090] The external flow line 401 allows the fluid to reach the electronic component 2b which follows along a wall 11 of the enclosure 10.

[0091] Thus the deflectors 40 allow the relatively unheated fluid to be directed towards the most downstream components in order to cool them sufficiently.

Claims

Demands

1. A cooling device (3) configured to cool at least two electronic components (2) having different heights, the cooling device (3) comprising: - a base (12) defining an enclosure (10) configured to receive, on a bottom (14) of the base (12), the electronic components (2), and to be filled with a dielectric fluid for immersing the electronic components (2), - a lid (16) configured to cooperate with the base (12) to close the enclosure (10) and comprising at least two stepped zones (160) having different heights, the height of a zone (160) being the distance measured between the bottom (14) of the base (12) and the zone of the lid (16), such that once the electronic components (2) are placed in the enclosure (10), fluid can flow into a space between the top (24) of the electronic components (2) and the stepped zones (160) of the lid (16).

2. Cooling device (3) according to claim 1, wherein the enclosure (10) has a width greater than one width of the electronic component (2), so as to provide spaces on the sides (22) of the electronic component (2) to allow the passage of dielectric fluid.

3. Cooling device (3) according to any one of the preceding claims, wherein at least one of the stepped areas (160) of the lid is inclined relative to the bottom of the base (12).

4. Cooling device (3) according to any one of the preceding claims, wherein all the stepped areas (160) of the lid have different heights or wherein some of the stepped areas have identical heights.

5. Cooling device (3) according to any one of the preceding claims, wherein at least one stepped area (160) is flat or convex.

6. Cooling device (3) according to any one of the preceding claims, wherein at least one stepped area (160) comprises at least one relief (17).

7. Cooling device (3) according to the preceding claim, wherein the relief (17) extends from an upstream edge to a downstream edge of the corresponding stepped zone (160).

8. Cooling device (3) according to any one of the preceding claims, wherein the base (12) comprises one or more walls (30) between the different locations for the components.

9. Cooling device (3) according to any one of the preceding claims, wherein the enclosure (10) receives one or more deflectors (40) to direct the dielectric fluid along predetermined flow lines.

10. Cooling device (3) according to any one of the preceding claims, wherein the cover (16) has at the level of a fluid inlet (18) of the enclosure (10), one or more fluid distribution orifices (20) communicating with the fluid inlet (18).

11. Cooling device (3) according to any one of the preceding claims, wherein the consecutive stepped zones (160) are separated by a step (164) on the cover (16).

12. System (1) comprising at least two electronic components (2) and a cooling device (3) according to any one of claims 1 to 11, configured to cool the electronic components (2).

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