Electrostatic capacitance measurement circuit module

Abstract

To provide an electrostatic capacitance measurement circuit module capable of reducing the noise influence more certainly.SOLUTION: An electrostatic capacitance measurement circuit module includes: a sensor electrode for input detection, which is provided on a wiring board; a sensor side shield electrode that shields the sensor electrode; a substrate side measurement terminal connected to the sensor electrode; a substrate side shield terminal connected to the sensor side shield electrode; a measurement integrated circuit having a circuit side measurement terminal connected to the substrate side measurement terminal and a circuit side shield terminal connected to the substrate side shield terminal, outputs a measurement signal from the circuit side measurement terminal, and outputs a shield signal with the same frequency and the same phase as the measurement signal from the circuit side shield terminal, the measurement integrated circuit being provided on the wiring board and configured to measure an electrostatic capacitance of the sensor electrode; and a circuit side shield electrode provided at a position facing the measurement integrated circuit on the wiring board and adjacent to the substrate side measurement terminal, and connected to the substrate side shield terminal.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present disclosure relates to a capacitance measurement circuit module for measuring capacitance. [Background technology]

[0002] Conventionally, there is a capacitive input device in which an IC (Integrated Circuit) is connected to a first mounting terminal and a second mounting terminal of an input panel via a flexible wiring board. A shield layer is formed on the wiring formed on the flexible wiring board connected to the input position detection electrode of the input panel, and a shield potential is applied to the shield layer to realize a state in which no parasitic capacitance occurs between the wiring and the shield layer (for example, see Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2011-028535 A Summary of the Invention [Problem to be solved by the invention]

[0004] However, conventional capacitive input devices do not have an active shield near the IC that transmits AC signals of the same frequency and phase as the sensor electrode, so there is a risk of noise being generated in the wiring around the IC due to parasitic capacitance between the IC and the wiring around the IC.

[0005] Therefore, an object of the present invention is to provide a capacitance measurement circuit module that can more reliably reduce the effects of noise. [Means for solving the problem]

[0006] a circuit side shield electrode provided on the wiring board for shielding the sensor electrode; a board side measurement terminal provided on the wiring board and connected to the sensor electrode; a board side shield terminal provided on the wiring board and connected to the sensor side shield electrode; a circuit side measurement terminal connected to the board side measurement terminal; and a circuit side shield terminal connected to the board side shield terminal, the measurement integrated circuit outputting a measurement signal from the circuit side measurement terminal and outputting a shield signal of the same frequency and phase as the measurement signal from the circuit side shield terminal, the measurement integrated circuit being provided on the wiring board and measuring the capacitance of the sensor electrode; and a circuit side shield electrode provided on the wiring board facing the measurement integrated circuit and adjacent to the board side measurement terminal, the measurement integrated circuit being connected to the board side shield terminal. Effect of the Invention

[0007] It is possible to provide a capacitance measurement circuit module that can more reliably reduce the effects of noise. [Brief description of the drawings]

[0008] [Figure 1] 2 is a diagram showing an example of a configuration of an L1 layer of the capacitance measuring circuit module according to the embodiment. FIG. [Diagram 2] 4 is a diagram showing an example of a configuration of an L2 layer of the capacitance measuring circuit module according to the embodiment; FIG. [Diagram 3] 2 is an enlarged view showing the configuration within an area A enclosed by a dashed rectangular line in FIG. 1. FIG. [Figure 4] 2 is a diagram showing an example of a planar configuration of a measurement IC of the capacitance measurement circuit module according to the embodiment; [Diagram 5] 2 is a diagram showing an example of a side configuration of a measurement IC of the capacitance measurement circuit module of the embodiment; FIG. [Figure 6] FIG. 2 is a diagram illustrating an example of a circuit configuration of a capacitance measurement circuit module according to an embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] Hereinafter, an embodiment to which the capacitance measurement circuit module of the present disclosure is applied will be described.

[0010] In the following, the XYZ coordinate system is defined and explained. The direction parallel to the X axis (X direction), the direction parallel to the Y axis (Y direction), and the direction parallel to the Z axis (Z direction) are mutually perpendicular. Furthermore, a planar view refers to a view on the XY plane. In the following, the length, width, thickness, etc. of each part may be shown exaggerated to make the configuration easier to understand.

[0011] <Embodiment> FIG. 1 is a diagram showing an example of the configuration of the L1 layer of the capacitance measurement circuit module 100 of the embodiment. The capacitance measurement circuit module 100 is, for example, a device that is installed in an input device in an elevator hall or elevator car that is installed in a store or facility and used by an unspecified number of users, a tablet-type input device, or an input unit of an ATM (Automatic Teller Machine), and measures the capacitance between the module and an object such as a user's hand. The capacitance measurement circuit module 100 may also be installed in an input unit of a cooking appliance that needs to be kept clean. The capacitance measurement circuit module 100 may also be installed in an input device in a center console of a vehicle, a tablet computer, a game machine, or the like that is used by individuals.

[0012] The capacitance measuring circuit module 100 includes a multi-layer substrate 50. The multi-layer substrate 50 is an example of a wiring substrate. The multi-layer substrate 50 has one or more insulating layers and a plurality of wiring layers. Here, as an example, a configuration in which the multi-layer substrate includes four wiring layers L1 to L4 and three insulating layers will be described. In FIG. 1, a measuring IC (Integrated Circuit) 160 is shown removed from the multi-layer substrate 50. In addition to the configuration of the L1 layer, FIG. 1 also shows a sensor electrode 110 and an active shield electrode 115 provided on the L4 layer. In the following, in addition to FIG. 1, FIG. 2 to FIG. 6 will be used for the description.

[0013] Fig. 2 is a diagram showing an example of the configuration of the L2 layer of the capacitance measuring circuit module 100. Fig. 2 shows an example of the configuration of the L2 layer of the capacitance measuring circuit module 100 located directly below the L1 layer portion shown in Fig. 1. Here, the configuration of the capacitance measuring circuit module 100 shown in Figs. 1 and 2 may be the configuration of a certain part of the entire capacitance measuring circuit module 100.

[0014] 3 is an enlarged view of the configuration within area A enclosed by a dashed rectangular line in FIG. 1. Area A is an area where measurement IC 160 is mounted on the L1 layer of multilayer substrate 50. In other words, area A is an area defined by a position facing measurement IC 160 on multilayer substrate 50. FIGS. 4 and 5 show an example of a planar configuration and a side configuration of measurement IC 160. Measurement IC 160 is an example of a measurement integrated circuit. Area A is a rectangular area corresponding to the four sides of measurement IC 160, which is rectangular in plan view.

[0015] In the following description, the four sides of the measurement IC 160 are distinguished as follows. The measurement IC 160 has a control side 160AC, a first measurement side 160A1, a second measurement side 160A2, and a third measurement side 160A3. The first measurement side 160A1, the second measurement side 160A2, and the third measurement side 160A3 are the three measurement sides of the four sides of the measurement IC 160 other than the control side 160AC. The control side 160AC is an end side extending in the X direction on the -Y direction side of the measurement IC 160. The first measurement side 160A1 is an end side extending in the Y direction on the +X direction side of the measurement IC 160. The second measurement side 160A2 is an end side extending in the X direction on the +Y direction side of the measurement IC 160. The third measurement side 160A3 is an end side extending in the Y direction on the -X direction side of the measurement IC 160.

[0016] In addition, for the area A having four sides corresponding to the four sides of the measurement IC 160, the four sides corresponding to the control side 160AC, the first measurement side 160A1, the second measurement side 160A2, and the third measurement side 160A3 are referred to as the control side AC, the first measurement side A1, the second measurement side A2, and the third measurement side A3, respectively. When the measurement IC 160 is placed in the area A, the control side 160AC, the first measurement side 160A1, the second measurement side 160A2, and the third measurement side 160A3 are located at the control side AC, the first measurement side A1, the second measurement side A2, and the third measurement side A3, respectively. In FIG. 1, the measurement IC 160 is shown shifted from the area A, but the following description will be given assuming that the measurement IC 160 is mounted in the area A.

[0017] <Configuration of Capacitance Measuring Circuit Module 100> The capacitance measurement circuit module 100 includes a multi-layer substrate 50, a sensor electrode 110, an active shield electrode 115, ground electrodes 120L1 and 120L2, active shield electrodes 130L1 and 130L2, a substrate-side terminal 140, a substrate-side terminal 150, and a measurement IC 160. The active shield electrode 115 is an example of a sensor-side shield electrode. The active shield electrodes 130L1 and 130L2 are examples of circuit-side shield electrodes.

[0018] <Multilayer board 50> As an example, the multilayer substrate 50 has three insulating layers and four wiring layers, L1 to L4 layers. FIG. 1 shows an insulating layer 51 of the three insulating layers, and FIG. 2 shows an insulating layer 52 of the three insulating layers. The L1 layer is provided on the -Z direction side of the insulating layer 51, and the L2 layer is provided between the insulating layers 51 and 52. The remaining insulating layer (not shown) is provided on the +Z direction surface of the L3 layer provided on the +Z direction surface of the insulating layer 52. The L4 layer is provided on the +Z direction surface of the remaining insulating layer (not shown). The L1 layer is located on the -Z direction surface of the multilayer substrate 50, the L2 layer and the L3 layer are inner layers of the multilayer substrate 50, and the L4 layer is located on the +Z direction surface of the multilayer substrate 50.

[0019] The sensor electrode 110, the active shield electrode 115, the ground electrodes 120L1 and 120L2, the active shield electrodes 130L1 and 130L2, the board-side terminal 140, and the board-side terminal 150 can be produced by patterning the metal layers L1 to L4 of the multilayer substrate 50. As an example of the metal layers, copper foil or the like can be used.

[0020] <Sensor electrode 110> The sensor electrode 110 is provided on the L4 layer, for example, and is a sensor electrode for detecting input to the capacitance measurement circuit module 100. The sensor electrode 110 is connected to the measurement IC 160 by a through-hole via and wiring that penetrates the insulating layers between the L1 layer to the L4 layer. The sensor electrode 110 is driven by a signal that includes an AC component with the same frequency and phase as the AC components included in the signals supplied to the active shield electrode 115 and the active shield electrodes 130L1 and 130L2.

[0021] As an example, the sensor electrode 110 is circular in a plan view. As an example, one sensor electrode 110 is shown in FIG. 1, but the capacitance measurement circuit module 100 may be configured to include two or more sensor electrodes 110. For example, when the capacitance measurement circuit module 100 is incorporated into an input device (operation unit) for selecting a stop floor installed in an elevator car, the capacitance measurement circuit module 100 may include sensor electrodes 110 equal to the number of floors of the building in which the elevator is installed. The capacitance measurement circuit module 100 may be configured to include at least one such sensor electrode 110. The capacitance measurement circuit module 100 measures the capacitance Crg between the sensor electrode 110 and the target object (hand H).

[0022] <Active shield electrode 115> The active shield electrode 115 is an electrode in the L4 layer that surrounds the sensor electrode 110 in a plan view. The active shield electrode 115 is made of a metal layer with no gaps. That is, the active shield electrode 115 is a metal layer that is formed without gaps on almost the entire surface of the L4 layer except for the portion where the sensor electrode 110 is provided. In other words, the active shield electrode 115 is formed so as to completely fill the portion of the L4 layer except for the portion where the multiple sensor electrodes 110 are provided.

[0023] The active shield electrode 115 is connected to the circuit-side shield terminal of the measurement IC 160 by through-hole vias and wiring that penetrate the insulating layers between the L1 to L4 layers, etc. The active shield electrode 115 is also connected to the active shield electrode 130L1 of the L1 layer by through-hole vias and wiring that penetrate the insulating layers between the L1 to L4 layers, etc., and is also connected to the active shield electrode 130L2 of the L2 layer by through-hole vias and wiring that penetrate the insulating layers between the L2 to L4 layers.

[0024] The active shield electrode 115 is driven by a signal containing an AC component of the same frequency and phase as the AC component contained in the signal supplied to the sensor electrode 110. The amplitude of the AC component of the signal supplied to the active shield electrode 115 is larger than the amplitude of the AC component of the signal supplied to the sensor electrode 110.

[0025] The active shield electrode 115 is provided to shield the multiple sensor electrodes 110 from noise and to suppress the influence of parasitic capacitance. The active shield electrode 115 is disposed near the multiple sensor electrodes 110 at a predetermined interval so as to be able to shield the multiple sensor electrodes 110 from noise mainly from a ground potential point such as the ground and to suppress the influence of parasitic capacitance between the multiple sensor electrodes 110 and the ground potential point.

[0026] <Ground electrode 120L1> 1, the ground electrode 120L1 is an electrode provided mainly in approximately half of the L1 layer on the -Y direction side. Most of the ground electrode 120L1 is provided on the -Y direction side of the region A in the Y direction. A part of the ground electrode 120L1 is provided inside and around the region A.

[0027] The ground electrode 120L1 is separated from other wirings and is connected to a ground (earth) in a power supply unit (not shown). A wiring 128 is provided insulated from the ground electrode 120L1 in a region where a portion of the ground electrode 120L1 on the -Y direction side of the region A is provided. A portion of the wiring 128 is connected to a substrate side terminal 140.

[0028] The ground electrode 120L1 is made of a metal layer with no gaps. That is, the ground electrode 120L1 is a metal layer formed without gaps on one surface in a portion avoiding other wiring, terminals, etc. In other words, the ground electrode 120L1 is formed so as to completely fill the portion excluding the portion where other wiring, terminals, etc. are provided.

[0029] The ground electrode 120L1 has a first ground electrode portion 121, a second ground electrode portion 122, a third ground electrode portion 123, and a fourth ground electrode portion 124 as portions provided inside and around the region A. The first ground electrode portion 121 extends in the X direction along the control side AC of the region A. The first ground electrode portion 121, the second ground electrode portion 122, the third ground electrode portion 123, and the fourth ground electrode portion 124 will be described later in detail.

[0030] 1, the ground electrode 120L1 includes a wiring 125 provided along the outer edge of the insulating layer 51 in the L1 layer. The wiring 125 extends from a corner in the +Y direction on the -X direction side of the ground electrode 120L1 along the outer edge of the insulating layer 51 to near a corner in the +Y direction on the +X direction side of the ground electrode 120L1 so as to surround the active shield electrode 130L1. Providing the wiring 125 makes it possible to take measures against static electricity.

[0031] <Ground electrode 120L2> The ground electrode 120L2 is an electrode provided in approximately half of the L2 layer on the -Y direction side as shown in Fig. 2. The shape of the ground electrode 120L2 in a plan view is approximately the same as the portion of the ground electrode 120L1 excluding the first ground electrode portion 121 to the fourth ground electrode portion 124 and the wiring 125. The ground electrode 120L2 is connected by a through-hole via penetrating the insulating layer 51 between the L1 layer and the L2 layer, and is connected to the ground (earth) in a power supply unit (not shown) in the same manner as the ground electrode 120L1.

[0032] <Active shield electrode 130L1> As shown in FIG. 1, the active shield electrode 130L1 is provided on the L1 layer, and is provided on substantially the entire portion of the L1 layer where the ground electrode 120L1 is not provided.

[0033] The active shield electrode 130L1 is connected to the circuit-side shield terminal of the measurement IC 160. The active shield electrode 130L1 is provided to reduce the effects of noise and parasitic capacitance in the substrate-side terminal 150, as well as to reduce the effects of noise and parasitic capacitance in wiring and the like included in the measurement IC 160.

[0034] As an example, the active shield electrode 130L1 is provided in a portion surrounding three sides of the region A in the +X direction, the +Y direction, and the -X direction in a plan view, and in a portion excluding the end portion of the region A in the -Y direction.

[0035] A portion of active shield electrode 130L1 that surrounds three sides of region A, the +X direction side, the +Y direction side, and the -X direction side, in a plan view, surrounds first measurement side A1, second measurement side A2, and third measurement side A3 of region A. First substrate side measurement terminals 151 to fourth substrate side measurement terminals 154 are provided at the positions of first measurement side A1, second measurement side A2, and third measurement side A3 of multilayer substrate 50, and first circuit side measurement terminals 161 to fourth circuit side measurement terminals 164 provided at first measurement side 160A1, second measurement side 160A2, and third measurement side 160A3 of measurement IC 160 are connected to them.

[0036] The first circuit side measurement terminals 161 are an example of a first circuit side measurement terminal group. The second circuit side measurement terminals 162 are an example of a second circuit side measurement terminal group. The third circuit side measurement terminals 163 are an example of a third circuit side measurement terminal group. The fourth circuit side measurement terminals 164 are an example of a fourth circuit side measurement terminal group.

[0037] The first substrate side measurement terminal 151 to the fourth substrate side measurement terminal 154 are connected to the sensor electrode 110 via the multilayer substrate 50, and therefore the first substrate side measurement terminal 151 to the fourth substrate side measurement terminal 154 and the first circuit side measurement terminal 161 to the fourth circuit side measurement terminal 164 transmit sensor signals obtained from the sensor electrode 110.

[0038] Of active shield electrode 130L1, the portion surrounding area A on three sides, the +X side, the +Y side, and the -X side in plan view, is provided to reduce noise from surrounding ground potential points in first substrate side measurement terminal 151 to fourth substrate side measurement terminal 154 and first circuit side measurement terminal 161 to fourth circuit side measurement terminal 164, and to reduce the influence of parasitic capacitance between the ground potential points.

[0039] Moreover, the active shield electrode 130L1 has a first shield section 131 to a fourth shield section 134 within the region A, the details of which will be described later.

[0040] <Active shield electrode 130L2> As shown in FIG. 2, the active shield electrode 130L2 is provided on substantially the entire portion of the L2 layer where the ground electrode 120L2 is not provided.

[0041] The active shield electrode 130L2 is connected to the circuit side shield terminal of the measurement IC 160. The active shield electrode 130L2 is provided to reduce the influence of noise from the sensor electrode 110 provided on the L4 layer and the driving IC of the sensor electrode 110 provided on the L4 layer. For example, the active shield electrode 130L2 may be provided at a position overlapping with either the sensor electrode 110 or the driving IC of the sensor electrode 110.

[0042] <Board side terminal 140> The board-side terminals 140 are a plurality of terminals arranged in the X direction along the control side AC of the region A. The board-side terminals 140 are surrounded by the first ground electrode portion 121. The circuit-side terminals 165 of the measurement IC 160 are connected to the board-side terminals 140. The circuit-side terminals 165 include a power supply terminal, an output terminal, a control terminal, and a circuit-side ground terminal. Therefore, the board-side terminals 140 have a power supply terminal, an input terminal, a control terminal, and a board-side ground terminal corresponding to the power supply terminal, the output terminal, the control terminal, and the circuit-side ground terminal of the circuit-side terminal 165. The power supply terminal, the input terminal, the control terminal, and the board-side ground terminal 140G of the board-side terminal 140 are connected to the power supply terminal, the output terminal, the control terminal, and the circuit-side ground terminal of the circuit-side terminal 165, respectively.

[0043] A sensor signal representing the capacitance value of the sensor electrode 110 is input to the input terminal of the board-side terminal 140. A control terminal of the board-side terminal 140 outputs a digital signal for controlling the measurement IC 160, and also receives a digital signal from the measurement IC 160. In addition, power is supplied from the multilayer substrate 50 to a power supply terminal of the board-side terminal 140, and a board-side ground terminal 140G of the board-side terminal 140 is connected to ground electrodes 120L1 and 120L2 of the multilayer substrate 50.

[0044] Such board-side terminal 140 is surrounded by a ground electrode 120L1, and the power terminal, input terminal, control terminal, and board-side ground terminal 140G of the board-side terminal 140 are protected from noise and other influences by the ground electrode 120L1.

[0045] <Board side terminal 150> 3, the board-side terminal 150 includes a first board-side measurement terminal 151 to a fourth board-side measurement terminal 154 for transmitting a sensor signal of the sensor electrode 110, board-side ground terminals 151G to 154G, and a board-side shield terminal 150AS. As an example, 16 of each of the first board-side measurement terminals 151 to 154 are provided. The first board-side measurement terminals 151 are an example of a first board-side measurement terminal group, and the second board-side measurement terminals 152 are an example of a second board-side measurement terminal group. The third board-side measurement terminals 153 are an example of a third board-side measurement terminal group, and the fourth board-side measurement terminals 154 are an example of a fourth board-side measurement terminal group.

[0046] Each of the 64 first to fourth substrate side measurement terminals 151 to 154 is connected to one sensor electrode 110 via the multi-layer substrate 50, for example. That is, the capacitance measuring circuit module 100 can be provided with a maximum of 64 sensor electrodes 110. When the number of sensor electrodes 110 included in the capacitance measuring circuit module 100 is less than 64, the sensor electrodes 110 are connected only to the first to fourth substrate side measurement terminals 151 to 154 corresponding to the number of sensor electrodes 110 among the 64 first to fourth substrate side measurement terminals 151 to 154, and the remaining first to fourth substrate side measurement terminals 151 to 154 are not used. Each of the 64 first to fourth substrate side measurement terminals 151 to 154 can be connected to a plurality of sensor electrodes 110 via a changeover switch. In the following, a connection relationship in the case where 64 sensor electrodes 110 are connected to the 64 first substrate side measurement terminals 151 to the 64 fourth substrate side measurement terminals 154 included in the capacitance measuring circuit module 100 will be described.

[0047] As shown in FIG. 3, the board-side terminals 150 are provided along the first measurement side A1 to the third measurement side A3 of the region A.

[0048] The board-side shield terminal 150AS is provided at the end of the first measurement side A1 on the -Y direction side. The board-side shield terminal 150AS is connected to the circuit-side shield terminal 160AS of the first measurement side 160A1 of the measurement IC 160.

[0049] The board-side terminal 150 adjacent to the board-side shield terminal 150AS on the -Y direction side is a dummy terminal with no connection destination. The board-side terminals 150 include several dummy terminals. The board-side terminal 150 adjacent to the board-side shield terminal 150AS on the +Y direction side is a power supply terminal. The power supply terminal is connected to the power supply terminal of the first measurement side 160A1 of the measurement IC 160.

[0050] The board-side ground terminal 151G is disposed adjacent to the power supply terminal adjacent to the board-side shield terminal 150AS on the +Y direction side. The board-side ground terminal 151G is connected to a ground (earth) in a power supply unit (not shown). The board-side ground terminal 151G is connected to a circuit-side ground terminal 161G of the first measurement side 160A1 of the measurement IC 160.

[0051] Sixteen first board-side measurement terminals 151 are arranged on the +Y-direction side of board-side ground terminal 151G. A board-side ground terminal 153G is provided adjacent to the +Y-direction side of first board-side measurement terminal 151 furthest on the +Y-direction side. The first board-side measurement terminals 151 are connected to the 16 first circuit-side measurement terminals 161 of first measurement side 160A1 of measurement IC 160. The board-side ground terminal 153G is connected to a circuit-side ground terminal 163G of first measurement side 160A1 of measurement IC 160.

[0052] Three of the sixteen second board-side measurement terminals 152 are arranged on the first measurement side A1 on the +Y-direction side of the board-side ground terminal 153G. The board-side terminal 150 adjacent to the +Y-direction side of the second board-side measurement terminal 152 furthest on the +Y-direction side on the first measurement side A1 is a dummy terminal with no connection destination. The three second board-side measurement terminals 152 are connected to the three second circuit-side measurement terminals 162 on the first measurement side 160A1 of the measurement IC 160.

[0053] The remaining 13 second substrate-side measurement terminals 152 are arranged from the +X direction side of the second measurement side A2. A substrate-side ground terminal 152G is provided adjacent to the -X direction side of the second substrate-side measurement terminal 152 closest to the -X direction. The 13 second substrate-side measurement terminals 152 are connected to the 13 second circuit-side measurement terminals 162 of the second measurement side 160A2 of the measurement IC 160. The substrate-side ground terminal 152G is connected to the circuit-side ground terminal 162G of the second measurement side 160A2 of the measurement IC 160.

[0054] Ten of the sixteen third board-side measurement terminals 153 are arranged on the second measurement side A2 on the -X direction side of the board-side ground terminal 152G. The board-side terminal 150 adjacent to the -X direction side of the third board-side measurement terminal 153 closest to the -X direction is a dummy terminal with no connection destination. The ten third board-side measurement terminals 153 are connected to the ten third circuit-side measurement terminals 163 on the second measurement side 160A2 of the measurement IC 160.

[0055] The remaining six of the third board-side measurement terminals 153 are arranged from the +Y direction side of the third measurement side A3. The board-side terminal 150 adjacent to the +Y direction side of the third board-side measurement terminal 153 closest to the +Y direction is a dummy terminal with no connection destination. In addition, a board-side ground terminal 154G is provided adjacent to the -Y direction side of the third board-side measurement terminal 153 closest to the -Y direction. The six third board-side measurement terminals 153 are connected to the six third circuit-side measurement terminals 163 of the third measurement side 160A3 of the measurement IC 160. The board-side ground terminal 154G is connected to the circuit-side ground terminal 164G of the third measurement side 160A3 of the measurement IC 160.

[0056] Sixteen fourth board-side measurement terminals 154 are arranged on the -Y direction side of board-side ground terminals 154G on the third measurement side A3. A first ground electrode portion 121 is provided adjacent to the -Y direction side of the fourth board-side measurement terminal 154 furthest on the -Y direction side. The 16 fourth board-side measurement terminals 154 are connected to 16 fourth circuit-side measurement terminals 164 on the third measurement side 160A3 of the measurement IC 160.

[0057] <Measurement IC160> 4, the measurement IC 160 has a control side 160AC and first to third measurement sides 160A1 to 160A3. The measurement IC 160 has a plurality of circuit side terminals 165 on the control side 160AC. The circuit side terminals 165 include a power supply terminal, an output terminal, a control terminal, and a circuit side ground terminal. Each circuit side terminal 165 is connected to a corresponding terminal of the board side terminal 140.

[0058] The measurement IC 160 has, on the first measurement side 160A1, a circuit-side shield terminal 160AS, a circuit-side ground terminal 161G, sixteen first circuit-side measurement terminals 161, a circuit-side ground terminal 163G, and three second circuit-side measurement terminals 162. The connection relationship of these to the multilayer substrate 50 is as described above. As shown in FIG. 5, the circuit-side shield terminal 160AS, the circuit-side ground terminal 161G, the first circuit-side measurement terminal 161, the circuit-side ground terminal 163G, and the second circuit-side measurement terminal 162 are bent toward the +Z direction midway along their extension from the upper surface side of the measurement IC 160 toward the +X direction, and the bent ends are connected to the multilayer substrate 50.

[0059] The measurement IC 160 has thirteen second circuit-side measurement terminals 162, a circuit-side ground terminal 162G, and ten third circuit-side measurement terminals 163 on the second measurement side 160A2. The connection relationship of these to the multilayer substrate 50 side is as described above. The shapes of the second circuit-side measurement terminals 162, the circuit-side ground terminal 162G, and the third circuit-side measurement terminal 163 on the second measurement side 160A2 viewed from the side are similar to the shapes of the circuit-side shield terminal 160AS, the circuit-side ground terminal 161G, the first circuit-side measurement terminal 161, the circuit-side ground terminal 163G, and the second circuit-side measurement terminal 162 on the first measurement side 160A1 shown in FIG.

[0060] The measurement IC 160 has, on the third measurement side 160A3, six third circuit-side measurement terminals 163, a circuit-side ground terminal 164G, and sixteen fourth circuit-side measurement terminals 164. The connection relationship of these to the multilayer substrate 50 is as described above. As shown in FIG. 5, the third circuit-side measurement terminals 163, the circuit-side ground terminal 164G, and the fourth circuit-side measurement terminals 164 are bent toward the +Z direction midway along their extension from the top surface side of the measurement IC 160 to the -X direction side, and the bent tips are connected to the multilayer substrate 50 side.

[0061] As an example, the measurement IC 160 is provided on the L1 layer. The measurement IC 160 is connected to the sensor electrode 110, the active shield electrode 115, and the active shield electrodes 130L1 and 130L2 via wiring, through-hole vias, and the like included in the multi-layer substrate 50.

[0062] Measurement IC 160 drives sensor electrode 110, active shield electrode 115, and active shield electrodes 130L1 and 130L2 by supplying them with measurement signals containing AC components of the same frequency and phase. The amplitude of the AC component of the signal supplied from measurement IC 160 to active shield electrode 115, active shield electrodes 130L1 and 130L2 is larger than the amplitude of the AC component of the signal supplied from measurement IC 160 to sensor electrode 110.

[0063] In addition, when the measurement IC 160 supplies a measurement signal including an AC component to the 64 sensor electrodes 110, the timing at which the measurement signal is output to each group of the first circuit side measurement terminal 161 to the fourth circuit side measurement terminal 164 is different, and the measurement signal is output at the same timing to the multiple first circuit side measurement terminals 161 to the fourth circuit side measurement terminals 164 included in each group.

[0064] The measurement IC 160 supplies signals including such AC components to the sensor electrode 110, the active shield electrode 115, and the active shield electrodes 130L1 and 130L2 to drive them, thereby shielding the multiple sensor electrodes 110 and the internal wiring of the measurement IC 160 from noise mainly from ground potential points such as the ground, and suppressing the effects of parasitic capacitance between the sensor electrodes 110 and the internal wiring of the measurement IC 160.

[0065] In this way, the measurement IC 160 shields the multiple sensor electrodes 110 and the internal wiring of the measurement IC 160 from noise mainly from a ground potential point such as the ground, and suppresses the influence of parasitic capacitance with the ground potential point. In this state, the measurement IC 160 determines how close a support such as an operator's hand has come to the sensor electrode 110 based on the capacitance of the sensor electrode 110, thereby determining the state of the operation input. The state of the operation input is, for example, a state in which the hand is in contact with the operation surface, a state in which the hand is somewhat close to the operation surface without touching it, or a state in which the hand is sufficiently separated from the operation surface.

[0066] <Circuit configuration of capacitance measurement circuit module 100> 6 is a diagram showing an example of a circuit configuration of the capacitance measurement circuit module 100. As shown in FIG. 6, the sensor electrode 110 and the active shield electrodes 115, 130L1, and 130L2 are connected to the measurement IC 160.

[0067] The measurement IC 160 includes a charge amplifier 171 , an AC signal source 172 , an amplitude adjustment unit 173 , an ADC (Analog to Digital Converter) 174 , a signal processing unit 175 , and a data processing unit 176 .

[0068] The AC signal source 172 outputs an AC signal to drive the active shield electrodes 115, 130L1, and 130L2. The active shield electrodes 115, 130L1, and 130L2 are electromagnetically coupled to the sensor electrode 110 and are also connected via a negative feedback circuit of the charge amplifier 171, so that the AC signal is also supplied to the sensor electrode 110. The sensor electrode 110 and the active shield electrodes 115, 130L1, and 130L2 are supplied with AC signals of the same frequency and phase. The amplitude of the AC component of the signal supplied to the sensor electrode 110 is smaller than the amplitude of the AC component of the signal supplied to the active shield electrode 115.

[0069] Charge amplifier 171 has a non-inverting input terminal (+) connected to the output terminal of amplitude adjustment unit 173, an inverting input terminal (-) connected to sensor electrode 110, and an output terminal connected to an input terminal of ADC 174. Charge amplifier 171 is a differential amplifier that amplifies the difference between the input to the non-inverting input terminal (+) and the input to the inverting input terminal (-) and outputs an output signal.

[0070] The amplitude adjustment unit 173 adjusts the current flowing from the active shield electrode 115 through the capacitance Crs to the sensor electrode 110 and the current flowing from the sensor electrode 110 through the parasitic capacitor Crgl to the ground so as to cancel each other out. That is, the amplitude is adjusted so that the drive current flowing through the sensor electrode 110 becomes zero in a state where the hand H, which is an object close to the sensor electrode 110, is not present (a state where the capacitance Crg is zero). The ADC 174 digitally converts the signal output from the charge amplifier 171 and outputs the digitalized signal to the signal processing unit 175. The signal processing unit 175 demodulates the output of the ADC 174 using a demodulation signal having the same frequency as the AC signal and outputs the demodulated signal to the data processing unit 176. The data processing unit 176 determines the presence or absence of an operation such as a touch on the sensor electrode 110 based on the output of the signal processing unit 175.

[0071] <Configurations of First Ground Electrode Portion 121 to Fourth Ground Electrode Portion 124> 1 and 3, the first ground electrode portion 121 extends in the X direction along the control side 160AC at a position facing the measurement IC 160 on the multilayer substrate 50. The first ground electrode portion 121 is provided with a board-side terminal 140. The board-side terminal 140 is connected to a circuit-side terminal 165 including a power terminal, an output terminal, a control terminal, and a circuit-side ground terminal of the measurement IC 160. The first ground electrode portion 121 is provided to reduce noise and the like around the board-side terminal 140 and the circuit-side terminal 165.

[0072] The second ground electrode portion 122 extends from the center in the X direction of the first ground electrode portion 121 in parallel to the first measurement side 160A1 and the third measurement side 160A3 and is connected to the board-side ground terminal 152G. The circuit-side ground terminal 162G is connected to the board-side ground terminal 152G. That is, the second ground electrode portion 122 extends from the center in the X direction of the first ground electrode portion 121 in parallel to the first measurement side 160A1 and the third measurement side 160A3 toward between the second circuit-side measurement terminal 162 and the third circuit-side measurement terminal 163 and is connected to the circuit-side ground terminal 162G between the second circuit-side measurement terminal 162 and the third circuit-side measurement terminal 163.

[0073] The third ground electrode portion 123 extends from the middle of the second ground electrode portion 122 in the +X direction in parallel to the control side 160AC and the second measurement side 160A2, and is connected to the board-side ground terminal 153G. The circuit-side ground terminal 163G is connected to the board-side ground terminal 153G. That is, the third ground electrode portion 123 extends from the middle of the second ground electrode portion 122 in the X direction in parallel to the control side 160AC and the second measurement side 160A2 toward between the first circuit-side measurement terminal 161 and the second circuit-side measurement terminal 162, and is connected to the circuit-side ground terminal 163G.

[0074] The fourth ground electrode portion 124 extends from the middle of the second ground electrode portion 122 toward the -X direction side in parallel to the control side 160AC and the second measurement side 160A2, and is connected to the board-side ground terminal 154G. That is, the fourth ground electrode portion 124 of the ground electrode 120L1 extends from the middle of the second ground electrode portion 122 toward between the third circuit-side measurement terminal 163 and the fourth circuit-side measurement terminal 164 in parallel to the control side 160AC and the second measurement side 160A2, and is connected to the circuit-side ground terminal 164G between the third circuit-side measurement terminal 163 and the fourth circuit-side measurement terminal 164 among the multiple circuit-side ground terminals.

[0075] <Configuration of First Shield Section 131 to Fourth Shield Section 134> The first to fourth shield parts 131 to 134 correspond to the first to fourth substrate side measurement terminals 151 to 154, respectively, and are arranged closer to the center of the measurement IC 160 than the first to fourth substrate side measurement terminals 151 to 154 in a plan view. The first to fourth shield parts 131 to 134 extend from a portion outside the region A of the active shield electrode 130L1 toward the inside of the region A, and are located within the region A. That is, the first to fourth shield parts 131 to 134 are located directly below the measurement IC 160. Of the internal circuits of the measurement IC 160, the output of the AC signal source 172, the input / output of the amplitude adjustment part 173, the input / output of the charge amplifier 171, and the input of the ADC 174 contain the same AC component as the AC component of the signal supplied to the sensor electrode 110. Therefore, the voltage applied to a part of the circuit inside the measurement IC 160 and the voltage applied to the first shield section 131 to the fourth shield section 134 contain the same AC component. The first shield section 131 to the fourth shield section 134 are provided to shield the wiring inside the measurement IC 160 and to suppress the influence of the parasitic capacitance between the measurement IC 160 and the ground potential point. Note that there are circuits inside the measurement IC 160 to which no AC component is applied. A weak current leaks from the first shield section 131 to the fourth shield section 134 through the parasitic capacitance to the circuit to which no AC component is applied. However, the operation of the circuit to which no AC component is applied does not change even if a weak current flows. In other words, the measurement IC 160 has a circuit whose measurement accuracy is improved by applying an AC voltage to the shield and a circuit that is not affected by the voltage applied to the shield. Overall, the measurement accuracy is improved by applying an AC voltage to the shield facing the measurement IC 160. Inside measurement IC 160, first ground electrode portion 121 to which no AC component is applied is disposed at a position facing a portion where only circuits to which no AC component is applied are disposed.

[0076] The first shield section 131 is provided between the 16 first substrate-side measurement terminals 151, the first ground electrode section 121, the second ground electrode section 122, and the third ground electrode section 123. The first shield section 131 is disposed at intervals between the 16 first substrate-side measurement terminals 151, the first ground electrode section 121, the second ground electrode section 122, and the third ground electrode section 123. The first shield section 131 is connected to the substrate-side shield terminal 150AS via a through-hole via (not shown), an active shield electrode 130L2 of the L2 layer, or the like.

[0077] The second shield section 132 is provided between the 16 second-substrate-side measurement terminals 152, the third ground electrode section 123, and the second ground electrode section 122, and is arranged at intervals between the 16 second-substrate-side measurement terminals 152, the third ground electrode section 123, and the second ground electrode section 122. The second shield section 132 is connected to the substrate-side shield terminal 150AS via a portion of the active shield electrode 130L1 outside the +X direction side of region A.

[0078] The third shield section 133 is provided between the 16 third substrate-side measurement terminals 153, the second ground electrode section 122, and the fourth ground electrode section 124, and is arranged at intervals between the 16 third substrate-side measurement terminals 153, the second ground electrode section 122, and the fourth ground electrode section 124. The third shield section 133 is connected to the substrate-side shield terminal 150AS via an outer portion on the −X direction side of region A of the active shield electrode 130L1, an outer portion on the +Y direction side, and an outer portion on the +X direction side.

[0079] The fourth shield section 134 is provided between the 16 fourth board-side measurement terminals 154, the first ground electrode section 121, the second ground electrode section 122, and the fourth ground electrode section 124. The fourth shield section 134 is disposed at intervals between the 16 fourth board-side measurement terminals 154, the first ground electrode section 121, the second ground electrode section 122, and the fourth ground electrode section 124. The fourth shield section 134 is connected to the board-side shield terminal 150AS via a through-hole via (not shown), the active shield electrode 130L2 of the L2 layer, etc.

[0080] <Effects> The capacitance measuring circuit module 100 includes a multilayer substrate 50, a sensor electrode 110 for input detection provided on the multilayer substrate 50, an active shield electrode 115 (sensor-side shield electrode) provided on the multilayer substrate 50 and shielding the sensor electrode 110, substrate-side measurement terminals (151 to 154) provided on the multilayer substrate 50 and connected to the sensor electrode 110, substrate-side shield terminals 150AS provided on the multilayer substrate 50 and connected to the active shield electrode 115 (sensor-side shield electrode), circuit-side measurement terminals (161 to 164) connected to the substrate-side measurement terminals (151 to 154), and a substrate-side shield terminal 150AS. The measurement IC 160 has a circuit-side shield terminal 160AS connected to the sensor electrode 110, outputs a measurement signal from the circuit-side measurement terminals (161-164), and outputs a shield signal of the same frequency and phase as the measurement signal from the circuit-side shield terminal 160AS, and is provided on the multilayer substrate 50 to measure the capacitance of the sensor electrode 110, and an active shield electrode 130L1 (circuit-side shield electrode) is provided on the multilayer substrate 50 at a position facing the measurement IC 160 and adjacent to the substrate-side measurement terminals (151-154), and is connected to the substrate-side shield terminal 150AS. Therefore, the active shield electrode 130L1 (circuit-side shield electrode) can reduce the effects of noise and parasitic capacitance at the substrate-side measurement terminals (151-154), and can also reduce the effects of noise and parasitic capacitance in wiring and the like included in the measurement IC 160.

[0081] Therefore, it is possible to provide the capacitance measuring circuit module 100 that can more reliably reduce the influence of noise. Also, it is possible to improve the measurement accuracy of the measurement IC 160 for the operation position of a support such as a hand.

[0082] Moreover, the measurement IC 160 further includes a ground electrode 120L1 provided on the multilayer substrate 50, and has a plurality of circuit-side ground terminals (161G-164G) connected to the ground electrode 120L1, and a plurality of circuit-side measurement terminals (161-164), and adjacent to each of the plurality of circuit-side measurement terminals (161-164), any one of the plurality of circuit-side measurement terminals (161-164) other than itself or any one of the plurality of circuit-side ground terminals (161G-164G) may be located. Therefore, since no power supply terminal or control terminal is provided at each of the circuit-side measurement terminals (161-164), crosstalk can be suppressed and measurement accuracy can be improved.

[0083] The measurement IC 160 has a rectangular shape having four sides in a plan view, and further includes a power supply terminal connected to a power supply, an output terminal for outputting a signal representing a capacitance value, and a control terminal for inputting or outputting a digital signal. Three of the four sides (first measurement side 160A1 to third measurement side 160A3) are provided with a plurality of circuit-side measurement terminals (161 to 164), a circuit-side shield terminal 160AS, and some of the circuit-side ground terminals (161G to 164G) among the plurality of circuit-side ground terminals (161G to 164G). A power supply terminal, an output terminal, a control terminal, and at least one circuit-side ground terminal (161G to 164G) of the multiple circuit-side ground terminals (161G to 164G) are provided on the control side 160AC other than three of the four measurement sides (first measurement side 160A1 to third measurement side 160A3), and the first ground electrode portion 121 of the ground electrode 120L1 may extend along the control side 160AC at a position facing the measurement IC 160 on the multilayer substrate 50. By providing the first ground electrode portion 121 along the control side 160AC on which the power supply terminal, the output terminal, the control terminal, and at least one circuit-side ground terminal are provided, the operation of the measurement IC 160 can be stabilized and the measurement accuracy can be improved.

[0084] The multiple circuit side measurement terminals (161-164) are divided into a first circuit side measurement terminal group (161), a second circuit side measurement terminal group (162), a third circuit side measurement terminal group (163), and a fourth circuit side measurement terminal group (164). The measurement IC 160 outputs measurement signals from the circuit side measurement terminals (161-164) at different timings for each of the first circuit side measurement terminal group (161), the second circuit side measurement terminal group (162), the third circuit side measurement terminal group (163), and the fourth circuit side measurement terminal group (164). 4) output measurement signals at the same timing, and the three measurement sides (first measurement side 160A1 to third measurement side 160A3) have a first measurement side 160A1 adjacent to the control side 160AC, a second measurement side 160A2 adjacent to the first measurement side 160A1, and a third measurement side 160A3 adjacent to the second measurement side 160A2 and the control side 160AC, and the first circuit side measurement terminal group (161) is provided on the first measurement side 160A1, the second circuit side measurement terminal group (162) is provided across the first measurement side 160A1 and the second measurement side 160A2, and the third circuit side measurement terminal group (163) is provided on the second measurement side 160A1. The fourth circuit side measurement terminal group (164) is provided on the third measurement side 160A3, the circuit side shield terminal 160AS is provided on the end of the first measurement side 160A1 on the control side 160AC side, and the multiple circuit side ground terminals (161G to 164G) are provided between the first circuit side measurement terminal group (161) and the second circuit side measurement terminal group (162), between the second circuit side measurement terminal group (162) and the third circuit side measurement terminal group (163), and between the third circuit side measurement terminal group (163) and the fourth circuit side measurement terminal group (164). The second ground electrode portion 122 of the ground electrode 120L1 extends from the first ground electrode portion 121 in parallel to the first measurement side 160A1 and the third measurement side 160A3 toward between the second circuit side measurement terminal group (162) and the third circuit side measurement terminal group (163) and is connected to a circuit side ground terminal 162G between the second circuit side measurement terminal group (162) and the third circuit side measurement terminal group (163) among the multiple circuit side ground terminals (161G to 164G). The third ground electrode portion 123 of the ground electrode 120L1 extends from the second ground electrode portion 122 toThe fourth ground electrode portion 124 of the ground electrode 120L1 extends parallel to the control side 160AC and the second measurement side 160A2 toward between the first circuit side measurement terminal group (161) and the second circuit side measurement terminal group (162) and is connected to a circuit side ground terminal 163G between the first circuit side measurement terminal group (161) and the second circuit side measurement terminal group (162) among the plurality of circuit side ground terminals (161G to 164G). The fourth ground electrode portion 124 of the ground electrode 120L1 extends parallel to the control side 160AC and the second measurement side 160A2 from the second ground electrode portion 122 to the third circuit side measurement terminal group (163G). The active shield electrode 130L1 (circuit-side shield electrode) may extend between the fixed terminal group (163) and the fourth circuit-side measurement terminal group (164) and be connected to a circuit-side ground terminal 164G between the third circuit-side measurement terminal group (163) and the fourth circuit-side measurement terminal group (164) among the plurality of circuit-side ground terminals (161G to 164G), and may be provided at a predetermined interval between the first ground electrode portion 121, the second ground electrode portion 122, the third ground electrode portion 123, and the fourth ground electrode portion 124. By providing the active shield electrode 130L1 (circuit-side shield electrode) between the first ground electrode portion 121 and the fourth ground electrode portion 124 in this manner, mutual influences between the first circuit-side measurement terminal group (161) to the fourth circuit-side measurement terminal group (164) can be suppressed, thereby reducing crosstalk. Therefore, it is possible to provide a capacitance measuring circuit module 100 that achieves both a reduction in the effects of noise and parasitic capacitance in the wiring included in the board side measuring terminals (151-154) and the measuring IC 160, and a reduction in crosstalk in the first circuit side measuring terminal group (161) to the fourth circuit side measuring terminal group (164).

[0085] The board-side measurement terminals (151-154) are divided into a first board-side measurement terminal group (151), a second board-side measurement terminal group (152), a third board-side measurement terminal group (153), and a fourth board-side measurement terminal group (154) corresponding to the first circuit-side measurement terminal group (161), the second circuit-side measurement terminal group (162), the third circuit-side measurement terminal group (163), and the fourth circuit-side measurement terminal group (164). The active shield electrode 130L1 (circuit-side shield electrode) is divided into a first ground electrode portion 121, a second ground electrode portion 122, a third ground electrode portion 123, and a fourth board-side measurement terminal group (154). The capacitance measuring circuit module 100 includes a first shield section 131, a second shield section 132, a third shield section 133, and a fourth shield section 134 that are provided at a predetermined interval between the ground electrode section 123 and the fourth ground electrode section 124, and the first shield section 131, the second shield section 132, the third shield section 133, and the fourth shield section 134 may be arranged corresponding to the first board-side measurement terminal group (151), the second board-side measurement terminal group (152), the third board-side measurement terminal group (153), and the fourth board-side measurement terminal group (154). Therefore, the first shield section 131 to the fourth shield section 134 can more effectively reduce the influence of noise and parasitic capacitance in the board-side measurement terminals (151 to 154) and wiring included in the measurement IC 160, and the like, thereby providing a capacitance measuring circuit module 100 with improved measurement accuracy.

[0086] The above describes an exemplary embodiment of a capacitance measurement circuit module of the present disclosure. However, the present disclosure is not limited to the specifically disclosed embodiment, and various modifications and variations are possible without departing from the scope of the claims. [Explanation of symbols]

[0087] 50 Multilayer board (example of wiring board) 51, 52 Insulating layer 100 Capacitance measurement circuit module 110 Sensor electrode 115 Active shield electrode (an example of a sensor-side shield electrode) 120L1, 120L2 Ground electrode 121 First ground electrode 122 Second ground electrode 123 Third ground electrode 124 Fourth ground electrode 125 Wiring 128 Wiring 130L1, 130L2 Active shield electrode (an example of a circuit side shield electrode) 131 First Shield Section 132 Second Shield Section 133 3rd Shield Section 134 4th Shield Section 140 Board side terminal 140G Board side ground terminal 150 Board side terminal 150AS Board side shield terminal 151 First board side measurement terminal (an example of the first board side measurement terminal group) 151G, 152G, 153G, 154G Board side ground terminal 152 Second board side measurement terminal (an example of the second board side measurement terminal group) 153 Third board side measurement terminal (an example of the third board side measurement terminal group) 154 4th board side measurement terminal (an example of the 4th board side measurement terminal group) 160 Measurement IC (an example of a measurement integrated circuit) 160A1 First measuring edge 160A2 Second measuring edge 160A3 Third measuring edge 160AC Control Side 160AS Circuit side shield terminal 161 First circuit side measurement terminal 161G, 162G, 163G, 164G Circuit side ground terminal 162 Second circuit side measurement terminal 163 3rd circuit side measurement terminal 164 4th circuit side measurement terminal 165 Circuit side terminal 171 Charge Amplifier 172 AC signal source 173 Amplitude adjustment section 174 ADC 175 Signal Processing Section 176 Data Processing Department

Claims

1. A wiring board having a sensor electrode for input detection, a sensor-side shield electrode for shielding the sensor electrode, a board-side measurement terminal connected to the sensor electrode, and a board-side shield terminal connected to the sensor-side shield electrode; a measurement integrated circuit having a circuit-side measurement terminal connected to the board-side measurement terminal and a circuit-side shield terminal connected to the board-side shield terminal, outputting a measurement signal from the circuit-side measurement terminal and outputting a shield signal having the same frequency and phase as the measurement signal from the circuit-side shield terminal, the measurement integrated circuit being provided on the wiring board and measuring the capacitance of the sensor electrode; a circuit-side shield electrode that is provided on the wiring board at a position facing the measurement integrated circuit and adjacent to the board-side measurement terminal, and that is connected to the board-side shield terminal; 1. A capacitance measurement circuit module comprising:

2. The wiring board further includes a ground electrode. the measurement integrated circuit has a plurality of circuit-side ground terminals connected to the ground electrode, and also has a plurality of the circuit-side measurement terminals; 2. The capacitance measurement circuit module of claim 1, wherein adjacent to each of the plurality of circuit-side measurement terminals is located one of the plurality of circuit-side measurement terminals other than the terminal itself, or one of the plurality of circuit-side ground terminals.

3. The measurement integrated circuit includes: It has a rectangular shape having four sides in a plan view, a power supply terminal connected to a power supply; an output terminal that outputs a signal representing the capacitance value; A control terminal for inputting or outputting digital signals and three measurement sides of the four sides are provided with the plurality of circuit-side measurement terminals, the circuit-side shield terminal, and some of the plurality of circuit-side ground terminals, the power supply terminal, the output terminal, the control terminal, and at least one circuit-side ground terminal among the plurality of circuit-side ground terminals are provided on a control side other than the three measurement sides among the four sides, 3. The capacitance measuring circuit module according to claim 2, wherein a first ground electrode portion of the ground electrode extends along the control side at a position on the wiring board facing the measurement integrated circuit.

4. the plurality of circuit-side measurement terminals are divided into a first circuit-side measurement terminal group, a second circuit-side measurement terminal group, a third circuit-side measurement terminal group, and a fourth circuit-side measurement terminal group; the measurement integrated circuit outputs the measurement signal from the circuit-side measurement terminals at different timings for each of the first, second, third, and fourth circuit-side measurement terminal groups, and outputs the measurement signal at the same timing to the plurality of circuit-side measurement terminals included in each group; the three measurement sides include a first measurement side adjacent to the control side, a second measurement side adjacent to the first measurement side, and a third measurement side adjacent to the second measurement side and the control side; the first circuit-side measurement terminal group is provided on the first measurement side, the second circuit-side measurement terminal group is provided across the first measurement side and the second measurement side, the third circuit-side measurement terminal group is provided across the second measurement side and the third measurement side, the fourth circuit-side measurement terminal group is provided on the third measurement side, the circuit-side shield terminal is provided at an end of the first measurement side on the control side, the plurality of circuit-side ground terminals are provided between the first circuit-side measurement terminal group and the second circuit-side measurement terminal group, between the second circuit-side measurement terminal group and the third circuit-side measurement terminal group, and between the third circuit-side measurement terminal group and the fourth circuit-side measurement terminal group; a second ground electrode portion of the ground electrode extends from the first ground electrode portion in parallel to the first measurement side and the third measurement side toward a position between the second circuit-side measurement terminal group and the third circuit-side measurement terminal group, and is connected to the circuit-side ground terminal between the second circuit-side measurement terminal group and the third circuit-side measurement terminal group among the plurality of circuit-side ground terminals; a third ground electrode portion of the ground electrode extends from the second ground electrode portion in parallel to the control side and the second measurement side toward between the first circuit-side measurement terminal group and the second circuit-side measurement terminal group, and is connected to the circuit-side ground terminal between the first circuit-side measurement terminal group and the second circuit-side measurement terminal group among the plurality of circuit-side ground terminals; a fourth ground electrode portion of the ground electrode extends from the second ground electrode portion in parallel to the control side and the second measurement side toward a position between the third group of circuit-side measurement terminals and the fourth group of circuit-side measurement terminals, and is connected to the circuit-side ground terminal between the third group of circuit-side measurement terminals and the fourth group of circuit-side measurement terminals among the plurality of circuit-side ground terminals; 4. The capacitance measuring circuit module according to claim 3, wherein the circuit-side shield electrode is provided at a predetermined interval between the first ground electrode portion, the second ground electrode portion, the third ground electrode portion, and the fourth ground electrode portion.

5. the substrate-side measurement terminals are divided into a first substrate-side measurement terminal group, a second substrate-side measurement terminal group, a third substrate-side measurement terminal group, and a fourth substrate-side measurement terminal group, corresponding to the first circuit-side measurement terminal group, the second circuit-side measurement terminal group, the third circuit-side measurement terminal group, and the fourth circuit-side measurement terminal group, the circuit-side shield electrode includes a first shield portion, a second shield portion, a third shield portion, and a fourth shield portion that are provided at predetermined intervals between the first ground electrode portion, the second ground electrode portion, the third ground electrode portion, and the fourth ground electrode portion, 5. The capacitance measuring circuit module of claim 4, wherein the first shield portion, the second shield portion, the third shield portion, and the fourth shield portion are arranged to correspond to the first substrate side measurement terminal group, the second substrate side measurement terminal group, the third substrate side measurement terminal group, and the fourth substrate side measurement terminal group.

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