Thermal hub for cooling electronic systems

Abstract

A thermal hub (1) for transferring heat from at least a heat generating device (2) to a cooling module (3) in an electronic system, the thermal hub (1) comprising a main body (4), a plurality of connector ports (5) arranged on the main body (4), each connector port (5) comprising a coupling interface (6) for being coupled in a removable way with the heat generating device (2) or with the cooling module (3), and at least a heat transfer element (7) connecting the connector ports (5) to each other to transfer and distribute heat from one port (5) to another port (5). The invention also relates to a modular heat distributing system and a method for distributing and dissipating heat in electronic systems.

Description

The present invention relates to a thermal hub , or a heat distribution apparatus for transferring heat from at least a heat generating device to a cooling module. Also, the present invention relates to a modular heat distributing system comprising said thermal hub or apparatus. In addition, the present invention relates to a method for distributing and dissipating heat in electronic systems using said thermal hub or said modular heat distributing system. The use of computing devices is constantly increased in recent times, these devices being basically employed in any fields of technology, such as urban farms and video analytics applications. The performance of these devices and the amount of data to be processed increase despite a continuous request in reducing the dimensions. The computing devices can be for example data center, edge Al, high performance computing, motor drive, edge Al computing comprising micro controller units (MCUs), graphic process units (GPUs) and Neural Process Units (NPUs). One issue related to these devices is the production of heat. Heat producing devices include, but not are not limited to, semiconductor electronics like high-performance processor (CPU, GPU, NPU), high-power transistor like Gallium-nitride MOSFET, or laser emitter in fiber optics system. During the design phase of the print circuit board, the amount of heat produced by these devices influence their placement density within an enclosure. Often, heatsinks had to be attached to each heat-producing devices to remove heat-spot locally. Such heat sinks occupy space and restricts the number of such devices that can be placed within the module. Each heatsink needs to be spaced apart for effective cooling of the devices, thereby further increasing the size of the enclosure. Examples of the present disclosure seek to address or at least alleviate the above problems. In a first aspect, there is provided a thermal hub for transferring heat from at least a heat generating device to a cooling module in an electronic system, the thermal hub (1) comprising: a main body; a plurality of connector ports arranged on the main body, each connector port comprising a coupling interface for being coupled in a removable way with the heat generating device or with the cooling module, and at least a heat transfer element connecting the connector ports to each other to transfer and distribute heat from one port to another port. In a second aspect, there is provided a modular heat distributing system for distributing and dissipating heat in electronic systems, comprising: a thermal hub according to the first aspect comprising a first connector port and a second connector port; at least a heat generating device coupled to the first connector port of the thermal hub; and at least a cooling module coupled to the second connector port of the thermal hub. In a third aspect, there is provided a method for distributing and dissipating heat in electronic systems using the thermal hub according to the first aspect or the modular heat distributing system according to the second aspect, the method comprising coupling at least one connector port of the thermal hub to a heat generating device and at least another connector port of the thermal hub to a cooling module Other aspects and features are defined in the appended claims. Examples of the disclosure may provide a hub able to transfer heat from a heat generating device to a cooling element that is efficient and simple to realize. In particular, examples of the disclosure may provide a thermal hub able to optimize the thermal design at a system level, thereby optimizing the cooling process of modular heat generating electronics and devices. In addition, examples of the disclosure may provide a thermal hub able to reduce the size of the electronics devices and to allow redundancy in cooling modules for reduced continuous operation risk and serviceability. The term “hub" is intended here as an apparatus comprising a plurality of ports (at least two) to be connected each to one device. The hub serves to extend the functionality of one (or more) device(s) connected to one (or more) port(s) to another (or other) device(s) connected to another (other) port(s) of the hub. Due to the structural characteristics of the present thermal hub, this apparatus can provide a heat transfer from a region (e.g. at a device generating heat) to another region (e.g. at a cooling module) so that the cooling functionality of the cooling module can be used and extended to any device generating heat that is connected to the thermal hub. In other words, the thermal hub is intended as an apparatus for transferring and distributing heat from one region (e.g. inside a device housing) to another region (e.g. outside the device housing). Examples of the disclosure will now be described by way of example only with reference to the accompanying drawings, in which like references refer to like parts, and in which: Figure 1 is a schematic representation of the thermal hub and of the modular heat distributing system according to an example; and Figure 2 is a schematic representation of the thermal hub and of the modular heat distributing system according to another example; A thermal hub, a modular heat distributing system and a method for distributing and dissipating heat in electronic systems are disclosed. In the following description, a number of specific details are presented in order to provide a thorough understanding of the examples of the disclosure. It will be apparent however to a person skilled in the art that these specific details need not be employed in order to practice the examples of the disclosure. Conversely, specific details known to the person skilled in the art are omitted for the purposes of clarity in presenting the examples. Figure 1 schematically illustrates a thermal hub 1 that is used to extract heat from one or more devices 2 and to conduct extracted heat to one or more cooling modules 3. It is noted that the device 2 can be located inside a housing 13 or device enclosure. In this way, the thermal hub 1 is configured to provide heat passage from inside to outside the housing 13 of the device 2. The direction of the heat transfer is schematically illustrated with arrows in the figure. In a basic configuration, the thermal hub 1 comprises a main body 4 provided with a plurality of connector ports 5. The connector ports 5 serve to connect the thermal hub 1 to one or more heat generating devices 2 or to one or more cooling modules 3. It is noted that each connector port 5 is configured to be equally coupled with a heat generating device 2 or with a cooling module 3. The coupling takes place at the coupling interface 6 of the connector port 5 and in a removable way. Therefore, a heat generating device 2 can be connected to, and disconnected from, one connector port 5 so that the same connector port 5 can be successively used to connect a different heat generating device 2 or even a cooling module 3. This makes the present thermal hub extremely flexible in terms of combination of devices / modules that can be attached thereto. In order to transfer and distribute heat from one connector port 5 to another connector port 5, the thermal hub 1 also comprises a heat transfer element 1 configure to connect the connector ports 5 to each other. The main body 4 is provided with a plurality of connector ports 5. As shown in the figure, the thermal hub 1 comprises nine connector ports 5, wherein three ports 5 are each coupled to a heat generating device 2 and two ports 5 are each coupled to a cooling module 3. Accordingly, it is not necessary that all the ports 5 are coupled to a device. As a matter of fact, based in the circumstances, some of the ports can be free of coupling (for example four ports in the figure). In one example, the connector ports 5 are arranged along at least a row on the many body 4. Based also on the form and dimensions of the hub 1, the connector ports 5 can be arranged differently, for example along several rows in order to form a grid on the main body 4 of the hub 1. Other arrangements of the connector ports 5 are also conceivable based on the structural requirements of the system. As shown in figure 1, the connector ports 5 can be arranged only on one side of the main body 4. For example, the main body 4 can have a first side (upper side in the figure) and a second side opposite to the first side (lower side in the figure). Accordingly, the connector ports 5 are arranged only on the first side or on the second side. Alternatively, the connector ports 5 can be arranged on both sides of the main body, i.e. partly on the first side and partly on the second side. Each connector port 5 comprises a coupling interface 6 that is configured to be coupled in a removable way with the device 2 and / or the cooling module 3. Advantageously, the coupling (i.e. attaching and detaching) occurs without big efforts. For example, the coupling interface 6 can be configured such that the coupling mechanism between the thermal hub 1 (i.e. the connector port 5 of the thermal hub 1) and the heat generating device 2 (and / or the cooling module 3) occurs through an insertion / extraction mechanism, without the necessity of permanently fixing the thermal hub 1 to said components, for example using screws or other fastening means. The connector port 5 (or a component of the connector port 5) can be a plug element that is insertable into a housing 13 or a case 15 for extracting heat from a device 2 located inside said housing 13 and / or the case 15. Therefore, the coupling interface 6 can comprise a plug-in junction, a snap-fit junction or another type of junction allowing an easy attachment to, and detachment from, the device 2 (or the housing 13 / case 15 of the device 2), without the need of fixing elements, like screws. For this purpose, the coupling interface 6 can comprise coupling elements (not shown in the figure). In a simple configuration, the coupling interface 6 comprises at least a protrusion that is insertable in the housing 13 and / or case 15 of the device 2. Coupling elements can comprise pins, clips, clamps, or the like. It is noted that the main body 4 of the thermal connector 1 can directly be coupled to the housing 13. Alternatively, the main body 4 can be indirectly coupled to the housing 13 of the device 2, i.e. using an interposed element that is fixable to the housing 13. Same considerations also apply as regards the coupling between the connector port 5 and the cooling module 3. In particular, the main body 4 can comprise a plurality of recess regions 9 at the connector ports 5. Accordingly, each heat generating device 2 and each cooling module 3 can be - at least partially - inserted into such recesses 9 in order to be coupled with the main body 4 of the thermal hub 1. In one example, the coupling interface 6 is located inside the recess region 9. For example, the coupling interface 6 can be at least a wall portion of the main body 4, in particular of the recess region 9. As shown in figure 1, the coupling interface 6 can be one internal wall of the recess region 9 at the connector port 5. As mentioned above, the heat transfer element 7 serves to thermally connect the plurality of connector ports 5 of the thermal hub 1. For this purpose, the heat transfer element 7 can extend longitudinally along the main body 4. In other words, the heat transfer element 7 can be a single element, for example a single pipe or tube, extending from one connector port 5 to another connector port 5 (i.e. extending below the recess region 9 of each connector port 5). The heat transfer element 7 can be also a combination of several components (pipes or tubes) connected to each other to form a heat transfer structure (or grid) extending along the main body 4 of the thermal hub 1. The heat transfer element 7 serves to conduct heat through the main body 4 from one port to another, in particular from one heat generating device 2 to a cooling module 3. For this purpose, the heat transfer element 7 can be made of a material having high heat conductivity. For example, the heat transfer element 7 can comprise copper or aluminum or suitable heat conducting materials. To favor the heat transfer, the heat transfer element 6 can comprise at least a heat pipe and / or a vapor chamber. For example, a heat pipe can extend along the main body 4 from one connector port 5 to another connector port 5. In examples, each connector port 5 comprises a thermal coupling element 8 connected to the heat transfer element 7 and configured to couple said heat transfer element 7 with the heat generating device 2 or with the cooling module 3. The thermal coupling element 8 can be an extension of the heat transfer element 7. As shown in figure 1, the thermal coupling element 8 can be located at each recess region 9 of the connector port 5, for example at the bottom wall of said recess region 9. Specifically, the thermal coupling element 8 can be located at the coupling interface 6 of each port 5 to facilitate the heat exchange between the heat transfer element 7 and the heat generating device 2 and / or the cooling module 3. In examples, the thermal hub 1 further comprises a power transfer element connecting the connector ports 5 to each other so that each connector port 5 is a power connector. In other words, each connector port 5 in addition to allow a heat transfer from one port to another, can also allow a transfer of power from one port to another port. This increases the modularity and flexibility of this hub 1 since each connector port can be used to transfer electricity to the attached devices, rather than transferring only heat. In alternative or in addition, the thermal hub 1 further comprises a signal transfer element connecting the connector ports 5 to each other so that each connector port 5 is a signal connector. In other words, each connector port 5 in addition to allow a heat transfer (and eventually power transfer) from one port to another, can also allow a transfer of signal from one port to another port, thereby increasing the modularity and flexibility of the hub even more. As a matter of fact, some connector ports 5 can be used to transfer heat from a heat generating device 2 to a cooling module 3, other ports 5, on the other hand, can be used to transfer electricity and / or signals. Of course, the same port 5 used for heat transfer and, at the same time, can be used to transfer power and / or signals to the corresponding attached devices. A modular heat distributing system 12 for distributing and dissipating heat in electronic systems can be shown in figure 1. This system, depicted with a dashed line in the figure, comprises the thermal hub 1 comprising nine connector ports 5 arranged on the main body 1 of the hub 1, three heat generating devices 2 and two cooling modules 3. It is noted that one heat generating device 2 is located inside a housing 13. In one example, the coupling interface 6 is coupled in a removable way with said housing 13 of the device 2. The three heat generating devices 2 are coupled each to one of three connector ports 5, for example the first, the second, and the third connector port. The two cooling modules 3 are coupled each to one of two connector ports 5, for example the eighth and the nineth connector port. The fourth, the fifth, the sixth and the seventh connector ports are coupling free. By using the present hub 1 in the modular heat distributing system 12, heat generated from heat sources (like the devices 2) can be removed by energy-efficient cooling modules 3 attached to the hub 1. As mentioned, the thermal hub 1 is configured to accept multiple cooling modules 3 to accommodate different cooling load and requirement. For example, the total heat extraction capacity could be designed as 20W consisting of 2 units of 10W heat extractor. Sufficient cooling module 3 could be activated according to the cooling requirement. If less than 10W of heat is added to the hub 1, only one cooling module 3 is activated, thus making the modular heat distributing system 12 more energy efficient. In another example, the two cooling modules 3 could be each a passive heatsink providing 20W of heat extraction capacity. A system 12 could be designed to operate at half the maximum heat load most of the time, with peak heat load at 20W. While operating at half the heat load, the system will be cooled with the 20W passive heat extraction, thereby reducing the operating temperature, extending the shelf-life of the devices 2 significantly, beyond the designed shelf-life. Additional benefits of redundant cooling modules 3 include the reduced risk failures and allowing room for continuous operation while maintenance is performed on one of the cooling modules 3. Figure 2 illustrates a thermal hub 1 and a modular heat distributing system 13 according to a different embodiment. In particular, the main body 4 of the hub 1 comprises five connector ports 5, wherein two connector ports 5, for example the first and the second port, are coupled to two heat generating devices 2, respectively. Other two connector ports, for example the fourth and the fifth port, are coupled to two cooling modules 3, respectively. It is noted that each heat generating device 2 is located inside a housing 13. In examples, the thermal coupling element 7 of each connector port 5 comprises a protruding portion 10 extending along the recess region 9. In particular, the protruding portion 9 of the thermal coupling element 7 is configured to be coupled to a heat collecting element 11 for collecting heat generated by the device 2 or for transferring heat to the cooling module 3, once the connector port 5 is coupled with the heat generating device 2 or with the cooling module 3, respectively. Specifically, the heat generating device 2 can be coupled to the respective connector port 5 through a device heat collecting element 11A ,whereas the cooling module 3 can be coupled to the second connector port 5 through a module heat collecting element 11B. As shown in figure 2, both the heat generating device 2 and the cooling module 3 are provided with a case 15 connected to the respective device heat collecting element 11A and the module heat collecting element 11B to facilitate the coupling to the connector ports 5 of the hub 1. The heat generating device 2 is positioned on a print circuit board 14. The device 2 generates heat and is in contact with the device heat collecting element 11A to collect and transport heat away from the device 2. The heat collecting element 11A is an elongated element, for example a heat pipe, extending from the device 2 to the edge of the housing 13 passing through the case 15. In a uncoupled configuration (in the figure), the main body 4 of the thermal hub 1 is separated from the heat generating device 2 and therefore from the housing 13. In the coupled configuration (not shown in the figure), on the other hand, the thermal hub 1 is connected to the heat generating device 2, i.e. to the housing 13, and device 2 (housing 13) is inserted into the recess region 9. In particular, the protruding portion 10 at the connector port 5 is inserted into a cavity of the case 15 and the device heat cooling element 11A comes into contact with said protruding portion 10 and to the thermal coupling element 8. As long as the connector port 5 is coupled to the heat generating device 2 (i.e. housing 13), heat produced at the device 2 is conducted outside the housing 13 through the thermal hub 1 to the cooling module 3. Such type of thermal hub 1 is configured to cool the device 2 by transferring heat from the device 2 and PCB 14 to outside the housing 13. Heat can then be dissipated outside the housing 13 with a cooling module 3 such as heat sink, radiative cooling, heat convection, and other means. The device 2 generates heat and is in contact with the device heat collecting element 11A to collect and transport heat away from the device 2. The device heat collecting element 11A is an elongated element, for example a heat pipe, extending from the device 2 to the edge of the housing 13 passing through the case 15. In an uncoupled configuration (in the figure), the main body 4 of the thermal hub 1 is separated from the heat generating device 2 and therefore from the housing 13. In the coupled configuration (not shown in the figure), on the other hand, the thermal hub 1 is connected to the heat generating device 2, i.e. to the housing 13, and device 2 (housing 13) is inserted into the recess region 9. In particular, the protruding portion 10 at the connector port 5 is inserted into a cavity of the case 15 and the device heat cooling element 11A comes into contact with said protruding portion 10 and to the thermal coupling elements. As long as the connector port 5 is coupled to the heat generating device 2 (i.e. housing 13), heat produced at the device 2 is conducted outside the housing 13 through the thermal hub 1 to the cooling module 3. The cooling module 3 dissipate heat and is in contact with the module heat collecting element 11B to collect and transport heat. The module heat collecting element 11B is an elongated element, for example a heat pipe, extending inside the cooling module 3 to passing through the case 15. In an uncoupled configuration (in the figure), the main body 4 of the thermal hub 1 is separated from the cooling module 3. In the coupled configuration (not shown in the figure), on the other hand, the thermal hub 1 is connected to the cooling module 3, and the module 3 is inserted into the recess region 9. In particular, the protruding portion 10 at the connector port 5 is inserted into a cavity of the case 15 and the module heat cooling element 11B comes into contact with said protruding portion 10 and to the thermal coupling element 8. As long as the connector port 5 is coupled to the cooling module 3, heat produced at the device 2 is conducted outside the housing 13 through the thermal hub 1 and is received by the cooling module 3. Such type of thermal hub 1 is configured to cool the device 2 by transferring heat from the device 2 and PCB 14 to outside the housing 13. Heat can then be dissipated outside the housing 13 with a cooling module 3 such as heat sink, radiative cooling, heat convection, and other means. It is noted that the system 12 is designed such that the heat collecting element 11 (both the device collecting element 11A and the module collecting element 11B) and the coupling interface 6 of the connector port 5 (i.e. the protruding portion 10 and thermal coupling element 8) can be mechanically disconnected in such a way that externally exerted pressure or movement on hub 1 does not cause misalignment or delamination of heat collecting element 11 from the device 2 (i.e. heat source). In other words, external forces exerted on the on the main body 4 of the thermal hub 1 do not affect the connection between the device 2 and hub 1. This is to avoid the cantilever effect causing poor connection between the heat collecting element 11 and the device 2. Similar considerations also apply to the coupling between the cooling module 3 and the thermal hub 1. By using the present thermal hub 1 and modular heat distributing system 12 it is possible to dissipate heat outside the device’s enclosure. This leads to a more effective cooling with external cooling solution, a simpler device’s design (housing) since can be made smaller, an increased waterproofing of device due to a complete sealing, a more energy efficient cooling system that leverage cooler external ambient temperature outside the housing than the recirculating hot air inside the housing, a more dynamic cooling option when power is connected, and a longer electronics longevity with less thermal aging. The additional benefit of this system 12 is that heat generated within a device enclosure 5 can be transmitted to an external, centralized cooling modular through the thermal hub 1. This reduces the size of each heat producing device 2 and simplify the thermal design of the device. Further, the centralized cooling module can be made more energy efficiency providing a more energy-efficient system-level cooling to remove heat from all devices 2 attached. 10 The present thermal hub 1 or modular heat distributing system 12 can advantageously be used at least for data center servers, edge Al devices, industrial PC, high performance computing, and heat generating motors. Although a variety of techniques and examples of such techniques have been described 15 herein, these are provided by way of example only and many variations and modifications on such examples will be apparent to the skilled person and fall within the spirit and scope of the present invention, which is defined by the appended claims and their equivalents. Reference signs 1. Thermal hub 2. Heat generating device 3. Cooling module 4. Main body 5. Connector ports 6. Coupling interface 7. Heat transfer element 8. Thermal coupling element 9. Recess region 10. Protruding portion 11. Heat collecting element 11 A. Device heat collecting element 11B. Module heat collecting element 12. Modular heat distributing system 13. Housing 14. Printed circuit board 15. Case

Claims

1. Thermal hub (1) for transferring heat from at least a heat generating device (2) to a cooling module (3) in an electronic system, the thermal hub (1) comprising:a main body (4);a plurality of connector ports (5) arranged on the main body (4), each connector port (5) comprising a coupling interface (6) for being coupled in a removable way with the heat generating device (2) or with the cooling module (3), andat least a heat transfer element (7) connecting the connector ports (5) to each other to transfer and distribute heat from one port (5) to another port (5).

2. Thermal hub (1) according to claim 1, wherein the heat transfer element (7) extends longitudinally along the main body (4).

3. Thermal hub (1) according to any one of claims 1 to 2, wherein:a. the heat transfer element (7) is made of a material having high heat conductivity, in particular comprising copper or aluminum; and / orb. the heat transfer element (7) comprises at least a heat pipe and / or a vapor chamber.

4. Thermal hub (1) according to any one of claims 1 to 3, wherein each connector port (5) comprises a thermal coupling element (8) connected to the heat transfer element (7) and configured to couple said heat transfer element (7) with the heat generating device (2) or with the cooling module (3).5, Thermal hub (1) according to any one of claims 1 to 4, wherein the main body (4) comprises a plurality of recess regions (9) at the connector ports (5).

6. Thermal hub (1) according to claim 4 and 5, wherein the thermal coupling element (7) of each connector port (5) comprises a protruding portion (10) extending along the recess region (9).

7. Thermal hub (1) according to claim 6, wherein the protruding portion (9) of the thermal coupling element (7) is configured to be coupled to a heat collecting element (11) for collectingheat generated by the device (2) or for transferring heat to the cooling module (3), once the connector port (5) is coupled with the heat generating device (2) or with the cooling module (3), respectively.

8. Thermal hub (1) according to any one of claims 1 to 7, wherein:a. the connector ports (5) are arranged along at least a row on the many body (4); and / orb. the connector ports (5) are arranged only on one side of the main body (4) or are arranged on both sides of the main body (4).

9. Thermal hub (1) according to any one of claims 1 to 8, further comprising:a. a power transfer element connecting the connector ports (5) to each other so that each connector port (5) is a power connector; and / orb. a signal transfer element connecting the connector ports (5) to each other so that each connector port (5) is a signal connector.

10. Modular heat distributing system (12) for distributing and dissipating heat in electronic systems, comprising:a thermal hub (1) according to any one of claims 1 to 9 comprising a first connector port (5) and a second connector port (5);at least a heat generating device (2) coupled to the first connector port (5) of the thermal hub (1); andat least a cooling module (3) coupled to the second connector port (5) of the thermal hub (1).

11. Modular heat distributing system (12) according to claim 10, whereina. the cooling module (3) comprises a passive cooling unit, in particular a heat sink with a heat pipe or a radiative cooling element, and / orb. the cooling module (3) comprises an active cooling unit, in particular a heat sink with a fan, a liquid cooling element, or a Peltier module.

12. Modular heat distributing system (12) according to any one of claims 10 to11, wherein:a. the heat generating device (2) is coupled to the first connector port (5) through a device heat collecting element (11 A); and / orb. the cooling module (3) is coupled to the second connector port (5) through a module heat collecting element (11B).

13. Modular heat distributing system (12) according to any one of claims 10 to 12, wherein the heat generating device (2) is at least one of:a. data center server;b. edge Al device;c. industrial computer;d. high performance computing device;e. motor drive; and / orf. a programmable logic controller.

14. Modular heat distributing system (12) according to any one of claims 10 to 13, wherein the heat generating device (2) is located in a housing (13) and the coupling interface (6) is coupled in a removable way with said housing (8) of the device (2).

15. Method for distributing and dissipating heat in electronic systems using the thermal hub (1) according to any one of claims 1 to 9 or the modular heat distributing system according to any one of claims 10 to 14, the method comprising coupling at least one connector port (5) of the thermal hub (1) to a heat generating device (2) and at least another connector port (5) of the thermal hub (1) to a cooling module (3).

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