Electronic Devices

Abstract

This application discloses an electronic device, which relates to the field of heat dissipation technology. The electronic device includes a heat dissipation housing (1), a circuit board (2), a chip (3), a thermal interface material layer (4), a thermally conductive member (5), and an elastic member (6). The circuit board (2), the chip (3), the thermally conductive member (5), and the elastic member (6) are located in a chamber (101) formed by the heat dissipation housing (1). The chip (3) is located on a surface of the circuit board (2). The thermally conductive member (5) is located on a surface of the chip (3). The elastic member (6), which has heat transfer properties, is compressed between the thermally conductive member (5) and a first housing wall (11), reducing the gap between the chip (3) and the thermally conductive member (5). The gap is filled with a thermal interface material layer (4). The thin thermal interface material layer (4) filled in the gap can accelerate the heat transfer between the chip (3) and the thermal conduction member (5), so that the thermal conduction member (5) can quickly transfer the absorbed heat to the heat dissipation housing (1), thereby improving the heat dissipation effect.

Description

Technical Field

[0001] This application claims priority based on Chinese Patent Application No. 202011478901.3, entitled "ELECTRONIC DEVICE", filed on December 15, 2020, and the entire content of the Chinese patent application is incorporated herein by reference.

[0002] This application relates to the field of heat dissipation technology, and specifically to the heat dissipation architecture of electronic devices.

Background Art

[0003] Self-driving vehicle Electronic devices such as in-vehicle devices may structurally include a chip and a heat dissipation housing. The chip is disposed within the heat dissipation housing. The heat dissipation housing is configured to seal the chip to achieve dust and waterproof effects and dissipate the heat of the chip.

[0004] The chip has a large tolerance during processing, and the housing wall and base of the heat dissipation housing each have a thickness tolerance during the processing of the heat dissipation housing. Therefore, usually, the gap between the chip and the housing wall of the heat dissipation housing is large, and it is necessary to fill this gap with a thick thermal interface material layer (for example, a thermal interface material layer having a thickness of usually about 1 millimeter). The thermal interface material layer can eliminate the large gap between the chip and the housing wall of the heat dissipation housing, reduce the thermal resistance caused by air, improve the heat transfer effect, and accelerate the heat dissipation of the chip.

[0005] The thick thermal interface material layer filled between the chip and the heat dissipation housing can eliminate the gap and reduce the thermal resistance caused by air, but since the thick thermal interface material layer itself has a large thermal resistance, the improvement effect of heat transfer becomes insufficient. Therefore, the heat dissipation effect of the electronic device is still insufficient.

Summary of the Invention

[0006] In the present application, an electronic device is provided to overcome the problems of related technologies. The technical solution is as follows.

[0007] According to one aspect, an electronic device is provided. The electronic device includes a heat dissipation housing, a circuit board, a chip, a heat conduction member, and an elastic member. The circuit board, the chip, the heat conduction member, and the elastic member are all located in a chamber formed in the heat dissipation housing. The chip is located on the surface of the circuit board. The heat conduction member is located on the surface of the chip away from the circuit board. The elastic member is compressed between the surface of the heat conduction member away from the chip and the inner surface of the first housing wall of the heat dissipation housing to reduce the gap between the chip and the heat conduction member. The elastic member has heat transfer characteristics. The first housing wall is the housing wall of the heat dissipation housing at a position facing the chip.

[0008] In one example, since the elastic member is compressed between the heat conduction member and the first housing wall, most of the gap between the chip and the heat conduction member can be eliminated, and the chip and the heat conduction member can fit more closely to each other. Regarding the tightness between the chip and the heat conduction member, when they fit more closely to each other, accordingly, the heat transfer between the chip and the heat conduction member becomes faster. Therefore, the heat conduction member can quickly absorb the heat of the chip, and using the elastic member with heat transfer characteristics, the absorbed heat can be transferred to the heat dissipation housing, so that the heat dissipation effect of the electronic device can be further improved.

[0009] In a possible implementation example, the electronic device further includes a thermal interface material layer. The thermal interface material layer is filled in the gap between the chip and the heat conduction member.

[0010] In one example, since the elastic member is compressed between the heat conducting member and the first housing wall, most of the gap between the chip and the heat conducting member can be eliminated, and the thickness of the thermal interface material layer filled between the chip and the heat conducting member can be reduced. When the thickness of the thermal interface material layer is reduced, the thermal resistance of the thermal interface material layer also decreases. When the thermal resistance of the thermal interface material layer decreases, the heat transfer from the chip to the thermal interface material layer and the heat conducting member can be accelerated. Therefore, the heat conducting member can quickly absorb the heat of the chip and transfer the absorbed heat to the thermal interface material layer, the elastic member with heat transfer characteristics, and the heat dissipation housing in sequence, so as to further improve the heat dissipation effect of the electronic device.

[0011] In a possible implementation example, the elastic member includes a spring and a heat pipe. The spring is compressed between the heat conducting member and the first housing wall to reduce the gap between the chip and the heat conducting member. The heat pipe is connected between the heat conducting member and the first housing wall to transfer the heat absorbed from the chip by the heat conducting member to the heat dissipation housing. The heat pipe has elasticity. The heat pipe is compressed between the surface of the heat conducting member away from the chip and the inner surface of the first housing wall of the heat dissipation housing.

[0012] In one example, due to the elastic force of the spring, most of the gap between the chip and the heat conducting member is eliminated, and the heat transfer between the chip and the heat conducting member can be accelerated. The heat transfer between the heat conducting member and the heat dissipation housing 1 can be accelerated by the thermal conductivity of the heat pipe. It can be seen that the heat generated by the chip can be quickly transferred to the heat conducting member, and the heat absorbed by the heat conducting member can be quickly transferred to the heat dissipation housing using the heat pipe, and dissipated to the outside using the heat dissipation housing, thereby enhancing the effect of dissipating the heat of the chip.

[0013] In a possible implementation example, the heat pipe includes a first pipe portion, a second pipe portion, and a third pipe portion. The first pipe portion is attached to the surface of the heat conduction member away from the chip. The third pipe portion is attached to the inner surface of the first housing wall. The second pipe portion is obliquely connected between the first pipe portion and the third pipe portion.

[0014] In one example, since the second pipe portion is inclined with respect to the first pipe portion and the third pipe portion, and the heat pipe is made of metal and has ductility, the connection portion between the first pipe portion and the second pipe portion can be made elastically deformable, and the connection portion between the second pipe portion and the third pipe portion can be made elastically deformable, realizing the elasticity of the heat pipe without causing interference with the expansion and contraction movement of the spring.

[0015] In a possible implementation example, the elastic member is a bent heat conduction sheet, which is compressed and disposed between the surface of the heat conduction member away from the chip and the inner surface of the first housing wall. The elastic member provides elasticity by its bending characteristics and transfers heat by its heat conduction characteristics.

[0016] In one example, the elastic member is a bent sheet, and the bent structure has stretchable elasticity. Since the elastic member is a heat conduction sheet and has heat transfer characteristics, the elastic member can be compressed between the heat conduction member and the first housing wall and transfer heat between the heat conduction member and the first housing wall.

[0017] In a possible implementation example, the circuit board is Clamping fixed to the housing wall of the heat dissipation housing.

[0018] In one example, the circuit board is Clamping fixed in the chamber and can provide a supporting force against the compressive elastic force of the elastic member. The circuit board may be Clamping fixed to any housing wall of the heat dissipation housing, for example, to the first housing wall or the second housing wall. ClampingIt may be fixed.

[0019] According to another aspect, an electronic device is provided. The electronic device includes a heat dissipation housing, a circuit board, a chip, a thermal interface material layer, a heat conducting member, and an elastic member. The circuit board, the chip, the thermal interface material layer, the heat conducting member, and the elastic member are all located within a chamber formed in the heat dissipation housing. The chip is located on the surface of the circuit board. The heat conducting member is located on the surface of the chip that is away from the circuit board. The elastic member is compressed between the surface of the heat conducting member away from the chip and the inner surface of the first housing wall of the heat dissipation housing to reduce the gap between the chip and the heat conducting member. This gap is filled with the thermal interface material layer. The elastic member has heat transfer characteristics. The first housing wall is the housing wall of the heat dissipation housing that is located opposite to the chip.

[0020] In one example, since the elastic member is compressed between the heat conducting member and the first housing wall, most of the gap between the chip and the heat conducting member can be eliminated, and the thickness of the thermal interface material layer filled between the chip and the heat conducting member can be reduced. When the thickness of the thermal interface material layer is reduced, the thermal resistance of the thermal interface material layer also decreases. When the thermal resistance of the thermal interface material layer decreases, the heat transfer from the chip to the thermal interface material layer and the heat conducting member can be accelerated. Therefore, the heat conducting member can quickly absorb the heat of the chip and transfer the absorbed heat to the thermal interface material layer, the elastic member with heat transfer characteristics, and the heat dissipation housing in sequence, so that the heat dissipation effect of the electronic device can be further improved.

[0021] According to another aspect, an electronic device is provided. The electronic device includes a heat dissipation housing, a circuit board, a chip, an elastic member, and a heat dissipation device. Both the circuit board and the chip are located in a chamber formed in the heat dissipation housing. The chip is located on the surface of the circuit board. There is an opening at a position corresponding to the chip on the first housing wall of the heat dissipation housing. The first housing wall is the housing wall of the heat dissipation housing that is at a position facing the chip. The heat dissipation device includes a heat dissipation base and a mounting plate. The mounting plate is located on the outer surface of the side wall of the heat dissipation base. The heat dissipation base matches the opening, and the heat dissipation base is detachably arranged in the opening. The heat dissipation base is located on the surface of the chip that is away from the circuit board. The mounting plate is located on the outer surface of the first housing wall. The elastic member is located on the surface of the mounting plate that is away from the first housing wall. Both the elastic member and the mounting plate are fixed to the first housing wall using a fastener. Clamping The elastic member is compressed between the fastener and the mounting plate to reduce the gap between the chip and the heat dissipation base.

[0022] In one example, since the elastic member is compressed between the upper part of the fastener and the mounting plate, most of the gap between the chip and the heat dissipation base can be eliminated, and the chip and the heat dissipation base can fit more closely together. When the chip and the heat dissipation base fit more closely together, accordingly, the heat transfer between the chip and the heat dissipation base becomes faster, so that the heat dissipation base can quickly absorb the heat of the chip and dissipate the heat of the chip, and the heat dissipation effect of the electronic device can be further improved.

[0023] Furthermore, regarding the path for dissipating the heat of the chip, since the bottom of the mounting plate is in close contact with the outer surface of the first housing wall, the heat dissipation device and the heat dissipation housing are thermally connected. As a result, the heat absorbed from the chip by the heat dissipation base is also transmitted to the heat dissipation housing, enabling the heat dissipation housing to dissipate the heat of the chip. It can be seen that a part of the heat generated in the chip is dissipated by the heat dissipation device, and the other part of the heat is transmitted by the heat dissipation device to the heat dissipation housing and dissipated by the heat dissipation housing.

[0024] In a possible implementation example, the electronic device further includes a thermal interface material layer. The thermal interface material layer is filled in the gap between the chip and the heat dissipation base. The elastic member can also reduce the thickness of the thermal interface material layer filled in the gap.

[0025] In one example, although the thermal interface material layer is filled between the chip of the electronic device and the heat dissipation base, since the elastic member in a compressed state arranged on the outer surface of the mounting plate applies a pressing force to the heat dissipation base, most of the gap between the chip and the heat dissipation base is eliminated. In this case, only a thin thermal interface material layer needs to be filled in the gap. For example, the thickness of the thermal interface material layer to be filled is only 0.05 millimeters to 0.07 millimeters, or even smaller.

[0026] Furthermore, since the thin thermal interface material layer filled between the chip and the heat dissipation base has compression deformation characteristics and the elastic member applies a pressing force to the heat dissipation base, the thickness of the thermal interface material layer can be further compressed, thereby making the thermal interface material layer thinner. For example, a thermal interface material layer made of silica gel with a thickness of 0.07 millimeters is selected and filled between the chip and the heat dissipation base. The thermal interface material layer is further compressed by 0.02 millimeters under the pressing action of the elastic member. In this case, the final thickness of the thermal interface material layer filled between the chip and the heat dissipation base is 0.05 millimeters.

[0027] It can be seen that the elastic member in the compressed state can eliminate most of the gap between the chip and the heat dissipation base, and can significantly reduce the thickness of the thermal interface material layer filled between the chip and the heat dissipation base. When the thickness of the thermal interface material layer decreases, the thermal resistance of the thermal interface material layer also decreases. When the thermal resistance of the thermal interface material layer decreases, the thermal conductivity of the thermal interface material layer is improved, and the heat dissipation effect of the electronic device can be further improved.

[0028] In a possible implementation example, a vapor chamber is arranged on the surface of the heat dissipation base close to the chip.

[0029] In one example, the vapor chamber can further accelerate the heat transfer between the chip and the heat dissipation device, and enhance the effect of dissipating the heat of the chip.

[0030] In a possible implementation example, the heat dissipation device further includes heat dissipation fins, and the heat dissipation fins are located on the surface of the heat dissipation base away from the chip.

[0031] In one example, the heat dissipation fins can increase the overall heat dissipation area of the heat dissipation base and accelerate the heat dissipation of the chip.

[0032] In a possible implementation example, the mounting plate is located at the root of the heat dissipation fins adjacent to the side wall of the heat dissipation base.

[0033] In one example, in the solution of attaching the heat dissipation fins on the outer surface of the upper part of the heat dissipation base, the mounting plate on the outer surface of the side wall of the heat dissipation base is at the root of the heat dissipation fins Clamping It may be fixed. Of course, the mounting plate may alternatively be located on the outer surface of the side wall of the heat dissipation base, near the upper part of the heat dissipation base. In this embodiment, the specific attachment position of the mounting plate is not limited, but it is a prerequisite that the bottom of the heat dissipation base can be located at the opening, and the mounting plate can be mounted on the outer surface of the first housing wall.

[0034] In a possible implementation example, the end of the mounting plate that is away from the side wall of the heat dissipation base is in contact with the housing heat dissipation fins of the heat dissipation housing.

[0035] In one example, since the bottom of the mounting plate is in contact with the first housing wall and the end of the mounting plate is in contact with the housing heat dissipation fins, the contact area between the mounting plate and the heat dissipation housing increases, speeding up the heat transfer between the heat dissipation device and the heat dissipation housing and enhancing the effect of dissipating the heat of the chip.

[0036] In a possible implementation example, a sealing material is disposed between the side wall of the heat dissipation base and the inner wall of the opening.

[0037] In one example, when the heat dissipation base is attached to the opening of the heat dissipation housing, since the sealing material is located between the side wall of the heat dissipation base and the inner wall of the opening, it is possible to prevent dust, water, etc. from entering the chamber through the gap between the outer wall of the heat dissipation base and the inner wall of the opening.

[0038] In a possible implementation example, the circuit board is on the housing wall of the heat dissipation housing Clamping fixed.

[0039] In one example, the circuit board is in the chamber Clamping fixed and can provide a supporting force against the compressive elastic force of the elastic member. The circuit board may be fixed to any housing wall of the heat dissipation housing, for example, it may be fixed to the first housing wall or the second housing wall. Clamping fixed, for example, it may be fixed to the first housing wall or the second housing wall. Clamping fixed.

[0040] According to another aspect, an electronic device is provided. The electronic device includes a heat dissipation housing, a circuit board, a chip, a thermal interface material layer, an elastic member, and a heat dissipation device. The circuit board, the chip, and the thermal interface material layer are all located in a chamber formed in the heat dissipation housing. The chip is located on the surface of the circuit board. There is an opening at a position corresponding to the thermal interface material layer on the first housing wall of the heat dissipation housing. The first housing wall is the housing wall of the heat dissipation housing at a position facing the chip. The heat dissipation device includes a heat dissipation base and a mounting plate. The mounting plate is located on the outer surface of the side wall of the heat dissipation base. The heat dissipation base is aligned with the opening, and the heat dissipation base is detachably arranged in the opening. The heat dissipation base is located on the surface of the chip away from the circuit board. The mounting plate is located on the outer surface of the first housing wall. The elastic member is located on the surface of the mounting plate away from the first housing wall. Both the elastic member and the mounting plate are Clamping fixed to the first housing wall using fasteners. The elastic member is compressed between the fasteners and the mounting plate to reduce the gap between the chip and the heat dissipation base and reduce the thickness of the thermal interface material layer filled in the gap.

[0041] In one example, the elastic member in a compressed state can eliminate most of the gap between the chip and the heat dissipation base, and can significantly reduce the thickness of the thermal interface material layer filled between the chip and the heat dissipation base. When the thickness of the thermal interface material layer decreases, the thermal resistance of the thermal interface material layer also decreases. When the thermal resistance of the thermal interface material layer decreases, the thermal conductivity of the thermal interface material layer is improved, and the heat dissipation effect of the electronic device can be further improved.

[0042] According to another aspect, an electronic device is provided. The electronic device includes a heat dissipation housing, a circuit board, a chip, and an elastic member. The circuit board, the chip, and the elastic member are all located within a chamber formed in the heat dissipation housing. The chip is located on the surface of the circuit board. The elastic member is compressed between the circuit board and a second housing wall of the heat dissipation housing to reduce a gap between the chip and a first housing wall of the heat dissipation housing. The first housing wall is a housing wall of the heat dissipation housing located opposite to the chip. The second housing wall is located opposite to the first housing wall.

[0043] In one example, due to the elastic force applied to the circuit board by the elastic member, the gap between the chip and the first housing wall can be reduced, and the chip and the first housing wall can be made to fit more closely to each other. When the chip and the first housing wall fit more closely to each other, accordingly, the heat transfer between the chip and the first housing wall is accelerated, so that the heat dissipation housing can quickly absorb the heat of the chip and dissipate the heat of the chip 3, and the heat dissipation effect of the electronic device can be further improved.

[0044] In a possible implementation example, the electronic device further includes a thermal interface material layer. The thermal interface material layer is filled in the gap between the chip and the first housing wall. The elastic member can also reduce the thickness of the thermal interface material layer filled in the gap.

[0045] In one example, although the thermal interface material layer is filled between the chip of the electronic device and the first housing wall, the elastic member in a compressed state disposed between the circuit board and the second housing wall applies an elastic force towards the chip to the circuit board, so that most of the gap between the chip and the first housing wall is eliminated. In this case, only a thin thermal interface material layer needs to be filled in the gap. For example, the thickness of the thermal interface material layer to be filled is only 0.05 millimeters to 0.07 millimeters, or even smaller.

[0046] The elastic member in a compressed state, which is attached between the circuit board and the second housing wall, can eliminate most of the gap between the chip and the first housing wall, and it can be seen that the thickness of the thermal interface material layer filled between the chip and the first housing wall can be significantly reduced. When the thickness of the thermal interface material layer is reduced, the thermal resistance of the thermal interface material layer also decreases. When the thermal resistance of the thermal interface material layer decreases, the thermal conductivity of the thermal interface material layer is improved, and the heat dissipation effect of the electronic device can be further improved.

[0047] In a possible implementation example, the circuit board includes a first sub-board and a second sub-board. The first sub-board and the second sub-board are electrically connected. The chip is located on the surface of the first sub-board. The elastic member is compressed between the first sub-board and the second housing wall. The second sub-board is Clamping fixed to the housing wall of the heat dissipation housing. The interface component of the electronic device is located on the surface of the second sub-board.

[0048] In one example, due to the elastic force applied to the first sub-board by the elastic member, most of the gap between the chip and the first housing wall is eliminated, and the heat transfer between the chip and the first housing wall can be accelerated. Even when a thermal interface material layer is filled between the chip and the first housing wall, the thickness of the thermal interface material layer to be filled is small, for example, within the range of 0.05 millimeters to 0.07 millimeters, and the thermal resistance of the thermal interface material layer is small. Considering this, the heat transfer between the chip and the first housing wall becomes even faster, and the effect of dissipating the heat of the chip can be enhanced.

[0049] Regarding the interface component, since the interface component is located on the surface of the second sub-board and does not need to vibrate with the elastic member, there is no need to ensure a gap between the interface component and the mounting port through which the interface component passes when it is mounted. In this way, the sealing performance between the interface component and the mounting port can be guaranteed, and the dustproof and waterproof effects can be realized.

[0050] According to another aspect, an electronic device is provided. The electronic device includes a heat dissipation housing, a circuit board, a chip, a thermal interface material layer, and an elastic member. The circuit board, the chip, the thermal interface material layer, and the elastic member are all located in a chamber formed in the heat dissipation housing. The chip is located on the surface of the circuit board. The elastic member is compressed between the circuit board and the second housing wall of the heat dissipation housing to reduce the gap between the chip and the first housing wall of the heat dissipation housing. This gap is filled with the thermal interface material layer. The first housing wall is the housing wall of the heat dissipation housing that is located opposite to the chip. The second housing wall is located opposite to the first housing wall.

[0051] It can be seen that the elastic member in a compressed state attached between the circuit board and the second housing wall can eliminate most of the gap between the chip and the first housing wall, and can significantly reduce the thickness of the thermal interface material layer filled between the chip and the first housing wall. When the thickness of the thermal interface material layer is reduced, the thermal resistance of the thermal interface material layer also decreases. When the thermal resistance of the thermal interface material layer decreases, the thermal conductivity of the thermal interface material layer is improved, and the heat dissipation effect of the electronic device can be further improved.

Brief Description of the Drawings

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[0067] [Reference numerals] 1. Heat dissipation housing; 101. Chamber; 11. First housing wall; 12. Opening; 13. Second housing wall; 14. Upper cover; 15. Bottom; 16. Housing heat dissipation fins; 2. Circuit board; 21. First sub-board; 22. Second sub-board; 3. Chip; 4. Thermal interface material layer; 5. Heat conduction member; 6. Elastic member; 61. Spring; 62. Heat pipe; 621. First pipe portion; 622. Second pipe portion; 623. Third pipe portion; 7. Heat dissipation device; 71. Heat dissipation base; 72. Mounting plate; 73. Vapor chamber; 74. Heat dissipation fins; 8. Fastener; 9. Sealing material; 10. Interface component.

Embodiment for Carrying Out the Invention

[0068] One embodiment of the present application provides an electronic device. The electronic device may be a device in the computer field or a device in the vehicle field, etc. In this embodiment, the specific field related to the electronic device is not limited. The electronic device may be applied to any field that needs to dissipate heat from the chip and further needs to provide a dust-proof and waterproof heat dissipation housing. For example, the electronic device may be an in-vehicle module used outdoors.

[0069] In this embodiment, the dust-proof and waterproof level of the heat dissipation housing of the electronic device is IP54 or higher. From the perspective of dust prevention, the heat dissipation housing can completely prevent foreign objects from entering the electronic device. It doesn't completely prevent dust from entering, but an amount of dust sufficient to impair the normal operation of the electronic device cannot enter. From the perspective of waterproofing, the heat dissipation housing can prevent water splashing from any direction from entering the electronic device and causing damage.

[0070] As shown in FIG. 1, the heat dissipation housing 1 of the electronic device includes a plurality of housing walls, and the plurality of housing walls can enclose to form a chamber 101. For example, the heat dissipation housing 1 is a hexahedral box body, includes six housing walls, and the six housing walls can enclose to form a chamber 101. Components of the electronic device may be located inside the heat dissipation housing 1. The heat dissipation housing 1 has an IP54 or higher dust and waterproof level, and can play a role in heat dissipation, waterproofing, and dust prevention of the components inside the heat dissipation housing 1. Therefore, the heat dissipation housing 1 can effectively prevent dust and water from entering the chamber 101 and affecting the normal operation of the components of the electronic device.

[0071] Still referring to FIG. 1, the heat dissipation housing 1 may include an upper cover 14 and a bottom 15. The upper cover 14 covers the bottom 15 to form the heat dissipation housing 1 having a chamber 101.

[0072] For example, as shown in FIG. 1, the upper cover 14 of the heat dissipation housing 1 may be a housing-like structure without a bottom, and the bottom 15 may be a housing-like structure without a cover. The sizes of the upper cover 14 and the bottom 15 match. For example, the length and width of the upper cover 14 respectively match the length and width of the bottom 15, so that the upper cover 14 covers the bottom 15 to form a housing having a chamber.

[0073] In another example, the upper cover 14 of the heat dissipation housing 1 may alternatively be a plate-like structure, the bottom 15 may be a housing-like structure without a cover, and the upper cover 14 covers the bottom 15 to form the heat dissipation housing 1. Alternatively, the upper cover 14 of the heat dissipation housing 1 is a housing-like structure without a bottom and has no bottom, the bottom 15 is a plate-like structure, and the upper cover 14 covers the bottom 15 to form the heat dissipation housing 1. In this embodiment, the specific formation method of the heat dissipation housing 1 is not limited, but it is a prerequisite that the heat dissipation housing 1 has a chamber configured to accommodate components of an electronic device and has excellent sealing performance.

[0074] Since the heat dissipation housing 1 further has a heat dissipation function, the heat dissipation housing 1 may be die-cast from a metal (for example, metal aluminum, aluminum alloy, metal copper, or copper alloy).

[0075] In order to increase the overall heat dissipation area of the heat dissipation housing 1, as shown in FIG. 1, the housing heat dissipation fins 16 may be disposed on the outer surface of the heat dissipation housing 1. For example, the housing heat dissipation fins 16 are disposed on the outer surface of the upper cover 14. In another example, the housing heat dissipation fins 16 are disposed on both the outer surface of the upper cover 14 and the outer surface of the bottom 15. In this embodiment, it is not limited thereto. A person skilled in the art will flexibly select the specific position of the housing heat dissipation fins 16 on the outer surface of the heat dissipation housing 1 based on the actual situation.

[0076] In one example, the heat dissipation housing 1 is processed by die-casting. Correspondingly, the housing heat dissipation fins 16 may also be processed by die-casting. Alternatively, the housing heat dissipation fins 16 may be processed by welding. By processing the heat dissipation fins by welding, the housing heat dissipation fins 16 will be densely distributed on the outer surface of the heat dissipation housing 1. The denser the housing heat dissipation fins 16 are, the larger the overall heat dissipation area of the heat dissipation housing 1 becomes, indicating that the effect of dissipating the heat of the chip 3 is better. A person skilled in the art will flexibly select the specific processing method of the housing heat dissipation fins 16 on the outer surface of the heat dissipation housing 1 based on the actual situation. In this embodiment, it is not limited in this regard.

[0077] To facilitate the attachment of the components of the electronic device into the heat dissipation housing 1, correspondingly, the upper cover 14 and the bottom 15 of the heat dissipation housing 1 are detachably attached. For example, the housing walls of the upper cover 14 and the bottom 15 are assembled using screws or the like. In this embodiment, the attachment method of the upper cover 14 and the bottom 15 is not limited. A person skilled in the art will flexibly select the attachment method based on the actual situation.

[0078] The electronic device in this embodiment further includes a circuit board 2 and a chip 3. The circuit board 2 is located inside the heat dissipation housing 1. For example, the circuit board 2 may be attached to the inner surface of the housing wall of the upper cover 14, or the circuit board 2 may be attached to the inner surface of the housing wall of the bottom 15. Then the chip 3 and other components of the electronic device are attached onto the circuit board 2. Finally, the upper cover 14 is attached onto the bottom 15.

[0079] For ease of explanation, the housing wall facing the chip 3 may be referred to as the first housing wall 11. In other words, the housing wall facing the surface of the chip 3 that is away from the circuit board 2 is referred to as the first housing wall 11. The housing wall facing the circuit board 2 is referred to as the second housing wall 13. In other words, the housing wall facing the surface of the circuit board 2 that is away from the chip 3 is referred to as the second housing wall 13. The positions of the first housing wall 11 and the second housing wall 13 face each other. As shown in FIG. 1, the first housing wall 11 may be the upper wall of the upper cover 14, and the second housing wall 13 may be the bottom wall of the bottom 15.

[0080] In one example, the chip 3 may be electrically connected to another component of the electronic device using a flat cable on the circuit board 2. Correspondingly, the chip 3 is located on the circuit board 2. For example, the chip 3 is soldered with tin on the surface of the circuit board 2. For example, there is a chip designated position on the upper (top) surface or the bottom surface of the circuit board 2, and the chip 3 may be soldered with tin at this chip designated position. When the chip 3 operates, heat is generated. The heat dissipation housing 1 can dissipate the heat of the chip 3. Correspondingly, the heat of the chip 3 may be transmitted to the housing wall of the heat dissipation housing 1 and dissipated through the housing wall of the heat dissipation housing 1. The specific path of heat dissipation will be described in detail in the following description of the structure of the electronic device.

[0081] In a certain application scenario, the electronic device may include a plurality of chips 3. The chip 3 of the present embodiment may be any chip on the surface of the circuit board 2, or may be the main chip on the surface of the circuit board 2. The main chip is a chip whose power consumption accounts for 50% of the total power consumption.

[0082] The specific structure of the plurality of electronic devices provided in the present embodiment will be described in detail below.

[0083] For a schematic diagram of the structure of the electronic device, refer to FIGS. 2 to 6.

[0084] FIG. 2 is a schematic diagram of the disassembled and assembled structure of the electronic device. The electronic device includes not only a heat dissipation housing 1, a circuit board 2, and a chip 3, but also a heat conduction member 5 and an elastic member 6. FIG. 3 is a schematic diagram of the structure of the assembled electronic device. The heat conduction member 5 is located on the surface of the chip 3 away from the circuit board 2. The elastic member 6 is compressed between the heat conduction member 5 and the first housing wall 11 of the heat dissipation housing 1. The elastic member 6 has not only compressive elasticity but also heat transfer characteristics. In this way, the heat generated by the chip 3 is transmitted to the heat conduction member 5, then transmitted to the elastic member 6 by the heat conduction member 5, and then transmitted to the first housing wall 11 by the elastic member 6, and the heat can be dissipated to the outside by the first housing wall 11.

[0085] As shown in FIG. 2, the circuit board 2 may be fixed in the chamber 101 of the heat dissipation housing 1. Clamping For example, as shown in FIG. 2, the circuit board 2 is fixed to the bottom 15 of the heat dissipation housing 1 using screws. Clamping The circuit board 2 may alternatively be fixed to the upper cover 14 of the heat dissipation housing 1 using screws. Clamping In this embodiment, the attachment position and attachment method of the circuit board 2 in the chamber 101 of the heat dissipation housing 1 are not limited, but it is a prerequisite that the circuit board 2 can be firmly fixed in the chamber 101.

[0086] The circuit board 2 is fixed in the chamber 101 and can provide a supporting force against the compressive elastic force of the elastic member 6. Clamping

[0087] As shown in FIG. 3, the heat conduction member 5 is located on the surface of the chip 3 that is away from the circuit board 2. The heat conduction member 5 is configured to absorb the heat of the chip 3 and transfer the absorbed heat to the heat dissipation housing 1. The heat conduction member 5 matches the chip 3 in shape and size respectively. For example, the heat conduction member 5 is a plate-shaped structure, and the size of the heat conduction member 5 is equal to the size of the chip 3, or the area of the heat conduction member 5 is slightly larger than the area of the chip 3. The heat conduction member 5 covers the surface of the chip 3 and absorbs heat at each position of the chip 3. The heat conduction member 5 may be a copper plate or a vapor chamber, etc. In this embodiment, the material of the heat conduction member is not limited, but it is a prerequisite that the heat conduction member 5 can quickly absorb the heat of the chip 3.

[0088] To reduce the gap between the chip 3 and the heat conduction member 5, increase the contact area between the heat conduction member 5 and the chip 3, and accelerate the heat absorption of the chip 3 by the heat conduction member 5, correspondingly, as shown in FIG. 3, the elastic member 6 is compressed between the heat conduction member 5 and the first housing wall 11 of the heat dissipation housing 1. The first housing wall 11 is the housing wall at the position of the heat dissipation housing 1 that faces the heat conduction member 5. Since the elastic member 6 is compressed between the heat conduction member 5 and the first housing wall 11, the chip 3 and the heat conduction member 5 are compressed against each other, so that the gap between the chip 3 and the heat conduction member 5 can be reduced or even eliminated. The better fit between the chip 3 and the heat conduction member 5 indicates that the heat transfer effect between the chip 3 and the heat conduction member 5 is improved.

[0089] The elastic member 6 has not only elasticity but also heat transfer characteristics and is compressed between the heat conduction member 5 and the first housing wall 11. Thereby, the gap between the chip 3 and the heat conduction member 5 is reduced, and the heat absorbed from the chip 3 by the heat conduction member 5 is transferred to the heat dissipation housing 1, and the heat can be dissipated to the outside by the heat dissipation housing 1. The specific structure of the elastic member 6 will be described in detail below.

[0090] The elastic member 6 compressed between the first housing wall 11 and the heat conduction member 5 presses the chip 3 against the surface of the heat conduction member 5, so that the chip 3 and the heat conduction member 5 fit more closely together, and it can be seen that the heat transfer between the chip 3, the heat conduction member 5, and the heat dissipation housing 1 can be accelerated, and the heat dissipation effect of the electronic device can be improved.

[0091] Correspondingly, in order to further reduce the gap between the chip 3 and the heat conduction member 5, as shown in FIG. 4, a thermal interface material layer 4 is further filled between the chip 3 and the heat conduction member 5. The thermal interface material layer 4 is a flexible material and has a specific thermal conductivity. For example, the thermal interface material layer 4 may be silica gel, silicone grease, or gel, etc. In this embodiment, the specific material of the thermal interface material layer 4 is not limited, but it is a prerequisite that the thermal interface material layer 4 can reduce the gap and realize the heat conduction effect.

[0092] Although the thermal interface material layer 4 is filled between the chip 3 and the heat conduction member 5 of the electronic device, since the elastic member 6 compressed between the heat conduction member 5 and the first housing wall 11 applies a pressing force to the heat conduction member 5, most of the gap between the chip 3 and the heat conduction member 5 is eliminated. In this case, all that needs to be filled in the gap is only the thin thermal interface material layer 4. For example, the thickness of the filled thermal interface material layer 4 is only 0.05 mm to 0.07 mm, or even smaller.

[0093] Furthermore, the thin thermal interface material layer 4 filled between the chip 3 and the heat conduction member 5 has compression deformation characteristics, and since the elastic member 6 applies a pressing force to the heat conduction member 5, the thickness of the thermal interface material layer 4 can be further reduced, and thereby, the thermal interface material layer 4 becomes even thinner. For example, a thermal interface material layer 4 made of silica gel with a thickness of 0.07 mm is selected and filled between the chip 3 and the heat conduction member 5. The thermal interface material layer 4 is compressed again by 0.02 mm in thickness under the pressing action of the elastic member 6. In this case, the final thickness of the thermal interface material layer 4 filled between the chip 3 and the heat conduction member 5 is 0.05 mm.

[0094] The elastic member 6 compressed between the heat conduction member 5 and the first housing wall 11 can eliminate most of the gap between the chip 3 and the heat conduction member 5, and it can be seen that the thickness of the thermal interface material layer 4 filled between the chip 3 and the heat conduction member 5 can be significantly reduced. When the thickness of the thermal interface material layer 4 is reduced, the thermal resistance of the thermal interface material layer 4 also decreases. When the thermal resistance of the thermal interface material layer 4 decreases, the thermal conductivity of the thermal interface material layer 4 is improved, and the heat dissipation effect of the electronic device can be further improved.

[0095] For example, when the elastic member 6 is not compressed between the heat conduction member 5 and the first housing wall 11, it is necessary to arrange the thermal interface material layer 4 with a thickness of 1 millimeter to 1.5 millimeters between the chip 3 and the heat conduction member 5. When the elastic member 6 is compressed between the heat conduction member 5 and the first housing wall 11, it is necessary to arrange the thermal interface material layer 4 with a thickness of only 0.05 millimeter to 0.07 millimeter between the chip 3 and the heat conduction member 5. It can be seen that the thickness of the thermal interface material layer 4 in the former case is significantly larger than the thickness of the thermal interface material layer 4 in the latter case. In this case, the thermal resistance of the thermal interface material layer 4 in the former case is also larger than the thermal resistance of the thermal interface material layer 4 in the latter case. Furthermore, the heat transfer performance of the thermal interface material layer 4 in the latter case is higher than the heat transfer performance of the thermal interface material layer 4 in the former case.

[0096] As described above, the heat dissipation path of the electronic device is as follows. Heat is generated at the chip 3. The heat conduction member 5 located on the surface of the chip 3 absorbs the heat and transfers the heat to the elastic member 6. The elastic member 6 then transfers the heat to the heat dissipation housing 1, and finally the heat dissipation housing 1 dissipates the heat to the outside.

[0097] It can be seen that the elastic member 6 not only has the function of pressing the heat conduction member 5 against the surface of the chip 3, but also needs to have a heat transfer function. Hereinafter, a plurality of elastic members 6 having heat transfer characteristics will be described.

[0098] The possible structure of the elastic member 6 may be as follows. As shown in FIG. 2, the elastic member 6 includes a spring 61 and a heat pipe 62. As shown in FIG. 4, the spring 61 is compressed between the heat conduction member 5 and the first housing wall 11 to reduce the gap between the chip 3 and the heat conduction member 5. The heat pipe 62 is connected between the heat conduction member 5 and the first housing wall 11 to transfer the heat absorbed from the chip 3 by the heat conduction member 5 to the heat dissipation housing 1. Further, the heat pipe 62 has elasticity and is compressed between the heat conduction member 5 and the first housing wall 11.

[0099] The heat pipe 62 is a copper pipe filled with a coolant (sometimes also called a heat dissipation liquid) inside.

[0100] The heat pipe 62 further has elasticity and is also compressed between the heat conduction member 5 and the first housing wall 11, so that the heat pipe 62 can perform a telescopic operation together with the spring 61. In this way, when the spring 61 applies an elastic force toward the chip 3 to the heat conduction member 5, the heat pipe 62 does not apply a reaction force in the opposite direction to the heat conduction member 5, so that the reduction of the gap between the heat conduction member 5 and the chip 3 is not affected.

[0101] To realize the elasticity of the heat pipe 62, correspondingly, as shown in FIG. 5, the heat pipe 62 may include three parts, namely, a first pipe part 621, a second pipe part 622, and a third pipe part 623. The first pipe part 621 is attached to the surface of the heat conduction member 5 away from the chip 3. The third pipe part 623 is attached to the inner surface of the first housing wall 11. The second pipe part 622 is obliquely connected between the first pipe part 621 and the third pipe part 623.

[0102] For example, the outer surface of the pipe wall of the first pipe portion 621 may be welded to the surface of the heat conducting member 5 that is away from the chip 3, and the outer surface of the pipe wall of the third pipe portion 623 may be welded to the inner surface of the first housing wall 11 of the heat dissipation housing 1. The second pipe portion 622 is disposed obliquely between the heat conducting member 5 and the first housing wall 11 to realize the elasticity of the heat pipe 62 without interfering with the expansion and contraction operation of the spring 61.

[0103] The second pipe portion 622 is obliquely connected between the first pipe portion 621 and the third pipe portion 623. For example, as shown in FIG. 5, the second pipe portion 622 is inclined to the right with respect to the first pipe portion 621. In another example, the second pipe portion 622 may be inclined to the left with respect to the first pipe portion 621. In the present embodiment, it is not limited whether the second pipe portion 622 is inclined to the right or left with respect to the first pipe portion 621. In the present embodiment, the inclination angle of the second pipe portion 622 with respect to the first pipe portion 621 is not limited. A person skilled in the art will flexibly select the inclination angle based on the actual situation.

[0104] Since the second pipe portion 622 is inclined with respect to the first pipe portion 621 and the third pipe portion 623, and the heat pipe 62 is made of metal and has ductility, the connection portion between the first pipe portion 621 and the second pipe portion 622 can be made elastically deformable, and the connection portion between the second pipe portion 622 and the third pipe portion 623 can be made elastically deformable.

[0105] It can be seen that the elastic member 6 provides an expandable and contractible elasticity using the spring 61 and provides heat transfer characteristics using the heat pipe 62.

[0106] Another possible structure of the elastic member 6 may be as follows. As shown in FIG. 6, the elastic member 6 is a bent heat-conducting sheet, for example, it may be a bent metal sheet, a bent copper sheet, or a bent vapor chamber. The elastic member 6 may be compressed between the heat-conducting member 5 and the first housing wall 11 and can transfer heat between the heat-conducting member 5 and the first housing wall 11.

[0107] In one example, there may be a plurality of elastic members 6, and a plurality of bent heat-conducting sheets are compressed between the heat-conducting member 5 and the first housing wall 11. The plurality of bent heat-conducting sheets may be evenly compressed between the heat-conducting member 5 and the first housing wall 11. Alternatively, the bent heat-conducting sheets may be densely arranged at positions with high heat and sparsely arranged at positions with low heat. A person skilled in the art can flexibly select the arrangement method based on the actual situation.

[0108] In the electronic device shown in FIGS. 2 to 5, since the elastic member 6 is compressed between the heat-conducting member 5 and the first housing wall 11, most of the gap between the chip 3 and the heat-conducting member 5 can be eliminated, and the chip 3 and the heat-conducting member 5 can fit more closely to each other. When the chip 3 and the heat-conducting member 5 fit more closely to each other, accordingly, the heat transfer between the chip 3 and the heat-conducting member 5 becomes faster. Therefore, the heat-conducting member 5 quickly absorbs the heat of the chip 3 and uses the elastic member 6 having heat transfer characteristics to transfer the absorbed heat to the heat dissipation housing 1, so that the heat dissipation effect of the electronic device can be further improved.

[0109] For a schematic diagram of the structure of another electronic device, please refer to FIG. 4.

[0110] The electronic device includes not only a heat dissipation housing 1, a circuit board 2, and a chip 3, but also a thermal interface material layer 4, a heat conducting member 5, and an elastic member 6. The heat conducting member 5 is located on the surface of the chip 3 that is away from the circuit board 2. The thermal interface material layer 4 is located on the surface of the heat conducting member 5 that is away from the chip 3. The elastic member 6 having heat transfer characteristics is compressed between the heat conducting member 5 and the first housing wall 11.

[0111] For the description of the electronic device having such a structure, refer to the descriptions of FIGS. 4 and 6 mentioned above. Here, the details will not be described one by one again.

[0112] In the electronic device shown in FIG. 4, since the elastic member 6 is compressed between the heat conducting member 5 and the first housing wall 11, most of the gap between the chip 3 and the heat conducting member 5 can be eliminated, and the thickness of the thermal interface material layer 4 filled between the chip 3 and the heat conducting member 5 can be reduced. When the thickness of the thermal interface material layer 4 is reduced, the thermal resistance of the thermal interface material layer 4 also decreases. When the thermal resistance of the thermal interface material layer 4 decreases, the heat transfer from the chip 3 to the thermal interface material layer 4 and the heat conducting member 5 can be accelerated. Therefore, the heat conducting member 5 can quickly absorb the heat of the chip 3 and transfer the absorbed heat to the thermal interface material layer 4, the elastic member 6 having heat transfer characteristics, and the heat dissipation housing 1 in sequence, so that the heat dissipation effect of the electronic device can be further improved.

[0113] For a schematic diagram of the structure of another electronic device, refer to FIGS. 7 to 12.

[0114] FIG. 7 is a schematic diagram of the structure of the electronic device before assembly. The electronic device includes not only a heat dissipation housing 1, a circuit board 2, and a chip 3, but also an elastic member 6 and a heat dissipation device 7. The circuit board 2 is located in a chamber 101 formed by the housing wall of the heat dissipation housing 1. For example, as shown in FIG. 7, the circuit board 2 is fixed to the upper cover 14 of the heat dissipation housing 1 using screws. Clamping Of course, the circuit board 2 can alternatively be fixed to the bottom 15 of the heat dissipation housing 1 using screws.Clamping It may be fixed. In this embodiment, although the mounting position and mounting method of the circuit board 2 in the chamber 101 of the heat dissipation housing 1 are not limited, it is a prerequisite that the circuit board 2 can be firmly Clamping fixed in the chamber 101. The chip 3 is located on the surface of the circuit board 2 and may be, for example, soldered to the surface of the circuit board 2 with tin.

[0115] The heat dissipation device 7 is configured to dissipate the heat of the chip 3. In order to accelerate the heat dissipation of the chip 3, the heat dissipation device 7 may be made of a metal with a high thermal conductivity coefficient, for example, it may be made of copper.

[0116] As shown in FIG. 7, the heat dissipation device 7 may include a heat dissipation base 71 and a mounting plate 72. The heat dissipation base 71 has a plate-like structure and may have a specific thickness. The mounting plate 72 may be located on the side wall of the heat dissipation base 71, and the bottom of the mounting plate 72 is higher than the bottom of the heat dissipation base 71. The heat dissipation base 71 is configured to contact the chip 3. The mounting plate 72 is configured to realize the detachable mounting of the heat dissipation device 7 and the heat dissipation housing 1. The positional relationship and mounting relationship between the heat dissipation device 7 and the heat dissipation housing 1 may be as follows.

[0117] As shown in FIG. 7, the first housing wall 11 of the heat dissipation housing 1 has an opening 12 at a position corresponding to the chip 3. The size of the opening 12 matches the chip 3. For example, the area of the opening 12 is larger than the area of the chip 3. For example, the first housing wall 11 may be provided with an opening 12 at a position corresponding to the chip 3. The opening 12 may be a rectangular window, so that the heat dissipation base 71 of the heat dissipation device 7 can be fixed to the opening 12.

[0118] The size of the heat dissipation base 71 matches the opening 12. For example, since the area of the heat dissipation base 71 is slightly larger than or equal to the area of the opening 12, the heat dissipation base 71 can be arranged in the opening 12. The heat dissipation base 71 is located on the surface of the chip 3 that is away from the circuit board 2. The mounting plate 72 is located on the outer surface of the first housing wall 11.

[0119] In this way, the chip 3 is in a position facing the opening 12, and the area of the opening 12 is larger than the area of the chip 3. As shown in FIG. 8, the bottom of the heat dissipation base 71 may be fixed to the opening 12 and may be in contact with the chip 3. The mounting plate 72 is mounted on the outer surface of the first housing wall 11.

[0120] In order to reduce the gap between the heat dissipation device 7 and the chip 3, correspondingly, as shown in FIG. 8, the elastic member 6 is located on the surface of the mounting plate 72 that is away from the first housing wall 11. Both the elastic member 6 and the mounting plate 72 are fixed to the first housing wall 11 using the fastener 8. Clamping The elastic member 6 is compressed between the fastener 8 and the mounting plate 72 to reduce the gap between the chip 3 and the heat dissipation base 71.

[0121] The fastener 8 may be any structure with a horizontal plate at the top, and the horizontal plate at the top of the fastener 8 functions to compress the elastic member 6. For example, the fastener 8 may be a screw, and a nut of the screw may be used as the horizontal plate at the top of the fastener 8.

[0122] The elastic member 6 may be any structure having compressive elasticity, and for example, may be a spring.

[0123] In this way, the elastic member 6 is located on the outer surface of the mounting plate 72, and the fastener 8 can pass continuously through the elastic member 6, the mounting plate 72, and the first housing wall 11 to achieve a detachable attachment between the heat dissipation device 7 and the heat dissipation housing 1. The elastic member 6 is compressed between the horizontal plate at the upper part of the fastener 8 and the mounting plate 72. For example, the elastic member 6 is compressed between the nut of the screw and the mounting plate 72.

[0124] In the electronic device shown in FIG. 8, since the elastic member 6 is compressed between the upper part of the fastener 8 and the mounting plate 72, most of the gap between the chip 3 and the heat dissipation base 71 can be eliminated, and the chip 3 and the heat dissipation base 71 can fit more closely to each other. When the chip 3 and the heat dissipation base 71 fit more closely to each other, accordingly, the heat transfer between the chip 3 and the heat dissipation base 71 becomes faster, so that the heat dissipation base 71 can quickly absorb the heat of the chip 3 and dissipate the heat of the chip 3, and the heat dissipation effect of the electronic device can be further improved.

[0125] Furthermore, regarding the path for dissipating the heat of the chip 3, as shown in FIG. 8, since the bottom of the mounting plate 72 is in close contact with the outer surface of the first housing wall 11, the heat dissipation device 7 and the heat dissipation housing 1 are thermally connected. Thereby, the heat absorbed from the chip 3 by the heat dissipation base 71 is also transmitted to the heat dissipation housing 1, and the heat dissipation housing 1 can dissipate the heat of the chip 3. In the electronic device shown in FIG. 8, it can be seen that a part of the heat generated by the chip 3 is absorbed by the heat dissipation device 7 and dissipated to the outside by the heat dissipation device 7; the other part of the heat is transmitted from the heat dissipation device 7 to the heat dissipation housing 1 and dissipated to the outside by the heat dissipation housing 1. It can be seen that the heat generated by the chip 3 can be dissipated to the outside jointly by the heat dissipation device 7 and the heat dissipation housing 1.

[0126] In order to further accelerate the heat transfer between the heat dissipation device 7 and the heat dissipation housing 1, correspondingly, as shown in FIG. 9, the end of the mounting plate 72 away from the heat dissipation base 71 is in contact with the housing heat dissipation fins 16 of the heat dissipation housing 1.

[0127] In this way, since the bottom of the mounting plate 72 is in contact with the first housing wall 11 and the end of the mounting plate 72 is in contact with the housing heat dissipation fins 16, the contact area between the mounting plate 72 and the heat dissipation housing 1 increases, the heat transfer between the heat dissipation device 7 and the heat dissipation housing 1 is accelerated, and the effect of dissipating the heat of the chip 3 can be enhanced.

[0128] In order to further reduce the gap between the chip 3 and the heat dissipation base 71, correspondingly, as shown in FIG. 10, the thermal interface material layer 4 is further filled between the chip 3 and the heat dissipation base 71. The thermal interface material layer 4 is a flexible material and has thermal conductivity. For example, the thermal interface material layer 4 may be silica gel, silicone grease, or gel, etc. In this embodiment, the specific material of the thermal interface material layer 4 is not limited, but it is a prerequisite that the thermal interface material layer 4 can reduce the gap and realize the heat conduction effect.

[0129] Although the thermal interface material layer 4 is filled between the chip 3 of the electronic device and the heat dissipation base 71, since the elastic member 6 in a compressed state arranged on the outer surface of the mounting plate 71 applies a pressing force to the heat dissipation base 71, most of the gap between the chip 3 and the heat dissipation base 71 is eliminated. In this case, all that needs to be filled in the gap is only the thin thermal interface material layer 4. For example, the thickness of the thermal interface material layer 4 to be filled is only 0.05 millimeters to 0.07 millimeters, or even smaller.

[0130] Furthermore, since the thin thermal interface material layer 4 filled between the chip 3 and the heat dissipation base 71 has compression deformation characteristics and the elastic member 6 applies a pressing force to the heat dissipation base 71, the thickness of the thermal interface material layer 4 can be further reduced, and thus the thermal interface material layer 4 becomes thinner. For example, a thermal interface material layer 4 made of silica gel with a thickness of 0.07 millimeter is selected and filled between the chip 3 and the heat dissipation base 71. The thermal interface material layer 4 is compressed again by 0.02 millimeter in thickness under the pressing action of the elastic member 6. In this case, the final thickness of the thermal interface material layer 4 filled between the chip 3 and the heat dissipation base 71 is 0.05 millimeter.

[0131] It can be seen that the elastic member 6 in the compressed state can eliminate most of the gap between the chip 3 and the heat dissipation base 71, and can significantly reduce the thickness of the thermal interface material layer 4 filled between the chip 3 and the heat dissipation base 71. When the thickness of the thermal interface material layer 4 decreases, the thermal resistance of the thermal interface material layer 4 also decreases. When the thermal resistance of the thermal interface material layer 4 decreases, the thermal conductivity of the thermal interface material layer 4 is improved, and the heat dissipation effect of the electronic device can be further improved.

[0132] For example, in the solution without arranging the elastic member 6, it is necessary to arrange a thermal interface material layer 4 with a thickness of 1 millimeter to 1.5 millimeters between the chip 3 and the heat dissipation base 71. In the solution with the elastic member 6 in the compressed state arranged on the outer surface of the mounting plate 72, it is necessary to arrange a thermal interface material layer 4 with a thickness of only 0.05 millimeter to 0.07 millimeter between the chip 3 and the heat dissipation base 71. It can be seen that the thickness of the thermal interface material layer 4 in the former case is significantly larger than that in the latter case. In this case, the thermal resistance of the thermal interface material layer 4 in the former case is also larger than that in the latter case. Furthermore, the heat transfer performance of the thermal interface material layer 4 in the latter case is higher than that in the former case.

[0133] In the electronic device shown in FIG. 10, since the elastic member 6 in a compressed state is arranged on the outer surface of the mounting plate 72, most of the gap between the chip 3 and the heat dissipation base 71 can be eliminated, and the thickness of the thermal interface material layer 4 filled between the chip 3 and the heat dissipation base 71 can be reduced. When the thickness of the thermal interface material layer 4 is reduced, the thermal resistance of the thermal interface material layer 4 also decreases. When the thermal resistance of the thermal interface material layer 4 decreases, the heat transfer from the chip 3 to the thermal interface material layer 4 and the heat dissipation base 71 can be accelerated, so that the heat dissipation base 71 can quickly absorb the heat of the chip 3. Furthermore, the heat dissipation base 71 transfers the absorbed heat to the heat dissipation housing 1, and the heat dissipation effect of the electronic device can be further improved.

[0134] Correspondingly, in order to further accelerate the heat transfer between the chip 3 and the heat dissipation device 7, as shown in FIG. 11, a vapor chamber 73 is arranged on the surface of the heat dissipation base 71 close to the chip 3.

[0135] The vapor chamber 73 conforms to the chip 3. For example, the shape of the vapor chamber 73 conforms to the shape of the chip 3, and the area of the vapor chamber 73 conforms to the area of the chip 3.

[0136] Thus, in one solution, the heat dissipation base 71 passes through the opening 12 and is located on the surface of the chip 3. The vapor chamber 73 at the bottom of the heat dissipation base 71 is in contact with the chip 3. The elastic member 6 in a compressed state located on the outer surface of the mounting plate 72 presses the heat dissipation base 71 against the surface of the chip 3 facing the circuit board 2, so that the vapor chamber 73 is in close contact with the chip 3, and the heat transfer between the chip 3 and the vapor chamber 73 can be accelerated.

[0137] In another solution, the heat dissipation base 71 passes through the opening 12 and is located on the surface of the chip 3. The vapor chamber 73 at the bottom of the heat dissipation base 71 is in contact with the thermal interface material layer 4, and the thermal interface material layer 4 is in contact with the chip 3. The elastic member 6 in a compressed state located on the outer surface of the mounting plate 72 presses the heat dissipation base 71 against the surface of the chip 3 facing the circuit board 2 to reduce the gap between the vapor chamber 73 and the chip 3. The thin thermal interface material layer 4 fills the gap. For example, the thickness of the thermal interface material layer 4 is about 0.05 millimeters, which speeds up the heat transfer between the chip 3 and the vapor chamber 73.

[0138] In order to improve the heat dissipation capacity of the heat dissipation device 7, correspondingly, as shown in FIG. 12, the heat dissipation device 7 further includes heat dissipation fins 74. The heat dissipation fins 74 are located on the surface of the heat dissipation base 71 away from the chip 3.

[0139] The heat dissipation fins 74 can increase the overall heat dissipation area of the heat dissipation base 71 and accelerate the heat dissipation of the chip 3.

[0140] As shown in FIG. 12, the heat dissipation fins 74 may include vertical heat dissipation fins perpendicular to the heat dissipation base 71. In order to increase the number of the heat dissipation fins 74, the heat dissipation fins 74 may further include horizontal heat dissipation fins perpendicular to the vertical heat dissipation fins. A person skilled in the art will flexibly select the arrangement of the heat dissipation fins 74 on the outer surface of the heat dissipation base 71 based on the actual situation.

[0141] In one example, the heat dissipation fins 74 may be attached in a plurality of ways. For example, they may be mounted on the outer surface of the heat dissipation base 71 by a welding method. Since the heat dissipation fins 74 are processed by the welding method, the number of the heat dissipation fins 74 increases and the heat dissipation fins 74 become dense, the overall heat dissipation area of the heat dissipation device 7 increases, and the effect of the heat dissipation device 7 for dissipating the heat of the chip 3 is improved.

[0142] As shown in FIG. 12, in the solution of attaching the heat dissipation fins 74 onto the outer surface of the upper part of the heat dissipation base 71, the mounting plate 72 on the outer surface of the side wall of the heat dissipation base 71 is at the base of the heat dissipation fins 74 Clamping and may be fixed. For example, as shown in FIG. 12, the mounting plate 72 may be located at the base of the heat dissipation fins 74 adjacent to the side wall of the heat dissipation base 71. Of course, as shown in FIG. 11, the mounting plate 72 may alternatively be located on the outer surface of the side wall of the heat dissipation base 71, close to the heat dissipation base 71. In the present embodiment, the specific attachment position of the mounting plate 72 is not limited, but it is a prerequisite that the bottom of the heat dissipation base 71 can be located at the opening 12 and that the mounting plate 72 can be mounted on the outer surface of the first housing wall 11.

[0143] Since the heat dissipation device 7 is detachably attached to the opening 12 of the heat dissipation housing 1, correspondingly, in order to improve the dustproof and waterproof performance of the electronic device, as shown in FIG. 12, a sealing material 9 is arranged between the side wall of the heat dissipation base 71 and the inner wall of the opening 12.

[0144] In one example, the sealing material 9 conforms to the heat dissipation base 71. For example, the heat dissipation base 71 is rectangular, the sealing material 9 is a rectangular ring, and can be sleeved on the side wall of the heat dissipation base 71. Then, when the heat dissipation base 71 is attached to the opening 12 of the heat dissipation housing 1, since the sealing material 9 is located between the side wall of the heat dissipation base 71 and the inner wall of the opening 12, it is possible to prevent dust, water, etc. from entering the chamber 101 through the gap between the outer wall of the heat dissipation base 71 and the inner wall of the opening 12.

[0145] In the electronic device shown in FIG. 9, the heat dissipation device 7 passes through the opening 12 and is located on the surface of the chip 3. The elastic member 6 in a compressed state located on the outer surface of the mounting plate 72 of the heat dissipation device 7 applies an elastic force to the heat dissipation device 7, so that most of the gap between the chip 3 and the heat dissipation base 71 can be eliminated, and the chip 3 and the heat dissipation base 71 can fit more closely to each other. When the chip 3 and the heat dissipation base 71 fit more closely to each other, accordingly, the heat transfer between the chip 3 and the heat dissipation base 71 becomes faster, so that the heat dissipation base 71 can quickly absorb the heat of the chip 3 and dissipate the heat of the chip 3, and the heat dissipation effect of the electronic device can be further improved.

[0146] As shown in FIG. 10, even when the heat interface material layer 4 is filled between the chip 3 and the heat dissipation base 71, the thickness of the filled heat interface material layer 4 is small, for example, within the range of only 0.05 millimeters to 0.07 millimeters, and the thermal resistance of the heat interface material layer 4 is small. Considering this, the thermal conductivity of the heat interface material layer 4 is improved, and the heat dissipation effect of the electronic device can be further improved.

[0147] Furthermore, since the bottom of the mounting plate 71 of the heat dissipation device 7 is in contact with the outer surface of the first housing wall 11, and the end of the mounting plate 71 is in contact with the housing heat dissipation fin 16 on the first housing wall 11, the heat dissipation device 7 and the heat dissipation housing 1 can be thermally connected, whereby the heat absorbed from the chip 3 by the heat dissipation device 7 can be transmitted to the heat dissipation housing 1, and this heat can also be dissipated by the heat dissipation housing 1. It can be seen that both the heat dissipation device 7 and the heat dissipation housing 1 can dissipate the heat of the chip 3 and enhance the effect of dissipating the heat of the chip 3.

[0148] In this way, the heat generated in the chip 3 can be quickly transferred to the heat dissipation device 7. A part of the heat absorbed by the heat dissipation device 7 is dissipated by itself, and the other part may be transferred to the heat dissipation housing 1 through the contact between the mounting plate 72 and the first housing wall 11, and is dissipated by the heat dissipation housing 1. It can be understood that both the heat dissipation device 7 and the heat dissipation housing 1 dissipate the heat of the chip 3, enhancing the effect of dissipating the heat of the chip 3.

[0149] For a schematic diagram of the structure of another electronic device, please refer to FIG. 10. The electronic device includes not only the heat dissipation housing 1, the circuit board 2, and the chip 3, but also the thermal interface material layer 4, the elastic member 6, and the heat dissipation device 7. The circuit board 2 is within the chamber 101 of the heat dissipation housing 1 Clamping fixed. The chip 3 is located on the surface of the circuit board 2. The thermal interface material layer 4 is located on the surface of the chip 3 away from the circuit board 2. An opening 12 is provided at a position corresponding to the chip 3 on the first housing wall 11 of the heat dissipation housing 1. The bottom of the heat dissipation base 71 of the heat dissipation device 7 enters the opening 12, and the heat dissipation base 71 is located on the surface of the thermal interface material layer 4. The mounting plate 72 of the heat dissipation device 7 is mounted on the outer surface of the first housing wall 11. The elastic member 6 is located on the outer surface of the mounting plate 72. Both the elastic member 6 and the mounting plate 72 are Clamping fixed to the first housing wall 11 using the fastener 8. The elastic member 6 is in a compressed state. Specifically, it is compressed between the upper part of the fastener 8 and the mounting plate 72.

[0150] For the description of the electronic device having such a structure, please refer to the descriptions of FIGS. 9 to 12 mentioned above. Here, the details will not be described again.

[0151] In the electronic device, the heat dissipation device 7 passes through the opening 12 and is located on the surface of the chip 3. The outer surface of the mounting plate 72 of the heat dissipation device 7 has an elastic member 6 in a compressed state. With the elastic force applied to the heat dissipation device 7 by the elastic member 6, most of the gap between the chip 3 and the heat dissipation base 71 can be eliminated. A thermal interface material layer 4 is filled between the chip 3 and the heat dissipation base 71, but the thickness of the filled thermal interface material layer 4 is small, for example, within the range of only 0.05 millimeters to 0.07 millimeters, and the thermal resistance of the thermal interface material layer 4 is small. Considering this, the thermal conductivity of the thermal interface material layer 4 is improved, and the heat dissipation effect of the electronic device can be further improved.

[0152] Furthermore, since the bottom of the mounting plate 71 of the heat dissipation device 7 is in contact with the outer surface of the first housing wall 11 and the end of the mounting plate 71 is in contact with the housing heat dissipation fins 16 on the first housing wall 11, the heat dissipation device 7 and the heat dissipation housing 1 can be thermally connected. As a result, the heat absorbed from the chip 3 by the heat dissipation device 7 can be transmitted to the heat dissipation housing 1, and this heat can also be dissipated by the heat dissipation housing 1. It can be seen that both the heat dissipation device 7 and the heat dissipation housing 1 can dissipate the heat of the chip 3 and enhance the effect of dissipating the heat of the chip 3.

[0153] In this way, the heat generated by the chip 3 can be quickly transmitted to the heat dissipation device 7. A part of the heat absorbed by the heat dissipation device 7 can be dissipated by itself, and the other part can be transmitted to the heat dissipation housing 1 through the contact between the mounting plate 72 and the first housing wall 11 and be dissipated by the heat dissipation housing 1. It can be seen that both the heat dissipation device 7 and the heat dissipation housing 1 can dissipate the heat of the chip 3 and enhance the effect of dissipating the heat of the chip 3.

[0154] For a schematic diagram of the structure of another electronic device, please refer to FIGS. 13 to 15.

[0155] As shown in FIG. 13, the electronic device includes a heat dissipation housing 1, a circuit board 2, a chip 3, and an elastic member 6. The circuit board 2, the chip 3, and the elastic member 6 are all located in a chamber 101 formed in the heat dissipation housing 1. The chip 3 is located on the surface of the circuit board 2. The elastic member 6 is compressed between the circuit board 2 and the second housing wall 13 of the heat dissipation housing 1 to reduce the gap between the chip 3 and the first housing wall 11 of the heat dissipation housing 1.

[0156] The first housing wall 11 is a housing wall of the heat dissipation housing 1 located opposite to the chip 3. The second housing wall 13 is a housing wall of the heat dissipation housing 1 located opposite to the circuit board 2. Since the chip 3 is located on the surface of the circuit board 2, the second housing wall 13 is located opposite to the first housing wall 11.

[0157] The elastic member 6 may be any component having compressive elasticity, for example, it may be a spring.

[0158] As shown in FIG. 13, both the circuit board 2 and the chip 3 are located in the chamber 101. The chip 3 is located on the surface of the circuit board 2. The chip 3 is located opposite to the first housing wall 11. The circuit board 2 is located opposite to the second housing wall 13. The elastic member 6 in a compressed state is attached between the surface of the circuit board 2 away from the chip 3 and the inner surface of the second housing wall 13.

[0159] There are multiple ways to attach the elastic member 6 in the chamber 101. For example, one way may be to weld one end of the elastic member 6 to the surface of the circuit board 2 away from the chip 3 and weld the other end of the elastic member 6 to the inner surface of the second housing wall 13. In another example, another way may be to fix the elastic member 6 between the circuit board 2 and the second housing wall 13 using screws. For example, the screw passes through the elastic member 6, and one end of the screw is attached to the circuit board 2 Clamping and the other end of the screw is attached to the second housing wall 13. ClampingOne end is fixed, and the other end is fixed to the second housing wall 13. Clamping Although the specific manner of attaching the elastic member 6 into the chamber 101 is not limited, it is a prerequisite that the elastic member 6 can be compressed and located between the circuit board 2 and the second housing wall 13, and an elastic force towards the chip 3 can be applied to the circuit board 2.

[0160] In this way, due to the elastic force applied to the circuit board 2 by the elastic member 6, the gap between the chip 3 and the first housing wall 11 can be reduced, and the chip 3 and the first housing wall 11 can be made to fit more closely to each other. When the chip 3 and the first housing wall 11 fit more closely to each other, correspondingly, the heat transfer between the chip 3 and the first housing wall 11 is accelerated, so that the heat dissipation housing 1 can quickly absorb the heat of the chip 3 and dissipate the heat of the chip 3, and the heat dissipation effect of the electronic device can be further improved.

[0161] In order to further reduce the gap between the chip 3 and the first housing wall 11, correspondingly, as shown in FIG. 14, a thermal interface material layer 4 is filled between the chip 3 and the first housing wall 11. The thermal interface material layer 4 is a flexible material and has thermal conductivity. For example, the thermal interface material layer 4 may be silica gel, silicone grease, or gel, etc. In this embodiment, the specific material of the thermal interface material layer 4 is not limited, but it is a prerequisite that the thermal interface material layer 4 can reduce the gap and realize the thermal conduction effect.

[0162] Although the thermal interface material layer 4 is filled between the chip 3 and the first housing wall 11 of the electronic device, since the elastic member 6 in a compressed state arranged between the circuit board 2 and the second housing wall 13 applies an elastic force towards the chip 3 to the circuit board 2, most of the gap between the chip 3 and the first housing wall 11 is eliminated. In this case, what needs to be filled in the gap is only the thin thermal interface material layer 4. For example, the thickness of the filled thermal interface material layer 4 is 0.05 millimeters to 0.07 millimeters, or even smaller.

[0163] Furthermore, since the thin thermal interface material layer 4 filled between the chip 3 and the first housing wall 11 has compression deformation characteristics and the elastic member 6 applies an elastic force to the circuit board 2, the thickness of the thermal interface material layer 4 can be further reduced, and thus the thermal interface material layer 4 becomes thinner. For example, a thermal interface material layer 4 made of silica gel with a thickness of 0.07 millimeter is selected and filled between the chip 3 and the first housing wall 11. The thermal interface material layer 4 is compressed again by 0.02 millimeter in thickness under the pressing action of the elastic member 6. In this case, the thickness of the thermal interface material layer 4 finally filled between the chip 3 and the first housing wall 11 becomes 0.05 millimeter.

[0164] The elastic member 6 in a compressed state attached between the circuit board 2 and the second housing wall 13 can eliminate most of the gap between the chip 3 and the first housing wall 11, and it can be seen that the thickness of the thermal interface material layer 4 filled between the chip 3 and the first housing wall 11 can be significantly reduced. When the thickness of the thermal interface material layer 4 decreases, the thermal resistance of the thermal interface material layer 4 also decreases. When the thermal resistance of the thermal interface material layer 4 decreases, the thermal conductivity of the thermal interface material layer 4 can be improved, and the heat dissipation effect of the electronic device can be further improved.

[0165] For example, in the solution without arranging the elastic member 6, it is necessary to arrange a thermal interface material layer 4 with a thickness of 1 millimeter to 1.5 millimeters between the chip 3 and the first housing wall 11. In the solution of arranging the elastic member 6 in a compressed state between the circuit board 2 and the second housing wall 13, it is necessary to arrange a thermal interface material layer 4 with a thickness of only 0.05 millimeter to 0.07 millimeter between the chip 3 and the first housing wall 11. It can be seen that the thickness of the thermal interface material layer 4 in the former case is significantly larger than that in the latter case. In this case, the thermal resistance of the thermal interface material layer 4 in the former case is also larger than that in the latter case. Furthermore, the heat transfer performance of the thermal interface material layer 4 in the latter case is higher than that in the former case.

[0166] As shown in FIGS. 13 and 14, the circuit board 2 is fixed in the chamber 101 using the elastic member 6. Clamping When the elastic member 6 expands and contracts, the circuit board 2 also vibrates together with the elastic member 6, which may affect the normal operation of other components on the surface of the circuit board 2, particularly the attachment and sealing performance of the interface components.

[0167] To overcome the above-described problems, the circuit board 2 may be divided into at least two sub-boards, with only the chip 3 occupying one sub-board and other components occupying another sub-board. The sub-board on which the chip 3 is located is flexibly fixed in the chamber 101 using the elastic member 6. Clamping The sub-board on which the other components are located is firmly fixed in the chamber 101. Clamping However, in a large electronic device where the circuit board 2 is large, the circuit board 2 may be further divided into more sub-boards, with only the chip 3 occupying one sub-board and other components occupying the remaining multiple sub-boards. In this embodiment, the number of sub-boards included in the circuit board 2 is not limited, but an example including a first sub-board and a second sub-board may be used. The first sub-board is the sub-board on which the chip 3 is located, and the number of first sub-boards matches the number of chips 3. The second sub-board is the sub-board on which the other components are located, and the number of second sub-boards is related to the number of other components, and there may be one or more second sub-boards.

[0168] As shown in FIG. 15, the circuit board 2 includes a first sub-board 21 and a second sub-board 22. The first sub-board 21 and the second sub-board 22 are electrically connected. The chip 3 is located on the surface of the first sub-board 21, and the elastic member 6 is compressed between the first sub-board 21 and the second housing wall 13. The second sub-board 22 is fixed to the housing wall of the heat dissipation housing 1, and the interface component 10 of the electronic device is located on the surface of the second sub-board 22. Clamping

[0169] There is one or more first sub-boards 21, which is mainly related to the number of chips 3. For example, if there is one chip 3, there is also one first sub-board 21. In another example, if there are multiple chips 3, there may be one first sub-board 21, and all the multiple chips 3 are located on this first sub-board 21. In another example, if there are multiple chips 3, there may also be multiple first sub-boards 21, and the chips 3 are in a one-to-one correspondence with the first sub-boards 21. In this embodiment, the number of the first sub-boards 21 is not limited, but those skilled in the art will flexibly select the number of the first sub-boards based on the actual situation.

[0170] There is one or more second sub-boards 22, which is mainly related to the number of components in the electronic device. For example, if there are a large number of components, there may be multiple second sub-boards 22. In this embodiment, the number of the second sub-boards 22 is not limited, but those skilled in the art will flexibly select the number of the second sub-boards based on the actual situation.

[0171] In the accompanying drawings, one first sub-board 21 and one second sub-board 22 may be used as an example.

[0172] As shown in FIG. 15, the chip 3 is welded to the surface of the first sub-board 21 among the plurality of circuit boards 2, and the elastic member 6 is compressed between the first sub-board 21 and the second housing wall 13. The interface component 10 is welded to the surface of the second sub-board 22, and the second sub-board 22 is firmly Clamping fixed in the chamber 101. Regarding the electrical connection relationship, the first sub-board 21 and the second sub-board 22 may be electrically connected using a flexible cable, or the first sub-board 21 and the second sub-board 22 may be electrically connected using a flexible circuit board.

[0173] Thus, due to the elastic force of the elastic member 6 acting on the first sub-board 21, most of the gap between the chip 3 and the first housing wall 11 is eliminated, and the heat transfer between the chip 3 and the first housing wall 11 can be accelerated. Even when the heat interface material layer 4 is filled between the chip 3 and the first housing wall 11, the thickness of the filled heat interface material layer 4 is small, for example, within the range of 0.05 mm to 0.07 mm, and the thermal resistance of the heat interface material layer 4 is small. Considering this, the heat transfer between the chip 3 and the first housing wall 11 becomes even faster, and the effect of dissipating the heat of the chip 3 can be enhanced.

[0174] Regarding the interface component 10, since the interface component 10 is located on the surface of the second sub-board 22 and does not need to vibrate together with the elastic member 6, there is no need to ensure a gap between the interface component 10 and the mounting port through which the interface component is mounted. In this way, the sealing performance between the interface component 10 and the mounting port can be guaranteed, and the dust-proof and waterproof effects can be realized.

[0175] For a schematic diagram of the structure of another electronic device, please refer to FIGS. 14 and 15.

[0176] As shown in FIG. 14, the electronic device includes a heat dissipation housing 1, a circuit board 2, a chip 3, a heat interface material layer 4, and an elastic member 6. The circuit board 2, the chip 3, the heat interface material layer 4, and the elastic member 6 are all located in a chamber 101 formed in the heat dissipation housing 1. The chip 3 is located on the surface of the circuit board 2. The heat interface material layer 4 is located on the surface of the chip 3 away from the circuit board 2. The elastic member 6 is compressed between the circuit board 2 and the second housing wall 13 of the heat dissipation housing 1 to reduce the gap between the chip 3 and the first housing wall 11 of the heat dissipation housing 1.

[0177] The first housing wall 11 is a housing wall of the heat dissipation housing 1 located at a position facing the chip 3. The second housing wall 13 is a housing wall of the heat dissipation housing 1 located at a position facing the circuit board 2. The second housing wall 13 is located at a position facing the first housing wall 11.

[0178] For the description of the electronic device having such a structure, please refer to the foregoing description. Here, the details will not be described one by one again.

[0179] In the electronic device, since the elastic member 6 compressed between the circuit board 2 and the second housing wall 13 applies an elastic force to the circuit board 2, most of the gap between the chip 3 and the first housing wall 11 can be eliminated, and the chip 3 and the first housing wall 11 can fit more closely to each other. When the chip 3 and the first housing wall 11 fit more closely to each other, accordingly, the heat transfer between the chip 3 and the first housing wall 11 becomes faster, so that the first housing wall 11 can quickly absorb the heat of the chip 3 and dissipate the heat of the chip 3, and the heat dissipation effect of the electronic device can be further improved.

[0180] Even when the heat interface material layer 4 is filled between the chip 3 and the first housing wall 11, the thickness of the filled heat interface material layer 4 is small, for example, within the range of only 0.05 millimeters to 0.07 millimeters, and the thermal resistance of the heat interface material layer 4 is small. Considering this, the thermal conductivity of the heat interface material layer 4 is improved, and the heat dissipation effect of the electronic device can be further improved.

[0181] The foregoing description is merely an embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions, or improvements made without departing from the spirit and principle of the present application should be included in the protection scope of the present application.

Claims

1. An electronic device for an autonomous vehicle, the electronic device comprising a heat dissipation housing, a circuit board, a chip, a heat conducting member, and an elastic member, wherein the circuit board, the chip, the heat conducting member, and the elastic member are all located within a chamber formed in the heat dissipation housing, the chip is located on the surface of the circuit board, and the heat conducting member is located on the surface of the chip that is away from the circuit board; the elastic member is compressed between the surface of the heat conducting member that is away from the chip and the inner surface of a first housing wall of the heat dissipation housing to reduce the gap between the chip and the heat conducting member, the elastic member has heat transfer characteristics, and the first housing wall is the housing wall of the heat dissipation housing that is located opposite to the chip, the circuit board is fastened and fixed to the heat dissipation housing, an electronic device.

2. The electronic device comprises a thermal interface material layer, The electronic device according to claim 1, wherein the thermal interface material layer fills the gap between the chip and the heat conducting member.

3. The elastic member has a spring and a heat pipe, the spring and the heat pipe are compressed between the heat conducting member and the first housing wall to reduce the gap between the chip and the heat conducting member; the spring and the heat pipe are connected between the heat conducting member and the first housing wall to transfer the heat absorbed from the chip by the heat conducting member to the heat dissipation housing; The electronic device according to claim 1 or 2, wherein the heat pipe has elasticity and the heat pipe is compressed between the surface of the heat conducting member that is away from the chip and the inner surface of the first housing wall of the heat dissipation housing.

4. The heat pipe includes a first pipe portion, a second pipe portion, and a third pipe portion, The electronic device according to claim 3, wherein the first pipe portion is attached to the surface of the heat conducting member that is away from the chip, the third pipe portion is attached to the inner surface of the first housing wall, and the second pipe portion is obliquely connected between the first pipe portion and the third pipe portion.

5. The elastic member is a bent heat conduction sheet and is disposed in a compressed manner between the surface of the heat conduction member away from the chip and the inner surface of the first housing wall, and the elastic member provides elasticity by its bending characteristics and transfers heat by its heat conduction characteristics. The electronic device according to any one of claims 1 to 4.

6. The electronic device according to any one of claims 1 to 5, wherein the circuit board is fastened and fixed to the housing wall of the heat dissipation housing.

7. An electronic device for an autonomous vehicle, the electronic device comprising a heat dissipation housing, a circuit board, a chip, an elastic member, and a heat dissipation device. Both the circuit board and the chip are located in a chamber formed in the heat dissipation housing, and the chip is located on the surface of the circuit board. The first housing wall of the heat dissipation housing has an opening at a position corresponding to the chip, and the first housing wall is a housing wall of the heat dissipation housing at a position facing the chip. The heat dissipation device has a heat dissipation base and a mounting plate, and the mounting plate is provided protruding from the side wall of the heat dissipation base. The heat dissipation base is aligned with the opening, the heat dissipation base is detachably disposed in the opening, the heat dissipation base is located on the surface of the chip away from the circuit board, and the bottom of the mounting plate is thermally connected to the outer surface of the first housing wall. The elastic member is located on the surface of the mounting plate away from the first housing wall, and both the elastic member and the mounting plate are fastened and fixed to the first housing wall using a fastener. The elastic member is compressed between the fastener and the mounting plate to reduce the gap between the chip and the heat dissipation base. The circuit board is fastened and fixed to the first housing wall. Electronic device.

8. The electronic device further comprises a thermal interface material layer. The electronic device according to claim 7, wherein the thermal interface material layer fills the gap between the chip and the heat dissipation base.

9. The electronic device according to claim 7 or 8, wherein the bottom of the mounting plate is in close contact with the outer surface of the first housing wall.

10. Further comprising a sealing material provided between the side wall of the heat dissipation base and the inner wall of the opening, The sealing material is in contact with the bottom of the mounting plate, The electronic device according to any one of claims 7 to 9.

11. The electronic device according to any one of claims 7 to 10, wherein a vapor chamber is disposed on a surface of the heat dissipation base close to the chip.

12. The electronic device according to any one of claims 7 to 11, wherein the heat dissipation device further has heat dissipation fins, and the heat dissipation fins are located on a surface of the heat dissipation base away from the chip. The electronic device according to any one of claims 7 to 11, wherein the heat dissipation device further has heat dissipation fins, and the heat dissipation fins are located on a surface of the heat dissipation base away from the chip.

13. The electronic device according to any one of claims 7 to 12, wherein an end of the mounting plate away from the side wall of the heat dissipation base is in contact with a housing heat dissipation fin of the heat dissipation housing.

14. The electronic device according to any one of claims 7 to 13, wherein a sealing material is disposed between the side wall of the heat dissipation base and the inner wall of the opening.

15. The electronic device according to any one of claims 7 to 14, wherein the circuit board is fastened and fixed to a housing wall of the heat dissipation housing.

16. An electronic device for an autonomous vehicle, the electronic device comprising a heat dissipation housing, a circuit board, a chip, and an elastic member, The circuit board, the chip, and the elastic member are all located in a chamber formed in the heat dissipation housing, and the chip is located on a surface of the circuit board; The elastic member is compressed between the circuit board and a second housing wall of the heat dissipation housing to reduce a gap between the chip and a first housing wall of the heat dissipation housing, the first housing wall being a housing wall of the heat dissipation housing at a position facing the chip, and the second housing wall being at a position facing the first housing wall, The circuit board is fastened and fixed to the heat dissipation housing. Electronic device.

17. The electronic device further comprises a thermal interface material layer, The electronic device according to claim 16, wherein the thermal interface material layer fills the gap between the chip and the first housing wall.

18. The circuit board has a first sub-board and a second sub-board, and the first sub-board and the second sub-board are electrically connected by a flexible cable or a flexible circuit board; The chip is located on the surface of the first sub-board, and the elastic member is compressed between the first sub-board and the second housing wall; The electronic device according to claim 16 or 17, wherein the second sub-board is fastened and fixed to the housing wall of the heat dissipation housing, and the interface component of the electronic device is located on the surface of the second sub-board.

19. The elastic member is a heat conduction sheet bent in a bellows shape and is disposed in a compressed manner between the circuit board and the second housing wall of the heat dissipation housing. The elastic member provides elasticity by its bending characteristics and transfers heat by its heat conduction characteristics. The electronic device according to any one of claims 16 to 18.

20. A vehicle comprising the electronic device according to any one of claims 1 to 6, or the electronic device according to any one of claims 7 to 15, or the electronic device according to any one of claims 16 to 19.

Images