Electronic system and method for assembling an electronic system

Abstract

Title of the invention: Electronic system and method for mounting such an electronic system. The present invention relates to an electronic system (2) comprising at least one printed circuit board (6) and a component (10) installed on the printed circuit board (6), the component (10) comprising at least one connection pin (20) fixed to the printed circuit board (6), the electronic system (2) further comprising at least one anchoring means (28) for the component (10) in the printed circuit board (6) separate from the at least one electrical connection pin (20). (Figure 1)

Description

Title of the invention: Electronic system and method for assembling an electronic system

[0001] The present invention relates to the field of electronic systems requiring cooling. More specifically, the present invention relates to the field of electronic systems comprising an electrical or electronic component that generates heat and is located on a printed circuit board and requires cooling.

[0002] Electronic systems typically comprise a large number of components mounted on a printed circuit board. These components perform a variety of specific functions and are soldered to the printed circuit board via connection pins to enable their operation. Some of these components generate a significant amount of heat that must be dissipated to limit damage to these components and, more broadly, to the associated electronic system.

[0003] It is particularly known to place the component(s) requiring cooling in contact with a cooling means, separate from the printed circuit board, so that heat exchange occurs between the components and the cooling means.

[0004] The inventors have observed that this prior art solution, although effective, is not optimal. Indeed, the arrangement of the components relative to the cooling means can be improved to increase the heat exchange capacity between the cooling means and the component(s), in a context where it is necessary to first ensure the correct positioning of the components relative to the printed circuit board so that they are properly fixed, and in particular soldered, to this printed circuit board and that the function of the electronic system is performed permanently.

[0005] The present invention falls within this context and aims to overcome at least some of the drawbacks of the prior art. In particular, the present invention aims to improve heat exchange between the component and the cooling means while ensuring correct positioning, and therefore correct electrical connection, of the component on the associated printed circuit board.

[0006] Thus, the present invention relates to an electronic system comprising at least one printed circuit board and a component installed on the printed circuit board, the component comprising at least one connection pin fixed to the printed circuit board, the electronic system further comprising at least a means of anchoring the component in the printed circuit board separate from at least one electrical connection pin.

[0007] The component may, for example, take the form of a power module, and more broadly, the component is an electrical or electronic component installed on the printed circuit board and connected to it by means of at least one electrical connection pin. Typically, the electrical connection pin is soldered to one side of the printed circuit board.

[0008] The anchoring means, separate from the electrical connection pin(s), serve, in particular, to hold the component in position before it is permanently attached to the printed circuit board by soldering the electrical connection pins. This positioning, achieved solely by the anchoring means during at least part of the assembly process, requires that the anchoring means be firmly embedded in the printed circuit board. This necessitates press-fitting, achieved by plastic deformation of the anchoring means' material. It is therefore essential that these anchoring means be separate from the connection pins to prevent damage to the latter during the component's placement on the printed circuit board.

[0009] According to one feature of the invention, the electronic system comprises a protective housing for the component in which an encapsulating material is disposed between at least one wall of the housing and said component, at least one anchoring means being formed projecting from an external face of the housing. The housing thus forms both a protective enclosure, to prevent damage to the component, and a rigid support that can take on a specific shape to generate and / or support anchoring means, the component then being able to retain its original shape.

[0010] According to one feature of the invention, the electronic system comprises two anchoring means formed respectively in the axial extension of a wall of the housing, the walls of the housing extended by the anchoring means being arranged on either side of the component. In this way, the anchoring forces exerted during press-fit mounting are evenly distributed on either side of the component, thus ensuring a reliable position of the component.

[0011] According to another feature of the invention, at least one anchoring means can be formed directly by the component.

[0012] According to one feature of the invention, at least one anchoring means is self-locking with respect to the printed circuit board along a direction of insertion of the anchoring means into the printed circuit board. In other words, the anchoring means has a shape that prevents the anchoring means from being dislodged in a direction opposite to that of the press-fit assembly. This reduces the plastic deformation required to hold the anchoring means in place. a corresponding hole in the printed circuit board. It should be noted, however, that at least one self-locking anchoring means is press-mounted, in accordance with the invention, and that it deforms plastically to ensure stable pre-positioning of the component relative to the printed circuit board.

[0013] According to one feature of the invention, at least one anchoring means has a serrated shape. This serrated shape results in a localized radial enlargement of the anchoring means's diameter, which forms ridges of material arranged at specific points around the periphery or along the corresponding anchoring means. It is the area of ​​the anchoring means with this ridge of material that will be plastically deformed during the forced insertion of the anchoring means. The serrated shape, that is, an arrangement in which the ridges of material are spaced apart from each other, reduces the forces required to achieve the appropriate plastic deformation of the anchoring means while ensuring that the component remains in position relative to the printed circuit board.The arrangement of spaced ridges can give the anchoring means, by way of non-limiting example, a fir tree or harpoon shape if the ridges of material extend in an annular fashion around the main elongation axis of the anchoring means, or a cross shape if the ridges of material are ribs extending axially along this main elongation axis.

[0014] According to one feature of the invention, the printed circuit board comprises at least one first hole through which extends at least one connecting pin, said connecting pin being soldered on a first face of the printed circuit board turned away from the component, and at least one second hole through which extends at least one anchoring means.

[0015] According to one feature of the invention, at least one anchoring means is secured to the printed circuit board by a tight fit in said second hole. In other words, while the electrical connection pin is inserted into the first hole with clearance that allows the connection pin to slide effortlessly within the first hole, the anchoring means rubs against the wall delimiting the second hole, and the frictional forces generated by this tight fit prevent the anchoring means from escaping the second hole solely under the weight of the component.

[0016] According to one feature of the invention, the tight fit is achieved by a generally cylindrical shape of the anchoring means whose diameter is greater than the diameter of the second orifice. This allows for a press fit of the anchoring means in the second orifice.

[0017] According to one feature of the invention, at least one anchoring means has a notched shape in that it has the shape of a cylindrical pin, with an axis of revolution parallel to an axis on which is centered at least one second orifice, said anchoring means comprising ridges locally increasing its radial dimension.

[0018] According to a feature of the invention, at least a second orifice is through.

[0019] According to one feature of the invention, at least a second hole has larger dimensions in the plane of the printed circuit board than the dimensions in the same plane of at least a first hole. This ensures a sufficient diameter for the anchoring means so that the plastic deformation involved in the press-fit mounting of the anchoring means leaves enough material to secure the component by the anchoring means.

[0020] According to one feature of the invention, the electronic system further comprises a housing participating in delimiting an internal housing within which at least the component and the printed circuit board are disposed, the electronic system further comprising a thermal interface material interposed between a wall of the housing and the component, said thermal interface material being in contact with said wall of the housing and the component, the electronic system further comprising a support member for the printed circuit board, said support member extending to a determined distance from said wall of the housing against which the thermal interface material is brought.

[0021] According to a feature of the invention, said wall of the casing includes within it a channel for the circulation of a refrigerant fluid.

[0022] According to one feature of the invention, the support member is formed in one piece with an additional wall of the housing.

[0023] The present invention also relates to a method of mounting an electronic system according to what has just been mentioned, in which at least one anchoring means is press-mounted in the printed circuit board.

[0024] According to one feature of the invention, the assembly method implements at least: - a first step in which the component is positioned in an assembly tool comprising a platform and pillars projecting from the platform, said component resting on the platform, said pillars having a free end disposed at a distance from the platform which is greater than the distance between the platform and a free end face of the component facing away from the platform, - a second step during which the mounting tool is positioned opposite the printed circuit board so that at least one connection pin and at least one anchoring method must be correctly positioned in relation to the printed circuit board, - a third step during which the mounting tool is translated along a displacement axis parallel to an elongation axis of at least one anchoring means so as to bring the component closer to the printed circuit board, with at least one connection pin passing through the printed circuit board and at least one anchoring means being press-mounted in the printed circuit board, - a fourth step during which the assembly tool is stopped in translation when control means detect that a predetermined threshold value has been exceeded.

[0025] According to various alternatives of the invention, during the fourth step of the assembly process, the assembly tool is stopped in translation when control means detect the exceeding of a distance value along the translation of the assembly tool or the exceeding of a predetermined force value exerted on the assembly tool.

[0026] According to a feature of the invention, during the fourth step, the threshold value is a predetermined force value exerted on the mounting tool, which is reached at least when one of the pillars of the mounting tool is in contact with the printed circuit board.

[0027] Other features, details and advantages of the invention will become clearer upon reading the following description on the one hand, and several illustrative and non-limiting examples of embodiments given with reference to the accompanying schematic drawings on the other hand, in which:

[0028] [Fig-1] schematically represents a general view of an electronic system in accordance with the present invention in which a component protected by a casing is attached to a printed circuit board, with in particular anchoring means attached to the casing which are engaged in holes in the printed circuit board and connection pins which are soldered onto the printed circuit board;

[0029] [Fig.2] schematically represents another general view of the electronic system visible on [Fig.1] in which the housing is seen in section to make visible a encapsulating material arranged between the housing and the component;

[0030] [Fig.3] schematically represents a top view of the printed circuit board visible in Figures 1 and 2 highlighting the shape of the anchoring means and connection pins of the component;

[0031] [Fig.4] schematically represents a method of mounting the component on the printed circuit board involving a mounting tool at the beginning of the mounting process;

[0032] [Fig.5] schematically represents the assembly process visible on [Fig.4] when the component is brought close to the printed circuit board;

[0033] [Fig.6] schematically represents the assembly process visible in figures 4 and 5 at the end of the assembly process.

[0034] The features, variants, and different embodiments of the invention can be combined in various ways, provided they are not incompatible or mutually exclusive. In particular, variants of the invention may be conceived comprising only a selection of features, described hereafter in isolation from the other described features, if this selection of features is sufficient to confer a technical advantage and / or to differentiate the invention from the prior art.

[0035] Fig. 1 schematically illustrates an electronic system 2 comprising a housing 4, a printed circuit board 6, a cooling means 8, a component 10 and a housing 12 for the component 10. In the examples illustrated, the component 10 is associated with a housing 12, but it could be envisaged that the housing 12 is optional and that the elements which will be described below as interacting with the housing 12 interact directly with the component.

[0036] Component 10 is an electrical or electronic component mounted on the printed circuit board 6, here via the housing 12 in which component 10 is housed. This component 10 may, by way of illustrative and non-limiting example of the invention, be a power module, for example in a DC / DC converter. Furthermore, component 10 is an element of the electronic system 2 that generates heat during its operation. Therefore, to promote the operation of component 10 and limit the risk of damaging the electronic system 2, component 10 is cooled by means of the cooling means 8.

[0037] The component 10 is attached to the printed circuit board 6, specifically at the connection pins 20 of the component 10. These connection pins 20 are soldered to an electrical trace of the printed circuit board 6. The connection pins 20 allow the component 10 to communicate with the printed circuit board 6. It should be noted that the main function of the connection pins 20 is to ensure the exchange of electrical signals between the component 10 and the printed circuit board 6, but that soldering the connection pins to the printed circuit board 6 also allows the component 10 to be attached to the printed circuit board 6.

[0038] The connection pins 20 of the component 10 pass through the printed circuit board 6 at the first holes 22. More specifically, the pins of The connection pins 22 of the component 10 are fixed to the printed circuit board 6 at a first face 26 and the component 10 is arranged opposite a second face 24 of the printed circuit board 6 opposite the first face 26, the connection pins passing through the printed circuit board through the first holes 22. For this purpose, and as can be seen in particular in [Fig.1], the first holes 22 have dimensions greater than the corresponding dimensions of the connection pins which pass through them, to avoid any damage to the connection pins during insertion.

[0039] As seen in the embodiment shown in [Fig. 1], the housing 4 defines an internal compartment 14 within which the component 10 is located. More specifically, the housing 4 comprises a lower wall 16 extending in a principal extension plane substantially parallel to a principal extension plane of the printed circuit board 6, an upper wall 17, and side walls 18 extending substantially perpendicularly to the principal extension plane of the lower wall 16 and joining the lower wall 16 and the upper wall 17. The internal compartment 14 is defined between the side walls 18, the upper wall 17, and the lower wall 16. It is understood that, for assembly and mounting purposes, at least the component 10 and the printed circuit board 6 are mounted in the housing, one of the aforementioned walls is removable.

[0040] The cooling means 8 is formed in or on a thickness of one of the walls of the housing 4 opposite which the component 10 is intended to be positioned. In the embodiment shown in Figures 1 and 2, the cooling means 8, schematically represented by dashed lines, is formed in a thickness E1 of the lower wall 16 of the housing 4. The dimensions of the cooling means are here substantially the same as those of the component 10, but it should be understood that they could be larger and, for example, extend over the entire lower wall 16. In this lower wall 16, a plurality of channels for circulating a refrigerant fluid are formed, which contributes to forming the cooling means 8. The cooling means 8 is positioned near the component 10 in such a way that heat exchange can take place from the component 10 to the lower wall 16 of the housing 4.Thus, this exchange of calories between component 10 and the lower wall 16 allows the temperature of component 10 to be lowered.

[0041] It should be noted that in an alternative embodiment of the invention, the cooling means 8 can be formed from a plate separate from the housing 4 and within which channels for circulating a refrigerant are formed. This plate is then arranged near the component 10, between the component and a wall of the housing, here the lower wall 16, so that heat exchange from the component 10 to the cooling means 8 can be achieved. In such a mode As an alternative embodiment, the plate forming the cooling means 8 may, for example, include fixing tabs allowing the plate to be secured to a wall of the case 4.

[0042] In the embodiment shown, the side walls 18 each include a support member 27 extending from a side wall 18 towards the component 10. These support members 27 support the printed circuit board 6 and ensure that the printed circuit board 6 is correctly positioned relative to the housing 4. To this end, the support members 27 may include retaining means, not shown here, for holding the printed circuit board 6 in position relative to the housing 4.

[0043] It should be noted that in the embodiment shown, the electronic system 2 comprises several support members 27. However, without departing from the scope of the present invention, the electronic system 2 may comprise a single support member 27 which alone supports the printed circuit board 6 and ensures its positioning relative to the housing 4. These support members 27 may be formed as a single unit with a wall of the housing 4 or alternatively consist of elements respectively attached to one of the walls of the housing 4.

[0044] In the embodiment represented in particular by [Fig.2], the housing 12 is configured to receive, in addition to the component 10, a encapsulating material 36 which has the function of protecting the component 10 within the housing 12 but also of ensuring the heat transfer between the component 10 and the wall of the housing 12, through which the heat will pass to the cooling device.

[0045] In other words, the housing 12 forms a physical protection for the component 10 and it can delimit an internal space 34 within which the component 10 and the encapsulating material 36 are arranged. This internal space 34 is delimited by walls 38 of the housing 12 joined edge to edge and framing the component 10. It should be noted that the internal space 34 can be directly open with respect to the lower wall 16 of the housing 4, i.e., not have an interposed wall between the component 10 and the cooling means 8, which promotes heat exchange between them.

[0046] The encapsulating material 36 is a thermal element facilitating heat transfer from the component 10 to the housing 12. It is understood that the encapsulating material 36 is disposed within the internal space 34 between at least one wall of the housing 12 and the component 10. By way of example, the encapsulating material 36 may be made of a heat-conducting resin. Alternatively, and without this list being exhaustive, the encapsulating material 36 may be made of a thermal paste or adhesive.

[0047] Furthermore, it is noteworthy in [Fig. 2] that component 10 is positioned directly against a thermal interface material 32. More specifically, the interface material thermal 32 is interposed between the lower wall 16 of the housing 4 and the component 10 by being in contact with the lower wall 16, i.e. the cooling means 8, and the component 10, here via the encapsulation material 36 and where applicable a wall of the housing 12.

[0048] This thermal interface material 32 is intended to promote heat exchange between the component 10 and the cooling means 8. More specifically, the thermal interface material 32 makes it possible to smooth out surface roughness, whether of the encapsulation material 36 or directly of the component 10, in order to maximize the exchange surfaces between the encapsulation material 36 or the component 10 and the cooling means 8. As an example, the thermal interface material 32 can be a thermal grease.

[0049] The thickness of the thermal interface material 32 must be within a range of values ​​which is specific to the dimensioning of each electronic system and more particularly of the component to be cooled, since the value of this thickness must be a compromise between the interest of limiting the thickness of the thermal interface material 32 in order to maximize the heat exchanges between the cooling means 8 and the component 10 and the need to have a minimum thickness of the thermal interface material 32 so that the smoothing of the roughnesses previously mentioned is sufficiently effective.

[0050] In this context, the positioning of the support members 27 relative to the housing 4 is fixed and predetermined, in order to control the distance between the printed circuit board 6 and the cooling means 8. Such control of the distance between the printed circuit board 6, and therefore the component 10 when it is made integral with the board, and the cooling means 8 makes it possible to adapt the thickness of the thermal interface material 32 to the desired minimum.

[0051] According to the invention, the electronic system 2 comprises at least one anchoring means 28 for the component 10 in the printed circuit board 6. This anchoring means 28 is separate from the connection pins 20 of the component 10 and is held firmly in the printed circuit board 6. This anchoring means 28 is specifically designed to ensure the attachment of the component 10 to the printed circuit board 6, at least before the connection pins 20 are soldered to the printed circuit board. It is understood that the presence of the anchoring means provides a load transfer that reduces the stresses that can be exerted on the solder joints of the connection pins 20 when the component 10 and / or the printed circuit board are handled.Furthermore, advantageously in the context of the invention, the anchoring means 28 make it possible to ensure that the component remains in position relative to the printed circuit board during the handling of the component and the printed circuit board before their position relative to each other. to the other not fixed by brazing the electrical connection pins, and therefore make it possible to ensure that the component 10 is in a theoretical position desired relative to the printed circuit board 6 when the connection pins 20 are brazed, which has the effect of ensuring control of the distance between the component 10 and the cooling means 8.

[0052] In other words, the anchoring means 28, integral with the component 10, are press-mounted in the printed circuit board 6 and such cooperation makes it possible, by controlling the insertion depth of the anchoring means in corresponding holes formed in the printed circuit board, to fix the position of the component 10 relative to the printed circuit board and thus to ensure an ideal amount of thermal interface material 32 with a limited rib chain.

[0053] In the embodiment illustrated in Figures 1 and 2, the anchoring means 28 are formed as a projection from an external face of one of the walls 38 of the housing 12. In other words, the housing 12 of the electronic system 2 includes at least one anchoring means 28, here two anchoring means 28, these anchoring means 28 being, as mentioned previously, press-fitted into the printed circuit board 6.

[0054] More specifically, the housing 12 includes two anchoring means 28 formed respectively in the axial extension of a wall 38 of the housing 12. In this way, the walls 38 of the housing 12 which are extended by the anchoring means 28 are arranged on either side of the component 10. It is understood that this makes it possible to give stability to the component 10 when the housing 12 associated with it is engaged with the printed circuit board by two areas which are respectively on each side of the component 10.

[0055] The anchoring means 28 and the connecting pins 20 extend outward from the same face of the housing, namely the face opposite the printed circuit board, and they extend mainly from this face in a parallel direction, which corresponds to their direction of insertion within the corresponding holes in the printed circuit board 6.

[0056] It should be noted that in an alternative embodiment of the invention mentioned above in which the electronic system 2 is without a housing 12, the anchoring means 28 can be formed as a single unit with the component 10. In this alternative embodiment of the invention, the anchoring means 28 are juxtaposed with the connection pins 20 and extend substantially parallel to these connection pins 20, protruding from the same face of the component 10 intended to be opposite the printed circuit board.

[0057] As mentioned, in order to achieve this reliable positioning of the component relative to the printed circuit board, prior to soldering the connection pins, the insertion distance of the anchoring means 28 in or through the The printed circuit board is controlled. In particular, the anchoring means 28 are self-locking relative to the printed circuit board 6 along an insertion direction of the anchoring means 28 into the printed circuit board 6. This insertion direction of the anchoring means 28 is substantially parallel to a principal elongation direction of the anchoring means 28.

[0058] The self-locking of the anchoring means 28 with respect to the printed circuit board 6 is made possible by the shape and respective dimensions of the anchoring means and the holes dedicated to them in the printed circuit board, to allow for force mounting of the anchoring means 28 in the printed circuit board 6.

[0059] More specifically, and as particularly visible in [Fig. 3], the anchoring means 28 of the housing 12 extend at least in part through second orifices 30. It should be noted that the introduction of an anchoring means 28 into the associated second orifice 30 will be described in more detail with reference to Figures 4 to 6.

[0060] The press-fitting of the anchoring means 28 in the printed circuit board 6 is permitted by a maximum radial dimension of the external profile of the anchoring means 28, for example an external diameter in the case of a circular cross-section, which is greater than the corresponding radial dimension, for example an internal diameter, of the second hole 30. Thus, the introduction of the anchoring means 28 into the second hole 30 results in the press-fitting of the anchoring means 28 in the second hole 30, by plastic deformation of the material of the anchoring means, and a holding of the component 10 relative to the printed circuit board 6.

[0061] In other words, it should be noted that the radial dimension, in a plane parallel to the main elongation plane of the printed circuit board 6, of the second holes 30 is adjusted to the corresponding dimension of the anchoring means 28, whereas the same radial dimension of the first holes 22 is wider than the corresponding dimension of the connecting pins 20.

[0062] In this context, it is notable in the illustrated example that a radial dimension of the second holes 30 considered in the plane of the printed circuit board 6 is greater than the radial dimension in the same plane of the first holes 22.This is explained on the one hand by the small radial dimension of the electrical connection pins and the need for the first holes 22 through which these connection pins 20 pass to have a radial dimension, here a diameter, which is slightly greater than the corresponding dimension of the electrical connection pins so that the soldering of the connection pins carried out after insertion is made possible by the presence of material of the printed circuit board on which to deposit the solder, and this is explained on the other hand by the fact that the dimension of the second holes is adjusted to that of the anchoring means and the need to have a sufficient diameter of the anchoring means so that the plastic deformation implied by the . Force mounting of the anchoring means leaves sufficient material to achieve the holding of the component by the anchoring means.

[0063] In the embodiment shown in [Fig. 3], the anchoring means 28 have a ribbed shape. More specifically, the anchoring means 28 has a cylindrical pin shape whose axis of revolution is parallel to an axis on which the associated second orifice 30 is centered. The ribbed shape of the anchoring means 28 increases the radial dimension of the cylindrical pin at specific points and forms material ridges 40. In other words, a peripheral edge of the anchoring means 28 has a succession of material ridges 40 and hollows 42 interposed angularly between two ridges. The maximum radial dimension of the external profile of the anchoring means is thus defined by the radial dimension of the free end of the material ridges 40.

[0064] The dimension, considered in the plane of the printed circuit board 6, of the cylindrical pin forming the anchoring means 28, excluding the material ridges 40, is smaller than the dimension, in said plane, of the associated second hole 30, while the corresponding dimension at the level of the material ridges 40 is larger. This facilitates the press-fitting of the anchoring means 28 in the second hole 30 by generating plastic deformation, which allows the press-fitting of the anchoring means 28 in the printed circuit board 6, only at the level of the material ridges 40, thus limiting the force required. The resistance to stress is less than if the anchoring means had been deformed around the entire circumference of the cylindrical pin, but this is within the context of holding the pin in position before the component is subsequently soldered to the printed circuit board.

[0065] It should be noted that to facilitate the insertion of the material beads 40 into the second orifice 30, the anchoring means 28 may have a free axial end, opposite the housing 12, the perimeter of which is devoid of ribs forming material beads, which makes it easier to position the anchoring means 28 relative to the second orifice 30 and to initiate an insertion of the anchoring means 28 into the second orifice 30.

[0066] Alternatively, the material ridges 40, which form the area of ​​an anchoring means 28 intended to be plastically deformed during the force-fitting of these anchoring means, may have an annular shape and be spaced apart from each other along the axial dimension of the corresponding anchoring means. In other words, the material ridges extend axially in the illustrated example, that is, along the main axial dimension of the anchoring means, parallel to the direction of insertion of the anchoring means 28 into the corresponding hole in the printed circuit board 6, while alternatively they are arranged in the form of grooves, presenting an annular shape projecting from a periphery of the pin. cylindrical. The areas without these gadroons, with an external diameter smaller than the diameter of the areas with the material ridges 40 forming the gadroons, are then considered as the hollows 42 previously mentioned, which help to limit the extent of the material ridges 40 and therefore limit the effort needed to plastically deform these material ridges.

[0067] In this alternative, the shims 40 can just as easily have a convex shape as an inclined plane shape, the anchoring means 28 having in the latter case a fir tree shape.

[0068] It is remarkable on [Fig.3] that the second holes 30 are through with respect to the printed circuit board 6. Thus, the insertion distance of the anchoring means 28 in the printed circuit board 6 can be adapted according to the desired configuration, the characteristic of the second holes 30 of being through in the printed circuit board 6 not limiting the insertion stroke of the anchoring means 28.

[0069] Figures 4 to 6 illustrate a method for mounting the component 10 with the printed circuit board 6, which notably illustrates the implementation of means not yet described for controlling the insertion distance of the anchoring means through or into the printed circuit board. More specifically, [Fig. 4] illustrates the beginning of the mounting method, [Fig. 5] illustrates an intermediate step during which the component 10 is brought closer to the printed circuit board 6, and [Fig. 6] illustrates the end of the mounting method.

[0070] As seen in [Fig. 4], during a first step of the assembly process, the component 10 is positioned in an assembly tool 44. This assembly tool 44 is formed of a platform 46 extending in a principal elongation plane parallel to the plane of the printed circuit board 6 and of a plurality of pillars 48, here two pillars 48. Each of the pillars 48 of the assembly tool 44 extends projecting from the platform 46 towards the printed circuit board 6 from the platform 46 to a free end 50.

[0071] It should be noted that the distance between the platform 46 and the free end 50 of the pillars 48 is greater than the distance between the platform 46 and the end face of the component 10 opposite the platform 46. It should be noted that the connecting pins 20 and the anchoring means 28 are not taken into account in determining said end face of the component 10.

[0072] During a second step of the assembly process, the mounting tool 44, on which the component 10 is installed (here the housing 12 and the thermal interface material 32 are also optionally installed), is correctly positioned relative to the printed circuit board 6. In other words, the mounting tool 44 is positioned so that the anchoring means 28 are opposite the second holes 30 and the connecting pins 20 opposite the first holes 22. Thus, when the component 10 and the printed circuit board 6 are brought together, the anchoring means 28 and the connecting pins 22 can enter their respective holes without coming into contact with the printed circuit board 6.

[0073] During a third step of the assembly process visible in [Fig. 5], the mounting tool 44 is translated along a displacement axis parallel to an elongation axis of the anchoring means 28. This translation of the mounting tool 44 makes it possible to bring the component 10 closer to the printed circuit board 6. More specifically, this translation leads to the insertion of the connection pins 20 of the component 10 through the first holes 22 of the printed circuit board 6 and to the press-fitting of the anchoring means 28 into the second holes 30 of the printed circuit board 6.

[0074] This translation of the mounting tool 44 is enabled, in the embodiment shown, by a piston 52 connected to a control unit 54. The piston 52 is configured to generate a force 56 towards the printed circuit board 6 and parallel to the extension axis of the anchoring means 28. The force of this force is measured by the control unit which, depending on the measured value, controls the movement of the piston 52.

[0075] This displacement of the piston 52 is characterized by three moments. A first moment corresponds to a value of the force 56 equal to the displacement of the weight of the mounting tool 44. A second moment corresponds to a value of the force 56 corresponding to the force required to force the anchoring means 28 into the printed circuit board 6. A third moment corresponds to a value of the force 56 exerted by the piston 52 on the mounting tool 44 when the free end 50 of the pillars 48 comes into contact with the printed circuit board 6.

[0076] This third moment contributes to obtaining a fourth step of the assembly process visible in [Fig.6] during which the assembly tool 44 is stopped in translation when control means, here the control unit 54, detect the exceeding of a predetermined force value exerted on the assembly tool 44.

[0077] It is understood from the above that the predetermined force value is reached when one of the pillars 48 of the mounting tool 44 comes into contact with the printed circuit board 6.

[0078] Once this predetermined force value is reached, the mounting tool 44 can be removed and the component 10 is held securely to the printed circuit board 6 by force mounting the anchoring means 28 in the printed circuit board 6. Thus, the distance between the thermal interface material 32 and the printed circuit board 6 can be controlled to minimize its thickness. It is understood that this distance can be controlled by modifying the length of the pillars 48.

[0079] Thus, the present invention achieves the goal it set for itself by proposing an electronic system in which the cooling of the component is improved by means of a controlled positioning of the latter relative to the printed circuit board so that the thickness of a thermal interface material interposed between the component and the cooling means is minimal.

[0080] The present invention is not limited to the means and configurations described and illustrated herein and also extends to any equivalent means and configuration as well as to any technically operative combination of such means.

Claims

Demands

1. Electronic system (2) comprising at least one printed circuit board (6) and a component (10) installed on the printed circuit board (6), the component (10) comprising at least one connection pin (20) attached to the printed circuit board (6), the electronic system (2) further comprising at least one anchoring means (28) for the component (10) in the printed circuit board (6) separate from at least one electrical connection pin (20).

2. Electronic system (2) according to claim 1, comprising a protective housing (12) for the component (10) within which an encapsulating material (36) is disposed between at least one wall (38) of the housing (12) and said component (10), at least one anchoring means (28) being formed projecting from an external face of the housing (12).

3. Electronic system (2) according to claim 2 and comprising two anchoring means (28) formed respectively in the axial extension of a wall (38) of the housing (12), the walls (38) of the housing (12) extended by the anchoring means (28) being arranged on either side of the component (10).

4. Electronic system (2) according to any one of claims 1 to 3, wherein at least one anchoring means (28) is self-locking with respect to the printed circuit board (6) along an insertion direction of the anchoring means (28) in the printed circuit board (6).

5. Electronic system (2) according to any one of claims 1 to 4, wherein at least one anchoring means (28) has a notched shape.

6. Electronic system (2) according to any one of claims 1 to 5, wherein the printed circuit board (6) comprises at least a first hole (22) through which extends at least one connecting pin (20), said connecting pin (20) being soldered to a first face (26) of the printed circuit board (6) turned away from the component (10), and at least a second hole (30) through which extends at least one anchoring means (28).

7. Electronic system (2) according to claim 6, wherein at least one anchoring means (28) is integral with the circuit board printed (6) by a tight fit in said second orifice (30).

8. Electronic system (2) according to any one of claims 5, 6 and 7, wherein at least one anchoring means (28) has a notched shape in that it has a cylindrical pin shape, with an axis of revolution parallel to an axis on which at least one second orifice (30) is centered, said anchoring means (28) having ridges (40) locally increasing its radial dimension.

9. Electronic system (2) according to any one of claims 6 to 8, wherein at least one second orifice (30) is through-hole.

10. Electronic system (2) according to any one of claims 6 to 9, wherein at least one second orifice (30) has in the plane of the printed circuit board (6) larger dimensions than the dimensions in the same plane of at least one first orifice (22).

11. Electronic system (2) according to any one of claims 1 to 10 and further comprising a housing (4) participating in defining an internal housing (14) within which at least the component (10) is disposed, the electronic system (2) further comprising a thermal interface material (32) interposed between a wall (16) of the housing (4) and the component (10), said thermal interface material (32) being in contact with said wall (16) of the housing (4) and the component (10), the electronic system (2) further comprising a support member (27) for the printed circuit board (6), said support member (27) extending to a determined distance from said wall (16) of the housing (4) against which the thermal interface material (32) is brought.

12. Electronic system (2) according to claim 11, wherein the support member (27) is formed in one piece with an additional wall (18) of the housing (4).

13. Method of mounting an electronic system (2) according to any one of claims 1 to 12, wherein at least one anchoring means (28) is press-mounted in the printed circuit board (6).

14. A method for mounting an electronic system (2) according to claim 13, the mounting method comprising at least: - a first step in which the component (10) is positioned in a mounting tool (44) comprising a platform

15. (46) and pillars (48) projecting from the platform (46), said component (10) resting on the platform (46), said pillars (48) having a free end (50) disposed at a distance from the platform (46) which is greater than the distance between the platform and a free end face of the component (10) facing away from the platform (46), - a second step in which the mounting tool (44) is positioned opposite the printed circuit board (6) so that at least one connecting pin (20) and at least one anchoring means (28) are correctly positioned opposite the printed circuit board (6), - a third step in which the mounting tool (44) is translated along a displacement axis parallel to an elongation axis of at least one anchoring means (28) so as to bring the component (10) closer to the printed circuit board (6), at least one connection pin (20) passing through the printed circuit board (6) and at least one anchoring means (28) being press-mounted in the printed circuit board (6), - a fourth step during which the assembly tool (44) is stopped in translation when control means (54) detect the exceeding of a predetermined threshold value. Assembly method according to claim 13 wherein, during the fourth step, the threshold value is a predetermined force value exerted on the assembly tool, which is reached at least when one of the pillars (48) of the assembly tool (44) is in contact with the printed circuit board (6).