Control apparatus and control panel

The control apparatus addresses the heat trapping issue by using heat dissipation sheets between heating elements and projecting portions on opposite surfaces of the main circuit board, enhancing cooling efficiency and allowing for a thinner design.

GB2631603APending Publication Date: 2025-01-08MITSUBISHI ELECTRIC CORP
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Patent Information

Application Number
GB2024012546
Authority / Receiving Office
GB · GB
Patent Type
Applications
Current Assignee / Owner
Priority Date
2022-04-14
Filing Date
2022-04-14
Publication Date
2025-01-08

AI Technical Summary

Technical Problem

The existing module with a heat dissipation board traps heat due to heating components, leading to increased depth and inability to thin the apparatus where it is installed.

Method used

A control apparatus with a main circuit board, first and second heating elements, and heat dissipation sheets, where the heating elements are mounted on opposite surfaces of the board, and heat dissipation sheets are sandwiched between the elements and projecting portions to facilitate efficient cooling and thinning.

Benefits of technology

This configuration achieves efficient cooling and reduces the depth of the apparatus by allowing air flow through the structure, effectively dissipating heat and enabling thinning of the control apparatus.

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Abstract

This control apparatus (1000) comprises a main circuit board (40), a first heating element (40a), a second heating element (40b), a structure (ST), a first heat dissipation sheet (41), and a second heat dissipation sheet (23). The first heating element (40a) is mounted to a front surface (FS) of the main circuit board (40). The second heating element (40b) is mounted to a rear surface (RS) of the main circuit board (40). The structure (ST) has a first protruding part (42a) and a second protruding part (20a). The first heat dissipation sheet (41) is sandwiched between the first heating element (40a) and the first protruding part (42a). The second heat dissipation sheet (23) is sandwiched between the second heating element (40b) and the second protruding part (20a). The first heat dissipation sheet (41) is in contact with the first heating element (40a) and the first protruding part (42a). The second heat dissipation sheet (23) is in contact with the second heating element (40b) and the second protruding part (20a).
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Description

TITLE OF INVENTION: Control Apparatus and Control Panel TECHNICAL FIELD

[0001] The present disclosure relates to a control apparatus and a control panel. BACKGROUND ART

[0002] A module including a heat dissipation board for dissipating heat generated from a heating component has been proposed to date. For example, Japanese Patent Laying-Open No. 2010-3718 (PTL 1) describes a module including a heat dissipation board. In the module described in PTL 1, a plurality of heating components are disposed on a surface of the heat dissipation board. A circuit board is sandwiched in the heat dissipation board in the state in which inter-board connection terminals of the heat dissipation board are folded. Accordingly, the module is decreased in size and as a result, an apparatus where the module is installed can be decreased in size. CITATION LIST PATENT LITERATURE

[0003] PTL 1: Japanese Patent Laying-Open No. 2010-3718 SUMMARY OF INVENTION TECHNICAL PROBLEM

[0004] In the module described in PTL 1, in the state in which the circuit board is sandwiched between the heating components mounted on the heat dissipation board, the circuit board is heated by the heating components. Thus, the heat is trapped inside the apparatus where the module is installed. In addition, the heat dissipation board is folded. Accordingly, while the projection area of the module is decreased, the depth dimension of the module is increased. Consequently, the apparatus where the module is installed cannot be thinned.

[0005] The present disclosure has been made in view of the foregoing problem and an object thereof is to provide a control apparatus and a control panel, which can achieve an efficient cooling configuration and thinning. SOLUTION TO PROBLEM

[0006] A control apparatus according to the present disclosure includes a main circuit board, a first heating element, a second heating element, a structure, a first heat dissipation sheet, and a second heat dissipation sheet. The main circuit board includes a front surface and a rear surface. surface of the main circuit board. surface of the main circuit board. The first heating element is mounted on the front The second heating element is mounted on the rear The structure includes a first projecting portion and a second projecting portion. The first projecting portion projects toward the first heating element. The second projecting portion projects toward the second heating element. The first heat dissipation sheet is sandwiched between the first heating element and the first projecting portion. The second heat dissipation sheet is sandwiched between the second heating element and the second projecting portion. The first heat dissipation sheet is in contact with the first heating element and the first projecting portion. The second heat dissipation sheet is in contact with the second heating element and the second projecting portion. ADVANTAGEOUS EFFECTS OF INVENTION

[0007] The control apparatus and the control panel according to the present disclosure enable it to provide a control apparatus that can achieve an efficient cooling configuration and thinning. BRIEF DESCRIPTION OF DRAWINGS

[0008] Fig. lisa perspective view schematically illustrating a configuration of a control apparatus according to Embodiment 1. Fig. 2 is a cross-sectional perspective view along line II-II in Fig. 1. Fig. 3 is a cross-sectional perspective view along line III-III in Fig. 1. Fig. 4 is a perspective view schematically illustrating an internal configuration of the control apparatus according to Embodiment 1. Fig. 5 is a cross-sectional perspective view along line V-V in Fig. 4. Fig. 6 is an enlarged view in which part VI in Fig. 5 is enlarged. Fig. 7 is a cross-sectional perspective view along line VII-VII in Fig. 4. Fig. 8 is an enlarged view in which part VIII in Fig. 7 is enlarged. Fig. 9 is a perspective view schematically illustrating an internal configuration of a control apparatus according to Embodiment 2. Fig. 10 is a cross-sectional perspective view along line X-X in Fig. 9. Fig. 11 is an enlarged view in which part XI in Fig. 10 is enlarged. Fig. 12 is a cross-sectional perspective view along line XII-XII in Fig. 9. Fig. 13 is an enlarged view in which part XIII in Fig. 12 is enlarged. Fig. 14 is a cross-sectional perspective view schematically illustrating a state in which the control apparatus according to Embodiment 2 is attached to a sheet metal bracket member. Fig. 15 is an enlarged view in which part XV in Fig. 14 is enlarged. Fig. 16 is a cross-sectional view schematically illustrating a configuration of a control panel according to Embodiment 2. Fig. 17 is a front view schematically illustrating a configuration of the control panel according to Embodiment 2. DESCRIPTION OF EMBODIMENTS

[0009] Embodiments are described below with reference to the drawings. In the drawings, the same or corresponding portions are denoted by the same reference characters and are not described repeatedly. For convenience in creating the drawings, no hatch pattern is given to any cross section in the drawings.

[0010] Embodiment 1. Referring to Figs. 1 to 8, a configuration of a control apparatus 1000 according to Embodiment 1 is described. As illustrated in Figs. 1 to 3, in Embodiment 1, an air conditioning control apparatus is described as an example of control apparatus 1000. In Embodiment 1, control apparatus 1000 is attached to a wall via a wall attachment frame member, which is not illustrated. Fig. lisa perspective view illustrating control apparatus 1000 according to Embodiment 1 from the back side. Fig. 2 is a perpendicular cross-sectional perspective view in a central position of a first heating element 40a on a main circuit board 40. Fig. 3 is a perpendicular cross-sectional perspective view in a central position of a second heating element 40b on main circuit board 40. The arrows in Figs. 2 and 3 indicate the flow of air.

[0011] Control apparatus 1000 according to Embodiment 1 mainly includes a housing member 8, a base sheet metal member 20, main circuit board 40, first heating element 40a, second heating element 40b, a first heat dissipation sheet 41, a second heat dissipation sheet 23, a heat spreader 42, and a housing cover member 60. In Embodiment 1, a structure ST includes base sheet metal member 20 and heat spreader 42.

[0012] The housing cover member covers base sheet metal member 20, main circuit board 40, first heating element 40a, second heating element 40b, first heat dissipation sheet 41, second heat dissipation sheet 23, and heat spreader 42. Housing member 8 is disposed on the front side of control apparatus 1000. Housing cover member 60 is disposed on the back side of control apparatus 1000. Housing cover member 60 is fixed to housing member 8.

[0013] A display device 1 is mounted on the front of control apparatus 1000. Display device 1 is fixed to housing cover member 60. Display device 1 constitutes an operation unit. A touch panel, not illustrated, is mounted on display device 1.

[0014] A plurality of air inlet slits 60c and a plurality of air outlet slits 60d are provided in housing cover member 60. The plurality of air inlet slits 60c and the plurality of air outlet slits 60d are provided through a wall surface of housing cover member 60 on the back side. The plurality of air inlet slits 60c are used to take in air from the outside to the inside of housing cover member 60. The plurality of air outlet slits 60d are used to discharge air from the inside to the outside of housing cover member 60. The plurality of air inlet slits 60c are provided in a lower portion of housing cover member 60. The plurality of air outlet slits 60d are provided in an upper portion of housing cover member 60.

[0015] Main circuit board 40 includes a front surface FS and a rear surface RS. First heating element 40a is mounted on front surface FS of main circuit board 40. First heating element 40a is, for example, a central processing unit (CPU). Second heating element 40b is mounted on rear surface RS of main circuit board 40. Second heating element 40b is, for example, a power management integrated circuit (PMIC). That is, the heating elements are mounted on both surfaces of main circuit board 40. First heating element 40a is thermally severer (larger in heat generation amount) than second heating element 40b and needs more heat dissipation than second heating element 40b.

[0016] First heating element 40a and first heat dissipation sheet 41 are disposed between main circuit board 40 and heat spreader 42, and second heating element 40b and second heat dissipation sheet 23 are disposed between main circuit board 40 and base sheet metal member 20. First heat dissipation sheet 41 and second heat dissipation sheet 23 are each, for example, a silicon-based heat dissipation sheet. Main circuit board 40, base sheet metal member 20, and heat spreader 42 are structured so that air flows through, between main circuit board 40, and base sheet metal member 20 and heat spreader 42, from the plurality of air inlet slits 60c to the plurality of air outlet slits 60d.

[0017] Fig. 4 is a perspective view illustrating a state in which housing cover member 60 is removed from housing member 8. As illustrated in Figs. 2 to 4, base sheet metal member 20 is disposed on the back side of display device 1. Base sheet metal member 20 is composed of, for example, a galvanized steel sheet (an iron-based) material. A sheet metal case member 30 is fixed on the back side of base sheet metal member 20 with a screw 403. A power supply system board 33 is fixed to sheet metal case member 30. Main circuit board 40 is disposed on the back side of base sheet metal member 20. Base sheet metal member 20 holds main circuit board 40. Base sheet metal member 20 holds heat spreader 42. Heat spreader 42 is composed of, for example, aluminum. That is, since first heating element 40a is thermally severer than second heating element 40b, heat spreader 42 is composed of a material superior to base sheet metal member 20 in heat dissipation performance. In addition, heat spreader 42 is made of a plate material thicker than base sheet metal member 20 and advantageous heat dissipation is achieved accordingly. Base sheet metal member 20 faces rear surface RS of main circuit board 40.

[0018] Heat spreader 42 is disposed on the back side of main circuit board 40. Heat spreader 42 faces front surface FS of main circuit board 40. A transmission system board 51 is fixed on the back side of heat spreader 42 with a screw 404. Heat spreader 42 is fixed to base sheet metal member 20 with screw 404 inserted through a hole provided in main circuit board 40.

[0019] Fig. 5 is a perpendicular cross-sectional perspective view in a central position of first heating element 40a. Fig. 6 is an enlarged view around first heating element 40a in Fig. 5. As illustrated in Figs. 2, 5, and 6, heat spreader 42 includes a first projecting portion 42a. First projecting portion 42a projects toward first heating element 40a. First projecting portion 42a has a drawn shape. First heat dissipation sheet 41 is in contact with a lower surface of first projecting portion 42a. First heat dissipation sheet 41 is sandwiched between first heating element 40a and first projecting portion 42a. A through hole is provided in the surface of first projecting portion 42a, on which first heat dissipation sheet 41 is disposed. This through hole is used to verify that first heat dissipation sheet 41 is reliably situated in a predetermined position when main circuit board 40 and heat spreader 42 are combined. First heat dissipation sheet 41 is in contact with first heating element 40a and first projecting portion 42a. First heat dissipation sheet 41 has thermal conductivity larger than that of air. When heat spreader 42 is fixed with screw 404, first projecting portion 42a is in contact with first heat dissipation sheet 41, and first heat dissipation sheet 41 is crushed by a half of its thickness accordingly. Boss portions having respective screw holes are provided around first projecting portion 42a. In particular, a pair of boss portions are provided so that first projecting portion 42a is sandwiched therebetween. The height of the boss portion is larger than the height of first projecting portion 42a and smaller than the height of first projecting portion 42a plus the height of first heat dissipation sheet 41 before being crushed. By driving the screw into the boss portion, the distance between main circuit board 40 and first projecting portion 42a is decreased and as a result, first heat dissipation sheet 41 is crushed and reliable contact can be maintained.

[0020] Fig. 7 is a perpendicular cross-sectional perspective view in a central position of second heating element 40b. Fig. 8 is an enlarged view around second heating element 40b in Fig. 7. As illustrated in Figs. 3, 7, and 8, base sheet metal member 20 includes a second projecting portion 20a. Second projecting portion 20a projects toward second heating element 40b. Second projecting portion 20a has a drawn shape. Second heat dissipation sheet 23 is in contact with an upper surface of second projecting portion 20a. Second heat dissipation sheet 23 is sandwiched between second heating element 40b and second projecting portion 20a. A through hole is provided in the surface of second projecting portion 20a, on which second heat dissipation sheet 23 is disposed. This through hole is used to verify that second heat dissipation sheet 23 is reliably situated in a predetermined position when main circuit board 40 and base sheet metal member 20 are combined. Second heat dissipation sheet 23 is in contact with second heating element 40b and second projecting portion 20a. First heat dissipation sheet 41 has thermal conductivity larger than that of air. When main circuit board 40 is fixed to base sheet metal member 20, second projecting portion 20a is in contact second heat dissipation sheet 23, and the second heat dissipation sheet is crushed by a half of its thickness accordingly. Boss portions having respective screw holes are provided around second projecting portion 20a. In particular, a pair of boss portions are provided so that second projecting portion 20a is sandwiched therebetween. The height of the boss portion is larger than the height of second projecting portion 20a and smaller than the height of second projecting portion 20a plus the height of second heat dissipation sheet 23 before being crushed. By driving the screw into the boss portion, the distance between main circuit board 40 and second projecting portion 20a is decreased and as a result, second heat dissipation sheet 23 is crushed and reliable contact can be maintained.

[0021] A fireproof partitioning sheet metal member 22 is fixed to base sheet metal member 20. Heat spreader 42 is provided with a folded portion 42d. In the state in which control apparatus 1000 is placed on a wall, folded portion 42d is positioned at an upper end of main circuit board 40.

[0022] An electrical component that is connected to power supply system board 33 and undergoes high voltage, such as a connector, is mounted on main circuit board 40. Tracking (ignition) may occur from this mounted component. If tracking (ignition) has occurred from the connector mounted on main circuit board 40, or the like, folded portion 42d functions as a fireproof wall to trap the fire. Fireproof partitioning sheet metal member 22 is positioned on the rear surface side of main circuit board 40 and also functions as a fireproof wall.

[0023] A plate spring component 40c is mounted on main circuit board 40. When heat spreader 42 is fixed to base sheet metal member 20, plate spring component 40c is pressed against heat spreader 42 by coming into contact with the surface of heat spreader 42 that faces main circuit board 40. Accordingly, the height-direction dimension of plate spring component 40c is decreased. By plate spring component 40c being in touch with the facing surface of heat spreader 42, ground connection of main circuit board 40 is enhanced and radiation of noise occurring from an electrical component mounted on main circuit board 40 is reduced. Since heat spreader 42 itself covers main circuit board 40 partially, heat spreader 42 also has a shield function against noise radiation.

[0024] Referring to Figs. 2 and 3, air flow and heat dissipation in control apparatus 1000 according to Embodiment 1 are described next.

[0025] As illustrated in Fig. 2, in the state in which control apparatus 1000 is placed on a wall, air comes into control apparatus 1000 from the plurality of air inlet slits 60c, flows upward through the gap between main circuit board 40 and heat spreader 42, and is discharged out of control apparatus 1000 from the plurality of air outlet slits 60d. The heat generated at first heating element 40a is transferred to first projecting portion 42a through first heat dissipation sheet 41 and diffused to heat spreader 42. The heat diffused to heat spreader 42 is dissipated out of control apparatus 1000 by the air flow. The heat dissipation performance is enhanced by first projecting portion 42a being hit by wind. A side surface of the drawn shape of first projecting portion 42a is arranged substantially perpendicular to the direction of the wind. By the wind colliding with the side surface of the drawn shape of first projecting portion 42a, the heat of first heating element 40a transferred to first projecting portion 42a through first heat dissipation sheet 41 is removed.

[0026] First projecting portion 42a includes the lower surface on which first heat dissipation sheet 41 is disposed, and at least two first side surfaces connecting the lower surface and a main surface of heat spreader 42. One first side surface of the at least two first side surfaces is arranged substantially perpendicular to the direction of the wind passing through the gap between main circuit board 40 and heat spreader 42.

[0027] The one first side surface of the at least two first side surfaces includes a first side connected to the lower surface, a second side connected to the main surface of heat spreader 42, and a third side connected to the first side and the second side and connected to the other first side surface of the at least two first side surfaces. The second side is longer than the first side.

[0028] As illustrated in Fig. 3, air comes into control apparatus 1000 from the plurality of air inlet slits 60c, flows upward through the gap between main circuit board 40 and base sheet metal member 20, and is discharged out of control apparatus 1000 from the plurality of air outlet slits 60d. The heat generated at second heating element 40b is transferred to second projecting portion 20a through second heat dissipation sheet 23 and diffused to base sheet metal member 20. The heat diffused to base sheet metal member 20 is dissipated out of control apparatus 1000 by the air flow. The heat dissipation performance is enhanced by second projecting portion 20a being hit by wind. A side surface of the drawn shape of second projecting portion 20a is arranged substantially perpendicular to the direction of the wind. By the wind colliding with the side surface of the drawn shape of second projecting portion 20a, the heat of second heating element 40b transferred to second projecting portion 20a through second heat dissipation sheet 23 is removed.

[0029] Second projecting portion 20a includes the upper surface on which second heat dissipation sheet 23 is disposed, and at least two second side surfaces connecting the upper surface and a main surface of base sheet metal member 20. One second side surface of the at least two second side surfaces is arranged substantially perpendicular to the direction of the wind passing through the gap between main circuit board 40 and heat spreader 42.

[0030] The one second side surface of the at least two second side surfaces includes a fourth side connected to the upper surface, a fifth side connected to the main surface of base sheet metal member 20, and a sixth side connected to the fourth side and the fifth side and connected to the other second side surface of the at least two second side surfaces. The fifth side is longer than the fourth side.

[0031] The gap between main circuit board 40 and heat spreader 42 is narrower than the gap between main circuit board 40 and base sheet metal member 20. The height of first projecting portion 42a is smaller than the height of second projecting portion 20a. When the same amount of wind enters each gap, the wind velocity in the gap between main circuit board 40 and heat spreader 42 is higher than the wind velocity in the gap between main circuit board 40 and base sheet metal member 20 because the gap between main circuit board 40 and heat spreader 42 is narrower than the gap between main circuit board 40 and base sheet metal member 20. Accordingly, the heat dissipation performance on the side of first heating element 40a thermally severer can be enhanced.

[0032] Functions and effects of control apparatus 1000 according to Embodiment 1 are described next. In control apparatus 1000 according to Embodiment 1, first heat dissipation sheet 41 is in contact with first heating element 40a and first projecting portion 42a, and second heat dissipation sheet 23 is in contact with second heating element 40b and second projecting portion 20a. Thus, the heat generated at first heating element 40a can be transferred to first projecting portion 42a through first heat dissipation sheet 41 and the heat generated at second heating element 40b can be transferred to second projecting portion 20a through second heat dissipation sheet 23. Thus, heat trapping inside control apparatus 1000 can be inhibited. Accordingly, an efficient cooling configuration can be achieved. In addition, first heating element 40a is mounted on front surface FS of main circuit board 40 and second heating element 40b is mounted on rear surface RS of main circuit board 40. Thus, thinning can be achieved in comparison with an instance where main circuit board 40 would be folded. Accordingly, control apparatus 1000 that can achieve an efficient cooling configuration and thinning is provided.

[0033] In control apparatus 1000 according to Embodiment 1, main circuit board 40 and structure ST are structured so that air flows through, between main circuit board 40 and structure ST, from the plurality of air inlet slits 60c to the plurality of air outlet slits 60d. Thus, the heat dissipated from first heating element 40a to first projecting portion 42a through first heat dissipation sheet 41 and the heat dissipated from second heating element 40b to second projecting portion 20a through second heat dissipation sheet 23 can be cooled by the air flowing through, between main circuit board 40 and structure ST, from the plurality of air inlet slits 60c to the plurality of air outlet slits 60d.

[0034] In addition, control apparatus 1000 according to Embodiment 1 allows air to flow through the inside of control apparatus 1000 since control apparatus 1000 is not molded with molding resin. Thus, cooling efficiency can be raised.

[0035] In control apparatus 1000 according to Embodiment 1, structure ST includes heat spreader 42. Heat spreader 42 faces front surface FS of main circuit board 40 and includes first projecting portion 42a. Thus, heat can be diffused by using heat spreader 42.

[0036] In control apparatus 1000 according to Embodiment 1, structure ST includes base sheet metal member 20. Base sheet metal member 20 holds main circuit board 40 and heat spreader 42, faces rear surface RS of main circuit board 40, and includes second projecting portion 20a. Thus, heat can be diffused by using base sheet metal member 20.

[0037] In control apparatus 1000 according to Embodiment 1, the gap between main circuit board 40 and heat spreader 42 is narrower than the gap between main circuit board 40 and base sheet metal member 20. Thus, by varying the respective wind velocities in the gap between main circuit board 40 and heat spreader 42 and the gap between main circuit board 40 and base sheet metal member 20, first heating element 40a and second heating element 40b can be cooled effectively. Accordingly, the heat dissipation performance on the side of first heating element 40a thermally severer can be enhanced.

[0038] In control apparatus 1000 according to Embodiment 1, the height of first projecting portion 42a is smaller than the height of second projecting portion 20a. Thus, the gap between main circuit board 40 and heat spreader 42 can be made narrower than the gap between main circuit board 40 and base sheet metal member 20.

[0039] In control apparatus 1000 according to Embodiment 1, the one first side surface of the at least two first side surfaces is arranged substantially perpendicular to the direction of the wind passing through the gap between main circuit board 40 and heat spreader 42. Further, the one second side surface of the at least two second side surfaces is arranged substantially perpendicular to the direction of the wind passing through the gap between main circuit board 40 and heat spreader 42. Thus, first heating element 40a and second heating element 40b can be cooled effectively.

[0040] In control apparatus 1000 according to Embodiment 1, the second side is longer than the first side in the first side surface of first projecting portion 42a. Further, the fifth side of the second projecting portion is longer than the fourth side thereof in the second side surface of second projecting portion 20a. Thus, first projecting portion 42a and second projecting portion 20a can each have a drawn shape.

[0041] For an air conditioning control apparatus to be placed on a wall, space inside the wall is restricted in many cases, and thinning of the apparatus is required. In control apparatus 1000 according to Embodiment 1, the heat generated at the heating components can be diffused to structure ST facing main circuit board 40 on which the plurality of heating components are mounted and having various other functions. Also, air can flow to a surface of structure ST efficiently. Accordingly, when control apparatus 1000 according to Embodiment 1 is applied to an air conditioning control apparatus, thinning of the air conditioning control apparatus can be achieved.

[0042] Embodiment 2. A control apparatus according to Embodiment 2 has the same features, operations, and functions and effects as those of the control apparatus according to Embodiment 1 unless otherwise stated particularly.

[0043] Referring to Figs. 9 to 13, a configuration of control apparatus 1000 according to Embodiment 2 is described. Fig. 9 is a perspective view illustrating a state in which a housing cover member 60 (see Fig. 14) is removed from a sheet metal outer case 200. As illustrated in Fig. 9, control apparatus 1000 according to Embodiment 2 includes sheet metal outer case 200. In Embodiment 2, a structure ST includes sheet metal outer case 200. Sheet metal outer case 200 is disposed on the front side of control apparatus 1000. Sheet metal outer case 200 includes no display device. Sheet metal outer case 200 holds a main circuit board 40. Main circuit board 40, a heat spreader 42, a transmission system board 51, a power supply system board 33, and a sheet metal case member 30 are fixed to sheet metal outer case 200. Housing cover member 60 is attached to sheet metal outer case 200 (see Fig. 14).

[0044] Fig. 10 is a perpendicular cross-sectional perspective view in a central position of a first heating element 40a. Fig. 11 is an enlarged view around first heating element 40a in Fig. 10. As illustrated in Figs. 10 and 11, heat spreader 42 faces a front surface FS of main circuit board 40. Heat spreader 42 includes a first projecting portion 42a. First projecting portion 42a projects toward first heating element 40a. A first heat dissipation sheet 41 is sandwiched between first heating element 40a and first projecting portion 42a. First heat dissipation sheet 41 is in contact with first heating element 40a and first projecting portion 42a. The heat generated at first heating element 40a is transferred to first projecting portion 42a of heat spreader 42 through first heat dissipation sheet 41 and diffused to a surface of heat spreader 42.

[0045] Fig. 12 is a perpendicular cross-sectional perspective view in a central position of a second heating element 40b. Fig. 13 is an enlarged view around second heating element 40b in Fig. 12. As illustrated in Figs. 12 and 13, sheet metal outer case 200 faces a rear surface RS of main circuit board 40. Sheet metal outer case 200 includes a second projecting portion 20a. Second projecting portion 20a projects toward second heating element 40b. A second heat dissipation sheet 23 is sandwiched between second heating element 40b and second projecting portion 20a. Second heat dissipation sheet 23 is in contact with second heating element 40b and second projecting portion 20a. The heat generated at second heating element 40b is transferred to second projecting portion 20a of sheet metal outer case 200 through second heat dissipation sheet 23 and diffused to a surface of sheet metal outer case 200.

[0046] Referring to Figs. 14 and 15, a state is described in which control apparatus 1000 according to Embodiment 2 is attached to a sheet metal bracket member 120.

[0047] Fig. 14 is a perpendicular cross-sectional perspective view in a central position of second heating element 40b in the state in which sheet metal outer case 200 is attached to sheet metal bracket member 120. Fig. 15 is an enlarged view around second heating element 40b. The arrows in Figs. 14 and 15 indicate the flow of heat. As illustrated in Figs. 14 and 15, sheet metal outer case 200 is attached to sheet metal bracket member 120. Sheet metal bracket member 120 is fixed to a metal wall material 3000a (see Fig. 16) of a control panel 3000 with a screw 501.

[0048] The heat generated at second heating element 40b is transferred to second projecting portion 20a of sheet metal outer case 200 through second heat dissipation sheet 23 and diffused to sheet metal outer case 200. The heat transferred downward is transferred to a surface of sheet metal bracket member 120 through a contact portion between sheet metal outer case 200 and sheet metal bracket member 120.

[0049] Referring to Figs. 16 and 17, a state is described in which control apparatus 1000 according to Embodiment 2 is placed on control panel 3000.

[0050] Fig. 16 is a cross-sectional view of control panel 3000 in the state in which control apparatus 1000 is placed on control panel 3000. Further, Fig. 17 is a front view of control panel 3000 in the state in which control apparatus 1000 is placed on control panel 3000. For convenience of description, a front lid of control panel 3000 is not illustrated in Fig. 17. As illustrated in Figs. 16 and 17, sheet metal bracket member 120 is attached to metal wall material 3000a in control panel 3000. As indicated by the arrows in Fig. 16, the heat transmitted to sheet metal bracket member 120 is transmitted to metal wall material 3000a having a large area.

[0051] Although control panel 3000 accommodates four control apparatuses 1000 in the present embodiment, the number of control apparatuses 1000 is not limited to four.

[0052] Functions and effects of control apparatus 1000 and control panel 3000 according to Embodiment 2 are described next.

[0053] In control apparatus 1000 according to Embodiment 2, structure ST includes sheet metal outer case 200. Sheet metal outer case 200 holds main circuit board 40, faces rear surface RS of main circuit board 40, and includes second projecting portion 20a. Thus, heat can be diffused by using sheet metal outer case 200.

[0054] Control panel 3000 according to Embodiment 2 includes sheet metal bracket member 120 to which sheet metal outer case 200 of control apparatus 1000 is attached, and metal wall material 3000a to which sheet metal bracket member 120 is attached. Thus, heat can be diffused through the route of sheet metal outer case 200, sheet metal bracket member 120, and metal wall material 3000a.

[0055] In control panel 3000 where an air conditioning control apparatus is placed, the heat of the heating components mounted on main circuit board 40 can be diffused through the route of structure ST, sheet metal outer case 200, sheet metal bracket member 120, and control panel 3000 that correspond to main circuit board 40. Even when a large number of heating components are mounted on main circuit board 40, heat trapping inside control apparatus 1000 can be inhibited. Thus, an efficient cooling configuration can be achieved. Accordingly, when control apparatus 1000 according to Embodiment 2 is applied to an air conditioning control apparatus, an efficient cooling configuration can be achieved.

[0056] It should be understood that the herein-disclosed embodiments are presented by way of illustration and example in every respect and are not to be taken by way of limitation. The scope of the present disclosure is not defined by the description above but is defined by the claims, and is intended to include all changes within the purport and scope equivalent to the claims. REFERENCE SIGNS LIST

[0057] 1 display device; 8 housing member; 20 base sheet metal member; 20a second projecting portion; 22 fireproof partitioning sheet metal member; 23 second heat dissipation sheet; 30 sheet metal case member; 33 power supply system board; 40 main circuit board; 40a first heating element; 40b second heating element; 40c plate spring component; 41 first heat dissipation sheet; 42 heat spreader; 42a first projecting portion; 42d folded portion; 51 transmission system board; 60 housing cover member; 60c air inlet slit; 60d air outlet slit; 120 sheet metal bracket member; 200 sheet metal outer case; 403, 404, 501 screw; 1000 control apparatus; 3000 control panel; 3000a metal wall material; FS front surface; RS rear surface; ST structure.

Claims

1. A control apparatus comprising:a main circuit board including a front surface and a rear surface;a first heating element mounted on the front surface of the main circuit board;a second heating element mounted on the rear surface of the main circuit board;a structure including a first projecting portion projecting toward the first heating element, and a second projecting portion projecting toward the second heating element;a first heat dissipation sheet sandwiched between the first heating element and the first projecting portion; anda second heat dissipation sheet sandwiched between the second heating element and the second projecting portion, whereinthe first heat dissipation sheet is in contact with the first heating element and the first projecting portion, andthe second heat dissipation sheet is in contact with the second heating element and the second projecting portion.

2. The control apparatus according to claim 1, further comprisinga housing cover member in which a plurality of air inlet slits and a plurality of air outlet slits are provided, whereinthe housing cover member covers the main circuit board, the first heating element, the second heating element, the structure, the first heat dissipation sheet, and the second heat dissipation sheet,the first heating element, the second heating element, the first heat dissipation sheet, and the second heat dissipation sheet are disposed between the main circuit board and the structure, andthe main circuit board and the structure are structured so that air flows through, between the main circuit board and the structure, from the plurality of air inlet slits tothe plurality of air outlet slits.

3. The control apparatus according to claim 1 or 2, whereinthe structure includes a heat spreader, andthe heat spreader faces the front surface of the main circuit board and includes the first projecting portion.

4. The control apparatus according to claim 3, whereinthe structure includes a base sheet metal member, andthe base sheet metal member holds the main circuit board and the heat spreader, faces the rear surface of the main circuit board, and includes the second projecting portion.

5. The control apparatus according to claim 4, wherein a gap between the main circuit board and the heat spreader is narrower than a gap between the main circuit board and the base sheet metal member.

6. The control apparatus according to claim 5, wherein a height of the first projecting portion is smaller than a height of the second projecting portion.

7. The control apparatus according to claim 5, whereinthe first projecting portion includes a lower surface on which the first heat dissipation sheet is disposed, and at least two first side surfaces connecting the lower surface and a main surface of the heat spreader,one first side surface of the at least two first side surfaces is arranged substantially perpendicular to a direction of wind passing through the gap between the main circuit board and the heat spreader,the second projecting portion includes an upper surface on which the secondheat dissipation sheet is disposed, and at least two second side surfaces connecting the upper surface and a main surface of the base sheet metal member, andone second side surface of the at least two second side surfaces is arranged substantially perpendicular to a direction of wind passing through the gap between the main circuit board and the heat spreader.

8. The control apparatus according to claim 7, whereinthe one first side surface of the at least two first side surfaces includes a first side connected to the lower surface, a second side connected to the main surface of the heat spreader, and a third side connected to the first side and the second side and connected to the other first side surface of the at least two first side surfaces,the second side is longer than the first side,the one second side surface of the at least two second side surfaces includes a fourth side connected to the upper surface, a fifth side connected to the main surface of the base sheet metal member, and a sixth side connected to the fourth side and the fifth side and connected to the other second side surface of the at least two second side surfaces, andthe fifth side is longer than the fourth side.

9. The control apparatus according to claim 1, further comprisinga sheet metal outer case, whereinthe structure includes the sheet metal outer case, andthe sheet metal outer case holds the main circuit board, faces the rear surface of the main circuit board, and includes the second projecting portion.

10. A control panel comprising:the control apparatus according to claim 9;a sheet metal bracket member to which the sheet metal outer case of the controlapparatus is attached; anda metal wall material to which the sheet metal bracket member is attached.

Citation Information

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