Substrate support for semiconductor manufacturing equipment

JP1706322SActive Publication Date: 2025-02-04KOKUSAI DENKI KK
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Patent Information

Application Number
JP2021018468D
Authority / Receiving Office
JP · JP
Patent Type
Designs
Current Assignee / Owner
Filing Date
2021-08-27
Publication Date
2025-02-04
Estimated Expiration
2046-08-27

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Abstract

The article of the present invention is a substrate support provided in a substrate processing apparatus for processing a plurality of wafers, the substrate support being provided in a processing chamber so as to surround the substrates, and supporting each wafer on pins.
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