Photosensitive film

JP1803322SActive Publication Date: 2025-07-10RESONAC CORP
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Patent Information

Application Number
JP2024026683D
Authority / Receiving Office
JP · JP
Patent Type
Designs
Current Assignee / Owner
Filing Date
2024-12-24
Publication Date
2025-07-10
Estimated Expiration
2049-12-24

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Abstract

This article is a photosensitive film used for circuit formation of wiring boards such as substrates for semiconductor packages. As shown in the "Reference Enlarged Views of Parts E-E and F-F Indicating the Names of Each Part", this article has a stepped portion formed on the winding core, and the film is wound starting from the stepped portion. As a result, this article can prevent the film from being marked with traces of steps because no step is generated at the portion overlapping the starting end of the film winding.
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