Storage container, processing apparatus, joining device, processing method, and joining method

Abstract

To provide a technique advantageous for processing a surface to be joined and joining the surface to be joined to an object to be joined while preventing a member from contacting the processed surface to be joined.SOLUTION: A storage container containing dies comprises: a body part that has a first through hole and a second through hole; a first lid that can be attached to the body part so as to cover the first through hole; and a second lid that can be attached to the body part so as to cover the second through hole. The dies are input to and output from the body part through the first through hole. The second through hole is configured such that the dies can be processed through the second through hole.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a storage container, a processing device, a joining device, a processing method, and a joining method. [Background technology]

[0002] There is a bonding method in which the bonding surface of a die is treated and then bonded to an object to be bonded. Patent Document 1 discloses a semiconductor chip storage case having a storage section for storing semiconductor chips and a storage lid for covering the storage section. The bottom surface of the storage section is tapered, and one end of a suction hole is connected to the bottom surface of the storage section, and an opening and closing valve is provided at the other end of the suction hole.

[0003] Let us consider the application of the semiconductor storage case described in Patent Document 1 to a bonding method. Normally, when the upper surface of a semiconductor chip stored in a semiconductor storage case is processed and then the upper surface is bonded to an object to be bonded, a mechanism for operating the semiconductor chip will come into contact with the bonded surface after the bonded surface is processed. Also, when the lower surface of a semiconductor chip stored in a semiconductor storage case is bonded to an object to be bonded, the bonded surface cannot be processed while the semiconductor chip is stored in the semiconductor storage case. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Publication No. 6-255691 Summary of the Invention [Problem to be solved by the invention]

[0005] An object of the present invention is to provide an advantageous technique for treating a surface to be bonded and bonding the treated surface to an object to be bonded without bringing a member into contact with the treated surface to be bonded. [Means for solving the problem]

[0006] One aspect of the present invention relates to a storage container for storing a die, the storage container comprising a main body having a first through hole and a second through hole, a first lid attachable to the main body so as to cover the first through hole, and a second lid attachable to the main body so as to cover the second through hole, the die being inserted and removed from the main body through the first through hole, and the second through hole being configured so that the die can be processed through the second through hole. Effect of the Invention

[0007] According to the present invention, there is provided an advantageous technique for treating a surface to be bonded and bonding the surface to a workpiece without contacting a member with the treated surface to be bonded. [Brief description of the drawings]

[0008] [Figure 1] FIG. 2 is a cross-sectional view of the storage container according to the first embodiment. [Diagram 2] FIG. 3 is a cross-sectional view showing a state in which a plurality of dies are held in the storage container of the first embodiment. [Diagram 3] 5A to 5C are diagrams illustrating the operation of the transfer device of the first embodiment for transferring a diced die to a storage container of the first embodiment. [Figure 4] 5A to 5C are diagrams illustrating an operation of treating a die held by the storage container of the first embodiment with the treatment device of the first embodiment. [Diagram 5] 5A to 5C are diagrams illustrating the operation of the bonding apparatus of the first embodiment, in which a die is removed from the storage container of the first embodiment and bonded to an object to be bonded. [Figure 6] 5A to 5C are diagrams illustrating the operation of the bonding apparatus of the first embodiment, in which a die is removed from the storage container of the first embodiment and bonded to an object to be bonded. [Figure 7] FIG. 11 is a cross-sectional view of a storage container according to a second embodiment. [Figure 8] 11A to 11C are diagrams illustrating the operation of a transfer device of the second embodiment for transferring a diced die to a storage container of the second embodiment. [Figure 9] FIG. 11 is a cross-sectional view of a storage container according to a third embodiment. [Figure 10] 13A to 13C are diagrams illustrating the operation of a transfer device of the third embodiment for transferring a diced die to a storage container of the third embodiment. [Figure 11] FIG. 13 is a cross-sectional view of a storage container according to a fourth embodiment. [Figure 12] 13A to 13C are diagrams illustrating the operation of the bonding apparatus of the fourth embodiment, in which a die is removed from a storage container of the fourth embodiment and bonded to an object to be bonded. [Figure 13] 13A to 13C are diagrams illustrating the operation of the bonding apparatus of the fourth embodiment, in which a die is removed from a storage container of the fourth embodiment and bonded to an object to be bonded. [Figure 14] 5A and 5B are diagrams illustrating an example of a first fixing mechanism that engages or fixes the first lid to the main body. [Figure 15] 13A and 13B are diagrams illustrating an example of a second fixing mechanism that engages or fixes the second lid to the main body. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] Hereinafter, the embodiments will be described in detail with reference to the attached drawings. Note that the following embodiments do not limit the invention according to the claims. Although the embodiments describe a number of features, not all of these features are essential to the invention, and the features may be combined in any manner. Furthermore, in the attached drawings, the same reference numbers are used for the same or similar configurations, and duplicated descriptions are omitted.

[0010] The storage container of the present disclosure may be used in a bonding method for bonding a die to one or more locations of a bonded object. The bonded object may be, for example, a wafer on which a semiconductor device is manufactured. The bonded object may be, for example, a silicon wafer, a silicon wafer on which wiring is formed, a glass wafer, a glass panel on which wiring is formed, an organic panel (PCB) on which wiring is formed, or a metal panel. The wafer on which a semiconductor device is manufactured may be a wafer on which a die on which a semiconductor device is manufactured has already been bonded. The die may be, for example, a chip obtained by dicing a semiconductor device. The die may be, for example, a stack of multiple dies, a small piece of material, an optical element, a MEMS, or a structure. The bonding method is not limited to a specific bonding method. For example, the bonding may be bonding by adhesive, temporary bonding by temporary adhesive, bonding by hybrid bonding, atomic diffusion bonding, vacuum bonding, bump bonding, etc., and various temporary bonding and permanent bonding methods can be used.

[0011] Industrial application examples will be described. As a first application example, the manufacture of stacked memories can be mentioned. When applied to the manufacture of stacked memories, the bonded object can be a wafer on which a memory, which is a semiconductor device, is formed, and the die can be a memory die. For example, when forming an eight-layer stacked structure by repeated bonding, in the bonding of the eighth layer, the bonded object can be a substrate on which six layers of memory dies have already been bonded on the wafer. The final layer can be, for example, a driver die that drives the memory.

[0012] The second application example is heterogeneous integration of processors. Conventional processors are mainly SoCs in which logic circuits and SRAM are configured in one semiconductor element, but in this case, each element is created as a separate wafer by applying the optimal process, and then the wafers are bonded to manufacture the processor. This can reduce the cost of the processor and improve the yield. When applied to heterogeneous integration, the bonded object is a wafer on which a logic device, which is a semiconductor device, is manufactured, and the die can be an SRAM, an antenna, a driver, or other die that is singulated after probing. Since different dies are usually bonded sequentially, the number of bonded objects increases sequentially. For example, when bonding from an SRAM, when bonding the next element of the SRAM, the object to be bonded is the one to which the SRAM is bonded to the logic wafer. When bonding multiple dies, it is desirable to bond the thinnest die first so that the bonding head does not interfere with the bonded die.

[0013] A third application example is 2.5D bonding using a silicon interposer. A silicon interposer is a silicon wafer on which wiring is formed. In 2.5D bonding, this silicon interposer is used to bond individual dies to electrically bond the dies. When applied to die bonding to a silicon interposer, the present disclosure is applied to a silicon wafer on which wiring is formed as a bonded object. Normally, multiple types of dies are bonded to a silicon interposer, so the bonded object also includes a silicon interposer to which several dies have already been bonded. When bonding multiple dies, it is desirable to bond them in the order of thin dies so that the bonding head does not interfere with the bonded dies.

[0014] A fourth application example is 2.1D bonding using an organic interposer or a glass interposer. An organic interposer is an organic panel (PCB substrate, CCL substrate) used as a package substrate on which wiring is formed, and a glass interposer is a glass panel on which wiring is formed. In 2.1D bonding, individualized dies are bonded to an organic interposer or a glass interposer, and the dies are electrically bonded to each other by the wiring on the interposer. When applying to die bonding to an organic interposer, the bonded object is an organic panel on which wiring is formed, and when applying to die bonding to a glass interposer, the bonded object is a glass panel on which wiring is formed. Usually, multiple types of dies are bonded to an organic interposer or a glass interposer, so the bonded object may include an organic interposer or a glass interposer to which several dies have already been bonded. When bonding multiple dies, it is desirable to bond the thinnest dies first so that the bonding head does not interfere with the bonded dies.

[0015] A fifth application example is temporary bonding in a fan-out package manufacturing process. A fan-out wafer level package in which an individualized die is reconstructed into a wafer shape using a molding resin and packaged, or a fan-out panel level package in which an individualized die is reconstructed into a panel shape and packaged, can be applied to semiconductor manufacturing as an advanced package. When packaging, rewiring from the die to the bumps, or rewiring for bonding different types of dies, is formed on a molded reconfigured substrate. If the alignment accuracy of the die is poor, when the rewiring pattern is transferred using a step-and-repeat exposure device, the rewiring pattern cannot be aligned to the die with high accuracy. Therefore, it is required to arrange the dies with high alignment accuracy. When applied to a fan-out package manufacturing process, the object to be bonded can be a metal panel. In accordance with the present disclosure, the individualized die may be temporarily bonded to the metal panel by a temporary bonding agent. Thereafter, the die is molded into a wafer or panel shape by a molding device, and after molding, the reconfigured wafer or reconfigured panel can be manufactured by peeling it off from the metal panel. When the present disclosure is applied to this bonding, the bonding position can be adjusted during bonding to correct for the alignment deformation caused by the molding process.

[0016] A sixth application example is heterogeneous substrate bonding. For example, InGaAs is known as a highly sensitive material in infrared image sensors. It has been proposed to manufacture a highly sensitive and high-speed infrared image sensor by using InGaAs for the sensor part that receives light and silicon capable of high-speed processing for the logic circuit that extracts data. However, InGaAs crystals are mass-produced only in small diameters such as 4 inches, which is smaller than the 300 mm that is the mainstream for silicon wafers. A method has been proposed in which an individualized InGaAs die is bonded onto a 300 mm silicon wafer on which a logic circuit is formed. In this way, the present disclosure can also be applied to heterogeneous substrate bonding in which substrates made of different materials and different sizes are bonded. When applied to heterogeneous substrate bonding, the present disclosure can be applied to the bonded object as a large-diameter substrate such as a silicon wafer, and the individualized die as a small piece of material such as InGaAs. The small piece of material is a sliced ​​crystal, but it is preferable to cut it into a square shape.

[0017] In the following description, directions are indicated by the XYZ coordinate system. The directions parallel to the X-axis, Y-axis, and Z-axis are the X-direction, Y-direction, and Z-direction, respectively. The X-direction, Y-direction, and Z-direction are mutually perpendicular or mutually intersecting directions.

[0018] FIG. 1 is a cross-sectional view of the storage container C of the first embodiment. FIG. 2 is a cross-sectional view showing a state in which a plurality of dies 4 are held in the storage container C of the first embodiment. The storage container C is a container that stores the die 4. The storage container C is also a container that allows processing of the bonded surfaces of one or more dies 4 while holding the die 4. The storage container C may include a main body 10. The main body 10 may include a first through hole PH1 for inserting and removing the die 4 from the positive direction of the Z axis. The main body 10 may also include one or more second through holes PH2 for processing or pre-processing the bonded surfaces of one or more dies 4 from the negative direction of the Z axis while the die 4 is held by the storage container C. The main body 10 may also include a holding portion 12 that holds one or more dies 4. The one or more second through holes PH2 may be provided in the holding portion 12. The die 4 may be inserted and removed from the main body 10 through the first through hole PH1.

[0019] The storage container C may include a first lid 20 that can be attached to the main body 10 so as to cover the first through hole PH1. The first through hole PH1 can be opened by opening the first lid 20 or by removing the first lid 20 from the main body 10. With the first through hole PH1 open, one or more dies 4 can be placed in the holding part 12 of the main body 10 through the first through hole PH1. The storage container C further includes a pressing part 22 that presses one or more dies against the holding part 12 or the main body 10 when the first lid 20 is attached to the main body 10. The first lid 20 can be locked or fixed to the main body 10 by a locking part such as a claw (not shown). With the first lid 20 attached to the main body 10, the die 4 can be sandwiched between the pressing part 22 and the holding part 12. The pressing part 22 can be made of an expandable member or an elastically deformable member.

[0020] The storage container C may include a second lid 30 attachable to the body portion 10 to cover the one or more second through-holes PH2. The one or more second through-holes PH2 can be opened by opening the second lid 30 or removing it from the body portion 10. The second through-holes PH2 may be configured to allow the one or more dies 4 held by the holding portion 12 to be processed through the one or more second through-holes PH2.

[0021] The holding part 12 may include one or more regulating parts 14 that regulate the position of each of the one or more dies 4. The holding part 12 has a first surface 16 that faces the first lid 20 when the first lid 20 is attached to the main body part 10, and each of the one or more regulating parts 14 may be a tapered part inclined with respect to the first surface 16. Alternatively, each of the multiple regulating parts may be one or more protrusions protruding from the first surface 16. Each of the regulating parts 14 may be a protrusion arranged to surround the entire circumference of the die 4, or may be a plurality of protrusions spaced apart from each other arranged to surround the die 4. It is preferable that the components that constitute the storage container C, such as the main body part 10, the first lid 20 and the second lid 30, the pressing part 22, and the regulating part 14, are configured so as not to generate foreign matter and impurities.

[0022] The storage container C may have readable identification information. The identification information may include at least one of information for identifying the storage container C itself and information for identifying the die 4 stored in the storage container C. The identification information may be rewritable information, and the storage container C may include a non-volatile memory that holds the identification information.

[0023] FIG. 14 shows a schematic example of a first fixing mechanism L1 that locks or fixes the first lid 20 to the main body 10. The first fixing mechanism L1 may be understood as a first lock mechanism. The first fixing mechanism L1 may include a gear 201 and a rack 202. The gear 201 and the rack 202 form a rack-and-pinion mechanism. In the example of FIG. 14, when the drive end of the opening / closing mechanism (not shown) is coupled to the coupling portion 203 of the gear 201 to rotate the gear 201, the rack 202 slides in the Y direction. When the rack 202 is inserted into the engagement portion 17 of the main body 10 by sliding the rack 202, the first lid 20 may be locked or fixed to the main body 10. This may be a state in which the first lid 20 is locked. Conversely, when the rack 202 is pulled out from the engagement portion 17 of the main body 10 by sliding the rack 202, the lock or fixation of the first lid 20 to the main body 10 may be released. The above-described first fixing mechanism L1 may be provided at multiple locations.

[0024] FIG. 15 illustrates a second fixing mechanism L2 that engages or fixes the second lid 30 to the main body 10. The second fixing mechanism L2 may be understood as a second lock mechanism. In the example of FIG. 15, when the slide member 31 is inserted into the engagement portion 18 of the main body 10 by a drive mechanism (not shown), the second lid 30 may be engaged or fixed to the main body 10. This may be a state in which the second lid 30 is locked. Conversely, when the slide member 31 is pulled out from the engagement portion 18 of the main body 10, the engagement or fixation of the second lid 30 to the main body 10 may be released. The second fixing mechanism L2 as described above may be provided at multiple locations.

[0025] FIG. 3 shows a schematic operation of a transfer device 50 that transfers a diced die 4 to a storage container C. The transfer device 50 can be configured to transfer one or more dies 4 to an empty storage container C. The dies 4 can be diced from a semiconductor wafer by a dicing device (not shown), attached to a dicing frame 40, and arranged on a dicing tape 41. A space is formed between the multiple dies 4 by stretching the dicing tape 41 by an expander (not shown). The die 4 to be picked up can be peeled off from the dicing tape 41 by a release head 51 and picked up by a pickup head 52. In FIG. 3, the white side of the die 4 indicates the device side, and the black side of the die 4 indicates the silicon side. In this example, the surface of the white side is the surface to be bonded to the bonded object. The die 4 picked up by the pickup head 52 can be turned upside down and handed over to the transfer head 53. The die 4 can be handed over to the transfer head 53 so that the black side (silicon side) is held by the transfer head 53.

[0026] The storage container C to which the die 4 is transferred is loaded in an empty state onto the transfer device 50, and the first lid 20 can be unlocked by the operation mechanism 54 to open the first through-hole PH1 of the main body 10. In the case where the storage container C has the first fixing mechanism L1 described in FIG. 14, the first lid 20 can be unlocked by the drive end of the opening / closing mechanism (not shown) being coupled to the coupling portion 203 of the gear 201 and rotating the gear 201. The method of operating the first lid 20 to open the first through-hole PH1 is arbitrary, and for example, the first lid 20 may be slid, the first lid 20 may be separated from the main body 10, the first lid 20 may be rotated, or another method may be used.

[0027] Thereafter, the die 4 is placed or transferred into the first through hole PH1 of the main body 10 of the storage container C by the transfer head 53 through the first through hole PH1 of the main body 10. Thereafter, the first lid 20 is operated by the operation mechanism 54 to close the first through hole PH1 of the main body 10, and the first lid 20 is locked. In the case where the storage container C has the first fixing mechanism L1 described in FIG. 14, the first lid 20 can be locked by coupling a driving end of an opening / closing mechanism (not shown) to the coupling portion 203 of the gear 201 and rotating the gear 201. Thereafter, the storage container C is carried out from the transfer device 50.

[0028] If the die 4 on the dicing frame 40 is lost during a series of transfer processes, the dicing frame 40 can be replaced. The die 4 is inspected in advance, and only KGD (Known Good Die) can be transferred to the storage container C. After the die 4 is transferred to or stored in the storage container C, it is inspected whether the transfer or storage has been performed correctly, and the result can be notified to the management device. When the die 4 is picked up from the dicing frame 40, cutting powder may be attached to the die 4, so the die 4 may be washed before being transferred to the storage container C.

[0029] FIG. 4 shows a schematic operation of processing the die 4 held by the storage container C by the processing device 60. After the storage container C is transported to the processing device 60, the second lid 30 can be unlocked by the operating mechanism 62 to open the second through hole PH2 of the main body 10. In the case where the storage container C has the second fixing mechanism L2 described in FIG. 15, the second lid 30 can be unlocked by sliding the slide member 31 of the opening / closing mechanism (not shown). The method of operating the second lid 30 to open the second through hole PH2 is arbitrary, and for example, the second lid 30 may be slid, the second lid 30 may be separated from the main body 10, the second lid 30 may be rotated, or another method may be used.

[0030] The processing device 60 includes a processing unit 61. The processing unit 61 processes the die 4 held by the storage container C through the second through hole PH2. The processing of the die 4 by the processing unit 61 may include, for example, at least one of a process of activating the surface (surface to be bonded) of the die 4, a process of cleaning the surface of the die 4, and a process of hydrophilizing the surface of the die 4. The process of activating the surface of the die 4 may include, for example, a process of irradiating the surface of the die 4 with plasma. The process of cleaning the surface of the die 4 may include, for example, a process of cleaning the surface of the die 4 using a surfactant, two fluids, pure water, or the like. The process of hydrophilizing the surface of the die 4 may include, for example, a process of providing hydroxyl groups to the surface of the die 4.

[0031] After the processing of the die 4 is completed, the second lid 30 can be operated by the operating mechanism 62 to close the second through-hole PH2 of the main body 10, thereby locking the second lid 30. In the case where the storage container C has the second fixing mechanism L2 described in Fig. 15, the second lid 30 can be locked by sliding the slide member 31 of the opening / closing mechanism (not shown).

[0032] The die 4 contained in the storage container C may be processed by a plurality of processing devices. While the second lid 30 is open, the space in which the plurality of processing devices are arranged is preferably maintained in a highly clean state, for example, at a cleanliness level of Class 1, so as to prevent foreign matter from adhering to the surface (bonding surface) of the die 4.

[0033] The processing method for processing the die by the processing device 60 may include an opening step of opening the second lid 30 of the storage container C, a processing step of processing the die 4 held by the storage container C through the second through-hole PH2, and a closing step of closing the second lid 30. The processing step may include at least one of a process of activating the surface of the die 4, a process of cleaning the surface, and a process of making the surface hydrophilic.

[0034] 5 shows a schematic operation of a bonding device 70 that removes a die 4 from a storage container C and bonds it to a wafer 73 that is an object to be bonded. The bonding device 70 may include an opening / closing mechanism 79 that opens and closes a first lid 20 of the storage container C. The bonding device 70 may also include a bonding head 74 (operation mechanism) that removes the die 4 held by the holder 12 of the main body 10 of the storage container C from the storage container C through the first through-hole PH1 and bonds it to the wafer 73 that is an object to be bonded.

[0035] The bonding apparatus 70 may include a stage 71 and a stage driving mechanism that drives the stage 71. The stage driving mechanism may drive the stage 71, for example, about a total of six axes, including an X-axis, a Y-axis, and a Z-axis, and rotations around these axes. The bonding apparatus 70 may include a measuring instrument 72 that measures the position and rotation of the stage 71. The bonding apparatus 70 may be configured to feedback-control the position and rotation of the stage 71 based on an output of the measuring instrument 72.

[0036] The stage 71 may be configured to hold the storage container C and the wafer 73. After the storage container C is carried into the bonding device 70, the first lid 20 may be removed from the main body 10 by the opening / closing mechanism 79 and placed on the stage 71. Alternatively, after the storage container C is carried into the bonding device 70 and placed on the stage 71, the first lid 20 may be removed from the main body 10 by the opening / closing mechanism 79. In the case where the storage container C has the first fixing mechanism L1 described in FIG. 14, the first lid 20 may be unlocked by coupling the driving end of the opening / closing mechanism 79 to the coupling portion 203 of the gear 201 and rotating the gear 201. The first lid 20 removed from the main body 10 may be held by the opening / closing mechanism 79.

[0037] The die 4 held by the main body 10 of the storage container C, or the die 4 held by the bonding head 74, can be taken out of the storage container C through the first through hole PH1. At this time, the bonding head 74 may be moved up and down, or the stage 71, which can be positioned with high precision, may be moved up and down. The wafer 73 as the object to be bonded that is carried into the stage 71 is observed by the wafer observation camera 75 while the stage 71 is moved, and the position of the portion to be bonded is accurately obtained. The die 4 held by the bonding head 74 is moved by driving the stage 71 so that the bonding head 74 is positioned directly above the chip observation camera 76, and the position of the die 4 on the bonding head 74 is accurately obtained.

[0038] Based on the position of the bonding location of the wafer 73 and the position of the die 4 held by the bonding head 74, as shown in Fig. 6, the die 4 is accurately bonded to the bonding location of the wafer 73. The bonding operation may be performed for a plurality of bonding locations on the wafer 73. At this time, if the die 4 in the storage container C runs out, the storage container C may be replaced. In addition, in the case of heterogeneous bonding in which a plurality of types of die 4 are bonded to one wafer 73, different types of die 4 may be bonded to the wafer 73 using a storage container C that contains different types of processed die 4.

[0039] The bonding device 70 is provided with the inspection results of the semiconductor elements formed on the wafer 73 through a network, and a die determined to be good can be bonded to a semiconductor element determined to be good. In the subsequent process, when it is necessary to bond a die to all the semiconductor elements, a die determined to be bad can be bonded to a semiconductor element determined to be bad. In this example, one storage container C is placed on the stage 71, but a plurality of storage containers C may be placed on the stage 71. In addition, a stage for holding the storage container C may be provided separately from the stage for holding the wafer 73. Since adhesion of foreign matter to the bonding surface of the die causes bonding failure, the area in the bonding device 70 where the die is taken out of the storage container C and handled can be maintained in a highly clean state, for example, a cleanness of Class 1. The wafer 73 with the die bonded to all the bonding locations is taken out of the bonding device 70, and post-processing such as annealing, dicing, testing, and resin encapsulation can be performed.

[0040] The bonding apparatus 70 may be configured to align the wafer 73 and the die 4 by observing them through a transmission while they are placed one on top of the other. A position observation mark may be provided on the surface to be bonded of the die 4, and the position of the die 4 may be measured by observing the mark. A camera for observing both the die 4 and the wafer 73 may be inserted into the gap between them immediately before bonding, and the alignment may be performed using the camera.

[0041] The bonding method for bonding the die 4 to the object to be bonded by the bonding device 70 may include an opening step of opening the first lid of the storage container C, and a removal step of removing the die 4 held by the storage container C from the storage container C through the first through hole PH1. The bonding method may also include a bonding step of bonding the die 4 removed from the storage container C to the object to be bonded.

[0042] Alternatively, the bonding method of one embodiment may include an opening step of opening the second lid 20 of the storage container C, a processing step of treating the die 4 held by the storage container C through the second through hole PH2, and a closing step of closing the second lid 20. The processing step may include at least one of a process of activating the surface of the die 4, a process of cleaning the surface, and a process of making the surface hydrophilic. The bonding method may also include a transfer step of transferring the storage container C to a bonding device. The bonding method may also include an opening step of opening the first lid 20 of the storage container C, a removal step of removing the die 4 held by the storage container C from the storage container C through the first through hole PH1, and a bonding step of bonding the die 4 removed from the storage container C to a bonded object.

[0043] The second embodiment will be described below. Matters not mentioned as the second embodiment may follow the first embodiment. FIG. 7 is a cross-sectional view of a storage container C of the second embodiment. In the second embodiment, one or more dies 4 are fixed or temporarily adhered to the first lid 20 by a temporary adhesive layer 23. Therefore, the first lid 20 functions as a holding part that holds one or more dies 4. The temporary adhesive layer 23 may be composed of a temporary adhesive applied in the transfer device 50, or may be a temporary adhesive layer that can be used repeatedly. In addition, when using an ultraviolet-peeling type temporary adhesive, it is desirable that the first lid 20 has a window (e.g., glass) that transmits ultraviolet light.

[0044] FIG. 8 shows a schematic operation of a second embodiment of a transfer device 50 that transfers a diced die 4 to a storage container C. The transfer device 50 can be configured to transfer one or more dies 4 to an empty storage container C. The dies 4 can be diced from a semiconductor wafer by a dicing device, attached to a dicing frame 40, and arranged on a dicing tape 41. A space is formed between the multiple dies 4 by stretching the dicing tape 41 by an expander (not shown). The die 4 to be picked up can be peeled off from the dicing tape 41 by a release head 51 and picked up by a pick-up head 52. In FIG. 8, the white side of the die 4 indicates the device side, and the black side of the die 4 indicates the silicon side. In this example, the surface of the white side is the surface to be bonded to the bonded object.

[0045] The storage container C to which the die 4 is transferred may be loaded in an empty state onto the transfer device 50 and then inverted upside down in the transfer device 50. Alternatively, the storage container C may be loaded into the transfer device 50 in an inverted state. The first lid 20 of the storage container C is unlocked by the operation mechanism 55, and the first through-hole PH1 of the main body 10 is opened.

[0046] In the transfer device 50, a temporary adhesive may be applied to the first lid 20 by an application mechanism (not shown) to form a temporary adhesive layer 23. Thereafter, the die 4 picked up by the pick-up head 52 is placed on the temporary adhesive layer 23 and temporarily adhered to the first lid 20 by the temporary adhesive layer 23. Temporarily adhered to the first lid 20. Thereafter, after all the dies 4 have been temporarily adhered to the first lid 20 by the temporary adhesive layer 23, the first lid 20 is operated by the operation mechanism 55 to close the first through-hole PH1 of the main body 10, and the first lid 20 is locked.

[0047] The processing device 60 is capable of processing the die 4 held by the container C according to the first embodiment.

[0048] In addition to the configuration of the first embodiment, the bonding device 70 may include a peeling unit that peels off the die 4 temporarily bonded to the first lid 20 by the temporary adhesive layer 23. For example, when the temporary adhesive layer 23 is composed of an ultraviolet-peeling type temporary adhesive, the peeling unit may be configured to irradiate the temporary adhesive layer 23 with ultraviolet light. For example, when the temporary adhesive layer 23 is composed of a thermal-peeling type temporary adhesive, the peeling unit may be configured to apply heat to the temporary adhesive layer 23. For example, when the temporary adhesive layer 23 is composed of a temporary adhesive that peels off when impacted, the peeling unit may be configured to apply an impact to the temporary adhesive layer 23.

[0049] The third embodiment will be described below. Matters not mentioned as the third embodiment may follow the first embodiment. FIG. 9 is a cross-sectional view of a storage container C of the third embodiment. In the third embodiment, a plurality of dies are fixed to the first lid 20 by vacuum suction. Thus, the first lid 20 functions as a holding part for holding one or a plurality of dies 4. The first lid 20 is provided with a vacuum suction part 25 for vacuum suctioning the die 4. The first lid 20 may be provided with a plurality of vacuum suction parts 25 for individually controlling the vacuum suction of the plurality of dies 4. The vacuum suction part 25 may be provided with an electromagnetic valve. The first lid 20 may be provided with a suction pad 26 for holding one or a plurality of dies 4 by vacuum suction.

[0050] FIG. 10 shows a schematic operation of a third embodiment of a transfer device 50 that transfers a diced die 4 to a storage container C. The transfer device 50 can be configured to transfer one or more dies 4 to an empty storage container C. The dies 4 can be diced from a semiconductor wafer by a dicing device, attached to a dicing frame 40, and arranged on a dicing tape 41. A space is formed between the multiple dies 4 by stretching the dicing tape 41 by an expander (not shown). The die 4 to be picked up can be peeled off from the dicing tape 41 by a release head 51 and picked up by a pick-up head 52. In FIG. 10, the white side of the die 4 indicates the device side, and the black side of the die 4 indicates the silicon side. In this example, the surface of the white side is the surface to be bonded to the bonded object.

[0051] The storage container C to which the die 4 is transferred may be loaded in an empty state onto the transfer device 50 and then inverted upside down in the transfer device 50. Alternatively, the storage container C may be loaded into the transfer device 50 in an inverted state. The first lid 20 of the storage container C is unlocked by the operation mechanism 55, and the first through-hole PH1 of the main body 10 is opened.

[0052] The first lid 20 may be held or placed with the vacuum suction surface or suction pad 26 facing upward by the operation mechanism 55. Then, the die 4 picked up by the pick-up head 52 may be placed on the vacuum suction surface or suction pad 26 of the first lid, vacuum-suctioned to the first lid 20 by the vacuum suction unit 25, and held by the first lid 20. Then, after all the dies 4 are held by the first lid 20 by vacuum suction, the first lid 20 is operated by the operation mechanism 55 to close the first through hole PH1 of the main body 10, and the first lid 20 is locked. The die 4 may be held by being sandwiched between the suction pad 26 and the main body 10.

[0053] The processing device 60 can process the die 4 held by the container C according to the first embodiment. The bonding device 70 can include a control unit that controls the vacuum suction unit 25, in addition to the configuration of the first embodiment.

[0054] Fig. 11 is a cross-sectional view of a storage container C of the fourth embodiment. Matters not mentioned in the fourth embodiment may follow the first to third embodiments. In the fourth embodiment, the storage container C is configured to be capable of storing only one die 4. Fig. 11 shows an example in which the die 4 is fixed or temporarily adhered to the first lid 20 by the temporary adhesive layer 23, but the method of fixing the die 4 may follow the first or third embodiment.

[0055] 12 and 13 are schematic diagrams showing the operation of the bonding apparatus 70 of the fourth embodiment, which takes out the die 4 from the storage container C and bonds it to a wafer, which is an object to be bonded. The configuration and operation of the bonding apparatus 70 of the fourth embodiment are similar to those of the bonding apparatus 70 of the first embodiment, except that the storage container C stores one die 4.

[0056] The present disclosure may include the following. (Item 1) A container for housing a die, a main body having a first through hole and a second through hole; a first lid attachable to the body portion so as to cover the first through hole; a second lid attachable to the main body so as to cover the second through hole, The die is inserted into and removed from the body through the first through hole, and the second through hole is configured to allow the die to be processed through the second through hole. A storage container characterized by: (Item 2) The main body portion is provided with a plurality of second through holes including the second through hole, The plurality of second through holes are configured such that a plurality of dies are processed through the plurality of second through holes. 2. The storage container according to item 1, (Item 3) The body portion includes a holder portion for holding the plurality of dies. 3. The storage container according to item 2, (Item 4) The holding portion is provided with a plurality of regulating portions that regulate the positions of the plurality of dies, 4. The storage container according to item 3, (Item 5) the holding portion has a first surface facing the first lid when the first lid is attached to the main body portion; Each of the plurality of restriction portions is a tapered portion inclined with respect to the first surface. 5. The storage container according to item 4, (Item 6) the holding portion has a first surface facing the first lid when the first lid is attached to the main body portion; Each of the plurality of restriction portions is one or a plurality of protrusions protruding from the first surface. 5. The storage container according to item 4, (Item 7) a pressing portion that presses the plurality of dies against the holding portion in a state in which the first lid is attached to the main body portion, 7. The storage container according to any one of items 3 to 6, (Item 8) The plurality of dies are secured to the first lid by a temporary adhesive layer. 3. The storage container according to item 2, (Item 9) The plurality of dies are secured to the first lid by vacuum suction. 3. The storage container according to item 2, (Item 10) Further comprising a first locking mechanism that locks the first lid in a state where the first lid is attached to the main body. 10. The storage container according to any one of items 1 to 9. (Item 11) Further comprising a second locking mechanism that locks the second lid in a state where the second lid is attached to the main body. 11. The storage container according to any one of items 1 to 10. (Item 12) An opening / closing mechanism for opening and closing the second lid of the storage container according to any one of items 1 to 11; a processing section that processes the die held by the body section of the storage container through the second through hole; A processing device comprising: (Item 13) The treatment of the die by the treatment unit includes at least one of a treatment for activating a surface of the die, a treatment for cleaning the surface, and a treatment for hydrophilizing the surface. 13. The processing device according to item 12, (Item 14) An opening / closing mechanism for opening and closing the first lid of the storage container according to any one of items 1 to 11; an operation mechanism for removing the die held by the main body of the storage container from the storage container through the first through hole and bonding the die to an object to be bonded; A joining device comprising: (Item 15) An opening step of opening the second lid of the storage container according to any one of items 1 to 11; a processing step of processing the die held by the container through the second through hole; a closing step of closing the second lid; A processing method comprising the steps of: (Item 16) The treatment step includes at least one of a treatment for activating a surface of the die, a treatment for cleaning the surface, and a treatment for hydrophilizing the surface. 16. The method according to item 15, (Item 17) An opening step of opening the first lid of the storage container according to any one of items 1 to 11; a removal step of removing the die held by the container from the container through the first through hole; a bonding step of bonding the die taken out of the container to an object to be bonded; A bonding method comprising the steps of: (Item 18) An opening step of opening the second lid of the storage container according to any one of items 1 to 11; a processing step of processing the die held by the container through the second through hole; a closing step of closing the second lid; a transfer step of transferring the storage container to a joining device; an opening step of opening the first lid of the storage container; a removal step of removing the die held by the container from the container through the first through hole; a bonding step of bonding the die taken out of the container to an object to be bonded; A bonding method comprising the steps of: (Item 19) The treatment step includes at least one of a treatment for activating a surface of the die, a treatment for cleaning the surface, and a treatment for hydrophilizing the surface. 20. The bonding method according to item 18, characterized in that

[0057] The invention is not limited to the above-described embodiments, and various modifications and variations are possible without departing from the spirit and scope of the invention. Accordingly, the following claims are appended to apprise the public of the scope of the invention. [Explanation of symbols]

[0058] C: container, 4: die, 10: main body, 12: holder, 20: first lid, 30: second lid, PH1: first through hole, PH2: second through hole

Claims

1. A container for housing a die, a main body portion provided with a first through hole and a second through hole; The die is The device is inserted into and removed from the main body through the first through hole, Processing is performed through the second through hole. A storage container characterized by:

2. A first lid that can be attached to the main body portion so as to cover the first through hole; a second lid attachable to the main body portion so as to cover the second through hole, 2. The storage container according to claim 1.

3. The main body portion is provided with a plurality of second through holes including the second through hole, a plurality of dies are processed through the plurality of second through holes; 3. The storage container according to claim 2.

4. the main body portion includes a holding portion that holds the plurality of dies; 4. The container according to claim 3.

5. The holding portion is provided with a plurality of restricting portions that restrict the positions of the plurality of dies, respectively.

5. The storage container according to claim 4.

6. the holding portion has a first surface facing the first lid when the first lid is attached to the main body portion; Each of the plurality of restriction portions is a tapered portion inclined with respect to the first surface.

6. The storage container according to claim 5.

7. the holding portion has a first surface facing the first lid when the first lid is attached to the main body portion; Each of the plurality of restriction portions is one or a plurality of protrusions protruding from the first surface.

6. The storage container according to claim 5.

8. a pressing portion that presses the plurality of dies against the holding portion in a state where the first lid is attached to the main body portion, 5. The storage container according to claim 4.

9. the plurality of dies are fixed to the first lid by a temporary adhesive layer; 4. The container according to claim 3.

10. the plurality of dies are secured to the first lid by vacuum suction; 4. The container according to claim 3.

11. further comprising a first locking mechanism that locks the first lid in a state where the first lid is attached to the main body portion; 3. The storage container according to claim 2.

12. further comprising a second locking mechanism that locks the second lid in a state in which the second lid is attached to the main body portion; 3. The storage container according to claim 2.

13. an opening / closing mechanism for opening and closing the second lid of the storage container according to any one of claims 2 to 12; a processing section that processes the die held by the main body of the container through the second through-hole; A processing device comprising:

14. The treatment of the die by the treatment unit includes at least one of a treatment for activating a surface of the die, a treatment for cleaning the surface, and a treatment for making the surface hydrophilic.

14. The processing device according to claim 13.

15. an opening / closing mechanism for opening and closing the first lid of the storage container according to any one of claims 2 to 12; an operation mechanism for removing the die held by the main body of the storage container from the storage container through the first through hole and bonding the die to an object to be bonded; A joining device comprising:

16. an opening step of opening the second lid of the storage container according to any one of claims 2 to 12; a processing step of processing the die held by the container through the second through-hole; a closing step of closing the second lid; A processing method comprising:

17. the treatment step includes at least one of a treatment for activating the surface of the die, a treatment for cleaning the surface, and a treatment for making the surface hydrophilic; 17. The method of claim 16.

18. an opening step of opening the first lid of the storage container according to any one of claims 2 to 12; a removal step of removing the die held by the storage container from the storage container through the first through hole; a bonding step of bonding the die taken out of the container to an object to be bonded; A bonding method comprising:

19. an opening step of opening the second lid of the storage container according to any one of claims 2 to 12; a processing step of processing the die held by the container through the second through-hole; a closing step of closing the second lid; a transfer step of transferring the storage container to a joining device; an opening step of opening the first lid of the storage container; a removal step of removing the die held by the storage container from the storage container through the first through hole; a bonding step of bonding the die taken out of the container to an object to be bonded; A bonding method comprising:

20. the treatment step includes at least one of a treatment for activating the surface of the die, a treatment for cleaning the surface, and a treatment for making the surface hydrophilic; 20. The bonding method according to claim 19.

Images