Head cooling device

JP1815991SActive Publication Date: 2026-01-07GENKI LAB CO LTD
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Patent Information

Application Number
JP2025009308D
Authority / Receiving Office
JP · JP
Patent Type
Designs
Current Assignee / Owner
Filing Date
2025-05-12
Publication Date
2026-01-07
Estimated Expiration
2050-05-12

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Abstract

This head cooling device is designed to be wrapped around the user's head to cool the head. The item includes a detachable cover and a cooling pack. The cooling pack of this item has five storage compartments containing PCM cooling material. The five storage compartments of the cooling pack are arranged in a row, and attachment sections with hook surfaces of a hook-and-loop fastener are provided at both ends of the five storage compartments. The cover of this item is made by sewing together stretchable fabric. The front and back sides of the cover's fabric are brushed to allow the hook surfaces of the hook-and-loop fastener to be attached and detached. The cover has an attachment section for attaching the cooling pack and two bands extending from both ends of the attachment section. Both ends of the attachment section of the cover are provided with pouches that fit into the attachment section and part of the storage compartment of the cooling pack. The cooling pack can be attached to the attachment section of the cover even when turned inside out with the bottom facing up. The two bands of the cover are each provided with a hook surface of a hook-and-loop fastener. The article can be kept wrapped around the user's head by connecting the two bands together by adhering the hook-and-loop fastener of one band to the raised surface of the other band.
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