Thermal insulation unit cover for semiconductor manufacturing equipment

JP1706320SActive Publication Date: 2025-02-04KOKUSAI DENKI KK
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Patent Information

Application Number
JP2021014030D
Authority / Receiving Office
JP · JP
Patent Type
Designs
Current Assignee / Owner
Filing Date
2021-06-28
Publication Date
2025-02-04
Estimated Expiration
2046-06-28

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Abstract

The article of the present application is a cover for covering a heat insulating unit provided at the furnace opening of a reaction tube for processing substrates such as semiconductor wafers.
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