Silanol-containing organic-inorganic hybrid coatings for high-resolution patterning

JP2021534315A5Active Publication Date: 2025-10-22PIBOND OY
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Patent Information

Application Number
JP2021531196
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Priority Date
2018-08-10
Filing Date
2019-08-12
Publication Date
2025-10-22
Estimated Expiration
2039-08-12

AI Technical Summary

Technical Problem

Existing lithographic processes face challenges in achieving high-resolution patterning with minimal metal contamination and improved line edge roughness (LER) and sensitivity, particularly in extreme ultraviolet lithography (EUVL), as current resists suffer from poor etch resistance, pattern instability, and high metal interaction with hydrogen species.

Method used

Development of silanol-containing polyhydridosilsesquioxane resin coatings that incorporate silanol moieties and metal oxide compounds, enhancing sensitivity and solubility through hydrolysis/condensation reactions, allowing for high-resolution patterning with reduced metal interference.

Benefits of technology

The coatings exhibit increased sensitivity and improved LER, enabling high-resolution patterning with reduced metal contamination and simplified lithographic stacks, suitable for EUVL applications.

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Abstract

A silanol-containing organic-inorganic hybrid coating on a semiconductor substrate for forming a pattern thereon. The coating of the present invention can be produced by coating a semiconductor substrate with a metal and silanol-containing polyhydridosilsesquioxane resin solution. Also provided herein is a method for patterning a metal and silanol-containing polyhydridosilsesquioxane-coated substrate with radiation of a specific wavelength of light, the method comprising irradiating the coated substrate in a selected pattern to form an irradiated structure in irradiated and unirradiated areas of the coating, and selectively developing the irradiated structure to remove a substantial portion of the unirradiated coating to form a patterned substrate. The present invention makes it possible to obtain a preselected silanol-containing polyhydridosilsesquioxane resin, and adjusting the silanol content allows for a highly sensitive coating for EUV applications.
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