Laser beam machining apparatus

Abstract

To provide a laser beam machining apparatus which can appropriately blow off sputter generated in laser beam machining.SOLUTION: A laser beam machining apparatus 1 is provided with: a laser beam irradiation device 2 which applies laser beam machining to a workpiece 60 while scanning the surface of the workpiece 60 to form a laser beam machined groove on the workpiece 60; a nozzle 40 which jets gas W, in an irradiation range of laser beam by the laser beam irradiation device 2; a motor 1 which changes a jetting position of the gas W in the nozzle 40; and a control device 10. The control device 10 controls the motor 41 in accordance with the irradiation position of the laser beam irradiation device 2, consequently the control device 10 changes the jetting position of the gas W in the nozzle 40.SELECTED DRAWING: Figure 3

Description

[Technical field]

[0001] The present disclosure relates to a laser processing apparatus, and more particularly to a technique for removing sputter in a laser processing apparatus. [Background technology]

[0002] A laser processing device that forms a groove in a workpiece by a laser beam is known. Japanese Patent No. 7081050 (Patent Document 1) discloses a technique for reducing the effect of heat by removing the plume (high-temperature steam) generated when laser processing a workpiece made of CFRP (Carbon Fiber Reinforced Plastics). In the technique disclosed in Japanese Patent No. 7081050 (Patent Document 1), the nozzle part is finely processed (for example, the cross-sectional shape is changed for each flow path in the multiple flow paths of the nozzle part) and the flow speed of the gas injected according to the position is changed, thereby efficiently removing the plume in the laser irradiation range. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent No. 7081050 Summary of the Invention [Problem to be solved by the invention]

[0004] Here, when a metal is used for the workpiece, spatter, which is molten metal, may occur in the processed groove due to the formation of the processed groove by laser processing. Unlike the plume, the spatter is heavy and may accumulate in the processed groove. The occurrence of spatter causes a decrease in quality in welding. For example, in dissimilar material joining in which molten resin enters the processed groove to join metal and resin, the spatter adheres to the processed groove and solidifies, reducing the joining strength. The technology disclosed in Patent Publication No. 7081050 (Patent Document 1) can efficiently remove the plume, but does not take into account the occurrence of large-volume spatter, making it difficult to blow away the spatter accurately.

[0005] An object of the present disclosure is to provide a laser processing apparatus capable of accurately blowing away sputters generated by laser processing. [Means for solving the problem]

[0006] The laser processing apparatus of the present disclosure includes a laser irradiation device that performs laser processing on the workpiece while scanning the surface of the workpiece to form a processed groove in the workpiece, an injection device that injects gas into the laser irradiation range of the laser irradiation device, an actuator that changes the injection position of the gas in the injection device, and a control device. The control device controls the actuator in response to the irradiation position of the laser irradiation device to change the injection position of the gas in the injection device. Effect of the Invention

[0007] According to the present disclosure, since the gas injection position is changed according to the irradiation position of the laser irradiation device, the gas can be blown out to the position where the spatter is generated by the laser processing, and thus the spatter generated by the laser processing can be precisely blown away. [Brief description of the drawings]

[0008] [Figure 1] 1 is a diagram illustrating a schematic configuration of a laser processing apparatus according to the present disclosure. [Diagram 2]4A and 4B are diagrams for explaining gas ejection from a nozzle. [Diagram 3] 4 is a flowchart showing the control contents executed by the control device. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings. In the drawings, the same or corresponding parts are designated by the same reference characters and their description will not be repeated.

[0010] 1 is a diagram showing a schematic configuration of a laser processing apparatus 1 according to the present disclosure. The laser processing apparatus 1 includes a laser irradiation device 2, a nozzle 40, a motor 41, and a control device 10. The laser irradiation device 2 is a device for performing laser processing on a workpiece 60 placed on a table (not shown). The laser irradiation device 2 includes a galvano scanner 20 and a laser oscillation device 30. The coordinate axes in FIG. 1 correspond to the X-axis, Y-axis, and Z-axis.

[0011] The galvano scanner 20 includes a lens 21, a scan mirror 22, a motor 23, an encoder 24, and a main body 27. The scan mirror 22 reflects the laser light L received from the laser oscillation device 30 and outputs the laser light L to the lens 21. The scan mirror 22 is configured so that its orientation can be changed by the motor 23, which is an actuator, and can change the irradiation position of the laser light L irradiated through the lens 21. The scan mirror 22 includes, for example, an X scan mirror that can change the irradiation position in the X direction, and a Y scan mirror that can change the irradiation position in the Y direction.

[0012] The motor 23 is, for example, a servo motor, and includes an X-axis motor that rotates the X-scan mirror and a Y-axis motor that rotates the Y-scan mirror. The motor 23 is connected to an encoder 24, which is a sensor that detects the rotational position. The galvano scanner 20 has a lens 21, a scan mirror 22, a motor 23, and an encoder 24 built into a main body 27, but the motor 23 and the encoder 24 are shown outside the main body 27 in the drawing. The galvano scanner 20 forms a machined groove in the workpiece 60 by scanning the laser light L on the XY plane of the workpiece 60 as shown in FIG. 1.

[0013] The nozzle 40 functions as an injection device that injects the gas W, and is connected to a cylinder 50, which is a supply source of the gas W, via a flow rate control valve 42, which is an adjustment mechanism that adjusts the flow rate of the gas W. The supply source of the gas W may be a configuration other than the cylinder 50, and may be any device that can supply the gas W. The cylinder 50 is filled with, for example, compressed air. The gas W may be other than air, and may be, for example, an inert gas such as argon.

[0014] The flow rate control valve 42 has a structure in which the opening degree can be changed. The flow rate control valve 42 adjusts the flow rate of the gas W sent from the cylinder 50 based on a signal from the control device 10. The flow rate control valve 42 is composed of, for example, a valve or a solenoid valve capable of adjusting the opening degree. The nozzle 40 is connected to a motor 41 which is an actuator.

[0015] The motor 41 is, for example, a stepping motor. The motor 41 may be, for example, a servo motor. The nozzle 40 and the motor 41 are fixed to a support 47. The support 47 is connected to the main body 27 of the galvano scanner 20. The support 47 is connected to, for example, the tip of a robot arm.

[0016] The control device 10 is configured to include a CPU (Central Processing Unit) 11, a memory 12 (ROM (Read Only Memory) and RAM (Random Access Memory)), and an input / output device (not shown) for inputting and outputting various signals. The CPU 11 deploys a program stored in the ROM into the RAM or the like and executes it. The program stored in the ROM is a program in which the processing procedures of the control device 10 are written. The control device 10 controls each device in accordance with these programs. This control is not limited to processing by software, but can also be processed by dedicated hardware (electronic circuits).

[0017] The control device 10 irradiates the galvano scanner 20 with laser light L by controlling the laser oscillation device 30. The control device 10 changes the reflection angle of the scan mirror 22 by controlling the motor 23. The control device 10 changes the position of the nozzle 40 by controlling the motor 41. The control device 10 adjusts the flow rate of the gas W by controlling the flow rate adjustment valve 42, thereby adjusting the flow rate of the gas W injected from the nozzle 40.

[0018] Next, the jetting of the gas W by the nozzle 40 will be described. Fig. 2 is a diagram for explaining the jetting of the gas by the nozzle 40. The nozzle 40 can jet the gas W on the XY plane of the workpiece 60. The control device 10 specifies the irradiation position of the laser light L based on a signal from the encoder 24. The control device 10 controls the motor 41 in accordance with the specified irradiation position to change the jetting position of the gas W in the nozzle 40.

[0019] The memory 12 stores position data relating to the injection position of the gas W corresponding to the irradiation position of the laser irradiation device 2. As an example of the position data, the memory 12 stores position data relating to each of positions A1 to A3, B1 to B3, and C1 to C3 on the workpiece 60, as shown in Fig. 2. The control device 10 controls the motor 41 based on the position data to change the position of the nozzle 40 to a position corresponding to the irradiation position of the laser light L.

[0020] In addition to changing the injection position, the control device 10 can change the flow velocity of the gas W. The control device 10 identifies the irradiation position of the laser beam L based on the signal from the encoder 24. The control device 10 controls the flow rate adjustment valve 42 corresponding to the identified irradiation position to change the flow velocity of the gas W at the nozzle 40.

[0021] The memory 12 stores flow velocity data regarding the flow velocity of the gas W corresponding to the irradiation position of the laser irradiation device 2. As shown in FIG. 2, as an example of the flow velocity data, the memory 12 stores flow velocity data regarding each position of A1 to A3, B1 to B3, and C1 to C3 on the workpiece 60. For example, the distance from the nozzle 40 becomes farther in the order of A1 < A2 < A3. The control device 10 slows down the flow velocity as the position is closer and speeds up the flow velocity as the position is farther. The control device 10 controls the flow rate adjustment valve 42 based on the flow velocity data to change the flow velocity of the gas W ejected from the nozzle 40 corresponding to the irradiation position of the laser beam L.

[0022] When the processing grooves formed by the laser beam L are formed at the positions of A1, A2, and A3, the control device 10 changes the injection position of the gas W at the nozzle 40 so as to correspond to each position, and controls the flow rate adjustment valve 42 so that the flow velocity increases in the order of positions A1 < A2 < A3. When the processing grooves formed by the laser beam L are formed at the positions of B1, B2, and B3, the control device 10 changes the injection position of the gas W at the nozzle 40 so as to correspond to each position, and controls the flow rate adjustment valve 42 so that the flow velocity increases in the order of positions B1 < B2 < B3. When the processing grooves formed by the laser beam L are formed at the positions of C1, C2, and C3, the control device 10 changes the injection position of the gas W at the nozzle 40 so as to correspond to each position, and controls the flow rate adjustment valve 42 so that the flow velocity increases in the order of positions C1 < C2 < C3.

[0023] As shown in Fig. 2, the control device 10 can change the injection position of the gas W in the nozzle 40 in response to the irradiation position of the laser light L, so that the gas W can be injected at an appropriate position corresponding to the scanning of the laser light L. The control device 10 can change the flow speed of the gas W in the nozzle 40 in response to the irradiation position of the laser light L. Specifically, the control device 10 makes the flow speed slower at a point where the distance between the nozzle 40 and the laser light L is close than at a point where the distance is far, and makes the flow speed faster at a point where the distance between the nozzle 40 and the laser light L is far than at a point where the distance is far. In this way, the gas W can be injected into the processed groove with a constant strength, so that spatters with a large volume can be blown off accurately from the processed groove at any position.

[0024] If the nozzle 40 were fixed, it would be expected that the strength of the gas W would differ depending on the position where the processed groove is formed. In response to this, the laser processing device 1 can inject gas W of a constant strength to the position corresponding to the scanning of the laser light L by controlling the nozzle 40 as described above. This makes it possible to precisely blow away large-volume spatters that are generated in the processed groove by irradiation with the laser light L.

[0025] Next, the control contents executed by the control device 10 will be described. Fig. 3 is a flowchart showing the control contents executed by the control device 10. The process of the flowchart in Fig. 3 is repeatedly called as a subroutine from the main routine in the control of the control device 10 and executed. First, in step S (hereinafter simply referred to as "S") 1, the control device 10 executes a process of setting, in the laser oscillation device 30, an output value of the laser light L corresponding to the machined groove to be formed in the workpiece 60.

[0026] Next, the control device 10 executes a process of setting, in the laser oscillation device 30, an irradiation position of the laser light L corresponding to the processed groove to be formed in the workpiece 60 (S2). The control device 10 transmits, for example, data indicating how to form the processed groove in the workpiece 60 to the laser oscillation device 30. Next, the control device 10 sets an injection position of the gas W corresponding to the irradiation position of the laser light L (S3). Specifically, the control device 10 sets so that the motor 41 is driven based on the ejection data related to the ejection position of the gas W corresponding to the irradiation position of the laser irradiation device 2.

[0027] Next, the control device 10 sets the flow velocity of the gas W corresponding to the irradiation position of the laser light L (S4). Specifically, the control device 10 sets the flow rate of the gas W to be changed by the flow rate adjustment valve 42 based on flow rate data related to the flow rate of the gas W corresponding to the irradiation position of the laser irradiation device 2.

[0028] Next, the control device 10 executes injection of the gas W corresponding to the setting of the laser light L based on the settings of S3 and S4 (S5). Next, the control device 10 executes irradiation of the laser light L to the workpiece 60 by the laser irradiation device 2 (S6). Next, the control device 10 detects the actual irradiation position of the laser light L on the workpiece 60 from the output value of the encoder 24, which is a sensor (S7).

[0029] Next, the control device 10 controls the nozzle 40 so that the gas W is injected at an appropriate position and flow rate that can remove the sputter from the processed groove based on the actual irradiation position of the laser light L in S7, and adjusts the injection of the gas W (S8). Here, when the control device 10 detects the actual irradiation position of the laser light L in the process of S8, it calculates the next irradiation position from the actual irradiation position and performs adjustment so that the injection of the gas W follows the irradiation of the laser light L without delay. This allows the control device 10 to suitably inject the gas W following the scanning of the laser light L. Next, the control device 10 judges whether the laser processing has been completed (S9). If the control device 10 judges that the laser processing has not been completed in S9 (NO in S9), it repeats the processes from S7 onwards. If the control device 10 judges that the laser processing has been completed (YES in S9), it stops the irradiation of the laser light L (S10). Next, the control device 10 stops the injection of the gas W (S11) and returns the process from the subroutine to the main routine.

[0030] <Modification> The control device 10 may execute injection of the gas W based on a setting of the irradiation position of the laser light L that has been set once, not based on detection of the irradiation position of the laser light L. In other words, after the control device 10 sets data on the injection position and flow rate of the gas corresponding to a predetermined irradiation position of the laser light, it may execute injection according to the data until the laser processing is completed.

[0031] The irradiation position of the laser light L may be detected from an image captured by a camera, instead of being detected by the encoder 24. Specifically, the control device 10 may identify a position with high brightness from the captured image as the irradiation position of the laser light L, and execute injection of the gas W corresponding to the identified irradiation position of the laser light L.

[0032] The nozzle 40 may be a Laval nozzle. The Laval nozzle has a structure in which the width narrows from the inlet to the center and then widens again at the outlet. The Laval nozzle can inject gas with a straight line at high speed.

[0033] <Summary> (1) The laser processing apparatus 1 of the present disclosure includes a laser irradiation device 2 that performs laser processing on the workpiece 60 while scanning the surface of the workpiece 60 to form a processed groove in the workpiece 60, a nozzle 40 that injects gas W in the laser irradiation range of the laser irradiation device 2, a motor 41 that changes the injection position of the gas W in the nozzle 40, and a control device 10. The control device 10 controls the motor 41 in accordance with the irradiation position of the laser irradiation device 2 to change the injection position of the gas W in the nozzle 40.

[0034] (2) The laser processing apparatus 1 of (1) further includes a flow rate adjustment valve 42 that changes the flow rate of the gas W sprayed from the nozzle 40. The control device 10 controls the flow rate adjustment valve 42 in accordance with the irradiation position of the laser irradiation device 2 to change the flow rate of the gas W in the nozzle 40.

[0035] (3) The laser processing apparatus 1 of (1) or (2) further includes a memory 12. The memory 12 stores injection data related to an injection position of the gas W corresponding to an irradiation position of the laser irradiation device 2. The control device 10 controls the motor 41 based on the injection data.

[0036] (4) The laser processing apparatus 1 of (2) or (3) further includes a memory 12. The memory 12 stores flow velocity data on the flow velocity of the gas W corresponding to the irradiation position of the laser irradiation device 2. The control device 10 controls the flow rate adjustment valve 42 based on the flow velocity data.

[0037] (5) The laser processing apparatus 1 according to any one of (1) to (4) further includes an encoder 24 that detects the irradiation position of the laser irradiation device 2. The control device 10 controls the motor 41 based on the output value of the encoder 24.

[0038] The laser processing apparatus 1 of the present disclosure can change the injection position of the gas W in the nozzle 40 corresponding to the irradiation position of the laser light L, and therefore can inject the gas W at an appropriate position corresponding to the scanning of the laser light L. The laser processing apparatus 1 can change the flow speed of the gas W in the nozzle 40 corresponding to the irradiation position of the laser light L, and therefore can inject the gas W at an appropriate flow speed to a position corresponding to the scanning of the laser light L.

[0039] The embodiments disclosed herein should be considered to be illustrative and not restrictive in all respects. The scope of the present disclosure is defined by the claims, not by the description of the embodiments described above, and is intended to include all modifications within the meaning and scope of the claims. [Explanation of symbols]

[0040] 1 laser processing device, 2 laser irradiation device, 10 control device, 11 CPU, 12 memory, 20 galvanometer scanner, 21 lens, 22 scan mirror, 23, 41 motor, 24 encoder, 27 main body, 30 laser oscillator, 40 nozzle, 42 flow rate control valve, 47 support part, 50 cylinder, 60 workpiece, L laser light, W gas.

Claims

1. a laser irradiation device that performs laser processing on a surface of a workpiece while scanning the surface of the workpiece to form a processing groove in the workpiece; an injection device that injects gas into a laser irradiation range of the laser irradiation device; an actuator for changing a gas injection position in the injection device; a control device; The control device controls the actuator in response to an irradiation position of the laser irradiation device to change an injection position of the gas in the injection device.

2. The gas injection device further includes an adjustment mechanism for changing a flow rate of the gas injected from the injection device. The laser processing device according to claim 1 , wherein the control device controls the adjustment mechanism in response to an irradiation position of the laser irradiation device to change a flow velocity of the gas in the injection device.

3. Further comprising a storage device; the storage device stores first data relating to a gas injection position corresponding to an irradiation position of the laser irradiation device; The laser processing device according to claim 1 , wherein the control device controls the actuator based on the first data.

4. Further comprising a storage device; the storage device stores second data on a flow velocity of a gas corresponding to an irradiation position of the laser irradiation device; The laser processing apparatus according to claim 2 , wherein the control device controls the adjustment mechanism based on the second data.

5. Further comprising a sensor for detecting an irradiation position of the laser irradiation device, The laser processing device according to claim 1 , wherein the control device controls the actuator based on an output value of the sensor.

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