Equipping system and method for equipping

Abstract

To suppress reduction of productivity while determining interference of an equipped head with a component having been equipped.SOLUTION: An equipping system 1 includes an equipped head, a storage unit (an equipped storage unit 36), an interference determination unit 33, and an equipped head control unit 31. The interference determination unit 33 determines whether a component having been equipped and the equipped head interfere with each other on the basis of shape information (component information 36b), substrate information 36c, and a displacement amount of a holding target component to the equipped head. The equipped head control unit 31 changes a sequence of equipping so that the holding target component will be equipped in the equipping position of a same type of a component in a case where the same type of the component is equipped later than the holding target component held by the equipped head when it is determined that the equipped head interferes with the component having been equipped.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present disclosure relates generally to a mounting system and a mounting method, and more particularly to a mounting system and a mounting method for mounting components on a board. [Background technology]

[0002] Patent Document 1 describes an interference check device that determines whether or not there is interference between a suction nozzle and a component already mounted on a board, based on three-dimensional data of the shape of the suction nozzle and the shape of the component, and the movement trajectory of the suction nozzle. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2007-12929 A Summary of the Invention [Problem to be solved by the invention]

[0004] In the interference check device described in Patent Document 1, if the suction nozzle interferes with an already mounted component (a component that has already been mounted), the component that is being picked up by the suction nozzle at the time the interference is determined cannot be mounted, resulting in a problem of reduced productivity.

[0005] An object of the present disclosure is to provide a mounting system and a mounting method that are capable of suppressing a decrease in productivity while determining whether a mounting head interferes with already-mounted components. [Means for solving the problem]

[0006] A mounting system according to an aspect of the present disclosure includes a mounting head, a storage unit, an interference determination unit, and a mounting head control unit. The mounting head holds a plurality of components and mounts them on a board. The storage unit stores shape information, board information, and operation information. The shape information is information about shapes of the plurality of components. The board information includes a plurality of electrode positions on the board to which the plurality of components are electrically connected, or a plurality of mounting positions on the board to which the plurality of components are mounted. The operation information is information about an operation of the mounting head when mounting the plurality of components. The interference determination unit determines whether or not a mounted component interferes with the mounting head based on the shape information, the board information, and a positional deviation amount of a held component with respect to the mounting head. The held component is a component of the plurality of components that is held by the mounting head. The mounted component is a component that has already been mounted on the board. The mounting head control unit changes the operation information when the interference determination unit determines that the mounting head interferes with the mounted component. The operation information includes a mounting order of the plurality of components on the board. The mounting head control unit has a mounting order change function. The mounting order change function is a function for changing the mounting order so that, when a similar component of the same type as the held component is to be mounted after the held component held by the mounting head when it is determined that the mounting head will interfere with the mounted component, the held component is mounted at the mounting position where the similar component is to be mounted.

[0007] In a mounting method according to one aspect of the present disclosure, whether or not a mounted component interferes with the mounting head is determined based on shape information, board information, and a positional deviation amount of the held component relative to the mounting head. The shape information is information regarding the shapes of a plurality of components held by the mounting head and mounted on the board. The board information includes a plurality of electrode positions on the board to which the plurality of components are electrically connected, or a plurality of mounting positions on the board to which the plurality of components are mounted. The held component is a component among the plurality of components that is held by the mounting head. The mounted component is a component that has already been mounted on the board. In the mounting method, when it is determined that the mounting head interferes with the mounted component, if a similar component of the same type as the held component is mounted on the board after the mounting order of the held component held by the mounting head, the mounting order is changed so that the held component is mounted at the mounting position where the similar component is mounted. Effect of the Invention

[0008] According to the mounting system and mounting method according to one aspect of the present disclosure, it is possible to suppress a decrease in productivity while determining whether the mounting head interferes with already-mounted components. [Brief description of the drawings]

[0009] [Figure 1] FIG. 1 is a block diagram of a mounting system according to an embodiment. [Diagram 2] FIG. 2 is a plan view of the mounting system. [Diagram 3] FIG. 3 is a side view of the mounting system. [Figure 4] FIG. 4 is a front view of the mounting head in the mounting system. [Diagram 5] FIG. 5 is a diagram showing an example of position information used in the mounting system. [Figure 6] FIG. 6 is a diagram showing an example of an image captured by a component recognition camera in the mounting system. [Figure 7]FIG. 7 is an explanatory diagram for explaining a state in which the suction nozzle of the mounting head interferes with an already-mounted component in the mounting system. [Figure 8] FIG. 8 is an explanatory diagram for explaining a method for avoiding interference between the suction nozzle of the mounting head and the mounted component in the mounting system. [Figure 9] FIG. 9 is an explanatory diagram for explaining another method for avoiding interference between the suction nozzle of the mounting head and the mounted component in the mounting system. [Figure 10] FIG. 10 is a flowchart showing a part of the operation of the mounting system. [Figure 11] FIG. 11 is a flowchart showing the remaining operation of the mounting system. [Figure 12] FIG. 12 is a front view of the board recognition camera in the mounting system according to the first modification of the embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] Hereinafter, a mounting system and a mounting method according to an embodiment will be described with reference to the drawings. Each figure described in the following embodiment is a schematic diagram, and the ratio of the size and thickness of each component does not necessarily reflect the actual dimensional ratio. In addition, the configuration described in the following embodiment is merely an example of the present disclosure. The present disclosure is not limited to the following embodiment, and various modifications are possible depending on the design, etc., as long as the effects of the present disclosure can be achieved.

[0011] (Embodiment) (1) Overview First, an overview of a mounting system 1 according to an embodiment will be described with reference to FIGS. 1 to 4. FIG.

[0012] The mounting system 1 according to the embodiment is, for example, a mounting device for mounting (attaching) a component 100, which is adsorbed by a suction nozzle 13 of a mounting head 11, onto a substrate 6. The mounting system 1 is used in operations for manufacturing various products, such as electronic devices and automobiles, in facilities, such as factories, laboratories, offices, and educational facilities.

[0013] In this embodiment, as an example, a case where the mounting system 1 is used for manufacturing electronic devices in a factory will be described. A typical electronic device has various circuit boards, such as a power supply circuit and a control circuit. In manufacturing these circuit boards, as an example, a solder application process, a mounting process, and a soldering process are performed in this order. In the solder application process, cream solder is applied (or printed) to a board (including a printed wiring board). In the mounting process, components (including electronic components) are mounted (mounted) on the board. In the soldering process, for example, the board on which the components are mounted is heated in a reflow furnace to melt the cream solder and perform soldering. In the mounting process, the mounting system 1 performs an operation of adsorbing (holding) the component 100 by the suction nozzle 13, and an operation of mounting (mounting) the component 100 adsorbed by the suction nozzle 13 on the board 6.

[0014] As shown in Figs. 1 to 4, the mounting system 1 according to the embodiment includes a mounting head 11, a mounting storage unit (storage unit) 36, an interference determination unit 33, and a mounting head control unit 31. The mounting head 11 holds a plurality of components 100 and mounts them on a board 6. The mounting storage unit 36 ​​stores component information (shape information) 36b, board information 36c, and operation information 36d. The component information 36b is information about the shapes of the plurality of components 100. The board information 36c includes a plurality of electrode positions on the board 6 to which the plurality of components 100 are electrically connected, or a plurality of mounting positions P01 to P10 (see Fig. 5) on the board 6 to which the plurality of components 100 are mounted, respectively. The operation information 36d is information about the operation of the mounting head 11 when mounting the plurality of components 100. The interference determination unit 33 determines whether or not the mounted component 100a (see FIGS. 7 to 9) will interfere with the mounting head 11, based on the component information 36b, the board information 36c, and the amount of positional deviation of the held component 100b relative to the mounting head 11. The held component 100b is a component among the multiple components 100 that is held by the mounting head 11. The mounted component 100a is a component that has already been mounted on the board 6. The mounting head control unit 31 changes the operation information 36d when the interference determination unit 33 determines that the mounting head 11 will interfere with the mounted component 100a. The operation information 36d includes the mounting order of the multiple components 100 on the board 6. The mounting head control unit 31 has a mounting order change function. The mounting order change function is a function that changes the mounting order so that, when it is determined that the mounting head 11 will interfere with the mounted component 100a, a similar component of the same type as the held component 100b is to be mounted after the held component 100b held by the mounting head 11, the held component 100b is mounted at the mounting position P05 (see Figure 9) where the similar component is mounted.

[0015] In the mounting system 1 according to the embodiment, when it is determined that the mounting head 11 interferes with the mounted component 100a, if a component of the same type is to be mounted after the mounting order of the held component 100b held by the mounting head 11, the mounting order is changed so that the held component 100b is mounted at the mounting position P05 (see FIG. 9) where the same type component is to be mounted. This makes it possible to suppress a decrease in productivity compared to a case where the held component 100b held by the mounting head 11 is discarded. That is, according to the mounting system 1 according to the embodiment, it is possible to suppress a decrease in productivity while performing interference determination of the mounting head 11 with the mounted component 100a.

[0016] (2)Details (2.1) Premise In this embodiment, as an example, a case will be described in which the mounting system 1 is used to mount the component 100 by surface mount technology (SMT). That is, the component 100 is a surface mount component (SMD: Surface Mount Device), and is mounted by being placed on the mounting surface 6a of the board 6. However, this is not limiting, and the mounting system 1 may be used to mount the component 100 by insertion mount technology (IMT: Insertion Mount Technology). In this case, the component 100 is a component for insertion mounting having lead terminals, and is mounted on the mounting surface 6a of the board 6 by inserting the lead terminals into holes in the board 6. That is, in this disclosure, "mounting a component on a board" includes placing the component on the mounting surface of the board and inserting the lead terminals of the component into holes in the board.

[0017] In the present disclosure, the captured images of the board recognition camera 22 and the component recognition camera 23 include still images (still images) and videos (moving images). Furthermore, "video" includes captured images composed of a plurality of still images obtained by frame-by-frame photography or the like. The captured images of the board recognition camera 22 and the component recognition camera 23 may not be the data output from the board recognition camera 22 and the component recognition camera 23. For example, the captured images of the board recognition camera 22 and the component recognition camera 23 may be appropriately compressed as necessary, converted into another data format, or processed to cut out a part of the captured images of the board recognition camera 22 and the component recognition camera 23, or to adjust the focus, brightness, or contrast. In the present embodiment, as an example, the captured images of the board recognition camera 22 and the component recognition camera 23 are full-color videos.

[0018] In the following, as an example, three mutually orthogonal axes, X-axis, Y-axis, and Z-axis, are set, and the axes parallel to the surface of the substrate 6 are the "X-axis" and "Y-axis", and the axis parallel to the thickness direction of the substrate 6 is the "Z-axis". Furthermore, one of the two directions along the Z-axis is the upward direction, and the other direction is the downward direction. For example, as shown in FIG. 3, when the suction nozzle 13 faces the substrate 6, the substrate 6 is located below the suction nozzle 13. Note that the X-axis, Y-axis, and Z-axis are all imaginary axes, and the arrows indicating "X", "Y", and "Z" in the drawings are merely indicated for the purpose of explanation, and none of them have any substance. Furthermore, these directions are not intended to limit the directions when the mounting system 1 is used.

[0019] Further, pipes for circulating cooling water, cables for supplying power, pipes for supplying air pressure (including positive pressure and vacuum), and the like are connected to the mounting system 1, but in this embodiment, illustration of these is omitted as appropriate.

[0020] (2.2) Overall structure Hereinafter, the configuration of a production system A1 equipped with a mounting system 1 according to an embodiment will be described with reference to FIGS.

[0021] The production system A1 has a function of mounting (attaching) components 100 to a board 6 to produce a mounted board. As shown in FIG. 1, the production system A1 includes a plurality of mounting systems 1 (three in the illustrated example) and a management system 3. The plurality of mounting systems 1 are connected to the management system 3 via a communication network 2. The management system 3 comprehensively manages the production of mounted boards by the plurality of mounting systems 1, and supports the plurality of mounting systems 1 in mounting the components 100 onto the board 6. In the following description, when it is necessary to distinguish between "multiple mounting systems 1," the plurality of mounting systems 1 will each be distinguished as "mounting systems 1A, 1B, 1C."

[0022] (2.2.1) Implemented System First, a description will be given of the configurations of mounting systems 1A, 1B, and 1C. Note that since mounting systems 1A, 1B, and 1C have the same configuration, the following description will focus on mounting system 1A, and descriptions of mounting systems 1B and 1C will be omitted.

[0023] The mounting system 1A can be realized, for example, by a computer system having one or more processors and one or more memories. That is, the mounting system 1A functions as a computer system by having one or more processors execute a program recorded in one or more memories of the computer system. Here, the program is pre-recorded in the mounting storage unit 36 ​​of the mounting system 1A, but may be provided, for example, through a telecommunication line such as the Internet, or may be provided by recording it on a non-transitory recording medium such as a memory card.

[0024] 2 and 3, the mounting system 1A includes a base 4, a board transport mechanism 5, a plurality of (two in the illustrated example) component supply units 7, a pair of Y-axis beams 9, an X-axis beam 10, and a mounting head 11. The mounting system 1A further includes a board recognition camera 22 and a component recognition camera 23.

[0025] A board transport mechanism 5 is disposed in the center of the base 4 along the X-axis direction (left and right direction in FIG. 2). The board transport mechanism 5 transports the board 6 carried in from the upstream side (for example, the right side in FIG. 2) in the X-axis direction, and positions and holds it at a mounting operation position by the mounting head 11. The board transport mechanism 5 also carries out the board 6 after component mounting operation has been completed to the downstream side (for example, the left side in FIG. 2).

[0026] Component supply units 7 are disposed on both sides of the board transport mechanism 5 in the Y-axis direction (the up-down direction in FIG. 2). Each component supply unit 7 is equipped with a plurality of tape feeders 8 disposed along the X-axis direction (the left-right direction in FIG. 2). Each tape feeder 8 supplies components 100 to a component suction position where the mounting head 11 suctions the components 100 by pitch-feeding a carrier tape having pockets for storing components 100 formed therein in a direction (tape feed direction) from the outside of the component supply unit 7 toward the board transport mechanism 5.

[0027] A pair of Y-axis beams 9 equipped with linear drive mechanisms are disposed at both ends in the X-axis direction (left-right direction in FIG. 2) on the top surface of the base 4. An X-axis beam 10 similarly equipped with a linear mechanism is attached to each Y-axis beam 9 so as to be freely movable in the Y-axis direction (up-down direction in FIG. 2). A mounting head 11 is attached to the X-axis beam 10 so as to be freely movable in the X-axis direction. As shown in FIG. 4, the mounting head 11 is a multiple head having multiple (four in the illustrated example) holding heads 12.

[0028] A suction nozzle 13 that suctions and holds a component 100 on a suction surface 130 (see FIG. 3) is attached to the lower end of each holding head 12. Each holding head 12 has a nozzle lifting mechanism 14 that lifts and lowers the suction nozzle 13 in the vertical direction (Z-axis direction), and a nozzle rotation mechanism (not shown) that rotates the suction nozzle 13 by θ around a rotation axis Ax1. As shown in FIG. 4, the holding head 12 rotates the suction nozzle 13 to a predetermined rotation angle by the nozzle rotation mechanism (arrow a1 in FIG. 4), and lowers it to a predetermined mounting height in the Z-axis direction by the nozzle lifting mechanism 14 (arrow b1 in FIG. 4), and mounts the component 100 held by the suction nozzle 13 on the mounting surface 6a of the board 6. That is, the mounting head 11 mounts a plurality of components 100 on the board 6.

[0029] The pair of Y-axis beams 9 and X-axis beams 10 constitute a mounting head moving mechanism 15 that moves the mounting head 11 in the horizontal direction (X-axis direction and Y-axis direction). The mounting head 11 equipped with the mounting head moving mechanism 15 and the nozzle lifting mechanism 14 constitutes a component mounting unit 16 that performs a component mounting operation of taking out a component 100 from the component supply unit 7 and mounting it at a mounting position Po1 (see Figs. 8 and 9) on the board 6. That is, the component mounting unit 16 has a function of moving the component 100 held by the suction nozzle 13 in the horizontal direction and the vertical direction. In the component mounting operation, the component mounting unit 16 repeats a series of operations of picking up a predetermined component 100 from the component supply unit 7 with each suction nozzle 13 provided on the mounting head 11 and mounting the component 100 held by each suction nozzle 13 at a predetermined rotation angle on the mounting position Po1 on the board 6.

[0030] A board recognition camera 22 is attached to the X-axis beam 10 and is positioned on the lower surface side of the X-axis beam 10 and moves integrally with the mounting head 11 (see FIG. 3). As the mounting head 11 moves, the board recognition camera 22 moves above the board 6 positioned at the mounting operation position of the board transport mechanism 5 and captures an image of a board mark (not shown) provided on the board 6 to recognize the position of the board 6. The board recognition camera 22 also captures an image of the mounting surface 6a of the board 6 including the mounted component 100a to recognize the position of the mounted component 100a. The mounted component 100a is a component that has already been mounted on the mounting surface 6a of the board 6, as shown in FIGS. 7 to 9.

[0031] A component recognition camera 23 is disposed between one of the component supply units 7 (lower side in FIG. 2) and the board transport mechanism 5. When the mounting head 11, which has taken out the component 100 from the component supply unit 7, is positioned above the component recognition camera 23, the component recognition camera 23 captures an image of the component 100 held by the suction nozzle 13 from below. In the component mounting operation of the mounting head 11 on the board 6 of the component 100, correction is performed by taking into account the recognition result of the board 6 and the mounted component 100a by the board recognition camera 22 and the recognition result of the component (held component) 100 by the component recognition camera 23. In this embodiment, the component recognition camera 23 corresponds to a component imaging unit. That is, the component recognition camera 23 captures an image of the mounting head 11 and the held component 100b (see FIG. 3) held by the mounting head 11 from below.

[0032] Here, the mounting system 1A further includes a touch panel 24, as shown in Fig. 1 and Fig. 2. The touch panel 24 has a display unit (not shown). Various information and buttons are displayed on the display unit of the touch panel 24. An operator inputs data, operates the mounting system 1A, and the like, by operating the buttons displayed on the display unit.

[0033] 1, the mounting system 1A further includes a notification unit 25. The notification unit 25 has, for example, a notification light (not shown). The notification unit 25 turns on the notification light to notify that the held component 100b cannot be mounted on the board 6. The held component 100b is a component held by the suction nozzle 13 of the mounting head 11 as shown in FIG. The held component 100b that cannot be mounted on the board 6 is discarded.

[0034] 1, the mounting system 1A further includes a mounting control device 30. The mounting control device 30 is connected to a board transport mechanism 5 (see FIG. 2), a tape feeder 8 attached to a component supply unit 7, a nozzle lifting mechanism 14 and a mounting head moving mechanism 15 constituting a component mounting unit 16, a board recognition camera 22, a component recognition camera 23, a touch panel 24, a notification unit 25, and the like.

[0035] The mounting control device 30 includes a mounting head control unit 31, an information acquisition unit 32, an interference determination unit 33, an input processing unit , a mounting communication unit 35, and a mounting storage unit .

[0036] The mounting storage unit 36 ​​is, for example, a storage device such as a flash memory. As shown in FIG. 1, the mounting storage unit 36 ​​stores position information 36a, component information 36b, board information 36c, operation information 36d, and positional deviation information 36e.

[0037] The position information 36a includes information on the mounting position of the component 100 on the mounting surface 6a of the board 6. As shown in FIG. 5, the position information 36a includes a mounting position number 60, mounting position coordinates 61, a component name 62, and a mounting operation number 63. The mounting position number 60 is information for identifying the mounting position Po1 of the component 100 on the board 6 (see FIGS. 8 and 9). In the example of FIG. 5, information on the mounting positions Po1 with the mounting position numbers 60 of "P01" to "P10" is shown. Hereinafter, the mounting position Po1 with the mounting position number 60 of "P01" will also be referred to as "mounting position P01". The same applies to the mounting position numbers 60 of "P02" to "P10".

[0038] The mounting position coordinates 61 are information including the mounting coordinates (X coordinates and Y coordinates) and the mounting angle of the mounting position Po1 of the component 100. The component name 62 is information for identifying the type of the component 100. In the example of Fig. 5, the component 100 mounted at the mounting positions P01, P03 to P05, and P07 to P10 is given the component name "E1", the component 100 mounted at the mounting position P02 is given the component name "F1", and the component 100 mounted at the mounting position P06 is given the component name "G1".

[0039] The mounting operation number 63 is information indicating the order in which the components 100 are to be mounted on the board 6. In the example of Fig. 5, the components 100 to be mounted at mounting positions P01 to P04 are mounted on the board 6 in a first mounting operation, the components 100 to be mounted at mounting positions P05 to P08 are mounted on the board 6 in a second mounting operation, and the components 100 to be mounted at mounting positions P09 to P10 are mounted on the board 6 in a third mounting operation.

[0040] The component information 36b includes information about the size (length, width, height) of the components 100. That is, the component information 36b includes shape information about the shapes of the multiple components 100. The component information 36b further includes information about the electrical characteristics of the components 100.

[0041] The board information 36c includes a plurality of mounting positions Po1 (see FIGS. 8 and 9) on the board 6 at which the plurality of components 100 are respectively mounted. The mounting storage unit 36 ​​stores the mounting position Po1 for each component 100. The board information 36c further includes the maximum expected warpage at each mounting position Po1 on the board 6 (the height position of the mounting surface 6a based on the height of the mounting surface 6a of the board 6 in the absence of warpage). The mounting storage unit 36 ​​stores the maximum expected warpage for each type of board 6 on which the components 100 are mounted.

[0042] The operation information 36d is information regarding the operation of the mounting head 11 when mounting the multiple components 100. More specifically, the operation information 36d includes the mounting order of the multiple components 100 on the board 6. That is, the multiple components 100 are mounted in order according to the mounting order included in the operation information 36d. The operation information 36d also includes coordinate information and angle information of the components 100 (including the held component 100b) on the board 6. The coordinate information includes, for example, the X coordinate and Y coordinate of the mounting position Po1 of the component 100 on the board 6. The angle information includes, for example, the mounting angle of the component 100 on the board 6 (for example, the angle with respect to the X axis).

[0043] The positional deviation information 36e includes the amount of positional deviation of the held component 100b with respect to the suction nozzle 13 of the mounting head 11. The amount of positional deviation is calculated by the interference determination unit 33 based on an image captured by the component recognition camera 23, as will be described later.

[0044] The mounting head control unit 31 controls the tape feeder 8, the component mounting unit 16, the board recognition camera 22 and the component recognition camera 23 based on various information stored in the mounting memory unit 36, and performs component mounting work to mount the component 100 supplied from the tape feeder 8 at the mounting position Po1 of the board 6 held at the mounting work position.

[0045] The mounting head control unit 31 also has a change function for changing the operation information 36d. Specifically, the mounting head control unit 31 has a mounting order change function, a coordinate information change function, and an angle information change function. The mounting order change function is a function for changing the mounting order so that the held component 100b is mounted at the mounting position Po1 where the same type of component 100 (same type component) is mounted when the same type of component 100 as the held component 100b held by the mounting head 11 is mounted after the mounting order of the held component 100b held by the mounting head 11 when it is determined that the mounting head 11 interferes with the mounted component 100a. The coordinate information change function is a function for changing the above-mentioned coordinate information based on the positional deviation amount calculated by the interference determination unit 33. The angle information change function is a function for changing the above-mentioned angle information based on the positional deviation amount calculated by the interference determination unit 33. In this way, the mounting head control unit 31 changes the operation information 36d when the interference determination unit 33 determines that the mounting head 11 interferes with the mounted component 100a.

[0046] When the mounting head control unit 31 executes the coordinate information change function, the mounting head 11 mounts the held component 100b held by the suction nozzle 13 onto the board 6 based on the changed coordinate information. Also, when the mounting head control unit 31 executes the angle information change function, the mounting head 11 mounts the held component 100b held by the suction nozzle 13 onto the board 6 based on the changed angle information.

[0047] The information acquisition unit 32 acquires information required when the interference determination unit 33 determines whether or not there is interference between the suction nozzle 13 of the mounting head 11 and the mounted component 100a. Specifically, the information acquisition unit 32 acquires position information 36a, component information 36b, and board information 36c from the mounting storage unit 36. The information acquisition unit 32 also acquires information required when the mounting head control unit 31 executes the above-mentioned mounting order change function, coordinate information change function, and angle information change function. Specifically, the information acquisition unit 32 acquires operation information 36d from the mounting storage unit 36.

[0048] The interference determination unit 33 determines whether or not there is interference between the suction nozzle 13 of the mounting head 11 and the mounted component 100a, based on the component information 36b, the board information 36c, and a positional deviation amount described below. The interference determination unit 33 also calculates the positional deviation amount of the held component 100b with respect to the suction nozzle 13 of the mounting head 11, based on an image captured by the component recognition camera 23. Hereinafter, the procedure by which the interference determination unit 33 calculates the positional deviation amount will be described with reference to FIG. 6.

[0049] Fig. 6 shows an image Im1 captured by the component recognition camera 23, which captures an image of the suction nozzle 13 of the mounting head 11 and the held component 100b held by the suction nozzle 13 from below. The two-dot chain line in Fig. 6 indicates the held component 100b (hereinafter also referred to as the "first held component 100b") in a state in which it is held in a normal position on the suction surface 130 of the suction nozzle 13. The held component 100b (hereinafter also referred to as the "second held component 100b") indicated by a solid line in Fig. 6 is held by the suction nozzle 13 at a position shifted from the normal position on the suction surface 130. The held component 100b is suctioned to the suction surface 130 by air passing through a circular through hole 131 provided in the center of the suction surface 130 of the suction nozzle 13.

[0050] 6, the amount of positional deviation of the held component 100b with respect to the suction nozzle 13 of the mounting head 11 is calculated based on the distance between the outer edge 132 of the suction surface 130 (holding surface) of the suction nozzle 13 and the outer edge 101 of the held component 100b. More specifically, the amount of positional deviation of the second held component 100b with respect to the mounting head 11 is calculated based on the distance L1 between the outer edge 132 of the suction surface 130 of the suction nozzle 13 and the outer edge 101 of the first held component 100b, and the distance L2 between the outer edge 132 of the suction surface 130 of the suction nozzle 13 and the outer edge 101 of the second held component 100b. That is, the interference determination unit 33 calculates the amount of positional deviation based on the distances L1 and L2 between the outer edge 132 of the suction surface 130 of the held component 100b in the mounting head 11 and the outer edge 101 of the held component 100b, which are obtained from the captured image Im1 of the component recognition camera 23.

[0051] The input processing unit 34 executes various processes based on the input information.

[0052] The mounting communication unit 35 includes a communication interface. The mounting communication unit 35 transmits and receives data to and from the other mounting systems 1B and 1C and the management system 3 via the communication network 2.

[0053] (2.2.2) Management Systems The management system 3 can be realized by, for example, a computer system having one or more processors and one or more memories. That is, the one or more processors execute a program recorded in one or more memories of the computer system, thereby functioning as the management system 3. Here, the program is pre-recorded in the management storage unit 51 of the management system 3, but it may be provided, for example, through a telecommunication line such as the Internet, or may be provided by recording it on a non-transitory recording medium such as a memory card.

[0054] As shown in FIG. 1, the management system 3 includes a management processing unit 50, a management storage unit 51, a display unit 52, an input unit 53, and a management communication unit .

[0055] The management processing unit 50 is, for example, a calculation device such as a CPU (Central Processing Unit). The management processing unit 50 includes an information acquiring unit 50a. The information acquiring unit 50a acquires position information 36a, component information 36b, and board information 36c from each mounting system 1.

[0056] The management storage unit 51 is, for example, a storage device such as a flash memory. The management storage unit 51 stores mounting information 51a, position information 51b, board information 51c, and component information 51d. The mounting information 51a is information related to a mounting operation for mounting the component 100 on the board 6. The position information 51b, board information 51c, and component information 51d are information similar to the position information 36a, board information 36c, and component information 36b stored in the mounting storage unit 36, respectively.

[0057] The display unit 52 is a display device such as a liquid crystal panel, and displays various data, an operation screen, and the like.

[0058] The input unit 53 is an input device such as a keyboard, a touch panel, a mouse, etc. The input unit 53 is used to input operation commands and data.

[0059] The management communication unit 54 includes, for example, a communication interface. The management communication unit 54 transmits and receives data to and from each of the mounting systems 1A, 1B, and 1C via the communication network 2.

[0060] (3) Interference avoidance methods Next, a method for avoiding interference of the suction nozzle 13 of the mounting head 11 with the mounted component 100a will be described with reference to FIGS.

[0061] As shown in FIG. 7, when the suction nozzle 13 of the mounting head 11 interferes with the mounted component 100a, the following two avoidance methods are conceivable.

[0062] The first avoidance method is to change at least one of the coordinate information and angle information of the held component 100b held by the suction nozzle 13. In the example of Fig. 8, based on the changed coordinate information and angle information, the suction nozzle 13 is moved in a direction away from the mounted component 100a in at least one of the X-axis direction and Y-axis direction parallel to the mounting surface 6a of the board 6, and then the suction nozzle 13 is rotated 180 degrees. This makes it possible to mount the held component 100b at the regular mounting position P01 of the held component 100b, as shown in Fig. 8.

[0063] The second avoidance method is to change the mounting order of the held component 100b and the same type component. In the example of Fig. 9, the mounting position P01 is the mounting position of the held component 100b held by the suction nozzle 13, and the mounting position P05 is the mounting position of the same type component. In this case, the suction nozzle 13 is moved in a direction away from the mounted component 100a in at least one of the X-axis direction and the Y-axis direction parallel to the mounting surface 6a of the board 6 toward the mounting position P05 of the same type component. This makes it possible to mount the held component 100b at the mounting position P05 as shown in Fig. 9.

[0064] (4) Mounting Method Next, a mounting method according to the embodiment will be described with reference to FIGS.

[0065] In the mounting method according to the embodiment, whether or not the mounted component 100a interferes with the mounting head 11 is determined based on component information 36b (shape information), board information 36c, and the amount of positional deviation of the held component 100b relative to the mounting head 11. The component information 36b is information about the shapes of the multiple components 100 held by the mounting head 11 and mounted on the board 6. The board information 36c includes multiple mounting positions Po1 on the board 6 at which the multiple components 100 are respectively mounted. The mounted component 100a is a component that has already been mounted on the board 6. The held component 100b is a component among the multiple components 100 that is held by the mounting head 11. In addition, in the mounting method, when it is determined that the mounting head 11 will interfere with the mounted component 100a, if a component 100 of the same type as the held component 100b (same type component) is to be mounted on the board 6 after the held component 100b held by the mounting head 11, the mounting order is changed so that the held component 100b is mounted at the mounting position P05 of the same type component.

[0066] In the mounting method according to the embodiment, when it is determined that the mounting head 11 interferes with the mounted component 100a, if a component of the same type is to be mounted after the mounting order of the held component 100b held by the mounting head 11, the mounting order is changed so that the held component 100b is mounted at the mounting position P05 of the same type component. This makes it possible to suppress a decrease in productivity compared to a case in which the held component 100b held by the mounting head 11 is discarded. That is, according to the mounting method according to the embodiment, it is possible to suppress a decrease in productivity while performing interference determination of the mounting head 11 with the mounted component 100a.

[0067] 10 and 11 are flowcharts showing a mounting method executed by the mounting system 1 according to the embodiment. The mounting method includes steps S1 to S14 shown in FIGS. 10 and 11. In this embodiment, the mounting method is executed by the mounting system 1 described above. For this reason, hereinafter, the mounting method of this embodiment will be described as the operation of the mounting system 1. Also, the flowcharts shown in FIGS. 10 and 11 are merely examples, and the order of the steps may be changed as appropriate, and steps may be added or deleted as appropriate.

[0068] The mounting system 1 starts mounting component n, which is the nth (n=1) component 100 (S1). First, the mounting head 11 holds the component n via the suction nozzle 13 (S2). After that, the component recognition camera 23 captures an image of the suction nozzle 13 of the mounting head 11 and the component n being picked up by the suction nozzle 13 from below (S3). Then, the interference determination unit 33 calculates the amount of positional deviation based on the captured image of the component recognition camera 23 (S4).

[0069] Next, the board recognition camera 22 captures an image of the mounting surface 6a of the board 6 so as to include the mounted component 100a (S5). Then, the interference determination unit 33 determines whether or not the suction nozzle 13 of the mounting head 11 holding the component n interferes with the mounted component 100a based on the component information 36b, the board information 36c, and the captured images of the board recognition camera 22 and the component recognition camera 23 (S6). If the suction nozzle 13 interferes with the mounted component 100a (S6: Yes), the mounting head control unit 31 determines whether or not the above-mentioned positional deviation amount can be corrected (S7). If the above-mentioned positional deviation amount can be corrected (S7: Yes), the mounting head control unit 31 executes at least one of a coordinate information change function and an angle information change function to correct at least one of the coordinate information and angle information of the component n (S8). Then, the mounting head 11 mounts the component n on the mounting surface 6a of the board 6 based on at least one of the coordinate information and angle information after correction of the component n (S12).

[0070] On the other hand, if the suction nozzle 13 does not interfere with the mounted component 100a (S6: No), the mounting head 11 mounts the component n on the mounting surface 6a of the board 6 (S12). If the positional deviation amount cannot be corrected (S7: No), the mounting head control unit 31 determines whether or not there is a component of the same type (same type component) behind the component n (S9). If there is a same type component (S9: Yes), the mounting head control unit 31 changes the mounting order of the component n so that the component n is mounted at the mounting position P05 of the same type component (S10). The mounting head 11 mounts the component n at the mounting position P05 of the same type component based on the changed mounting order (S12).

[0071] However, if there is no component of the same type (S9: No), the notification unit 25 turns on a notification light to notify that the component n cannot be mounted on the board 6 (S11). In this case, the process ends without mounting all the components 100.

[0072] The mounting head control unit 31 determines whether or not all of the components 100 have been mounted on the board 6 (S13). If all of the components 100 have not been mounted on the board 6 (S13: No), the mounting system 1 executes the steps (S1 to S14) for mounting the next component n on the board 6. On the other hand, if all of the components 100 have been mounted on the board 6 (S13: Yes), the mounting system 1 ends the series of steps.

[0073] 10 and 11, step S3 may be omitted. In this case, the mounting head control unit 31 uses the amount of misalignment included in the misalignment information 36e stored in the mounting storage unit 36 ​​instead of calculating the amount of misalignment in step S4.

[0074] 10 and 11, the order of steps S7 and S9 may be reversed. That is, the mounting head control unit 31 may determine whether or not the same component (same type component) is present after the component n, and then determine whether or not the amount of misalignment can be corrected. Furthermore, step S7 may be omitted.

[0075] (5) Effects In the mounting system 1 according to the embodiment, when it is determined that the mounting head 11 interferes with the mounted component 100a, if a component of the same type is to be mounted after the mounting order of the held component 100b held by the mounting head 11, the mounting order is changed so that the held component 100b is mounted at the mounting position P05 (see FIG. 9) where the same type component is to be mounted. This makes it possible to suppress a decrease in productivity compared to a case where the held component 100b held by the mounting head 11 is discarded. That is, according to the mounting system 1 according to the embodiment, it is possible to suppress a decrease in productivity while performing interference determination of the mounting head 11 with the mounted component 100a.

[0076] Furthermore, in the mounting system 1 according to the embodiment, when the mounting head control unit 31 executes the coordinate information change function, the mounting head 11 mounts the held component 100b on the board 6 based on the changed coordinate information. This makes it possible to mount the held component 100b on the board 6 based on the changed coordinate information, thereby further suppressing a decrease in productivity.

[0077] Furthermore, in the mounting system 1 according to the embodiment, when the mounting head control unit 31 executes the angle information change function, the mounting head 11 mounts the held component 100b on the board 6 based on the changed angle information. This makes it possible to mount the held component 100b on the board 6 based on the changed angle information, thereby further suppressing a decrease in productivity.

[0078] Furthermore, in the mounting system 1 according to the embodiment, the amount of positional deviation is determined based on the image captured by the component recognition camera 23, which makes it possible to improve the accuracy of interference determination of the mounting head 11 with the mounted component 100a.

[0079] (6) Variations The above-described embodiment is merely one of various embodiments of the present disclosure. The above-described embodiment can be modified in various ways depending on the design, etc., as long as the object of the present disclosure can be achieved. In addition, functions similar to the mounting method according to the above-described embodiment may be embodied in a mounting system 1, a (computer) program, or a non-transitory recording medium on which a program is recorded, etc.

[0080] Modifications of the above-described embodiment are listed below. The modifications described below can be applied in appropriate combination.

[0081] (6.1) Variation 1 In the above-described embodiment, the mounting system 1 is equipped with one board recognition camera 22, as shown in Figures 2 and 3, but the mounting system 1 may also be equipped with two board recognition cameras 22A, 22B, as shown in Figure 12.

[0082] In the mounting system 1 according to the first modification, as shown in Fig. 12, the board recognition cameras 22A and 22B are arranged on both sides of the suction nozzle 13 in the X-axis direction. That is, in the mounting system 1 according to the first modification, the two board recognition cameras 22A and 22B and the suction nozzle 13 are lined up along the X-axis direction. An imaging area R1 of the board recognition camera 22A and an imaging area R2 of the board recognition camera 22B partially overlap with each other.

[0083] According to the mounting system 1 of the first modification, it is possible to move the mounting head 11 while capturing an image of the mounting position Po1 of the held component 100b with the two board recognition cameras 22A and 22B. This makes it possible to improve the mounting accuracy of the held component 100b relative to the mounting position Po1.

[0084] (6.2) Other Modifications Other variations are listed below.

[0085] It is not essential for the mounting system 1 that multiple functions are concentrated in one housing, and the components of the mounting system 1 may be distributed across multiple housings. Furthermore, at least some of the functions of the mounting system 1, for example, some of the functions of the mounting head control unit 31, may be realized by the cloud (cloud computing) or the like.

[0086] Conversely, in the above-described embodiment, at least some of the functions of the mounting system 1 that are distributed among multiple devices may be integrated into one housing. For example, some of the functions of the mounting system 1 that are distributed between the mounting control device 30 and the component mounting unit 16 may be integrated into one housing.

[0087] In the above embodiment, the production system A1 is provided with three mounting systems 1, but the number of mounting systems 1 provided in the production system A1 is not limited to three and may be one, two, four or more.

[0088] In the above-described embodiment, the number of holding heads 12 provided on the mounting head 11 is four, but the number of holding heads 12 provided on the mounting head 11 is not limited to four and may be one, two, three, or five or more.

[0089] Furthermore, the mounting head 11 may be a rotary type head in which a plurality of suction nozzles 13 are arranged concentrically.

[0090] Furthermore, the method by which the mounting head 11 holds the component 100 is not limited to vacuum suction using the suction nozzle 13, but may be a method in which the component 100 is gripped by a chuck, for example.

[0091] Furthermore, in the above-described embodiment, the board information 36c includes the mounting positions Po1 on the board 6 on which the multiple components 100 are mounted. In contrast to this, the board information 36c may include multiple electrode positions on the board 6 to which the multiple components 100 are electrically connected, instead of the mounting positions Po1 of each component 100. That is, the board information 36c includes multiple electrode positions on the board 6 to which the multiple components 100 are electrically connected, or the mounting positions Po1 on the board 6 on which the multiple components 100 are mounted.

[0092] In addition, in the above-described embodiment, the notification unit 25 notifies the user that the held component 100b cannot be mounted on the board 6. However, for example, the display unit of the touch panel 24 may display a message that the held component 100b cannot be mounted on the board 6.

[0093] In the above embodiment, the amount of misalignment of the held component 100b relative to the suction nozzle 13 is calculated based on the distances L1 and L2 between the outer edge 132 of the suction surface 130 of the held component 100b on the suction nozzle 13 of the mounting head 11 and the outer edge 101 of the held component 100b. In contrast to this, the amount of misalignment of the held component 100b relative to the suction nozzle 13 may be calculated based on the distance between the center of the suction surface 130 and the center of the held component 100b. Furthermore, the amount of misalignment of the held component 100b relative to the suction nozzle 13 may be calculated based on the distance between the center of the suction surface 130 and the outer edge 101 of the held component 101b.

[0094] (Aspect) The present specification discloses the following aspects.

[0095] The mounting system (1) according to the first aspect includes a mounting head (11), a storage unit (36), an interference determination unit (33), and a mounting head control unit (31). The mounting head (11) holds a plurality of components (100) and mounts them on a board (6). The storage unit (36) stores shape information (36b), board information (36c), and operation information (36d). The shape information (36b) is information about the shapes of the plurality of components (100). The board information (36c) includes a plurality of electrode positions on the board (6) to which the plurality of components (100) are electrically connected, or a plurality of mounting positions (Po1) on the board (6) to which the plurality of components (100) are mounted, respectively. The operation information (36d) is information about the operation of the mounting head (11) when mounting the plurality of components (100). The interference determination unit (33) determines whether or not the mounted component (100a) and the mounting head (11) interfere with each other based on the shape information (36b), the board information (36c), and the amount of positional deviation of the held component (100b) relative to the mounting head (11). The held component (100b) is a component among the multiple components (100) that is held by the mounting head (11). The mounted component (100a) is a component that has already been mounted on the board (6). The mounting head control unit (31) changes the operation information (36d) when the interference determination unit (33) determines that the mounting head (11) interferes with the mounted component (100a). The operation information (36d) includes the mounting order of the multiple components (100) on the board (6). The mounting head control unit (31) has a mounting order change function. The mounting order change function is a function for changing the mounting order in the case where a similar component of the same type as the held component (100b) is to be mounted after the held component (100b) held by the mounting head (11) when it is determined that the mounting head (11) will interfere with the mounted component (100a), so that the held component (100b) is mounted at the mounting position (P05) of the similar component.

[0096] According to this embodiment, it is possible to suppress a decrease in productivity while performing interference determination for the mounted component (100a).

[0097] In the mounting system (1) according to the second aspect, in the first aspect, the operation information (36d) further includes coordinate information of the held component (100b) on the substrate (6). The mounting head control unit (31) further has a coordinate information changing function for changing the coordinate information based on the amount of positional deviation. When the mounting head control unit (31) executes the coordinate information changing function, the mounting head (11) mounts the held component (100b) on the substrate (6) based on the changed coordinate information.

[0098] According to this embodiment, the held component (100b) can be mounted on the board (6) based on the changed coordinate information, so that the decrease in productivity can be further suppressed.

[0099] In the mounting system (1) according to the third aspect, in the first or second aspect, the operation information (36d) further includes angle information of the held component (100b) on the substrate (6). The mounting head control unit (31) further has an angle information changing function that changes the angle information based on the amount of positional deviation. When the mounting head control unit (31) executes the angle information changing function, the mounting head (11) mounts the held component (100b) on the substrate (6) based on the changed angle information.

[0100] According to this embodiment, the held component (100b) can be mounted on the board (6) based on the changed angle information, so that the decrease in productivity can be further suppressed.

[0101] The mounting system (1) according to a fourth aspect is any one of the first to third aspects, and further includes a component imaging unit (23). The component imaging unit (23) images the mounting head (11) and the held component (100b) held by the mounting head (11) from below. The interference determination unit (33) calculates the amount of positional deviation based on a distance (L1, L2) between an outer edge (132) of a holding surface (130) of the held component (100b) in the mounting head (11) and an outer edge (101) of the held component (100b), which is obtained from the image captured by the component imaging unit (23).

[0102] According to this aspect, since the amount of positional deviation is obtained based on the image captured by the component imaging unit (23), it is possible to improve the accuracy of interference determination with respect to the mounted component (100a).

[0103] In the mounting method according to the fifth aspect, whether or not the mounted component (100a) interferes with the mounting head (11) is determined based on the shape information (36b), the board information (36c), and the amount of positional deviation of the held component (100b) relative to the mounting head (11). The shape information (36b) is information about the shapes of the multiple components (100) held by the mounting head (11) and mounted on the board (6). The board information (36c) includes multiple electrode positions on the board (6) to which the multiple components (100) are electrically connected, or multiple mounting positions (Po1) on the board (6) to which the multiple components (100) are mounted, respectively. The held component (100b) is a component held by the mounting head (11) among the multiple components (100). The mounted component (100a) is a component that has already been mounted on the board (6). In the mounting method, when it is determined that the mounting head (11) will interfere with the mounted component (100a), if a component of the same type as the held component (100b) is to be mounted on the board (6) after the held component (100b) held by the mounting head (11), the mounting order is changed so that the held component (100b) is mounted at the mounting position (P05) of the same type of component.

[0104] According to this embodiment, it is possible to suppress a decrease in productivity while performing interference determination for the mounted component (100a).

[0105] The configurations according to the second to fourth aspects are not essential to the mounting system (1) and may be omitted as appropriate. [Explanation of symbols]

[0106] 1. Mounting system 6 Substrate 11 Mounting head 23 Part recognition camera (part imaging section) 31 Mounting head control section 33 Interference detection section 36 Implemented memory unit (memory unit) 36b Part information (shape information) 36c Board Information 36d operating information 100 parts 100a Mounted parts 100b Held parts 101 Outer edge 130 Adsorption surface (holding surface) 132 Outer edge Po1 mounting position P05 Mounting position L1,L2 distance

Claims

1. a mounting head that holds a plurality of components and mounts them on a board; a storage unit that stores shape information relating to shapes of the plurality of components, board information including a plurality of electrode positions on the board to which the plurality of components are electrically connected, or a plurality of mounting positions on the board to which the plurality of components are mounted, and operation information relating to an operation of the mounting head when mounting the plurality of components; an interference determination unit that determines whether or not a mounted component already mounted on the board will interfere with the mounting head based on the shape information, the board information, and a positional deviation amount of a held component held by the mounting head among the plurality of components with respect to the mounting head; a mounting head control unit that changes the operation information when the interference determination unit determines that the mounting head will interfere with the mounted component, the operation information includes a mounting order of the plurality of components on the board; the mounting head control unit has a mounting order change function for changing the mounting order so that, when a component of the same type as the held component held by the mounting head is to be mounted after the held component held by the mounting head when it is determined that the mounting head will interfere with the mounted component, the held component is mounted at the mounting position of the same type of component. Implementation system.

2. The operation information further includes coordinate information of the held component on the board, the mounting head control unit further has a coordinate information changing function for changing the coordinate information based on the positional deviation amount, When the mounting head control unit executes the coordinate information change function, the mounting head mounts the held component on the board based on the changed coordinate information. The mounting system according to claim 1 .

3. The operation information further includes angle information of the held component on the board, the mounting head control unit further has an angle information changing function for changing the angle information based on the positional deviation amount, When the mounting head control unit executes the angle information change function, the mounting head mounts the held component on the board based on the changed angle information. The mounting system according to claim 1 or 2.

4. a component imaging unit configured to image the mounting head and the held component held by the mounting head from below, the interference determination unit calculates the amount of positional deviation based on a distance between an outer edge of a holding surface of the held component in the mounting head and an outer edge of the held component, the distance being determined from an image captured by the component imaging unit. The mounting system according to claim 1 or 2.

5. determining whether or not a mounted component already mounted on the board will interfere with the mounting head based on shape information relating to the shapes of a plurality of components to be held by the mounting head and mounted on the board, board information including a plurality of electrode positions on the board to which the plurality of components are electrically connected or a plurality of mounting positions on the board to which the plurality of components are respectively mounted, and an amount of positional deviation of a held component held by the mounting head among the plurality of components with respect to the mounting head; when it is determined that the mounting head interferes with the mounted component, if a component of the same type as the held component is to be mounted on the board after the mounting order of the held component held by the mounting head, the mounting order is changed so that the held component is mounted at the mounting position of the same type component. How to implement it.

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