Semiconductor manufacturing device, coating device, and manufacturing method of semiconductor device

Abstract

To provide a technique capable of facilitating a setting of a coating pattern.SOLUTION: A semiconductor manufacturing device comprises: a stage for holding a substrate; a recognition camera; a nozzle provided so as to be movable to an upper direction of the stage; a bond head for bonding a die to the substrate to which a paste is coated by the nozzle; and a control device that acquires a substrate image by photographing the substrate held onto the stage with the recognition camera, and displays the substrate image onto a screen so as to be overlapped in a coating pattern to be selected.SELECTED DRAWING: Figure 6

Description

[Technical field]

[0001] The present disclosure relates to a semiconductor manufacturing apparatus and is applicable, for example, to a die bonder equipped with a coating device. [Background technology]

[0002] As one step in the manufacturing process of a semiconductor device, a die separated from a wafer is picked up and bonded to a member to which a paste has been applied. Here, the paste is a liquid adhesive, such as a resin paste or solder. The paste is ejected from a nozzle at the tip of a syringe, and the paste is applied according to the trajectory (application pattern) of the nozzle (for example, JP 2020-4812 A). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2020-4812 A Summary of the Invention [Problem to be solved by the invention]

[0004] The coating pattern required differs depending on the shape and size of the die, so it is necessary to set the coating pattern according to the die. If the appropriate setting is not done, good coating quality may not be obtained.

[0005] The present disclosure provides a technique that makes it possible to easily set a coating pattern. Other objects and novel features will become apparent from the description of this specification and the accompanying drawings. [Means for solving the problem]

[0006] A brief summary of representative aspects of this disclosure is as follows. That is, the semiconductor manufacturing apparatus includes a stage that holds a substrate, a recognition camera, a nozzle that is movably disposed above the stage, a bond head that bonds a die to the substrate onto which paste has been applied by the nozzle, and a control device that is configured to photograph the substrate held on the stage with the recognition camera to obtain a substrate image and to display the substrate image on a screen by superimposing it on a selected application pattern. Effect of the Invention

[0007] According to the present disclosure, it is possible to easily set a coating pattern. [Brief description of the drawings]

[0008] [Figure 1] FIG. 1 is a top view showing an outline of a die bonder in an embodiment. [Diagram 2] FIG. 2 is a diagram for explaining a schematic configuration when viewed from the direction of arrow A in FIG. [Diagram 3] FIG. 3 is a side view showing an outline of the preform part shown in FIG. [Figure 4] FIG. 4 is a block diagram showing a schematic configuration of a control system of the die bonder shown in FIG. [Diagram 5] FIG. 5 is a flowchart showing a method for manufacturing a semiconductor device using the die bonder shown in FIG. [Figure 6] FIG. 6 shows a setting screen for the application pattern. [Figure 7] FIG. 7 is a diagram showing an example of a lead frame and a coating pattern displayed on the setting screen shown in FIG. [Figure 8] FIG. 8 shows the change in the shape of the applied paste over time. [Figure 9] FIG. 9 is a diagram showing a contour image of the paste shown in FIG. [Figure 10] FIG. 10 is a diagram showing a setting screen for the application pattern in the first modified example. [Figure 11] FIG. 11 is a diagram for explaining a method of displaying a setting screen in the embodiment and the first modified example. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] Hereinafter, the embodiments and modified examples will be described with reference to the drawings. However, in the following description, the same components are given the same reference numerals, and repeated description may be omitted. Note that, in order to clarify the description, the drawings may show the width, thickness, shape, etc. of each part in a schematic manner compared to the actual embodiment, but these are merely examples and do not limit the interpretation of the present disclosure.

[0010] The configuration of a die bonder as one aspect of semiconductor manufacturing equipment will be described with reference to Fig. 1 to Fig. 3. Fig. 1 is a top view showing an outline of the die bonder in an embodiment. Fig. 2 is a diagram explaining the outline of the configuration as seen from the direction of the arrow A in Fig. 1. Fig. 3 is a side view showing an outline of the preform part shown in Fig. 1.

[0011] The die bonder 1 broadly comprises a wafer supply unit 10, a pickup unit 20, an intermediate stage unit 30, a preform unit 90, a bonding unit 40, a transport unit 50, a substrate supply unit 60, a substrate unloading unit 70, and a control unit (controller, control device) 80. The Y2-Y1 direction is the front-rear direction of the die bonder 1, the X2-X1 direction is the left-right direction, and the Z1-Z2 direction is the up-down direction. The wafer supply unit 10 is disposed on the front side of the die bonder 1, and the bonding unit 40 is disposed on the rear side.

[0012] The wafer supply section 10 includes a wafer cassette lifter 11, a wafer holder 12, a peeling unit 13, and a wafer recognition camera 14.

[0013] A wafer cassette lifter 11 moves a wafer cassette (not shown) in which a plurality of wafer rings WR are stored up and down to the wafer transport height. A wafer correction chute (not shown) aligns the wafer rings WR supplied from the wafer cassette lifter 11. A wafer extractor (not shown) removes the wafer rings WR from the wafer cassette and supplies them to the wafer holder 12, or removes them from the wafer holder 12 and stores them in the wafer cassette.

[0014] A wafer W is adhered (attached) onto a dicing tape DT, and the wafer W is divided into a plurality of dies D. The dicing tape DT is held by a wafer ring WR. The wafer W is, for example, a semiconductor wafer or a glass wafer, and the dies D are, for example, semiconductor chips, glass chips, or MEMS (Micro Electro Mechanical Systems).

[0015] The wafer holder 12 is moved in the X1-X2 and Y1-Y2 directions by an XY table and a drive unit (not shown), and moves the die D to be picked up to the position of the peeling unit 13. The wafer holder 12 rotates the wafer ring WR in the XY plane by a drive unit (not shown). The peeling unit 13 is moved in the Z1-Z2 directions by a drive unit (not shown). The peeling unit 13 peels the die D from the dicing tape DT.

[0016] The wafer recognition camera 14 detects the pick-up position of the die D to be picked up from the wafer W and inspects the surface of the die D.

[0017] The pickup unit 20 has a pickup head 21 and a Y drive unit 23. The pickup head 21 is provided with a collet 22 that suction-holds the peeled die D at its tip. The pickup head 21 picks up the die D from the wafer supply unit 10 and places it on the intermediate stage 31. The Y drive unit 23 moves the pickup head 21 in the Y1-Y2 direction. The pickup unit 20 has each drive unit (not shown) that raises and lowers, rotates, and moves the pickup head 21 in the X1-X2 direction.

[0018] The intermediate stage unit 30 has an intermediate stage 31 on which the die D is placed, and a stage recognition camera 34 for recognizing the die D on the intermediate stage 31. The intermediate stage 31 has a suction hole that adsorbs the placed die D. The placed die D is temporarily held on the intermediate stage 31.

[0019] The preform unit 90 has a syringe 91, a drive unit 93, a preform camera 94 as a recognition camera, and a preform stage 96. The syringe 91 has a nozzle 92 at the tip of its lower part. The syringe 91 applies paste to the substrate S that has been transported to the preform stage 96 by the transport unit 50. The drive unit 93 moves the syringe 91 in the X1-X2 direction, the Y1-Y2 direction, and the Z1-Z2 direction. The substrate S is, for example, a wiring board, a lead frame formed of a thin metal plate, a glass substrate, or the like.

[0020] The preform camera 94 grasps the position of the paste applied to the substrate S by the syringe 91. The preform stage 96 rises when applying the paste to the substrate S, and supports the substrate S from below. The preform stage 96 has a suction hole (not shown) for vacuum suctioning the substrate S, and can fix the substrate S in place.

[0021] The bonding section 40 has a bond head 41, a Y drive section 43, a substrate recognition camera 44, and a bond stage 46. The bond head 41 is provided with a collet 42 that suction-holds the die D at its tip. The Y drive section 43 moves the bond head 41 in the Y1-Y2 direction. The substrate recognition camera 44 captures an image of a position recognition mark (not shown) of a package area P of the substrate S to recognize the bond position. Here, the substrate S has a plurality of product areas (hereinafter referred to as package areas P) that will eventually become one package. A position recognition mark is provided for each package area P. When the die D is placed on the substrate S, the bond stage 46 is raised and supports the substrate S from below. The bond stage 46 has a suction port (not shown) for vacuum-suctioning the substrate S, and can fix the substrate S. The bond stage 46 has a heating section (not shown) for heating the substrate S. The bonding section 40 has various drive sections (not shown) for raising and lowering the bond head 41, rotating it, and moving it in the X1-X2 directions.

[0022] With this configuration, the bond head 41 corrects the pick-up position and posture based on the imaging data of the stage recognition camera 34, and picks up the die D from the intermediate stage 31. Then, based on the imaging data of the board recognition camera 44, the bond head 41 bonds (places and adheres) the die D onto the package area P of the transported board S to which paste has been applied.

[0023] The transport section 50 has a transport claw 51 that grips and transports the substrate S, and a pair of transport lanes 52 along which the substrate S moves. The substrate S moves in the X1-X2 direction by driving a nut (not shown) of the transport claw 51 provided on the transport lane 52 by a ball screw (not shown) provided along the transport lane 52. With this configuration, the substrate S moves from the substrate supply section 60 along the transport lane 52 to the bonding position, and after bonding, moves to the substrate unloading section 70 and hands the substrate S over to the substrate unloading section 70.

[0024] The substrate supplying section 60 removes the substrate S, which has been stored in the transport jig and carried in, from the transport jig and supplies it to the transporting section 50. The substrate unloading section 70 stores the substrate S transported by the transporting section 50 in the transport jig.

[0025] The control system of the die bonder 1 will be described with reference to Fig. 4. Fig. 4 is a block diagram showing a schematic configuration of the control system of the die bonder shown in Fig. 1.

[0026] The control system 8 includes a control unit 80, a drive unit 86, a signal unit 87, and an optical system 88. The control unit 80 is broadly divided into a control and calculation unit 81 mainly composed of a CPU (Central Processing Unit), a storage unit 82, an input / output unit 83, a bus line 84, and a power supply unit 85. The storage unit 82 includes a main storage unit 82a and an auxiliary storage unit 82b. The main storage unit 82a is composed of a RAM (Random Access Memory) that stores processing programs and the like. The auxiliary storage unit 82b is composed of an HDD (Hard Disk Drive) or SSD (Solid State Drive) that stores control data, image data, and the like required for control.

[0027] The input / output device 83 includes a monitor 83a for displaying the device status and information of the die bonder 1, a touch panel 83b for inputting an operator's instruction, a mouse 83c for operating the monitor 83a, and an image capture device 83d for capturing image data from an optical system 88. The input / output device 83 further includes a motor control device 83e and an I / O signal control device 83f. The motor control device 83e controls a drive unit 86 including the XY table of the wafer supply unit 10 and the ZY drive shaft of the bond head table of the bonding unit 40. The I / O signal control device 83f captures signals from a signal unit 87 and controls the signal unit 87. The signal unit 87 includes various sensors, switches and volumes for controlling the brightness of a lighting device, etc. The control / arithmetic device 81 captures necessary data via a bus line 84, performs calculations, and transmits information to the monitor 83a and the like, as well as to control the pickup head 21 and the like.

[0028] The control and calculation device 81 stores image data captured by the optical system 88 in the storage device 82 via the image capture device 83d. The optical system 88 includes the wafer recognition camera 14, the stage recognition camera 34, the substrate recognition camera 44, and the preform camera 94. The cameras used in the optical system 88 convert light intensity and color into numerical values. The control and calculation device 81 performs positioning of the die D and substrate S, inspection of the paste application pattern, and surface inspection of the die D and substrate S by software programmed based on the stored image data. The control and calculation device 81 drives the drive unit 86 via the motor control device 83e by software based on the calculated positions of the die D and substrate S. Through this process, the control and calculation device 81 performs positioning of the die D on the wafer W, and operates the drive units of the wafer supply unit 10, the pickup unit 20, and the bonding unit 40 to bond the die D onto the package area P of the substrate S.

[0029] A bonding process (a method for manufacturing a semiconductor device), which is one of the manufacturing processes for a semiconductor device using the die bonder 1, will be described with reference to Fig. 5. Fig. 5 is a flowchart showing a method for manufacturing a semiconductor device using the die bonder shown in Fig. 1. In the following description, the operation of each part constituting the die bonder 1 is controlled by a control unit 80.

[0030] (Wafer loading: process S1) The wafer ring WR is supplied to the wafer cassette of the wafer cassette lifter 11. The supplied wafer ring WR is then supplied to the wafer holder 12.

[0031] (Substrate loading: Process S2) The transport jig storing the substrate S is supplied to the substrate supply section 60. In the substrate supply section 60, the substrate S is taken out of the transport jig and fixed to the transport claws 51.

[0032] (Pickup: Process S3) After step S1, the wafer holder 12 is moved so that the desired die D can be picked up from the dicing tape DT. The die D is photographed by the wafer recognition camera 14, and the die D is positioned and its surface inspected based on the image data acquired by photographing. The image data is processed to calculate the amount of deviation (X, Y, and θ directions) of the die D on the wafer holder 12 from the die position reference point of the die bonder, and the die D is positioned. Note that the die position reference point is previously held at a predetermined position of the wafer holder 12 as the initial setting of the device. The image data is processed to inspect the surface of the die D.

[0033] The positioned die D is peeled off from the dicing tape DT by the peeling unit 13 and the pick-up head 21. The die D peeled off from the dicing tape DT is attracted to and held by a collet 22 provided on the pick-up head 21, and is transported to and placed on the intermediate stage 31.

[0034] The die D on the intermediate stage 31 is photographed by the stage recognition camera 34, and the positioning and surface inspection of the die D are performed based on image data acquired by photographing. The image data is processed to calculate the amount of deviation (X, Y, and θ directions) of the die D on the intermediate stage 31 from the die position reference point of the die bonder 1, and positioning is performed. Note that the die position reference point is previously held at a predetermined position of the intermediate stage 31 as the initial setting of the device. The image data is processed to perform surface inspection of the die D.

[0035] The pickup head 21 that transported the die D to the intermediate stage 31 is returned to the wafer supply unit 10. The next die D is peeled off from the dicing tape DT according to the above-mentioned procedure, and thereafter, the dies D are peeled off one by one from the dicing tape DT according to the same procedure.

[0036] (Preform: Process S4) After step S2, the substrate S is transported to the preform stage 96 by the transport unit 50. The surface of the substrate S before application is photographed by the preform camera 94, and the surface to which the paste is to be applied is confirmed based on the image data acquired by photographing. If there is no problem with the surface to be applied, the position of the substrate S supported by the preform stage 96 where the paste is to be applied is confirmed and positioned. Positioning is performed by pattern matching or the like.

[0037] Paste is ejected from nozzle 92 at the tip of syringe 91 and applied to substrate S following the trajectory of nozzle 92. When the paste stored in syringe 91 is applied to substrate S, for example, pressurized gas such as air is supplied from an air pulse type dispenser from above syringe 91 for a certain period of time, and a predetermined amount of paste is discharged. With nozzle 92 brought close to substrate S, syringe 91 is scanned (drawing operation) two-dimensionally within the XY plane.

[0038] The applied paste is photographed by the preform camera 94. Whether the paste has been applied accurately is confirmed based on the image acquired by photographing, and the applied paste is inspected (visual inspection). That is, in the visual inspection, it is confirmed whether the applied paste has been applied in a predetermined amount in a predetermined shape at a predetermined position on the substrate S. The inspection contents include, for example, the presence or absence of paste, the applied area, and the applied shape (excess or shortage, overflow). The inspection is performed by a method of counting the number of pixels after separating the paste area by binarization processing, as well as a method of comparing differences and scores by pattern matching.

[0039] (Bond: Process S5) If there are no problems with the coating, the substrate S is transported to the bond stage 46 by the transport unit 50. The substrate S placed on the bond stage 46 is photographed by the substrate recognition camera 44, and image data is acquired by photographing. The image data is processed to calculate the amount of deviation (X, Y, and θ directions) of the substrate S from the substrate position reference point of the die bonder. Note that the substrate position reference point is previously held at a predetermined position of the bonding unit 40 as the initial setting of the device.

[0040] The suction position of the bond head 41 is corrected based on the deviation amount of the die D on the intermediate stage 31 calculated in step S3, and the die D is suctioned by the collet 42. The bond head 41 that has suctioned the die D from the intermediate stage 31 bonds the die D to a predetermined position of the substrate S supported by the bond stage 46. The substrate recognition camera 44 photographs the die D bonded to the substrate S, and based on the image data acquired by photographing, an inspection is performed to determine whether the die D has been bonded at the desired position, etc.

[0041] After bonding the die D to the substrate S, the bond head 41 is returned to the intermediate stage 31. Following the procedure described above, the next die D is picked up from the intermediate stage 31 and bonded to the substrate S. This is repeated until a die D is bonded to every package area P of the substrate S.

[0042] (Substrate unloading: Process S6) The substrate S with the die D bonded thereto is transported to the substrate unloading section 70. In the substrate unloading section 70, the substrate S is removed from the transport claws 51 and stored in a transport jig. The transport jig storing the substrate S is unloaded from the die bonder 1.

[0043] As described above, the die D is mounted on the substrate S and is carried out from the die bonder 1. Thereafter, for example, a transport jig storing the substrate S on which the die D is mounted is transported to a wire bonding process, and the electrodes of the die D are electrically connected to the electrodes of the substrate S via Au wires or the like. Then, the substrate S is transported to a molding process, and the die D and the Au wires are sealed with molding resin (not shown), thereby completing a semiconductor package.

[0044] In the case of stacked bonding, following the wire bonding process, a transport jig on which a substrate S on which a die D is mounted is loaded and stored is transported into a die bonder, and the die D is stacked on the die D mounted on the substrate S. Then, after being transported out of the die bonder, the die D is electrically connected to the electrodes of the substrate S via Au wires in a wire bonding process. The dies D above the second stage are peeled off from the dicing tape DT by the above-mentioned method, transported to the bonding section, and stacked on the dies D. After the above process is repeated a predetermined number of times, the substrate S is transported to a molding process, and the multiple dies D and Au wires are sealed with molding resin (not shown) to complete a stacked package.

[0045] Setting of a paste application pattern will be described with reference to Fig. 6 and Fig. 7. Fig. 6 is a diagram showing a setting screen for the application pattern. Fig. 7 is a diagram showing an example of a lead frame and an application pattern displayed on the setting screen shown in Fig. 6. The following description will be given taking a lead frame LF as an example of the substrate S.

[0046] As described above, the paste is ejected from the nozzle 92 at the tip of the syringe 91 by the drawing operation of the syringe 91, and is applied to a predetermined location of the package area P of the substrate S (a predetermined location of the tab TB serving as a die mounting portion of the lead frame LF) according to the trajectory of the nozzle 92. The trajectory of the nozzle 92, i.e., the application pattern, is, for example, an x-shape or a cross shape.

[0047] As described above, the coating pattern required varies depending on the shape and size of the die, the member to which the paste is to be coated, and the like, and therefore the coating pattern must be set according to the die and member.

[0048] In this embodiment, when setting an application pattern, as shown in FIG. 6, tabs TB of the lead frame LF and an application pattern PAP are displayed on the touch panel 83b as an operation screen (setting screen).

[0049] More specifically, in advance (before the application pattern is set), the control unit 80 photographs the tab TB of the lead frame LF using the preform camera 94 and stores the image of the tab TB of the lead frame LF as shown in FIG. 7 in the memory device 82 (step S11).

[0050] When setting the application pattern, the control unit 80 displays an image of the tab TB of the lead frame LF as shown in FIG. 7 on the setting screen (step S12).

[0051] The application pattern PAP is input on a setting screen (step S13). For example, the application pattern PAP may be selected from application patterns registered in advance, or may be input by inputting numerical values. Also, the application pattern PAP may be input to the die bonder from an external device via communication or the like.

[0052] Next, as shown in FIG. 6, the control unit displays an application pattern PAP having the same ratio as the size of the tab TB of the leadframe LF displayed on the setting screen, superimposed on the image of the tab TB of the leadframe LF (step S14).

[0053] The operator of the die bonder adjusts the position and size of the paste while watching the screen. At that time, steps S13 and S14 are repeated as necessary. If there are no problems, the paste shape is decided and production (application) begins.

[0054] According to this embodiment, the application pattern PAP is displayed on the image of the tab TB of the actual lead frame LF, so it is possible to visually confirm what kind of application pattern will be formed within the tab TB. This makes it possible to visually compare the tab size and the application pattern size, and it is possible to prevent errors in applying paste in advance. In addition, it is easy to grasp the ratio of the size of the tab TB and the application pattern PAP, improving usability.

[0055] <Modification> Below, some representative modified examples of the embodiment are exemplified. In the following description of the modified examples, the same reference numerals as those in the above-mentioned embodiment may be used for parts having the same configuration and function as those described in the above-mentioned embodiment. The description of such parts may be appropriately cited within the scope of technical inconsistency. Furthermore, a part of the above-mentioned embodiment and all or a part of the multiple modified examples may be appropriately applied in a composite manner within the scope of technical inconsistency.

[0056] (First Modification) Setting of an application pattern in the first modified example will be described with reference to Fig. 8 to Fig. 11. Fig. 8 is a diagram showing a change over time in the shape of the applied paste. Fig. 9 is a diagram showing a contour image of the paste shown in Fig. 8. Fig. 10 is a diagram showing a setting screen for the application pattern in the first modified example. Fig. 11 is a diagram for explaining a method of displaying the setting screen in the embodiment and the first modified example.

[0057] When the paste PA is applied to the tab TB of the lead frame LF, the paste PA spreads over time as shown in FIG.

[0058] Prior to this (before continuous operation, before production operation, and before setting of the application pattern), the control unit 80 performs a test application of the paste PA to the tab TB of the lead frame LF. The control unit 80 starts measuring the elapsed time at the same time as the application. When the measured elapsed time reaches a predetermined time, the control unit 80 uses the preform camera 94 to obtain an image of the paste PA, which is then stored and registered in the storage device 82 (step S21). This allows an image of the change over time in the planar shape of the paste to be registered.

[0059] For example, when the predetermined time is ta, the control unit 80 photographs the paste PA applied to the lead frame LF with the preform camera 94, and the image shown at t=ta in Fig. 8 is registered. After that, when the predetermined time is tb, the control unit 80 photographs the paste PA applied to the lead frame LF with the preform camera 94, and the image shown at t=tb in Fig. 8 is registered. After that, when the predetermined time is tc, the paste PA applied to the lead frame LF is photographed with the preform camera 94, and the image shown at t=tc in Fig. 8 is registered.

[0060] Next, the control unit 80 generates and registers paste contour images CTa, CTb, and CTc at t=ta, tb, and tc as shown in FIG. 9 from the registered image of the change over time of the paste (step S22).

[0061] An image of the paste corresponding to the set time elapsed since the paste application is selected from the registered contour images CTa to CTc and displayed superimposed on the image displayed in step S14 (step S23). The selection method may be to directly select the displayed image, or to scroll the seek bar to switch the elapsed time and display and select an image of the corresponding elapsed time.

[0062] The operator of the die bonder adjusts the position and size of the paste while watching the screen. At that time, steps S13, S14, and S23 are repeated as necessary. If there are no problems, the paste shape is decided and production (application) begins.

[0063] According to the first modification, the change in the paste over time is also displayed, so that the application pattern can be determined while checking the paste shape immediately before bonding. The shape of the paste after it is actually applied is displayed together with the tab, so that it is possible to visually compare the tab size with the application pattern size, and errors in paste application can be prevented in advance. In addition, the paste shape inside the tab immediately before bonding the die can be checked before application, so that the paste overflow after bonding the die can be predicted in advance, and an appropriate application shape can be set, improving application quality.

[0064] (Second Modification) In addition to the prediction of the change over time in the planar shape of the paste, height information may also be superimposed and displayed.

[0065] For example, in step S21 of the first modified example, the control unit 80 further acquires an image of the side shape of the paste PA by photographing the paste from directly beside it with the preform camera 94 at a different position or with another camera when the measuring time reaches a predetermined time, and stores and registers the image in the storage device 82. In this way, an image of the change over time in the three-dimensional shape including the height information of the paste is registered.

[0066] Next, in step S22, the control unit 80 further generates and registers images in which contour lines, which are height information, are added to the paste outline images CTa, CTb, and CTc, a heat map image, and the like.

[0067] In step S23, an image of the paste corresponding to the set time that has elapsed since the paste was applied is selected from the images to which the height information has been added, and is displayed superimposed on the image displayed in step S14.

[0068] (Third Modification) At least one of the images of the change over time of the planar shape of the paste registered in steps S21 and S22 of the first modified example and the images of the change over time of the three-dimensional shape of the paste registered in the second modified example is registered in storage device 82. When new paste application conditions are determined, a search is performed to see if they have been registered in storage device 82, and if they have not been registered, steps S21 and S22 may be performed.

[0069] The disclosure made by the present inventors has been specifically described above based on embodiments and modified examples. However, it goes without saying that the present disclosure is not limited to the above-described embodiments and modified examples, and various modifications are possible.

[0070] In the embodiment, an example has been described in which an intermediate stage section 30 is provided between the wafer supply section 10 and the bonding section 40, a die D picked up from the wafer supply section 10 by the pick-up head 21 is placed on the intermediate stage 31, and the die D is picked up again from the intermediate stage 31 by the bond head 41 and bonded to the transported substrate S. The die D picked up from the wafer supply section 10 by the bond head 41 may also be bonded to the substrate S. [Explanation of symbols]

[0071] 1. Die bonder (semiconductor manufacturing equipment) 92 Nozzle 94 Preform camera (recognition camera) 96 Preform stage (stage) 80... Control unit (control device)

Claims

1. A stage for holding the substrate; A recognition camera, a nozzle provided above the stage so as to be movable according to a coating pattern; a bond head for bonding a die to the substrate on which the paste has been applied by the nozzle; a control device configured to photograph the substrate held on the stage with the recognition camera to obtain a substrate image, and to display the substrate image and a selected coating pattern on a screen in a superimposed manner; A semiconductor manufacturing apparatus comprising:

2. 2. The semiconductor manufacturing apparatus according to claim 1, The control device is a semiconductor manufacturing device configured to perform a test application of paste, photograph the planar shape of the paste at multiple time intervals after application using the recognition camera, and register each paste image.

3. 3. The semiconductor manufacturing apparatus according to claim 2, The control device is configured to acquire a paste image corresponding to a set elapsed time after application from the paste image, and display the acquired paste image on the screen by superimposing it on the substrate image and the application pattern.

4. 3. The semiconductor manufacturing apparatus according to claim 2, The control device of the semiconductor manufacturing apparatus is further configured to photograph the side shape of the paste at multiple time intervals after application with a recognition camera and register height information of each paste.

5. 5. The semiconductor manufacturing apparatus according to claim 4, The control device is a semiconductor manufacturing device configured to acquire a paste image and height information corresponding to a set elapsed time after application from the paste image, and display the acquired paste image and height information on the screen by superimposing the acquired paste image and height information on the substrate image and the application pattern.

6. A stage for holding the substrate; A recognition camera, a nozzle provided above the stage so as to be movable according to a coating pattern; a control device configured to photograph the substrate held on the stage with the recognition camera to obtain a substrate image, and to display the substrate image and a selected coating pattern on a screen in a superimposed manner; A coating device comprising:

7. carrying a substrate into a semiconductor manufacturing device including a stage for holding the substrate, a recognition camera, a nozzle movably provided above the stage in accordance with a coating pattern, and a control device configured to photograph the substrate held on the stage with the recognition camera to obtain a substrate image, and to display the substrate image and a selected coating pattern superimposed on a screen; a coating step of coating the substrate with a paste by the nozzle; a bonding step of bonding a die to the substrate on which the paste is applied; A method for manufacturing a semiconductor device having the above structure.

Images