Electrostatic chuck
JP2024175417APending Publication Date: 2024-12-18TOTO LTD
View PDF 0 Cites 0 Cited by
Patent Information
- Application Number
- JP2023093196
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2023-06-06
- Publication Date
- 2024-12-18
Smart Images

Figure 00000000_0000_ABST
Abstract
To provide an electrostatic chuck capable of achieving both protection of insulation breakdown in a base plate and security of cooling performance of a dielectric substrate.SOLUTION: An electrostatic chuck 10 includes: a dielectric substrate 100; a base plate 200 formed by metal; a joint layer 300 joining a dielectric substrate 100 and the base plate 200; and an insulation film 230 formed on the surface of the base plate 200. The insulation film 230 includes: a first part 231 covering a part facing the joint layer 300 of the surface of the base plate 200; and a second part 232 connected to the first part 231 from outside. Thickness T1 of the first part 231 is thinner than thickness T2 of the second part 232.SELECTED DRAWING: Figure 2
Need to check novelty before this filing date? Find Prior Art
