Molding device for sealing resin used in compression molding

Abstract

To provide a compression molding device capable of preventing occurrence of molding defects, a molding device capable of forming a sealing resin that enables a compression molding method to be realized, and a molding device capable of preventing occurrence of breakage of the sealing resin during a molding process.SOLUTION: A sealing resin molding device 100 according to the present invention forms a sealing resin R to be used in compression molding of a workpiece W, and is equipped with a pair of lower and upper dies 106 and 104 that is opened and closed, a forming die 102 that contains and heats and pressurizes a base resin Rm with a release film F interposed therebetween to form a sealing resin R of a predetermined shape, and a film peeling mechanism 170 that peels off the release film F from the sealing resin R that is being formed.SELECTED DRAWING: Figure 9

Description

[Technical field]

[0001] The present invention relates to an apparatus for forming a sealing resin used in compression molding. [Background technology]

[0002] 2. Description of the Related Art As an example of a resin sealing apparatus and a resin sealing method for sealing a workpiece having electronic components mounted on a substrate with a sealing resin and processing it into a molded product, a method using a compression molding method is known.

[0003] The compression molding method is a technology in which a predetermined amount of sealing resin is supplied to a sealing area (cavity) provided in a sealing mold comprising an upper mold and a lower mold, a workpiece is placed in the sealing area, and the upper mold and lower mold are clamped to seal the workpiece with resin. As an example, when a sealing mold having a cavity in the upper mold is used, a technology is known in which the sealing resin is supplied all at once to the center position on the workpiece and molded. On the other hand, when a sealing mold having a cavity in the lower mold is used, a technology is known in which a release film (hereinafter sometimes simply referred to as a "film") that covers the mold surface including the cavity and the sealing resin are supplied and molded (Patent Document 1: See JP 2019-145550 A). [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2019-145550 A Summary of the Invention [Problem to be solved by the invention]

[0005] For example, when a strip-type wire-connected electronic component (semiconductor chip) is encapsulated with resin as a workpiece, the compression molding method in which a cavity is provided in the upper die has a problem that encapsulation is difficult because the wire portion of the workpiece held in the lower die comes into contact with the encapsulation resin previously supplied to the cavity or the encapsulation resin supplied onto the workpiece and deforms. Therefore, a compression molding method in which the workpiece is held in the upper die, a cavity is provided in the lower die, and encapsulation resin (granular resin, as an example) is supplied into the cavity has generally been adopted.

[0006] However, in a configuration in which a workpiece is held in the upper mold and a cavity is provided in the lower mold, when the workpiece is thin or large, there is a problem that it is difficult to hold it in the upper mold and it is easy to fall. In addition, although the sealing resin is usually supplied into the cavity of the lower mold through a film, when a thick molded product with a thickness (here, the thickness of the resin part after molding) of more than 1 mm is to be formed, the molding stroke becomes large, and there is a problem that the film is likely to be caught in the molded product, resulting in molding defects. Furthermore, when granular resin is used as the sealing resin, the bulk increases depending on the diameter of the granular resin, making it easy for the film to be caught. In addition, there are problems that dust is generated during molding due to friction when the granular resin moves, and handling is difficult, and there are problems that it is difficult to supply (spread) the sealing resin evenly to the entire area in the cavity provided in the lower mold, and winding unevenness is likely to occur. In addition, there was a problem that molding defects were likely to occur because air trapped in the gaps between the particles when the sealing resin was sprayed and gas components that were degassed from the sealing resin when melted were not released and remained in the molded product as voids, etc. In particular, in the case of workpieces on which electronic components are mounted by wire connection, there was a risk of wire flow (deformation or breakage of the wire) due to the resin flow in the cavity during resin sealing.

[0007] Furthermore, the sealing resin used in compression molding is naturally in a state before it is fully cured, and therefore has low rigidity (brittleness) and low strength, which poses the problem of being prone to breakage during the forming process. [Means for solving the problem]

[0008] The present invention has been made in consideration of the above circumstances, and aims to provide a molding apparatus and a molding method for forming a sealing resin that can realize a compression molding apparatus and a compression molding method that can solve the problems of a configuration in which a cavity is provided in an upper mold and a configuration in which a cavity is provided in a lower mold, prevent molding defects caused by resin flow, uneven winding, residual gas, and dust generation during molding, and form a molded product with a large thickness dimension, while being easy to handle. In addition, it aims to prevent the sealing resin from breaking during the molding process. In particular, it is difficult to solve the problem of breakage when peeling off a release film attached to the sealing resin.

[0009] The present invention solves the above problems by the solution means described below as one embodiment.

[0010] An apparatus for forming sealing resin in one embodiment is an apparatus for forming sealing resin used in compression molding of a workpiece, and is required to be equipped with a pair of lower and upper dies that are opened and closed, a forming die that contains and heats and pressurizes a base resin with a release film interposed therebetween, and forms the sealing resin into a predetermined shape, and a film peeling mechanism that peels off the release film from the sealing resin that is formed.

[0011] For example, a powder resin is used as the base resin, and the forming die is a tableting die for tableting the powder resin.

[0012] In addition, it is preferable that the molding die is set to a heating temperature at which the base resin does not become thermally hardened, so that the formed sealing resin can be thermally hardened when used in compression molding of the workpiece.

[0013] The film peeling mechanism preferably has a gripping portion that grips one end of the release film and moves toward the other end.

[0014] In addition, it is preferable that the film peeling mechanism has a tension roller that moves linearly in the same direction as the movement direction of the gripping part while applying tension to the release film by rolling or sliding the release film against a part of the peripheral surface when the gripping part grips one end of the release film and moves toward the other end.

[0015] It is also preferable that the film peeling mechanism has a tension section that rotatably supports the tension roller and applies resistance to restrict linear movement of the tension roller.

[0016] It is also preferable that the tension section has a linear motion mechanism using an air cylinder or an electric motor, and the resistance is set or variably controlled by the linear motion mechanism.

[0017] It is also preferable that the film peeling mechanism has an adsorption stage having an adsorption portion on one of its upper or lower surfaces that adsorbs the sealing resin, and that the gripping portion and the tension roller are arranged on the same side of the adsorption stage as the surface on which the adsorption portion is provided.

[0018] It is also preferable to further include an inversion mechanism for inverting the sealing resin so that the upper and lower surfaces are inverted. Effect of the Invention

[0019] According to the forming device of the present invention, it is possible to form a sealing resin that can realize a compression molding device and a compression molding method that have the following effects. Specifically, in the compression molding device and the compression molding method, it is possible to solve the problems of a configuration in which a cavity is provided in an upper mold and the problems of a configuration in which a cavity is provided in a lower mold. It is also possible to prevent molding defects caused by resin flow, uneven winding, residual gas, and dust generation during molding. It is also possible to form molded products with large (thick) thickness dimensions as well as molded products with small (thin) thickness dimensions. Furthermore, handling is easier than granular resins, especially when supplying and setting.

[0020] Furthermore, with the above-described forming apparatus, when the release film attached to the sealing resin during the forming process is peeled off, it is possible to prevent the sealing resin from being broken or damaged. [Brief description of the drawings]

[0021] [Figure 1] 1 is a plan view showing an example of a compression molding apparatus in which a sealing resin formed by a forming apparatus and a forming method according to an embodiment of the present invention is used. [Diagram 2] 1A to 1C are explanatory diagrams illustrating an example of a compression molding method in which a sealing resin formed by the forming apparatus and forming method according to an embodiment of the present invention is used. [Diagram 3] Fig. 3A is an enlarged view of part III in Fig. 2. Fig. 3B is an explanatory view following Fig. 3A. [Figure 4] FIG. 3B is an explanatory diagram following FIG. 3B. [Diagram 5] FIG. 5 is an explanatory diagram following FIG. [Figure 6] 11A to 11C are explanatory diagrams illustrating another example of a compression molding method in which a sealing resin formed by the forming apparatus and forming method according to an embodiment of the present invention is used. [Figure 7] FIG. 7 is an explanatory diagram following FIG. [Figure 8] FIG. 8 is an explanatory diagram following FIG. [Figure 9] 1 is a plan view illustrating an example of an apparatus for forming a sealing resin according to an embodiment of the present invention. [Figure 10] 10 is a front view showing an example of a pressing device of the forming apparatus shown in FIG. 9. [Figure 11] FIG. 10 is a front cross-sectional view showing an example of a tableting die of the forming apparatus shown in FIG. [Figure 12] 10 is a plan view showing an example of a resin guard of the forming device shown in FIG. 9. [Figure 13] 10 is a front view showing an example of a film peeling mechanism of the forming apparatus shown in FIG. [Figure 14] 5A to 5C are explanatory diagrams of a method for forming a sealing resin according to an embodiment of the present invention. [Figure 15] FIG. 15 is an explanatory diagram following FIG. 14. [Figure 16] FIG. 16 is an explanatory diagram following FIG. [Figure 17] 1 is a perspective view showing an example of a sealing resin formed by a forming apparatus and a forming method according to an embodiment of the present invention; [Figure 18] 11 is a perspective view showing another example of a sealing resin formed by the forming apparatus and forming method according to the embodiment of the present invention. FIG. [Figure 19] 11 is a perspective view showing another example of a sealing resin formed by the forming apparatus and forming method according to the embodiment of the present invention. FIG. [Figure 20] 11 is a perspective view showing another example of a sealing resin formed by the forming apparatus and forming method according to the embodiment of the present invention. FIG. [Figure 21] FIG. 1 is an explanatory diagram of a conventional compression molding method. [Figure 22] FIG. 1 is an explanatory diagram of a conventional compression molding method. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0022] (Compression molding device and compression molding method) The sealing resin forming apparatus 100 and forming method according to the embodiment of the present invention are an apparatus and method for forming sealing resin R used in compression molding of a workpiece W. First, an outline of a compression molding apparatus 1 and a compression molding method for resin sealing (compression molding) a workpiece W using the sealing resin R will be described. Here, FIG. 1 is a plan view (schematic diagram) showing an example of a compression molding apparatus 1. For convenience of explanation, arrows may be used in the figure to indicate the left-right direction (X direction), the front-back direction (Y direction), and the up-down direction (Z direction). In addition, in all the figures for explaining each embodiment, members having the same function are given the same reference numerals, and repeated explanations thereof may be omitted.

[0023] The workpiece W to be sealed has a configuration in which electronic components Wb are mounted on a substrate Wa. More specifically, examples of the substrate Wa include plate-shaped members such as a resin substrate, a ceramic substrate, a metal substrate, a carrier plate, a lead frame, and a wafer. Examples of the electronic components Wb include a semiconductor chip, a MEMS chip, a passive element, a heat sink, a conductive member, and a spacer. The shape of the substrate Wa is a rectangular shape (striped shape), a square shape, a circular shape, and the like. The number of electronic components Wb mounted on one substrate Wa is set to one or more (for example, in a matrix shape, etc.).

[0024] Examples of methods for mounting the electronic components Wb on the substrate Wa include wire bonding mounting, flip chip mounting, etc. Alternatively, in the case of a configuration in which the substrate (glass or metal carrier plate) Wa is peeled off from the molded product Wp after resin sealing, there is also a method in which the electronic components Wb are attached using a thermally peelable adhesive tape or an ultraviolet-curable resin that is cured by exposure to ultraviolet light.

[0025] As examples of the film F, a film material having excellent heat resistance, peelability, flexibility, and extensibility, such as PTFE (polytetrafluoroethylene), ETFE (polytetrafluoroethylene polymer), PET, FEP, fluorine-impregnated glass cloth, polypropylene, polyvinylidine chloride, etc. are preferably used. The film F is also used when forming the sealing resin R in the forming device 100 described later.

[0026] As shown in Fig. 1, the compression molding apparatus 1 mainly comprises a supply unit 10A for supplying the workpiece W, a press unit 10B for sealing the workpiece W with resin and processing it into a molded product Wp, and a storage unit 10C for storing the molded product Wp. As an example, the supply unit 10A, the press unit 10B, and the storage unit 10C are arranged in this order along the X direction in Fig. 1. However, the above configuration is not limited to this, and the equipment configuration within the unit, the number of units (particularly the number of press units), the arrangement order of the units, and the like can be changed. Also, a configuration including units other than those described above (all not shown) is possible.

[0027] In addition, in the compression molding apparatus 1, a guide rail 20 is provided linearly across each unit, and a transport device (first loader) 22 for transporting the workpiece W and the sealing resin R, and a transport device (second loader) 24 for transporting the molded product Wp (which may be used to transport the sealing resin R) are provided so as to be movable between predetermined units along the guide rail 20. However, the configuration is not limited to the above, and a configuration may be provided with a common (single) transport device (loader) for transporting the workpiece W, the sealing resin R, and the molded product Wp (not shown). Also, the transport device may be configured to include a robot hand or the like instead of a loader.

[0028] In addition, in the compression molding apparatus 1, a control unit 30 that controls the operation of each mechanism in each unit is disposed in the supply unit 10A (it may be disposed in another unit).

[0029] The press unit 10B includes a pair of sealing dies that are opened and closed by a press device 250. As one example, the sealing dies may have a configuration in which a cavity is provided in an upper die (sealing die 202), and as another example, may have a configuration in which a cavity is provided in a lower die (sealing die 302).

[0030] As an example, steps of a compression molding method performed using a compression molding apparatus 1 equipped with a sealing mold 202 will be described with reference to Fig. 2 to Fig. 5. In this case, the press device 250 is provided with a film supply unit 211 that supplies a film F for covering a mold surface 204a (predetermined area) including the inner surface of the cavity 208 in the upper mold 204. Incidentally, as an example, the film F is in a roll shape, but it may also be in a rectangular shape.

[0031] First, a preparation step (sealing preparation step) is performed. Specifically, a step of adjusting and heating the upper mold 204 and the lower mold 206 to a predetermined temperature (for example, 100°C to 300°C) is performed. Also, a step of operating the film supply unit 211 to supply new film F and adsorb it to cover a predetermined area of ​​the mold surface 204a including the inner surface of the cavity 208 in the upper mold 204 is performed.

[0032] After the preparation step, a workpiece holding step is performed in which the workpiece W is held by the workpiece holding portion 205 of the lower die 206. Specifically, the workpiece W supplied from the supply magazine 12 is held by the first loader 22 and carried into the sealing die 202, and is held by the workpiece holding portion 205 of the lower plate 242 (die surface 206a).

[0033] After the workpiece holding step, a resin placing step is performed in which the sealing resin R is placed on the workpiece W held by the workpiece holding part 205 (see FIG. 2). Specifically, the sealing resin R formed in a sealing resin forming device (which may simply be referred to as a "forming device") 100 described below is held by a first loader 22 (or another conveying device) and carried into the sealing die 202, and placed on the workpiece W held by the workpiece holding part 205.

[0034] Alternatively, as another example of the resin placing step, the sealing resin R formed in the forming apparatus 100 may be placed on the workpiece W before the above-described workpiece holding step. In this case, the workpiece holding step is a step of holding the workpiece W with the sealing resin R placed thereon in the workpiece holding section 205. That is, the first loader 22 holds the workpiece W with the sealing resin R placed thereon, carries it into the sealing die 202, and holds it in the workpiece holding section 205. This has the advantage of performing the workpiece W and the sealing resin R in the sealing die 202 at once, rather than separately.

[0035] Next, a resin sealing step is performed in which the workpiece W is sealed with sealing resin R and processed into a molded product Wp. Specifically, the sealing mold 202 is closed, and the cavity piece 226 is relatively lowered in the cavity 208 surrounded by the clamper 228 to perform the mold closing step in which the sealing resin R is heated and pressurized against the workpiece W. Note that Fig. 3A is an enlarged view of part III in Fig. 2, and in the mold closing step, the sealing resin R softens and melts to change from the state in Fig. 3A to the state in Fig. 3B.

[0036] This causes the sealing resin R to thermally harden, completing the resin sealing (compression molding) (see FIG. 4).

[0037] The steps following the above mold closing step are the same as those in the conventional compression molding method. In summary, a mold opening step is performed in which the sealing mold 202 is opened and the molded product Wp and the used film F are separated so that the molded product Wp can be removed (see FIG. 5). Next, a molded product carrying-out step is performed in which the second loader 24 carries the molded product Wp out of the sealing mold 202 and transports it to the storage unit 10C. As an example, the transported molded product Wp is stored in the storage magazine 14. In addition, after or in parallel with the molded product carrying-out step, a step is performed in which the film supply unit 211 is operated to send out the used film F from the sealing mold 202 and send a new film F into the sealing mold 202 and set it therein.

[0038] The above are the main steps of the compression molding method performed using the compression molding apparatus 1 when the sealing mold 202 is provided. However, the above order of steps is only an example, and the order of steps can be changed or steps can be performed in parallel as long as there is no problem.

[0039] As another example, steps of a compression molding method performed using a compression molding apparatus 1 equipped with a sealing mold 302 will be described with reference to Figs. 6 to 8. In this case, the press device 250 is provided with a film supply unit 311 that supplies a film F for covering a mold surface 306a (predetermined area) including the inner surface of a cavity 308 in a lower mold 306. Note that, as one example, the film F is in a roll shape, but it may also be in a rectangular shape.

[0040] First, a preparation step (sealing preparation step) is performed. Specifically, a step of adjusting and heating upper mold 304 and lower mold 306 to a predetermined temperature (for example, 100°C to 300°C) is performed. Also, a step of operating film supply unit 311 to supply new film F and adsorb it to cover a predetermined area of ​​mold surface 306a including the inner surface of cavity 308 in lower mold 306 is performed.

[0041] After the preparation step, a workpiece holding step is performed in which the workpiece W is held by the workpiece holding portion 305 of the upper die 304. Specifically, the workpiece W supplied from the supply magazine 12 is held by the first loader 22 and carried into the sealing die 302, and is held by the workpiece holding portion 305 of the upper plate 342 (die surface 304a).

[0042] After the workpiece holding step, a resin holding step is performed (it may be performed before the workpiece holding step or in parallel). The resin holding step includes the following steps: The sealing resin R is held in the cavity 308 of the lower die 306 (see FIG. 6). Specifically, the sealing resin R formed in the forming device 100 is held by the first loader 22 (or another conveying device) and carried into the sealing die 302, and is housed in the cavity 308 (specifically, it is placed on the upper surface of the cavity piece 326).

[0043] Next, a resin sealing process is performed in which the workpiece W is sealed with sealing resin R and processed into a molded product Wp. Specifically, the sealing mold 302 is closed, and the cavity piece 326 is relatively raised in the cavity 308 surrounded by the clamper 328 to perform the mold closing process in which the sealing resin R is heated and pressurized against the workpiece W. This thermally hardens the sealing resin R, completing the resin sealing (compression molding) (see FIG. 7).

[0044] The steps following the above mold closing step are the same as those in the conventional compression molding method. In summary, a mold opening step is performed in which the sealing mold 302 is opened and the molded product Wp and the used film F are separated so that the molded product Wp can be removed (see FIG. 8). Next, a molded product carrying-out step is performed in which the second loader 24 carries the molded product Wp out of the sealing mold 302 and transports it to the storage unit 10C. As an example, the transported molded product Wp is stored in the storage magazine 14. In addition, after or in parallel with the molded product carrying-out step, a step is performed in which the film supply unit 311 is operated to send out the used film F from the sealing mold 302 and send a new film F into the sealing mold 302 and set it therein.

[0045] The above are the main steps of the compression molding method performed using the compression molding apparatus 1 when the sealing mold 302 is provided. However, the above order of steps is only an example, and the order of steps can be changed or steps can be performed in parallel as long as no problems occur.

[0046] (Sealing resin forming device) Next, the above-mentioned compression molding apparatus 1 and a forming apparatus 100 for forming the sealing resin R used in the compression molding method will be described with reference to Figs. 9 to 13. The forming apparatus 100 processes a base resin Rm to form the sealing resin R. Here, Fig. 9 is a plan view (schematic view) showing an example of the forming apparatus 100. The forming apparatus 100 may be provided either inside or outside the compression molding apparatus 1.

[0047] In this embodiment, a thermosetting resin (for example, an epoxy resin containing a filler, but not limited thereto) is used as the base resin Rm and the sealing resin R formed from the base resin Rm. The sealing resin R is formed as a solid or semi-solid resin having a predetermined shape (details will be described later) that corresponds to the shape of the workpiece W. Usually, one piece constitutes the "whole" of the required amount of sealing (one time per workpiece W), but it may be configured so that several pieces (for example, about two or three pieces) are divided to constitute the "whole" of the required amount of sealing. In addition, the above-mentioned "semi-solid" does not mean a completely solid state, but a state melted to the so-called B stage. In addition, a powder resin (powder resin form) that is a thermosetting resin (property) is preferably used as the base resin Rm. However, it is not limited thereto, and a granular resin, a crushed resin, a solid resin, a liquid resin, or a resin that is a combination of a plurality of them may be used.

[0048] As shown in Figure 9, the forming apparatus 100 mainly comprises a supply section 100A that supplies base resin Rm, a forming section 100B that forms sealing resin R from the base resin Rm, a storage section 100C that performs film peeling and storage of the formed sealing resin R, a transport section 100D that transports the base resin Rm and sealing resin R, etc., and a control and calculation section 100E that controls the operation of each mechanism.

[0049] First, the conveying section 100D includes, as an example, a guide rail 167 laid between the supply section 100A and the storage section 100C, a first conveying device (loader) 168 that moves on the guide rail 167 to convey the base resin Rm, and a second conveying device (loader) 169 that conveys the sealing resin R. However, the configuration is not limited to the above, and a common (single) conveying device (loader) that conveys the base resin Rm and the sealing resin R may be included. In addition, the conveying devices (loaders) 168 and 169 are configured to be movable in the X direction and the Y direction, but a conveying device that moves in the X direction and a conveying device that moves in the Y direction may be separately included. In addition, the conveying device may be configured to include a robot hand or the like instead of a loader (both not shown).

[0050] Next, the forming section 100B includes, as an example, a forming die 102 having a pair of dies (for example, a combination of a plurality of die blocks, die plates, die pillars, and other members made of alloy tool steel) that are opened and closed by a press device 150. Here, a front view (schematic diagram) of the press device 150 is shown in Fig. 10. Also, a front cross-sectional view (schematic diagram) of the forming die 102 is shown in Fig. 11.

[0051] As shown in FIG. 10, the press machine 150 includes a pair of platens 154, 156, a plurality of tie bars 152 on which the pair of platens 154, 156 are supported, and a drive device for moving (raising and lowering) the platen 156. Specifically, the drive device includes a drive source (e.g., an electric motor) 160 and a drive transmission mechanism (e.g., a ball screw or a toggle link mechanism) 162 (however, the present invention is not limited to this). In this embodiment, the platen 154 on the upper side in the vertical direction is set as a fixed platen (a platen fixed to the tie bars 152), and the platen 156 on the lower side is set as a movable platen (a platen slidably held by the tie bars 152 and raised and lowered). However, the present invention is not limited to this, and the platens may be set upside down, i.e., the upper side may be set as a movable platen and the lower side as a fixed platen, or both the upper side and the lower side may be set as movable platens (neither is shown).

[0052] On the other hand, as shown in FIG. 10, the forming mold 102 includes an upper mold 104 on the upper side in the vertical direction and a lower mold 106 on the lower side as a pair of molds disposed between the pair of platens 154, 156 in the press device 150. The upper mold 104 is assembled to the upper platen (in this embodiment, the fixed platen 154), and the lower mold 106 is assembled to the lower platen (in this embodiment, the movable platen 156). The upper mold 104 and the lower mold 106 approach and move away from each other to perform mold closing and mold opening (the vertical direction (up and down direction) is the mold opening and closing direction). In this embodiment, a powder resin is suitably used as the base resin Rm, and the forming mold 102 is configured as a "tabletting mold" that forms the sealing resin R by tableting the base resin Rm (powder resin) in the mold closing process. Specifically, the upper mold 104 constitutes a so-called "pestle mold", and the lower mold 106 constitutes a so-called "mortar mold".

[0053] Next, the lower mold 106 of the forming mold 102 will be described in detail. As shown in Fig. 11, the lower mold 106 includes a lower mold chase 110, a cavity piece 126 held thereby, a clamper 128, and the like. The lower mold chase 110 is fixed to the upper surface of a support plate 114 via a support pillar 112. A cavity 108 is provided on the upper surface of the lower mold 106 (the surface on the upper mold 104 side). A predetermined amount of base resin Rm is accommodated in this cavity 108.

[0054] The clamper 128 is configured in an annular shape so as to surround the cavity piece 126, and is assembled to be movable up and down while being spaced apart (floating) from the upper surface of the support plate 114 via the pushing pin 122 and the clamper spring 124 (a biasing member exemplified by a coil spring, for example) (however, the assembly structure is not limited to this). The cavity piece 126 constitutes the inner part (bottom part) of the cavity 108, and the clamper 128 constitutes the side part of the cavity 108. The shape and number of cavities 108 provided in one lower mold 106 are set appropriately (one or multiple).

[0055] Furthermore, the lower mold 106 is provided with suction paths (holes, grooves, etc.) (not shown) communicating with a suction device on the upper surface of the clamper 128, on the boundary between the clamper 128 and the cavity piece 126, etc. This allows the film F (strip-shaped film) carried in with the base resin Rm placed thereon by the resin guard 400 described below to be adsorbed and held on the mold surface 106a including the inner surface of the cavity 108.

[0056] In this embodiment, a lower die heating mechanism (not shown) is provided to heat the lower die 106 to a predetermined temperature. This lower die heating mechanism includes a heater (e.g., an electric wire heater), a temperature sensor, a power source, etc., and heating is controlled by the control and calculation unit 100E. As an example, the heater is built into the lower die chase 110 and is configured to apply heat to the entire lower die 106 and the base resin Rm contained in the cavity 108. At this time, the lower die 106 is heated to a predetermined temperature (e.g., 50°C to 80°C) at which the base resin Rm does not thermally cure (mainly cure).

[0057] Incidentally, the lower mold 106 described above has a structure including a movable clamper (clamper 128) as an example, but may have a structure not including a movable clamper as another example (not shown).

[0058] Next, the upper die 104 of the forming die 102 will be described in detail. As shown in FIG. 11, the upper die 104 is provided with a tableting plate 142 that presses a predetermined amount of base resin Rm contained in the cavity 108 of the lower die 106 to form (compress) the sealing resin R having a predetermined shape corresponding to the shape of the workpiece W (details of the forming method will be described later). The tableting plate 142 is held (fixed) by the upper die chase 140. As an example, a leg forming groove (including a recess) 143 for forming the leg Rb of the sealing resin R is provided on the lower surface (surface on the lower die 106 side) of the tableting plate 142. Note that the leg forming groove 143 is provided on the tableting plate 142, but may be provided on the cavity piece 126 or on both.

[0059] Here, the press device 150 is provided with an upper die film supplying section 113 that supplies a film F for covering the die surface 104a (predetermined area) of the upper die 104. Note that, as an example, the film F is in a roll shape, but it may also be in a rectangular shape.

[0060] Furthermore, the upper die 104 is provided with suction paths (holes, grooves, etc.) (not shown) communicating with a suction device on the tableting plate 142, etc. This allows the film F supplied from the upper die film supply unit 113 to be adsorbed and held on the die surface 104a.

[0061] In this embodiment, an upper die heating mechanism (not shown) is provided for heating the upper die 104 to a predetermined temperature. This upper die heating mechanism includes a heater (e.g., an electric wire heater), a temperature sensor, a power source, etc., and heating is controlled by the control and calculation unit 100E. As an example, the heater is built into the upper die chase 140 and configured to apply heat to the entire upper die 104. At this time, the upper die 104 is heated to a predetermined temperature (e.g., 50°C to 80°C) at which the base resin Rm held (contained) in the lower die 106 is not thermally cured (mainly cured).

[0062] Next, the supply unit 100A includes, as an example, a film supply unit 165 that supplies a film F (strip-shaped film). It also includes a dispenser 166 that supplies (discharges) a base resin Rm. In this embodiment, a resin guard (conveyor) 400 is used to hold the film F (strip-shaped film) and the base resin Rm, and is transported by a loader 168. A plurality of resin guards 400 are prepared as appropriate, and are configured to be circulated.

[0063] As shown in FIG. 12, the resin guard 400 has a storage section 402 that stores the base resin Rm. A through hole 404 that penetrates in the vertical direction is formed in the storage section 402, and a suction hole 408 that suctions the film F is drilled in the peripheral portion 406 of the through hole 404. With this configuration, the base resin Rm can be placed and held on the film F in the through hole 404 in a state where the rectangular film F is sucked so as to close the through hole 404 from the lower side. The size of the through hole 404 is slightly smaller than the cavity 108 of the forming mold 102. The thickness of the resin guard 400 is the thickness necessary for transporting the base resin Rm (powder resin) to the cavity 108 of the forming mold 102 and forming it.

[0064] Next, the storage unit 100C includes, as an example, a film peeling mechanism 170 that peels off the film F from the sealing resin R formed by tableting the base resin Rm (powder resin). Also, a storage magazine 192 that stores the sealing resin R after the film F has been peeled off is included. A known stack magazine or the like can be used for the storage magazine 192. Also, an inversion mechanism 194 that inverts the sealing resin R so that the top and bottom surfaces are reversed is included. Note that, if inversion is not necessary depending on the configuration of the molding die 102 or the configuration of the sealing resin R to be formed, the inversion mechanism 194 may be omitted (not shown).

[0065] 13, the film peeling mechanism 170 includes a suction stage 172 having a suction section 174 provided on one of its upper and lower surfaces for suctioning the surface to be suctioned (the surface not covered by the rectangular film F) of the sealing resin R (for the sake of simplicity, the sealing resin R is illustrated as being substantially plate-shaped). With this configuration, the sealing resin R can be held on the suction stage 172 without being clamped, and therefore, the occurrence of breakage of the sealing resin R due to clamping can be prevented.

[0066] Further, the film peeling mechanism 170 includes a gripping portion 176 that grips one end of the film F and moves toward the other end. With this configuration, the film F can be peeled off from the sealing resin R that is held by suction on the suction stage 172. As an example, the mechanism for gripping the film F is configured to use gripping claws, but is not limited to this and may be configured to use a suction pad or the like (not shown).

[0067] Furthermore, film peeling mechanism 170 includes tension roller 178 that, when gripping portion 176 grips one end of film F and moves toward the other end, causes film F to make rolling contact (or sliding contact) with part of its circumferential surface, applying tension to film F, and moves linearly in the same direction as the movement direction of gripping portion 176. Grip portion 176 pinches the end of the film, and then gripping portion 176 moves obliquely upward in the peeling direction, thereby winding the film around tension roller 178.

[0068] As an example, the gripper 176 and the tension roller 178 are disposed on the same side of the suction stage 172 as the surface on which the suction force of the suction unit 174 is generated. In addition, the tension roller 178 is disposed so that the central axis thereof is perpendicular to the linear movement direction.

[0069] Furthermore, the film peeling mechanism 170 has a support portion 182 that rotatably supports the tension roller 178, and is equipped with a tension portion 180 that applies resistance to restrict the linear movement of the tension roller 178.

[0070] As an example, the tension section 180 is provided with a linear motion mechanism 184 using an air cylinder (a mechanism for linearly moving the support section 182 in the same direction as the grip section 176), and the above-mentioned "resistance" is configured to be set by the linear motion mechanism 184 (for example, by sliding resistance or operating force). Note that only the sliding resistance of the air exhaust released to the atmosphere may be used, but the exhaust pressure may also be controlled. Alternatively, as another example, a linear motion mechanism using an electric motor and a ball screw or the like may be used (not shown). In any of the above examples, instead of a configuration in which the "resistance" is set constant, a configuration in which it is variably controlled by the control calculation section 100E may be used.

[0071] According to this configuration, when the film F is peeled off from the sealing resin R, an appropriate tension that is not too strong can be applied to the film F, thereby preventing the sealing resin R from being broken due to strong tension.

[0072] (Method of forming sealing resin) Next, there will be described steps of the method for forming the sealing resin according to this embodiment, which is carried out using the above-mentioned forming apparatus 100. Here, Fig. 14 to Fig. 16 are explanatory views of each step, and are illustrated as front cross-sectional views taken in the same direction as Fig. 11.

[0073] First, a preparation step (tabletting preparation step) is performed. The preparation step includes the following steps. A lower die heating step is performed in which the lower die 106 is adjusted to a predetermined temperature (a temperature at which the base resin Rm and the sealing resin R do not fully cure, for example, 50°C to 80°C) and heated by the lower die heating mechanism. In addition, an upper die heating step is performed in which the upper die 104 is adjusted to a predetermined temperature (a temperature at which the base resin Rm and the sealing resin R do not fully cure, for example, 50°C to 80°C) and heated by the upper die heating mechanism. In addition, an upper die film supply step is performed in which the upper die film supply unit 113 is operated to supply a new film F and adsorb it so as to cover a predetermined area of ​​the die surface 104a of the upper die 104.

[0074] After the preparation step, the film F is adsorbed and held so as to block the through-holes 404 of the resin guard 400. In this state, the base resin Rm is supplied (discharged) onto the film F from the dispenser 166. Next, the film F and base resin Rm held by the resin guard 400 are transported by the loader 168, and a setting step is performed in which the film F and base resin Rm are set at a predetermined position in the forming mold 102 (in this case, so as to be contained in the cavity 108 of the lower mold 106) (see FIG. 14). Note that the resin guard 400 after the film F and base resin Rm are set is returned to the supply section 100A by the loader 168.

[0075] After the setting step, a forming step is performed in which the base resin Rm is heated and pressurized in the forming die 102 with the film F interposed therebetween to form the sealing resin R in a predetermined shape. The forming step according to the present embodiment includes a tableting step in which the base resin Rm is tableted to form a solid or semi-solid resin having a "predetermined shape" (details to be described later) as the sealing resin R, the overall shape of which corresponds to the shape of the workpiece W. Specifically, the press device 150 is operated to perform a step (mold closing step) of closing the forming die 102 heated to the above-mentioned predetermined temperature (see FIG. 15). At this time, the cavity piece 126 rises relatively in the cavity 108, and the base resin Rm is tableted (sandwiched and pressed) between the cavity piece 126 and the tableting plate 142. As a result, a solid or semi-solid sealing resin R having a predetermined shape and not yet thermally cured (mainly cured) is formed. At this time, the base resin Rm entering the leg forming groove 143 of the tabletting plate 142 through the film F becomes the leg Rb of the sealing resin R, and the other (remaining) base resin Rm becomes the main body Ra of the sealing resin R (the detailed configuration of the sealing resin R will be described later). As a modified example of the tabletting process, a part of the base resin Rm may be held (welded, gripped, etc.) by the upper die 104 (not shown).

[0076] It is important that the above tableting step is carried out at a temperature at which the base resin Rm does not thermally harden (mainly harden) (the lower die 106 and the upper die 104 are heated to a temperature at which the base resin Rm does not thermally harden (mainly harden)) so that the formed sealing resin R can be thermally hardened (mainly hardened) in a resin sealing step (one step of a compression molding method) carried out later in the compression molding apparatus 1. As described above, the "temperature at which the base resin Rm does not thermally harden (mainly harden)" depends on the material of the base resin Rm, but is specifically about 50°C to 80°C (about 70°C in this embodiment).

[0077] Here, the "predetermined shape" of the sealing resin R will be described. As an example, in the case of the sealing resin R used in the compression molding apparatus 1 when the sealing mold 202 is provided, the "predetermined shape" is a shape that does not come into contact with the electronic component Wb (including the wire in the case of the electronic component Wb having a wire) when placed on the base material Wa of the work W. As an example, as shown in FIG. 2, the sealing resin R is preferably provided with a plate-shaped or block-shaped main body Ra and legs Rb that are intermittently (or continuously) erected on one surface of the main body Ra (the surface facing the electronic component Wb of the work W) (however, the shape is not limited to this). The main body Ra is a size that fits into the cavity 208 in a plan view, and considering the resin flow, a size that is slightly smaller than the shape of the cavity 208 (particularly the cavity piece 226) is preferable. In addition, the legs Rb need to have a height H (see FIG. 3A) that does not come into contact with the electronic component Wb, but this does not exclude contact to the extent that the wire does not undergo plastic deformation. The legs Rb are arranged at a position where they do not contact the electronic components Wb in a plan view of the main body Ra, and where the main body Ra will not tilt when placed on the base material Wa of the work W. Furthermore, it is preferable that the legs Rb are arranged between the electronic components Wb or at the outer periphery of the electronic components Wb so as not to damage the wiring (particularly the wires) of the work W even a little during molding. The total amount of resin in the plate-shaped or block-shaped main body Ra and the legs Rb may be just the right amount or may be a large amount of resin as long as it is sufficient for one compression molding. Details of specific configuration examples of the sealing resin R (FIGS. 17 to 20) will be described later.

[0078] As another example, in the case of the sealing resin R used in the compression molding apparatus 1 when the sealing die 302 is provided, the "predetermined shape" is a shape in which, when the upper die 304 is gradually approached to the lower die 306 during the closing of the sealing die 302, the tip (upper end) of the leg Rb of the sealing resin R contained in the cavity 308 comes into contact with the base material Wa of the work W held by the work holding part 305, and the main body part Ra of the sealing resin R does not come into contact with the electronic component Wb of the work W (the electronic component Wb having a wire includes the wire). Note that the specific shape of the sealing resin R is the same as that of the sealing resin R used in the compression molding apparatus 1 when the sealing die 202 is provided (see Figs. 17 to 20), and therefore repeated explanation will be omitted. However, the sealing resin R is not limited to the configuration shown in Figs. 17 to 20, and may have a configuration in which the upper surface is formed flat without providing the leg Rb on the upper surface (not shown).

[0079] Next, the resin amount setting step of setting the "predetermined amount" of the base resin Rm will be described. As an example of the resin amount setting step, the control calculation unit 100E acquires data measured by a measuring mechanism or the like (not shown) on the number of electronic components Wb mounted on one substrate Wa for each workpiece W to be sealed (the number of mounted or missing, and may further include measuring the height of each electronic component Wb and measuring the thickness of the substrate Wa and the weight of the workpiece W). Next, the control calculation unit 100E calculates the amount of resin (in grams) required for resin sealing (compression molding) for each workpiece W based on the measurement data. Alternatively, as another example of the resin amount setting step, multiple types of fixed amounts corresponding to the types of workpieces W to be sealed are prepared, and the control calculation unit 100E or the operator selects one of the fixed amounts that is optimal for the type of workpiece W to set the "predetermined amount". In the case of the fixed amount, it is important that the amount of resin is not insufficient during resin sealing (compression molding). Regardless of the setting, an appropriate amount of base resin Rm can be supplied to the workpiece W. Therefore, in particular, it is possible to prevent molding defects caused by a shortage of the amount of resin required during resin sealing, and further, it is possible to prevent waste caused by supplying an excessive amount of resin.

[0080] In addition, it is preferable to use a powder resin as the base resin Rm. This allows the amount of resin to be supplied to be adjusted very accurately compared to when a granular resin or a crushed resin is used. However, the base resin Rm is not limited to a powder resin.

[0081] After the tableting step, a mold opening step is performed (see FIG. 16) in which the forming mold 102 is opened and the sealing resin R is separated from the used film F (roll-shaped film F attached to the first surface of the sealing resin R) so that the sealing resin R can be removed. For ease of explanation, the surface of the sealing resin R that has been pressure-formed by the upper mold 104 is referred to as the "first surface," and the surface that has been pressure-formed by the lower mold 106 is referred to as the "second surface."

[0082] After or in parallel with the mold opening process, the upper mold film supply section 113 is operated to send out the used film F (rolled film) for the upper mold 104 from within the forming mold 102 and to send new film F into the forming mold 102 and set it on the upper mold 104 (mold surface 104a), thereby carrying out the upper mold film supply process.

[0083] After the mold opening step, a carrying-out step is performed in which the sealing resin R is carried out from the forming mold 102 by the loader 169 and transported to the storage section 100C. In this embodiment, the sealing resin R is transported to the storage section 100C in a state in which the used film F (strip-shaped film) for the lower mold 106 is attached to the second surface of the sealing resin R.

[0084] After the carrying-out step, a peeling step is performed in which the film F (the strip-shaped film F attached to the second surface of the sealing resin R) is peeled off from the sealing resin R. In this embodiment, first, an inversion step is performed in which the sealing resin R is inverted upside down using the inversion mechanism 194. This allows the second surface of the sealing resin R to which the strip-shaped film F is attached to face upward, and the first surface to which the strip-shaped film F is not attached to face downward. Note that if inversion is not necessary, the above-mentioned inversion step may be omitted.

[0085] After the inversion step, the sealing resin R (with the first surface facing downward) is placed on the suction stage 172. Next, the suction unit 174 is operated to generate a suction force, and the sealing resin R is suctioned and held on the suction stage 172 (the first surface becomes the surface to be suctioned). Next, the gripping unit 176 grips (sandwiches) one end of the film F and moves toward the other end. More specifically, the gripping unit 176 gripping one end of the film F first moves diagonally upward (in the direction of arrow A), and then moves horizontally (in the direction of arrow B) (see FIG. 13). Through these operations, the film F (strip-shaped film) can be peeled off from the sealing resin R (second surface).

[0086] Here, when the gripper 176 moves, the tension roller 178 moves linearly in the same direction as the movement direction of the gripper 176 while the film F is in rolling contact (or sliding contact) with a part of the circumferential surface of the tension roller 178 (the movement distance of the gripper 176 is longer than that of the tension roller 178). At this time, the tensioner 180 applies a movement resistance to the tension roller 178 (resistance acting to suppress linear movement, i.e., a force acting in the opposite direction to the movement direction). As described above, the resistance is set constant by the sliding resistance and operating force of the linear motion mechanism 184, but as a modified example, the resistance may be variably controlled by the control calculation unit 100E, i.e., the resistance may be appropriately changed depending on the material of the sealing resin R and the film F.

[0087] As described above, before the full hardening, the sealing resin R has low rigidity (brittleness) and low strength, and thus has a problem of being easily broken. In response to this problem, the above-described configuration makes it possible to hold the sealing resin R on the suction stage 172 without clamping it, thereby preventing the sealing resin R from breaking. Furthermore, when peeling off the film F, an appropriate tension that is not too strong can be applied to the film F, thereby preventing the sealing resin R from breaking.

[0088] After the peeling step, the peeled film F (strip-shaped film) is discarded in a disposer (not shown).

[0089] The above are the main steps of the method for forming the sealing resin R using the forming apparatus 100. However, the above order of steps is only an example, and the order of steps can be changed or steps can be performed in parallel as long as no problems occur.

[0090] (Sealing resin) Next, specific configuration examples of the sealing resin R formed by the above-mentioned forming apparatus 100 and forming method are shown in Figs. 17 to 20, and the features of each will be described.

[0091] First, as a configuration common to each example shown in FIG. 17 to FIG. 20, the main body part Ra is formed in a plate shape (note that it may be a shape other than a plate shape, for example, a block shape having a concave part or a convex part, etc.). In addition, the leg part Rb is erected on the main body part Ra so that it is in a position that does not abut against the electronic component Wb of the work W when the sealing resin R is placed at a predetermined position (a design set position) on the substrate Wa of the work W, and is formed at a height H (see FIG. 3A, etc.) that ensures a distance at which the main body part Ra does not abut against the electronic component Wb. As described above, in the tableting process, the base resin Rm that enters the leg part forming groove 143 of the tableting plate 142 through the film F becomes the leg part Rb of the sealing resin R, and the other (remaining) base resin Rm becomes the main body part Ra of the sealing resin R.

[0092] In the example of the sealing resin R shown in Fig. 17, the leg Rb is formed as a convex body Rb1 in which all (or a part) is arranged in a dot shape. As an example of the convex body Rb1, it is arranged at a plurality of positions and formed in a shape in which the ratio t of the length L1 to the width W1 in a plan view is, for example, 0.5≦t≦2. According to this, the configuration in which the leg Rb is a columnar shape arranged in a dot shape can suppress the sealing resin R placed on the work W from flowing during compression molding. Therefore, wire sweep and the like can be prevented, and molding quality can be improved.

[0093] In the example of the encapsulating resin R shown in FIG. 18, the leg portion Rb is formed as a convex body Rb2, a part of which (or all of it may be) is arranged linearly. As an example of the convex body Rb2, it is arranged at one position (or may be at a plurality of positions), and in a plan view, the ratio t of the length L2 to the width W2 is formed in a shape where, as an example, t < 0.5 or 2 < t. According to this, resin flow is intentionally generated from the leg portion Rb (in this case, the convex body Rb2) having a dike-like configuration of a predetermined length, and filling of the encapsulating resin R into a narrow portion (for example, between the substrate Wa connected by flip chip and the electronic component Wb) in the workpiece W can be promoted. Therefore, it is possible to prevent gas from remaining in the molded product Wp and improve the molding quality.

[0094] In the example of the encapsulating resin R shown in FIG. 19, the leg portion Rb is formed as a convex body Rb3 that is arranged to intermittently (or may be continuously) surround the entire outer periphery (referring to the outer edge region) of the main body portion Ra. As an example of the convex body Rb3, convex bodies having the same configuration as the above Rb2 are formed continuously in a circumferential shape while providing a gap L3 at a predetermined interval. Generally, the outer peripheral position of the encapsulating resin R in the molded product Wp is the position where it is cut by a dicing machine or the like when it is separated into individual pieces, and since there is no electronic component Wb, a larger amount of resin for encapsulation is required compared to the central position. Therefore, by providing the leg portion Rb (in this case, the convex body Rb3) arranged to surround the entire outer periphery in this configuration, it is possible to supply a large amount of resin to the outer peripheral position while suppressing the resin flow during compression molding. Furthermore, by providing the gap L3, the discharge of gas components such as air from the inside (central portion) to the outside is promoted.

[0095] On the other hand, the example of the sealing resin R shown in FIG. 20 is a configuration example regarding the other surface of the main body part Ra (the surface on the side on which the leg part Rb is not provided, i.e., the surface on the side that does not face the electronic component Wb of the workpiece W). Specifically, the main body part Ra has linear grooves Rg formed on the other surface at the position where dicing for individualization is performed. This can reduce wear of the dicing blade and reduce dust generated during dicing. As an example, the grooves Rg are provided in a lattice shape in accordance with the dicing position, but are not limited to this. In order to form the grooves Rg, a tableting process may be performed using a cavity piece 126 having a correspondingly shaped protrusion (not shown) on its upper surface.

[0096] As described above, according to the forming device 100 of the present invention, when peeling off the film F attached to the sealing resin R during the forming process, the sealing resin R can be held without being clamped. Furthermore, the film F can be peeled off while applying an appropriate tension that is not too strong to the film F. Therefore, it is possible to prevent the sealing resin R from being broken before it is fully cured.

[0097] Furthermore, by using the sealing resin R formed by the forming device 100 and the forming method, it is possible to realize a compression molding device 1 and a compression molding method that have the following effects. Specifically, the compression molding device 1 and the compression molding method can prevent molding defects caused by resin flow, uneven winding, residual gas, and dust generation during molding. In addition, it is possible to form not only thin molded products Wp (thickness dimension less than 1 mm) but also thick molded products Wp (thickness dimension 1 mm or more). Although the upper limit of the thickness dimension depends on various setting conditions, it is considered that it is possible to form a thickness of up to about 10 mm. In addition, handling during supply and setting is made easier.

[0098] Furthermore, the compression molding apparatus 1 and compression molding method can solve the problem that occurs when a cavity is provided in the upper mold. That is, in a conventional compression molding apparatus in which a cavity is provided in the upper mold, when a mold closing process is performed on a workpiece W on which a strip-type wire-connected electronic component (semiconductor chip) Wb is mounted, the wire portion of the workpiece held by the lower mold comes into contact with the sealing resin previously supplied to the cavity or the sealing resin previously supplied onto the workpiece, and is deformed or cut, making resin sealing difficult. This problem can be solved by adopting a configuration that uses the sealing resin R formed by the apparatus and method according to the present embodiment, that is, a solid or semi-solid resin formed into a predetermined shape corresponding to the shape of the workpiece W.

[0099] Specifically, during the mold closing process, the sealing resin R is heated and softened and melted, as shown in the transition from Fig. 3A to Fig. 3B. At this time, the resin (specifically, the main body portion Ra) comes into uniform contact with all the wires (see Fig. 3B). This makes it possible to prevent the wires from being deformed or cut.

[0100] In addition, when an experiment was actually conducted in the above-mentioned compression molding apparatus 1 using sealing resin R formed by the apparatus and method of this embodiment, it was confirmed that deformation and breakage of the wire was prevented and molding quality was improved, compared to a conventional compression molding apparatus having a configuration in which a workpiece W is held in the upper die, a cavity is provided in the lower die, and sealing resin (specifically, granular resin) is supplied to the cavity.

[0101] On the other hand, the compression molding apparatus 1 and the compression molding method can also solve the problem that occurs when a cavity is provided in the lower mold. That is, in a conventional compression molding apparatus in which a cavity is provided in the lower mold, the particle size and height (lamination thickness) of the sealing resin (granular resin) accommodated in the cavity are not uniform, especially when granular resin is used as the sealing resin. Therefore, for example, depending on the type and melting state of the granular resin, it may not be completely liquid (low viscosity state), and when a mold closing process is performed on a workpiece W on which a strip-type wire-connected electronic component (semiconductor chip) Wb is mounted, as shown in FIG. 21, depending on the position, there is a problem that the wire portion of the workpiece held by the upper mold comes into strong (large) contact with the sealing resin (granular resin) and is deformed or cut. Furthermore, as shown in FIG. 22, there is a problem that a large resin flow occurs in the cavity, and the wire portion is deformed or cut. This problem can be solved by adopting a configuration that uses the sealing resin R formed by the apparatus and method according to this embodiment, that is, a solid or semi-solid resin formed into a predetermined shape corresponding to the shape of the workpiece W.

[0102] 3A and 3B, the heating of the sealing resin R causes it to soften and melt, and the resin (specifically, the main body portion Ra) comes into uniform contact with all the wires during the mold closing process. From this perspective, the sealing resin R is not limited to the configurations shown in Figs. 17 to 20, and may have a configuration (not shown) in which the upper surface is formed flat without providing legs Rb on the upper surface. This configuration also makes it possible to solve the problems caused by non-uniformity in particle size and height (lamination thickness) compared to the conventional technology using granular resin.

[0103] Furthermore, by making the forming device 100 a separate device from the compression molding device 1, the compression molding device 1 can be made unaffected by dust generated when tableting the powder resin in the forming device 100, and the compression molding device 1 can be easily placed in a clean room. However, the present invention is not limited to this configuration, and the forming device 100 may be integrally installed in the compression molding device 1.

[0104] The present invention is not limited to the above-described embodiment, and various modifications are possible without departing from the scope of the present invention. [Explanation of symbols]

[0105] 1. Compression molding equipment 100 Sealing resin forming device 102 Forming mold 170 Film peeling mechanism 202, 302 Sealing mold F Release Film Rm Base Resin R Sealing resin W work

Claims

1. A forming apparatus for forming a sealing resin used in compression molding of a workpiece, a molding die having a pair of a lower die and an upper die which are opened and closed, and which accommodates a base resin with a release film therebetween, and heats and presses the base resin to form the sealing resin into a predetermined shape; and a film peeling mechanism for peeling the release film from the formed sealing resin. The sealing resin forming apparatus is characterized by the above.

2. A powder resin is used as the base resin, The molding die is a tableting die for tableting the powder resin.

2. The sealing resin forming apparatus according to claim 1,

3. The molding die is set to a heating temperature at which the base resin does not harden by heat so that the formed sealing resin can be hardened by heat when used in compression molding of the workpiece.

3. The sealing resin forming apparatus according to claim 1, further comprising:

4. The film peeling mechanism has a gripping portion that grips one end of the release film and moves toward the other end.

3. The sealing resin forming apparatus according to claim 1, further comprising:

5. The film peeling mechanism has a tension roller that moves linearly in the same direction as the movement direction of the gripping part while applying tension to the release film by rolling or sliding the release film against a part of a peripheral surface when the gripping part grips the one end of the release film and moves toward the other end.

5. The sealing resin forming apparatus according to claim 4,

6. The film peeling mechanism has a tension unit that rotatably supports the tension roller and applies resistance to restrict linear movement of the tension roller.

6. The sealing resin forming apparatus according to claim 5,

7. The tension unit has a linear motion mechanism using an air cylinder or an electric motor, and the resistance is set or variably controlled by the linear motion mechanism.

7. The sealing resin forming apparatus according to claim 6,

8. the film peeling mechanism has a suction stage having a suction portion for suctioning the sealing resin on one of an upper surface and a lower surface, The gripping portion and the tension roller are disposed on the same side of the suction stage as a surface on which the suction portion is provided.

6. The sealing resin forming apparatus according to claim 5,

9. Further, a reversing mechanism is provided for reversing the upper and lower surfaces of the sealing resin.

3. The sealing resin forming apparatus according to claim 1, further comprising:

Images