Sensor Module

JP1787997SActive Publication Date: 2024-12-26TAIWAN ASIA SEMICONDUCTOR CORPORATION
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Patent Information

Application Number
JP2024014313D
Authority / Receiving Office
JP · JP
Patent Type
Designs
Current Assignee / Owner
Priority Date
2024-01-16
Filing Date
2024-07-11
Publication Date
2024-12-26
Estimated Expiration
2049-07-11

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Abstract

This item is a sensor module that is used on a wearable device and has multiple isosceles trapezoidal photodiodes arranged in a ring, which are used to receive light and convert it into a current or voltage signal.
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