Chiplet configuration detection and bootstrapping

The method allows chiplets in mSoC packages to determine their roles and communicate effectively, addressing booting uncertainties and reducing external components, enhancing system stability and logistics efficiency.

GB2643760APending Publication Date: 2026-03-04MERCEDES BENZ GROUP AG
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Patent Information

Authority / Receiving Office
GB · GB
Patent Type
Applications
Current Assignee / Owner
Filing Date
2024-09-02
Publication Date
2026-03-04

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Abstract

A multiple-systems-on-chip (mSoC) can include a substrate comprising a plurality of chiplet positions. A main chiplet disposed on the substrate, and one or more secondary chiplets disposed on the subs
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Citation Information

Patent Citations

  • Initialization sequencing of chiplet I / O channels within a chiplet system

    US20220138142A1

  • Multi-chiplet module system, method and device

    US20240330183A1