Method for manufacturing connection structure and guide film

Abstract

To prevent a fine second component from tilting or falling over at a predetermined location of a first component, such as a substrate, larger than the fine second component, such as μLED, for example, when arranging the components using various mass transfer methods such as a stamp transfer method and a laser lift-off method.SOLUTION: A method for manufacturing a connection structure in which a second component, which is finer than a first component, is joined to a predetermined area of the first component, comprises: a step A of arranging a guide film having a through hole through which the second component can pass between the first component and the second component; a step B of passing the second component through the through hole of the guide film to place it in the predetermined area of the first component; and a step C of joining the second component to the predetermined area of the first component, where the joining of the second component to the predetermined area of the first component is performed via a connection material between the predetermined area of the first component and the second component.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a method for manufacturing a connection structure such as a μLED display, and a guide film used in the manufacturing method. [Background technology]

[0002] In recent years, as a next-generation display, μLED displays, in which self-luminous μLEDs (Micro Light-Emitting Diodes) are mass-transferred onto a display wiring board and arranged in a matrix, have been attracting attention as relatively small smartphone displays, relatively large TV displays, and signage displays. μLEDs usually have a pair of electrodes arranged on one side, and are minute rectangular electronic components measuring 10 to 30 μm square, with an extremely narrow fine pitch between the electrodes.

[0003] When manufacturing such a μLED display, it is required to quickly and precisely arrange a huge number of fine μLEDs at predetermined positions on the display wiring board. Methods that meet this requirement include the stamp transfer method (Patent Document 1, Figure 15) that uses an adhesive stamp tool (pickup head) and the laser lift-off method (Patent Document 1, Figure 16) that utilizes the ablation phenomenon caused by laser irradiation. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2022-151816 A Summary of the Invention [Problem to be solved by the invention]

[0005] However, in the case of the stamp transfer method, there was a concern that the μLEDs might be picked up in an inclined state when picked up by the stamp tool, and in the case of the laser lift-off method, there was a concern that the μLEDs might be transported in an inclined or even upside-down state when a laser is irradiated onto the μLEDs on the wafer to peel them off from the wafer and then transported to the display wiring board.

[0006] The object of the present invention is to solve the problems of the conventional technology and to prevent a minute second component, such as a μLED, from tilting or falling over when the minute second component is placed at a predetermined location on a larger first component, such as a substrate, by various mass transfer techniques including stamp transfer and laser lift-off. [Means for solving the problem]

[0007] The inventors discovered that when placing a fine second component such as a μLED at a predetermined location on a larger first component such as a substrate by various mass transfer techniques including stamp transfer and laser lift-off, in order to prevent the fine second component from tilting or falling over, it is effective to provide a guide between the first and second components that enables the second component to be placed while maintaining an intended positional relationship with the first component, and that a through hole provided in a film material can be used as such a guide, which led to the completion of the present invention.

[0008] That is, the present invention is a method for producing a connection structure in which a second component that is finer than a first component is joined to a predetermined region of the first component, the method comprising the steps of: (Process A) disposing a guide film between the first component and the second component, the guide film having a through hole through which the second component can pass; (Process B) A step of passing the second component through the through hole of the guide film and disposing it in a predetermined area of ​​the first component; and (Process C) Bonding the second component to the first component in a predetermined area. having The present invention provides a method for manufacturing a connection structure, in which a second component is joined to a predetermined region of a first component via a connection material between the predetermined region of the first component and the second component. The connection material includes a conductive material (e.g., a conductive paste) and an insulating material (e.g., a non-insulating fixing adhesive). These preferably have adhesive properties. The shape of the connection material is preferably a film.

[0009] In the method for manufacturing a connection structure of the present invention, prior to step B, it is preferable to align the through hole of the guide film and the second component with respect to a predetermined region of the first component.

[0010] In the method for manufacturing a connection structure of the present invention, it is preferable to use, as the first component to be inputted in step A, a component having an adhesive film laminated as a connection material over the entire surface of the predetermined region side, or a component having a piece-shaped adhesive film laminated as a connection material only in the predetermined region. It is also preferable to use, as the second component to be inputted in step A, a component having a piece-shaped adhesive film laminated as a connection material on the surface of the first component side. Instead of the piece-shaped adhesive film, a conductive paste (or a film of the conductive paste) may be disposed.

[0011] In the manufacturing method of the connection structure of the present invention, in step A, a guide film having a through hole through which the second component can pass is placed between the first component and the second component held on the transparent substrate, and in step B, a laser is irradiated to the second component from the transparent substrate side using a laser lift-off method to peel the second component from the transparent substrate, and the second component is passed through the through hole of the guide film and placed in a predetermined area of ​​the first component.

[0012] Furthermore, in the manufacturing method of the connection structure of the present invention, in step A, it is preferable that a second component held on one side of a carrier substrate is attached to a convex portion of a stamp material having a convex portion formed on one side of a base material by a stamp transfer method, a guide film having a through hole through which the second component can pass is arranged between the first component and the second component attached to the convex portion, and in step B, the second component is passed through the through hole of the guide film and arranged in a predetermined area of ​​the first component.

[0013] Furthermore, in the method for manufacturing a connection structure of the present invention, in step A, it is preferable that a second component held on one side of a carrier substrate is attached to an adhesive layer at the bottom of a through hole in a stamp material replacement guide film having a guide film having a through hole through which the second component can pass, an adhesive layer formed on the entire surface of one side of the guide film, and a pickup head replacement substrate laminated thereon, and in step B, the second component is pushed out into a predetermined area of ​​the first component, thereby passing the second component through the through hole of the guide film and placing it in a predetermined area of ​​the first member.

[0014] Furthermore, in the method for manufacturing a connection structure of the present invention, in step A, the second component held on one side of the carrier substrate is attached to an adhesive layer at the bottom of the through hole in a stamp material replacement guide film which comprises a guide film having a through hole through which the second component can pass, an adhesive layer formed on the entire surface of one side of the guide film, and a pickup head replacement substrate laminated thereon; and in step B, a laser is irradiated onto the second component from the light-transmitting pickup head replacement substrate side by a laser lift-off method to peel the second component from the adhesive layer, and the second component is passed through the through hole in the guide film and placed in a predetermined area of ​​the first component.

[0015] The present invention also provides a guide film having a through hole that serves as a guide when a second part, which is smaller than the first part, is transported to a predetermined region of a first part, the through hole having a diameter large enough to allow the second part to pass through. The opening shape of the through hole is preferably substantially the same as the shape of the second part to be passed through, and the thickness of the guide film is preferably 0.1 to 0.9 times the maximum thickness of the second part. Effect of the Invention

[0016] In the method for manufacturing a connection structure of the present invention, when a fine second component such as a μLED is placed at a predetermined location on a larger first component such as a substrate, a guide film having a through hole is placed between the first and second components as a guide that enables the second component to be placed while maintaining an intended positional relationship with respect to the first component. Therefore, the fine second component can be placed on the first component without tilting or falling over. [Brief description of the drawings]

[0017] [Figure 1] FIG. 1 is a process explanatory diagram of a manufacturing method (basic embodiment) of a connection structure of the present invention. [Diagram 2] FIG. 2 is a process explanatory diagram of a manufacturing method (basic embodiment) of the connection structure of the present invention. [Diagram 3] FIG. 3 is a process explanatory diagram of a manufacturing method (basic aspect) of the connection structure of the present invention. [Figure 4] FIG. 4 is a process explanatory diagram of a manufacturing method for a connection structure of the present invention (modified embodiment 1). [Diagram 5] FIG. 5 is a process explanatory diagram of a manufacturing method for a connection structure of the present invention (modified embodiment 1). [Figure 6] FIG. 6 is a process explanatory diagram of a manufacturing method for a connection structure of the present invention (modified embodiment 1). [Figure 7A] FIG. 7A is a process explanatory diagram of a manufacturing method for a connection structure of the present invention (modified embodiment 2). [Figure 7B]FIG. 7B is a process explanatory diagram of the manufacturing method of the connection structure of the present invention (modified embodiment 2). [Figure 8] FIG. 8 is a process explanatory diagram of a manufacturing method for a connection structure of the present invention (modified embodiment 2). [Figure 9] FIG. 9 is a process explanatory diagram of a manufacturing method for a connection structure of the present invention (modified embodiment 2). [Figure 10A] FIG. 10A is a process explanatory diagram of a manufacturing method for a connection structure of the present invention (third modified embodiment). [Figure 10B] FIG. 10B is a process explanatory diagram of the manufacturing method of the connection structure of the present invention (third modified embodiment). [Figure 11] FIG. 11 is a process explanatory diagram of a manufacturing method for a connection structure of the present invention (third modified embodiment). [Figure 12] FIG. 12 is a process explanatory diagram of a manufacturing method for a connection structure of the present invention (third modified embodiment). [Figure 13A] FIG. 13A is a process explanatory diagram of a manufacturing method for a connection structure of the present invention (variant embodiment 4). [Figure 13B] FIG. 13B is a process explanatory diagram of the manufacturing method of the connection structure of the present invention (variant embodiment 4). [Figure 14] FIG. 14 is a process explanatory diagram of a manufacturing method for a connection structure of the present invention (variant embodiment 4). [Figure 15] FIG. 15 is a process explanatory diagram of a manufacturing method for a connection structure of the present invention (variant embodiment 4). DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0018] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

[0019] <Method of manufacturing connection structure (basic aspect)> The present invention relates to a method for producing a connection structure in which a second component that is finer than the first component is joined to a predetermined region of a first component, and includes steps A to C. Each step will be described below.

[0020] (Process A) 1, step A is a step of arranging a guide film 3 having a through hole th through which the second component 2 can pass between a first component 1 and a second component 2 that have been prepared in advance. When the second component 2 passes through the through hole th of the guide film 3, the inclination of the second component 2 is corrected, and it becomes possible to arrange the second component 2 in an appropriate orientation with respect to the first component 1. In addition, the second component 2 preferably has a pair of electrodes 2a formed on one side opposite to the substrate 4 that holds the second component 2 so as to enable flip-chip mounting.

[0021] (First part) The first component 1 is a member on which a fine second component 2 is mounted, and has a flat surface on which the second component 2 can be placed. Usually, the surface of the first component 1 on the second component side is provided with pads or bump-shaped electrodes 1a for flip-chip mounting the second component 2. The region including such electrodes 1a becomes the predetermined region 5 of the first component 1. There is no particular limitation on such first component 1 as long as it is suitable for mounting, and a known rigid wiring board, flexible wiring board, etc. can be used. In particular, when the connection structure is applied to display applications, a glass wiring board, a plastic wiring board, etc. that exhibit light transparency can be used. In addition, the electrode 1a can be formed from a metal such as copper, aluminum, or gold, or a metal oxide such as ITO. In particular, an ITO electrode that exhibits light transparency can be preferably used.

[0022] (2nd part) The second component 2 is a minute component, and can be exemplified by an electronic component having a maximum length of 10 μm to 200 μm, but there is no particular restriction on the planar or three-dimensional shape. For example, the second component 2 is preferably a rectangular electronic component having a side of about 10 μm to 200 μm, and specifically, a micro LED having a side of 10 μm to 50 μm or a mini LED having a side of 100 μm to 200 μm can be preferably exemplified. Usually, the second component 2 is provided with electrodes corresponding to at least some of the electrodes of the first component 1.

[0023] The electrodes of the first component 1 and the corresponding electrodes of the second component 2 may be fixed in direct contact with each other using a connecting material described later, or when the connecting material contains conductive particles, the electrodes are bonded and electrically connected by sandwiching the conductive particles of the connecting material between them to obtain a connection structure. Known conductive materials or insulating materials can be used as the connecting material, and these materials are preferably adhesive and preferably in the form of a film. Such connecting materials will be described later.

[0024] The second component 2 is usually held on a substrate 4 (e.g., a silicone adhesive substrate, a transparent substrate, a carrier substrate, a semiconductor substrate, etc.), however, when the second component 2 is handled manually or by a robotic hand, it is conceivable that such a substrate 4 is not present.

[0025] (Guide film) The guide film 3 has through holes th as guides that enable the second component 2, such as a μLED, to be placed between the first component 1 and the second component 2 while maintaining an intended positional relationship with respect to the first component 1 when placing the fine second component 2, such as a μLED, in a predetermined region 5 of a first component 1, such as a larger substrate. Therefore, the fine second component 2 can be transferred to the first component 1 without tilting or falling. Such a guide film 3 is a film material, for example, a metal film material such as nickel or stainless steel, or a resin film material such as high-density polyethylene, poly(meth)acrylate, polystyrene, polyurethane, polyamide, or polyimide, in which through holes th are formed as guides. The positions of the through holes th in the film material correspond to the predetermined region 5 of the first component 1, and are usually positions corresponding to the electrodes 1a of the first component 1, and the number of through holes formed corresponds to the number of second components 2 to be placed on the first component 1.

[0026] The opening shape of the through hole th functioning as a guide can adopt various shapes that allow the second part 2 to pass through, but it is preferable that it is approximately the same as the outer shape of the second part 2. For example, when the shape of the second part 2 is rectangular, it is preferable that the opening shape of the through hole th is also rectangular. This is because the influence of the shape of the second part 2 can be reduced. In addition, if the opening shape of the through hole th is made circular, it is possible to increase the applicability to second parts 2 of different shapes. In addition, the hole diameter of the through hole th is a size that allows the second part to pass through. It can be appropriately determined in consideration of the shape and maximum thickness of the second part. It may be the same as the film thickness of the guide film. Unnecessary contact may be reduced by making it smaller than the film thickness, and position control may be more accurate by making it larger than the film thickness. This is to function as a guide for the second part 2. The film thickness of the guide film 3 is preferably 0.1 to 0.9 times, more preferably 0.2 to 0.7 times, the maximum thickness of the second part 2.

[0027] Prior to step B, it is preferable to align the through hole th of the guide film 3 with the second component 2 relative to a predetermined region of the first component 1. The alignment can be performed by a conventional method.

[0028] (Process B) As shown in FIG. 2, in the process B, the second component 2 is passed through the through hole th of the guide film 3 and placed in the predetermined region 5 of the first component 1. During this placement, a connecting material 6 made of a known material is present between the first component 1 and the second component 2. This connecting material 6 is used to bring the first component 1 and the second component 2 into close contact with each other and join them during the joining process C. Therefore, as long as the connecting material 6 exists between the first component 1 and the second component 2 until the joining process, it may be laminated or disposed on the surface of the first component 1 facing the second component 2, or on the surface of the second component 2 facing the first component 1, or it may be used as a single body (for example, a film) separated from both components. For example, the first component 1 to be input in the process A may have an adhesive film or adhesive paste laminated or disposed as the connecting material 6 on the entire surface of the predetermined region 5 side, and the first component 1 to be input in the process A may have an individual piece of adhesive film or adhesive paste laminated or disposed as the connecting material 6 only in the predetermined region 5. Alternatively, the second component 2 to be input in process A may have a piece of adhesive film or adhesive paste laminated or disposed on the surface of the first component 1 as the connecting material 6. When the connecting material is used in the form of a piece, it is possible to avoid disposing the connecting material on the guide film 3 or the through hole portions that do not require the connecting material, thereby suppressing the occurrence of contamination or pollution.

[0029] Furthermore, when the second components 2 are passed through the through holes th of the guide film 3, the second components 2 may be passed one by one, or multiple components may be passed at once. In this case, it is preferable to have a one-to-one correspondence between the second components 2 and the through holes th. This is to make it easier to ensure the guide function of the guide film 3. Note that a known mass transfer method (e.g., stamp transfer method, laser lift-off method, etc.) employed in mounting μLEDs can be used as a method for passing multiple components at once.

[0030] (Connecting material 6) The connecting material 6 can be appropriately selected from known conductive materials and insulating materials. The connecting material 6 preferably has adhesive properties. The form of the connecting material 6 is not particularly limited, and may be a film, a paste, or a liquid. From the viewpoint of installing the connecting material 6 in minute pieces by applying the laser lift-off method, a film is preferable. Specifically, in known μLED displays, a film-like, paste-like, or liquid-like conductive material or insulating material used when mounting μLEDs on a display substrate can be appropriately used according to the purpose. As the conductive material, for example, a conductive adhesive film, an anisotropic conductive adhesive film, or a conductive adhesive paste can be appropriately used, and as the insulating material, an insulating adhesive film, an insulating adhesive paste, etc. can be appropriately used. As the resin composition that is the base of these connecting materials, a thermosetting resin composition can be formed. Such a thermosetting resin composition preferably contains a rubber component, a film-forming resin, a thermosetting resin, a thermosetting agent, and an inorganic filler.

[0031] *Rubber component The rubber component contained in the thermosetting resin composition is a component for imparting cushioning properties (shock absorption properties) to the connecting material, and is not particularly limited as long as it is an elastomer with good cushioning properties. Specific examples include acrylic rubber, silicone rubber, butadiene rubber, and polyurethane resin (polyurethane-based elastomer). Among these, it is preferable to use one or more selected from acrylic rubber and silicone rubber. The content of the rubber component is preferably 1 part by mass or more and 20 parts by mass or less, more preferably 2 parts by mass or more and 10 parts by mass or less, relative to 100 parts by mass of the total of the rubber component, the film-forming resin, the thermosetting resin, the thermosetting agent, and the inorganic filler.

[0032] *Film forming resin Examples of the film-forming resin include various resins such as phenoxy resin, polyester resin, polyurethane resin, polyester urethane resin, acrylic resin, polyimide resin, butyral resin, etc., preferably having a weight average molecular weight of about 10,000 to 80,000 from the viewpoint of film-forming properties, and these may be used alone or in combination of two or more. Among these, it is preferable to use phenoxy resin from the viewpoint of film formation state, connection reliability, etc. The content of the film-forming resin is preferably 20 parts by mass or more and 50 parts by mass or less, more preferably 25 parts by mass or more and 45 parts by mass or less, and even more preferably 35 parts by mass or more and 45 parts by mass or less, relative to 100 parts by mass of the total of the rubber component, the film-forming resin, the thermosetting resin, the thermosetting agent, and the inorganic filler.

[0033] *Thermosetting resin Examples of the thermosetting resin include epoxy compounds and (meth)acrylate compounds, and epoxy compounds are particularly preferred. These compounds may be monomers, oligomers, or polymers. The content of the thermosetting resin is preferably 10 parts by mass or more and 50 parts by mass or less, more preferably 20 parts by mass or more and 40 parts by mass or less, and even more preferably 25 parts by mass or more and 35 parts by mass or less, relative to 100 parts by mass of the total of the rubber component, the film-forming resin, the thermosetting resin, the thermosetting agent, and the inorganic filler.

[0034] The epoxy compound that can be used as the thermosetting resin is not particularly limited as long as it is an epoxy compound having one or more epoxy groups in the molecule, and may be, for example, a bisphenol A type epoxy resin, a bisphenol F type epoxy resin, or a urethane-modified epoxy resin. Among these, a high-purity bisphenol A type epoxy resin can be preferably used. A specific example of a high-purity bisphenol A type epoxy resin is, for example, the product name "YL980" manufactured by Mitsubishi Chemical Corporation. When an epoxy compound is used as the thermosetting resin, the content of the epoxy compound is preferably 30 parts by mass or more and 60 parts by mass or less, more preferably 35 parts by mass or more and 55 parts by mass or less, and even more preferably 35 parts by mass or more and 45 parts by mass or less, relative to 100 parts by mass of the total of the rubber component, the film-forming resin, the thermosetting resin, the thermosetting agent, and the inorganic filler.

[0035] *Heat curing agent The thermosetting agent is selected according to the thermosetting resin. For example, when the thermosetting resin is an epoxy compound, a thermal anionic polymerization initiator or a thermal cationic polymerization initiator can be preferably selected, and a thermal cationic polymerization initiator that can suppress the curing reaction caused by laser light and rapidly cure by heat can be more preferably selected. The content of the thermosetting agent can be determined according to the type of the thermosetting agent and the type of the thermosetting resin. The content of the thermosetting agent is preferably 1 part by mass or more and 10 parts by mass or less, more preferably 2 parts by mass or more and 8 parts by mass or less, and even more preferably 3 parts by mass or more and 6 parts by mass or less, based on 100 parts by mass of the total of the rubber component, the film-forming resin, the thermosetting resin, the thermosetting agent, and the inorganic filler.

[0036] In addition, the thermal cationic polymerization initiator preferably applicable to the epoxy compound is one that generates an acid capable of cationic polymerization of a cationic polymerization type compound by heat, and known iodonium salts, sulfonium salts, phosphonium salts, ferrocenes, etc. can be used. Among these, aromatic sulfonium salts that show good latency against temperature can be preferably used. A specific example of an aromatic sulfonium salt-based polymerization initiator is "San-Aid SI-60L" manufactured by Sanshin Chemical Industry Co., Ltd. The content of such a thermal cationic polymerization initiator is preferably 1 part by mass or more and 15 parts by mass or less, more preferably 1 part by mass or more and 10 parts by mass or less, and even more preferably 3 parts by mass or more and 8 parts by mass or less, based on 100 parts by mass of the total of the rubber component, the film-forming resin, the thermosetting resin, the thermosetting agent, and the inorganic filler.

[0037] *Inorganic filler The inorganic filler in the thermosetting resin composition is used for the purpose of adjusting the durometer A hardness of the connecting material, the storage modulus at a frequency of 200 Hz, and the storage modulus after curing, and may be silica, talc, titanium oxide, calcium carbonate, magnesium oxide, silane coupling agents, fillers, softeners, colorants, flame retardants, thixotropic agents, etc. The inorganic fillers may be used alone or in combination of two or more kinds.

[0038] The content of the inorganic filler is preferably 1 to 20 parts by mass, more preferably 5 to 15 parts by mass, and even more preferably 8 to 12 parts by mass, per 100 parts by mass of the total of the rubber component, the film-forming resin, the thermosetting resin, the thermosetting agent, and the inorganic filler. In particular, when the content of the rubber component is 2 to 10 parts by mass, per 100 parts by mass of the total of the rubber component, the film-forming resin, the thermosetting resin, the thermosetting agent, and the inorganic filler, by setting the content of the inorganic filler to 8 to 12 parts by mass, the desired durometer A hardness, storage modulus at a frequency of 200 Hz, and storage modulus after curing can be easily achieved.

[0039] (Process C) 3, step C is a step of bonding the second component 2 to the predetermined region 5 of the first component 1. The bonding of the second component 2 to the predetermined region 5 of the first component 1 can be performed by employing a known bonding method such as thermocompression bonding using a heat tool or ultrasonic bonding using an ultrasonic vibrator, with a connecting material 6 interposed between the predetermined region 5 of the first component 1 and the second component 2.

[0040] <Modification 1 of the manufacturing method of the connection structure> The "first modified embodiment" is characterized in that in step A, a guide film having a through hole through which the second part can pass is disposed between the first part and the second part held on the transparent substrate, and the second part is transferred to the first part by a laser lift-off method. Specifically, it has the following steps A1, B1, and C1 corresponding to steps A, B, and C.

[0041] (Process A1) As shown in FIG. 4, step A1 is a step of arranging a guide film 3 having a through hole th through which the second component 20 can pass between a first component 1 prepared in advance and a second component 20 held on a transparent substrate 41. When the second component 20 passes through the through hole th of the guide film 3, the inclination of the second component 20 is corrected, and it becomes possible to arrange the second component 20 in an appropriate direction with respect to the first component 1. The transparent substrate 41 is a material that transmits the laser used in the laser lift-off method, and can be a glass substrate, a quartz substrate, a plastic substrate, or the like. In the first modified embodiment, the electrode 20a of the second component 20 is arranged so as to be located on the opposite side to the transparent substrate 41. This is to enable flip-chip mounting.

[0042] (Process B1) As shown in FIG. 5, in step B1, a known laser lift-off method is used to irradiate the second component 20 from the transparent substrate 41 side with a laser L to peel the second component 20 from the transparent substrate 41, and the second component 20 is placed (transferred) through the through hole th of the guide film 3 to a predetermined region 5 of the first component 1. During this placement, a connecting material 6 made of a known adhesive material is present between the first component 1 and the second component 20. This connecting material 6 is used to bond the first component 1 and the second component 20 together during bonding in step C1. As long as it is present between the first component 1 and the second component 20, it may be laminated or disposed on the surface of the first component 1 on the second component 20 side, or on the surface of the second component 20 on the first component 1 side, or it may be used as a single unit (for example, a film) separated from both. For example, the first component 1 to be input to step A1 may have an adhesive film or adhesive paste laminated or disposed as the connecting material 6 over the entire surface of the predetermined region 5, or the first component 1 to be input to step A1 may have an individual piece of adhesive film or adhesive paste laminated or disposed as the connecting material 6 only over the predetermined region 5. Alternatively, the second component 20 to be input to step A1 may have an individual piece of adhesive film or adhesive paste laminated or disposed as the connecting material 6 over the surface of the first component 1. When the connecting material is used in the form of individual pieces, it is possible to avoid disposing the connecting material on the guide film 3 or the through hole where the connecting material is not required, and thus it is possible to suppress the occurrence of contamination or pollution.

[0043] (Process C1) 6, step C1 is a step of bonding the second component 20 to the predetermined region 5 of the first component 1. The bonding of the second component 20 to the predetermined region 5 of the first component 1 can be performed by employing a known bonding method such as thermocompression bonding using a heat tool or ultrasonic bonding using an ultrasonic vibrator, with a connecting material 6 between the predetermined region 5 of the first component 1 and the second component 20.

[0044] <Modification of the manufacturing method of the connection structure: 2> In "Modification 2," in step A, a second component held on one side of a carrier substrate is attached to a convex portion of a stamp material having a convex portion formed on one side of a base material by a stamp transfer method, a guide film having a through hole through which the second component can pass is disposed between the first component and the second component attached to the convex portion, and in step B, the second component is passed through the through hole of the guide film and disposed in a predetermined area of ​​the first component. Specifically, the method has the following steps A2, B2, and C2 corresponding to steps A, B, and C.

[0045] (Process A2) In step A2, as shown in FIG. 7A, the second component 21 held on one side of the carrier substrate 42 is attached to the protruding portion 72 of a stamp material 70 having a protruding portion 72 formed on one side of a base substrate 71 by a stamp transfer method. In other words, the second component 21 is picked up by the protruding portion 72 of the stamp material 70, and as shown in FIG. 7B, a guide film 3 having a through hole th through which the second component 21 can pass is arranged between the first component 1 and the second component 21 attached to the protruding portion 72. When the second component 21 passes through the through hole th of the guide film 3, the inclination of the second component 21 is corrected, and the second component 21 can be arranged in an appropriate direction relative to the first component 1. As the carrier substrate, a carrier substrate used in the manufacture of μLEDs can be appropriately used. As the stamp material 70, a known stamp material, for example, one formed from a silicone resin having adhesiveness, can be used. In addition, in the second modified embodiment, the electrode 21a of the second component 21 is arranged so as to be located on the carrier substrate 42 side. This is to enable flip chip mounting when the stamp is transferred.

[0046] (Process B2) As shown in FIG. 8, the process B2 is a process in which the second component 21 is passed through the through hole th of the guide film 3 and placed in the predetermined region 5 of the first component 1. During this placement, a connecting material 6 made of a known material is present between the first component 1 and the second component 21. This connecting material 6 is used to bring the first component 1 and the second component 21 into close contact with each other and join them during the joining process C2. Therefore, as long as the connecting material 6 exists between the first component 1 and the second component 21, it may be laminated or disposed on the surface of the first component 21 side of the first component 1, or on the surface of the second component 21 side of the first component 1, or it may be used as a single body (for example, a film) separated from both. For example, the first component 1 to be inputted in the process A2 may have an adhesive film or adhesive paste laminated or disposed as the connecting material 6 on the entire surface of the predetermined region 5 side, and the first component 1 to be inputted in the process A2 may have an individual piece of adhesive film or adhesive paste laminated or disposed as the connecting material 6 only in the predetermined region 5. Alternatively, the second component 21 to be input in step A2 may have a piece of adhesive film or adhesive paste laminated or disposed on the surface of the first component side as the connecting material 6. When the connecting material is used in the form of pieces, it is possible to avoid disposing the connecting material on the guide film 3 or the through hole portions that do not require the connecting material, thereby suppressing the occurrence of contamination or pollution.

[0047] (Process C2) 9, step C2 is a step of bonding the second component 21 to the predetermined region 5 of the first component 1. The bonding of the second component 21 to the predetermined region 5 of the first component 1 can be performed by employing a known bonding method such as thermocompression bonding using a heat tool or ultrasonic bonding using an ultrasonic vibrator, with a connecting material 6 interposed between the predetermined region 5 of the first component 1 and the second component 21.

[0048] <Third modified embodiment of the manufacturing method of the connection structure> In "Modification 3," in step A, a second component held on one side of a carrier substrate is attached to an adhesive layer at the bottom of a through hole in a stamp material replacement guide film, which has a guide film having a through hole through which the second component can pass, an adhesive layer formed on the entire surface of one side of the guide film, and a pickup head replacement substrate laminated thereon, and in step B, the second component is pushed out to a predetermined area of ​​the first component, so that the second component passes through the through hole in the guide film and is disposed in the predetermined area of ​​the first component. Specifically, the method has the following steps (A3), (B3), and (C3) corresponding to steps (A), (B), and (C).

[0049] (Process A3) In step A3, as shown in FIG. 10A, the second component 22 held on one side of the carrier substrate 42 is attached to the adhesive layer 6a at the bottom of the through hole th of the stamp material replacement guide film 3A, which is made up of a guide film 3 having a through hole th through which the second component 22 can pass, an adhesive layer 6a formed on the entire surface of one side of the guide film 3A, and a pickup head replacement substrate 80 laminated thereon. In this step, the picked-up second component 22 is made to face the first component 1 as shown in FIG. 10B. As a result, it is understood that the guide film 3 is disposed between the first component 1 and the second component 22. The adhesive layer 6a can be appropriately selected from those formed from known adhesive materials. The pickup head replacement substrate 80 can also be appropriately selected from the substrate 4, the transparent substrate 41, the carrier substrate 42, and the like. In the third modified embodiment, the electrode 22a of the second component 22 is disposed so as to be located on the carrier substrate 42 side. This is to enable flip-chip mounting when the stamp is transferred.

[0050] (Process B3) In step B3, as shown in FIG. 11, the second component 22 picked up by the stamp material substitute guide film 3A is pushed out to the predetermined region 5 of the first component 1 by a known method, so that the second component 22 passes through the through hole th of the guide film 3 and is disposed in the predetermined region 5 of the first component 1. During this disposition, a connecting material 6 made of a known adhesive material is present between the first component 1 and the second component 22. This connecting material 6 is used to bond the first component 1 and the second component 22 together during bonding in step C3. As long as it is present between the first component 1 and the second component 22, it may be laminated or disposed on the surface of the first component 1 on the second component 22 side, or it may be laminated or disposed on the surface of the second component 22 on the first component 1 side, or it may be used as a single unit (for example, a film) separated from both. For example, the first component 1 to be input to the process A3 may have an adhesive film or adhesive paste laminated or disposed as the connecting material 6 on the entire surface of the predetermined region 5, or the first component 1 to be input to the process A3 may have an adhesive film or adhesive paste in the form of individual pieces laminated or disposed as the connecting material 6 only on the predetermined region 5. Alternatively, the second component 22 to be input to the process A3 may have an adhesive film or adhesive paste in the form of individual pieces laminated or disposed as the connecting material 6 on the surface of the first component 1. When the connecting material is used in the form of individual pieces, it is possible to avoid disposing the connecting material on the guide film 3 or the through hole portions where the connecting material is not required, and thus it is possible to suppress the occurrence of contamination or pollution.

[0051] (Process C3) 12, step C3 is a step of bonding the second component 22 to the predetermined region 5 of the first component 1. The bonding of the second component 22 to the predetermined region 5 of the first component 1 can be performed by employing a known bonding method such as thermocompression bonding using a heat tool or ultrasonic bonding using an ultrasonic vibrator, with a connection material 6 between the predetermined region 5 of the first component 1 and the second component 22.

[0052] <Fourth variation of the manufacturing method of the connection structure> In "Modification 4", in step A, the second component held on one side of the carrier substrate is attached to the adhesive layer at the bottom of the through hole of the stamp material replacement guide film, which is made up of a guide film having a through hole through which the second component can pass, an adhesive layer formed on the entire surface of one side, and a pickup head replacement substrate laminated thereon, and in step B, a laser is irradiated onto the second component from the pickup head replacement substrate side by the laser lift-off method to peel the second component from the adhesive layer, and the second component is passed through the through hole of the guide film and placed in a predetermined area of ​​the first component. Specifically, it has the following steps (A4), (B4), and (C4) corresponding to steps (A), (B), and (C).

[0053] (Process A4) In step A4, as shown in FIG. 13A, the second component 23 held on one side of the carrier substrate 42 is attached to the adhesive layer 6a at the bottom of the through hole th of the stamp material replacement guide film 3A, which is made up of a guide film 3 having a through hole th through which the second component 23 can pass, an adhesive layer 6a formed on the entire surface of one side of the guide film 3A, and a pickup head replacement substrate 80 laminated thereon. In this step, the picked-up second component 23 is made to face the first component 1 as shown in FIG. 13B. As a result, it is understood that the guide film 3 is disposed between the first component 1 and the second component 23. The adhesive layer 6a can be appropriately selected from those formed from known adhesive materials. The pickup head replacement substrate 80 can also be appropriately selected from the substrate 4, the transparent substrate 41, the carrier substrate 42, and the like. In the fourth modified embodiment, the electrode 23a of the second component 23 is disposed so as to be located on the carrier substrate 42 side. This is to enable flip chip mounting when the stamp is transferred.

[0054] (Process B4) As shown in FIG. 14, in step B4, a laser L is irradiated onto the second component 23 from the pickup head replacement substrate 80 side by a known laser lift-off method to peel off the second component 23 from the adhesive layer 6a of the pickup head replacement substrate 80, and the second component 23 is placed (transferred) in a predetermined area 5 of the first component 1 through the through hole th of the guide film 3. As a result, the second component 23 is placed in a predetermined area 5 of the first component 1 through the through hole th of the guide film 3. During this placement, a connecting material 6 made of a known adhesive material is present between the first component 1 and the second component 23. Since the connecting material 6 is used to bring the first component 1 and the second component 23 into close contact and bond them during the bonding in step C4, as long as it exists between the first component 1 and the second component 23, it may be laminated or disposed on the surface of the first component 1 on the second component 23 side, or on the surface of the second component 23 on the first component 1 side, or it may be used as a single unit (for example, a film) separated from both. For example, the first component 1 to be input to step A4 may have an adhesive film or adhesive paste laminated or disposed as the connecting material 6 over the entire surface of the predetermined region 5, or the first component 1 to be input to step A4 may have an individual piece of adhesive film or adhesive paste laminated or disposed as the connecting material 6 only over the predetermined region 5. Alternatively, the second component 23 to be input to step A4 may have an individual piece of adhesive film or adhesive paste laminated as the connecting material 6 over the surface of the first component 1. When the connecting material is used in the form of individual pieces, it is possible to avoid disposing the connecting material on the guide film 3 or the through hole where the connecting material is not required, and thus it is possible to suppress the occurrence of contamination or pollution.

[0055] (Process C4) 15, step C4 is a step of bonding the second component 23 to the predetermined region 5 of the first component 1. The bonding of the second component 23 to the predetermined region 5 of the first component 1 can be performed by employing a known bonding method such as thermocompression bonding using a heat tool or ultrasonic bonding using an ultrasonic vibrator, with a connecting material 6 interposed between the predetermined region 5 of the first component 1 and the second component 23.

[0056] <Guide film> In the above-described manufacturing method of the connection structure of the present invention, it is essential to use a guide film. Such a guide film has a through hole that serves as a guide when a second part, which is finer than the first part, is transferred to a predetermined region of the first part, and the diameter of the through hole is a size that allows the second part to pass through. Specifically, the film thickness of the guide film is preferably 0.1 to 0.9 times the maximum thickness of the second part. In addition, the opening shape of the through hole can adopt various shapes that allow the second part to pass through. For example, if the outer shape of the second part is rectangular (oblong), the through hole may be rectangular (oblong), and if the outer shape of the second part is circular or a shape similar thereto, the through hole may be circular or a shape similar thereto. [Industrial Applicability]

[0057] In the method for manufacturing a connection structure of the present invention, when a fine second component such as a μLED is placed at a predetermined location on a larger first component such as a substrate, a guide film having a through hole is placed between the first and second components as a guide that enables the second component to be placed while maintaining an intended positional relationship with respect to the first component. Therefore, the fine second component can be placed on the first component without tilting or tipping over. Therefore, it is useful for manufacturing μLED displays. [Explanation of symbols]

[0058] 1. First Part 1a Electrode of the first component 2, 20, 21, 22, 23 2nd part 2a, 20a, 21a, 22a, 23a Electrodes of the second component 3 Guide film 3A Stamp material replacement guide film 4. Board 5. Predetermined area of ​​the first part 6. Connecting materials 6a Adhesive layer 41 Transparent Substrate 42 Carrier Board 70 Stamp material 71 Base Material 72 Convex 80 Pickup head replacement board 80 L Laser th through hole

Claims

1. A method for manufacturing a connecting structure in which a second component, which is finer than the first component, is joined to a predetermined area of ​​the first component, comprising the following steps A and B: (Process A) A step of placing a guide film having a through hole through which the second part can pass between the first part and the second part; and (Process B) A process of placing the second component into a predetermined area of ​​the first component by passing it through a through-hole in the guide film. A method for manufacturing a connecting structure having the following characteristics.

2. The manufacturing method according to Claim 1, wherein step B is followed by step C: (Process C) A process of joining the second part to a predetermined area of ​​the first part. It has, A method for manufacturing a connecting structure, wherein the second component is joined to a predetermined area of ​​the first component via a connecting material between the predetermined area of ​​the first component and the second component.

3. The manufacturing method according to claim 1 or 2, wherein a μLED is used as the second component.

4. The manufacturing method according to claim 1 or 2, wherein, prior to step B, the through-hole of the guide film and the second part are aligned with respect to a predetermined area of ​​the first part.

5. The manufacturing method according to claim 1 or 2, wherein the first component to be introduced into process A has an adhesive film laminated on its entire surface in a predetermined area as a connecting material.

6. The manufacturing method according to claim 1 or 2, wherein the first component introduced into process A has individual adhesive films laminated as connecting material only in a predetermined area thereof.

7. The manufacturing method according to claim 1 or 2, wherein the second component introduced into process A has individual adhesive films laminated on its surface facing the first component as a connecting material.

8. The manufacturing method according to claim 1 or 2, wherein in step A, a guide film having through holes through which the second component can pass is placed between the first component and the second component held on a transparent substrate, and in step B, a laser is irradiated onto the second component from the transparent substrate side by a laser lift-off method to peel the second component from the transparent substrate and place it in a predetermined area of ​​the first component by passing it through the through holes of the guide film.

9. The manufacturing method according to claim 1 or 2, wherein in step A, a second component held on one side of a carrier substrate is attached to a protrusion of a stamp material having a protrusion formed on one side of a base substrate by a stamp transfer method, a guide film having a through hole through which the second component can pass is placed between the first component and the second component attached to the protrusion, and in step B, the second component is placed in a predetermined area of ​​the first component by passing it through the through hole of the guide film.

10. The manufacturing method according to claim 1 or 2, wherein in step A, a second component held on one side of a carrier substrate is attached to the adhesive layer at the bottom of the through-hole of a stamp material substitute guide film having a through-hole through which the second component can pass, an adhesive layer formed on the entire surface of that side, and a pickup head substitute substrate laminated thereon, and in step B, the second component is pushed into a predetermined area of ​​the first component, thereby passing the second component through the through-hole of the guide film and placing it in a predetermined area of ​​the first component.

11. The manufacturing method according to claim 1 or 2, wherein in step A, a second component held on one side of a carrier substrate is attached to the adhesive layer at the bottom of the through-hole of a stamp material substitute guide film having a through-hole through which the second component can pass, an adhesive layer formed on the entire surface of that side, and a pickup head substitute substrate laminated thereon; and in step B, a laser is irradiated onto the second component from the light-transmitting pickup head substitute substrate side by a laser lift-off method to peel the second component from the adhesive layer and allow it to pass through the through-hole of the guide film and be placed in a predetermined area of ​​the first component.

12. A method for arranging a second component which is finer than the first component in a predetermined area of ​​the first component, A method of arranging a component, comprising placing a guide film having a through-hole through which the second component can pass between a first component and a second component, and arranging the second component in a predetermined area of ​​the first component by passing it through the through-hole of the guide film.

13. A guide film having through holes that serve as guides when transferring a second part, which is smaller than the first part, to a predetermined area of ​​the first part, wherein the diameter of the through holes is a size that the second part can pass through.

14. The guide film according to claim 13, wherein the opening shape of the through hole is substantially the same as the shape of the second component, and the film thickness of the guide film is 0.1 to 0.9 times the maximum thickness of the second component.

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