Fully automatic laser thickness measurement multiaxis polishing cleaning device

Abstract

To provide a fully automatic laser thickness measurement multiaxis polishing cleaning device that measures a present thickness of a polishing target panel to adjust a distance between a first polishing roller and a second polishing roller, thereby improving accuracy of polishing.SOLUTION: A polishing cleaning device includes: a thickness measurement mechanism installed to a frame; a transport mechanism; a plurality of polishing mechanisms; and cleaning mechanisms of which quantity is matched to the number of the polishing mechanisms. The thickness measurement mechanism is positioned in a feeding end of the transport mechanism. The cleaning mechanisms are positioned above the corresponding polishing mechanisms. The cleaning mechanisms are used for spraying cleaning fluid to the polishing mechanisms.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to the technical field of polishing, and in particular to a fully automatic laser thickness measuring multi-axis polishing and cleaning device. [Background technology]

[0002] Conventionally, before using objects to be processed such as membranes, paper, nonwoven fabrics, metal foils, steel plates, etc. (hereinafter referred to as panels), polishing treatment is required, and generally, the polishing of metal foils needs to be performed in multiple stages, so the thickness of the metal foils gradually becomes thinner. However, in reality, the initial thickness of each metal foil has a certain error, and the position of the polishing roller cannot be adjusted, so that the thickness varies during the polishing process, which affects the polishing accuracy. Summary of the Invention [Problem to be solved by the invention]

[0003] In order to overcome the deficiencies and shortcomings of the prior art, the objective of the present invention is to provide a fully automatic laser thickness measurement multi-axis polishing and cleaning device, which measures the thickness of the current panel to be polished, thereby adjusting the distance between the first polishing roller and the second polishing roller, and improving the accuracy of polishing. [Means for solving the problem]

[0004] The present invention is realized by the following technical solutions.

[0005] The fully automatic laser thickness measurement multi-axis polishing and cleaning device includes a frame, a thickness measurement mechanism provided on the frame, a transport mechanism, a plurality of polishing mechanisms, and a cleaning mechanism corresponding to the number of the polishing mechanisms, the thickness measurement mechanism is located at the supply end of the transport mechanism, the cleaning mechanism is located above the corresponding polishing mechanism, and the cleaning mechanism is used to spray cleaning liquid onto the polishing mechanism; The polishing mechanism includes a first polishing roller, a second polishing roller located below the first polishing roller, and a first polishing rotation drive mechanism, a second polishing rotation drive mechanism, a first polishing lift drive mechanism, and a second polishing lift drive mechanism provided on a frame, the first polishing lift drive mechanism and the second polishing lift drive mechanism are each electrically connected to a thickness measurement mechanism, both ends of the first polishing roller and both ends of the second polishing roller are each connected to the frame so as to be slidable up and down, the first polishing rotation drive mechanism is used to drive the first polishing roller to rotate, the second polishing rotation drive mechanism is used to drive the second polishing roller to rotate, the first polishing lift drive mechanism is used to drive the first polishing roller to move up and down, and the second polishing lift drive mechanism is used to drive the second polishing roller to move up and down.

[0006] Here, the first polishing rotation drive mechanism includes a first rotation drive member, a first synchronous wheel, a first synchronous belt, a second synchronous wheel, and a tension mechanism, the first rotation drive member is provided on a frame, the first synchronous wheel is provided at the output end of the first rotation drive member, the second synchronous wheel is provided at one end of the first polishing roller, the first synchronous wheel is drivingly connected to the second synchronous wheel via the first synchronous belt, and the tension mechanism is used to tension the first synchronous belt.

[0007] Here, the tension mechanism includes a tension base provided on a frame, a first elastic member provided on the tension base, and a tension wheel provided on one end of the first elastic member, the tension wheel being in contact with the first synchronous belt,

[0008] When the tension wheel is brought into contact with the first synchronous belt, the first elastic member contracts to drive the tension wheel to tension the first synchronous belt.

[0009] Here, the structure of the second polishing rotary drive mechanism is the same as the structure of the first polishing rotary drive mechanism.

[0010] Here, the first polishing lifting drive mechanism includes a first lifting drive member provided on a frame and a first bearing stand provided on the frame so as to be slidable up and down, the output end of the first lifting drive member is connected to the lower end of the first bearing stand, and the bearing of the first bearing stand is fitted into one end of the first polishing roller.

[0011] Here, the structure of the second polishing lift drive mechanism is the same as the structure of the first polishing lift drive mechanism.

[0012] Here, the cleaning mechanism includes a liquid transport pipe and a plurality of nozzles provided on one side of the liquid transport pipe, the plurality of nozzles being connected to the liquid transport pipe, the polishing and cleaning apparatus further includes a water pipe provided on the frame, the ends of the water pipes respectively being connected to the liquid transport pipes of the plurality of cleaning mechanisms, and the water supply ends of the water pipes are used to connect to an external liquid supply unit.

[0013] Here, the transport mechanism includes a transport drive mechanism, a plurality of first transport rollers arranged in a coplanar manner, and second transport rollers, the number of which is the same as the number of the first transport rollers, the second transport rollers abut against the upper ends of the corresponding first transport rollers, and the transport mechanism is used to drive the first transport rollers to roll.

[0014] Here, the transport mechanism further includes two second elastic members symmetrically arranged on both ends of the second transport roller, and two second bearing stands symmetrically arranged on both ends of the second transport roller, the upper ends of the second elastic members are connected to a frame, the second bearing stands are connected to the frame so as to be slidable up and down, the lower ends of the second elastic members are connected to the upper ends of the second bearing stands, and the bearings of the second bearing stands are fitted into one end of the second transport roller.

[0015] Here, the transport drive mechanism includes a transport drive member, a chain, and a plurality of gears, each of which is provided in one-to-one correspondence with one end of the first transport roller, and the transport drive member is drivingly connected to each of the plurality of gears via a chain. Effect of the Invention

[0016] The beneficial effects of the present invention are as follows:

[0017] In the fully automatic laser thickness measurement multi-axis polishing and cleaning apparatus according to the present invention, a thickness measurement mechanism and a polishing mechanism are provided, in which the thickness measurement mechanism can measure the thickness of the panel to be polished, and the first polishing lifting and lowering drive mechanism and the second polishing lifting and lowering drive mechanism of the polishing mechanism can respectively lift and lower the first polishing roller and the second polishing roller based on the numerical value obtained by the thickness measurement mechanism, thereby adjusting the distance between the first polishing roller and the second polishing roller and improving the accuracy of polishing. [Brief description of the drawings]

[0018] The present invention will be further described with reference to the drawings, but the embodiments in the drawings do not limit the present invention, and those skilled in the art can also obtain other drawings according to the following drawings without creative work.

[0019] [Figure 1] FIG. 1 is a perspective view of the present invention. [Diagram 2] FIG. 2 is a front view of the present invention. [Diagram 3] FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0020] In order to make the above objects, features and advantages of the present invention clearer, specific embodiments of the present invention will be described in detail below with reference to the drawings. In the following description, many specific details are set forth in order to provide a thorough understanding of the present invention. However, the present invention is not limited to the specific embodiments disclosed below, since the present invention can be implemented in many ways other than those described herein, and those skilled in the art can make similar improvements without departing from the spirit of the present invention.

[0021] In describing the present invention, as necessary for understanding, the orientations or positional relationships indicated by terms such as "center", "lateral", "longitudinal", "width", "length", "thickness", "up", "down", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "diameter", "circumferential" and the like are based on the orientations or positional relationships shown in the accompanying drawings and are used only to explain and simplify the description of the present invention, and do not indicate or imply that the devices or elements referred to have a particular orientation and must be constructed and operated in a particular direction, and therefore should not be construed as limitations on the present invention.

[0022] Additionally, the terms "first" and "second" are used for descriptive purposes only and should not be construed to indicate or imply relative importance or quantity of technical features. Thus, a feature delimited by "first" and "second" may explicitly or implicitly include one or more of that feature. In the present description, unless otherwise specified, the meaning of "plurality" refers to two or more, e.g., two, three.

[0023] Conventionally, before using objects to be processed such as membranes, paper, nonwoven fabrics, metal foils, steel plates, etc. (hereinafter referred to as panels), polishing treatment is required, and generally, the polishing of metal foils needs to be performed in multiple stages, so the thickness of the metal foils gradually becomes thinner. However, in reality, the initial thickness of each metal foil has a certain error, and the position of the polishing roller cannot be adjusted, so that the thickness varies during the polishing process, which affects the polishing accuracy.

[0024] In order to solve the above problems, this embodiment discloses a fully automatic laser thickness measurement multi-axis polishing and cleaning apparatus, the structure of which is shown in FIG. 1 to FIG. 3. The polishing and cleaning apparatus includes a frame 100, a thickness measurement mechanism 101 provided on the frame 100, a transport mechanism 200, a plurality of polishing mechanisms 301, and a cleaning mechanism 401 corresponding to the number of the polishing mechanisms 301. The thickness measurement mechanism 101 is located at the supply end of the transport mechanism 200, and the cleaning mechanism 401 is located above the corresponding polishing mechanism 301. The cleaning mechanism 401 is used to spray cleaning liquid onto the polishing mechanism 301.

[0025] The polishing mechanism 301 includes a first polishing roller 302, a second polishing roller 303 located below the first polishing roller 302, a first polishing rotation drive mechanism 304, a second polishing rotation drive mechanism 313, a first polishing lift drive mechanism 314, and a second polishing lift drive mechanism 317 provided on a frame 100. The first polishing lift drive mechanism 314 and the second polishing lift drive mechanism 317 are each electrically connected to a thickness measurement mechanism 101. Both ends of the first polishing roller 302 and both ends of the second polishing roller 303 are each connected to a frame 101. 100 so as to be slidable up and down, the first polishing rotation drive mechanism 304 is used to drive the first polishing roller 302 to rotate, the second polishing rotation drive mechanism 313 is used to drive the second polishing roller 303 to rotate, the first polishing lift drive mechanism 314 is used to drive the first polishing roller 302 to move up and down, and the second polishing lift drive mechanism 317 is used to drive the second polishing roller 303 to move up and down.

[0026] 2 and 3, the polishing mechanism 301 in this embodiment includes three sets of first polishing rotation drive mechanisms 304 and three sets of second polishing rotation drive mechanisms 313, that is, the number of first polishing rollers 302 and second polishing rollers 303 in this embodiment is three, and the above three-set structure polishes the panel to three different thicknesses, achieving a polishing effect on three axes, left and right, for a total of six axes. Note that the thickness measurement mechanism 101 in this embodiment is a conventional technology, and its description will be omitted here.

[0027] In the fully automatic laser thickness measurement multi-axis polishing and cleaning apparatus according to the present invention, a thickness measurement mechanism 101 and a polishing mechanism 301 are provided, in which the thickness measurement mechanism 101 can measure the thickness of the panel to be polished, and the first polishing lifting and lowering drive mechanism 314 and the second polishing lifting and lowering drive mechanism 317 of the polishing mechanism 301 can respectively lift and lower the first polishing roller 302 and the second polishing roller 303 based on the numerical value obtained by the thickness measurement mechanism 101, thereby adjusting the distance between the first polishing roller and the second polishing roller and improving the accuracy of polishing.

[0028] Further, the first polishing rotation drive mechanism 304 includes a first rotation drive member 305, a first synchronous wheel 306, a first synchronous belt 307, a second synchronous wheel 308, and a tension mechanism 309, wherein the first rotation drive member 305 is mounted on the frame 100, the first synchronous wheel 306 is mounted on the output end of the first rotation drive member 305, the second synchronous wheel 308 is mounted on one end of the first polishing roller 302, the first synchronous wheel 306 is drivingly connected to the second synchronous wheel 308 via the first synchronous belt 307, and the tension mechanism 309 is used to tension the first synchronous belt 307.

[0029] In this embodiment, the first rotary driving member 305 is preferably a servo motor. In the process of driving the first polishing roller 302 to ascend and descend, the distance between the first synchronous wheel 306 and the second synchronous wheel 308 changes, so the length of the first synchronous belt 307 needs to have a certain margin. In this case, in order to prevent the first synchronous belt 307, the first synchronous wheel 306 and the second synchronous wheel 308 from loosening and falling, the tension mechanism 309 performs a self-adaptive tensioning process on the first synchronous belt 307.

[0030] Further, the tension mechanism 309 includes a tension base 310 provided on the frame 100, a first elastic member 311 provided on the tension base 310, and a tension wheel 312 provided on one end of the first elastic member 311, the first elastic member 311 is preferably a spring, and the tension wheel 312 is abutted against the first synchronous belt 307. As can be seen from FIG. 2, the tension wheel 312 is located inside the first synchronous belt 307, and when the first polishing roller 302 and the second polishing roller 303 move away from each other, the first synchronous belt 307 pulls the first elastic member 311 to extend, and when the first polishing roller 302 and the second polishing roller 303 approach each other, the first elastic member 311 contracts so that the tension wheel 312 always maintains abutment against the first synchronous belt 307. Therefore, the tension wheel 312 is always in contact with the first synchronous belt 307, and the first elastic member 311 contracts to drive the tension wheel 312 to tension the first synchronous belt 307.

[0031] In addition, since the structure of the second polishing rotation drive mechanism 313 in this embodiment is the same as the structure of the first polishing rotation drive mechanism 304, the operating principle of the second polishing rotation drive mechanism 313 driving the second polishing roller 303 to rotate is the same as the operating principle of the first polishing rotation drive mechanism 304 driving the first polishing roller 302 to rotate, and therefore will not be explained here.

[0032] Furthermore, the first polishing lifting drive mechanism 314 includes a first lifting drive member 315 provided on the frame 100, and a first bearing stand 316 provided on the frame 100 so as to be slidable up and down, and the output end of the first lifting drive member 315 is connected to the lower end of the first bearing stand 316, and the bearing of the first bearing stand 316 is fitted into one end of the first polishing roller 302.

[0033] In this embodiment, the first lifting drive member 315 is preferably a hydraulic cylinder, and the first lifting drive member 315 drives the bearing stand to move up and down, and moves the first polishing roller 302 to move up and down.

[0034] In addition, since the structure of the second polishing lifting drive mechanism 317 in this embodiment is the same as the structure of the first polishing lifting drive mechanism 314, the operating principle of the second polishing lifting drive mechanism 317 driving the second polishing roller 303 to lift and lower is the same as the operating principle of the first polishing lifting drive mechanism 314 driving the first polishing roller 302 to lift and lower, and therefore, explanation thereof will be omitted here.

[0035] Further, the cleaning mechanism 401 includes a liquid transport pipe 402 and a plurality of nozzles 403 provided on one side of the liquid transport pipe 402, the plurality of nozzles 403 communicate with the liquid transport pipe 402, the polishing and cleaning device further includes a water pipe 404 provided on the frame 100, the ends of the water pipe 404 communicate with the liquid transport pipes 402 of the plurality of cleaning mechanisms 401 respectively, and the water supply end of the water pipe 404 is used to communicate with an external liquid supply unit. In this embodiment, the end of the water pipe 404 can be connected to a water pump from the outside, and the water pump injects the cleaning liquid from the water pipe 404 into each liquid transport pipe 402, and then sprays it onto the polishing mechanism 301 through the corresponding nozzle 403.

[0036] Further, the transport mechanism 200 includes a transport driving mechanism 201, a plurality of first transport rollers 202 arranged in a coplanar manner, and second transport rollers 203 whose number is the same as that of the first transport rollers 202, the second transport rollers 203 abut against the upper ends of the corresponding first transport rollers 202, and the transport mechanism 201 is used to drive the first transport rollers 202 to roll.

[0037] In this embodiment, the transport drive member 204 includes a chain 205 and a plurality of gears 206, each of which is provided in one-to-one correspondence with one end of the first transport roller 202, and the transport drive member 204 is drivingly connected to the plurality of gears 206 via the chain 205, respectively, and the transport drive member 204 is preferably a servo motor, and the transport drive member 204 drives the gears 206 to rotate via the chain 205, thereby realizing the panel transport effect.

[0038] Specifically, the transport mechanism 200 further includes two second elastic members 207 symmetrically arranged on both ends of the second transport roller 203, and two second bearing pedestals 208 symmetrically arranged on both ends of the second transport roller 203, the upper end of the second elastic member 207 is connected to the frame 100, the second bearing pedestal 208 is connected to the frame 100 so as to be vertically slidable, the lower end of the second elastic member 207 is connected to the upper end of the second bearing pedestal 208, and the bearing of the second bearing pedestal 208 is fitted to one end of the second transport roller 203. During actual use, when the panel passes through the first polishing roller 302 and the second polishing roller 303, the first polishing roller 302 can be lifted, and at the same time, the first polishing roller 302 and the second polishing roller 303 are respectively abutted against the two end surfaces of the panel through the second elastic member 207, thereby ensuring the stability of the panel transportation.

[0039] Finally, for illustrative purposes, the above embodiments are only used to describe the technical solutions of the present invention, and do not limit the protection scope of the present invention; the present invention is described in detail with reference to the preferred embodiments, but those skilled in the art should understand that they can make modifications or equivalent substitutions to the technical solutions of the present invention without departing from the substance and scope of the technical solutions of the present invention. [Explanation of symbols]

[0040] Frame--100, thickness measuring mechanism--101, A transport mechanism 200, a transport drive mechanism 201, a first transport roller 202, a second transport roller 203, a transport drive member 204, a chain 205, a gear 206, a second elastic member 207, a second bearing stand 208, Polishing mechanism 301, first polishing roller 302, second polishing roller 303, first polishing rotation drive mechanism 304, first rotation drive member 305, first synchronous wheel 306, first synchronous belt 307, second synchronous wheel 308, tension mechanism 309, tension base 310, first elastic member 311, tension wheel 312, second polishing rotation drive mechanism 313, first polishing lift drive mechanism 314, first lift drive member 315, first bearing stand 316, second polishing lift drive mechanism 317, Cleaning mechanism--401, liquid transport pipe--402, nozzle--403, water pipe--404

Claims

1. A fully automatic laser thickness measurement multi-axis polishing and cleaning apparatus including a frame, further including a thickness measurement mechanism provided on the frame, a transport mechanism, a plurality of polishing mechanisms, and a number of cleaning mechanisms corresponding to the number of polishing mechanisms, wherein the thickness measurement mechanism is located at a feed end of the transport mechanism, the cleaning mechanism is located above a corresponding polishing mechanism, and the cleaning mechanism is used to spray a cleaning liquid onto the polishing mechanism; The polishing mechanism includes a first polishing roller, a second polishing roller located below the first polishing roller, and a first polishing rotation drive mechanism, a second polishing rotation drive mechanism, a first polishing lift drive mechanism, and a second polishing lift drive mechanism provided on a frame, the first polishing lift drive mechanism and the second polishing lift drive mechanism are each electrically connected to a thickness measurement mechanism, both ends of the first polishing roller and both ends of the second polishing roller are each connected to the frame so as to be slidable up and down, the first polishing rotation drive mechanism is used to drive the first polishing roller to rotate, the second polishing rotation drive mechanism is used to drive the second polishing roller to rotate, the first polishing lift drive mechanism is used to drive the first polishing roller to move up and down, and the second polishing lift drive mechanism is used to drive the second polishing roller to move up and down. A fully automatic laser thickness measurement multi-axis polishing and cleaning device.

2. 2. The fully automatic laser thickness measurement multi-axis polishing and cleaning apparatus of claim 1, wherein the first polishing rotary drive mechanism includes a first rotary drive member, a first synchronous wheel, a first synchronous belt, a second synchronous wheel, and a tension mechanism, the first rotary drive member is mounted on a frame, the first synchronous wheel is mounted on an output end of the first rotary drive member, the second synchronous wheel is mounted on one end of a first polishing roller, the first synchronous wheel is drivingly connected to the second synchronous wheel via a first synchronous belt, and the tension mechanism is used to tension the first synchronous belt.

3. The tension mechanism includes a tension base provided on a frame, a first elastic member provided on the tension base, and a tension wheel provided on one end of the first elastic member, the tension wheel being in contact with the first synchronous belt, 3. The fully automatic laser thickness measurement multi-axis polishing and cleaning device according to claim 2, characterized in that, when the tension wheel is in contact with the first synchronous belt, the first elastic member contracts to drive the tension wheel to tension the first synchronous belt.

4. 4. The fully automatic laser thickness measuring multi-axis polishing and cleaning device according to claim 2 or 3, wherein the structure of the second polishing rotary drive mechanism is the same as that of the first polishing rotary drive mechanism.

5. 2. The fully automatic laser thickness measurement multi-axis polishing and cleaning device according to claim 1, wherein the first polishing lifting and lowering drive mechanism includes a first lifting and lowering drive member mounted on a frame and a first bearing stand mounted on the frame so as to be slidable up and down, an output end of the first lifting and lowering drive member is connected to a lower end of the first bearing stand, and a bearing of the first bearing stand is fitted to one end of a first polishing roller.

6. The fully automatic laser thickness measuring multi-axis polishing and cleaning device according to claim 5, wherein the structure of the second polishing lifting and driving mechanism is the same as that of the first polishing lifting and driving mechanism.

7. 2. The fully automatic laser thickness measurement multi-axis polishing and cleaning device according to claim 1, characterized in that the cleaning mechanism includes a liquid transport pipe and a plurality of nozzles provided on one side of the liquid transport pipe, the plurality of nozzles being connected to the liquid transport pipe, the polishing and cleaning device further includes a water pipe provided on the frame, ends of the water pipes being connected to the liquid transport pipes of the plurality of cleaning mechanisms respectively, and a water supply end of the water pipe is used to connect to an external liquid supply unit.

8. The fully automatic laser thickness measurement multi-axis polishing and cleaning apparatus of claim 1, characterized in that the transport mechanism includes a transport drive mechanism, a plurality of coplanar first transport rollers, and second transport rollers, the number of which is the same as the number of the first transport rollers, the second transport rollers being abutted against the upper ends of the corresponding first transport rollers, and the transport mechanism is used to drive the first transport rollers to roll.

9. 9. The fully automatic laser thickness measurement multi-axis polishing and cleaning device according to claim 8, wherein the transport mechanism further includes two second elastic members symmetrically arranged on both ends of the second transport roller, and two second bearing stands symmetrically arranged on both ends of the second transport roller, the upper ends of the second elastic members are connected to a frame, the second bearing stands are connected to the frame so as to be slidable up and down, the lower ends of the second elastic members are connected to the upper ends of the second bearing stands, and the bearings of the second bearing stands are fitted to one ends of the second transport rollers.

10. The fully automatic laser thickness measurement multi-axis polishing and cleaning apparatus according to claim 8, characterized in that the transport driving mechanism includes a transport driving member, a chain, and a plurality of gears, each of which is provided in one-to-one correspondence with one end of the first transport roller, and the transport driving member is drivably connected to each of the plurality of gears via a chain.

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