Multilayer electronic component and method of manufacturing the same

Abstract

To provide a multilayer electronic component having improved capacitance per unit volume.SOLUTION: A multilayer electronic component 1000 includes: a body 110 including a first surface and a second surface facing in a first direction, a third surface and a fourth surface facing in a second direction, and a fifth surface and a sixth surface facing in a third direction; a first external electrode 131 including a first connection portion 131a, a first band portion 131b, and a third band portion 131c, and a second external electrode 132 including a second connection portion 132a, a second band portion 132b, and a fourth band portion 132c; a cover layer 151 disposed on the first and second connection portions and arranged so as to cover the third band portion and the fourth band portion; and a first plating layer 141 disposed on the first band portion and a second plating layer 142 disposed on the second band portion. The cover layer includes a base layer 151a and a second base layer, which have hydrophilicity, and an insulating layer 151b disposed on the base layer.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present invention relates to a multilayer electronic component and a method for manufacturing the same. [Background technology]

[0002] A multilayer ceramic capacitor (MLCC), a type of multilayer electronic component, is a chip-type capacitor that is mounted on the printed circuit boards of various electronic products such as liquid crystal displays (LCDs), plasma display panels (PDPs), computers, smartphones, and mobile phones, and plays the role of charging or discharging electricity.

[0003] Such multilayer ceramic capacitors can be used as components in various electronic devices due to their advantages of being small, yet guaranteeing high capacitance, and being easy to mount. As various electronic devices such as computers and mobile devices become smaller and more powerful, the demand for smaller and higher-capacitance multilayer ceramic capacitors is increasing.

[0004] Furthermore, as industry interest in automotive electronic components has increased in recent years, multilayer ceramic capacitors are also required to have high reliability characteristics for use in automobiles and infotainment systems.

[0005] To miniaturize and increase the capacitance of multilayer ceramic capacitors, it is necessary to form the internal electrodes and dielectric layers thinly and increase the number of layers. This requires minimizing the volume of parts that do not affect capacitance formation and increasing the effective volume fraction necessary to achieve the desired capacitance.

[0006] Furthermore, in order to mount as many components as possible within the limited area of ​​the circuit board, it is necessary to minimize the mounting space.

[0007] Furthermore, as multilayer ceramic capacitors become smaller and their capacitance increases, the margin thickness decreases, making them more susceptible to external moisture and plating solution penetration, which can weaken their reliability. Therefore, one method is to place an insulating layer on the external electrodes to protect the multilayer ceramic capacitor from external moisture and plating solution penetration. However, physical peeling and damage to the insulating layer may occur during polishing and plating processes, and a method to prevent this is needed. [Overview of the project] [Problems that the invention aims to solve]

[0008] One of the various objectives of the present invention is to provide a stacked electronic component with improved capacity per unit volume.

[0009] One of the various objectives of the present invention is to provide a multilayer electronic component with improved reliability.

[0010] One of the various objectives of the present invention is to provide a stacked electronic component that can minimize the mounting space.

[0011] One of the various objectives of the present invention is to provide a multilayer electronic component with excellent bonding strength between a cover layer including an insulating layer and an external electrode.

[0012] However, the object of the present invention is not limited to the above-described content and can be more easily understood in the process of describing specific embodiments of the present invention. [Means for solving the problem]

[0013] A stacked electronic component according to one embodiment of the present invention includes a dielectric layer and first and second internal electrodes arranged alternately on either side of the dielectric layer, and comprises a body including first and second surfaces facing in a first direction, third and fourth surfaces connected to the first and second surfaces and facing in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and facing in a third direction, and a first external electrode including a first connecting portion arranged on the third surface, a first band portion extending from the first connecting portion to a part of the first surface, and a third band portion extending from the first connecting portion to a part of the second surface, and The device includes a second external electrode comprising a second connecting portion located on the fourth surface, a second band portion extending from the second connecting portion to a part of the first surface, and a fourth band portion extending from the second connecting portion to a part of the second surface; a cover layer located on the first and second connecting portions and positioned to cover the second surface and the third and fourth band portions; a first plating layer located on the first band portion; and a second plating layer located on the second band portion, wherein the cover layer may include a hydrophilic base layer and an insulating layer located on the base layer.

[0014] A stacked electronic component according to one embodiment of the present invention includes a dielectric layer and first and second internal electrodes arranged alternately on either side of the dielectric layer, comprising: a body including first and second surfaces facing in a first direction, third and fourth surfaces connected to the first and second surfaces and facing in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and facing in a third direction; a first external electrode including a first connecting portion on the third surface, a first band portion extending from the first connecting portion to a part of the first surface, and a first corner portion extending from the first connecting portion to the corner connecting the second surface and the third surface; a second connecting portion on the fourth surface, a second band portion extending from the second connecting portion to a part of the first surface, and a second corner portion extending from the second connecting portion to the corner connecting the second surface and the fourth surface. The device includes a second external electrode, a cover layer disposed on the first and second connection portions and positioned to cover the second surface and the first and second corner portions, a first plating layer disposed on the first band portion, and a second plating layer disposed on the second band portion, wherein when the average size in the second direction from the extension line of the third surface to the end of the first corner portion is B3, the average size in the second direction from the extension line of the fourth surface to the end of the second corner portion is B4, the average size in the second direction of the region separated from the third surface and the second internal electrode is G1, and the average size in the second direction of the region separated from the fourth surface and the first internal electrode is G2, the conditions B3≦G1 and B4≦G2 are satisfied, and the cover layer may include a hydrophilic base layer and an insulating layer disposed on the base layer.

[0015] A method for manufacturing a stacked electronic component according to one embodiment of the present invention includes the steps of: forming a body including a dielectric layer and internal electrodes; forming external electrodes on the body; plasma treating the outer surface of the external electrodes and the outer surface of the body on which the external electrodes are not formed; forming an insulating layer on the external electrodes; and forming a plating layer in the region of the external electrodes on which the insulating layer is not formed. [Effects of the Invention]

[0016] One of the various effects of the present invention is that by disposing a cover layer on the connection portion of the external electrode and disposing a plating layer on the band portion of the external electrode, the capacitance per unit volume of the multilayer electronic component is improved and the reliability is improved.

[0017] One of the various effects of the present invention is that the mounting space of the multilayer electronic component is minimized.

[0018] One of the various effects of the present invention is that since the cover layer includes a hydrophilic base layer and an insulating layer disposed on the base layer, the bonding force between the external electrode and the insulating layer is improved.

[0019] One of the various effects of the present invention is that since the cover layer includes a hydrophilic base layer and an insulating layer disposed on the base layer, the penetration of moisture and plating solution is prevented, the moisture resistance reliability is improved, and the generation and propagation of cracks are suppressed. <000008*>[^0*]]<000008*>[^1*]]However, the various and beneficial advantages and effects of the present invention are not limited to the above-described content, and can be more easily understood in the process of explaining the specific embodiments of the present invention.

Brief Description of the Drawings

[0021] [Figure 1] It is a perspective view schematically showing a multilayer electronic component according to an embodiment of the present invention. [Figure 2] It is a perspective view schematically showing the main body of the multilayer electronic component of FIG. 1. [Figure 3] It is a cross-sectional view taken along line I-I' of FIG. 1. [Figure 4] It is an exploded perspective view schematically showing the main body of FIG. 2 disassembled. [Figure 5] It is a perspective view schematically showing a substrate on which the multilayer electronic component of FIG. 1 is mounted. [Figure 6] It is a perspective view schematically showing a multilayer electronic component according to an embodiment of the present invention. [Figure 7] It is a cross-sectional view taken along line II-II' of FIG. 6. Note: There seems to be some issue with the tags

[0020] to in the original text as they are not used properly in the context. I've left them as they are but it might be a formatting error in the original. Also, the translation of <000008*>[^0*]] and <000008*>[^1*]] is not clear what the original intention was, so I've just kept them as is. If there's more context available, it would be possible to provide a more accurate translation. [Figure 8] This is a schematic perspective view of a stacked electronic component according to one embodiment of the present invention. [Figure 9] This is a cross-sectional view along the line III-III' in Figure 8. [Figure 10] This is a schematic perspective view of a stacked electronic component according to one embodiment of the present invention. [Figure 11] This is a cross-sectional view along the line IV-IV' in Figure 10. [Figure 12] This is a schematic perspective view of a stacked electronic component according to one embodiment of the present invention. [Figure 13] This is a cross-sectional view along the line V-V' in Figure 12. [Figure 14] This is a schematic perspective view of a stacked electronic component according to one embodiment of the present invention. [Figure 15] This is a cross-sectional view along the line VI-VI' in Figure 14. [Figure 16] This figure shows a modified version of Figure 14. [Figure 17] This is a schematic perspective view of a stacked electronic component according to one embodiment of the present invention. [Figure 18] This is a cross-sectional view along the line VII-VII' in Figure 17. [Figure 19] This is a schematic perspective view of a stacked electronic component according to one embodiment of the present invention. [Figure 20] This is a cross-sectional view along the line VIII-VIII' in Figure 19. [Figure 21] This figure shows a modified example of Figure 19. [Figure 22] This is a schematic perspective view of a stacked electronic component according to one embodiment of the present invention. [Figure 23] This is a cross-sectional view along the line IX-IX' in Figure 22. [Figure 24] This figure shows a modified version of Figure 22. [Figure 25] This is a schematic perspective view of a stacked electronic component according to one embodiment of the present invention. [Figure 26] This is a cross-sectional view along the line X-X' in Figure 25. [Figure 27] This figure shows a modified version of Figure 25. [Figure 28] This is a schematic perspective view of a stacked electronic component according to one embodiment of the present invention. [Figure 29] This is a cross-sectional view along the line XI-XI' in Figure 28. [Figure 30] This figure shows a modified version of Figure 28. [Figure 31] This is a schematic perspective view of a stacked electronic component according to one embodiment of the present invention. [Figure 32] This is a cross-sectional view along the line XII-XII' in Figure 31. [Figure 33] This is a schematic perspective view of a stacked electronic component according to one embodiment of the present invention. [Figure 34] This is a cross-sectional view along the line XIII-XIII' in Figure 33. [Figure 35] This figure shows a modified example of Figure 33. [Figure 36] This is a schematic perspective view of a stacked electronic component according to one embodiment of the present invention. [Figure 37] This is a cross-sectional view along the line XIV-XIV' in Figure 36. [Figure 38] This is a magnified view of the K1 region in Figure 36. [Modes for carrying out the invention]

[0022] Embodiments of the present invention will be described below with reference to specific embodiments and accompanying drawings. However, embodiments of the present invention can be modified into various different forms, and the scope of the present invention is not limited to the embodiments described below. Furthermore, embodiments of the present invention are provided to give a more complete explanation of the present invention to a person of ordinary skill. Therefore, the shapes and sizes of elements in the drawings may be enlarged or reduced (or highlighted or simplified) for a clearer explanation, and elements indicated by the same reference numerals in the drawings are the same elements.

[0023] In the drawings, parts unrelated to the explanation have been omitted in order to clearly illustrate the present invention, and the size and thickness of each component shown in the drawings are arbitrarily shown for the convenience of explanation; therefore, the present invention is not necessarily limited to what is shown. Furthermore, components having the same function within the scope of the same concept will be described using the same reference numerals. Moreover, throughout the specification, when a part "includes" a certain component, it does not mean that other components are excluded, but rather that other components may be further included, unless otherwise stated.

[0024] In drawings, the first direction can be defined as the lamination direction or the thickness (T) direction, the second direction as the length (L) direction, and the third direction as the width (W) direction.

[0025] Figure 1 is a schematic perspective view showing a stacked electronic component according to one embodiment of the present invention.

[0026] Figure 2 is a schematic perspective view showing the main body of the stacked electronic component shown in Figure 1.

[0027] Figure 3 is a cross-sectional view along the line I-I' in Figure 1.

[0028] Figure 4 is an exploded perspective view showing the main body of Figure 2 disassembled.

[0029] Figure 5 is a schematic perspective view showing a substrate on which the multilayer electronic components shown in Figure 1 are mounted.

[0030] A stacked electronic component 1000 according to one embodiment of the present invention will be described below with reference to Figures 1 to 5.

[0031] A stacked electronic component 1000 according to one embodiment of the present invention includes a dielectric layer 111 and first and second internal electrodes 121 and 122 arranged alternately on either side of the dielectric layer, and comprises a body 110 including first and second surfaces 1 and 2 facing in a first direction, third and fourth surfaces 3 and 4 connected to the first and second surfaces and facing in a second direction, and fifth and sixth surfaces 5 and 6 connected to the first to fourth surfaces and facing in a third direction, and a first external electrode 131 including a first connecting portion 131a arranged on the third surface, a first band portion 131b extending from the first connecting portion to a part of the first surface, and a third band portion 131c extending from the first connecting portion to a part of the second surface, and the first The second external electrode 132 includes a second connection portion 132a arranged on four sides, a second band portion 132b extending from the second connection portion to a part of the first surface, and a fourth band portion 132c extending from the second connection portion to a part of the second surface; a cover layer 151 arranged on the first and second connection portions and covering the second surface and the third and fourth band portions 131c, 132c; a first plating layer 141 arranged on the first band portion 131b; and a second plating layer 142 arranged on the second band portion 132b, wherein the cover layer 151 may include a hydrophilic base layer 151a and an insulating layer 151b arranged on the base layer.

[0032] The main body 110 has dielectric layers 111 and internal electrodes 121 and 122 stacked alternately.

[0033] The specific shape of the main body 110 is not particularly limited, but as shown in the figure, the main body 110 may have a hexahedral shape or a similar shape. Due to the shrinkage of the ceramic powder contained in the main body 110 during the firing process, the main body 110 may not have a hexahedral shape made up of perfectly straight lines, but may have a substantially hexahedral shape.

[0034] The main body 110 may have first and second surfaces 1 and 2 facing each other in the first direction, third and fourth surfaces 3 and 4 connected to the first and second surfaces 1 and 2 and facing each other in the second direction, and fifth and sixth surfaces 5 and 6 connected to the first and second surfaces 1 and 2 and connected to the third and fourth surfaces 3 and 4 and facing each other in the third direction.

[0035] In one embodiment, the main body 110 includes a first-to-third corner connecting the first surface and the third surface, a first-to-fourth corner connecting the first surface and the fourth surface, a second-to-third corner connecting the second surface and the third surface, and a second-to-fourth corner connecting the second surface and the fourth surface. The first-to-third corner and the second-to-third corner have a form that contracts towards the center of the main body in the first direction as they approach the third surface, and the first-to-fourth corner and the second-to-fourth corner can have a form that contracts towards the center of the main body in the first direction as they approach the fourth surface.

[0036] Due to the overlap of margin regions on the dielectric layer 111 where internal electrodes 121 and 122 are not placed, a step difference occurs due to the thickness of the internal electrodes 121 and 122, and the corners connecting the first surface with the third to fifth surfaces and / or the corners connecting the second surface with the third to fifth surfaces may have a form that is contracted toward the center in the first direction of the main body 110 when viewed with reference to the first or second surface. Alternatively, due to the shrinkage behavior during the sintering process of the main body, the corners connecting the first surface 1 with the third to sixth surfaces 3, 4, 5, and 6 and / or the corners connecting the second surface 2 with the third to sixth surfaces 3, 4, 5, and 6 may have a form that is contracted toward the center in the first direction of the main body 110 when viewed with reference to the first or second surface. Alternatively, to prevent chipping defects, the corners connecting each face of the main body 110 can be rounded in a separate process, so that the corners connecting the first face with the third to sixth faces and / or the corners connecting the second face with the third to sixth faces have a rounded shape.

[0037] The above-mentioned corners may include the 1st-3rd corner connecting the 1st and 3rd faces, the 1st-4th corner connecting the 1st and 4th faces, the 2nd-3rd corner connecting the 2nd and 3rd faces, and the 2nd-4th corner connecting the 2nd and 4th faces. Furthermore, the above-mentioned corners may include the 1st-5th corner connecting the 1st and 5th faces, the 1st-6th corner connecting the 1st and 6th faces, the 2nd-5th corner connecting the 2nd and 5th faces, and the 2nd-6th corner connecting the 2nd and 6th faces. The 1st to 6th faces of the main body 110 are substantially flat surfaces, and any non-flat areas can be considered corners. Hereinafter, the extensions of each face may refer to lines extending from the flat portions of each face.

[0038] Here, of the external electrodes 131 and 132, the area located on the corner of the main body 110 can be referred to as the corner portion, the areas located on the third and fourth surfaces of the main body 110 can be referred to as the connecting portion, and the areas located on the first and second surfaces of the main body 110 can be referred to as the band portion.

[0039] On the other hand, in order to suppress the step caused by the internal electrodes 121 and 122, if, after lamination, the internal electrodes are cut so that they are exposed on the fifth and sixth surfaces 5 and 6 of the main body, and then a single dielectric layer or two or more dielectric layers are laminated on both sides of the capacitance forming portion Ac in the third direction (width direction) to form margin portions 114 and 115, then the portions connecting the first surface with the fifth and sixth surfaces, and the portions connecting the second surface with the fifth and sixth surfaces, do not need to have a contracted form.

[0040] The multiple dielectric layers 111 forming the main body 110 are in a fired state, and the boundaries between adjacent dielectric layers 111 can be integrated to such an extent that they are difficult to confirm without using a scanning electron microscope (SEM).

[0041] According to an embodiment of the present invention, the raw material for forming the dielectric layer 111 is not particularly limited as long as sufficient capacitance can be obtained. For example, a barium titanate-based material, a lead composite perovskite-based material, a strontium titanate-based material, etc. can be used. The above barium titanate-based material may contain BaTiO3-based ceramic powder. Examples of the above ceramic powder include BaTiO3, (Ba 1-x Ca x )TiO3 (0 < x < 1) in which Ca (calcium), Zr (zirconium), etc. are partially solid-solved in BaTiO3, Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1) or Ba(Ti 1-y Zr y )O3 (0 < y < 1), etc.

[0042] In addition, various ceramic additives, organic solvents, binders, dispersants, etc. can be added to the raw material for forming the dielectric layer 111, such as powder of barium titanate (BaTiO3), etc., according to the purpose of the present invention.

[0043] On the other hand, the average thickness td of the dielectric layer 111 does not need to be particularly limited.

[0044] However, generally, when the dielectric layer is formed thin with a thickness less than 0.6 μm, especially when the average thickness of the dielectric layer is 0.35 μm or less, the reliability may decrease.

[0045] According to an embodiment of the present invention, by disposing the cover layer on the connection portion of the external electrode and disposing the plating layer on the band portion of the external electrode, it is possible to prevent the penetration of moisture or plating solution from the outside and improve the reliability. Therefore, even when the average thickness td of the dielectric layer 111 is 0.35 μm or less, excellent reliability can be ensured.

[0046] Therefore, when the average thickness td of the dielectric layer 111 is 0.35 μm or less, the reliability improvement effect according to the present invention becomes more pronounced.

[0047] The average thickness td of the dielectric layer 111 may refer to the average thickness of the dielectric layer 111 placed between the first and second internal electrodes 121 and 122.

[0048] The average thickness td of the dielectric layer 111 can be measured by scanning the cross-section of the main body 110 in the length and thickness direction LT with a scanning electron microscope (SEM) at 10,000x magnification. More specifically, the average value can be measured by measuring the thickness at 30 equally spaced points along the length of a single dielectric layer in the scanned image. These 30 equally spaced points can be specified by the capacitance forming section Ac. Furthermore, by extending this average value measurement to 10 dielectric layers and measuring the average value, the average thickness of the dielectric layers can be further generalized.

[0049] The main body 110 may include a capacitance forming portion Ac which is disposed inside the main body 110 and includes a first internal electrode 121 and a second internal electrode 122 which are arranged opposite each other with a dielectric layer 111 in between, and cover portions 112 and 113 which are formed on the upper and lower parts of the capacitance forming portion Ac in a first direction.

[0050] Furthermore, the capacitance-forming portion Ac is the part that contributes to the formation of the capacitance of the capacitor, and can be formed by repeatedly stacking a plurality of first and second internal electrodes 121 and 122 with a dielectric layer 111 in between.

[0051] The cover portions 112 and 113 may include an upper cover portion 112 positioned above the volume-forming portion Ac in the first direction, and a lower cover portion 113 positioned below the volume-forming portion Ac in the first direction.

[0052] The upper cover portion 112 and the lower cover portion 113 may be formed by stacking a single dielectric layer or two or more dielectric layers in the thickness direction on the upper and lower surfaces of the capacitance forming portion Ac, respectively, and basically serve to prevent damage to the internal electrodes due to physical or chemical stress.

[0053] The upper cover portion 112 and the lower cover portion 113 do not include internal electrodes and may contain the same material as the dielectric layer 111.

[0054] In other words, the upper cover portion 112 and the lower cover portion 113 may contain a ceramic material, for example, a barium titanate (BaTiO3) based ceramic material.

[0055] On the other hand, the average thickness tc of the cover portions 112 and 113 is not particularly limited. However, in order to more easily achieve miniaturization and high capacity of the stacked electronic component, the average thickness tc of the cover portions 112 and 113 may be 15 μm or less. Furthermore, according to one embodiment of the present invention, by arranging the cover layer on the connection portion of the external electrode and the plating layer on the band portion of the external electrode, it is possible to prevent the penetration of moisture from the outside and the penetration of the plating solution, thereby improving reliability. Therefore, even when the average thickness tc of the cover portions 112 and 113 is 15 μm or less, excellent reliability can be ensured.

[0056] The average thickness tc of the cover portions 112 and 113 represents the size in the first direction and can be the average value of the sizes of the cover portions 112 and 113 in the first direction measured at five equally spaced points on the upper or lower part of the volume forming portion Ac.

[0057] Furthermore, margin portions 114 and 115 can be arranged on the side surface of the volume-forming portion Ac.

[0058] The margin portions 114 and 115 may include a first margin portion 114 positioned on the fifth surface 5 of the main body 110 and a second margin portion 115 positioned on the sixth surface 6 of the main body 110. That is, the margin portions 114 and 115 can be positioned on both end surfaces in the width direction of the main body 110.

[0059] As shown in Figure 3, the margin portions 114 and 115 can refer to the regions between the interface between both ends of the first and second internal electrodes 121 and 122 and the body 110 in a cross-section obtained by cutting the body 110 in the width-thickness WT direction.

[0060] The margins 114 and 115 essentially serve to prevent damage to the internal electrodes due to physical or chemical stress.

[0061] The margin portions 114 and 115 may be formed by applying a conductive paste to the ceramic green sheet, excluding the portion that forms the margin portion, to form internal electrodes.

[0062] Furthermore, in order to suppress the step caused by the internal electrodes 121 and 122, after lamination, the internal electrodes can be cut so that they are exposed from the fifth and sixth surfaces 5 and 6 of the main body, and then a single dielectric layer or two or more dielectric layers can be laminated in the third direction (width direction) on both sides of the capacitance forming portion Ac to form margin portions 114 and 115.

[0063] On the other hand, the width of the margin portions 114 and 115 does not need to be particularly limited. However, in order to more easily achieve miniaturization and high capacity of the stacked electronic component, the average width of the margin portions 114 and 115 may be 15 μm or less. Furthermore, according to one embodiment of the present invention, by arranging the cover layer on the connection portion of the external electrode and the plating layer on the band portion of the external electrode, it is possible to prevent the penetration of moisture from the outside and the penetration of the plating solution, thereby improving reliability. Therefore, even when the average width of the margin portions 114 and 115 is 15 μm or less, excellent reliability can be ensured.

[0064] The average width of the margin portions 114 and 115 represents the average size of the margin portions 114 and 115 in the third direction, and can be the average value of the sizes of the margin portions 114 and 115 in the third direction measured at five equally spaced points on the side surface of the volume forming portion Ac.

[0065] The internal electrodes 121 and 122 are stacked alternately with the dielectric layer 111.

[0066] The internal electrodes 121 and 122 may include first and second internal electrodes 121 and 122. The first and second internal electrodes 121 and 122 are arranged alternately opposite each other across the dielectric layer 111 that constitutes the main body 110, and can be exposed from the third and fourth surfaces 3 and 4 of the main body 110, respectively.

[0067] Referring to Figure 3, the first internal electrode 121 is separated from the fourth surface 4 and exposed from the third surface 3, and the second internal electrode 122 is separated from the third surface 3 and exposed from the fourth surface 4. The first external electrode 131 is positioned on the third surface 3 of the main body and connected to the first internal electrode 121, and the second external electrode 132 is positioned on the fourth surface 4 of the main body and connected to the second internal electrode 122.

[0068] In other words, the first internal electrode 121 is not connected to the second external electrode 132, but rather to the first external electrode 131, and the second internal electrode 122 is not connected to the first external electrode 131, but rather to the second external electrode 132. Therefore, the first internal electrode 121 can be formed at a predetermined distance from the fourth surface 4, and the second internal electrode 122 can be formed at a predetermined distance from the third surface 3.

[0069] Here, the first and second internal electrodes 121 and 122 can be electrically isolated from each other by the dielectric layer 111 placed in between.

[0070] The main body 110 can be formed by alternately laminating ceramic green sheets printed with the first internal electrode 121 and ceramic green sheets printed with the second internal electrode 122, and then firing them.

[0071] The materials used to form the internal electrodes 121 and 122 are not particularly limited, and any material with excellent electrical conductivity can be used. For example, the internal electrodes 121 and 122 may include one or more of the following: nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

[0072] Furthermore, the internal electrodes 121 and 122 can be formed by printing a conductive paste for internal electrodes containing one or more of the following on a ceramic green sheet: nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof. While screen printing and gravure printing can be used as printing methods for the conductive paste for internal electrodes, the present invention is not limited to these methods.

[0073] On the other hand, the average thickness te of the internal electrodes 121 and 122 does not need to be particularly limited.

[0074] However, generally speaking, when the internal electrodes were formed thinly with a thickness of less than 0.6 μm, especially when the average thickness of the internal electrodes was 0.35 μm or less, there was a risk of reduced reliability.

[0075] According to one embodiment of the present invention, by placing the cover layer on the connection portion of the external electrode and the plating layer on the band portion of the external electrode, it is possible to prevent the penetration of moisture from the outside and the penetration of the plating solution, thereby improving reliability. As a result, even when the average thickness te of the internal electrodes 121 and 122 is 0.35 μm or less, excellent reliability can be ensured.

[0076] Therefore, when the average thickness te of the internal electrodes 121 and 122 is 0.35 μm or less, the effects of the present invention become more pronounced, and miniaturization and increased capacitance of the stacked electronic component can be achieved more easily.

[0077] The average thickness te of the internal electrodes 121 and 122 can mean the average thickness of one internal electrode 121 or 122.

[0078] The average thickness te of the internal electrodes 121 and 122 can be measured by scanning the cross-section of the main body 110 in the length and thickness direction LT with a scanning electron microscope (SEM) at 10,000x magnification. More specifically, the average value can be measured by measuring the thickness at 30 equally spaced points along the length of one internal electrode in the scanned image. These 30 equally spaced points can be specified in the capacitance forming section Ac. Furthermore, by extending this average value measurement to 10 internal electrodes, the average thickness of the internal electrodes can be further generalized.

[0079] External electrodes 131 and 132 can be arranged on the third and fourth surfaces 3 and 4 of the main body 110. The external electrodes 131 and 132 may include first and second external electrodes 131 and 132, respectively, which are arranged on the third and fourth surfaces 3 and 4 of the main body 110 and connected to first and second internal electrodes 121 and 122, respectively.

[0080] The external electrodes 131 and 132 may include a first external electrode 131 which includes a first connecting portion 131a located on the third surface and a first band portion 131b extending from the first connecting portion to a part of the first surface, and a second external electrode 132 which includes a second connecting portion 132a located on the fourth surface and a second band portion 132b extending from the second connecting portion to a part of the first surface. The first connecting portion 131a may be connected to the first internal electrode 121 on the third surface, and the second connecting portion 132a may be connected to the second internal electrode 122 on the fourth surface.

[0081] Furthermore, the first external electrode 131 may include a third band portion 131c extending from the first connection portion 131a to a part of the second surface, and the second external electrode 132 may include a fourth band portion 132c extending from the second connection portion 132a to a part of the second surface. In addition, the first external electrode 131 may include a first side band portion extending from the first connection portion 131a to a part of the fifth and sixth surfaces, and the second external electrode 132 may include a second side band portion extending from the second connection portion 132a to a part of the fifth and sixth surfaces.

[0082] However, the third band section, the fourth band section, the first side band section, and the second side band section are not essential components in the present invention. The first and second external electrodes 131 and 132 do not have to be placed on the second surface, nor do they have to be placed on the fifth and sixth surfaces. By not placing the first and second external electrodes 131 and 132 on the second surface, the first and second external electrodes 131 and 132 can be placed below the extension line of the second surface of the main body. Also, the first and second connecting sections 131a and 132a may be placed away from the fifth and sixth surfaces, and the first and second connecting sections 131a and 132a may be placed away from the second surface. Also, the first and second band sections 131b and 132b may be placed away from the fifth and sixth surfaces.

[0083] On the other hand, when the first and second external electrodes 131 and 132 include the third and fourth band portions 131c and 132c, it is indicated that a cover layer is placed on the third and fourth band portions 131c and 132c, but this is not limited to this, and a plating layer may be placed on the third and fourth band portions 131c and 132c to improve the convenience of mounting. Also, the first and second external electrodes 131 and 132 may include the third and fourth band portions 131c and 132c but not the side band portions, in which case the first and second connecting portions 131a and 132a, and the first to fourth band portions 131b, 132b, 131c and 132c may be separated from the fifth and sixth surfaces.

[0084] In this embodiment, a structure is described in which the stacked electronic component 1000 has two external electrodes 131 and 132. However, the number and shape of the external electrodes 131 and 132 can be changed according to the form of the internal electrodes 121 and 122 or other purposes.

[0085] On the other hand, the external electrodes 131 and 132 may be formed using any material that has electrical conductivity, such as metal, and the specific material may be determined by considering electrical properties and structural stability, and may even have a multilayer structure.

[0086] The external electrodes 131 and 132 may be firing electrodes containing conductive metal and glass, or resin-based electrodes containing conductive metal and resin.

[0087] Furthermore, the external electrodes 131 and 132 may be formed by sequentially forming a fired electrode and a resin-based electrode on the main body. Also, the external electrodes 131 and 132 may be formed by transferring a sheet containing a conductive metal onto the main body, or by transferring a sheet containing a conductive metal onto a fired electrode.

[0088] The conductive metal included in the external electrodes 131 and 132 can be any material with excellent electrical conductivity, but is not particularly limited. For example, the conductive metal may be one or more of Cu, Ni, Pd, Ag, Sn, Cr, and their alloys. Preferably, the external electrodes 131 and 132 may contain one or more of Ni and Ni alloys. This can further improve connectivity with the internal electrodes 121 and 122 which contain Ni.

[0089] The cover layer 151 can be placed on the first and second connection portions 131a and 132a. The cover layer 151 may include a hydrophilic base layer 151a and an insulating layer 151b placed on the base layer.

[0090] Since the first and second connection parts 131a and 132a are connected to the internal electrodes 121 and 122, they can become pathways for the penetration of plating solution during the plating process or for the penetration of moisture during actual use. In the present invention, since the cover layer 151 is placed on the connection parts 131a and 132a, it is possible to prevent the penetration of moisture from the outside or the penetration of plating solution.

[0091] The cover layer 151 can be positioned in contact with the first and second plating layers 141 and 142. Here, the cover layer 151 may be positioned to cover a portion of the edges of the first and second plating layers 141 and 142, or the first and second plating layers 141 and 142 may be positioned to cover a portion of the edges of the cover layer 151.

[0092] The cover layer 151 can be placed on the first and second connecting portions 131a and 132a and positioned to cover the second surface and the third and fourth band portions 131c and 132c. Here, the cover layer 151 may be positioned to cover the area of ​​the second surface where the third and fourth band portions 131c and 132c are not located, and the third and fourth band portions 131c and 132c themselves. Thus, by covering the area where the ends of the third and fourth band portions 131c and 132c and the main body 110 are in contact with each other, and blocking the moisture penetration path, the moisture resistance reliability can be further improved.

[0093] The cover layer 151 can be positioned on the second surface and extend to the first and second connection portions 131a and 132a. Alternatively, if the external electrodes 131 and 132 are not positioned on the second surface, the cover layer can be positioned to cover the entire second surface. On the other hand, the cover layer 151 does not necessarily have to be positioned on the second surface; it may not be positioned on part or all of the second surface, and the cover layer may be separated into two parts, each positioned on the first and second connection portions 131a and 132a. If the cover layer is not positioned on the entire second surface, it can be positioned below the extension line of the second surface. Furthermore, even if the cover layer is not positioned on the second surface, it can extend from the first and second connection portions 131a and 132a to the fifth and sixth surfaces, forming a single cover layer.

[0094] Furthermore, the cover layer 151 can be positioned to cover the first and second side band portions, as well as parts of the fifth and sixth surfaces. In this case, the parts of the fifth and sixth surfaces not covered by the cover layer 151 can be exposed to the outside.

[0095] Furthermore, the cover layer 151 may be arranged to cover the entirety of the first and second side band portions, as well as the fifth and sixth surfaces. In this case, the fifth and sixth surfaces are not exposed to the outside, thus improving moisture resistance reliability. The connection portions 131a and 132a are also not directly exposed to the outside, thus improving the reliability of the laminated electronic component 1000. More specifically, the cover layer may cover the entirety of the first and second side band portions and the entirety of the fifth and sixth surfaces except for the areas where the first and second side band portions are formed.

[0096] The cover layer 151 plays a role in preventing the formation of plating layers 141 and 142 on the external electrodes 131 and 132 on which the cover layer 151 is placed, thereby improving sealing properties and minimizing the penetration of moisture, plating solution, etc. from the outside.

[0097] The cover layer 151 may include a hydrophilic base layer 151a and an insulating layer 151b disposed on the base layer.

[0098] Conventionally, the insulating layer was generally placed on the external electrode without a hydrophilic base layer 151a. However, due to the weak bonding force between the insulating layer and the external electrode, physical delamination and damage to the insulating layer could occur during polishing, plating, and other processes. Consequently, moisture, plating solutions, etc., could penetrate the delaminate and damaged areas, potentially reducing reliability.

[0099] This invention improves the bonding strength between the external electrodes 131 and 132 and the insulating layer 151b by placing a hydrophilic base layer 151a in the region where the insulating layer 151b is located, thereby solving the problems that occurred when only an insulating layer was placed in the conventional method.

[0100] The base layer 151a is hydrophilic and plays a role in improving the bonding strength between the main body 110 and the external electrodes 131 and 132 and the insulating layer 151b.

[0101] Hydrophilicity refers to the property of readily bonding with water molecules, while hydrophobicity refers to the property of not readily bonding with water molecules. Hydrophilicity and hydrophobicity can be distinguished by measuring the contact angle with water, and in this invention, hydrophilicity means that the contact angle with water is less than 90 degrees. Therefore, in one embodiment, the base layer 151a can have a contact angle with water of less than 90 degrees.

[0102] Furthermore, in order to further improve the bonding force between the external electrodes 131 and 132 and the insulating layer 151b, it is more preferable that the base layer 151a has a contact angle with water of 60 degrees or less. There is no particular limit to the method for forming the base layer 151a so that the contact angle with water is 60 degrees or less, but for example, a base layer 151a with a contact angle with water of 60 degrees or less can be formed by plasma surface treatment.

[0103] The method for forming the base layer 151a described above is not particularly limited. For example, the base layer 151a can be formed by plasma surface treatment, and more specifically by O2 / Ar plasma surface treatment. Plasma surface treatment has the advantage that the surface can be handled stably and stable materials can be processed at low temperatures because the physical and chemical reactions occur uniformly and are limited to the surface layer without changing the overall properties of the material. Here, O2 / Ar plasma surface treatment can mean modifying the surface of the object by injecting a mixed gas of O2 and Ar to generate a plasma. The ratio of O2 to Ar is not particularly limited and can be determined by considering the properties to be obtained.

[0104] O2 / Ar plasma surface treatment can improve illuminance and increase surface energy on the surfaces of the external electrodes 131 and 132 and the main body 110. Furthermore, hydrophilicity can be imparted to the surfaces of the external electrodes 131 and 132 and the main body 110, allowing the O2 / Ar plasma surface-treated surfaces of the external electrodes 131 and 132 and the main body 110 to be considered as the base layer 151a. Therefore, the bonding strength between the insulating layer 151b and the external electrodes 131 and 132 can be improved.

[0105] The plasma surface treatment apparatus is not particularly limited; for example, an inductively coupled plasma apparatus that forms a high-density plasma in a high vacuum may be used.

[0106] In one embodiment, the base layer 151a can have surface roughness at its interface with the insulating layer 151b. This improves the bonding strength between the insulating layer 151b and the external electrodes 131 and 132. The method for imparting surface roughness is not particularly limited, but it can be imparted by the O2 / Ar plasma surface treatment described above. Here, the surface roughness can be controlled by adjusting the ratio of O2 and Ar gas. For example, the base layer 151a can have a centerline average roughness Ra of 50 to 100 nm at its interface with the insulating layer 151b.

[0107] In one embodiment, the base layer 151a may contain O2. When the base layer 151a is formed by O2 / Ar plasma surface treatment, the base layer 151a may contain O2.

[0108] In one embodiment, the base layer 151a may contain a metal oxide in the region in contact with the first and second external electrodes 131 and 132. The base layer 151a is given surface roughness by containing a metal oxide, and the metal oxide contained in the base layer 151a may be formed by the oxidation of the conductive metal contained in the external electrodes 131 and 132 by O2 / Ar plasma surface treatment. Therefore, the metal of the metal oxide contained in the base layer 151a may be the same type as the conductive metal contained in the external electrodes 131 and 132.

[0109] In particular, if the external electrodes 131 and 132 contain Cu as a conductive metal, the base layer 151a may contain an oxide containing Cu as a metal oxide. When the base layer 151a contains an oxide containing Cu, the surface roughness becomes higher, which can further improve the bonding strength between the insulating layer 151b and the external electrodes 131 and 132.

[0110] Here, the oxide containing Cu may be one or more of CuO and Cu2O.

[0111] On the other hand, the base layer 151a does not have a continuous layer shape, and it may not be easy to clearly distinguish it from the external electrodes 131 and 132 even when using a scanning electron microscope. However, if surface roughness is formed on the surface of the external electrodes 131 and 132, if the surface of the external electrodes contains O2, or if the surface of the external electrodes contains metal oxides, then the base layer 151a of the present invention can be considered to be disposed on the external electrodes 131 and 132.

[0112] The insulating layer 151b plays a role in preventing the formation of plating layers 141 and 142 on the external electrodes 131 and 132 on which the cover layer 151 is placed, thereby improving sealing properties and minimizing the penetration of moisture, plating solutions, etc., from the outside.

[0113] The materials constituting the insulating layer 151b are not particularly limited, and the insulating layer 151b may contain an insulating material and have electrically insulating properties. For example, the insulating material contained in the insulating layer 151b may be one or more selected from epoxy resin, acrylic resin, ethyl cellulose, etc., or it may be glass. More specifically, the material constituting the insulating layer 151b is preferably a glass material with excellent resistance to plating solutions, and a Si mole fraction of 20 mol% or more and 65 mol% or less.

[0114] On the other hand, if the insulating layer 151b contains glass, there is a high possibility that physical peeling and damage will occur to the insulating layer due to polishing, plating, etc. However, according to one embodiment of the present invention, by arranging a base layer between the insulating layer and the external electrodes, the bonding force between the insulating layer 151b and the external electrodes 131 and 132 can be improved, so that even if the insulating layer 151b contains glass, physical peeling and damage can be effectively prevented. Therefore, when the insulating layer 151b contains glass, the effect of the present invention in preventing physical peeling and damage to the insulating layer 151b becomes even more pronounced.

[0115] The method for forming the insulating layer 151b is not particularly limited. For example, the insulating layer 151b may be formed by forming external electrodes 131 and 132 on the main body 100, forming the base layer 151a, then applying a paste containing glass powder, or by dipping in a paste containing glass and then heat-treating it.

[0116] In one embodiment, the cover layer 151 is arranged in direct contact with the first and second external electrodes 131 and 132, and the first and second external electrodes 131 and 132 may include conductive metal and glass. By doing so, the plating layers 141 and 142 are not placed in the area of ​​the outer surface of the first and second external electrodes 131 and 132 where the cover layer 151 is placed, thereby effectively suppressing corrosion of the external electrodes by the plating solution.

[0117] Here, the first plating layer 141 may be positioned to cover the edge of the cover layer 151 placed on the first external electrode 131, and the second plating layer 142 may be positioned to cover the edge of the cover layer 151 placed on the second external electrode 132. By forming the cover layer 151 first before forming the plating layers 141 and 142 on the external electrodes 131 and 132, the penetration of the plating solution during the plating layer formation process can be suppressed more reliably. By forming the cover layer before the plating layer, the plating layers 141 and 142 can have a configuration that covers the edge of the cover layer 151.

[0118] In one embodiment, the cover layer 151 is arranged in direct contact with the first and second external electrodes 131 and 132, and the first and second external electrodes 131 and 132 may contain conductive metal and resin. By doing so, the plating layers 141 and 142 are not placed in the area of ​​the outer surface of the first and second external electrodes 131 and 132 where the cover layer 151 is placed, thereby effectively suppressing corrosion of the external electrodes by the plating solution.

[0119] Here, the first plating layer 141 may be positioned to cover the edge of the cover layer 151 placed on the first external electrode 131, and the second plating layer 142 may be positioned to cover the edge of the cover layer 151 placed on the second external electrode 132. By forming the cover layer 151 first before forming the plating layers 141 and 142 on the external electrodes 131 and 132, the penetration of the plating solution during the plating layer formation process can be suppressed more reliably. By forming the cover layer before the plating layer, the plating layers 141 and 142 can have a configuration that covers the edge of the cover layer 151.

[0120] In one embodiment, the average thickness t2 of the cover layer 151 may be 1 μm or more and 20 μm or less.

[0121] If the average thickness t2 of the cover layer 151 is less than 1 μm, the insulating layer's effect in preventing the penetration of moisture and plating solution is insufficient. If it exceeds 20 μm, there is a risk that the capacity per unit volume will decrease.

[0122] The average thickness t2 of the cover layer 151 can be the average of the thicknesses measured at five equally spaced points on the first and second connection portions 131a and 132a. More specifically, it can be the average of the thickness values ​​of the cover layer measured at the center point in the first direction of the first and second connection portions 131a and 132a, two points 5 μm apart in the first direction relative to the center point in the first direction, and two points 10 μm apart in the first direction. On the other hand, the base layer 151a is very thin and may not be measurable, but since it does not significantly affect the average thickness t2 of the cover layer 151, the thickness of the insulating layer 151b may be considered as the thickness of the cover layer 151. Therefore, the average thickness t2 of the cover layer 151 means the average thickness of the insulating layer 151b.

[0123] The first and second plating layers 141 and 142 can be arranged on the first and second band portions 131b and 132b, respectively. The plating layers 141 and 142 play a role in improving mounting characteristics, and by arranging the plating layers 141 and 142 on the band portions 131b and 132b, the mounting space can be minimized, and the penetration of the plating solution into the internal electrodes can be minimized, thereby improving reliability. The first and second plating layers 141 and 142 may have one end in contact with the first surface and the other end in contact with the cover layer 151.

[0124] The plating layers 141 and 142 are not particularly limited in type and may be plating layers containing one or more of Cu, Ni, Sn, Ag, Au, Pd, and their alloys, and may also be formed in multiple layers.

[0125] As a more specific example of the plating layers 141 and 142, the plating layers 141 and 142 may be Ni plating layers or Sn plating layers, and may be in a form in which the Ni plating layer and the Sn plating layer are sequentially formed on the first and second band portions 131b and 132b.

[0126] In one embodiment, the first and second plating layers 141 and 142 can be arranged to extend so as to cover a portion of the first and second connecting portions 131a and 132a, respectively. When H1 is the average size in the first direction from the first and second internal electrodes 121 and 122 to the internal electrode closest to the first surface 1, and H2 is the average size in the first direction from the extension line of the first surface 1 to the ends of the first and second plating layers 141 and 142 arranged on the first and second connecting portions 131a and 132a, it is possible to satisfy H1 > H2 (or H1 ≥ H2). This suppresses the penetration of the plating solution into the internal electrodes during the plating process and improves reliability.

[0127] H1 and H2 can be the average of values ​​measured in cross-sections (LT cross-sections) obtained by cutting the main body 110 in the first and second directions at five equally spaced points in the third direction. H1 can be the average of values ​​measured at the point where the internal electrode closest to the first surface 1 is connected to the external electrode in each cross-section, and H2 can be the average of values ​​measured with reference to the edge of the plating layer in contact with the external electrode in each cross-section, and the extension line of the first surface that serves as the reference when measuring H1 and H2 can be the same.

[0128] In one embodiment, the first plating layer 141 can be positioned to cover the edge of the cover layer 151 placed on the first external electrode 131, and the second plating layer 142 can be positioned to cover the edge of the cover layer 151 placed on the second external electrode 132. This strengthens the bonding force between the cover layer 151 and the plating layers 141 and 142, improving the reliability of the multilayer electronic component 1000.

[0129] In one embodiment, the cover layer 151 can be positioned to cover the edge of the first plating layer 141 placed on the first external electrode 131, and the cover layer 151 can be positioned to cover the edge of the second plating layer 142 placed on the second external electrode 132. This strengthens the bonding force between the cover layer 151 and the plating layers 141 and 142, improving the reliability of the multilayer electronic component 1000.

[0130] In one embodiment, when the average size of the main body 110 in the second direction is L, the average size in the second direction from the extension line of the third surface to the end of the first band portion is B1, and the average size in the second direction from the extension line of the fourth surface to the end of the second band portion is B2, the conditions 0.2 ≤ B1 / L ≤ 0.4 and 0.2 ≤ B2 / L ≤ 0.4 can be satisfied.

[0131] If B1 / L and B2 / L are less than 0.2, it is difficult to ensure sufficient adhesion strength. On the other hand, if B2 / L exceeds 0.4, there is a risk of leakage current occurring between the first band portion 131b and the second band portion 132b under high voltage current, and there is a risk of the first band portion 131b and the second band portion 132b becoming electrically connected due to the bleeding of the plating during the plating process.

[0132] B1, B2, and L can be the average of values ​​measured at cross-sections (LT cross-sections) obtained by cutting the main body 110 in the first and second directions at five equally spaced points in the third direction.

[0133] Referring to Figure 5, which shows a mounting substrate 1100 on which a multilayer electronic component 1000 is mounted, the plating layers 141 and 142 of the multilayer electronic component 1000 may be joined to electrode pads 181 and 182 placed on the substrate 180 by solder 191 and 192.

[0134] On the other hand, if the internal electrodes 121 and 122 are stacked in a first direction, the stacked electronic component 1000 can be horizontally mounted on the substrate 180 so that the internal electrodes 121 and 122 are parallel to the mounting surface. However, the present invention is not limited to horizontal mounting, and if the internal electrodes 121 and 122 are stacked in a third direction, the stacked electronic component can be vertically mounted on the substrate so that the internal electrodes 121 and 122 are perpendicular to the mounting surface.

[0135] There is no particular limit to the size of the stacked electronic component 1000.

[0136] However, in order to achieve both miniaturization and high capacity simultaneously, it is necessary to reduce the thickness of the dielectric layer and internal electrodes and increase the number of layers. Therefore, the improvement in reliability and capacity per unit volume according to the present invention becomes more pronounced in a stacked electronic component 1000 having a size of 1005 (length × width, 1.0 mm × 0.5 mm) or less.

[0137] Therefore, considering manufacturing tolerances, the size of external electrodes, etc., the reliability improvement effect according to the present invention becomes more pronounced when the length of the stacked electronic component 1000 is 1.1 mm or less and the width is 0.55 mm or less. Here, the length of the stacked electronic component 1000 can mean the maximum size of the stacked electronic component 1000 in the second direction, and the width of the stacked electronic component 1000 can mean the maximum size of the stacked electronic component 1000 in the third direction.

[0138] Figure 6 is a schematic perspective view showing a stacked electronic component 1001 according to one embodiment of the present invention, and Figure 7 is a cross-sectional view along the line II-II' in Figure 6.

[0139] Referring to Figures 6 and 7, in one embodiment of the present invention, the stacked electronic component 1001 has the first and second plating layers 141-1 and 142-1 positioned below the extension line E1 of the first surface. This minimizes the height of the solder during mounting and minimizes the mounting space.

[0140] Furthermore, the cover layer 151-1 can be positioned to extend below the extension line of the first surface and be in contact with the first and second plating layers 141-1 and 142-1.

[0141] Figure 8 is a schematic perspective view showing a stacked electronic component 1002 according to one embodiment of the present invention, and Figure 9 is a cross-sectional view along the line III-III' in Figure 8.

[0142] Referring to FIGS. 8 and 9, a stacked electronic component 1002 according to an embodiment of the present invention is disposed on the first surface 1 and may further include an additional insulating layer 161 disposed between the first band portion 131b and the second band portion 132b. By doing so, it is possible to prevent leakage current and the like that may occur between the first band portion 131b and the second band portion 132b under a high voltage current.

[0143] The type of the additional insulating layer 161 does not need to be particularly limited. For example, the additional insulating layer 161 may include one or more selected from epoxy resin, acrylic resin, ethyl cellulose, etc., and may include glass. Further, in addition to the polymer resin, the additional insulating layer 161 may include one or more selected from TiO2, BaTiO3, Al2O3, SiO2, BaO, etc. as additives. By doing so, the bonding strength with the main body or the external electrode can be improved.

[0144] FIG. 10 is a perspective view schematically showing a stacked electronic component 1003 according to an embodiment of the present invention, and FIG. 11 is a cross-sectional view taken along the line IV-IV' of FIG. 10.

[0145] Referring to FIGS. 10 and 11, for a stacked electronic component 1003 according to an embodiment of the present invention, when the average size in the first direction from the first surface 1 to the internal electrode closest to the first surface 1 among the first and second internal electrodes 121 and 122 is H1, and the average size in the first direction from the extension line of the first surface 1 to the ends of the plating layers 141-3 and 142-3 disposed on the first and second connection portions 131a and 132a is H2, H1 < H2 can be satisfied. Thereby, the area contacting the solder during mounting can be increased, and the fixing strength can be improved.

[0146] More preferably, when the average size of the main body 110 in the first direction is T, H2 < T / 2 can be satisfied. That is, H1 < H2 < T / 2 can be satisfied. This is because when H2 is greater than or equal to T / 2, the effect of improving the moisture resistance reliability by the cover layer may decrease.

[0147] H1, H2, and T can be the values obtained by averaging the values measured in the cross-section (L-T cross-section) obtained by cutting the main body 110 in the first and second directions at five equally spaced points in the third direction. H1 can be the value obtained by averaging the values measured at the points where the internal electrode closest to the first surface 1 in each cross-section is connected to the external electrode. H2 can be the value obtained by averaging the values measured based on the end of the plating layer in contact with the external electrode in each cross-section. The extension line of the first surface used as a reference during the measurement of H1 and H2 can be the same. Also, T can be the value obtained by averaging the maximum size of the main body 110 in the first direction in each cross-section.

[0148] FIG. 12 is a perspective view schematically showing a multilayer electronic component 1004 according to an embodiment of the present invention, and FIG. 13 is a cross-sectional view taken along the line V-V' of FIG. 12.

[0149] Referring to FIGS. 12 and 13, in a multilayer electronic component 1004 according to an embodiment of the present invention, the average length B1 of the first band portion 131b-4 can be longer than the average length B3 of the third band portion 131c-4, and the average length of the second band portion 132b-4 can be longer than the average length B4 of the fourth band portion 132c-4. Thereby, the area in contact with solder during mounting can be increased, and the fixing strength can be improved.

[0150] More specifically, when the average size in the second direction from the extension line of the third surface 3 to the end of the first band portion 131b-4 is B1, the average size in the second direction from the extension line of the fourth surface 4 to the end of the second band portion 132b-4 is B2, the average size in the second direction from the extension line of the third surface 3 to the end of the third band portion 131c-4 is B3, and the average size in the second direction from the extension line of the fourth surface 4 to the end of the fourth band portion 132c-4 is B4, B3 < B1 and B4 < B2 can be satisfied.

[0151] Here, when the average size of the main body 110 in the second direction is L, 0.2 ≦ B1 / L ≦ 0.4 and 0.2 ≦ B2 / L ≦ 0.4 can be satisfied.

[0152] B1, B2, B3, B4, and L can be the average of values ​​measured at cross-sections (LT cross-sections) obtained by cutting the main body 110 in the first and second directions at five equally spaced points in the third direction.

[0153] Furthermore, the first external electrode 131-4 includes a first side band portion extending from the first connecting portion 131a-4 to a part of the fifth and sixth surfaces, and the second external electrode 132-4 includes a second side band portion extending from the second connecting portion 132a-4 to a part of the fifth and sixth surfaces. Here, the size of the first and second side band portions in the second direction can gradually increase as they approach the first surface. That is, the first and second side band portions may be arranged in a tapered or trapezoidal shape.

[0154] Furthermore, when B3 is the average size in the second direction from the extension line of the third surface to the end of the third band portion 131c-4, B4 is the average size in the second direction from the extension line of the fourth surface to the end of the fourth band portion 132c-4, G1 is the average size in the second direction of the region separated from the third surface and the second internal electrode 122, and G2 is the average size in the second direction of the region separated from the fourth surface and the first internal electrode 121, then B3 ≤ G1 and B4 ≤ G2 can be satisfied. This minimizes the volume occupied by the external electrodes and increases the capacity per unit volume of the stacked electronic component 1004.

[0155] The above G1 and G2 can be defined as follows: In a cross-section obtained by cutting the main body in the center of the third direction in the first and second directions, G1 is the average value of the size in the second direction of the region separated to the third surface, measured for any five second internal electrodes located in the center of the first direction, and G2 is the average value of the size in the second direction of the region separated to the fourth surface, measured for any five first internal electrodes located in the center of the first direction.

[0156] Furthermore, the method can be further generalized by determining G1 and G2 in cross-sections (LT cross-sections) obtained by cutting the main body 110 at five equally spaced points in the third direction in the first and second directions, and then averaging these values ​​to obtain G1 and G2.

[0157] However, there is no intention to limit the present invention to B3≦G1 and B4≦G2, and the present invention can also include cases where B3≧G1 and B4≧G2 are satisfied. Therefore, in one embodiment, when B3 is the average size in the second direction from the extension line of the third surface to the end of the third band portion, B4 is the average size in the second direction from the extension line of the fourth surface to the end of the fourth band portion, G1 is the average size in the second direction of the region separated from the third surface and the second internal electrode, and G2 is the average size in the second direction of the region separated from the fourth surface and the first internal electrode, then B3≧G1 and B4≧G2 can be satisfied.

[0158] In one embodiment, when the average size in the second direction from the extension line E3 of the third surface to the end of the first band portion is B1, and the average size in the second direction from the extension line E4 of the fourth surface to the end of the second band portion is B2, it is possible to satisfy B1≧G1 and B2≧G2. This makes it possible to improve the bonding strength between the multilayer electronic component 1004 and the substrate 180.

[0159] Figure 14 is a schematic perspective view showing a stacked electronic component 1005 according to one embodiment of the present invention, and Figure 15 is a cross-sectional view along the line VI-VI' in Figure 14.

[0160] Referring to Figures 14 and 15, the first and second external electrodes 131-5 and 132-5 of the stacked electronic component 1005 according to one embodiment of the present invention may not be arranged on the second surface, but rather on the third, fourth, and first surfaces, forming an L-shape. That is, the first and second external electrodes 131-5 and 132-5 may be arranged below the extension of the second surface.

[0161] The first external electrode 131-5 includes a first connecting portion 131a-5 located on the third surface 3, and a first band portion 131b-5 extending from the first connecting portion 131a-5 to a part of the first surface 1. The second external electrode 132-5 includes a second connecting portion 132a-5 located on the fourth surface 4, and a second band portion 132b-5 extending from the second connecting portion 132a-5 to a part of the first surface 1. The external electrodes 131-5 and 132-5 are not located on the second surface 2, and the cover layer 151-5 can be arranged to cover the entire second surface 2. This minimizes the volume occupied by the external electrodes 131-5 and 132-5, thereby improving the capacity per unit volume of the multilayer electronic component 1005. However, the cover layer 151-5 is not limited to covering the entire second surface 2. The cover layer may not cover part or all of the second surface 2, but may be separated to cover the first and second connecting portions 131a-5 and 132a-5, respectively.

[0162] Furthermore, reliability can be further improved by positioning the cover layer 151-5 so as to cover a portion of the fifth and sixth surfaces. In this case, the portions of the fifth and sixth surfaces not covered by the cover layer 151-5 can be exposed to the outside.

[0163] Furthermore, the cover layer 151-5 can be positioned to cover the entirety of the fifth and sixth surfaces. In this case, since the fifth and sixth surfaces are not exposed to the outside, the moisture resistance reliability can be further improved.

[0164] A first plating layer 141-5 is placed on the first band portion 131b-5, and a second plating layer 142-5 is placed on the second band portion 132b-5. The first and second plating layers 141-5 and 142-5 can extend to a portion of the first and second connecting portions 132a-5 and 132b-5.

[0165] Here, the external electrodes 131-5 and 132-5 do not necessarily have to be placed on the fifth and sixth surfaces 5 and 6. In other words, there may be a configuration in which the external electrodes 131-5 and 132-5 are placed only on the third, fourth, and first surfaces.

[0166] Let the average size in the first direction from the first surface 1 to the internal electrode closest to the first surface 1 among the first and second internal electrodes 121 and 122 be H1, and the average size in the first direction from the extension line of the first surface 1 to the ends of the plating layers 141-5 and 142-5 disposed on the first and second connection portions 131a-5 and 132a-5 be H2. Then, H1 < H2 can be satisfied. Thereby, the area contacting the solder during mounting can be increased to improve the fixing strength, and the area where the external electrodes 131-5 and 132-5 contact the plating layers 141-5 and 142-5 can be increased to suppress an increase in ESR (Equivalent Series Resistance).

[0167] More preferably, when the average size in the first direction of the main body 110 is T, H2 < T / 2 can be satisfied. That is, H1 < H2 < T / 2 can be satisfied. This is because when H2 is greater than or equal to T / 2, the effect of improving the moisture resistance reliability by the cover layer may decrease.

[0168] Also, the first and second plating layers 141-5 and 142-5 can be arranged to cover a part of the cover layer 151-5 on the third and fourth surfaces. That is, the plating layers 141-5 and 142-5 can be arranged to cover the ends of the cover layer 151-5 on the third and fourth surfaces. Thereby, the bonding strength between the cover layer 151-5 and the plating layers 141-5 and 142-5 can be strengthened, and the reliability of the stacked electronic component 1005 can be improved.

[0169] Also, the cover layer 151-5 can be arranged to cover a part of the first and second plating layers 141-5 and 142-5 on the third and fourth surfaces. That is, the cover layer 151-5 can be arranged to cover the ends of the plating layers 141-5 and 142-5 on the third and fourth surfaces. Thereby, the bonding strength between the cover layer 151-5 and the plating layers 141-5 and 142-5 can be strengthened, and the reliability of the stacked electronic component 1005 can be improved.

[0170] Figure 16 shows a modified example of Figure 14. Referring to Figure 16, in a modified example (1006) of the stacked electronic component 1005 according to one embodiment of the present invention, a first additional electrode layer 134 may be arranged between the first connection portion 131a-6 and the third surface, and a second additional electrode layer 135 may be arranged between the second connection portion 132a-6 and the fourth surface. The first additional electrode layer 134 may be arranged within a range that does not deviate from the third surface, and the second additional electrode layer 135 may be arranged within a range that does not deviate from the fourth surface. The first and second additional electrode layers 134 and 135 can improve the electrical connectivity between the internal electrodes 121 and 122 and the external electrodes 131-6 and 132-6, and can play a role in improving the mechanical bonding force of the external electrodes 131-6 and 132-6 by having excellent bonding strength with the external electrodes 131-6 and 132-6.

[0171] The first and second external electrodes 131-6 and 132-6 may have an L-shape in which the first and second external electrodes are not positioned on the second surface.

[0172] The first external electrode 131-6 may include a first connecting portion 131a-6 disposed on the first additional electrode layer 134, and a first band portion 131b-6 extending from the first connecting portion 131a-6 to a part of the first surface 1. The second external electrode 132-6 may include a second connecting portion 132a-6 disposed on the second additional electrode layer 135, and a second band portion 132b-6 extending from the second connecting portion 132a-6 to a part of the first surface 1.

[0173] On the other hand, the first and second additional electrode layers 131-6 and 132-6 may be formed using any material that has electrical conductivity, such as metal, and the specific material can be determined by considering electrical properties and structural stability. Furthermore, the first and second additional electrode layers 131-6 and 132-6 may be firing electrodes containing conductive metal and glass, or resin-based electrodes containing conductive metal and resin. In addition, the first and second additional electrode layers 131-6 and 132-6 may be formed by transferring a sheet containing conductive metal onto the main body.

[0174] The conductive metals included in the first and second additional electrode layers 131-6 and 132-6 can be materials with excellent electrical conductivity, but are not particularly limited. For example, the conductive metal may be one or more of Cu, Ni, Pd, Ag, Sn, Cr, and their alloys. The first and second additional electrode layers 131-6 and 132-6 preferably contain one or more of Ni and Ni alloys, which can further improve connectivity with the internal electrodes 121 and 122 containing Ni.

[0175] Figure 17 is a schematic perspective view showing a stacked electronic component 1007 according to one embodiment of the present invention, and Figure 18 is a cross-sectional view along the line VII-VII' in Figure 17.

[0176] Referring to Figures 17 and 18, the stacked electronic component 1007 according to one embodiment of the present invention can have a configuration in which the average thickness t1 of the first and second plating layers 141-6 and 142-6 is thinner than the average thickness t2 of the cover layer 151-6.

[0177] The cover layer 151-6 plays a role in preventing the penetration of moisture and plating solution from the outside, but its weak connectivity with the plating layers 141-6 and 142-6 can cause delamination of the plating layers 141-6 and 142-6. If delamination occurs in the plating layers, the adhesion strength to the substrate 180 may decrease. Here, delamination of the plating layers 141-6 and 142-6 means that the plating layers partially peel off or are physically separated from the external electrodes 131-5 and 132-5. Due to the weak connectivity between the plating layers and the cover layer, there is a higher possibility of gaps forming at the interface between the cover layer and the plating layer, or of foreign matter penetrating, making it more vulnerable to external impacts and increasing the likelihood of delamination.

[0178] According to one embodiment of the present invention, by making the average thickness t1 of the plating layer thinner than the average thickness t2 of the cover layer, the contact area between the plating layer and the cover layer can be reduced, thereby suppressing the occurrence of delamination and improving the bonding strength between the multilayer electronic component 1007 and the substrate 180.

[0179] The average thickness t1 of the first and second plating layers 141-6 and 142-6 can be the average of the thicknesses measured at five equally spaced points on the first and second connecting portions 131a-5 and 132a-5 or the first and second band portions 131b-5 and 132b-5, and the average thickness t2 of the cover layer 151-6 can be the average of the thicknesses measured at five equally spaced points on the first and second connecting portions 131a-5 and 132a-5.

[0180] Figure 19 is a schematic perspective view showing a stacked electronic component 2000 according to one embodiment of the present invention. Figure 20 is a cross-sectional view along the line VIII-VIII' in Figure 19.

[0181] Hereinafter, with reference to Figures 19 and 20, a stacked electronic component 2000 according to one embodiment of the present invention will be described in detail. However, to avoid redundant explanations, content that overlaps with what has been described above will be omitted.

[0182] A stacked electronic component 2000 according to one embodiment of the present invention includes a dielectric layer 111 and first and second internal electrodes 121 and 122 arranged alternately on either side of the dielectric layer, and comprises a body 110 including first and second surfaces 1 and 2 facing in the first direction, third and fourth surfaces 3 and 4 connected to the first and second surfaces and facing in the second direction, and fifth and sixth surfaces 5 and 6 connected to the first to fourth surfaces and facing in the third direction, a first external electrode 231 including a first connecting electrode 231a arranged on the third surface and a first band electrode 231b arranged on the first surface and connected to the first connecting electrode, a second connecting electrode 232a arranged on the fourth surface, and on the first surface The first external electrode 232 includes a second band electrode 232b which is positioned and connected to the second connecting electrode; a first cover layer 251 which is positioned on the first connecting electrode; a second cover layer 252 which is positioned on the second connecting electrode; a first plating layer 241 which is positioned on the first band electrode; and a second plating layer 242 which is positioned on the second band electrode. The first cover layer 251 includes a hydrophilic first base layer 251a and a first insulating layer 251b which is positioned on the first base layer 251a; and the second cover layer 252 may include a hydrophilic second base layer 252a and a second insulating layer 252b which is positioned on the second base layer 252a.

[0183] The first connecting electrode 231a can be positioned on the third surface 3 and connected to the first internal electrode 121, and the second connecting electrode 231b can be positioned on the fourth surface 4 and connected to the second internal electrode 122. In addition, a first cover layer 251 can be positioned on the first connecting electrode 231a, and a second cover layer 252 can be positioned on the second connecting electrode 232a.

[0184] Conventionally, when forming external electrodes, the main method used was to use a paste containing a conductive metal and dip the exposed surface of the main body's internal electrodes into the paste. However, external electrodes formed by the dipping method sometimes had excessive thickness in the center in the thickness direction. Furthermore, even without this problem of thickness unevenness in external electrodes formed by the dipping method, since the internal electrodes are exposed from the third and fourth surfaces of the main body, the external electrodes placed on the third and fourth surfaces were formed to be of a certain thickness or more in order to suppress the penetration of moisture and plating solution through the external electrodes.

[0185] In contrast, in the present invention, since cover layers 251 and 252 are placed on the connecting electrodes 231a and 232a, sufficient reliability can be ensured even if the thickness of the connecting electrodes 231a and 232a on the third and fourth surfaces where the internal electrodes are exposed is reduced.

[0186] The first and second connecting electrodes 231a and 232a can be configured to correspond to the third and fourth surfaces, respectively, and the surfaces of the first and second connecting electrodes 231a and 232a facing the main body 110 can have the same area as the third and fourth surfaces of the main body 110, respectively. The first and second connecting electrodes 231a and 232a can be positioned within a range that does not deviate from the third and fourth surfaces 3 and 4, respectively. The connecting electrodes 231a and 232a can be positioned so as not to extend to the first, second, fifth and sixth surfaces 1, 2, 5 and 6 of the main body 110. Specifically, in one embodiment, the first and second connecting electrodes 231a and 232a can be positioned spaced apart from the fifth and sixth surfaces. This makes it possible to increase the capacity per unit volume of the stacked electronic component 2000 by minimizing the volume occupied by the external electrodes while ensuring sufficient connectivity between the internal electrodes 121 and 122 and the external electrodes 231 and 232.

[0187] From this perspective, the first and second connecting electrodes 231a and 232a can be arranged at a distance from the second surface 2. That is, by not arranging the external electrodes 231 and 232 on the second surface, the volume occupied by the external electrodes 231 and 232 can be further minimized, and the capacity per unit volume of the stacked electronic component 2000 can be further increased.

[0188] However, the connecting electrodes 231a and 232a may include corner portions that extend to and are positioned on the corners of the main body 110. That is, in one embodiment, the first connecting electrode includes a corner portion that extends and is positioned on the first to third corners and the second to third corners, and the second connecting electrode may include a corner portion that extends and is positioned on the first to fourth corners and the second to fourth corners.

[0189] Furthermore, the connecting electrodes 231a and 232a can have a uniform and thin thickness compared to external electrodes formed by the conventional dipping method.

[0190] The method for forming the connecting electrodes 231a and 232a is not particularly limited. For example, they may be formed by transferring sheets containing a conductive metal, an organic substance such as a binder, to the third and fourth surfaces, but are not limited to this method, and may also be formed by plating a conductive metal onto the third and fourth surfaces. In other words, the connecting electrodes 231a and 232a may be a fired layer formed by firing a conductive metal, or they may be a plated layer.

[0191] The thickness of the connecting electrodes 231a and 232a is not particularly limited, but can be, for example, 2 to 7 μm. Here, the thickness of the connecting electrodes 231a and 232a refers to the maximum thickness and can also refer to the size of the connecting electrodes 231a and 232a in the second direction.

[0192] In one embodiment, the first and second connecting electrodes 231a and 232a may contain the same metal and glass as the metal contained in the internal electrodes 121 and 122. By including the same metal as the metal contained in the internal electrodes 121 and 122, the electrical connectivity with the internal electrodes 121 and 122 can be improved, and by including glass in the first and second connecting electrodes 231a and 232a, the bonding strength with the main body 110 and / or cover layers 251 and 252 can be improved. Here, the same metal as the metal contained in the internal electrodes 121 and 122 may be Ni.

[0193] The first and second cover layers 251 and 252 are positioned on the first and second connecting electrodes 231a and 232a, respectively, and serve to prevent the formation of a plating layer on the first and second connecting electrodes 231a and 232a. In addition, the first and second cover layers 251 and 252 improve sealing properties and minimize the penetration of moisture, plating solution, etc., from the outside.

[0194] The first cover layer 251 includes a hydrophilic first base layer 251a and a first insulating layer 251b disposed on the first base layer 251a, and the second cover layer 252 may include a hydrophilic second base layer 252a and a second insulating layer 252b disposed on the second base layer 252a.

[0195] The first and second band electrodes 231b and 232b may be arranged on the first surface 1 of the main body 110. The first and second band electrodes 231b and 232b can be electrically connected to the first and second internal electrodes 121 and 122, respectively, by contacting the first and second connecting electrodes 231a and 232a.

[0196] External electrodes formed by conventional dipping methods are formed thickly on the third and fourth surfaces, and partially extend to the first, second, fifth, and sixth surfaces, which presents a problem in that it is difficult to secure a high effective volume ratio.

[0197] In contrast, according to one embodiment of the present invention, by arranging the first and second connecting electrodes 231a and 232a on the surface where the internal electrodes are exposed, and the first and second band electrodes 231b and 232b on the surface that is mounted on the substrate, a high effective volume ratio can be secured.

[0198] On the other hand, if the internal electrodes 121 and 122 are stacked in a first direction, the stacked electronic component 2000 can be horizontally mounted on the substrate so that the internal electrodes 121 and 122 are parallel to the mounting surface. However, the present invention is not limited to horizontal mounting, and if the internal electrodes 121 and 122 are stacked in a third direction, the stacked electronic component can be vertically mounted on the substrate so that the internal electrodes 121 and 122 are perpendicular to the mounting surface.

[0199] The first and second band electrodes 231b and 232b may be formed using any electrically conductive material such as metal, and the specific material can be determined by considering electrical properties and structural stability. For example, the first and second band electrodes 231 and 232b may be firing electrodes containing conductive metal and glass, or they may be formed by applying a paste containing conductive metal and glass to the first surface of the main body, but are not limited to these, and may also be a plated layer in which conductive metal is plated onto the first surface of the main body.

[0200] The conductive metals included in the first and second band electrodes 231b and 232b can be materials with excellent electrical conductivity, but are not particularly limited. For example, the conductive metal may be one or more of nickel (Ni), copper (Cu), and alloys thereof, and may also include the same metals as those included in the internal electrodes 121 and 122.

[0201] On the other hand, in one embodiment, the first external electrode 231 further includes a third band electrode (not shown) arranged on the second surface 2 and connected to the first connecting electrode 231a, and the second external electrode 232 may further include a fourth band electrode (not shown) arranged on the second surface 2 and connected to the second connecting electrode 232a.

[0202] In one embodiment, when B1 is the distance from the extension line E3 of the third surface to the end of the first band electrode 231b, B2 is the distance from the extension line E4 of the fourth surface to the end of the second band electrode 232b, B3 is the distance from the extension line of the third surface to the end of the third band electrode (not shown), B4 is the distance from the extension line of the fourth surface to the end of the fourth band electrode (not shown), G1 is the average size in the second direction of the region separated from the third surface and the second internal electrode 122, and G2 is the average size in the second direction of the region separated from the fourth surface and the first internal electrode 121, then B1≧G1, B3≦G1, B2≧G2, and B4≦G2 can be satisfied. This minimizes the volume occupied by the external electrodes, increases the capacity per unit volume of the stacked electronic component 2000, and increases the area in contact with the solder during mounting, thereby improving the bonding strength.

[0203] However, the present invention is not intended to limit itself to cases where B1≧G1, B3≦G1, B2≧G2, and B4≦G2 are satisfied, and cases where B1≧G1, B3≧G1, B2≧G2, and B4≧G2 are satisfied can also be included as one embodiment of the present invention. Therefore, in one embodiment, when B1 is the distance from the extension line E3 of the third surface to the end of the first band electrode 231b, B2 is the distance from the extension line E4 of the fourth surface to the end of the second band electrode 232b, B3 is the distance from the extension line of the third surface to the end of the third band electrode (not shown), B4 is the distance from the extension line of the fourth surface to the end of the fourth band electrode (not shown), G1 is the average size in the second direction of the region separated from the third surface and the second internal electrode 122, and G2 is the average size in the second direction of the region separated from the fourth surface and the first internal electrode 121, then B1≧G1, B3≧G1, B2≧G2, and B4≧G2 can be satisfied. As a result, either the first or second surface can be used as the mounting surface, improving the convenience of mounting.

[0204] The first and second plating layers 241 and 242 can be placed on the first and second band electrodes 231b and 232b. The first and second plating layers 241 and 242 play a role in improving mounting characteristics. The first and second plating layers 241 and 242 are not particularly limited in type and may be plating layers containing one or more of Ni, Sn, Pd and their alloys, or may be formed in multiple layers.

[0205] As a more specific example of the first and second plating layers 241 and 242, the first and second plating layers 241 and 242 can be Ni plating layers or Sn plating layers, and can be in a configuration in which the Ni plating layer and the Sn plating layer are sequentially formed on the first and second band electrodes 231b and 232b.

[0206] In one embodiment, the first and second plating layers 241 and 242 can be arranged to extend and cover a portion of the first and second connecting electrodes 231a and 232a, respectively.

[0207] When H1 is the average size in the first direction from the first surface 1 to the internal electrode closest to the first surface 1 among the first and second internal electrodes 121 and 122, and H2 is the average size in the first direction from the extension of the first surface 1 to the ends of the first and second plating layers 241 and 242 placed on the first and second connecting electrodes 231a and 232a, the condition H1 > H2 (or H1 ≥ H2) can be satisfied. This suppresses the penetration of the plating solution into the internal electrodes during the plating process and improves reliability.

[0208] In one embodiment, the first and second cover layers 251 and 252 are arranged to be in direct contact with the first and second connecting electrodes 231a and 232a, respectively, and the first and second connecting electrodes 231a and 232a may include conductive metal and glass. By doing so, the plating layers 241 and 242 are not arranged in the areas of the outer surface of the first and second connecting electrodes 231a and 232a where the cover layers 251 and 252 are arranged, thereby effectively suppressing corrosion of the external electrodes by the plating solution.

[0209] In one embodiment, the first and second cover layers 251 and 252 are arranged to be in direct contact with the first and second connecting electrodes 231a and 232a, respectively, and the first and second connecting electrodes 231a and 232a may include conductive metal and resin. By doing so, the plating layers 241 and 242 are not arranged in the areas of the outer surface of the first and second connecting electrodes 231a and 232a where the cover layers 251 and 252 are arranged, thereby effectively suppressing corrosion of the external electrodes by the plating solution.

[0210] In one embodiment, the first plating layer 241 can be positioned to cover the edge of the first cover layer 251 placed on the first external electrode 231, and the second plating layer 242 can be positioned to cover the edge of the second cover layer 252 placed on the second external electrode 232. This strengthens the bonding force between the cover layers 251, 252 and the plating layers 241, 242, improving the reliability of the multilayer electronic component 2000. Furthermore, by forming the first and second cover layers 251, 252 before forming the plating layers 241, 242 on the external electrodes 231, 232, the penetration of the plating solution during the plating layer formation process can be more reliably suppressed. By forming the cover layers before the plating layers, the plating layers 241, 242 can have a configuration that covers the edges of the cover layers 251, 252.

[0211] In one embodiment, the first cover layer 251 can be positioned to cover the edge of the first plating layer 241 placed on the first external electrode 231, and the second cover layer 252 can be positioned to cover the edge of the second plating layer 242 placed on the second external electrode 232. This strengthens the bonding force between the cover layer 251 and the plating layers 241 and 242, improving the reliability of the multilayer electronic component 2000.

[0212] Figure 21 shows a modified example of Figure 19. Referring to Figure 21, in a modified example (2001) of a stacked electronic component 2000 according to one embodiment of the present invention, the first and second cover layers 251-1 and 252-1 can be connected to a single cover layer 253-1 by extending to the fifth and sixth surfaces 5 and 6 and connecting them to each other. Here, the connected first and second cover layers 253-1 may be arranged to cover a portion of the fifth and sixth surfaces.

[0213] Figure 22 is a schematic perspective view showing a stacked electronic component 2002 according to one embodiment of the present invention. Figure 23 is a cross-sectional view along the line IX-IX' in Figure 22.

[0214] Referring to Figures 22 and 23, in the stacked electronic component 2002 according to one embodiment of the present invention, the first and second plating layers 241-2 and 242-2 can be positioned below the extension line of the first surface. This minimizes the height of the solder during mounting and minimizes the mounting space.

[0215] Furthermore, the first and second cover layers 251-2 and 252-2 may be arranged to extend below the extension line of the first surface and be in contact with the first and second plating layers 241-2 and 242-2.

[0216] Figure 24 shows a modified example of Figure 22. Referring to Figure 24, a modified example (2003) of the stacked electronic component 2002 according to one embodiment of the present invention is such that the first and second cover layers 251-3 and 252-3 can be connected to a single cover layer 253-3 by extending to the fifth and sixth surfaces 5 and 6 and connecting to each other. Here, the connected first and second cover layers 253-3 may be arranged to cover the entirety of the fifth and sixth surfaces.

[0217] Figure 25 is a schematic perspective view showing a stacked electronic component 2004 according to one embodiment of the present invention. Figure 26 is a cross-sectional view taken along the line X-X' in Figure 25.

[0218] Referring to FIGS. 25 and 26, a stacked electronic component 2004 according to an embodiment of the present invention is disposed on the first surface 1 and may further include an additional insulating layer 261 disposed between the first band electrode 231b and the second band electrode 232b. By doing so, it is possible to prevent leakage current and the like that may occur between the first band electrode 231b and the second band electrode 232b under a high voltage current.

[0219] The type of the additional insulating layer 261 does not need to be particularly limited. For example, the additional insulating layer 261 may include one or more selected from epoxy resin, acrylic resin, ethyl cellulose, etc., and may include glass.

[0220] FIG. 27 is a view showing a modified example of FIG. 25. Referring to FIG. 27, a modified example (2005) of a stacked electronic component 2004 according to an embodiment of the present invention can be connected to a single cover layer 253-5 by the first and second cover layers 251-5 and 252-5 extending to the fifth and sixth surfaces 5 and 6 and being connected to each other.

[0221] FIG. 28 is a perspective view schematically showing a stacked electronic component 2006 according to an embodiment of the present invention. FIG. 29 is a cross-sectional view taken along the line XI-XI' of FIG. 28.

[0222] Referring to FIGS. 28 and 29, a stacked electronic component 2006 according to an embodiment of the present invention includes a first cover layer 251-6 disposed on the first connecting electrode 231a and a second cover layer 252-6 disposed on the second connecting electrode 232a. When the average size in the first direction from the first surface 1 to the internal electrode closest to the first surface 1 among the first and second internal electrodes 121 and 122 is H1, and the average size in the first direction from the extension line of the first surface 1 to the ends of the first and second plating layers 241-6 and 242-6 disposed on the first and second connecting electrodes 231a and 232a is H2, H1 < H2 can be satisfied. Thereby, the area in contact with solder during mounting can be increased, and the fixing strength can be improved.

[0223] More preferably, when the average size of the main body 110 in the first direction is T, H2 < T / 2 can be satisfied. That is, H1 < H2 < T / 2 can be satisfied. This is because when H2 is greater than or equal to T / 2, the effect of improving the moisture resistance reliability by the cover layer may decrease.

[0224] FIG. 30 is a diagram showing a modified example of FIG. 28. Referring to FIG. 30, a modified example (2007) of the stacked electronic component 2006 according to an embodiment of the present invention can be connected to a single cover layer 253-7 by the first and second cover layers 251-7 and 252-7 extending to the fifth and sixth surfaces 5 and 6 and being connected to each other.

[0225] FIG. 31 is a perspective view schematically showing a stacked electronic component 2008 according to an embodiment of the present invention. FIG. 32 is a cross-sectional view taken along the line XII-XII' of FIG. 31.

[0226] Referring to FIGS. 31 and 32, a stacked electronic component 2008 according to an embodiment of the present invention can be connected to a single cover layer 253-8 by the first and second cover layers 251-8 and 252-8 extending to the second, fifth, and sixth surfaces 2, 5, and 6 and being connected to each other. As shown in FIG. 31, the cover layer 253-8 can be in a form that entirely covers the second surface, and the fifth and sixth surfaces can be in a form that covers only a part thereof.

[0227] FIG. 33 is a perspective view schematically showing a stacked electronic component 2009 according to an embodiment of the present invention. FIG. 34 is a cross-sectional view taken along the line XIII-XIII' of FIG. 33.

[0228] Referring to FIGS. 33 and 34, a stacked electronic component 2009 according to an embodiment of the present invention can be in a form where the average thickness t1 of the first and second plating layers 241-9 and 242-9 is thinner than the average thickness t2 of the first and second cover layers 251-9 and 252-9.

[0229] According to one embodiment of the present invention, by making the average thickness t1 of the first and second plating layers 241-9 and 242-9 thinner than the average thickness t2 of the first and second cover layers 251-9 and 252-9, the area in contact between the plating layer and the cover layer can be reduced, thereby suppressing the occurrence of delamination and improving the bonding strength between the multilayer electronic component 2009 and the substrate 180.

[0230] The average thickness t1 of the first and second plating layers 241-9 and 242-9 is the average of the thicknesses measured at five equally spaced points on the first and second connecting electrodes 231a and 232a or the first and second band electrodes 231b and 232b, and the average thickness t2 of the cover layers 251-9 and 252-9 is the average of the thicknesses measured at five equally spaced points on the first and second connecting electrodes 231a and 232a.

[0231] Figure 35 shows a modified example of Figure 33. Referring to Figure 35, a modified example (2010) of a stacked electronic component 2009 according to one embodiment of the present invention can be connected to a single cover layer 253-10 by having the first and second cover layers 251-10 and 252-10 extend to the fifth and sixth surfaces 5 and 6 and connect to each other.

[0232] Figure 36 is a schematic perspective view of a stacked electronic component 3000 according to one embodiment of the present invention. Figure 37 is a cross-sectional view along the line XIV-XIV' in Figure 36. Figure 38 is an enlarged view of region K1 in Figure 36.

[0233] Referring to Figures 36 to 38, a stacked electronic component 3000 according to one embodiment of the present invention includes a dielectric layer 111 and first and second internal electrodes 121 and 122 arranged alternately on either side of the dielectric layer, and comprises a body 110 including first and second surfaces facing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and facing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and facing each other in a third direction, and a first external electrode 331 including a first connecting portion 331a arranged on the third surface of the body, a first band portion 331b extending from the first connecting portion to a part of the first surface, and a first corner portion 331c extending from the first connecting portion to the corner connecting the second and third surfaces of the body. The device includes a second external electrode 332 comprising a second connecting portion 332a located on the fourth surface of the main body, a second band portion 332b extending from the second connecting portion to a part of the first surface, and a second corner portion 332c extending from the second connecting portion to a corner connecting the second and fourth surfaces of the main body; a cover layer 351 located on the first and second connecting portions 331a, 332a and positioned to cover the second surface and the first and second corner portions; a first plating layer 341 located on the first band portion; and a second plating layer 342 located on the second band portion, wherein the cover layer 351 may include a hydrophilic base layer 351a and an insulating layer 351b located on the base layer.

[0234] In one embodiment, when B3 is the average size in the second direction from the extension line of the third surface to the end of the first corner portion 331c, B4 is the average size in the second direction from the extension line of the fourth surface to the end of the second corner portion 332c, G1 is the average size in the second direction of the region separated from the third surface and the second internal electrode, and G2 is the average size in the second direction of the region separated from the fourth surface and the first internal electrode, then B3 ≤ G1 and B4 ≤ G2 can be satisfied. This minimizes the volume occupied by the external electrodes 331 and 332 and increases the capacity per unit volume of the stacked electronic component 3000.

[0235] Here, if we let B1 be the average size in the second direction from the extension line of the third surface to the end of the first band portion 331b, and B2 be the average size in the second direction from the extension line of the fourth surface to the end of the second band portion 332b, then B1≧G1 and B3≧G2 can be satisfied. This increases the area in contact with the solder during mounting and improves the bonding strength.

[0236] A stacked electronic component 3000 according to one embodiment may include a body 110 that includes a dielectric layer 111 and first and second internal electrodes 121 and 122 arranged alternately on either side of the dielectric layer, and has first and second faces facing in a first direction, third and fourth faces connected to the first and second faces and facing in a second direction, and fifth and sixth faces connected to the first to fourth faces and facing in a third direction. The body 110 of the stacked electronic component 3000 may have the same configuration as the body 110 of the stacked electronic component 1000, except that the end of the first or second face of the body 110 is contracted, as will be described later.

[0237] External electrodes 331 and 332 can be arranged on the third and fourth surfaces 3 and 4 of the main body 110. The external electrodes 331 and 332 may include a first external electrode 331 arranged on the third surface 3 of the main body 110 and connected to a first internal electrode 121, and a second external electrode 332 arranged on the fourth surface 4 of the main body 110 and connected to a second internal electrode 122.

[0238] The external electrodes 331 and 332 may include a first external electrode 331 which includes a first connecting portion 331a located on the third surface, a first band portion 331b extending from the first connecting portion to a part of the first surface, and a first corner portion 331c extending from the first connecting portion to the corner connecting the second surface and the third surface, and a second external electrode 332 which includes a second connecting portion 332a located on the fourth surface, a second band portion 332b extending from the second connecting portion to a part of the first surface, and a second corner portion 332c extending from the second connecting portion to the corner connecting the second surface and the fourth surface. The first connecting portion 331a may be connected to the first internal electrode 121 on the third surface, and the second connecting portion 332a may be connected to the second internal electrode 122 on the fourth surface.

[0239] In one embodiment, the first and second connecting portions 331a and 332a can be arranged at a distance from the fifth and sixth surfaces. This minimizes the specific gravity occupied by the external electrodes 331 and 332, making the multilayer electronic component 3000 smaller.

[0240] Due to the overlap of margin regions on the dielectric layer 111 where internal electrodes 121 and 122 are not placed, a step difference occurs due to the thickness of the internal electrodes 121 and 122, and the corners connecting the first surface with the third to fifth surfaces and / or the corners connecting the second surface with the third to fifth surfaces may have a form that is contracted toward the center in the first direction of the main body 110 when viewed with reference to the first or second surface. Alternatively, due to the shrinkage behavior during the sintering process of the main body, the corners connecting the first surface 1 with the third to sixth surfaces 3, 4, 5, and 6 and / or the corners connecting the second surface 2 with the third to sixth surfaces 3, 4, 5, and 6 may have a form that is contracted toward the center in the first direction of the main body 110 when viewed with reference to the first or second surface. Alternatively, to prevent chipping defects, the corners connecting each face of the main body 110 can be rounded in a separate process, so that the corners connecting the first face with the third to sixth faces and / or the corners connecting the second face with the third to sixth faces have a rounded shape.

[0241] The above-mentioned corners may include the 1st-3rd corner C1-3 connecting the 1st and 3rd faces, the 1st-4th corner C1-4 connecting the 1st and 4th faces, the 2nd-3rd corner C2-3 connecting the 2nd and 3rd faces, and the 2nd-4th corner C2-4 connecting the 2nd and 4th faces. Furthermore, the above-mentioned corners may include the 1st-5th corner connecting the 1st and 5th faces, the 1st-6th corner connecting the 1st and 6th faces, the 2nd-5th corner connecting the 2nd and 5th faces, and the 2nd-6th corner connecting the 2nd and 6th faces. However, in order to suppress the step caused by the internal electrodes 121 and 122, if, after lamination, the internal electrodes are cut so that they are exposed from the fifth and sixth surfaces 5 and 6 of the main body, and then a single dielectric layer or two or more dielectric layers are laminated in the third direction (width direction) on both sides of the capacitance forming portion Ac to form margin portions 114 and 115, then the portions connecting the first surface with the fifth and sixth surfaces, and the portions connecting the second surface with the fifth and sixth surfaces, may not have a contracted form.

[0242] On the other hand, the first to sixth surfaces of the main body 110 are almost flat, and the non-flat areas can be considered as corners. In addition, the areas of the external electrodes 331 and 332 that are located on the corners can be considered as corner sections.

[0243] From this perspective, the first and second corner portions 331c and 332c can be positioned below the extension line E2 of the second surface, and the first and second corner portions 331c and 332c can be positioned away from the second surface. That is, by not positioning the external electrodes 331 and 332 on the second surface, the volume occupied by the external electrodes 331 and 332 can be further minimized, and the capacity per unit volume of the stacked electronic component 3000 can be further increased. In addition, the first corner portion 331c may be positioned on a part of the second-third corner C2-3 connecting the third surface and the second surface, and the second corner portion 332c may be positioned on a part of the second-fourth corner C2-4 connecting the fourth surface and the second surface.

[0244] The extension line E2 of the second face can be defined as follows:

[0245] In the length-thickness cross-section (LT cross-section) obtained by cutting the stacked electronic component 3000 in the center in the width direction, when seven straight lines P0, P1, P2, P3, P4, P5, P6, and P7 are drawn in the thickness direction with equal spacing in the length direction from the third face to the fourth face, the straight line passing through the point where P2 intersects the second face and the point where P4 intersects the second face can be defined as the extension line E2 of the second face.

[0246] On the other hand, the external electrodes 331 and 332 may be formed using any material that has electrical conductivity, such as metal, and the specific material may be determined by considering electrical properties and structural stability, and furthermore, they may have a multilayer structure.

[0247] The external electrodes 331 and 332 may be firing electrodes containing conductive metal and glass, or resin-based electrodes containing conductive metal and resin.

[0248] Furthermore, the external electrodes 331 and 332 may be formed by sequentially forming a fired electrode and a resin-based electrode on the main body. In addition, the external electrodes 331 and 332 may be formed by transferring a sheet containing a conductive metal onto the main body, or by transferring a sheet containing a conductive metal onto a fired electrode.

[0249] The conductive metal included in the external electrodes 331 and 332 can be any material with excellent electrical conductivity, but is not particularly limited. For example, the conductive metal can be one or more of Cu, Ni, Pd, Ag, Sn, Cr, and their alloys. The external electrodes 331 and 332 preferably contain one or more of Ni and Ni alloys, which can further improve connectivity with the internal electrodes 121 and 122 containing Ni.

[0250] The cover layer 351 can be placed on the first and second connecting portions 331a and 332a.

[0251] Since the first and second connecting portions 331a and 332a are connected to the internal electrodes 121 and 122, they can become pathways for the penetration of plating solution during the plating process or for the penetration of moisture during actual use. In the present invention, since the cover layer 351 is placed on the connecting portions 331a and 332a, it is possible to prevent the penetration of moisture from the outside or the penetration of plating solution.

[0252] The cover layer 351 can be positioned in contact with the first and second plating layers 341 and 342. Here, the cover layer 351 may be in contact with the first and second plating layers 341 and 342 in a manner that covers a portion of their edges, or the first and second plating layers 341 and 342 may be in contact with the cover layer 351 in a manner that covers a portion of its edges.

[0253] The cover layer 351 can be positioned on the first and second connecting portions 331a and 332a, and can be positioned to cover the second surface and the first and second corner portions 331c and 332c. Furthermore, by covering the area where the ends of the first and second corner portions 331c and 332c and the main body 110 are in contact, thereby blocking the moisture penetration path, the moisture resistance reliability can be further improved.

[0254] The cover layer 351 can be positioned on the second surface and extend to the first and second connection portions 331a and 332a. If the external electrodes 331 and 332 are not positioned on the second surface, the cover layer can be positioned to cover the entire second surface. On the other hand, the cover layer 351 does not necessarily have to be positioned on the second surface; it may not be positioned on part or all of the second surface, and the cover layer may be separated into two parts and positioned on the first and second connection portions 331a and 332a respectively. However, even in this case, the cover layer can be positioned to cover the entire first and second corner portions 331c and 332c. If the cover layer is not positioned on the entire second surface, it can be positioned below the extension line of the second surface. Furthermore, the cover layer may not be positioned on the second surface at all, but may extend from the first and second connection portions 331a and 332a to the fifth and sixth surfaces, forming a single cover layer.

[0255] In one embodiment, the cover layer 351 is positioned to cover a portion of the fifth and sixth surfaces, thereby improving reliability. In this case, the portion of the fifth and sixth surfaces not covered by the cover layer can be exposed to the outside.

[0256] Furthermore, the cover layer 351 can be positioned to cover the entirety of the fifth and sixth surfaces. In this case, since the fifth and sixth surfaces are not exposed to the outside, the moisture resistance reliability can be further improved.

[0257] The cover layer 351 serves to prevent the formation of plating layers 341 and 342 on the external electrodes 331 and 332 on which the cover layer 351 is placed, thereby improving sealing properties and minimizing the penetration of moisture, plating solutions, etc., from the outside. The components, composition, average thickness, and effects of the cover layer 351 are the same as those of the cover layers 151, 251, 252, and 253 included in the multilayer electronic components 1000, 2000 or various embodiments thereof, so a detailed explanation of these is omitted.

[0258] The first and second plating layers 341 and 342 can be placed on the first and second band portions 331b and 332b, respectively. The plating layers 341 and 342 play a role in improving mounting characteristics, and by placing the plating layers 341 and 342 on the band portions 331b and 332b, the mounting space can be minimized, and the penetration of the plating solution into the internal electrodes can be minimized, thereby improving reliability. The first and second plating layers 341 and 342 can have one end in contact with the first surface and the other end in contact with the cover layer 351.

[0259] The plating layers 341 and 342 are not particularly limited in type and may be plating layers containing one or more of Cu, Ni, Sn, Ag, Au, Pd, and their alloys, and may also be formed in multiple layers.

[0260] As a more specific example of the plating layers 341 and 342, the plating layers 341 and 342 may be Ni plating layers or Sn plating layers, and may be in a form in which the Ni plating layer and the Sn plating layer are sequentially formed on the first and second band portions 331b and 332b.

[0261] In one embodiment, the cover layer 351 is arranged in direct contact with the first and second external electrodes 331 and 332, and the first and second external electrodes 331 and 332 may include conductive metal and glass. By doing so, the plating layers 341 and 342 are not placed in the area of ​​the outer surface of the first and second external electrodes 331 and 332 where the cover layer 351 is placed, thereby effectively suppressing corrosion of the external electrodes by the plating solution.

[0262] In one embodiment, the cover layer 351 is arranged in direct contact with the first and second external electrodes 331 and 332, and the first and second external electrodes 331 and 332 may include conductive metal and resin. By doing so, the plating layers 341 and 342 are not placed in the area of ​​the outer surface of the first and second external electrodes 331 and 332 where the cover layer 351 is placed, thereby effectively suppressing corrosion of the external electrodes by the plating solution.

[0263] In one embodiment, the first plating layer 341 can be positioned to cover the edge of the cover layer 351 placed on the first external electrode 331, and the second plating layer 342 can be positioned to cover the edge of the cover layer 351 placed on the second external electrode 332. This strengthens the bonding force between the cover layer 351 and the plating layers 341 and 342, improving the reliability of the multilayer electronic component 3000. Furthermore, by forming the cover layer 351 before forming the plating layers 341 and 342 on the external electrodes 331 and 332, the penetration of the plating solution during the plating layer formation process can be more reliably suppressed. By forming the cover layer before the plating layer, the plating layers 341 and 342 can have a configuration that covers the edge of the cover layer 351.

[0264] In one embodiment, the cover layer 351 is disposed to cover the ends of the first plating layer 341 disposed on the first external electrode 331, and the cover layer 351 can be disposed to cover the ends of the second plating layer 342 disposed on the second external electrode 332. Thereby, the bonding strength between the cover layer 351 and the plating layers 341 and 342 can be strengthened, and the reliability of the stacked electronic component 3000 can be improved.

[0265] In one embodiment, the first and second plating layers 341 and 342 can be extended and disposed so as to cover a part of the first and second connection portions 331a and 332a, respectively. When the average size in the first direction from the first and second internal electrodes 121 and 122 to the internal electrode disposed closest to the first surface 1 is H1, and the average size in the first direction from the extension line of the first surface 1 to the ends of the first and second plating layers 341 and 342 disposed on the first and second connection portions 331a and 332a is H2, H1 > H2 (or H1 ≥ H2) can be satisfied. Thereby, it is possible to suppress the penetration of the plating solution into the internal electrode during the plating process and improve the reliability.

[0266] In one embodiment, when the average size in the first direction from the first surface to the internal electrode disposed closest to the first surface among the first and second internal electrodes 121 and 122 is H1, and the average size in the first direction from the extension line of the first surface to the ends of the plating layers 341 and 342 disposed on the first and second connection portions 331a and 332a is H2, H1 < H2 can be satisfied. Thereby, the area contacting the solder during mounting can be increased, and the fixing strength can be improved. More preferably, when the average size in the first direction of the main body 110 is T, H2 < T / 2 can be satisfied. That is, H1 < H2 < T / 2 can be satisfied. This is because when H2 is greater than or equal to T / 2, the effect of improving the moisture resistance reliability by the cover layer may decrease.

[0267] In one embodiment, the first and second plating layers 341 and 342 can be disposed below the extension line of the first surface. Thereby, the height of the solder during mounting can be minimized, and the mounting space can be minimized. Further, the cover layer 351 can be disposed to extend below the extension line of the first surface and contact the first and second plating layers 341 and 342.

[0268] In one embodiment, when the average size of the main body in the second direction is L, the average size in the second direction from the extension line of the third surface to the end of the first band portion is B1, and the average size in the second direction from the extension line of the fourth surface to the end of the second band portion is B2, 0.2 ≦ B1 / L ≦ 0.4 and 0.2 ≦ B2 / L ≦ 0.4 can be satisfied.

[0269] When B1 / L and B2 / L are less than 0.2, it is difficult to ensure sufficient adhesion strength. On the other hand, when B2 / L exceeds 0.4, there is a risk of leakage current occurring between the first band portion 331b and the second band portion 332b under high voltage current, and the first band portion 331b and the second band portion 332b may be electrically connected due to plating bleeding during the plating process.

[0270] In one embodiment, it can further include an additional insulating layer disposed on the first surface and between the first band portion 331b and the second band portion 332b. By doing so, leakage current and the like that may occur between the first band portion 331b and the second band portion 332b under high voltage current can be prevented.

[0271] The type of the additional insulating layer does not need to be particularly limited. For example, the additional insulating layer may include one or more selected from epoxy resin, acrylic resin, ethyl cellulose, etc., and may include glass.

[0272] In one embodiment, when the average size in the second direction from the extension line of the third surface to the end of the first band portion is B1, and the average size in the second direction from the extension line of the fourth surface to the end of the second band portion is B2, B3 < B1 and B4 < B2 can be satisfied. The average length B1 of the first band portion 331b can be longer than the average length B3 of the first corner portion 331c, and the average length B2 of the second band portion 332b can be longer than the average length B4 of the second corner portion 332c. Thereby, the area contacting the solder during mounting can be increased, and the fixing strength can be improved.

[0273] More specifically, when the average size in the second direction from the extension line of the third surface 3 to the end of the first band portion 331b is B1, the average size in the second direction from the extension line of the fourth surface 4 to the end of the second band portion 332b is B2, the average size in the second direction from the extension line of the third surface 3 to the end of the first corner portion 331c is B3, and the average size in the second direction from the extension line of the fourth surface 4 to the end of the second corner portion 332c is B4, B3 < B1 and B4 < B2 can be satisfied.

[0274] In one embodiment, the average thicknesses of the first and second plating layers 341 and 342 can be thinner than the average thickness of the cover layer 351.

[0275] The cover layer 351 serves to prevent the penetration of moisture from the outside and the penetration of the plating solution. However, since the connectivity with the plating layers 341 and 342 is weak, it can cause delamination of the plating layer. When delamination occurs in the plating layer, the fixing strength with the substrate may decrease. Here, delamination of the plating layer means that the plating layer is partially peeled off or physically separated from the external electrodes 331 and 332. Since the connectivity between the plating layer and the cover layer is weak, there is a high possibility that gaps will occur or foreign substances will penetrate at the interface between the cover layer and the plating layer, making it vulnerable to external impacts and increasing the possibility of delamination.

[0276] According to one embodiment of the present invention, by making the average thickness of the plating layer thinner than the average thickness of the cover layer, the contact area between the plating layer and the cover layer can be reduced, thereby suppressing the occurrence of delamination and improving the bonding strength between the multilayer electronic component 3000 and the substrate.

[0277] There is no particular limit to the size of the 3000 multilayer electronic component.

[0278] However, in order to achieve both miniaturization and high capacity simultaneously, it is necessary to reduce the thickness of the dielectric layer and internal electrodes and increase the number of layers. Therefore, the improvement in reliability and capacity per unit volume according to the present invention becomes more pronounced in stacked electronic components 3000 having a size of 1005 (length × width, 1.0 mm × 0.5 mm) or less.

[0279] Therefore, considering manufacturing tolerances, the size of external electrodes, etc., the reliability improvement effect according to the present invention becomes more pronounced when the length of the stacked electronic component 3000 is 1.1 mm or less and the width is 0.55 mm or less. Here, the length of the stacked electronic component 3000 can mean the maximum size of the stacked electronic component 3000 in the second direction, and the width of the stacked electronic component 3000 can mean the maximum size of the stacked electronic component 3000 in the third direction.

[0280] The following describes the method for manufacturing the multilayer electronic components mentioned above. However, this is not an exhaustive explanation, and any content that overlaps with what has been described above will be omitted to avoid repetition.

[0281] A method for manufacturing a stacked electronic component according to one embodiment of the present invention may include the steps of: forming a body including a dielectric layer and internal electrodes; forming external electrodes on the body; plasma treating the outer surface of the external electrodes and the outer surface of the body on which the external electrodes are not formed; forming an insulating layer on the external electrodes; and forming a plating layer in the region of the external electrodes on which the insulating layer is not formed.

[0282] As described above, the main body 110 may have first and second surfaces 1 and 2 facing each other in the first direction, third and fourth surfaces 3 and 4 connected to the first and second surfaces 1 and 2 and facing each other in the second direction, and fifth and sixth surfaces 5 and 6 connected to the first and second surfaces 1 and 2 and connected to the third and fourth surfaces 3 and 4 and facing each other in the third direction. Furthermore, the main body 110 may include a first-to-third corner connecting the first surface and the third surface, a first-to-fourth corner connecting the first surface and the fourth surface, a second-to-third corner connecting the second surface and the third surface, and a second-to-fourth corner connecting the second surface and the fourth surface. The first-to-third corner and the second-to-third corner may have a form that contracts towards the center of the main body in the first direction as it approaches the third surface, and the first-to-fourth corner and the second-to-fourth corner may have a form that contracts towards the center of the main body in the first direction as it approaches the fourth surface.

[0283] Furthermore, the shape of the external electrode is not particularly limited and may have the configuration described above.

[0284] By plasma-treating the outer surfaces of the external electrodes and the main body, the bonding strength between the insulating layer and the external electrodes can be improved, and physical peeling and damage to the insulating layer caused by polishing, plating, etc., can be suppressed. Here, the plasma-treated surfaces of the external electrodes 131, 132 and the main body 110 can be referred to as the base layer 151a described above.

[0285] Although not limited to this, plasma treatment may be performed in areas other than the region where the plating layer is formed. This can improve the electrical connectivity between the plating layer and the external electrode.

[0286] In one embodiment, the plasma treatment may be performed using a plasma generated with a mixed gas of O2 and Ar. That is, the plasma treatment may be an O2 / Ar plasma surface treatment.

[0287] By performing O2 / Ar plasma surface treatment, the illuminance can be improved and the surface energy can be increased for the surfaces of the external electrodes 131 and 132 and the surface of the main body 110. Also, hydrophilicity can be imparted to the surfaces of the external electrodes 131 and 132 and the surface of the main body 110. Thereby, the bonding strength between the insulating layer 151b and the external electrodes 131 and 132 can be improved.

[0288] In one embodiment, the plasma treatment may be performed such that the outer surfaces of the external electrodes 131 and 132 are oxidized. By oxidizing the outer surfaces of the external electrodes 131 and 132, the outer surfaces of the external electrodes 131 and 132 come to have surface roughness, and the bonding strength between the insulating layer 151b and the external electrodes 131 and 132 can be improved.

[0289] In one embodiment, the external electrodes 131 and 132 may contain a metal that is easily oxidized as a conductive metal. In particular, when the external electrodes 131 and 132 contain Cu as a conductive metal, oxides containing Cu are formed on the surfaces of the external electrodes 131 and 132, and the surface roughness of the external electrodes 131 and 132 becomes higher, so that the bonding strength between the insulating layer 151b and the external electrodes 131 and 132 can be further improved. Here, the oxide containing Cu may be one or more of CuO and Cu2O.

[0290] In one embodiment, the plasma treatment may be performed such that the surface roughness of the outer surface of the external electrode increases. By the above-described O2 / Ar plasma surface treatment, the plasma treatment can be performed such that the surface roughness of the outer surface of the external electrode increases, and the surface roughness can be controlled by adjusting the ratio of O2 and Ar gases.

[0291] Next, an insulating layer is formed on the external electrode. The method of forming the insulating layer does not particularly need to be limited. For example, after forming the external electrodes 131 and 132 on the main body 100, performing plasma treatment, and then applying a paste containing glass powder or dipping in a paste containing glass and then performing heat treatment, the insulating layer 151b may be formed.

[0292] Next, a plating layer is formed on the region of the external electrode where the insulating layer is not formed. The method for forming the plating layer is not particularly limited and can be formed using methods such as electroless plating or electrolytic plating.

[0293] Although embodiments of the present invention have been described in detail above, the present invention is not limited to the embodiments and accompanying drawings, but is limited by the claims attached. Therefore, within the scope of the technical idea of ​​the present invention as described in the claims, various forms of substitution, modification, and alteration are possible by persons with ordinary skill in the art, and these also fall within the scope of the present invention.

[0294] It should be noted that the expression "one embodiment" used in this invention does not mean that each embodiment is the same as another, but is provided to emphasize and describe the unique and distinct features of each embodiment. However, the above-presented embodiment does not preclude its realization in combination with the features of other embodiments. For example, a matter described in a particular embodiment can be understood as a description according to another embodiment, even if it is not described in another embodiment, as long as there is no description in the other embodiment that contradicts or contradicts that matter.

[0295] The terms used in this invention are used solely to describe one embodiment and are not intended to limit the invention. Here, singular expressions include plural expressions unless the context clearly indicates otherwise. [Explanation of Symbols]

[0296] 1000, 2000, 3000 Stacked Electronic Components 1100 Mounting board 110 Main Unit 111 Dielectric layer 112, 113 Cover section 114, 115 Margin section 121, 122 Internal electrode 131, 231, 331 1st external electrode 132, 232, 332 2nd external electrode 134, 135 Additional electrode layer 141, 142, 241, 242, 341, 342 Plating layer 151, 251, 252, 253, 351 Cover layer 151a, 251a, 252a, 253a, 351a Base layer 151b, 251b, 252b, 253b, 351b Insulating layer 161, 261 Additional insulating layer 180 circuit boards 181, 182 Electrode Pads 191, 192 Handa

Claims

Claim 1: A laminated electronic component comprising a dielectric layer, and first and second internal electrodes alternately disposed with the dielectric layer interposed therebetween, a main body including first and second surfaces facing in a first direction, third and fourth surfaces connected to the first and second surfaces and facing in a second direction, and fifth and sixth surfaces connected to the first through fourth surfaces and facing in a third direction, a first external electrode including a first connection portion disposed on the third surface and a first band portion extending from the first connection portion to a part of the first surface, a second external electrode including a second connection portion disposed on the fourth surface and a second band portion extending from the second connection portion to a part of the first surface, a cover layer including a first cover layer disposed on the first connection portion and a second cover layer disposed on the second connection portion, a plating layer including a first plating layer disposed on the first band portion and a second plating layer disposed on the second band portion, wherein the cover layer includes a base layer having hydrophilicity and an insulating layer disposed on the base layer, one end portion of the first plating layer extends to abut against one end portion of the first cover layer, and one end portion of the second plating layer extends to abut against one end portion of the second cover layer. Claim 2: The laminated electronic component according to claim 1, wherein the base layer has a contact angle with water of 60 degrees or less. Claim 3: The laminated electronic component according to claim 1, wherein the base layer has a surface roughness at an interface with the cover layer. Claim 4: The laminated electronic component according to claim 1, wherein the base layer contains O₂. Claim 5: The laminated electronic component according to claim 1, wherein the base layer contains a metal oxide in a region in contact with the first and second external electrodes. Claim 6: The laminated electronic component according to claim 5, wherein the metal oxide is an oxide containing Cu. Claim 7: When an average size in the first direction from the first surface to the internal electrode closest to the first surface among the first and second internal electrodes is H1, and an average size in the first direction from an extension line of the first surface to an end portion of the plating layer disposed on the first and second connection portions is H2, the laminated electronic component according to claim 1 satisfies H1 > H2.

8. The laminated electronic component according to claim 1, wherein when the average size in the first direction from the first surface to the internal electrode among the first and second internal electrodes that is closest to the first surface is H1, and the average size in the first direction from the extension line of the first surface to the end of the plating layer disposed on the first and second connection portions is H2, H1 < H2 is satisfied.

9. When the average size in the first direction of the main body is T, the laminated electronic component according to claim 8, wherein H2 < T / 2 is satisfied.

10. The laminated electronic component according to claim 1, wherein the first and second plating layers are disposed below the extension line of the first surface.

11. When the average size in the second direction of the main body is L, the average size in the second direction from the extension line of the third surface to the end of the first band portion is B1, and the average size in the second direction from the extension line of the fourth surface to the end of the second band portion is B2, the laminated electronic component according to claim 1, wherein 0.2 ≦ B1 / L ≦ 0.4 and 0.2 ≦ B2 / L ≦ 0.4 are satisfied.

12. The laminated electronic component according to claim 1, further including an additional insulating layer disposed on the first surface and between the first band portion and the second band portion.

13. The laminated electronic component according to claim 1, wherein the average thickness of the dielectric layer is 0.35 μm or less.

14. The laminated electronic component according to claim 1, wherein the average thicknesses of the first and second internal electrodes are each 0.35 μm or less.

15. The main body includes a capacitance forming portion including first and second internal electrodes alternately disposed with the dielectric layer therebetween, and cover portions disposed on both end surfaces in the first direction of the capacitance forming portion. The laminated electronic component according to claim 1, wherein the average size in the first direction of the cover portion is 15 μm or less.

16. The laminated electronic component according to claim 1, wherein the average thicknesses of the first and second plating layers are thinner than the average thickness of the cover layer.

17. The laminated electronic component according to claim 1, wherein the first plating layer is disposed to cover one end portion of the first cover layer, and the second plating layer is disposed to cover the end portion of the second insulating layer close to the first surface.

18. The first insulating layer is arranged to cover an end portion disposed on the first external electrode of the first plating layer, and the second insulating layer is arranged to cover an end portion disposed on the second external electrode of the second plating layer. The laminated electronic component according to claim 1.

19. The first external electrode includes a first side surface band portion extending from the first connection portion to a part of the fifth and sixth surfaces. The second external electrode includes a second side surface band portion extending from the second connection portion to a part of the fifth and sixth surfaces. The size of the first and second side surface band portions in the second direction increases as it approaches the first surface. The laminated electronic component according to claim 1.

20. The first and second external electrodes are arranged at a distance from the fifth and sixth surfaces. The laminated electronic component according to claim 1.

21. The first and second external electrodes are arranged at a distance from the second surface. The laminated electronic component according to claim 1.

22. The first and second cover layers extend to the second surface and are connected to each other. The laminated electronic component according to claim 1.

23. The first and second cover layers extend to the fifth and sixth surfaces and are connected to each other. The laminated electronic component according to claim 1.

24. The cover layer is not disposed on the second, fifth, and sixth surfaces. The laminated electronic component according to claim 1.

25. The first external electrode includes a third band portion extending from the first connection portion to a part of the second surface. The second external electrode includes a fourth band portion extending from the second connection portion to a part of the second surface. The laminated electronic component according to claim 1.

26. The main body includes a first - 3 corner connecting the first surface and the third surface, a first - 4 corner connecting the first surface and the fourth surface, a second - 3 corner connecting the second surface and the third surface, and a second - 4 corner connecting the second surface and the fourth surface. The first - 3 corner and the second - 3 corner have a form that contracts toward the center of the main body in the first direction as it approaches the third surface, and the first - 4 corner and the second - 4 corner have a form that contracts toward the center of the main body in the first direction as it approaches the fourth surface. The first external electrode includes a first corner portion that extends and is disposed on the first - 3 corner and the second - 3 corner at the first connection portion. The second external electrode includes a second corner portion that extends and is disposed on the first - 4 corner and the second - 4 corner from the second connection portion. The multilayer electronic component according to claim 1.

27. When the average size in the second direction from the extension line of the third surface to the end of the first corner portion is B3, the average size in the second direction from the extension line of the fourth surface to the end of the second corner portion is B4, the average size in the second direction of the region where the third surface and the second internal electrode are separated is G1, and the average size in the second direction of the region where the fourth surface and the first internal electrode are separated is G2, The multilayer electronic component according to claim 26, satisfying B3 ≤ G1 and B4 ≤ G2.

28. The first external electrode includes a first connection electrode disposed on the third surface, and a first band electrode disposed on the first surface and connected to the first connection electrode. The second external electrode includes a second connection electrode disposed on the fourth surface, and a second band electrode disposed on the first surface and connected to the second connection electrode. The multilayer electronic component according to claim 1.

29. The first external electrode further includes a third band electrode disposed on the second surface and connected to the first connection electrode. The second external electrode further includes a fourth band electrode disposed on the second surface and connected to the second connection electrode. The multilayer electronic component according to claim 28.

30. A step of forming a body including a dielectric layer and an internal electrode; A step of forming an external electrode on the body; A step of plasma - treating the outer surface of the body where the external electrode is not formed among the outer surface of the external electrode and the outer surface of the body; A step of forming an insulating layer on the external electrode; A step of forming a plating layer in a region of the external electrode where the insulating layer is not formed. A manufacturing method of a multilayer electronic component.

31. The plasma treatment is an O₂ / Ar plasma surface treatment. The manufacturing method of a multilayer electronic component according to claim 30.

32. The plasma treatment is performed such that the outer surface of the external electrode is oxidized. The manufacturing method of a multilayer electronic component according to claim 30.

33. The external electrode contains Cu as a conductive metal. The manufacturing method of a multilayer electronic component according to claim 30.

34. The method for manufacturing a multilayer electronic component according to claim 30, wherein the plasma treatment is performed so as to increase the surface roughness of the outer surface of the external electrode.

35. The method for manufacturing a multilayer electronic component according to claim 30, wherein the insulating layer contains glass.

36. The method for manufacturing a multilayer electronic component according to claim 30, wherein the outer surfaces of the plasma-treated external electrode and the main body have a contact angle with water of 60 degrees or less.

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