Capacitor device

Abstract

To provide a capacitor device which achieves small electric influence on electric components and improvement of heat radiation performance of bus bars.SOLUTION: A capacitor device includes a capacitor 20, a case 70, and a case cover 80. The capacitor has electrodes on a first end surface 23 and a second end surface 24 separated from each other in a thickness direction TD and is connected to electric components 2, 14. Bus bars electrically connect the electrodes and the electric components. The case houses the capacitor and the bus bars. The case cover covers the case from an outer side of the case and forms with refrigerant passages 151, 152, 153, 154 with the case. The bus bars include: overlapping parts 41, 51 overlapping with the end surfaces with respect to a thickness direction; connection parts 43, 45, 53, 55 connected to the electric components; and non-connection parts 46, 56 which are not connected to the electric components. With respect to a plane direction orthogonal to the thickness direction, the non-connection parts and at least parts of the refrigerant passages overlap with each other.SELECTED DRAWING: Figure 7

Description

[Technical field]

[0001] The disclosure provided herein relates to a capacitor device. [Background technology]

[0002] The energy storage module described in Patent Document 1 includes a stack of multiple energy storage cells, a resin plate arranged on the surface of the stack and having a flow path, and a bus bar formed integrally with the resin plate and electrically connecting the multiple energy storage cells. Cooling water flows through the flow path, covering a portion of the bus bar. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent Publication No. 2022-121926 Summary of the Invention [Problem to be solved by the invention]

[0004] In the energy storage module described in Patent Document 1, a bus bar electrically connects adjacent energy storage cells. The flow path portion covers a portion of the bus bar, so heat is efficiently dissipated from the bus bar to the cooling water. If the length of the bus bar is increased in the stacking direction of the energy storage cells, the overlapping portion with the flow path portion increases and the electrical resistance between the energy storage cells increases. In Patent Document 1, it was difficult to reduce the electrical effect on the energy storage cells and improve the heat dissipation performance of the bus bar.

[0005] An object of the present disclosure is to provide a capacitor device that reduces the electrical impact on electrical components and improves the heat dissipation performance of the bus bars. [Means for solving the problem]

[0006] A capacitor device according to one aspect of the present disclosure comprises: a capacitor (20) having electrodes on a first end surface (23) and a second end surface (24) separated in a thickness direction (TD) and connected to an electrical component (2, 14); bus bars (40, 50) electrically connecting the electrodes and the electrical components; A case (70) for housing the capacitor and the bus bar in an internal housing space (78); a case cover (80) that covers the case from the outside and forms, together with the case, a refrigerant flow path (151, 152, 153, 154) through which a refrigerant can flow; The busbar is an overlapping portion (41, 51) overlapping the first end surface or the second end surface in the thickness direction and connected to the electrode; a connection portion (43, 45, 53, 55) connected to the overlapping portion and connected to an electrical component; a non-connection portion (46, 56) connected to the overlapping portion and not connected to the electrical component; In a planar direction perpendicular to the thickness direction, the non-connected portion and the coolant flow path at least partially overlap with each other.

[0007] The greater the area of ​​the non-connected portions (46, 56), the more heat from the condenser (20) is dissipated to the refrigerant flow paths (151, 152, 153, 154). Because the non-connected portions are not connected to the electrical components, the electrical influence on the electrical components is small and the area of ​​the non-connected portions can be increased. The electrical influence on the electrical components is small and the heat dissipation performance of the bus bar can be improved.

[0008] It should be noted that the reference numbers in parentheses above merely indicate the corresponding relationship with the configurations described in the embodiments described below, and do not in any way limit the technical scope. [Brief description of the drawings]

[0009] [Figure 1] FIG. 2 is an electric circuit diagram illustrating the in-vehicle system. [Diagram 2] FIG. 2 is a plan view of the capacitor device. [Diagram 3] FIG. 2 is a plan view of the capacitor device. [Figure 4]FIG. 2 is a perspective view of a capacitor module. [Diagram 5] FIG. 4 is a plan view illustrating a refrigerant flow path. [Figure 6] FIG. 3 is a cross-sectional view taken along line VI-VI shown in FIG. [Figure 7] FIG. 3 is a cross-sectional view taken along line VII-VII shown in FIG. [Figure 8] FIG. 3 is a cross-sectional view taken along line VIII-VIII shown in FIG. [Figure 9] FIG. 5 is a cross-sectional view of a capacitor device according to a second embodiment. [Figure 10] FIG. 11 is a cross-sectional view of a capacitor device according to a third embodiment. [Figure 11] FIG. 13 is a perspective view of a capacitor module according to a fourth embodiment. [Figure 12] FIG. 11 is a cross-sectional view of a capacitor device according to a fourth embodiment. [Figure 13] FIG. 13 is a perspective view of a capacitor module according to a fifth embodiment. [Figure 14] FIG. 13 is a plan view illustrating a refrigerant flow path of the sixth embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] Hereinafter, several embodiments for carrying out the present disclosure will be described with reference to the drawings. In each embodiment, the same reference numerals may be used to designate parts corresponding to matters described in the preceding embodiment, and duplicated descriptions may be omitted. In each embodiment, when only a part of the configuration is described, the other embodiment described previously may be applied to the other parts of the configuration.

[0011] In addition to combinations of parts that are explicitly stated as possible in each embodiment, it is also possible to partially combine embodiments, embodiments and variations, and variations even if not explicitly stated, provided that there are no particular problems with the combination.

[0012] (First embodiment) <In-vehicle systems> 1 is an electrical circuit diagram of a power conversion device 10 mounted on an in-vehicle system 1. The in-vehicle system 1 is equipped with a battery 2, a motor generator 4, and the power conversion device 10. The vehicle on which the in-vehicle system 1 is mounted is a hybrid automobile that can run by switching between and / or combining the driving force of an engine and the driving force of the motor generator 4. The engine and the motor generator 4 are interconnected via a gear device.

[0013] The power conversion device 10 has an inverter 11, a capacitor module 60, a high potential side wiring 110, a low potential side wiring 120, and a connecting bus bar 15. The high potential side wiring 110 is a conductive member connected to the positive electrode of the battery 2. The low potential side wiring 120 is a conductive member connected to the negative electrode of the battery 2. The capacitor module 60 has a capacitor 20, a portion of the high potential side wiring 110, and a portion of the low potential side wiring 120. The connecting bus bar 15 is a conductive member that connects the inverter 11 and the motor generator 4.

[0014] The inverter 11 has a plurality of switch modules 12. The plurality of switch modules 12 constitute a power module 14. Each switch module 12 has two switching elements 13 and two diodes 13A. The two switching elements 13 are connected in series between a high potential side wiring 110 and a low potential side wiring 120. A high potential side input terminal 11A connected to the high potential side wiring 110 is connected to a collector electrode of one of the two switching elements 13 provided on the high potential side. A low potential side input terminal 11B connected to the low potential side wiring 120 is connected to an emitter of one of the two switching elements 13 provided on the low potential side. The anode of the diode 13A is connected to the emitter of the corresponding switching element 13. The cathode of the diode 13A is connected to the collector of the corresponding switching element 13.

[0015] A motor terminal 11C connected to the motor generator 4 is connected to the emitter of the switching element 13 on the high potential side and the collector of the switching element 13 on the low potential side. The multiple switching elements 13 convert DC power supplied from the battery 2 into AC power capable of driving the motor generator 4. The converted power is supplied to the motor generator 4 via a connecting bus bar 15. Gate terminals 11D of the multiple switching elements 13 are electrically connected to a control unit mounted on a control circuit board (not shown). The multiple switching elements 13 are on / off controlled by the control unit.

[0016] <Mechanical configuration of the capacitor device> Next, a description will be given of the mechanical configuration of the capacitor device 100. The capacitor device 100 includes a capacitor module 60, a sealing resin 30, a case 70, a case cover 80, a frame 130, and a frame cover 140. The capacitor device 100 is also mounted on the in-vehicle system 1.

[0017] As described above, the capacitor module 60 has the capacitor 20, a portion of the high potential side wiring 110, and a portion of the low potential side wiring 120. The portion of the high potential side wiring 110 of the capacitor module 60 may be referred to as a high potential side bus bar 40. The portion of the low potential side wiring 120 of the capacitor module 60 may be referred to as a low potential side bus bar 50. The capacitor module 60 has the capacitor 20, the high potential side bus bar 40, and the low potential side bus bar 50.

[0018] The high potential side bus bar 40 and the low potential side bus bar 50 are electrically connected to the capacitor 20. The case 70 is a box-shaped housing having a case storage space 78 for storing them. The case 70 is made mainly of a resin material, for example. Note that the material of the case 70 is not limited to the resin material. The case storage space 78 of the case 70 is filled with a sealing resin 30. The capacitor 20, a part of the high potential side bus bar 40, and a part of the low potential side bus bar 50 are fixed to the case 70 via the sealing resin 30. The sealing resin 30 is, for example, an epoxy resin. Note that the capacitor device 100 does not need to have the sealing resin 30. In the first embodiment, a configuration having the sealing resin 30 will be described as an example.

[0019] 2 and 3 are plan views of the capacitor device 100. The case cover 80 and the frame cover 140 may be collectively referred to as covers 80, 140. FIG. 4 is a perspective view of the capacitor module 60. FIG. 5 is a plan view for explaining the refrigerant flow path 150. FIG. 6 is a cross-sectional view taken along line VI-VI shown in FIG. 2. FIG. 7 is a cross-sectional view taken along line VII-VII shown in FIG. 2. FIG. 8 is a cross-sectional view taken along line VIII-VIII shown in FIG. 2. The arrows in FIGS. 6 to 8 indicate the flow of the refrigerant. In FIG. 3, dashed lines are used in the same positions as in FIG. 2.

[0020] Regarding directions, the thickness direction of the capacitor 20 may be referred to as the thickness direction TD. A direction perpendicular to the thickness direction TD may be referred to as the width direction WD. A direction perpendicular to the thickness direction TD and the width direction WD may be referred to as the depth direction DP. The thickness direction TD, the width direction WD, and the depth direction DP are three directions perpendicular to each other. A direction perpendicular to the thickness direction TD may be referred to as the planar direction. The depth direction DP may be referred to as the first arrangement direction. The width direction WD may be referred to as the second arrangement direction.

[0021] As shown in FIG. 7, the case 70 has a case bottom 71 having a thickness in the thickness direction TD, and a case side wall 72 rising from the case bottom 71 in an annular shape. A case storage space 78 is defined by the case bottom 71 and the case side wall 72. A case opening 79 opening in the thickness direction TD is defined by a case side wall end 77 of the case side wall 72 away from the case bottom 71. As shown in FIG. 2 and FIG. 6, the case side wall 72 includes a first case wall portion 73 and a third case wall portion 75 aligned in the width direction WD, and a second case wall portion 74 and a fourth case wall portion 76 aligned in the depth direction DP. The first case wall portion 73, the second case wall portion 74, the third case wall portion 75, and the fourth case wall portion 76 are continuous in an annular shape in the clockwise direction in this order.

[0022] The case cover 80 is a cover that covers the case side wall 72 from the outside. The case cover 80 has a cover bottom 81 having a thickness in the thickness direction TD, and a cover side wall 82 that rises in an annular shape from the cover bottom 81. A cover storage space 88 is defined by the cover bottom 81 and the cover side wall 82. A cover opening 89 that opens in the thickness direction TD is defined by a cover side wall end portion 87 of the cover side wall 82 that is distant from the cover bottom 81.

[0023] The cover side wall 82 includes a first cover wall portion 83 and a third cover wall portion 85 aligned in the width direction WD, and a second cover wall portion 84 and a fourth cover wall portion 86 aligned in the depth direction DP. The first cover wall portion 83, the second cover wall portion 84, the third cover wall portion 85, and the fourth cover wall portion 86 are continuous in this order in a clockwise direction in an annular shape. The cover opening 89 is larger than the size of the case 70. The case 70 is stored in the cover storage space 88. A gap is provided between the case side wall 72 and the cover side wall 82.

[0024] The frame 130 is a base on which the power module 14 is mounted. The frame 130 has a flat shape with a small thickness in the thickness direction TD. The frame 130 is continuous with the case 70 and made of the same material. The frame 130 is integrally connected to the case side wall 72. The frame 130 extends in a planar direction away from the case side wall 72. A portion of the frame 130 connected to the first case wall 73 may be referred to as a first case connecting portion 133. A portion of the frame 130 connected to the second case wall 74 may be referred to as a second case connecting portion 134. A portion of the frame 130 connected to the third case wall 75 may be referred to as a third case connecting portion 135. A portion of the frame 130 connected to the fourth case wall 76 may be referred to as a fourth case connecting portion 136.

[0025] The fourth case connecting portion 136 extends in the depth direction DP longer than the size of the power module 14. The fourth case connecting portion 136 has a connecting portion 136A extending from the fourth case wall portion 76, and a mounting portion 136B on which the power module 14 is mounted at an end of the connecting portion 136A.

[0026] The frame cover 140 is a cover that covers a part of the frame 130. The frame cover 140 is integrally connected to the cover side wall 82. The frame cover 140 extends in a planar direction away from the cover side wall 82. A portion of the frame cover 140 that is connected to the first cover wall portion 83 may be referred to as a first cover connecting portion 143. A portion of the frame cover 140 that is connected to the second cover wall portion 84 may be referred to as a second cover connecting portion 144. A portion of the frame cover 140 that is connected to the third cover wall portion 85 may be referred to as a third cover connecting portion 145. A portion of the frame cover 140 that is connected to the fourth cover wall portion 86 may be referred to as a fourth cover connecting portion 146.

[0027] The fourth cover connecting portion 146 extends in the depth direction DP longer than the size of the power module 14. The fourth case connecting portion 136 has a connecting portion 146A extending from the fourth cover wall portion 86, and a mounting portion 146B on which the power module 14 is mounted at an end of the connecting portion 146A.

[0028] <Coolant flow path> The first case connecting portion 133 and the first cover connecting portion 143 overlap in the thickness direction TD. The second case connecting portion 134 and the second cover connecting portion 144 overlap in the thickness direction TD. The third case connecting portion 135 and the third cover connecting portion 145 overlap in the thickness direction TD. The fourth case connecting portion 136 and the fourth cover connecting portion 146 overlap in the thickness direction TD. As shown in FIG. 7, the first case connecting portion 133 and the first cover connecting portion 143 are in close contact with each other. The first case connecting portion 133 and the first cover connecting portion 143 are in close contact with each other, thereby blocking the gap between the first case wall portion 73 and the first cover wall portion 83. The gap between the first case wall portion 73 and the first cover wall portion 83 is a refrigerant flow path through which the refrigerant can flow. For this reason, the gap between the first case wall portion 73 and the first cover wall portion 83 may be referred to as the first wall portion side refrigerant flow path 151.

[0029] The third case connecting portion 135 and the third cover connecting portion 145 are in close contact with each other. The gap between the third case wall portion 75 and the third cover wall portion 85 is closed by the close contact between the third case connecting portion 135 and the third cover connecting portion 145. The gap between the third case wall portion 75 and the third cover wall portion 85 is a refrigerant flow path through which the refrigerant can flow. For this reason, the gap between the third case wall portion 75 and the third cover wall portion 85 may be referred to as a third wall-side refrigerant flow path 153. The same applies to the gap between the second case wall portion 74 and the second cover wall portion 84. The gap between the second case wall portion 74 and the second cover wall portion 84 may be referred to as a second wall-side refrigerant flow path 152. The same applies to the gap between the fourth case wall portion 76 and the fourth cover wall portion 86. The gap between the fourth case wall portion 76 and the fourth cover wall portion 86 may be referred to as a fourth wall-side refrigerant flow path 154.

[0030] Furthermore, a refrigerant flow path having a gap large enough to allow the refrigerant to flow is formed between the second case connecting portion 134 and the second cover connecting portion 144. The refrigerant flow path between the second case connecting portion 134 and the second cover connecting portion 144 is connected to an outlet port that is discharged to the outside of the condenser device 100. The refrigerant flow path between the second case connecting portion 134 and the second cover connecting portion 144 may be referred to as an outlet port side refrigerant flow path 155. A refrigerant flow path having a gap large enough to allow the refrigerant to flow is also formed between the fourth case connecting portion 136 and the fourth cover connecting portion 146. The fourth case connecting portion 136 and the fourth cover connecting portion 146 have a length in the depth direction DP that is equal to or greater than the size of the power module 14.

[0031] The refrigerant flow path between the fourth case connecting portion 136 and the fourth cover connecting portion 146 overlaps with the power module 14 in the thickness direction TD at the end portion remote from the condenser 20. The power module 14 is cooled by the refrigerant flow path between the fourth case connecting portion 136 and the fourth cover connecting portion 146. The refrigerant flow path between the fourth case connecting portion 136 and the fourth cover connecting portion 146 may be referred to as an inlet side refrigerant flow path 156. A first inlet side refrigerant flow path 156B is formed by the mounting portion 136B and the mounting portion 146B. A second inlet side refrigerant flow path 156A is formed by the connecting portion 136A and the connecting portion 146A.

[0032] The inlet side refrigerant flow path 156 is connected to the fourth wall side refrigerant flow path 154. The second wall side refrigerant flow path 152 is connected to the fourth wall side refrigerant flow path 154. The second wall side refrigerant flow path 152 and the fourth wall side refrigerant flow path 154 are connected to the first wall side refrigerant flow path 151 and the third wall side refrigerant flow path 153. The outlet side refrigerant flow path 155 is connected to the second wall side refrigerant flow path 152. The inlet side refrigerant flow path 156 is connected to the fourth wall side refrigerant flow path 154.

[0033] The refrigerant flows from the first inlet side refrigerant flow passage 156B to the second inlet side refrigerant flow passage 156A. The refrigerant flows from the second inlet side refrigerant flow passage 156A to the fourth wall side refrigerant flow passage 154. The refrigerant flows from the fourth wall side refrigerant flow passage 154 to the first wall side refrigerant flow passage 151 and the third wall side refrigerant flow passage 153. The refrigerant flows from the first wall side refrigerant flow passage 151 and the third wall side refrigerant flow passage 153 to the second wall side refrigerant flow passage 152. The refrigerant flows from the second wall side refrigerant flow passage 152 to the outlet side refrigerant flow passage 155 and is discharged to the outside of the condenser device 100. The first wall side refrigerant flow passage 151 to the inlet side refrigerant flow passage 156 may be collectively simply referred to as the refrigerant flow passage 150. The refrigerant passing through the refrigerant flow passage 150 is, for example, cooling water. The refrigerant is not limited to cooling water, and may be air, refrigerant gas, or the like.

[0034] The first wall side refrigerant flow path 151, the second wall side refrigerant flow path 152, the third wall side refrigerant flow path 153, and the fourth wall side refrigerant flow path 154 are refrigerant flow paths formed between the case 70 and the cover 80. The first wall side refrigerant flow path 151, the second wall side refrigerant flow path 152, the third wall side refrigerant flow path 153, and the fourth wall side refrigerant flow path 154 may be collectively referred to as a case refrigerant flow path. The inflow side refrigerant flow path 156 is a refrigerant flow path formed between the fourth case connecting portion 136 and the fourth cover connecting portion 146. The inflow side refrigerant flow path 156 may be referred to as a frame refrigerant flow path.

[0035] <Capacitor module> As an example, the capacitor 20 has two capacitor elements 21 and 22. One of the two capacitor elements 21 and 22 may be referred to as a first capacitor element 21. The other of the two capacitor elements 21 and 22 may be referred to as a second capacitor element 22. The first capacitor element 21 and the second capacitor element 22 may be collectively referred to as the capacitor elements 21 and 22. The capacitor 20 may have only one capacitor element or may have three or more capacitor elements.

[0036] Capacitor elements 21 and 22 are film capacitors. A film capacitor is a dielectric film that is wound around such that metal vapor deposition electrodes are provided on the dielectric film and the metal vapor deposition electrodes face each other. Metallicon electrodes are formed on both end surfaces of the film capacitor by spraying metal. Capacitor elements 21 and 22 are three-dimensional shapes with a certain volume. Capacitor elements 21 and 22 may be provided in three-dimensional shapes such as a circular cylinder or an elliptical cylinder. Capacitor elements 21 and 22 have two end faces 23 and 24 that are separated in the thickness direction TD, and a side surface 25 that connects the two end faces 23 and 24.

[0037] One of the two end faces 23, 24 overlaps with the case bottom 71 in the thickness direction TD. The other of the two end faces 23, 24 is provided on the case opening 79 side. Of the two end faces 23, 24, the one that overlaps with the case bottom 71 may be referred to as the first end face 23. Of the two end faces 23, 24, the one that is separated from the case bottom 71 may be referred to as the second end face 24.

[0038] A first electrode, which is a metallikon electrode, is provided on the first end surface 23. A second electrode, which is a metallikon electrode, is provided on the second end surface 24. The first electrode and the second electrode are provided to be spaced apart in the thickness direction TD. The side surface 25 connects the first end surface 23 and the second end surface 24. The side surface 25 extends along the edges of the first end surface 23 and the second end surface 24. It can also be said that the side surface 25 extends along the edges of the first end surface 23 and the second end surface 24 in the circumferential direction about an axis along the thickness direction TD. The two capacitor elements 21 and 22 are arranged side by side in the depth direction DP in the case storage space 78. The first capacitor element 21 is provided closer to the fourth case wall portion 76 than the second capacitor element 22. A high potential side bus bar 40 is connected to the first electrode of the first capacitor element 21 and the first electrode of the second capacitor element 22. A low potential side bus bar 50 is connected to the second electrode of first capacitor element 21 and the second electrode of second capacitor element 22.

[0039] <High potential bus bar> The high potential side busbar 40 is a conductive member formed by bending a metal plate. The high potential side busbar 40 has a first overlapping portion 41, a battery side first protruding portion 42, a battery side first connecting portion 43, a power module side first protruding portion 44, a power module side first connecting portion 45, and a high potential side non-connecting portion 46. The first overlapping portion 41 is a portion that overlaps with the case bottom 71 in the thickness direction TD. It can also be said that the first overlapping portion 41 is a portion that overlaps with the first electrode of the first capacitor element 21 and the first electrode of the second capacitor element 22 in the thickness direction TD with respect to the thickness direction TD. The first overlapping portion 41 spreads in the planar direction. The high potential side busbar 40 may also be called a bottom side busbar.

[0040] A battery side first protruding portion 42 is provided at an end of the first overlapping portion 41 on the second case wall portion 74 side. The battery side first protruding portion 42 protrudes in the thickness direction TD so as to move away from the first overlapping portion 41. A battery side first protruding end portion 42A, which is an end portion of the battery side first protruding portion 42 farther from the case bottom 71, is farther from the case bottom 71 than the case side wall end portion 77. The battery side first protruding end portion 42A is exposed from the case opening 79.

[0041] The battery side first connection part 43 is provided on the battery side first protruding end part 42A. The battery side first connection part 43 is a part that electrically connects the capacitor 20 and the battery 2. The battery side first connection part 43 extends in the depth direction DP away from the battery side first protruding end part 42A. The battery side first connection part 43 extends in the width direction WD beyond the case side wall end part 77 to the outside of the second case wall part 74.

[0042] A power module side first protruding portion 44 is provided at an end of the first overlapping portion 41 on the fourth case wall portion 76 side. The power module side first protruding portion 44 protrudes in the thickness direction TD so as to move away from the case bottom 71. A power module side first protruding end portion 44A, which is the end portion of the power module side first protruding portion 44 away from the case bottom 71, is farther from the case bottom 71 than the case side wall end portion 77. The power module side first protruding end portion 44A is exposed from a case opening 79.

[0043] A power module side first connection portion 45 is provided at the power module side first protruding end portion 44A. The power module side first connection portion 45 is a portion that electrically connects the capacitor 20 and the power module 14. The power module side first connection portion 45 extends in the depth direction DP so as to move away from the power module side first protruding end portion 44A. The power module side first connection portion 45 extends in the depth direction DP beyond the case side wall end portion 77 to the outside of the fourth case wall portion 76.

[0044] A high potential side non-connection portion 46 is provided at an end of the first overlapping portion 41 on the third case wall portion 75 side. The high potential side non-connection portion 46 is a portion that is not connected to the battery 2 and the power module 14. The end of the high potential side non-connection portion 46 is an open end. The high potential side non-connection portion 46 protrudes in the thickness direction TD so as to move away from the case bottom 71. A high potential side non-connection end portion 46A, which is the end of the high potential side non-connection portion 46 farther from the case bottom 71, is provided closer to the case bottom 71 than the second end surface 24. The high potential side non-connection end portion 46A is separated enough to ensure insulation from the second overlapping portion 51. It is desirable that the high potential side non-connection end portion 46A is extended as far as possible.

[0045] High potential side non-connection portion 46 overlaps with side surface 25 of capacitor 20 on the side of third case wall portion 75 in the width direction WD. The length in the depth direction DP of high potential side non-connection portion 46 is longer than the length in the depth direction DP of one of capacitor elements 21, 22. High potential side non-connection portion 46 extends across first capacitor element 21 and second capacitor element 22 in the depth direction DP.

[0046] The first overlapping portion 41, a portion of the battery-side first protruding portion 42, a portion of the power module-side first protruding portion 44, and the high potential side non-connecting portion 46 are provided in the case storage space 78. The first overlapping portion 41, a portion of the battery-side first protruding portion 42, a portion of the power module-side first protruding portion 44, and the high potential side non-connecting portion 46 are fixed to the case 70 via sealing resin 30. The sealing resin 30 is interposed between the third case wall portion 75 and the high potential side non-connecting portion 46. The sealing resin 30 is interposed between the high potential side non-connecting portion 46 and the capacitor elements 21, 22.

[0047] A current flows through the high potential side bus bar 40 from the battery 2 toward the power module 14. The current flows in the order of the battery side first connection portion 43, the battery side first protrusion portion 42, the first overlap portion 41, the power module side first protrusion portion 44, and the power module side first connection portion 45. The battery side first connection portion 43, the battery side first protrusion portion 42, the first overlap portion 41, the power module side first protrusion portion 44, and the power module side first connection portion 45 form the shortest current path through which a current flows from the battery 2 to the power module 14.

[0048] The high potential side non-connection portion 46 is connected to an end portion of the first overlapping portion 41 different from the end portion where the battery side first protrusion portion 42 and the power module side first protrusion portion 44 are provided. The high potential side non-connection portion 46 is out of the shortest current path from the battery 2 to the power module 14. The high potential side non-connection portion 46 is also sometimes referred to as a non-current path because no current flows through the shortest current path from the battery 2 to the power module 14. The high potential side non-connection portion 46 overlaps with the capacitor 20 in the width direction WD on the third case wall portion 75 side.

[0049] <Low potential bus bar> The low potential side busbar 50 is a conductive member formed by bending a metal plate. The low potential side busbar 50 has a second overlapping portion 51, a battery side second protruding portion 52, a battery side second connecting portion 53, a power module side second protruding portion 54, a power module side second connecting portion 55, and a low potential side non-connecting portion 56. The second overlapping portion 51 is separated from the case bottom 71 in the thickness direction TD. The second overlapping portion 51 is a portion that overlaps with the second electrode of the first capacitor element 21 and the second electrode of the second capacitor element 22 in the thickness direction TD. The second overlapping portion 51 spreads in the planar direction. The low potential side busbar 50 may also be called an opening side busbar.

[0050] A battery side second protruding portion 52 is provided at an end of the second overlapping portion 51 on the second case wall portion 74 side. The battery side second protruding portion 52 protrudes in the thickness direction TD so as to move away from the second overlapping portion 51. A battery side second protruding end portion 52A, which is an end portion of the battery side second protruding portion 52 farther from the second electrode, is farther from the second electrode than the case side wall end portion 77. The battery side second protruding end portion 52A is exposed from the case opening 79.

[0051] The battery side second connection portion 53 is provided on the battery side second protruding end portion 52A. The battery side second connection portion 53 is a portion that electrically connects the capacitor 20 and the battery 2. The battery side second connection portion 53 extends in the depth direction DP away from the battery side second protruding end portion 52A. The battery side second connection portion 53 extends in the depth direction DP beyond the case side wall end portion 77 to the outside of the second case wall portion 74.

[0052] A power module side second protruding portion 54 is provided at an end of the second overlapping portion 51 on the fourth case wall portion 76 side. The power module side second protruding portion 54 protrudes in the thickness direction TD so as to move away from the second electrode. An inverter side second protruding end portion 54A, which is an end of the power module side second protruding portion 54 away from the second electrode, is farther from the second electrode than the case side wall end portion 77. The inverter side second protruding end portion 54A is exposed from a case opening 79.

[0053] A power module side second connection portion 55 is provided at the inverter side second protruding end portion 54A. The power module side second connection portion 55 is a portion that electrically connects the capacitor 20 and the battery 2. The power module side second connection portion 55 extends in the depth direction DP away from the inverter side second protruding end portion 54A. The power module side second connection portion 55 extends in the depth direction DP beyond the case side wall end portion 77 to the outside of the fourth case wall portion 76.

[0054] A low potential side non-connection portion 56 is provided at the end of the second overlapping portion 51 on the first case wall portion 73 side. The low potential side non-connection portion 56 is a portion that is not connected to the battery 2 and the power module 14. The end of the low potential side non-connection portion 56 is an open end. The low potential side non-connection portion 56 protrudes in the thickness direction TD toward the case bottom 71. A low potential side non-connection end portion 56A, which is the end of the low potential side non-connection portion 56 on the case bottom 71 side, is provided farther from the case bottom 71 than the first end face 23. The low potential side non-connection end portion 56A is far enough away from the first overlapping portion 41 to ensure insulation. It is desirable that the low potential side non-connection end portion 56A is extended as far as possible.

[0055] Low potential side non-connection portion 56 overlaps in the width direction WD with side surface 25 of capacitor elements 21, 22 on the first case wall portion 73 side. The length in the depth direction DP of low potential side non-connection portion 56 is longer than the length in the depth direction DP of one of capacitor elements 21, 22. Low potential side non-connection portion 56 extends across first capacitor element 21 and second capacitor element 22 in the depth direction DP.

[0056] The second overlapping portion 51, a portion of the battery side second protruding portion 52, a portion of the power module side second protruding portion 54, and the low potential side non-connecting portion 56 are provided in the case storage space 78. The second overlapping portion 51, a portion of the battery side second protruding portion 52, a portion of the power module side second protruding portion 54, and the low potential side non-connecting portion 56 are fixed to the case 70 via sealing resin 30. The sealing resin 30 is interposed between the first case wall portion 73 and the low potential side non-connecting portion 56. The sealing resin 30 is interposed between the low potential side non-connecting portion 56 and the capacitor elements 21, 22.

[0057] A current flows through the low potential side bus bar 50 from the battery 2 toward the power module 14. The current flows in the order of the battery side second connection portion 53, the battery side second protrusion portion 52, the second overlap portion 51, the power module side second protrusion portion 54, and the power module side second connection portion 55. The battery side second connection portion 53, the battery side second protrusion portion 52, the second overlap portion 51, the power module side second protrusion portion 54, and the power module side second connection portion 55 form the shortest current path through which a current flows from the battery 2 to the power module 14.

[0058] The low potential side non-connection portion 56 is connected to an end portion of the second overlapping portion 51 different from the end portion where the battery side second protrusion portion 52 and the power module side second protrusion portion 54 are provided. The low potential side non-connection portion 56 is out of the shortest current path from the battery 2 to the power module 14. The low potential side non-connection portion 56 is also sometimes referred to as a non-current path because no current flows through the shortest current path from the battery 2 to the power module 14. The low potential side non-connection portion 56 overlaps with the capacitor 20 in the width direction WD on the first case wall portion 73 side.

[0059] <Busbar and coolant flow path> In the width direction WD, the low potential side non-connection portion 56 overlaps the first case wall portion 73. In the depth direction DP, the battery side first protrusion portion 42 and the battery side second protrusion portion 52 overlap the second case wall portion 74. In the width direction WD, the high potential side non-connection portion 46 overlaps the third case wall portion 75. In the depth direction DP, the power module side first protrusion portion 44 and the power module side second protrusion portion 54 overlap the fourth case wall portion 76.

[0060] The low potential side non-connection portion 56 overlaps the first wall side refrigerant flow path 151 in the width direction WD. The battery side first protrusion portion 42 and the battery side second protrusion portion 52 overlap the second wall side refrigerant flow path 152 in the depth direction DP. The high potential side non-connection portion 46 overlaps the third wall side refrigerant flow path 153 in the width direction WD. The power module side first protrusion portion 44 and the power module side second protrusion portion 54 overlap the fourth wall side refrigerant flow path 154 in the depth direction DP. Cooling water flows in the refrigerant flow path 150.

[0061] The heat of the capacitor elements 21, 22 is dissipated from the low potential side non-connection portion 56 to the refrigerant flowing in the first wall side refrigerant flow passage 151. The heat of the capacitor elements 21, 22 is dissipated from the battery side first protruding portion 42 and the battery side second protruding portion 52 to the refrigerant flowing in the second wall side refrigerant flow passage 152. The heat of the capacitor elements 21, 22 is dissipated from the high potential side non-connection portion 46 to the refrigerant flowing in the third wall side refrigerant flow passage 153. The heat of the capacitor elements 21, 22 is dissipated from the power module side first protruding portion 44 and the power module side second protruding portion 54 to the refrigerant flowing in the fourth wall side refrigerant flow passage 154. The power module 14 overlaps the first inflow side refrigerant flow passage 156B in the thickness direction TD. The heat of the power module 14 is dissipated from the power module 14 to the refrigerant flowing in the first inflow side refrigerant flow passage 156B.

[0062] <Action and effect> The effects achieved by the first embodiment will be described below. In describing the effects, the components described so far may be collectively described. The battery 2 and the power module 14 may be collectively referred to as the electric components 2 and 14. The first overlapping portion 41 and the second overlapping portion 51 may be collectively referred to as the overlapping portions 41 and 51. The battery side first connection portion 43, the power module side first connection portion 45, the battery side second connection portion 53, and the power module side second connection portion 55 may be collectively referred to as the connection portions 43 and 45 and 53 and 55. The high potential side non-connection portion 46 and the low potential side non-connection portion 56 may be collectively referred to as the non-connection portions 46 and 56. The first capacitor element 21 and the second capacitor element 22 may be collectively referred to as the capacitor elements 21 and 22.

[0063] The capacitor device 100 has a capacitor 20, a high potential side bus bar 40, a low potential side bus bar 50, a case 70, and a case cover 80. The capacitor 20 is electrically connected to the electric components 2, 14 via the high potential side bus bar 40 and the low potential side bus bar 50. The capacitor 20, a portion of the high potential side bus bar 40, and a portion of the low potential side bus bar 50 are accommodated in a case accommodation space 78 of the case 70.

[0064] The case cover 80 covers the case 70 from the outside. A refrigerant flow path 150 through which a refrigerant can flow is formed between the case 70 and the case cover 80. The high potential side bus bar 40 has a first overlapping portion 41, a battery side first connection portion 43, a power module side first connection portion 45, and a high potential side non-connection portion 46. The low potential side bus bar 50 has a second overlapping portion 51, a battery side second connection portion 53, a power module side second connection portion 55, and a low potential side non-connection portion 56. The overlapping portions 41, 51 overlap the first end surface 23 or the second end surface 24 in the thickness direction TD and are connected to the electrodes. The connection portions 43, 45, 53, 55 are connected to the overlapping portions 41, 51 and are connected to the electric components 2, 14. The non-connection portions 46, 56 are connected to the overlapping portions 41, 51 and are not connected to the electric components 2, 14. The non-connected portions 46, 56 and a part of the coolant flow path 150 overlap in the planar direction.

[0065] The heat of the condenser 20 is dissipated from the non-connected portions 46, 56 to the refrigerant flowing in the refrigerant flow path 150. Because the non-connected portions 46, 56 are not connected to the electrical components 2, 14, increasing the area of ​​the non-connected portions 46, 56 has little electrical effect on the electrical components 2, 14. The larger the area of ​​the non-connected portions 46, 56, the more heat of the condenser 20 is dissipated to the refrigerant flow path 150. The heat of the condenser 20 can be efficiently dissipated from the non-connected portions 46, 56 to the refrigerant flow path 150 with little electrical effect on the electrical components 2, 14. The heat dissipation performance of the bus bar can be improved with little electrical effect on the electrical components 2, 14. In addition, the non-connected portions 46, 56 have a high degree of design freedom.

[0066] Unlike this embodiment, in a configuration in which the non-connected portions 46, 56 and the refrigerant flow path 150 do not overlap in the planar direction, the amount of intervening material between the case side wall 72 and the condenser 20 is reduced. However, in order to ensure insulation from the case side wall 72 to the condenser 20, it is necessary to interpose air or an insulating potting material between the case side wall 72 and the condenser 20. In this case, air and potting material have poor thermal conductivity, making it difficult to efficiently transfer heat from the condenser 20.

[0067] In contrast, in a configuration in which the non-connected portions 46, 56 and the refrigerant flow path 150 overlap in the planar direction as in this embodiment, the non-connected portions 46, 56 have better thermal conductivity than air or potting material. As a result, heat from the condenser 20 can be efficiently dissipated from the non-connected portions 46, 56 to the refrigerant flow path 150. Even if the non-connected portions 46, 56 are provided between the side wall 72 and the capacitor 20 via the sealing resin 30, the heat from the condenser 20 can be efficiently transferred to the refrigerant flow path 150 compared to a case in which only the sealing resin 30 is provided between the side wall 72 and the capacitor 20. In addition, since the non-connected portions 46, 56 are part of the bus bars 40, 50, no new parts need to be added, and an increase in the number of parts can be suppressed.

[0068] The connection parts 43, 45, 53, 55 are connected to ends of the overlapping parts 41, 51 that overlap with the electrical components 2, 14 in the depth direction DP. The non-connection parts 46, 56 are connected to ends of the overlapping parts 41, 51 that do not overlap with the electrical components 2, 14. The non-connection parts 46, 56 overlap the refrigerant flow path 150 in the width direction WD. The connection parts 43, 45, 53, 55 and the non-connection parts 46, 56 are connected to different ends of the overlapping parts 41, 51. Therefore, the non-connection parts 46, 56 are less likely to be restricted in area. There is a high degree of freedom in increasing the area of ​​the non-connection parts 46, 56.

[0069] The non-connected portions 46, 56 extend along the side surfaces 25 of the capacitor elements 21, 22. The non-connected portions 46, 56 overlap the capacitor elements 21, 22 and the refrigerant flow path 150 in the width direction WD. Because the non-connected portions 46, 56 overlap the capacitor elements 21, 22 in the width direction WD, heat is easily radiated from the capacitor elements 21, 22 to the non-connected portions 46, 56. The heat of the capacitor elements 21, 22 can be efficiently dissipated from the non-connected portions 46, 56 to the refrigerant flow path 150. In addition, because the non-connected portions 46, 56 and the capacitor elements 21, 22 overlap in the planar direction, an increase in the physical size in the thickness direction TD can be suppressed.

[0070] The connection parts 43, 45, 53, 55 have battery side connection parts 43, 53 connected to one end of the overlapping parts 41, 51 in the depth direction DP, and power module side connection parts 45, 55 connected to the other end of the overlapping parts 41, 51 in the depth direction DP. The high potential side non-connection part 46 is provided at one end of the first overlapping part 41 in the width direction WD. The low potential side non-connection part 56 is provided at the other end of the second overlapping part 51 in the width direction WD. The high potential side non-connection part 46 overlaps with the third wall side refrigerant flow path 153 in the width direction WD. The low potential side non-connection part 56 overlaps with the first wall side refrigerant flow path 151 in the width direction WD. Heat of the condenser 20 is dissipated from the high potential side non-connection part 46 to the third wall side refrigerant flow path 153. Heat of the condenser 20 is dissipated from the low potential side non-connection part 56 to the first wall side refrigerant flow path 151. This makes it possible to efficiently dissipate heat from capacitor elements 21 and 22 while suppressing an increase in the inductance component of the current path to power module 14.

[0071] The busbars 40, 50 include a high-potential side busbar 40 connected to the first electrode and the electric components 2, 14, and a low-potential side busbar 50 connected to the second electrode and the electric components 2, 14. The battery side first protrusion 42 of the high-potential side busbar 40 and the battery side second protrusion 52 of the low-potential side busbar 50 overlap in the width direction WD. The power module side first protrusion 44 of the high-potential side busbar 40 and the power module side second protrusion 54 of the low-potential side busbar 50 overlap in the width direction WD. The high-potential side non-connection portion 46 and the low-potential side non-connection portion 56 overlap the refrigerant flow path 150 in the width direction WD. Since the non-connection portions 46, 56 are provided at ends different from the connection portions 43, 45, 53, 55, it is not necessary to consider insulation between the non-connection portions 46, 56 and the connection portions 43, 45, 53, 55. By increasing the area of ​​the non-connected portion 46 of the high potential side bus bar 40 and the non-connected portion 56 of the low potential side bus bar 50, the heat of the capacitor 20 can be dissipated efficiently.

[0072] The condenser device 100 further includes a frame 130 and a frame cover 140. The frame 130 is a base on which the power module 14 is mounted. The frame 130 is integrally connected to the case side wall 72. The frame 130 extends in a planar direction away from the case side wall 72. The frame cover 140 is a cover that covers a part of the frame 130. The frame cover 140 is integrally connected to the cover side wall 82. The frame cover 140 extends in a planar direction away from the cover side wall 82. The frame cover 140 and the frame 130 form an inlet side refrigerant flow path 156 that is connected to the fourth wall side refrigerant flow path 154. The power module 14 overlaps a part of the inlet side refrigerant flow path 156 in the thickness direction TD. Since the refrigerant flow path that cools the power module 14 and the refrigerant flow path that cools the condenser 20 can be integrated, the number of parts can be reduced while efficiently dissipating heat from the condenser 20.

[0073] The refrigerant flow path 150 has a first wall-side refrigerant flow path 151, a second wall-side refrigerant flow path 152, a third wall-side refrigerant flow path 153, and a fourth wall-side refrigerant flow path 154. The first wall-side refrigerant flow path 151 overlaps the low-potential side non-connection portion 56 in the width direction WD. The second wall-side refrigerant flow path 152 overlaps the battery-side first protruding portion 42 and the battery-side second protruding portion 52 in the depth direction DP. The third wall-side refrigerant flow path 153 overlaps the high-potential side non-connection portion 46 in the width direction WD. The fourth wall-side refrigerant flow path 154 overlaps the power module-side first protruding portion 44 and the power module-side second protruding portion 54 in the depth direction DP. The refrigerant flow path 150 extends to surround the condenser 20. According to this, since the heat of the condenser 20 can be dissipated to the refrigerant flow path 150 from both the connection parts 43, 45, 53, 55 and the non-connection parts 46, 56, the heat of the condenser 20 can be dissipated efficiently.

[0074] Second embodiment 9 is a cross-sectional view of a capacitor device 100 of the second embodiment. The non-connected parts 46, 56 of the second embodiment are leaf springs. The non-connected parts 46, 56 have a spring-like deformation property. The non-connected parts 46, 56 are bent and in contact with the case side walls 72, 74 while housed in the case 70. The non-connected parts 46, 56 are in close contact with the case side walls 72, 74. This allows the heat of the condenser 20 to be efficiently dissipated from the non-connected parts 46, 56 to the refrigerant flow path 150.

[0075] Third embodiment FIG. 10 is a cross-sectional view of a capacitor device 100 of a third embodiment. The capacitor device 100 may further include a heat dissipation member 160. The heat dissipation member 160 may be a heat conductive sheet, a grease-like thermal interface material, or the like. The heat dissipation member 160 is provided between the low potential side non-connection portion 56 and the first case wall portion 73. The heat dissipation member 160 is provided between the high potential side non-connection portion 46 and the third case wall portion 75. The heat dissipation member 160 provided on the first case wall portion 73 side is in contact with the first case wall portion 73. The heat dissipation member 160 provided on the third case wall portion 75 side is in contact with the third case wall portion 75. The low potential side non-connection portion 56 is in contact with the first case wall portion 73 via the heat dissipation member 160. The high potential side non-connection portion 46 is in contact with the third case wall portion 75 via the heat dissipation member 160. This allows heat from the condenser 20 to be efficiently dissipated from the non-connection parts 46, 56 to the refrigerant flow path 150. Note that the type of heat dissipation member 160 between the high potential side non-connection part 46 and the first case wall part 73 and the type of heat dissipation member 160 between the low potential side non-connection part 56 and the third case wall part 75 may be different.

[0076] (Fourth embodiment) Fig. 11 is a perspective view of a capacitor device 100 of the fourth embodiment. Fig. 12 is a cross-sectional view of the capacitor device 100 of the fourth embodiment. The low potential side bus bar 50 of the fourth embodiment has two low potential side non-connection portions 56. The high potential side bus bar 40 of the fourth embodiment does not have a high potential side non-connection portion 46. One of the two low potential side non-connection portions 56 is provided at an end portion of the first overlapping portion 41 on the first case wall portion 73 side. The other of the two low potential side non-connection portions 56 is provided at an end portion of the first overlapping portion 41 on the third case wall portion 75 side.

[0077] The low potential side non-connection portion 56 on the first case wall portion 73 side extends along the condenser 20. The low potential side non-connection portion 56 on the first case wall portion 73 side overlaps with the first wall portion side refrigerant flow path 151 and the condenser 20 in the width direction WD. The low potential side non-connection portion 56 on the third case wall portion 75 side overlaps with the third wall portion side refrigerant flow path 153 and the condenser 20 in the width direction WD. Heat of the condenser 20 is efficiently dissipated from the low potential side non-connection portion 56 on the first case wall portion 73 side and the low potential side non-connection portion 56 on the third case wall portion 75 side to the refrigerant flow paths 151, 153. This also provides the same effect as the first embodiment.

[0078] The high potential side busbar 40 may have two high potential side non-connection portions 46, and the low potential side busbar 50 may not have a low potential side non-connection portion 56. As the non-connection portions 46, 56, the capacitor device 100 may have only one high potential side non-connection portion 46, or only one low potential side non-connection portion 56.

[0079] Fifth embodiment 13 is a perspective view of a capacitor device 100 of a fifth embodiment. The capacitor 20 may be provided in the case 70 such that the first end surface 23 overlaps the second case wall portion 74 and the second end surface 24 overlaps the fourth case wall portion 76. Even in this case, the high potential side non-connection portion 46 and the low potential side non-connection portion 56 overlap the refrigerant flow path 150 in the width direction WD. For example, the high potential side non-connection portion 46 overlaps the first wall side refrigerant flow path 151 in the width direction WD. The low potential side non-connection portion 56 overlaps the third wall side refrigerant flow path 153 in the width direction WD. The first overlapping portion 41 overlaps the second wall side refrigerant flow path 152 in the depth direction DP. The second overlapping portion 51 overlaps the fourth wall side refrigerant flow path 154 in the depth direction DP. Heat from the condenser 20 is dissipated to the refrigerant flow path 150 from the first overlapping portion 41, the high potential side unconnected portion 46, the second overlapping portion 51, and the low potential side unconnected portion 56.

[0080] Sixth embodiment 14 is a plan view illustrating the refrigerant flow path 150 of the sixth embodiment. The refrigerant flow path 150 of the sixth embodiment has a first wall side refrigerant flow path 151, a second wall side refrigerant flow path 152, a third wall side refrigerant flow path 153, an outlet side refrigerant flow path 155, and an inlet side refrigerant flow path 156. The refrigerant flow path 150 extends along the first case wall 73, the first case wall 73 side of the second case wall 74, and the first case wall 73 side of the fourth case wall 76. The low potential side non-connection portion 56 overlaps the first wall side refrigerant flow path 151 in the width direction WD. This also provides the same effect as the first embodiment.

[0081] (Other variations) Alternatively, air may be used as the refrigerant. In this case, too, heat from the condenser 20 is dissipated to the air via the high potential side non-connection part 46 and the low potential side non-connection part 56. When air is used as the refrigerant, protrusions called fins or the like may be provided on the surfaces of the case side wall 72 and the cover side wall 82 that define the refrigerant flow path 150. This increases the contact area between the case side wall 72 and the cover side wall 82 and the air. Accordingly, heat from the condenser 20 is efficiently dissipated to the air.

[0082] Furthermore, when the case 70 is a resin case made of a resin member, it is also possible to mold the high potential side bus bar 40 and the low potential side bus bar 50 integrally with the case 70. The high potential side bus bar 40 and the low potential side bus bar 50 may be embedded in the case side wall 72. When the case 70 is a conductive case made of a conductive member such as die casting, it is also possible to form the refrigerant flow path 150 in the side wall 72 of the case 70. However, in this case, it is necessary to ensure insulation between the bus bars 40, 50 and the side wall 72. The distance between the bus bars 40, 50 and the side wall 72 needs to be large enough to ensure insulation between them. For this reason, it is difficult to bring the side wall 72 and the bus bars 40, 50 close to each other in the conductive case 70.

[0083] Although the present disclosure has been described based on the embodiment, it is understood that the present disclosure is not limited to the embodiment or structure. The present disclosure also encompasses various modifications and modifications within the equivalent range. In addition, although various combinations and forms are shown in the present disclosure, other combinations and forms including only one element, more than one, or less than one element are also within the scope and scope of the present disclosure. [Explanation of symbols]

[0084] 130 frame, 14 electric component, 14 power module, 140 frame cover, 151 refrigerant flow path, 151 case refrigerant flow path, 152 refrigerant flow path, 152 case refrigerant flow path, 153 refrigerant flow path, 153 case refrigerant flow path, 154 refrigerant flow path, 154 case refrigerant flow path, 155, 156 frame refrigerant flow path, 160 heat dissipation member, 2 electric component, 2 battery, 20 capacitor, 23 first end face, 24 second end face, 25 side face, 40 bus bar, 40 high potential side bus bar, 41 overlapping portion, 43 connection portion, 43 battery side connection portion, 45 connection portion, 45 power module side connection portion, 46 non-connection portion, 50 bus bar, 50 low potential side bus bar, 51 overlapping portion, 53 connection portion, 53 battery side connection portion, 55 connection portion, 55 power module side connection portion, 56 non-connection portion, 70 case, 78 storage space, 80 case cover, DP depth direction, TD thickness direction, WD width direction.

Claims

1. a capacitor (20) having electrodes on a first end surface (23) and a second end surface (24) separated in a thickness direction (TD) and connected to an electrical component (2, 14); A bus bar (40, 50) electrically connecting the electrode and the electrical component; A case (70) for housing the capacitor and the bus bar in an inner housing space (78); a case cover (80) that covers the case from the outside and forms, together with the case, a refrigerant flow path (151, 152, 153, 154) through which a refrigerant can flow; The bus bar is an overlapping portion (41, 51) overlapping the first end surface or the second end surface in the thickness direction and connected to the electrode; a connection portion (43, 45, 53, 55) connected to the overlapping portion and connected to the electrical component; a non-connected portion (46, 56) connected to the overlapping portion and not connected to the electrical component, A capacitor device in which the non-connected portion and at least a portion of the refrigerant flow path overlap in a planar direction perpendicular to the thickness direction.

2. the connection portion is connected to an end portion of the overlapping portion in a first arrangement direction (DP) in which the capacitor and the electrical component are arranged, the first arrangement direction being one of the planar directions; The non-connected portion is connected to an end portion of the overlapping portion in a second arrangement direction (WD) different from the first arrangement direction in the planar direction, The capacitor device according to claim 1 , wherein the non-connected portion and at least a portion of the refrigerant flow path overlap in the second arrangement direction.

3. The non-connected portion extends along a side surface (25) of the capacitor, The capacitor device according to claim 2 , wherein the non-connected portion further overlaps the capacitor in the second arrangement direction.

4. the connection portion includes a battery-side connection portion (43, 53) connected to one end of the overlapping portion in the first arrangement direction and connected to a battery (2), and a power module-side connection portion (45, 55) connected to the other end of the overlapping portion in the first arrangement direction and connected to a power module (14), the non-connected portion is provided at least one of one end and the other end of the overlapping portion in the second arrangement direction, The capacitor device according to claim 3 , wherein at least a portion of the refrigerant flow path overlaps in the second arrangement direction with the non-connected portion provided at least one of one end and the other end of the overlapping portion in the second arrangement direction.

5. The bus bar has a high potential side bus bar (40) connected to the first end surface and the electrical component, and a low potential side bus bar (50) connected to the second end surface and the electrical component, the battery side connection portion of the high potential side bus bar and the battery side connection portion of the low potential side bus bar overlap in the second arrangement direction at one end of the first arrangement direction, the power module side connection portion of the high potential side bus bar and the power module side connection portion of the low potential side bus bar overlap in the second arrangement direction at the other end in the first arrangement direction, 5. The capacitor device according to claim 4, wherein the non-connected portion of the high potential side bus bar and the non-connected portion of the low potential side bus bar, or the non-connected portion of the high potential side bus bar, or the non-connected portion of the low potential side bus bar overlap at least a portion of the refrigerant flow path in the second arrangement direction.

6. The capacitor device according to claim 5 , wherein the non-connected portion and the case are in contact with each other, or a heat dissipation member (160) is provided between the non-connected portion and the case, and the heat dissipation member is in contact with the case.

7. a frame (130) connected to the case, extending in the planar direction, and on which the power module is mounted; A frame cover (140) is connected to the case cover and extends in the planar direction so as to overlap the frame in the thickness direction, The frame cover and the frame form a frame refrigerant flow path (155, 156) that is connected to a case refrigerant flow path (151, 152, 153, 154) that is the refrigerant flow path, The capacitor device according to claim 6 , wherein the power module overlaps at least a portion of the frame coolant flow path in the thickness direction.

8. 8. The condenser device according to claim 1, wherein the refrigerant flow path extends so as to surround the condenser.

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