Connector insulator

Abstract

To provide a connector insulator which has a low relative dielectric constant and dielectric loss tangent, and enables reflow soldering.SOLUTION: A connector insulator contains a resin composition containing a 3-methyl-1-butene-based polymer.SELECTED DRAWING: None

Description

[Technical Field]

[0001] The present invention relates to a connector insulator. [Background technology]

[0002] Communication speeds and capacities are increasing year by year in mobile communication devices such as mobile phones, their base station equipment, servers, routers and other network infrastructure equipment, large computers, etc. This has led to the need to support higher frequencies, and there is a demand for insulators with excellent dielectric properties in high frequency bands that enable reduction of transmission loss. Materials used for insulators that enable such reduction in transmission loss are preferably those with small relative permittivity and dielectric dissipation factor, especially small dielectric dissipation factor. Conventionally, resins with small relative permittivity and dielectric dissipation factor have been used, such as polytetrafluoroethylene and tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer resin. However, polytetrafluoroethylene cannot be injection molded, making mass production difficult. In addition, although tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer resins can be injection molded, they generate decomposition products when melted, which corrodes metals, resulting in significant limitations on the materials, designs, etc. of extruders and molds. To solve these problems, Patent Document 1 proposes a high-frequency connector that can be manufactured by injection molding and is used to transmit high frequencies of 1.4 GHz or higher, in which the insulator of the connector is made of a thermoplastic norbornene-based resin and the voltage standing wave ratio value is 1.20 or less in the range of 2 to 3 GHz. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 8-213113 Summary of the Invention [Problem to be solved by the invention]

[0004] In recent years, reflow soldering has become widely used in surface mounting processes due to the increasing integration of devices. Because solder has a relatively high melting temperature, the temperature of the object being reflow soldered must be set high, at 260°C or higher. However, thermoplastic norbornene resins are amorphous and have a glass transition point (Tg) of 140°C or lower, meaning they have low heat resistance and melt at the reflow soldering temperature. This means that connectors containing thermoplastic norbornene resins cannot be reflow soldered.

[0005] In view of the current situation, an object of the present invention is to provide a connector insulator that has a low relative dielectric constant and dielectric loss tangent and that can be reflow soldered. [Means for solving the problem]

[0006] As a result of intensive research to solve the above problems, the present inventors have conceived the following invention and found that the problems can be solved. That is, the present invention is as follows.

[0007] [1] A connector insulator containing a resin composition containing a 3-methyl-1-butene polymer. [2] The connector insulator according to the above [1], wherein the 3-methyl-1-butene polymer is at least one selected from the group consisting of a 3-methyl-1-butene homopolymer and a copolymer of 3-methyl-1-butene with ethylene or an α-olefin, and the α-olefin is an α-olefin having 3 to 20 carbon atoms. [3] The connector insulator according to the above [2], wherein the content of the structural units derived from ethylene or an α-olefin in the copolymer is more than 0 mol % and 10 mol % or less. [4] The connector insulator according to any one of the above [1] to [3], which has a dielectric loss tangent of 0.001 or less in the range of 10 kHz to 200 GHz. [5] The connector insulator according to any one of the above [1] to [4], wherein the melting point of the 3-methyl-1-butene polymer is 260° C. or higher. [6] The connector insulator according to any one of the above [1] to [5], wherein the resin composition contains an antioxidant. [7] The connector insulator according to the above [6], wherein the antioxidant includes at least one selected from the group consisting of phenol-based antioxidants and phosphorus-based antioxidants. [Effects of the Invention]

[0008] According to the present invention, it is possible to provide a connector insulator that has a low relative dielectric constant and dielectric loss tangent and is capable of being reflow soldered. DETAILED DESCRIPTION OF THE INVENTION

[0009] The present invention will be described below based on an example of an embodiment, but the embodiment shown below is merely an example for embodying the technical concept of the present invention, and the present invention is not limited to the following description. In this specification, preferred embodiments are shown, but a combination of two or more of the individual preferred embodiments is also a preferred embodiment. When there are several numerical ranges for matters shown as numerical ranges, the lower limit and upper limit can be selectively combined to form a preferred embodiment. In this specification, when a numerical range is stated as "XX to YY", it means "XX or more and YY or less."

[0010] <Connector insulator> The connector insulator of the present embodiment is characterized by containing a resin composition containing a 3-methyl-1-butene polymer. The resin composition of the connector insulator contains a 3-methyl-1-butene polymer, which allows reflow soldering while maintaining a low dielectric constant and dielectric loss tangent. The connector insulator of this embodiment also has excellent dielectric properties in the high frequency band, making it suitable for high frequency applications, particularly for coaxial connectors.

[0011] The resin composition of the connector insulator contains a 3-methyl-1-butene polymer, which allows the connector insulator to have low water absorption. Because of its low water absorption, the connector insulator can be reflow soldered even after being left in an atmosphere of 85°C and 85% RH for 7 days.

[0012] The connector insulator of the present embodiment may be made of a resin composition, or may contain components other than the resin composition.

[0013] [Resin composition] The resin composition of the present embodiment contains a 3-methyl-1-butene polymer.

[0014] <3-methyl-1-butene polymer> The 3-methyl-1-butene polymer may be a 3-methyl-1-butene homopolymer or a copolymer of 3-methyl-1-butene and an unsaturated hydrocarbon. Examples of the unsaturated hydrocarbon include ethylene and an α-olefin, and from the viewpoint of good copolymerizability, ethylene or an α-olefin having 3 to 20 carbon atoms is preferred. From the viewpoint of suitably exhibiting mechanical properties (adequate strength, flexibility, and impact resistance), the 3-methyl-1-butene polymer is preferably at least one selected from the group consisting of a 3-methyl-1-butene homopolymer and a copolymer of 3-methyl-1-butene with ethylene or an α-olefin having 3 to 20 carbon atoms, and more preferably a copolymer of 3-methyl-1-butene with ethylene or an α-olefin having 3 to 20 carbon atoms. The copolymer may be a random copolymer, a block copolymer, or an alternating copolymer. The method for producing the copolymer is not limited as long as it does not impair the effects of the present invention, and any known copolymerization method can be used.

[0015] When the 3-methyl-1-butene polymer is the above copolymer, the content of structural units derived from ethylene or an α-olefin in the copolymer is preferably more than 0 mol % and 20 mol % or less. From the viewpoint of flexibility and impact resistance, the content of structural units derived from ethylene or an α-olefin in the copolymer is more preferably 0.1 mol % or more, and even more preferably 0.5 mol % or more. From the viewpoint of heat resistance during reflow soldering, the content of structural units derived from ethylene or α-olefin in the copolymer is more preferably 15 mol % or less, and even more preferably 10 mol % or less. From these viewpoints, the content of structural units derived from ethylene or an α-olefin in the copolymer is more preferably 0.1 to 15 mol%, and even more preferably 0.5 to 10 mol%. In one embodiment, the content of structural units derived from ethylene or an α-olefin in the copolymer is preferably more than 0 mol% and 10 mol% or less. The content of structural units derived from ethylene or α-olefin in the copolymer can be determined by a Fourier transform infrared spectrophotometer (FT-IR). Specifically, it can be measured by the method described in the examples.

[0016] When the 3-methyl-1-butene polymer is the above copolymer, the content of structural units derived from 3-methyl-1-butene in the copolymer is preferably 80 mol % or more and less than 100 mol %. From the viewpoint of heat resistance during reflow soldering, the content of structural units derived from 3-methyl-1-butene in the copolymer is more preferably 85 mol % or more, and even more preferably 90 mol % or more. Furthermore, from the viewpoint of flexibility and impact resistance, the content of structural units derived from 3-methyl-1-butene in the copolymer is more preferably 99.9 mol % or less, and even more preferably 99.5 mol % or less.

[0017] From the viewpoint of suitably exhibiting the physical properties of the 3-methyl-1-butene polymer, the ethylene or the α-olefin having 3 to 20 carbon atoms is preferably an α-olefin having 4 to 16 carbon atoms, more preferably an α-olefin having 4 to 12 carbon atoms. The α-olefin having 3 to 20 carbon atoms may be linear or branched.

[0018] Examples of the α-olefins having 3 to 20 carbon atoms include propylene, 1-butene, 1-pentene, 1-hexene, 3-methyl-1-pentene, 3-ethyl-1-pentene, 4-methyl-1-pentene, 4-methyl-1-hexene, 4,4-dimethyl-1-hexene, 4,4-dimethyl-1-pentene, 4-ethyl-1-hexene, 3-ethyl-1-hexene, 1-octene, 1-decene, 1-dodecene, 1-tetradecene, 1-hexadecene, 1-octadecene, 1-eicosene, vinylcyclohexene, and vinylnorbornane. The α-olefins having 3 to 20 carbon atoms may be used alone or in combination of two or more.

[0019] The melting point of the 3-methyl-1-butene polymer is preferably 260 to 310° C. When the melting point of the 3-methyl-1-butene polymer is within the above range, the resin composition can be easily molded by injection molding or the like, and warping, melting, blistering, and the like of the connector insulator due to reflow soldering are further suppressed, i.e., the reflow heat resistance is improved. The melting point of the 3-methyl-1-butene polymer refers to the peak temperature measured by using a differential scanning calorimeter to raise the temperature of a test piece from 30°C to 320°C at a rate of 10°C / min under a nitrogen flow rate (100 mL / min), hold the test piece at 320°C for 5 minutes, then lower the temperature to -70°C at a rate of 10°C / min, hold the test piece at -70°C for 5 minutes, and then raise the temperature to 320°C at a rate of 10°C / min. Specifically, the melting point can be measured by the method described in the examples. From the viewpoint of the balance between production efficiency and reflow heat resistance, the melting point of the 3-methyl-1-butene polymer is preferably 270 to 305°C, more preferably 280 to 300°C.

[0020] The content of the 3-methyl-1-butene polymer in the resin composition is preferably 50.0 to 99.9 mass%, more preferably 60.0 to 99.9 mass%, and even more preferably 65.0 to 99.9 mass%, from the viewpoint of obtaining a connector insulator having a lower relative dielectric constant and dielectric dissipation factor.

[0021] 3-methyl-1-butene polymers have a relatively low specific gravity and can contribute to reducing the weight of connector insulators. Furthermore, 3-methyl-1-butene polymers do not generate harmful gases when incinerated. Furthermore, the decomposition products in an inert atmosphere are low-molecular-weight hydrocarbons, making them suitable for chemical recycling.

[0022] <Alkyl radical scavenger> The resin composition may contain an alkyl radical scavenger from the viewpoint of exhibiting better mechanical properties. In the present embodiment, the term "alkyl radical scavenger" refers to a compound that reacts with an alkyl radical derived from a 3-methyl-1-butene polymer and then stabilizes the radical, thereby suppressing a chain reaction of main chain scission initiated by the alkyl radical. From the viewpoint of exhibiting better mechanical properties, the alkyl radical scavenger preferably contains at least one selected from the group consisting of an acrylic phenol compound and a benzofuranone compound. The alkyl radical scavengers may be used alone or in combination of two or more.

[0023] (Acrylphenolic compounds) The acrylic phenol compound used in this embodiment can be represented by, for example, the following general formula (I).

[0024] [ka]

[0025] In general formula (I), R 1 represents a hydrogen atom or a methyl group, and R 2 represents a hydrogen atom or an alkyl group having 1 to 3 carbon atoms, and R 3 ,R 4 ,R 5 and R 6 each independently represents an alkyl group having 1 to 9 carbon atoms. Examples of the alkyl group having 1 to 3 carbon atoms include a methyl group, an ethyl group, an n-propyl group, and an isopropyl group. The alkyl group having 1 to 9 carbon atoms may be linear or branched. Examples of the alkyl group having 1 to 9 carbon atoms include a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, an isobutyl group, an s-butyl group, a t-butyl group, a 1,1-dimethylpropyl group, a 1,2-dimethylpropyl group, a 2,2-dimethylpropyl group, a 1-methylbutyl group, a 2-methylbutyl group, a 3-methylbutyl group, an n-pentyl group, an n-hexyl group, an n-heptyl group, an n-octyl group, and an n-nonyl group. R 1 is preferably a hydrogen atom. R 2 is preferably a hydrogen atom or a methyl group, more preferably a methyl group. R 3 ,R 4 ,R 5 and R 6 are each independently preferably an alkyl group having 3 to 8 carbon atoms, more preferably an alkyl group having 5 carbon atoms, and even more preferably a 1,1-dimethylpropyl group.

[0026] Examples of the acrylic phenol compound represented by general formula (I) include 2,4-di-t-amyl-6-[1-(3,5-di-t-amyl-2-hydroxyphenyl)ethyl]phenyl acrylate, 2,4-di-t-butyl-6-[1-(3,5-di-t-butyl-2-hydroxyphenyl)ethyl]phenyl acrylate, and 2-t-butyl-6-[(3-t-butyl-2-hydroxy-5-methylphenyl)methyl]-4-methylphenyl acrylate. Commercially available alkyl radical scavengers may be used, and examples of the acrylic phenol compound represented by general formula (I) include "Sumilizer GS" and "Sumilizer GM," both of which are manufactured by Sumitomo Chemical Co., Ltd.

[0027] (benzofuranone compounds) The benzofuranone compound used in this embodiment can be represented by, for example, the following general formula (II).

[0028] [ka]

[0029] In general formula (II), R 7 and R 8 each independently represents an alkyl group having 1 to 4 carbon atoms, and R 9 and R 10 each independently represents an alkyl group having 1 to 9 carbon atoms. Examples of the alkyl group having 1 to 4 carbon atoms include a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, an isobutyl group, an s-butyl group, and a t-butyl group. The alkyl group having 1 to 9 carbon atoms may be linear or branched. Examples of the alkyl group having 1 to 9 carbon atoms include a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, an isobutyl group, an s-butyl group, a t-butyl group, a 1,1-dimethylpropyl group, a 1,2-dimethylpropyl group, a 2,2-dimethylpropyl group, a 1-methylbutyl group, a 2-methylbutyl group, a 3-methylbutyl group, an n-pentyl group, an n-hexyl group, an n-heptyl group, an n-octyl group, and an n-nonyl group. R 7 and R 8 are each independently preferably an alkyl group having 1 to 3 carbon atoms, more preferably a methyl group. R 9 and R 10 are each independently preferably an alkyl group having 1 to 4 carbon atoms, more preferably a t-butyl group.

[0030] Examples of the benzofuranone compound represented by general formula (II) include 5,7-di-t-butyl-3-(3,4-di-methyl-phenyl)-3H-benzofuran-2-one, 5,7-di(t-butyl)-3-(3,4-di-propyl-phenyl)-3H-benzofuran-2-one, and 4-t-butyl-2-(5-t-butyl-2-oxo-3H-benzofuran-3-yl)phenyl-3,5-di-t-butyl-4-hydroxybenzoate. Commercially available alkyl radical scavengers may be used, and examples of the benzofuranone compound represented by general formula (II) include "Iragnox HP-136" (trade name) manufactured by BASF and "Revonox 501" (trade name) manufactured by Chitec.

[0031] (Alkyl radical scavenger content) The content of the alkyl radical scavenger in the resin composition relative to 100 parts by mass of the 3-methyl-1-butene polymer is preferably 0.01 to 1.00 parts by mass. When the content of the alkyl radical scavenger is 0.01 parts by mass or more, the physical properties of the resin composition can be more stably maintained during melt-kneading of the resin composition, and molding defects caused by generation of decomposition gas during melt molding can be suppressed. Furthermore, when the content of the alkyl radical scavenger is 1.00 parts by mass or less, a connector insulator having more excellent mechanical properties is easily obtained, and the deterioration of the physical properties required for the resin composition, such as bleeding out of the alkyl radical scavenger or deterioration of moisture absorption, can be suppressed.

[0032] From the viewpoint of maintaining the physical properties of the resin composition more stably during melt-kneading, the content of the alkyl radical scavenger in the resin composition relative to 100 parts by mass of the 3-methyl-1-butene polymer is more preferably 0.02 parts by mass or more, and even more preferably 0.05 parts by mass or more. From the viewpoint of a balance between maintaining the stability of the physical properties of the resin composition and economic efficiency, and from the viewpoint of obtaining a connector insulator having a lower relative dielectric constant and dielectric dissipation factor, the content of the alkyl radical scavenger in the resin composition per 100 parts by mass of the 3-methyl-1-butene polymer is more preferably 0.80 parts by mass or less, and even more preferably 0.70 parts by mass or less. From these viewpoints, the content of the alkyl radical scavenger in the resin composition relative to 100 parts by mass of the 3-methyl-1-butene polymer is more preferably 0.02 to 0.80 parts by mass, and even more preferably 0.05 to 0.70 parts by mass. When two or more types of alkyl radical scavengers are contained, the content of the alkyl radical scavengers refers to the total content of the alkyl radical scavengers.

[0033] <Antioxidants> The resin composition may contain an antioxidant from the viewpoint of ensuring the stability of the polymer. The antioxidant preferably includes at least one selected from the group consisting of phenol-based antioxidants and phosphorus-based antioxidants. The antioxidants may be used alone or in combination of two or more.

[0034] (phenolic antioxidant) Examples of phenolic antioxidants include pentaerythritol tetrakis[3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate], 1,3,5-tris(3,5-di-t-butyl-4-hydroxybenzyl)-1,3,5-triazine-2,4,6(1H,3H,5H)-trione, 1,3,5-tris[(4-t-butyl-3-hydroxy-2,6-xylyl)methyl]-1,3,5-triazine-2,4,6(1H,3H,5H)-trione, and octaerythritol tetrakis[3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate]. Decyl-3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate, thiodiethylene-bis[3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate], N,N'-hexane-1,6-diylbis[3-(3,5-di-t-butyl-4-hydroxyphenyl)propionamide], 3,3',3'',5,5',5''-hexa-t-butyl-α,α',α''-(mesitylene-2,4,6-triyl)tri-p-cresol, ethylene bis (Oxyethylene)bis[3-(5-t-butyl-4-hydroxy-m-tolyl)propionate], hexamethylene-bis[3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate], 2,6-di-t-butyl-4-[4,6-bis(octylthio)-1,3,5-triazin-2-ylamino]phenol, 3,9-bis[2-(3-(3-t-butyl-4-hydroxy-5-methylphenyl)propionyloxy)-1,1-dimethylethyl]-2, Examples include 4,8,10-tetraoxaspiro(5,5)undecane, 4,4',4''-(1-methylpropanyl-3-ylidene)tris(6-t-butyl-m-cresol), 6,6'-di-t-butyl-4,4'-butylidene-di-m-cresol, octadecyl-3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate, and benzenepropionic acid 3,5-bis-(1,1-dimethylethyl)-4-hydroxy-C7-C9 branched alkyl ester.

[0035] As the phenolic antioxidant, commercially available products may be used, such as the "ADEKA STAB AO series" manufactured by ADEKA Corporation and the "Irganox series" manufactured by BASF Japan Ltd.

[0036] (phosphorus antioxidant) Examples of the phosphorus-based antioxidant include 3,9-bis(2,6-di-t-butyl-4-methylphenoxy)-2,4,8,10-tetraoxa-3,9-diphosphaspiro[5.5]undecane, tetrakis(2,4-di-t-butyl-phenyl)-4,4'-biphenylenephosphonite, 2,2-methylenebis(4,6-di-t-butylphenyl)octylphosphite, and tris(2,4-di-t-butylphenyl)phosphite. phosphate, bis(2,4-bis(1,1-dimethylethyl)-6-methylphenyl)ethyl ester phosphite, bis(2,4-di-t-butylphenyl)pentaerythritol diphosphite, bis(2,4-dicumylphenyl)pentaerythritol diphosphite, di-t-butyl-m-cresyl phosphonite, diethyl [(3,5-bis(1,1-dimethylethyl)-4-hydroxyphenyl)methyl]phosphonate, tris(2,4-di-t-butylphenyl)phosphite, tetrakis(2,4-di-t-butylphenyl)-4,4'-biphenylene diphosphonite, 3,9-bis(octadecyoxy)-2,4,8,10-tetraoxa-3,9-diphosphaspiro[5.5]undecane, tris(2,4-di-t-butylphenyl)phosphite, tris(nonylphenyl)phosphite, tetra-C12-15-alkyl (propane-2,2-diylbis(4,1-phenylene))bis(phosphite), 2-ethylhexyldiphenyl phosphite, isodecyldiphenyl phosphite, trisisodecyl phosphite, triphenyl phosphite, and 3,9-bis[2,4-bis(1-methyl-1-phenylethyl)phenoxy]-2,4,8,10-tetraoxa-3,9-diphosphaspiro[5.5]undecane.

[0037] Commercially available phosphorus-based antioxidants may be used, such as the "ADK STAB PEP series" and "ADK STAB HP series" manufactured by ADEKA Corporation, the "IRGAFOS series" manufactured by BASF Japan Ltd., and "HOSTANOX P-EPQ" manufactured by Clariant.

[0038] (sulfur-based antioxidant) Examples of sulfur-based antioxidants include dilauryl 3,3'-thiodipropionate, dimyristyl 3,3'-thiodipropionate, distearyl 3,3'-thiodipropionate, laurylstearyl 3,3'-thiodipropionate, pentaerythritol-tetrakis-(β-lauryl-thio-propionate), and 3,9-bis(2-dodecylthioethyl)-2,4,8,10-tetraoxaspiro[5,5]undecane.

[0039] (Other antioxidants) The resin composition may also contain antioxidants other than the phenolic antioxidants, phosphorus-based antioxidants, and sulfur-based antioxidants, as long as the effects of the present invention are not impaired. Examples of antioxidants other than the phenolic antioxidants, phosphorus-based antioxidants, and sulfur-based antioxidants include amine-based antioxidants.

[0040] (Antioxidant content) The content of the antioxidant in the resin composition relative to 100 parts by mass of the 3-methyl-1-butene polymer is preferably 0.01 part by mass or more, more preferably 0.10 part by mass or more, from the viewpoint of ensuring the stability of the 3-methyl-1-butene polymer, and is preferably 1.00 part by mass or less, more preferably 0.80 part by mass or less, from the viewpoint of the relative dielectric constant and the dielectric loss tangent, i.e., preferably 0.01 to 1.00 parts by mass, more preferably 0.10 to 0.80 parts by mass. When the resin composition contains two or more antioxidants, the content of the antioxidants means the total content of the antioxidants.

[0041] <Other additives> The resin composition may contain additives other than the alkyl radical scavenger and the antioxidant. Examples of other additives include antacids, fillers, light stabilizers, antistatic agents, flame retardants, pigments, polymerization inhibitors, heavy metal deactivators, ultraviolet absorbers, nucleating agents, clarifying agents, lubricants, fluorescent brighteners, rust inhibitors, and sliding agents. The other additives may be used alone or in combination of two or more.

[0042] (antacids) From the viewpoint of suppressing deterioration due to acid components generated from residual metal components and the like during melt-kneading, the resin composition preferably contains an antacid. Antacids include barium laurate, calcium stearate, zinc stearate, magnesium stearate, aluminum stearate, zinc oleate, magnesium 12-hydroxystearate, and the like. The antacids may be used alone or in combination of two or more.

[0043] The content of the antacid in the resin composition relative to 100 parts by mass of the 3-methyl-1-butene polymer can be determined appropriately and may be, for example, 0.01 to 200 parts by mass.

[0044] (antistatic agent) Examples of the antistatic agent include sodium alkylsulfonate, phosphonium alkylsulfonate, and fatty acid ester hydroxyamine compounds such as glycerin esters of stearic acid.

[0045] The content of the antistatic agent in the resin composition relative to 100 parts by mass of the 3-methyl-1-butene polymer can be determined appropriately, and may be, for example, 5 parts by mass or less.

[0046] (filler) The resin composition may contain a filler from the viewpoint of further improving the mechanical properties of the connector insulator. Examples of fillers include fibrous compounds such as glass fiber, alumina fiber, resin fiber, carbon fiber, and cellulose fiber; plate-like compounds such as mica, talc, montmorillonite, and plate-like aluminum; spherical compounds such as glass beads, shirasu balloons, and acrylic balloons; needle-like compounds such as acicular metal titanate, wollastonite, acicular silica, and tin oxide; and powdered compounds such as powdered metal titanate, finely divided wood chips, titanium oxide, calcium carbonate, silica, and alumina. These fillers may be surface-treated with, for example, a silane coupling agent. A compatibilizer may also be used to enhance the dispersibility of the filler. Among these, glass fiber is preferable from the viewpoint of further improving the mechanical properties of the connector insulator. The fillers may be used alone or in combination of two or more.

[0047] The content of the filler in the resin composition relative to 100 parts by mass of the 3-methyl-1-butene polymer can be determined appropriately and may be, for example, 0.01 to 300 parts by mass or 0.1 to 100 parts by mass.

[0048] (ultraviolet absorber) Examples of the ultraviolet absorber include hindered amine ultraviolet absorbers such as 2,2,6,6-tetramethyl-4-piperidyl benzoate, bis(2,2,6,6-tetramethyl-4-piperidyl) sebacate, bis(1,2,2,6,6-pentamethyl-4-piperidyl)-2-(3,5-di-t-butyl-4-hydroxybenzyl)-2-n-butylmalonate, and 4-(3-(3,5-di-t-butyl-4-hydroxyphenyl)propionyloxy)-1-(2-(3-(3,5-di-t-butyl-4-hydroxyphenyl)propionyloxy)ethyl)-2,2,6,6-tetramethylpiperidine. benzotriazole-based ultraviolet absorbers such as 2-(2-hydroxy-5-methylphenyl)benzotriazole, 2-(3-t-butyl-2-hydroxy-5-methylphenyl)-5-chlorobenzotriazole, 2-(3,5-di-t-butyl-2-hydroxyphenyl)-5-chlorobenzotriazole, and 2-(3,5-di-t-amyl-2-hydroxyphenyl)benzotriazole; and benzoate-based ultraviolet absorbers such as 2,4-di-t-butylphenyl-3,5-di-t-butyl-4-hydroxybenzoate and hexadecyl-3,5-di-t-butyl-4-hydroxybenzoate.

[0049] The content of the ultraviolet absorber in the resin composition relative to 100 parts by mass of the 3-methyl-1-butene polymer can be determined appropriately and may be, for example, 0.001 to 5 parts by mass or 0.01 to 1 part by mass.

[0050] (lubricant) Inorganic fine particles are generally used as the lubricant. Examples of inorganic fine particles include oxides, hydroxides, sulfides, nitrides, halides, carbonates, sulfates, acetates, phosphates, phosphites, organic carboxylates, silicates, titanates, borates, and hydrated compounds thereof, composite compounds mainly composed of these, and natural minerals, etc., of elements of Groups 1, 2, 4, 6, 7, 8 to 10, 11, 12, 13, and 14 of the periodic table.

[0051] Examples of inorganic fine particles include Group 1 element compounds such as thialium fluoride and borax (sodium borate hydrate); Group 2 element compounds such as magnesium carbonate, magnesium phosphate, magnesium oxide (magnesiu), magnesium chloride, magnesium acetate, magnesium fluoride, magnesium titanate, magnesium silicate, magnesium silicate hydrate (talc), calcium carbonate, calcium phosphate, calcium phosphite, calcium sulfate (gypsum), calcium acetate, calcium terephthalate, calcium hydroxide, calcium silicate, calcium fluoride, calcium titanate, strontium titanate, barium titanate, zinc titanate, lanthanum titanate, bismuth titanate, lead titanate, barium carbonate, barium phosphate, barium sulfate, and barium phosphite; titanium dioxide (titania Group 4 element compounds such as titanium monoxide, titanium nitride, zirconium dioxide (zirconia), and zirconium monoxide; Group 6 element compounds such as molybdenum dioxide, molybdenum trioxide, and molybdenum sulfide; Group 7 element compounds such as manganese chloride and manganese acetate; Group 8 to 10 element compounds such as cobalt chloride and cobalt acetate; Group 11 element compounds such as cuprous iodide; Group 12 element compounds such as zinc oxide and zinc acetate; Group 13 element compounds such as aluminum oxide (alumina), aluminum hydroxide, aluminum fluoride, and aluminosilicates (alumina silicate, kaolin, and kaolinite); Group 14 element compounds such as silicon oxide (silica, silica gel), graphite, carbon, graphite, and glass; and natural mineral fine particles such as karnalite, kainite, mica, and byrrosite. The average particle size of the inorganic fine particles is not particularly limited, but is preferably 0.01 to 3 μm.

[0052] The content of the lubricant in the resin composition relative to 100 parts by mass of the 3-methyl-1-butene polymer can be determined appropriately and may be, for example, 0.001 to 5 parts by mass or 0.005 to 3 parts by mass.

[0053] <Other resins> The resin composition may contain a resin other than the 3-methyl-1-butene polymer. From the viewpoint of improving the dispersibility of additives containing polar groups, the resin composition may contain other resins, such as vinyl acetate-ethylene copolymers and modified polyolefins partially modified with reactive functional groups such as oxidation or maleic acid. Examples of polyolefins constituting the modified polyolefins modified with reactive functional groups include polyethylene, polypropylene, and polyolefins having a structural unit of an α-olefin having 3 to 20 carbon atoms. Examples of α-olefins having 3 to 20 carbon atoms include those described above in the section on 3-methyl-1-butene polymers. These may be homopolymers or copolymers. Furthermore, these polyolefins may be high-density or low-density, and may be polymerized using a metallocene catalyst. Among these, at least one selected from the group consisting of polyethylene or polypropylene is preferred, at least one selected from the group consisting of modified polyethylene or modified polypropylene that has been partially modified with reactive functional groups such as oxidation or maleic acid is more preferred, and at least one selected from the group consisting of maleic anhydride-modified polypropylene is even more preferred.

[0054] From the viewpoint of further exerting the effects of the present invention, the contents of the vinyl acetate-ethylene copolymer and the modified polyolefin partially modified with a reactive functional group such as oxidation or maleic acid in the resin composition relative to 100 parts by mass of the 3-methyl-1-butene polymer are preferably 30 parts by mass or less, more preferably 20 parts by mass or less, and even more preferably 10 parts by mass or less.

[0055] Examples of resins other than vinyl acetate-ethylene copolymers and modified polyolefins partially modified with reactive functional groups such as oxidation or maleic acid include polyolefins such as low-density polyethylene, high-density polyethylene, linear low-density polyethylene, very low-density polyethylene, polypropylene, syndiotactic polypropylene, polybutene, and polypentene; polyesters such as polyethylene terephthalate and polybutylene terephthalate; polyamides such as nylon 6 and nylon 66; ethylene-ethyl acrylate copolymer, ethylene-vinyl acetate copolymer, polystyrene, syndiotactic polystyrene, polyphenylene sulfide, polyphenylene ether, polyamide, polyester, polycarbonate, and thermoplastic elastomers. Examples of thermoplastic elastomers include random or block copolymers of aromatic vinyl monomers and conjugated diene monomers, such as styrene-butadiene block copolymers, styrene-butadiene-styrene block copolymers, styrene-isoprene block copolymers, styrene-isoprene-styrene block copolymers, and styrene-butadiene random copolymers; polyisoprene rubber; polyolefin rubbers, such as ethylene-propylene copolymers, ethylene-α-olefin copolymers, and propylene-α-olefin copolymers; diene copolymers, such as ethylene-propylene-diene copolymers, α-olefin-diene copolymers, diene copolymers, isobutylene-isoprene copolymers, and isobutylene-diene copolymers; norbornene rubbery polymers, such as copolymers of norbornene monomers and ethylene or α-olefins, terpolymers of norbornene monomers, ethylene and α-olefins, and ring-opening polymers of norbornene monomers, or hydrogenated versions of these.

[0056] From the viewpoint of further improving the flexibility, bendability, and impact resistance of the connector insulator, the resin composition preferably contains a thermoplastic elastomer. When the resin composition contains a thermoplastic elastomer, the connector insulator is less susceptible to distortion or impact when the connector is repeatedly connected and disconnected or when the connector is rolled up like an electric wire and then straightened out for a long period of time, and thus the occurrence of cracks can be suppressed.

[0057] From the viewpoint of impact resistance, the thermoplastic elastomer preferably has a glass transition temperature (Tg) of 40°C or less. Some block copolymers have two or more Tg points, but they can be preferably used as long as one of the Tg points is 40°C or less. The number-average molecular weight is preferably 10,000 or more, more preferably 20,000 or more, even more preferably 30,000 or more, and preferably 200,000 or less. A number-average molecular weight of 10,000 or more provides superior mechanical properties, while a number-average molecular weight of 200,000 or less facilitates production. From the viewpoint of compatibility with 3-methyl-1-butene polymers, non-polar elastomers, i.e., those composed only of carbon and hydrogen, are preferred.

[0058] From the viewpoint of obtaining a connector insulator having a low dielectric constant and dielectric loss tangent, it is preferable that the resin composition has a reduced amount of metal elements. Therefore, from the viewpoint of facilitating the reduction of the amount of metal elements, the thermoplastic elastomer is preferably a copolymer of an aromatic vinyl monomer and a conjugated diene monomer, and more preferably a block copolymer thereof. From the viewpoint of improving weather resistance, hydrogenated products thereof are more preferred.

[0059] The content of other resins other than the thermoplastic elastomer, vinyl acetate-ethylene copolymer, and modified polyolefin partially modified with reactive functional groups such as oxidized or maleic acid in the resin composition is preferably 1 to 100 parts by mass, more preferably 2 to 50 parts by mass, and even more preferably 3 to 30 parts by mass, per 100 parts by mass of the 3-methyl-1-butene polymer. When the content is within this range, the excellent physical properties of the 3-methyl-1-butene polymer, such as heat resistance and chemical resistance, are likely to be exhibited.

[0060] <Melting Point of Resin Composition> The melting point of the resin composition of the present embodiment is preferably 260 to 310° C. When the melting point of the resin composition is within the above range, molding can be performed more easily, and reflow heat resistance can be further improved. The melting point of the resin composition means the peak temperature when measured by a method similar to that for measuring the melting point of a 3-methyl-1-butene polymer, and specifically, the melting point can be measured by the method for measuring the melting point of a 3-methyl-1-butene polymer described in the Examples. From the viewpoint of the balance between production efficiency and reflow heat resistance, the melting point of the resin composition is preferably 270 to 305°C, and more preferably 280 to 300°C. The melting point of the resin composition of this embodiment is almost the same as that of the 3-methyl-1-butene polymer, and therefore, in this specification, the melting point of the 3-methyl-1-butene polymer can be considered to be the melting point of the resin composition.

[0061] <Melt Viscosity of Resin Composition> The melt viscosity of the resin composition of this embodiment is preferably 10 to 1,000 Pa·s. When the melt viscosity of the resin composition is 10 Pa·s or more, the mechanical strength is further improved, and when it is 1,000 Pa·s or less, good fluidity during molding is easily obtained. From the viewpoint of the balance between mechanical strength and fluidity during molding, the melt viscosity of the resin composition is more preferably 30 to 500 Pa·s, and even more preferably 50 to 300 Pa·s. The melt viscosity of the resin composition of this embodiment is measured at a barrel temperature of 320°C and a shear rate of 1220 sec-1 The value is measured under the conditions of (capillary: inner diameter 1.0 mm x length 10 mm, extrusion speed 10 mm / min), and specifically, it can be measured by the method described in the examples.

[0062] <Dielectric tangent of connector insulator> The dielectric loss tangent of the connector insulator of this embodiment at 10 kHz to 200 GHz is preferably 0.00010 or more, more preferably 0.00013 or more, and even more preferably 0.00015 or more from the viewpoint of economic efficiency, and is preferably 0.00100 or less, more preferably 0.00080 or less, and even more preferably 0.00050 or less from the viewpoint of reducing transmission loss. That is, the dielectric loss tangent at 10 kHz to 200 GHz is preferably 0.00010 to 0.00100, more preferably 0.00013 to 0.00080, and even more preferably 0.00015 to 0.00050. The dielectric loss tangent of the connector insulator in the range of 10 kHz to 200 GHz means a value measured by a common method such as the capacitance method, the resonance method, or the frequency change method, and specifically, can be measured by the method described in the examples. When the measurement wavelength is 10 kHz to 1 GHz, it is preferable to measure by the capacitance method, when the measurement wavelength is more than 1 GHz and not more than 50 GHz, it is preferable to measure by the resonance method, and when the measurement wavelength is more than 50 GHz and not more than 200 GHz, it is preferable to measure by the frequency change method.

[0063] <Relative dielectric constant of connector insulator> The relative dielectric constant of the connector insulator of this embodiment at 10 kHz to 200 GHz is preferably 0.5 or more, more preferably 1.5 or more, and even more preferably 2.0 or more from the viewpoint of economic efficiency, and is preferably 5.0 or less, more preferably 4.0 or less, and even more preferably 3.5 or less from the viewpoint of reducing transmission loss. That is, the relative dielectric constant at 10 kHz to 200 GHz is preferably 0.5 to 5.0, more preferably 1.5 to 4.0, and even more preferably 2.0 to 3.5. The relative dielectric constant of the connector insulator in the range of 10 kHz to 200 GHz means a value measured by a common method such as the capacitance method, the resonance method, or the frequency change method, and specifically, it can be measured by the method described in the examples. When the measurement wavelength is 10 kHz to 1 GHz, it is preferable to measure by the capacitance method, when the measurement wavelength is more than 1 GHz and not more than 50 GHz, it is preferable to measure by the resonance method, and when the measurement wavelength is more than 50 GHz and not more than 200 GHz, it is preferable to measure by the frequency change method.

[0064] <Water absorption rate of connector insulator> The water absorption rate of the connector insulator of the present embodiment is preferably 0.5% by mass or less, more preferably 0.3% by mass or less, and even more preferably 0.1% by mass or less. If the water absorption rate of the connector insulator is within the above range, the occurrence of blisters during reflow soldering can be further suppressed, and storage management before reflow soldering becomes easier. The water absorption rate of the connector insulator means a value measured in accordance with Method A of JIS K 7209:2000, and specifically, can be measured by the method described in the examples.

[0065] <Method of manufacturing connector insulators> The method for manufacturing the connector insulator of this embodiment is a method for manufacturing the connector insulator described above, and is not particularly limited. From the viewpoint of obtaining a connector insulator that has a low dielectric constant and dielectric dissipation factor and that can be reflow soldered, the method for producing a connector insulator preferably includes a step of obtaining a 3-methyl-1-butene polymer and a step of molding a resin composition to obtain the connector insulator. When a resin composition is obtained by blending other components such as additives in addition to the 3-methyl-1-butene polymer, it is preferable to go through the step of obtaining a resin composition described below.

[0066] [Step of obtaining 3-methyl-1-butene polymer] In the present embodiment, the method for obtaining the 3-methyl-1-butene polymer is not particularly limited, and the polymer can be produced using a known catalyst such as a Ziegler-Natta catalyst, a metallocene catalyst, etc. The 3-methyl-1-butene polymer can be obtained as a powder by homopolymerizing 3-methyl-1-butene in the presence of a catalyst or copolymerizing 3-methyl-1-butene with the above-mentioned ethylene or α-olefin, as described in JP-A-61-103910, for example. The stereoregularity of the 3-methyl-1-butene polymer may be isotactic or syndiotactic.

[0067] [Step of obtaining resin composition] The step of obtaining a resin composition is a step of blending and mixing other components such as additives in addition to the 3-methyl-1-butene polymer to obtain a resin composition. The blending method is not particularly limited, and a method of melt-kneading using a twin-screw kneading extruder or the like can be used. When no other components are blended in addition to the 3-methyl-1-butene polymer, the resin composition consists of the 3-methyl-1-butene polymer, and there is no need to go through a step of obtaining the resin composition. Examples of additives include those similar to those described in the above [Resin composition], such as alkyl radical scavengers, antioxidants, antacids, fillers, light stabilizers, antistatic agents, flame retardants, pigments, polymerization inhibitors, heavy metal deactivators, ultraviolet absorbers, nucleating agents, clarifying agents, lubricants, fluorescent brighteners, rust inhibitors, and sliding agents.

[0068] <Melting and kneading conditions> The melt-kneading conditions are not particularly limited, but it is preferable to perform melt-kneading by injecting an inert gas into the melt-kneader, or by degassing the inside of the melt-kneader under reduced pressure. In order to suppress deterioration of the physical properties of the resin composition due to oxygen and to produce a connector insulator having better mechanical properties, it is preferable to melt and knead the resin composition in an inert atmosphere or in a low-oxygen state. In this embodiment, the "low-oxygen state" refers to a state in which the oxygen concentration inside the melt kneader is lower than that before the degassing under reduced pressure. In the "low-oxygen state," the oxygen concentration inside the melt kneader is preferably 5% or less, more preferably 2% or less, and even more preferably 1% or less. The oxygen concentration is measured using an oxygen concentration meter such as a diaphragm-type galvanic oxygen meter.

[0069] The method of melt-kneading by injecting an inert gas into the melt-kneader may involve, for example, introducing each component into the melt-kneader while injecting the inert gas into the melt-kneader, or introducing each component into the melt-kneader and then injecting the inert gas into the melt-kneader. Furthermore, the inert gas may be continuously injected into the melt-kneader during melt-kneading. The inert gas may be injected in a manner that is appropriate for the equipment provided in each melt kneader. For example, the inert gas may be injected from a supply section for a gas such as an inert gas provided in the melt kneader, from a supply section for each component provided in the melt kneader, or from a gas vent provided in the melt kneader. There is no limitation on the injection method as long as the inert gas can be injected into the entire area from the inert gas supply section to the heating section where melting and kneading is performed, and melting and kneading can be performed. Examples of inert gases include nitrogen gas, helium gas, neon gas, argon gas, krypton gas, and carbon dioxide gas, with nitrogen gas being preferred from the viewpoints of availability and versatility.

[0070] The method of melt-kneading by degassing the inside of the melt-kneader under reduced pressure may be, for example, to carry out melt-kneading by charging each component into the melt-kneader and then degassing the inside of the melt-kneader under reduced pressure. During melt-kneading, degassing the inside of the melt-kneader under reduced pressure may be carried out intermittently or continuously. The method of degassing the inside of the melt kneader under reduced pressure can be carried out depending on the equipment provided in each melt kneader, and may be carried out through a vacuum vent, for example. When degassing under reduced pressure, the inside of the melt kneader can be in a vacuum state of, for example, 0.1 kPa or more and 50 kPa or less.

[0071] The melt kneader may be a single-screw extruder, a multi-screw extruder, a kneader, a Banbury mixer, or the like, which is equipped with equipment capable of melt-kneading by injecting an inert gas into the inside of the melt kneader, or equipment capable of melt-kneading by degassing the inside of the melt kneader under reduced pressure.

[0072] The melt-kneading temperature is preferably 300 to 380°C. When the melt-kneading temperature is 300°C or higher, the 3-methyl-1-butene polymer can be sufficiently melted, making it easier to disperse additives, etc. When the melt-kneading temperature is 380°C or lower, thermal decomposition of the 3-methyl-1-butene polymer and additives can be suppressed. From the viewpoint of thoroughly dispersing the additives throughout the 3-methyl-1-butene polymer, the melt-kneading temperature is more preferably 300°C or higher, and even more preferably 310°C or higher. In addition, from the viewpoint of preventing the raw materials from being significantly decomposed, the melt-kneading temperature is more preferably 380°C or lower, and even more preferably 360°C or lower.

[0073] The melt-kneading time can be adjusted depending on the size of the kneading apparatus, etc. For example, it may be 1 to 15 minutes, but is not limited to this numerical range of the melt-kneading time. In this embodiment, the "melt-kneading time" refers to the time during which the mixer is rotating in a batch kneader, and refers to the residence time of the raw materials in the apparatus in the case of a continuous extrusion kneader.

[0074] The rotation speed of the mixer during melt-kneading may be 80 rpm or more or 100 rpm or more, and may be 300 ppm or less or 250 ppm or less. After the melt-kneading, the resin composition is removed from the melt-kneader and cooled.

[0075] [Process for obtaining connector insulators] In the present embodiment, the step of obtaining a connector insulator is a step of obtaining a connector insulator by molding a resin composition. The molding method is not particularly limited, and a method suitable for the shape of the connector insulator may be used. The resin composition of this embodiment is thermoplastic and can be melt-molded. Therefore, injection molding, extrusion molding, pressure molding, hot press molding, etc. can be used. Among these, injection molding is preferred from the viewpoints of ease of manufacturing and obtaining molded products with excellent dimensional accuracy.

[0076] <Connector insulator shape> The shape of the connector insulator in this embodiment is selected according to the shape, purpose, and performance of the connector. The following describes a coaxial cable connector, which is the most common connector. A coaxial cable connector most commonly consists of a center conductor and an outer conductor that are connected to or to be connected to the center conductor and outer conductor of the coaxial cable, respectively, an insulator that secures the center conductor and insulates the center conductor from the outer conductor, and a gasket that insulates the entire assembly.

[0077] A coaxial cable connector insulator is usually in the form of a cylinder or a combination of cylinders of different diameters with their central axes aligned, with a through-hole in the center for fixing a central conductor. The outer periphery of the coaxial cable connector insulator has a diameter of preferably 2 mm or more, more preferably 3 mm or more, and even more preferably 5 mm or more, and is preferably 40 mm or less, more preferably 30 mm or less, and even more preferably 25 mm or less. That is, the outer periphery of the coaxial cable connector insulator has a diameter of preferably 2 to 40 mm, more preferably 3 to 30 mm, and even more preferably 5 to 25 mm.

[0078] In order to achieve a low dielectric constant and dielectric loss tangent, particularly in the high-frequency band, the connector insulator may be provided with a void other than the through hole for fixing the central conductor. The void is generally a through hole parallel to the central through hole and preferably has a circular cross section. However, it is preferable to provide a gap of at least 1 mm, more preferably at least 2 mm, between the outer peripheries of the through holes and between the through hole and the outer periphery of the connector insulator.

[0079] Typically, the larger the cross-sectional area of ​​a connector insulator perpendicular to the axial direction, and the higher the frequency of the application, the greater the reflected wave relative to the input wave at the connection site, resulting in greater transmission loss. Therefore, particularly for high-frequency applications, a connector insulator with a small cross-sectional area is preferable. However, if the cross-sectional area is too small, the mechanical strength is poor and the insulator is more likely to break when connecting to or disconnecting from the connector. Furthermore, the connector itself may be small and difficult to hold, making it difficult to use. Furthermore, when connecting a connector insulator to a connector or connecting a connector with a connector insulator to another connector, the connector insulator is more likely to be subjected to stress and break. Furthermore, if the connector insulator (excluding the gap) and the connector itself are the same size and shape, the larger the ratio of the gap to the volume of the connector insulator (including the gap), the smaller the voltage standing wave ratio at high frequencies, making it possible to use the connector insulator in a higher frequency band. However, if the gap is too large, the strength of the connector insulator decreases, making it more susceptible to damage when connecting to a cable. Therefore, sufficient thickness must be provided between gaps, between the gap and the outer periphery, and between the gap and the through hole for fixing the central conductor.

[0080] <Connector> Connectors generally come in two types: male and female, or plug and jack, each with a different shape. In the case of coaxial cables, the male center conductor typically protrudes from the connector insulator, while the female center conductor is recessed in a central through-hole in the connector insulator. Inserting the male center conductor into the female through-hole brings the two center conductors into contact. The male center conductor is fixed by the female connector insulator, securing the male and female connectors, and the outer conductors also come into contact. The outer conductors typically contact each other by covering the outer periphery of the outer conductor that covers the side of the female connector insulator, thereby firmly securing the male and female connectors. Specific examples of coaxial cable connectors include those described in JIS C 5410:1991, JIS C 5411:1995, JIS C 5412:1995, etc., such as C01-type connectors and C02-type connectors. Furthermore, the materials for the central conductor and the outer conductor are not particularly limited as long as they are conductive, but examples include those described in the above-mentioned JIS, such as silver-plated brass, nickel-plated brass, silver-plated phosphor bronze, silver-plated beryllium copper, and gold-plated beryllium copper.

[0081] In addition to connectors for coaxial cables, connectors of various shapes are used depending on the application, such as RC232C connectors for personal computers used to connect multiple conductors at once, and S-terminal connectors used for input and output of image information. A typical example of this is a connector with multiple conductor terminals, which correspond to the central conductor of a coaxial cable connector. In either case, connectors generally allow electrical current to flow between corresponding male and female conductors. Furthermore, the conductors are typically connected to conductor wires by soldering or other methods, and the ends of these conductors are connected to other connectors, electrical circuits, antennas, etc. However, the connector's central conductor and outer conductor are not necessarily connected to the conductor wires. Some connectors are simply used to securely fasten connectors together and are not connected to anything else, or they may be directly connected to the circuit on the wiring board and fixed to the wiring board itself. Some connectors have two integrated female connectors, two integrated male connectors, or two integrated pairs of different connectors, allowing for indirect connection between incompatible male and female connectors, or between different types of connectors. Some connectors are not even connected to the conductor wires. [Example]

[0082] The present invention will be specifically explained below with reference to examples and comparative examples, but the present invention is not limited to these.

[0083] <Measurement and evaluation methods> Various physical properties were measured or evaluated by the following methods.

[0084] [Content of structural units derived from comonomers] The content ratio of structural units derived from α-olefins (comonomers) other than 3-methyl-1-butene in the 3-methyl-1-butene copolymers obtained in Production Examples 1 and 2 was determined by IR measurement using an FT-IR analyzer (manufactured by Ailent Technologies, device name "cary 600 series FTIR spectrometer") by the ATR method, as follows: Bending vibration of the main chain methylene group of 3-methyl-1-butene homopolymer: 1,461 cm -1 and the bending vibration of 727 cm originating from the side chain methylene group of the α-olefin homopolymer. -1A calibration curve was created from the ratio of the peak area of ​​the 3-methyl-1-butene copolymer obtained in the Production Example to the peak area of ​​the 3-methyl-1-butene copolymer obtained in the Production Example, and the obtained measured values ​​were inserted into the calibration curve to determine the content of structural units derived from α-olefins other than 3-methyl-1-butene.

[0085] [Melting point] Using a differential scanning calorimeter (TA Instrument "DSC25"), the polymers (3-methyl-1-butene polymers) obtained in Production Examples 1 to 3 were heated from 30°C to 320°C at a rate of 10°C / min under a nitrogen flow rate (100 mL / min), held at 320°C for 5 minutes, and then cooled to -70°C at a rate of 10°C / min. After holding at -70°C for 5 minutes, the peak temperature was measured when the temperature was raised to 320°C at 10°C / min, and this temperature was taken as the melting point.

[0086] [Melt viscosity] The melt viscosity (Pa·s) of the resin compositions obtained in Examples 1 to 3 was measured using a capillary rheometer ("Capillography 1C" manufactured by Toyo Seiki Seisakusho Co., Ltd.) at a barrel temperature of 320°C and a shear rate of 1220 sec -1 Measurement was performed under the following conditions: (capillary: inner diameter 1.0 mm x length 10 mm, extrusion speed 10 mm / min).

[0087] [Weight average molecular weight] The weight average molecular weight of the syndiotactic polystyrene obtained in Production Example 4 was determined by the following gel permeation chromatography (GPC) measurement. Apparatus: GPC apparatus "HLC-8020" (Tosoh Corporation) Separation column: "TSKgel GMHXL" manufactured by Tosoh Corporation Eluent: chloroform Eluent flow rate: 1mL / min Sample concentration: 5mg / 10mL Column temperature: 40℃ Detector: Ultraviolet absorption detector UV detector Calibration curve: Created using standard polystyrene

[0088] [Injection moldability] Whether or not a 1A-type test piece conforming to JIS K 7161-2 could be produced was evaluated. The resin compositions obtained in Examples 1 to 3 and Comparative Examples 1 and 2 were injection molded under the conditions described in Examples 1 to 3 and Comparative Examples 1 and 2, respectively. The resin composition obtained in Comparative Example 3 was injection molded under the same conditions as in Example 1, except that the cylinder temperature was 380°C. If the above test piece could be molded, it was marked with ◯, and if not, it was marked with ×.

[0089] [specific gravity] The resin compositions obtained in Examples 1 to 3 and the resin compositions used in Comparative Examples 1 to 3 were press-molded to prepare test pieces (length: 40 mm, width: 10 mm, thickness: 4 mm). Using the test pieces, specific gravity was measured in accordance with Method A of JIS K 7112:1999.

[0090] [Water absorption rate] Test pieces (length: 60 mm, width: 60 mm, thickness: 1 mm) were prepared by press molding the resin compositions obtained in Examples 1 to 3 and the resin compositions used in Comparative Examples 1 to 3. Using the test pieces, the water absorption was measured in accordance with Method A of JIS K 7209:2000.

[0091] [Dielectric constant and dielectric loss tangent] In Examples 1 to 3 and Comparative Examples 1 and 2, the obtained resin compositions were injection molded under the respective injection conditions described in Examples 1 to 3 and Comparative Examples 1 and 2 described below, and in Comparative Example 3, the obtained sintered body was cut to prepare a test piece (length: 30 mm, width: 1.5 mm, thickness: 1 mm). Using the test piece, the relative permittivity and dielectric loss tangent at a measurement frequency of 10 GHz were measured by a vector network analyzer "Keysight E8361A" (manufactured by Agilent Technologies) using a perturbation type cavity resonance method. Test pieces (length: 100 mm, width: 100 mm, thickness: 2 mm) were prepared by press molding the resin compositions obtained in Examples 1 to 3. Using the test pieces, the relative permittivity and dielectric loss tangent at a measurement frequency of 100 GHz were measured by a frequency change method using a millimeter-wave module (WR10 67 GHz-115 GHz, manufactured by Virginia Diodes Inc.). Test pieces (length: 100 mm, width: 100 mm, thickness: 2 mm) were prepared by press molding the resin compositions obtained in Examples 1 to 3. Using the test pieces, the relative permittivity and dielectric loss tangent were measured at a measurement frequency of 200 GHz by a frequency variation method using a vector network analyzer (Anritsu ME7838G 70 kHz-220 GHz).

[0092] [Reflow heat resistance] The connector insulators obtained in Examples 1 to 3 and Comparative Examples 1 to 3 were left to stand for 7 days in an atmosphere of 85°C and 85% RH. After standing, the test pieces were heat-treated using a high-temperature observation device "SMT Scope Light SL-1" (manufactured by Sanyo Seiko Co., Ltd.) with the following reflow temperature profile, and then the appearance of the test pieces was observed and evaluated. Specifically, a test piece that showed at least one of warping, melting, and blisters was marked with "x," and a test piece that showed no warping, melting, or blisters was marked with "o." Reflow temperature profile: The temperature was raised from 25°C to 150°C over 60 seconds, then raised to 180°C over 80 seconds, and then raised to 280°C over 60 seconds, and held at 280°C for 10 seconds, followed by air cooling.

[0093] [Catalyst Preparation] Preparation of titanium catalyst components A mixture of 47.6 g (500 mmol) of anhydrous magnesium chloride, 250 mL of decane, and 234 mL (1.5 mol) of 2-ethylhexyl alcohol was heated at 130°C for 2 hours to form a homogeneous solution. The resulting homogeneous solution was cooled to room temperature (23°C) and then added dropwise over 1 hour to 2 L (18 mol) of titanium tetrachloride maintained at -20°C. After the addition, the mixture was heated to 90°C over 2 hours. Upon reaching 90°C, 11.4 mL (80 mmol) of ethyl benzoate was added and the mixture was maintained at the same temperature for 2 hours with stirring. After the 2-hour reaction, the mixture was allowed to stand and the supernatant was removed. Decane and hexane were added to the mixture, and the solid components were washed three times. They were then resuspended in 2 L of titanium tetrachloride and heated again at 90°C for 2 hours. After the reaction, the mixture was again allowed to stand with decane and hexane, and the supernatant was removed repeatedly. The mixture was thoroughly washed until no free titanium compounds were detected in the washes. The resulting suspension was dried under reduced pressure at room temperature for 6 hours to obtain a titanium catalyst component. The composition of the obtained titanium catalyst component was 4.0 mass % titanium, 56.0 mass % chlorine, 17.0 mass % magnesium, 10.4 mass % ethyl benzoate, and 12.6 mass % hydrocarbon solvent consisting of decane and hexane.

[0094] [Manufacturing Example 1] Preparation of copolymer (A) A 20 L stainless steel autoclave was charged with 8.0 kg of 3-methyl-1-butene, 0.6 kg of 1-decene, 50 g of triethylaluminum diluted with hexane to a concentration of 1 mol / L, and 4 g of the titanium catalyst component prepared in the above "Catalyst Preparation" section. The polymerization reaction was carried out at 70 °C for 4 hours. Hydrogen was continuously fed at a rate of 40 mL / min during the polymerization reaction. After 4 hours, 200 g of 3-methyl-1-butanol was injected to terminate the reaction and remove excess unreacted monomer. Next, 2 kg of normal heptane was introduced, and the mixture was stirred at 60 °C for 30 minutes. The solids were then filtered off using a pressure filter. This procedure was repeated twice, and then the solvent was changed from 2 kg of normal heptane to 3 kg of 2-propanol, and the same procedure was repeated twice. 7.7 kg of the obtained crude polymer was placed in a 50 L container equipped with a stirrer, followed by the addition of 8 kg of 1 mol / L hydrochloric acid and 16 kg of 2-propanol and stirring for 1 hour. The suspension was filtered under reduced pressure and washed with 10 kg of 2-propanol. The crude polymer was placed in a 50 L container equipped with a stirrer, followed by the addition of 20 kg of 2-propanol and stirring for 1 hour. The suspension was filtered under reduced pressure and washed with 10 kg of 2-propanol. The washed polymer obtained was dried under reduced pressure at 80°C for 2 days to obtain 3.2 kg of copolymer (A), a copolymer of 3-methyl-1-butene and 1-decene. The obtained copolymer (A) was subjected to the above-mentioned measurements and found to have a melting point of 286° C. Furthermore, the content of structural units derived from the comonomer 1-decene in the copolymer (A) was 1.1 mol %.

[0095] [Manufacturing Example 2] Preparation of copolymer (B) The same procedure as in Production Example 1 was carried out except that 0.6 kg of 1-decene was changed to 3.6 kg of 1-decene, thereby obtaining 2.8 kg of a copolymer (B) which was a copolymer of 3-methyl-1-butene and 1-decene. The obtained copolymer (B) was subjected to the above-mentioned measurements, and the melting point was 281°C and the melt viscosity was 99 Pa s. The content of structural units derived from the comonomer 1-decene in copolymer (B) was 6.4 mol%.

[0096] [Manufacturing Example 3] Production of homopolymer (C) The same procedure as in Production Example 1 was carried out except that 0.6 kg of 1-decene was not added, to obtain 3.3 kg of homopolymer (C), which was a homopolymer of 3-methyl-1-butene. The homopolymer (C) thus obtained was subjected to the above-mentioned measurements, and the melting point was found to be 305°C and the melt viscosity was 126 Pa·s.

[0097] [Manufacturing Example 4] Production of syndiotactic polystyrene To a reaction vessel, 3.2 L of toluene as a solvent, methylaluminoxane as a catalyst component in an amount such that the aluminum atomic weight was 0.13 mol, and 1.34 mmol of tetraethoxytitanium were added, followed by 1.5 kg of styrene. The temperature was then raised to 55°C, and the polymerization reaction was carried out for 2 hours. After completion of the reaction, the obtained crude product was washed with a sodium hydroxide / methanol mixed solution to decompose and remove the catalyst component. This was then dried to obtain 0.2 kg of polymer. The resulting polymer had a melting point of 270°C, a weight-average molecular weight of 180,000, and a syndiotacticity of 98%.

[0098] [Example 1] To 100 parts by mass of the copolymer (A) obtained in Production Example 1, 0.2 parts by mass of pentaerythritol tetrakis[3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate] ("AO-60", manufactured by ADEKA Corporation), 3,9-bis(2,6-di-t-butyl-4-methylphenoxy)-2,4,8,10-tetraoxa-3,9-diphosphaspiro[5.5]undecane ("PEP-36", manufactured by ADEKA Corporation) 0.2 parts by mass of 2,4-di-t-amyl-6-[1-(3,5-di-t-amyl-2-hydroxyphenyl)ethyl]phenyl acrylate ("Sumilizer GS", manufactured by Sumitomo Chemical Co., Ltd.), 0.1 parts by mass of 2,4-di-t-amyl-6-[1-(3,5-di-t-amyl-2-hydroxyphenyl)ethyl]phenyl acrylate ("Sumilizer GS", manufactured by Sumitomo Chemical Co., Ltd.), and 0.25 parts by mass of zinc stearate were dry-blended, and then melt-kneaded using a small kneader "Micro15 Compounder" (manufactured by DSMXplore Co., Ltd.) to obtain a pellet-shaped resin composition (M1). The melt viscosity of the resulting resin composition (M1) was 104 Pa s. The resulting resin composition (M1) was melt-kneaded for 4 minutes using a small injection molding machine, "Micro Injection Molding Machine 10cc" (manufactured by DSMXplore), under a nitrogen atmosphere at 50 rpm and a cylinder temperature of 320°C. It was then injection-molded at an injection pressure of 0.3 MPa, a mold retention time of 35 seconds, and a mold temperature of 180°C to obtain a connector insulator (P1) (a cylindrical shape with an outer diameter of 20 mm, a thickness of 10 mm, and an inner diameter of 2 mm through-hole). The resulting connector insulator (P1) was evaluated according to the above-mentioned evaluation methods for specific gravity, water absorption, dielectric constant and dielectric loss tangent, and reflow heat resistance. The results are shown in Table 1.

[0099] [Example 2] A connector insulator was produced in the same manner as in Example 1, except that the copolymer (B) obtained in Production Example 2 was used instead of the copolymer (A) in Example 1. In Example 2, the results of evaluation according to the above-mentioned evaluation method are shown in Table 1.

[0100] [Example 3] A connector insulator was produced in the same manner as in Example 1, except that the copolymer (C) obtained in Production Example 3 was used instead of the copolymer (A) in Example 1. In Example 3, the results of evaluation according to the above-mentioned evaluation method are shown in Table 1.

[0101] [Table 1]

[0102] [Comparative Example 1] A connector insulator (Q1) was obtained in the same manner as in Example 1, except that the syndiotactic polystyrene obtained in Production Example 4 was used instead of the copolymer (A) obtained in Production Example 1, and the cylinder temperature during melt-kneading and injection molding was changed to 280° C. and the mold temperature was changed to 80° C. The evaluation results of the obtained connector insulator (Q1) are shown in Table 2.

[0103] Comparative Example 2 A connector insulator (Q2) was obtained in the same manner as in Example 1, except that polymethylpentene "TPX (registered trademark) MX0020" (manufactured by Mitsui Chemicals, Inc.) was used instead of the resin composition (M1) in Example 1, and the cylinder temperature during melt-kneading and injection molding was changed to 260°C and the mold temperature was changed to 70°C. The evaluation results of the obtained connector insulator (Q2) are shown in Table 2.

[0104] Comparative Example 3 PTFE "Polyflon M12" (manufactured by Daikin Industries, Ltd.) was placed in a compression molding die with an inner diameter of 50φ and a length of 500 mm, and the die was compressed at room temperature under a molding pressure of 100 kg / cm using a compression molding machine (manufactured by Shinto Metal Industries Co., Ltd., AYS10). 2 The preform was compression molded with a pressure holding time of 10 minutes. The obtained preform was sintered in an electric furnace at 370°C and then cooled to room temperature to obtain a sintered body. This was cut into the shape described in Example 1 to obtain a connector insulator (Q3). The evaluation results of the obtained connector insulator (Q3) are shown in Table 2.

[0105] [Table 2]

[0106] As shown in the examples, the connector insulator containing the resin composition containing the 3-methyl-1-butene polymer of this embodiment has a low dielectric constant and a low dielectric loss tangent, and is suitable for reflow soldering. Therefore, the connector insulator of this embodiment is highly industrially useful.

Claims

1. A connector insulator containing a resin composition containing a 3-methyl-1-butene-based polymer.

2. The connector insulator according to claim 1, wherein the 3-methyl-1-butene-based polymer is at least one selected from the group consisting of a 3-methyl-1-butene homopolymer and a copolymer of 3-methyl-1-butene and ethylene or an α-olefin, and the α-olefin is an α-olefin having 3 to 20 carbon atoms.

3. The connector insulator according to claim 2, wherein the content ratio of the structural unit derived from the ethylene or α-olefin in the copolymer is more than 0 mol% and 10 mol% or less.

4. The connector insulator according to any one of claims 1 to 3, wherein the dielectric loss tangent at 10 kHz to 200 GHz is 0.001 or less.

5. The connector insulator according to any one of claims 1 to 3, wherein the melting point of the 3-methyl-1-butene-based polymer is 260 °C or higher.

6. The connector insulator according to any one of claims 1 to 3, wherein the resin composition contains an antioxidant.

7. The connector insulator according to claim 6, wherein the antioxidant contains at least one selected from the group consisting of a phenolic antioxidant and a phosphorus-based antioxidant.