Substrate conveying mechanism, lithographic apparatus, and method for manufacturing article

Abstract

To provide a substrate conveying mechanism advantageous for simplifying an apparatus.SOLUTION: A substrate conveying mechanism has a holding part that holds a substrate, a moving part that moves the holding part, and a guide that guides the movement of the moving part. The shape of the guide is configured such that the moving part moves along the guide to change the angle of the holding part. The holding part is moved by the moving part while holding the substrate in an inclined state.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present invention relates to a substrate transport mechanism, a lithographic apparatus, and a method for manufacturing an article. [Background technology]

[0002] In the manufacturing process of semiconductor devices, liquid crystal display devices, and the like, an operation of transporting a substrate from a placement position to a predetermined position is performed, and it is preferable that this transport operation be performed in a short time. Patent Document 1 discloses a method of transporting a substrate while suction-holding it by a substrate carry-out device built into a substrate stage. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2015-146045 A Summary of the Invention [Problem to be solved by the invention]

[0004] However, if a mechanism for sucking the substrate is provided in the transport section in order to transport the substrate while sucking and holding it, the apparatus becomes complicated.

[0005] SUMMARY OF THE PRESENT EMBODIMENT An object of the present invention is to provide a substrate transport mechanism which is advantageous in simplifying the apparatus. [Means for solving the problem]

[0006] In order to achieve the above-mentioned object, a substrate transport mechanism as one aspect of the present invention has a holding part for holding a substrate, a moving part for moving the holding part, and a guide for guiding the movement of the moving part, the shape of the guide is configured such that the angle of the holding part changes as the moving part moves along the guide, and the holding part is moved by the moving part while holding the substrate in an inclined state.

[0007] Further objects or other aspects of the present invention will become apparent from the following description of the embodiments with reference to the accompanying drawings. Effect of the Invention

[0008] According to the present invention, it is possible to provide a substrate transport mechanism which is advantageous in simplifying the apparatus. [Brief description of the drawings]

[0009] [Figure 1] 1 is a schematic view showing a configuration of a substrate processing apparatus in a first embodiment. [Diagram 2] FIG. 2 is a cross-sectional view of the substrate stage in the first embodiment. [Diagram 3] 5A and 5B are diagrams illustrating detailed configurations of a first cam follower and a second cam follower. [Figure 4] 5A and 5B are diagrams illustrating detailed configurations of a third cam follower and a fourth cam follower. [Diagram 5] 13 is a diagram showing the substrate transport mechanism and the substrate support part as viewed from the +Z direction. [Figure 6] 5A to 5C are diagrams illustrating a substrate transport operation in the first embodiment. [Figure 7] FIG. 11 is a diagram showing a configuration of a base in a second embodiment. [Figure 8] 10 is a flowchart of a method for manufacturing an article in a third embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] Hereinafter, an embodiment of the present invention will be described with reference to the attached drawings. Note that the following embodiment does not limit the invention according to the claims. Although the embodiment describes a number of features, not all of these features are essential to the invention, and the features may be combined in any manner. Furthermore, in the attached drawings, the same reference numbers are used for the same or similar configurations, and duplicated descriptions are omitted.

[0011] In addition, in this specification and the attached drawings, directions are basically indicated by an XYZ coordinate system in which the vertical direction is the Z axis, the horizontal plane perpendicular to the vertical direction is the XY plane, and each axis is orthogonal to each other. However, if an XYZ coordinate system is described in each drawing, that coordinate system takes precedence.

[0012] A specific configuration will be described below for each embodiment.

[0013] First Embodiment FIG. 1 is a schematic diagram showing the configuration of a substrate processing apparatus 100 in this embodiment. In this embodiment, the substrate processing apparatus 100 is a projection exposure apparatus that exposes a pattern of an original (mask, reticle) onto a substrate via a projection optical system. However, the substrate processing apparatus 100 is not limited to an exposure apparatus. For example, the substrate processing apparatus 100 may be a drawing apparatus that draws on a substrate using an electron beam, an ion beam, or the like to form a pattern on the substrate. The substrate processing apparatus 100 may also be another lithography apparatus, for example, an imprint apparatus that forms a pattern on the substrate by molding an imprint material on the substrate using a mold. Alternatively, the substrate processing apparatus 100 may be another apparatus for processing a substrate such as a semiconductor wafer or a glass plate, such as an ion implantation apparatus, a development apparatus, an etching apparatus, a film formation apparatus, an annealing apparatus, a sputtering apparatus, or a deposition apparatus. The substrate processing apparatus 100 may also be a planarization apparatus that planarizes a composition on a substrate using a flat plate.

[0014] The substrate processing apparatus 100 includes an illumination optical system 1, which is a light irradiation unit that irradiates light, a reticle stage 3 that holds a reticle 2, a projection optical system 4, a substrate stage 6 that is movable while holding a substrate 5, and a control unit 7 that controls each part of the substrate processing apparatus 100. The reticle 2 is, for example, a master plate on which a pattern (for example, a circuit pattern) to be transferred is formed of chrome on the surface of quartz glass. The substrate 5 is, for example, single crystal silicon, and when the substrate processing apparatus 100 is an exposure apparatus, the substrate 5 transported to the substrate processing apparatus 100 has a photosensitive material (resist) applied on its surface. Here, the illumination optical system 1 is a pattern forming unit that forms a pattern on the substrate 5. In this embodiment, an example of a lithography apparatus that forms a pattern using light is shown, and the pattern forming unit is the illumination optical system 1, but it may be a lithography apparatus that hardens a thermosetting material by heat. In that case, the pattern forming unit is, for example, a heating unit that heats the thermosetting material.

[0015] In the substrate processing apparatus 100, exposure light from a light source (not shown) passes through an illumination optical system 1 and illuminates a reticle 2 held on a reticle stage 3. The light transmitted through the reticle 2 passes through a projection optical system 4 and is irradiated onto a substrate 5. At this time, light from a pattern formed on the reticle 2 forms an image on the surface of the substrate 5. The substrate processing apparatus 100 exposes a shot area on the substrate 5 in this manner, and performs similar exposure on each of a plurality of shot areas.

[0016] FIG. 2 is a cross-sectional view of the substrate stage 6 in this embodiment. The substrate stage 6 has a substrate placement unit 20, an X driving unit 30, an X air bearing 30a, a Y driving unit 50, a Y air bearing 50a, a Y guide 60, a drive control unit 80, a support 201, and an X bar mirror 90. The substrate stage 6 also has a transport guide 401, a transport moving unit 402, a Z guide 403, a Z moving unit 470, a base 404, a holding unit 430, and a compression coil spring 460. The substrate stage 6 also has a first guide 410a, a second guide 410b, a third guide 410c, and a fourth guide 410d for positioning the base 404 at an arbitrary position. By arranging a plurality of guides in this manner, the base 404 can be positioned at an arbitrary position. Here, by arranging the base (moving part) 404 at an arbitrary position, the movement of the base 404 can be guided and the movement of the base (moving part) 404 can be regulated. The first guide 410a, the third guide 410c, the fourth guide 410d, and the fifth guide 410e described later each have an inclined portion. That is, the plurality of guides includes a plurality of guides provided with an inclined portion. The amount of inclination (amount of change in angle) of the base 404, the holding part 430, and the substrate 5 held by the holding part 430 is determined by the shape of each guide determined from the length and angle of the inclination of the inclined portion and the length of the horizontal portion of each guide. The length or angle of the inclination is determined based on one or more of the speed at which the substrate 5 is transported, the shape of the substrate 5, and the thickness of the substrate 5. This determination is specifically to determine the design value of each guide, and the length or angle of the inclination of the inclined portion of each guide is designed based on one or more of the speed at which the substrate 5 is transported, the shape of the substrate 5, and the thickness of the substrate 5. Then, each guide including the designed inclined portion is manufactured. In the present embodiment, the movement of the substrate transport mechanism is guided by a guide having a plurality of inclined portions, but the holding portion 430 (substrate holding surface) may be inclined by providing an inclined portion on at least one of the plurality of guides. Furthermore, the substrate stage 6 has a first cam follower 420a, a second cam follower 420b, a third cam follower 420c, and a fourth cam follower 420d, which are cylindrical shaft bearings provided on the base 404.

[0017] In this embodiment, the transfer moving part 402, the Z guide 403, the Z moving part 470, the base 404, the holding part 430, the compression coil spring 460, the cam followers, and the guides are collectively referred to as the substrate transfer mechanism. Although each guide is a part of the substrate transfer mechanism, each guide is fixed at a predetermined position and does not move, so that the part that moves the substrate transfer mechanism (the part that changes position) in the description of the movement (position change) of the substrate transfer mechanism described later does not include each guide. The substrate placement part 20 is fixed on the X driving part 30 via a support 201, and the substrate 5 can be placed thereon. The X driving part 30 drives the Y driving part 50 in the X direction via the X air bearing 30a by a linear motor or the like (not shown). The Y driving part 50 drives the Y guide 60 in the Y direction via the Y air bearing 50a by a linear motor or the like (not shown). The drive control part 80 controls the drive of each part of the substrate stage 6 including the substrate transfer mechanism. X bar mirror 90 reflects light from an interferometer (not shown) and is used for positioning in the X coordinate of substrate 5. In addition, substrate stage 6 has a Y bar mirror (not shown), which reflects light from an interferometer (not shown) and is used for positioning in the Y coordinate of substrate 5.

[0018] The transport guide 401 is a guide when the substrate transport mechanism moves in the Y direction, and is disposed on the upper surface of the X drive unit 30, and the transport moving unit 402 moves in the Y direction along the transport guide 401. The Z guide 403 is a guide when a part of the substrate transport mechanism moves in the Z direction, and is connected to the transport moving unit 402. The Z moving unit 470 is connected to the base 404, and moves in the Z direction along the Z guide 403, thereby moving the base 404 in the Z direction. The first guide 410a, the second guide 410b, the third guide 410c, the fourth guide 410d, the fifth guide 410e, and the sixth guide 410f, which will be described later, are guide rails having sliding surfaces, and each cam follower moves along the sliding surface. The holding unit 430 is disposed on the base 404, and holds the substrate 5 when the substrate transport mechanism transports the substrate 5. Furthermore, since the substrate transport mechanism moves in the Y direction at high acceleration, it is preferable that the surface of the holding portion 430 that holds the substrate 5 be capable of generating a high frictional force between the substrate 5 and the holding portion 430 in order to prevent the substrate 5 from falling.

[0019] FIG. 3 is a diagram for explaining the detailed configuration of the first cam follower 420a and the second cam follower 420b. As shown in FIG. 3(a), the base 404 is provided with the first deflection Z guide 421, the first deflection Z moving part 422, the first deflection spring 423, and the first mechanical stopper 424. The first deflection Z guide 421, the first deflection Z moving part 422, the first deflection spring 423, and the first mechanical stopper 424 are arranged to move the first cam follower 420a in the Z direction. In this embodiment, the first cam follower 420a is configured to be driven in the Z direction, but is not limited to this example. For example, the second cam follower 420b may be configured to be driven in the Z direction depending on the shapes of the first guide 410a, the second guide 410b, the third guide 410c, and the fourth guide 410d. Alternatively, both the first cam follower 420a and the second cam follower 420b may be configured to drive in the Z direction.

[0020] First deflection Z guide 421 is fixed to base 404, and first deflection Z moving part 422 moves in the Z direction along first deflection Z guide 421. Note that, in order to reduce the load on first deflection Z guide 421, it is preferable that the Y coordinate of the center position in the Y direction of first cam follower 420a coincides with the Y coordinate of the center position in the Y direction of first deflection Z guide 421.

[0021] First cam follower 420a is connected to first deflection Z movement part 422, and second cam follower 420b is integral with base 404. The +Z direction end of first deflection spring 423 is connected to base 404, and the -Z direction end is connected to first deflection Z movement part 422. The spring constant of first deflection spring 423 is set so that the tension of first deflection spring 423 is greater than the force in the -Z direction due to gravity of first deflection Z movement part 422 and first cam follower 420a.

[0022] First mechanical stopper 424 is integrated with base 404, and is disposed so that a part of the -Z direction surface of first avoidance Z movement part 422 and a part of the +Z direction surface of first mechanical stopper 424 are in contact. Also, first mechanical stopper 424 restricts the extension of first avoidance spring 423 in the -Z direction by contacting first avoidance Z movement part 422. Here, the surface of first mechanical stopper 424 that contacts first avoidance Z movement part 422 is preferably spherical, and by making the contact surface spherical, the state when first mechanical stopper 424 and first avoidance Z movement part 422 come into contact with each other is generally similar. In this embodiment, an example has been described in which the surface of the first mechanical stopper 424 that comes into contact with the first avoidance Z movement portion 422 is spherical, but the surface of the first avoidance Z movement portion 422 that comes into contact with the first mechanical stopper 424 may also be spherical.

[0023] When an external force of a predetermined value or more is applied to first cam follower 420a in the +Z direction, first deflection spring 423 contracts, and first cam follower 420a and first deflection Z movement part 422 move in the +Z direction along first deflection Z guide 421, as shown in FIG. 3(b). When the external force becomes less than the predetermined value, first deflection spring 423 expands, and first cam follower 420a and first deflection Z movement part 422 move in the -Z direction along first deflection Z guide 421. Then, first cam follower 420a and first deflection Z movement part 422 stop at a position where first mechanical stopper 424 and first deflection Z movement part 422 come into contact with each other, as shown in FIG. 3(a).

[0024] FIG. 4 is a diagram for explaining the detailed configuration of the third cam follower 420c and the fourth cam follower 420d. As shown in FIG. 4(a), the base 404 is provided with the second Z guide for deflection 425, the second Z moving part for deflection 426, the second spring for deflection 427, and the second mechanical stopper 428. The second Z guide for deflection 425, the second Z moving part for deflection 426, the second spring for deflection 427, and the second mechanical stopper 428 are arranged to move the fourth cam follower 420d in the Z direction. In this embodiment, the fourth cam follower 420d is configured to be driven in the Z direction, but is not limited to this example. For example, the third cam follower 420c may be configured to be driven in the Z direction depending on the shapes of the first guide 410a, the second guide 410b, the third guide 410c, and the fourth guide 410d. Alternatively, both the third cam follower 420c and the fourth cam follower 420d may be configured to be driven in the Z direction.

[0025] Second deflection Z guide 425 is fixed to base 404, and second deflection Z movement part 426 moves in the Z direction along second deflection Z guide 425. Note that, in order to reduce the load on second deflection Z guide 425, it is preferable that the Y coordinate of the center position in the Y direction of fourth cam follower 420d coincides with the Y coordinate of the center position in the Y direction of second deflection Z guide 425.

[0026] Fourth cam follower 420d is connected to second deflection Z movement part 426, and third cam follower 420c is integrated with base 404. The +Z direction end of second deflection spring 427 is connected to base 404, and the -Z direction end is connected to second deflection Z movement part 426. The spring constant of second deflection spring 427 is set so that the tension of second deflection spring 427 is greater than the force in the -Z direction due to gravity of second deflection Z movement part 426 and fourth cam follower 420d.

[0027] Second mechanical stopper 428 is integral with base 404, and is disposed so that a portion of the +Z direction surface of second avoidance Z movement part 426 contacts a portion of the -Z direction surface of second mechanical stopper 428. Also, second mechanical stopper 428 contacts second avoidance Z movement part 426 to restrict contraction of second avoidance spring 427 in the +Z direction. Here, the surface of second mechanical stopper 428 that contacts second avoidance Z movement part 426 is preferably spherical, and by making the contact surface spherical, the state when second mechanical stopper 428 and second avoidance Z movement part 426 come into contact with each other is generally similar. In this embodiment, an example has been described in which the surface of the second mechanical stopper 428 that comes into contact with the second avoidance Z movement portion 426 is spherical, but the surface of the second avoidance Z movement portion 426 that comes into contact with the second mechanical stopper 428 may also be spherical.

[0028] When an external force of a predetermined value or more is applied to fourth cam follower 420d in the -Z direction, second deflection spring 427 expands as shown in Fig. 4(b), and fourth cam follower 420d and second deflection Z movement part 426 move in the -Z direction along second deflection Z guide 425. When the external force becomes less than the predetermined value, second deflection spring 427 contracts, and fourth cam follower 420d and second deflection Z movement part 426 move in the +Z direction along second deflection Z guide 425. Then, fourth cam follower 420d and second deflection Z movement part 426 stop at a position where second mechanical stopper 428 and second deflection Z movement part 426 come into contact with each other as shown in Fig. 4(a).

[0029] Fig. 5 is a diagram of the substrate transport mechanism and substrate support part 70 as viewed from the +Z direction. Fig. 5 also shows the positional relationship in the X direction between third cam follower 420c, fourth cam follower 420d, third guide 410c, fourth guide 410d, fifth guide 410e, and sixth guide 410f. Substrate support part 70 is a platform on which substrate 5 transported from the substrate transport mechanism is placed, and supports substrate 5 by a plurality of pins provided on the platform.

[0030] The third cam follower 420c and the fourth cam follower 420d are disposed at positions offset in the X direction, and the third cam follower 420c is disposed on the -X direction side of the fourth cam follower 420d. The third guide 410c has a sliding surface at a position where it contacts only the third cam follower 420c. The fourth guide 410d has a sliding surface that is wide in the X direction so that it can guide both the third cam follower 420c and the fourth cam follower 420d. The fifth guide 410e and the sixth guide 410f are provided on the substrate support part 70, and have a sliding surface at a position where it contacts only the fourth cam follower 420d.

[0031] FIG. 6 is a diagram showing the substrate transport operation in this embodiment. As shown in FIG. 6(a), the substrate transport mechanism is in standby so that the holding part 430 is at a lower position than the substrate placement part 20. Then, the substrate transport operation is started, and the transport moving part 402 moves in the -Y direction along the transport guide 401 as shown in FIG. 6(b). This causes the entire substrate transport mechanism to move in the -Y direction. During this movement in the -Y direction, the first cam follower 420a moves along the sliding surface of the first guide 410a, and the fourth cam follower 420d moves along the sliding surface of the fourth guide 410d. Here, when the first cam follower 420a moves along the first guide 410a, the compression coil spring 460 expands in the +Z direction at the inclined part provided on the +Y direction side of the first guide 410a. Due to the expansion of this compression coil spring 460, the Z moving part 470 moves in the +Z direction along the Z guide 403, and the base 404 moves in the +Z direction accordingly. The base 404 moves in the +Z direction, whereby the holder 430 receives (obtains) the substrate 5 from the substrate mounting part 20 .

[0032] Here, by making the inclination angle of first guide 410a in the +Y direction the same as the inclination angle of fourth guide 410d, when the substrate transport mechanism receives (acquires) substrate 5 from substrate mounting section 20, it is possible to acquire substrate 5 with the substrate holding surface of the substrate transport mechanism in a horizontal state. In other words, the guide is arranged so that two or more of the inclined portions of the guide having multiple inclined portions have the same angle.

[0033] This makes it possible to suppress misalignment of the substrate 5 in the horizontal direction. Here, the inclination angle of the +Y direction side of the first guide 410a and the inclination angle of the fourth guide 410d are set so that the substrate 5 is positioned on the +Z direction side of the substrate mounting part 20 when the holding part 430 holds the substrate 5. Also, they are set so that the substrate mounting part 20 and the substrate 5 do not come into contact with each other even if the substrate 5 bends in the -Z direction due to its own weight when the substrate transport mechanism transports the substrate 5.

[0034] When the substrate transport mechanism moves further in the -Y direction, as shown in Fig. 6(c), the substrate transport mechanism becomes tilted due to the difference between the inclination length of the +Y direction side of the first guide 410a and the inclination length of the fourth guide 410d. The first guide 410a is arranged so that the inclination length of the +Y direction side of the first guide 410a is longer than the inclination length of the fourth guide 410d. In other words, the guide is arranged so that the length of a first inclined portion (the inclined portion on the +Y direction side of the first guide 410a) and a second inclined portion (the inclined portion of the fourth guide 410d) different from the first inclined portion are different from each other.

[0035] By arranging in this way, the base 404 is inclined as shown in FIG. 6(c), and the holding part 430 is also inclined accordingly, so that the substrate conveying mechanism can hold the substrate 5 at an angle. The shapes of the first guide 410a and the fourth guide 410d are determined and arranged so that the height of the substrate 5 on the conveying direction side is lower than the height of the substrate 5 on the opposite side to the conveying direction. In this embodiment, when the substrate conveying mechanism conveys the substrate 5, the substrate 5 is held by friction between the holding part 430 and the substrate 5 and by air resistance against the surface of the substrate 5 caused by moving the substrate 5 in the Y direction while holding it at an angle. By configuring in this way, it is not necessary to provide a mechanism for adsorbing the substrate 5 in the substrate conveying mechanism (conveying part), and the device can be simplified. Also, the inclination length of the inclination provided on the +Y direction side of the first guide 410a and the inclination length of the fourth guide 410d are set so that the conveying direction side (-Y direction side) of the substrate 5 does not receive a lift force in the +Z direction due to vibration when the substrate 5 is conveyed.

[0036] When the substrate transport mechanism further moves in the -Y direction, as shown in FIG. 6(d), the sliding surfaces of the fourth guide 410d and the fifth guide 410e are discontinuous, so that the fourth cam follower 420d moves away from the sliding surface of the fourth guide 410d. At this time, the third cam follower 420c comes into contact with the sliding surface of the fourth guide 410d to support the substrate transport mechanism. Here, when the cam follower in contact with the fourth guide 410d changes from the fourth cam follower 420d to the third cam follower 420c, the angle at which the substrate 5 is held changes. In order to suppress this change in angle, a height difference may be provided between the sliding surface in contact with the fourth cam follower 420d of the fourth guide 410d and the sliding surface in contact with the third cam follower 420c of the fourth guide 410d.

[0037] When the substrate transport mechanism moves further in the -Y direction, the sliding surface of the fifth guide 410e comes into contact with the fourth cam follower 420d as shown in Fig. 6(e). Here, the distance between the third cam follower 420c and the fourth cam follower 420d is set to be equal to or greater than the distance between the end of the fourth guide 410d on the -Y direction side and the end of the fifth guide 410e on the +Y direction side.

[0038] When the substrate transport mechanism further moves in the -Y direction, the compression coil spring 460 is compressed in the -Z direction at the inclined portion provided on the -Y direction side of the first guide 410a, as shown in FIG. 6(f). This compression coil spring 460 causes the Z moving portion 470 to move in the -Z direction along the Z guide 403, and the base 404 moves in the -Z direction accordingly. Here, by making the inclination angle of the inclined portion provided on the -Y direction side of the first guide 410a the same as the inclination angle of the inclined portion provided on the fifth guide 410e, the base 404 becomes horizontal before the substrate 5 comes into contact with the substrate support portion 70, and the substrate 5 is held horizontally. Note that when the substrate transport mechanism moves in the -Y direction while holding the substrate 5 horizontally, the holding force of the holding portion 430 due to the air resistance received by the surface of the substrate 5 decreases, so the acceleration in the -Y direction at this time is set so that the substrate 5 does not shift horizontally. Then, while holding the substrate 5 horizontally, the substrate transport mechanism moves in the -Y and -Z directions along the first guide 410a and the fifth guide 410e, whereby the holding part 430 delivers the substrate 5 to the substrate support part 70.

[0039] When the substrate transport mechanism further moves in the -Y direction, the compression coil spring 460 contracts in the -Z direction at the inclined portion provided on the -Y direction side of the first guide 410a as shown in Fig. 6(g). Then, the fourth cam follower 420d comes into contact with the sixth guide 410f.

[0040] Next, as shown in FIG. 6(h), the transport moving part 402 moves in the +Y direction along the transport guide 401. This causes the entire substrate transport mechanism to move in the +Y direction. During this movement in the +Y direction, the first cam follower 420a and the second cam follower 420b move along the sliding surface of the second guide 410b, and the fourth cam follower 420d moves along the sliding surface of the sixth guide 410f. Note that the distance between the lowest position of the fifth guide 410e and the highest position of the sixth guide 410f is arranged to be larger than the outermost diameter of the fourth cam follower 420d so as not to impede the movement of the fourth cam follower 420d in the +Y direction. Then, before the fourth cam follower 420d leaves the sliding surface of the sixth guide 410f, the third cam follower 420c comes into contact with the sliding surface of the third guide 410c.

[0041] When the substrate transport mechanism further moves in the +Y direction, as shown in FIG. 6(i), the third cam follower 420c moves in the +Z direction on the inclined portion of the third guide 410c. Accordingly, the compression coil spring 460 expands in the +Z direction. Due to the expansion of the compression coil spring 460, the Z moving portion 470 moves in the +Z direction along the Z guide 403, and accordingly, the base 404 moves in the +Z direction. Here, the lower surface of the fourth guide 410d and the fourth cam follower 420d come into contact with each other so as to interfere with each other. However, as described above, the second deflection Z guide 425, the second deflection Z moving portion 426, the second deflection spring 427, and the second mechanical stopper 428 cause the fourth cam follower 420d to move in the -Z direction, suppressing the interference from impeding the movement of the substrate transport mechanism.

[0042] When the substrate transport mechanism further moves in the +Y direction, as shown in Fig. 6(j), the second cam follower 420b comes into contact with the first guide 410a, and the compression coil spring 460 expands in the +Z direction. Also, since the lower surface of the fourth guide 410d and the fourth cam follower 420d are no longer in contact with each other, the fourth cam follower 420d moves in the +Z direction and returns to its original position. Then, the substrate transport mechanism moves in the -Y direction, returning to the initial position shown in Fig. 6(a).

[0043] According to this embodiment, by tilting the portion of the substrate transport mechanism that holds the substrate 5, the substrate transport mechanism can hold the substrate 5 by the air resistance on the surface of the substrate 5 and the frictional force of the holding portion 430 that holds the substrate 5. Therefore, the substrate transport mechanism does not need to provide a mechanism for suction and holding the substrate 5 in the transport portion, and the device can be simplified. In addition, the tilt of the substrate holding surface (holding portion 430) of the substrate transport mechanism and the movement in the Z direction to acquire or place the substrate 5 are appropriately performed by the tilt length and tilt angle of the tilt portion provided in the guide. In other words, the substrate transport mechanism of this embodiment does not need to be provided with a mounting portion for moving in the Z direction. This not only simplifies the device, but also reduces the risk of dust generation.

[0044] <Second embodiment> In addition to the features of the first embodiment, this embodiment is characterized by the provision of a member for preventing the substrate 5 from falling. Fig. 7 is a diagram showing the configuration of a base 500 in this embodiment. The base 500 in this embodiment is provided with fall prevention members 510 at each of the ends in the +Y direction and -Y direction to prevent the substrate 5 from falling.

[0045] According to this embodiment, when the holding force of the holding portion 430 for the substrate 5 becomes insufficient and the substrate 5 falls, the fall prevention member 510 can prevent the substrate 5 from falling.

[0046] <Third embodiment> The present embodiment is characterized in that an article is manufactured using the substrate transport mechanism described in the first and second embodiments.

[0047] 8 is a flowchart of a method for manufacturing an article in this embodiment. A forming step (S510) of forming a pattern on a substrate is performed, followed by a transport step (S520) of transporting the substrate on which the pattern has been formed in the forming step using the substrate transport mechanism described in the first and second embodiments. Then, a manufacturing step (S530) of manufacturing an article from the substrate on which the pattern has been formed in the forming step and which has been transported in the transport step is performed.

[0048] Here, the flowchart in Figure 8 shows an example in which the transport process is performed after the formation process, but after the transport process of transporting the substrate using the substrate transport mechanism described in the first and second embodiments, a formation process of forming a pattern on the substrate transported in the transport process may be performed.

[0049] Products manufactured by this manufacturing method include, for example, semiconductor IC elements, liquid crystal display elements, color filters, MEMS, etc. In the formation process, for example, a substrate (silicon wafer, glass plate, etc.) on which a photosensitive material is applied onto a pattern material is exposed by an exposure device (lithography device) to form a latent image pattern on the photosensitive material of the substrate.

[0050] The manufacturing process includes, for example, pre-processing including development of a substrate (photosensitive material) on which a latent image pattern has been formed, etching of the pattern material of the developed substrate, resist peeling, etc., and post-processing including dicing, bonding, packaging, etc. According to this manufacturing method, it is possible to manufacture an article by a method with higher productivity per unit time than conventional methods.

[0051] The disclosure of the present specification includes the following substrate transport mechanism, lithographic apparatus, method for manufacturing a guide, and method for manufacturing an article.

[0052] (Item 1) A holder for holding the substrate; A moving unit that moves the holding unit; A guide that guides the movement of the moving part, A substrate transport mechanism characterized in that the shape of the guide is configured so that the angle of the holding part changes as the moving part moves along the guide, and the holding part is moved by the moving part while holding the substrate in an inclined state.

[0053] (Item 2) 2. The substrate transport mechanism according to item 1, wherein the guide is arranged so that the substrate is horizontal when the substrate is transferred.

[0054] (Item 3) 3. The substrate transport mechanism according to item 1 or 2, wherein the moving part is inclined so that the height of the substrate transport direction side is lower than the height of the substrate opposite to the transport direction.

[0055] (Item 4) 4. The substrate transport mechanism according to any one of items 1 to 3, wherein a plurality of the guides are arranged, and at least one of the plurality of the guides is provided with an inclined portion.

[0056] (Item 5) The plurality of guides include a plurality of guides each having the inclined portion, 5. The substrate transport mechanism according to item 4, wherein a guide has a plurality of inclined portions, and two or more of the inclined portions have the same angle.

[0057] (Item 6) The plurality of guides include a plurality of guides each having the inclined portion, 6. A substrate transport mechanism as described in item 4 or 5, characterized in that a first inclined portion among the inclined portions of a guide having a plurality of inclined portions and a second inclined portion different from the first inclined portion have different lengths.

[0058] (Item 7) 7. The substrate transport mechanism according to any one of items 1 to 6, wherein the holding portion is made of a material that generates a frictional force between the holding portion and the substrate.

[0059] (Item 8) 8. The substrate transport mechanism according to any one of items 1 to 7, wherein the moving part has a member for preventing the substrate from falling.

[0060] (Item 9) A substrate transport mechanism according to any one of items 1 to 8 for transporting a substrate; A pattern forming unit that forms a pattern on the substrate; 1. A lithography apparatus comprising:

[0061] (Item 10) A method for designing a guide that guides movement of a moving part that moves a holding part that holds a substrate, comprising the steps of: a designing step of designing a length or angle of the inclination of the inclined portion of the guide based on one or more of a transport speed of the substrate, a shape of the substrate, and a thickness of the substrate, so that the angle of the holding portion changes as the moving portion moves along the guide, and the holding portion is moved by the moving portion while holding the substrate in an inclined state; a manufacturing process for manufacturing the guide including the inclined portion designed in the design process; A method for manufacturing a guide, comprising the steps of:

[0062] (Item 11) forming a pattern on a substrate; A transport step of transporting a substrate using the substrate transport mechanism according to any one of items 1 to 8; a manufacturing process for manufacturing an article from the substrate that has been subjected to the forming process and the transporting process; A method for producing an article, comprising the steps of:

[0063] The invention is not limited to the above-described embodiments, and various modifications and variations are possible without departing from the spirit and scope of the invention. Accordingly, the following claims are appended to apprise the public of the scope of the invention.

Claims

1. a holding portion including a surface for holding the substrate; a moving unit that moves the holding unit; a guide that guides the movement of the moving part, A plurality of the guides are arranged, and at least one of the plurality of guides is provided with an inclined portion and a horizontal portion, the holding unit is moved by the moving unit while holding the substrate with the surface tilted; A substrate transport mechanism, characterized in that the inclination of the surface changes depending on the shape of the guide as the moving part moves along the guide.

2. 2. The substrate transport mechanism according to claim 1, wherein the guide is arranged so that the substrate is horizontal when the substrate is transferred.

3. 2. The substrate transport mechanism according to claim 1, wherein the moving part is inclined so that the height of the moving part on the side in the transport direction of the substrate is lower than the height of the side opposite to the transport direction of the substrate.

4. A spring that expands and contracts according to the shape of the guide, 2. The substrate transport mechanism according to claim 1, wherein the spring connects the moving parts together.

5. the plurality of guides include a plurality of guides each having the inclined portion and the horizontal portion; 5. The substrate transport mechanism according to claim 4, wherein the guide has a plurality of inclined portions and horizontal portions, and two or more of the inclined portions have the same angle.

6. the plurality of guides include a plurality of guides each having the inclined portion and the horizontal portion; 2. The substrate transport mechanism according to claim 1, wherein a first inclined portion and a second inclined portion different from the first inclined portion are different in length among the inclined portions of a guide having a plurality of inclined portions and horizontal portions.

7. 2. The substrate transport mechanism according to claim 1, wherein the surface is made of a material that generates a frictional force between the surface and the substrate.

8. 2. The substrate transport mechanism according to claim 1, wherein the moving part has a member for preventing the substrate from falling.

9. a substrate transport mechanism according to any one of claims 1 to 8 for transporting a substrate; a pattern forming unit that forms a pattern on the substrate; 1. A lithography apparatus comprising:

10. A method of manufacturing a guide that guides movement of a moving part that moves a holding part that holds a substrate, comprising: a design step of designing the length or angle of the inclination of the inclined portion of the guide based on one or more of the speed at which the substrate is transported, the shape of the substrate, and the thickness of the substrate, so that the angle of the surface at which the holding portion holds the substrate changes as the moving portion moves along the guide, and the holding portion can be moved by the moving portion while holding the substrate with the surface inclined; a manufacturing process for manufacturing the guide including the inclined portion designed in the design process; and The method for manufacturing a guide is characterized in that a plurality of the guides are arranged, and at least one of the plurality of guides is provided with an inclined portion and a horizontal portion.

11. a forming step of forming a pattern on a substrate; a transport step of transporting a substrate using the substrate transport mechanism according to any one of claims 1 to 8; a manufacturing process for manufacturing an article from the substrate that has been subjected to the forming process and the transporting process; A method for manufacturing an article, comprising:

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