Laser processing device and method for cutting adhesive film

Abstract

To provide a laser processing device capable of easily determining whether or not an adhesive film is normally cut along a nonlinear part included in a plurality of chips.SOLUTION: After a laser beam is radiated on an adhesive film so as to trace three or more scheduled division coordinates each indicating a location included in a nonlinear part at a boundary of a plurality of chips, a combined image including all locations indicated by the respective three or more scheduled division coordinates is formed. Then, by comparing the nonlinear part and a cut trace of the adhesive film shown in the combined image, it is determined whether or not the adhesive film is normally cut.SELECTED DRAWING: Figure 3

Description

[Technical field]

[0001] The present invention relates to a laser processing apparatus and a method for cutting an adhesive film, the adhesive film being attached on one side to a plurality of chips whose boundaries include non-linear portions that do not extend linearly, along the non-linear portions. [Background technology]

[0002] Device chips such as ICs (Integrated Circuits) are essential components in various electronic devices such as mobile phones and personal computers. These chips are manufactured, for example, by dividing a wafer, on the front side of which a plurality of devices arranged in a matrix pattern are provided, into a lattice pattern along the boundaries between the plurality of devices.

[0003] A known method for manufacturing chips is, for example, to form grooves on the front side of a wafer and then grind the back side of the wafer. Specifically, in this method, the wafer is first cut along the boundaries of multiple devices so that grooves extending in a grid pattern are formed on the front side of the wafer.

[0004] Next, a protective member, also called a back grind (BG) tape, is attached to the front side of the wafer to prevent damage to the device when the back side of the wafer is ground. Next, while holding the front side of the wafer, the back side of the wafer is ground until the wafer is divided at the grooves. As a result, multiple chips, each of which has a rectangular parallelepiped shape, are produced.

[0005] A rectangular adhesive film, also called a die attach film (DAF), which is generally used when fixing each chip to a predetermined structure, is provided on the back surface of each of the multiple chips (see, for example, Patent Document 1). This rectangular adhesive film is generally provided by attaching one adhesive film to the back surface sides of all of the multiple chips, peeling off the protective member from the front surface side, and then removing the portion of the adhesive film that overlaps the boundary between the multiple chips.

[0006] Furthermore, such partial removal of the adhesive film is performed, for example, in a laser processing device that includes a chuck table, a laser irradiation unit for irradiating a laser beam capable of cutting the adhesive film, and a movement mechanism for moving the chuck table and the laser irradiation unit relative to one another.

[0007] When the adhesive film is partially removed in this laser processing device, first, multiple chips are held by the chuck table via the adhesive film. Then, while a laser irradiation unit irradiates a laser beam onto the adhesive film from the front side of each chip, a moving mechanism moves the chuck table and the laser irradiation unit relatively so that the trajectory of the irradiated laser beam follows the boundaries of the multiple chips.

[0008] However, when multiple chips are manufactured as described above, the arrangement of the multiple chips may become disrupted due to the release of internal stress in the wafer and protective member and / or the fact that grinding continues for a certain amount of time even after the wafer is divided at the grooves, etc. In this case, the boundaries between the multiple chips may not form a strict lattice pattern, and the boundaries between the multiple chips may include non-linear portions that do not extend linearly.

[0009] Even if the nonlinear portion is included in the boundaries of the multiple chips, if the above-mentioned adhesive film is irradiated with a laser beam so as to trace a lattice-like locus, at least one of the multiple chips may be damaged. In light of this, it has been proposed to grasp the boundaries of the multiple chips prior to irradiating the adhesive film with a laser beam (for example, see Patent Document 2). [Prior art documents] [Patent documents]

[0010] [Patent Document 1] JP 2002-118081 A [Patent Document 2] JP 2006-278784 A Summary of the Invention [Problem to be solved by the invention]

[0011] The above-mentioned laser beam irradiation is generally performed in a state where the processing feed speed of the laser processing device, i.e., the relative moving speed between the chuck table and the laser irradiation unit, is set to a relatively high speed. Therefore, even if the boundaries of the multiple chips including the non-linear parts are known in advance, the laser beam may be irradiated onto the adhesive film along a trajectory that is deviated from the boundaries of the multiple chips.

[0012] Therefore, after the laser beam is irradiated onto the adhesive film in this manner, it is necessary to judge whether the adhesive film is properly cut, specifically, whether the trajectory of the laser beam is accurately along the boundaries of the plurality of chips. However, if the entire trajectory of the laser beam is checked to make this judgment, it is very laborious and takes a long time.

[0013] In view of this, an object of the present invention is to provide a laser processing apparatus and a method for cutting an adhesive film that can easily determine whether an adhesive film has been cut normally along non-linear portions contained in multiple chips. [Means for solving the problem]

[0014] According to one aspect of the present invention, there is provided a laser processing apparatus for cutting an adhesive film, one side of which is affixed to a plurality of chips including a non-linear portion at a boundary thereof that does not extend linearly, along the non-linear portion, the apparatus comprising: a chuck table for holding the other side of the adhesive film; a laser beam irradiation unit for irradiating a laser beam capable of cutting the adhesive film; an imaging unit for imaging the adhesive film to form an image; a movement mechanism for relatively moving the chuck table, the laser beam irradiation unit, and the imaging unit; a display for displaying information relating to the adhesive film; and a controller for controlling the laser beam irradiation unit, the imaging unit, the movement mechanism, and the display, the controller imaging the entire area or a plurality of different areas of the non-linear portion before the adhesive film is cut along the non-linear portion, and forming one or more events. a laser processing apparatus including a pre-imaging section that controls the imaging unit and the moving mechanism to form a pre-image; an identification section that identifies three or more planned division coordinates each indicating a location included in the non-linear portion based on the one or more pre-images; an irradiation section that controls the laser beam irradiation unit and the moving mechanism to irradiate the adhesive film with the laser beam so as to trace the three or more planned division coordinates; a post-imaging section that controls the imaging unit and the moving mechanism to image a plurality of different areas of the non-linear portion after the adhesive film has been cut along the non-linear portion and form three or more post-imaging images each including a location indicated by any of the three or more planned division coordinates; a combination section that forms a combined image including all of the locations indicated by each of the three or more planned division coordinates based on the three or more post-imaging images; and a display section that controls the display to display the combined image.

[0015] Preferably, the controller further includes a judgment unit which compares the cut mark of the adhesive film shown in the combined image with the non-linear portion to judge whether the adhesive film has been cut normally, and the display unit controls the display to display information for informing of the judgment result by the judgment unit together with the combined image.

[0016] According to another aspect of the present invention, there is provided a method for cutting an adhesive film, one side of which is attached to a plurality of chips including a non-linear portion at a boundary thereof that does not extend linearly, along the non-linear portion, the method including a pre-imaging step of imaging the entire area of ​​the non-linear portion or a plurality of different areas of the non-linear portion to form one or more pre-images, a specifying step after the pre-imaging step of identifying three or more planned division coordinates each indicating a location included in the non-linear portion based on the one or more pre-images, and a laser beam capable of cutting the adhesive film after the specifying step of irradiating the adhesive film so as to trace the three or more planned division coordinates. The present invention provides a method for cutting an adhesive film, the method comprising: an irradiation step; a post-imaging step, after the irradiation step, of imaging a plurality of different regions of the non-linear portion to form three or more post-imaging images, each of which includes a location indicated by any of the three or more planned division coordinates; a combining step, after the post-imaging step, of forming a combined image based on the three or more post-imaging images, the combined image including all of the locations indicated by each of the three or more planned division coordinates; and a determination step, after the combining step, of comparing the cut marks on the adhesive film shown in the combined image with the non-linear portion to determine whether the adhesive film has been cut normally.

[0017] Preferably, in the combining step, the combined image is formed by extracting a portion from each of the three or more post images to form three or more extracted post images and then combining the three or more extracted post images. Effect of the Invention

[0018] In the present invention, after irradiating the adhesive film with a laser beam so as to trace three or more planned division coordinates each indicating a location included in a non-linear portion of the boundary between a plurality of chips, a combined image is formed that includes all of the locations indicated by the three or more planned division coordinates. In this case, by comparing the cut marks on the adhesive film shown in this combined image with the non-linear portion, it is possible to easily determine whether the adhesive film has been cut normally or not. [Brief description of the drawings]

[0019] [Figure 1] FIG. 1(A) is an oblique view showing a schematic example of a frame unit having an adhesive film and a number of chips attached to one side of the adhesive film, and FIG. 1(B) is a plan view showing a schematic example of a non-linear portion included in the boundary between the multiple chips. [Diagram 2] FIG. 2 is a perspective view that illustrates a schematic example of a laser processing device for cutting an adhesive film along a non-linear portion. [Diagram 3] FIG. 3 is a block diagram illustrating an example of a controller for controlling the components of the laser processing apparatus. [Figure 4] FIG. 4 is a flowchart illustrating an example of a method for cutting an adhesive film in a laser processing device, the method being for cutting an adhesive film attached on its front side to multiple chips whose boundaries include non-linear portions along the non-linear portions. [Diagram 5] Figure 5(A) is a plan view showing a schematic example of an area imaged in the pre-imaging step, Figure 5(B) is a plan view showing a schematic example of three or more planned division coordinates identified in the identification step, and Figure 5(C) is a plan view showing a schematic example of a cut mark in the adhesive film formed in the irradiation step. [Figure 6] FIG. 6(A) is a plan view that shows a schematic example of an area imaged in the post-imaging step, and FIG. 6(B) is a diagram that shows a schematic example of a combined image formed in the combining step. [Figure 7] FIG. 7 is a diagram illustrating another example of the combined image formed in the combining step. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0020] The embodiments of the present invention will be described with reference to the accompanying drawings. Fig. 1(A) is a perspective view showing a frame unit including an adhesive film and a plurality of chips attached to one side of the adhesive film. The frame unit 1 shown in Fig. 1 includes an annular frame 3 made of a metal material such as aluminum and having a cylindrical opening 3a formed in its central region.

[0021] A peripheral area on the front surface side of a disk-shaped dicing tape 5 having a diameter larger than that of the opening 3a is attached to the rear surface side of the frame 3. The dicing tape 5 has, for example, a flexible film-like base layer and an adhesive layer (glue layer) provided on the front surface (the surface on the frame 3 side) of the base layer.

[0022] Specifically, the base layer is made of polyolefin (PO), polypropylene (PP), polyethylene terephthalate (PET), polyvinyl chloride (PVC), polystyrene (PS), etc. The adhesive layer is made of ultraviolet-curable silicone rubber, acrylic material, epoxy material, etc.

[0023] A disk-shaped adhesive film (DAF) 7 having a diameter smaller than that of the opening 3a is attached to the back side (other side) of the dicing tape 5 in the central region on the front side of the dicing tape 5. The adhesive film 7 is made of, for example, epoxy resin. A plurality of chips 9 are attached to the front side (one side) of the adhesive film 7.

[0024] The chips 9 are manufactured, for example, by forming a lattice-like groove on the front side of a wafer on which a matrix of devices is arranged, and then grinding the back side of the wafer until the wafer is divided at the groove. The boundaries of the chips 9 thus manufactured and then attached to the adhesive film 7 include nonlinear portions 11 that do not extend linearly.

[0025] 1(B) is a plan view showing a schematic diagram of a non-linear portion 11 included in the boundary between multiple chips 9. This non-linear portion 11 is located between ten chips 9a1-9a10 and ten chips 9b1-9b10. The end of chip 9a1 on the chip 9b1 side and the end of chip 9a10 on the chip 9b10 side roughly overlap with an imaginary straight line L1.

[0026] The end of chip 9b1 on the chip 9a1 side and the end of chip 9b10 on the chip 9a10 side roughly overlap with imaginary straight line L2 parallel to imaginary straight line L1. A part of nonlinear portion 11 (for example, a portion extending from between chips 9a1 and 9b1 to between chips 9a5 and 9b5) extends so as to be slightly inclined with respect to imaginary straight lines L1 and L2.

[0027] Fig. 2 is a perspective view showing a schematic example of a laser processing device for cutting the adhesive film 7 along the non-linear portion 11. Note that the X-axis direction and the Y-axis direction shown in Fig. 2 are directions perpendicular to each other on a horizontal plane, and the Z-axis direction is a direction (vertical direction) perpendicular to each of the X-axis direction and the Y-axis direction.

[0028] The laser processing device 2 shown in Fig. 2 includes a chuck table 4. The chuck table 4 has a diameter larger than the adhesive film 7 and smaller than the opening 3a of the frame 3, and includes a circular holding surface that is approximately parallel to a horizontal plane. Furthermore, the chuck table 4 is connected to a suction mechanism (not shown) and a rotation mechanism (not shown).

[0029] The suction mechanism includes, for example, an ejector. When the suction mechanism operates, a suction force acts on the space near the holding surface of the chuck table 4. Therefore, when the suction mechanism operates with the adhesive film 7 placed on the holding surface via the dicing tape 5, the frame unit 1 is held on the holding surface of the chuck table 4, specifically, the back side of the adhesive film 7 is held via the dicing tape 5.

[0030] The rotation mechanism includes, for example, a pulley and a motor. When the rotation mechanism operates, the chuck table 4 rotates about a straight line passing through the center of the holding surface along the Z-axis direction as a rotation axis. For example, in the laser processing device 2, after the frame unit 1 is held on the holding surface of the chuck table 4, the rotation mechanism rotates the chuck table 4 so that the imaginary straight lines L1 and L2 are approximately parallel to the X-axis direction.

[0031] A head 8 of the laser beam irradiation unit 6 is provided above the chuck table 4. This head 8 is fixed to the tip of a cylindrical housing 10 extending along the Y-axis direction. The head 8 houses an optical system such as a condenser lens and a mirror, and the housing 10 houses an optical system such as a mirror and / or a lens.

[0032] The base end of the housing 10 is connected to a horizontal movement mechanism (not shown) and a vertical movement mechanism (not shown) for relatively moving the chuck table 4, the laser beam irradiation unit 6, and the imaging unit 12 described later.

[0033] Each of the horizontal movement mechanism and the vertical movement mechanism has, for example, a ball screw and a motor, etc. When the horizontal movement mechanism operates, the head 8 and the housing 10 move along the X-axis direction and / or the Y-axis direction, and when the vertical movement mechanism operates, the head 8 and the housing 10 move along the Z-axis direction.

[0034] The laser beam irradiation unit 6 also has a laser oscillator (not shown) that generates a laser beam capable of cutting the adhesive film 7, specifically, a laser beam with a wavelength that is absorbed by the adhesive film 7. This laser oscillator has, for example, Nd:YAG or the like as a laser medium. When the laser beam is generated by the laser oscillator, the laser beam is emitted directly below the center of the head 8 via the housing 10 and an optical system contained in the head 8.

[0035] Furthermore, an imaging unit 12 for capturing an image of the adhesive film 7 or the like is provided on the side of the housing 10. The imaging unit 12 has, for example, a light source such as an LED (Light Emitting Diode), an objective lens, and an imaging element such as a CCD (Charge Coupled Device) image sensor or a CMOS (Complementary Metal Oxide Semiconductor) image sensor.

[0036] Further, the laser processing device 2 is provided with a cover (not shown) so as to cover the chuck table 4 and the laser beam irradiation unit 6. A display 14 for displaying information about the adhesive film 7 is disposed on the front surface of the cover. The display 14 is, for example, a liquid crystal display or an organic EL (Electro Luminescence) display.

[0037] The display 14 may be replaced with a touch panel that functions as a user interface. The touch panel includes, for example, the display 14 and an input unit such as a capacitive or resistive touch sensor.

[0038] Furthermore, the laser processing device 2 has a built-in controller for controlling the above-mentioned components. Fig. 3 is a block diagram showing a schematic example of this controller. The controller 16 shown in Fig. 3 has a processor 18 and a memory 20.

[0039] The processor 18 is configured, for example, by a CPU (Central Processing Unit) etc. The memory 20 is configured, for example, by a volatile memory such as a DRAM (Dynamic Random Access Memory) or an SRAM (Static Random Access Memory) and a non-volatile memory such as an SSD (Solid State Drive) (NAND type flash memory) or an HDD (Hard Disk Drive) (magnetic storage device).

[0040] The memory 20 stores data, programs, and the like used in the processor 18. Examples of this data include the irradiation conditions of the laser beam when cutting the adhesive film 7. Examples of this program include a program for implementing a method for cutting an adhesive film, for cutting the adhesive film 7, the front side of which is attached to a plurality of chips 9 including non-linear portions 11 at the boundary between the chips 9, along the non-linear portions 11.

[0041] Moreover, the processor 18 controls the components of the laser processing device 2 so as to read and execute a program for carrying out the adhesive film cutting method stored in the memory 20. The processor 18 has a pre-imaging unit 18a, a specifying unit 18b, an irradiating unit 18c, a post-imaging unit 18d, a joining unit 18e, a determining unit 18f, and a display unit 18g.

[0042] The pre-imaging unit 18a controls the imaging unit 12 and the horizontal movement mechanism and vertical movement mechanism connected to the housing 10 to image the entire area or multiple different areas of the non-linear portion 11 before the adhesive film 7 is cut along the non-linear portion 11 to form one or multiple pre-images.

[0043] The specifying unit 18b specifies three or more planned division coordinates, each of which indicates a location included in the non-linear portion 11, based on the one or more preliminary images. The irradiating unit 18c controls the laser beam irradiating unit 6 and the horizontal movement mechanism and the vertical movement mechanism connected to the housing 10, in order to irradiate the adhesive film 7 with the laser beam LB so as to trace the three or more planned division coordinates.

[0044] The post-imaging unit 18d controls the imaging unit 12 and the horizontal movement mechanism and vertical movement mechanism connected to the housing 10 to image different areas of the non-linear portion 11 after the adhesive film 7 is cut along the non-linear portion 11 and form three or more post-imaging images, each of which includes a location indicated by any of the three or more planned division coordinates.

[0045] The combining unit 18e forms a combined image including the locations indicated by all of the three or more planned division coordinates based on the three or more posterior images. The determining unit 18f compares the cut marks on the adhesive film 7 shown in the combined image with the non-linear portion 11 to determine whether the adhesive film 7 has been cut normally. The display unit 18g controls the display 14 to display the combined image.

[0046] FIG. 4 is a flowchart showing a schematic example of a method for cutting an adhesive film in a laser processing device 2, in which an adhesive film 7 having a front side attached to a plurality of chips 9, the front side of which includes non-linear portions 11 at their boundaries, is cut along the non-linear portions 11.

[0047] In this method, first, a plurality of different regions of the non-linear portion 11 are imaged to form a plurality of preliminary images (pre-imaging step S1). Fig. 5(A) is a plan view showing an example of a region imaged in the pre-imaging step S1.

[0048] In this pre-imaging step S1, first, the pre-imaging unit 18a controls the horizontal movement mechanism connected to the housing 10 so that the area R1 centered between the chips 9a1 and 9b1 overlaps in the vertical direction with the range that can be imaged by the imaging unit 12.

[0049] Next, the pre-imaging unit 18a controls the vertical movement mechanism connected to the housing 10 so that the focal point of imaging by the imaging unit 12 is positioned at approximately the same height as the upper surface of each chip 9. Next, the pre-imaging unit 18a controls the imaging unit 12 so as to image the region R1 and form an image (pre-image).

[0050] Furthermore, the pre-imaging section 18a controls the horizontal movement mechanism connected to the imaging unit 12 and the housing 10 so as to capture images of an area R2 centered between the chips 9a4 and 9b4, an area R3 centered between the chips 9a7 and 9b7, and an area R4 centered between the chips 9a10 and 9b10 to form three pre-images. This forms four pre-images and completes the pre-imaging step S1.

[0051] After the preliminary imaging step S1, three or more planned division coordinates each indicating a location included in the non-linear portion 11 are identified based on the multiple preliminary images (identification step S2). Fig. 5(B) is a plan view showing an example of three or more planned division coordinates identified in the identification step S2.

[0052] In this identification step S2, the identification unit 18b identifies the coordinates (e.g., (X1, Y1)) in a plane (XY plane) parallel to each of the X-axis and Y-axis directions of a point located at the center of a pair of adjacent chips 9 (e.g., chip 9a1 and chip 9b1) in the Y-axis direction as the planned division coordinates.

[0053] The X coordinate of the point located at the center of a pair of adjacent chips 9 in the Y-axis direction is equal to the X coordinate of the center of each of the pair of chips 9 in the X-axis direction, and the Y coordinate is located midway in the Y-axis direction of the pair of chips 9. Therefore, the planned division coordinates can be specified by referring to the pair of chips 9 included in each preliminary image. As a result, three or more (four in this case) planned division coordinates (X1, Y1), (X2, Y2), (X3, Y3), and (X4, Y4) are formed, and the specification step S2 is completed.

[0054] After the determination step S2, the adhesive film 7 is irradiated with a laser beam so as to trace three or more planned division coordinates (X1, Y1), (X2, Y2), (X3, Y3), and (X4, Y4) (irradiation step S3). Fig. 5(C) is a plan view showing a schematic example of a cut mark on the adhesive film 7 formed in the irradiation step S3.

[0055] In this irradiation step S3, first, the irradiation unit 18c controls the horizontal movement mechanism connected to the housing 10 so that the center of the head 8 is positioned outside the adhesive film 7 in a plan view and the planned division coordinates (X1, Y1) are positioned in the X-axis direction when viewed from the center. Next, the irradiation unit 18c controls the vertical movement mechanism connected to the housing 10 so that the focal point of the laser beam emitted from the head 8 is positioned at a height corresponding to the adhesive film 7.

[0056] Next, the irradiation unit 18c controls the laser beam irradiation unit 6 so that a laser beam is emitted from the head 8, while the irradiation unit 18c controls the horizontal movement mechanism connected to the housing 10 so as to move the head 8 in the X-axis direction until the center of the head 8 is positioned directly above the planned division coordinates (X1, Y1).

[0057] Next, while keeping the laser beam emitted from head 8, the horizontal movement mechanism connected to housing 10 is controlled so that head 8 is moved in a zigzag line until the center of head 8 is positioned directly above the planned division coordinates (X2, Y2), directly above the planned division coordinates (X3, Y3), and at the planned division coordinates (X4, Y4) in that order.

[0058] Next, the irradiation unit 18c controls the horizontal movement mechanism connected to the housing 10 so as to move the head 8 in the X-axis direction while keeping the laser beam emitted from the head 8 until the center of the head 8 is positioned outside the adhesive film 7 in a plan view. As a result, the portion of the adhesive film 7 irradiated with the laser beam is removed, that is, the cut mark 13 is formed in the adhesive film 7, and the irradiation step S3 is completed.

[0059] After the irradiation step S3, a plurality of different regions of the non-linear portion 11 are imaged to form three or more post-imaging images, each of which includes a location indicated by one of the three or more planned division coordinates (post-imaging step S4). Fig. 6(A) is a plan view showing an example of a region imaged in the post-imaging step S4.

[0060] In this post-imaging step S4, first, the post-imaging unit 18d controls the horizontal movement mechanism connected to the housing 10 so that the area R1' centered between the chips 9a1 and 9b1 overlaps in the vertical direction with the range that can be imaged by the imaging unit 12.

[0061] Next, the post-imaging unit 18d controls the vertical movement mechanism connected to the housing 10 so that the focal point of the imaging by the imaging unit 12 is positioned at approximately the same height as the upper surface of the adhesive film 7. Next, the post-imaging unit 18d controls the imaging unit 12 so that the imaging unit 12 captures an image of the region R1' to form an image (post-imaging image).

[0062] Furthermore, the post-imaging section 18d controls the horizontal movement mechanism connected to the imaging unit 12 and the housing 10 so as to capture images of an area R2' centered between the chips 9a4 and 9b4, an area R3' centered between the chips 9a7 and 9b7, and an area R4' centered between the chips 9a10 and 9b10 to form three post-imaging images. This forms four post-imaging images and completes the post-imaging step S4.

[0063] After the post-imaging step S4, a combined image including the locations indicated by all of the three or more planned division coordinates (X1, Y1), (X2, Y2), (X3, Y3), and (X4, Y4) is formed based on the three or more post-imaging images (combining step S5). Fig. 6(B) is a schematic diagram showing an example of the combined image formed in the combining step S5.

[0064] In this combining step S5, the combining unit 18e forms a combined image I in which the four regions R1', R2', R3', and R4' are continuously displayed based on the four posterior images. This forms a combined image I that includes the locations indicated by all of the four planned division coordinates (X1, Y1), (X2, Y2), (X3, Y3), and (X4, Y4), completing the combining step S5.

[0065] After the joining step S5, the cut mark 13 of the adhesive film 7 shown in the joined image I is compared with the non-linear portion 11 to determine whether the adhesive film 7 has been cut normally (determination step S6).

[0066] In this determination step S6, for example, if the shortest distance between the cut mark 13 and each chip (e.g., chip 9a4) 9 is k (k is 0.1, preferably 0.15, more preferably 0.20) times or more the distance between a pair of adjacent chips (e.g., chip 9a4 and chip 9b4) 9 in the Y-axis direction, the determination unit 18f determines that the adhesive film 7 has been normally cut. The value of k is stored in the memory 20 in advance.

[0067] Furthermore, once the judgment by the judgment unit 18f is completed, the display unit 18g may control the display 14 to display information for notifying the judgment result by the judgment unit 18f (e.g., text indicating the judgment result) together with the combined image I in order to notify the operator of the laser processing device 2 of the judgment result.

[0068] In the laser processing device 2, the adhesive film 7 is irradiated with a laser beam so as to trace three or more planned division coordinates (X1, Y1), (X2, Y2), (X3, Y3), and (X4, Y4) each of which indicates a location included in the non-linear portion 11 of the boundary between a plurality of chips 9, and then a combined image I is formed which includes all of the locations indicated by the three or more planned division coordinates (X1, Y1), (X2, Y2), (X3, Y3), and (X4, Y4). In this case, by comparing the cut marks 13 of the adhesive film 7 shown in this combined image I with the non-linear portion 11, it is possible to easily determine whether the adhesive film 7 has been cut normally or not.

[0069] The above-mentioned content is one aspect of the present invention, and the present invention is not limited to the above-mentioned content. For example, in the laser processing device 2, the processor 18 does not need to be provided with the determination unit 18f. In this case, after the combining step S5, the display unit 18g controls the display 14 to display the combined image I.

[0070] Then, in a judgment step S6, an operator of the laser processing device 2 compares the cut mark 13 of the adhesive film 7 shown in the combined image I displayed on the display 14 with the non-linear portion 11 to judge whether the adhesive film 7 has been cut normally.

[0071] Also, in the preliminary imaging step S1, one preliminary image may be formed by imaging the entire area of ​​the non-linear portion 11. In this case, in the identification step S2, three or more planned division coordinates each indicating a location included in the non-linear portion 11 are identified based on the one preliminary image.

[0072] Alternatively, in the combining step S5, the combined image may be formed by extracting a portion from each of the three or more post images to form three or more extracted post images, and then combining the three or more extracted post images. Figure 7 is a schematic diagram showing an example of a combined image thus formed.

[0073] When the combining step S5 is performed in this manner, for example, the parts of the four post-images that are located toward the center in the X-axis direction are extracted, and then a combined image I' is formed in which the four extracted parts are continuously displayed. In this case, even if the number of planned division coordinates becomes very large, it is possible to display on the display 14 a combined image I' that includes all of the locations indicated by the planned division coordinates.

[0074] In addition, the structures and methods according to the above-described embodiments can be modified as appropriate without departing from the scope of the present invention. [Explanation of symbols]

[0075] 1: Frame unit 2: Laser processing equipment 3: Frame (3a: opening) 4: Chuck table 5: Dicing tape 6: Laser beam irradiation unit 7: Adhesive film 8: Head 9: Chip (9a1~9a10,9b1~9b10: Chip) 10: Housing 11: Non-linear part 12: Imaging unit 13: Cutting marks 14: Display 16: Controller 18: Processor (18a: pre-imaging unit, 18b: identification unit, 18c: irradiation unit) (18d: post-imaging unit, 18e: coupling unit, 18f: judgment unit, 18g: display unit) 20: Memory

Claims

1. A laser processing device for cutting an adhesive film attached on one side to a plurality of chips, the chips including a non-linear portion at the boundary between the chips, along the non-linear portion, the laser processing device comprising: a chuck table for holding the other surface of the adhesive film; a laser beam irradiation unit for irradiating the adhesive film with a laser beam capable of cutting the adhesive film; an imaging unit for imaging the adhesive film to form an image; a moving mechanism for relatively moving the chuck table, the laser beam irradiation unit, and the imaging unit; a display for displaying information about the adhesive film; a controller for controlling the laser beam irradiation unit, the imaging unit, the moving mechanism and the display; The controller a pre-imaging unit that controls the imaging unit and the moving mechanism to image the entire area or a plurality of different areas of the non-linear portion before the adhesive film is cut along the non-linear portion to form one or a plurality of pre-imaging images; an identification unit that identifies three or more planned division coordinates each indicating a location included in the non-linear portion based on the one or more preliminary images; an irradiation unit that controls the laser beam irradiation unit and the moving mechanism to irradiate the adhesive film with the laser beam so as to trace the three or more planned division coordinates; a post-imaging unit that controls the imaging unit and the moving mechanism to image a plurality of different regions of the non-linear portion after the adhesive film is cut along the non-linear portion and form three or more post-imaging images, each of which includes a location indicated by any of the three or more planned division coordinates; a combining unit that forms a combined image including all of the locations indicated by the three or more planned division coordinates based on the three or more posterior images; and a display unit that controls the display to display the combined image.

2. The controller further includes a determination unit that compares the cut mark of the adhesive film shown in the combined image with the non-linear portion to determine whether the adhesive film is normally cut or not; 2. The laser processing apparatus according to claim 1, wherein the display unit controls the display to display information for notifying a result of the determination by the determination unit together with the combined image.

3. A method for cutting an adhesive film, the adhesive film being attached on one side to a plurality of chips, the boundaries of which include non-linear portions that do not extend linearly, along the non-linear portions, the method comprising the steps of: a pre-imaging step of imaging the entire area or a plurality of different areas of the non-linear portion to form one or a plurality of pre-imaging images; a step of identifying three or more planned division coordinates each indicating a location included in the non-linear portion based on the one or more preliminary images after the preliminary imaging step; After the identifying step, an irradiation step of irradiating the adhesive film with a laser beam capable of cutting the adhesive film so as to trace the three or more planned division coordinates; a post-imaging step of imaging a plurality of mutually different regions of the non-linear portion after the irradiation step to form three or more post-imaging images each including a location indicated by any of the three or more planned division coordinates; a combining step of forming a combined image including all of the locations indicated by the three or more planned division coordinates based on the three or more post-imaging step after the post-imaging step; a determining step of determining whether the adhesive film has been normally cut by comparing the cut mark of the adhesive film shown in the combined image with the non-linear portion after the combining step; A method for cutting an adhesive film comprising the steps of:

4. The method for cutting an adhesive film as described in claim 3, wherein in the combining step, the combined image is formed by extracting a portion from each of the three or more post images to form three or more extracted post images, and then combining the three or more extracted post images.

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