Di metal transaction device and manufacturing method thereof

Abstract

To provide a transaction device and a method for manufacturing the transaction device.SOLUTION: A transaction device includes: a metal layer 950 including one or more discontinuities 924 constituting a gap extending from the front surface to the back surface and defining a path from a device peripheral part to an opening 912; a transponder chip module 910 arranged in the opening 912; a booster antenna 942 in communication with the transponder chip module 910; and a reinforcement layer 982 arranged over the whole of the metal layer 950.SELECTED DRAWING: Figure 9C

Description

[Technical field]

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS This application claims priority to U.S. Provisional Patent Application No. 62 / 971,439, filed February 7, 2020, entitled "DI Metal Transaction Device and Method of Manufacturing Thereof," which is incorporated herein by reference.

[0002] The present invention relates to transaction cards with electronic components and methods for their production. [Background technology]

[0003] Metal payment cards present unique challenges when they contain electronic components such as inductively coupled payment modules, RF electronics, and stand-alone electronic inlays. To accommodate these components, the metal is machined into various geometries, which are then placed into cavities and left exposed or hidden under printed sheets of plastic or other decorative elements. The decorative elements may be affixed to the card through a variety of processes, such as platen lamination, contact adhesives, curable adhesives, or "press-fit" or any bonding method known to the art. RF shielding is often required within the cavities, further complicating card assembly while maintaining the desired aesthetics of the card.

[0004] Some of these required machining geometries remove significant amounts of metal or leave slits or holes through the card, which reduce the card's strength and are aesthetically undesirable. In order to strengthen the card and provide a desirable surface, overmolding and insert molding techniques have been developed to encapsulate electronic inlays within the card and strengthen the card geometry. Additionally, this development has improved RF performance over existing designs, as it allows for the removal of more metal within the critical RF transmit and receive areas while maintaining structural rigidity and a desirable appearance. Summary of the Invention

[0005] Aspects of the invention relate to transaction devices, methods of manufacturing transaction devices, and transaction devices produced by the disclosed methods.

[0006] One aspect of the invention is a transaction device that includes a metal layer having a front surface, a back surface, a periphery, an opening in the metal layer, a transponder chip module disposed in the opening, and a booster antenna in communication with the transponder chip module. The transponder chip module and the booster antenna are components in a circuit configured for wireless communication with a device reader. The metal layer has one or more discontinuities, each discontinuity constituting a gap in the metal layer extending from the front surface to the back surface, including at least one discontinuity defining a passageway from the device periphery to the opening. The metal layer is not part of the booster antenna or a component in the circuit.

[0007] A non-metallic molding material may be disposed within one or more discontinuities in the metal layer. In some embodiments, a reinforcing layer, such as a layer including fiberglass, more particularly a fiber reinforced epoxy laminate material, is disposed over the metal layer. A fiber reinforced epoxy laminate material layer may be disposed on at least one of the front and back surfaces of the metal layer, and in some embodiments, the metal layer is sandwiched between opposing layers of fiber reinforced epoxy laminate material.

[0008] Another aspect of the invention includes a transaction device having a metal layer having one or more discontinuities therein, a first non-metallic reinforcing layer disposed over a front surface of the metal layer, a booster antenna disposed over a back surface of the metal layer, a second non-metallic reinforcing layer disposed over a back surface of the metal layer, an opening in the metal layer extending through the first non-metallic reinforcing layer, and a transponder chip module disposed in the opening. The booster antenna includes a plurality of metallizations electrically insulated from the metal layer. The transponder chip module is in communication with the booster antenna and together with the booster antenna constitutes a payment circuit configured for wireless communication with a device reader. The first non-metallic layer and the second non-metallic layer may each include a fiber reinforced epoxy laminate material.

[0009] The one or more discontinuities may include a discontinuity extending from the periphery to an opening in the metal layer, a discontinuity extending from the periphery to an end point that is not within an opening in the metal layer, a discontinuity extending from an intersection with the first discontinuity to an end point that is not within an opening or at the periphery, or a combination thereof. The metal layer may be electrically isolated from the payment circuit or may be part of the payment circuit.

[0010] Another aspect of the invention includes a transaction device including a metal layer, an opening in the metal layer extending from the metal layer to a top surface of the device, one or more discontinuities in the metal layer, a backside fiber reinforced epoxy laminate material layer disposed across a backside surface of the metal layer, a booster antenna, and a transponder chip module disposed in the opening and having a top surface accessible from the top surface of the device. At least one discontinuity extends between a periphery of the metal layer and the opening in the metal layer. The transponder chip module in communication with the booster antenna together constitutes a payment circuit configured for wireless communication with a device reader. The booster antenna may include the metal layer or may be separate from the metal layer, the metal layer being electrically insulated from the payment circuit. A topside fiber reinforced epoxy laminate material layer may be disposed across a top side of the metal layer. The topside and / or bottomside fiber reinforced epoxy laminate material layers may each be directly bonded to the metal layer by the epoxy of the respective fiber reinforced epoxy laminate material layer. In embodiments in which the metal layer is electrically isolated from the payment circuitry and the booster antenna, the booster antenna may include a plurality of metallizations embedded on or within the rear fiber reinforced epoxy laminate material layer. In embodiments in which the plurality of metallizations are disposed on the rear surface of the rear fiber reinforced epoxy laminate material layer, the device may include a non-metallic layer disposed over the plurality of metallizations. Each fiber reinforced epoxy laminate material layer may be disposed over the front and rear sides of the metal layer as a separate layer secured to the metal layer by a non-epoxy adhesive of the respective fiber reinforced epoxy laminate material layer. In some embodiments, at least a portion of the plurality of booster antenna metallizations may be disposed on the front surface of the rear fiber reinforced epoxy laminate material layer and separated from the metal layer by a non-metallic layer disposed between the fiber reinforced epoxy laminate material layer and the metal layer.

[0011] Another aspect of the invention includes a method of manufacturing a transaction device as described herein. Such method includes the steps of providing a metal layer, forming one or more discontinuities in the metal layer, disposing a booster antenna over a back surface of the metal layer, disposing a first fiberglass over a front surface of the metal layer, disposing a second fiberglass layer over the back surface of the metal layer, forming an opening in the metal layer that extends through the first fiberglass layer to a top surface of the device, and disposing a transponder chip module in the opening. The opening in the metal layer is created in the same step as the discontinuities in the metal layer.

[0012] The method can include disposing a booster antenna layer over a rear surface of the metal layer with the booster antenna metallization electrically isolated from the metal layer, and configuring the device with the metal layer not included in the payment circuit. Disposing the booster antenna over the rear surface of the metal layer can include forming a plurality of metallizations on or embedded within a second fiberglass layer, and optionally disposing an additional non-metallic layer over the metallizations.

[0013] In one method embodiment, disposing the first and second fiberglass layers over the front and back surfaces of the metal layer includes casting the first and second fiberglass layers with epoxy to form first and second fiber reinforced epoxy laminate material layers bonded directly to the metal layer.

[0014] In another method embodiment, disposing the first and second fiberglass layers over the front and back surfaces of the metal layer includes attaching a first cured fiber reinforced epoxy laminate material layer with a first adhesive layer to the front surface of the metal layer and attaching a second cured fiber reinforced epoxy laminate material layer with a second adhesive layer to the back surface of the metal layer. In an embodiment including forming a booster antenna over the back surface of the metal layer, a plurality of metallizations may be formed on or embedded within the second cured fiber reinforced epoxy laminate material layer. One such method includes disposing a metal layer over the second cured fiber reinforced epoxy laminate material layer and etching away a portion of the metal layer to leave the metallizations. In a method including forming a plurality of metallizations on an interior surface of the second cured fiber reinforced epoxy laminate material layer facing the metal layer, the second adhesive layer may include a non-metallic substrate layer. In a method including forming a plurality of metallizations on an exterior surface of a second cured fiber reinforced epoxy laminate material layer facing away from the metal layer, the method can include disposing a non-metallic layer over the exterior surface of the second cured fiber reinforced epoxy laminate material and the plurality of metallizations disposed thereon.

[0015] In another aspect of the invention, a method for manufacturing a transaction device includes providing a prefabricated laminate comprised of a metal layer, a first cured fiber reinforced epoxy laminate layer bonded to a front surface of the metal layer, and a second cured fiber reinforced epoxy laminate layer bonded to a back surface of the metal layer. One or more discontinuities are formed in the metal layer of the prefabricated laminate, each discontinuity defining a gap in the metal layer extending from the front surface to the back surface, with at least one discontinuity extending to a periphery of the metal layer. Each of the one or more discontinuities similarly extends through at least one of the first cured fiber reinforced epoxy laminate layer or the second cured fiber reinforced epoxy laminate layer. A booster antenna is disposed across an outer surface of one of the first cured fiber reinforced epoxy laminate layer or the second cured fiber reinforced epoxy laminate layer. An opening is formed in the metal layer extending through the first fiberglass layer to a top surface of the device, and a transponder chip module is disposed within the opening. A booster antenna can be formed by forming a plurality of metallizations on an outer surface or embedded within one of the first cured fiber reinforced epoxy laminate layer or the second cured fiber reinforced epoxy laminate layer. The method can further include disposing a non-metallic layer over the outer surface of each cured fiber reinforced epoxy laminate material and the plurality of metallizations disposed thereon. It should be understood that both the foregoing general description and the following detailed description are exemplary and not limiting of the present invention.

[0016] The invention is best understood when the following detailed description is read in conjunction with the accompanying drawings, in which like elements bear the same reference numerals. Where there is a plurality of similar elements, a single reference numeral may be assigned to the plurality of similar elements, with a lower case letter designation referring to the particular element. When referring to a plurality of elements collectively or to a non-specific one or more of the plurality of elements, the lower case letter designation may be dropped. This emphasizes that, according to common practice, the various features of the drawings are not drawn to scale unless otherwise indicated. Conversely, the dimensions of the various features may be expanded or reduced for clarity. Included in the drawings are the following figures: [Brief description of the drawings]

[0017] [Figure 1] FIG. 1 is a flow diagram of selected steps of a method for manufacturing a transaction card according to an embodiment of the present invention. [Figure 2A-2B] 2A and 2B are photographs showing an electronic component before and after overmolding according to an embodiment of the invention. [Figure 3A-3D] FIGURE 3A is a schematic illustration of a front side of a transaction card prior to insert molding, according to an embodiment of the present invention; FIGURE 3B is a schematic illustration of a back side of a transaction card prior to insert molding, according to an embodiment of the present invention; FIGURE 3C is a schematic illustration of a front side of a transaction card after insert molding, according to an embodiment of the present invention; and FIGURE 3D is a schematic illustration of a back side of a transaction card after insert molding, according to an embodiment of the present invention. [Figure 4A-4B] 4A and 4B are schematic illustrations of selected steps of an overmolding process for manufacturing a transaction card, according to an embodiment of the present invention. [Figure 5A-5C]Figure 5A is an image depicting the front side of an example card with an encapsulated antenna surrounding a payment module, Figure 5B is an image depicting the back side of the example card of Figure 5A, and Figure 5C is a perspective view of the insulated example encapsulated antenna prior to insertion of a payment module therein. [Figure 6A-6C] Fig. 6A is a schematic exemplary plan view of an exemplary contactless RFID device according to an embodiment of the present invention prior to encapsulation of a chip layer within an opening in a frame, Fig. 6B is a schematic exemplary view of the exemplary contactless RFID device of Fig. 6A in cross section through line 6B-6B after encapsulation of the chip layer, and Fig. 6C is a schematic exemplary end view of the exemplary contactless RFID device of Fig. 6B. [Figure 7A-7C] Fig. 7A is a schematic exemplary plan view of an exemplary contactless RFID device according to another embodiment of the present invention prior to encapsulation of a chip layer within an opening in a frame, Fig. 7B is a schematic exemplary view of the exemplary contactless RFID device of Fig. 7A in cross section through line 7B-7B after encapsulation of the chip layer, and Fig. 7C is a schematic exemplary end view of the exemplary contactless RFID device of Fig. 7B. [Figure 8A-8C] Figure 8A is a schematic exemplary plan view of an exemplary DI RFID device according to another embodiment of the present invention prior to encapsulation of a chip layer within an opening in a frame, Figure 8B is a schematic exemplary view of the exemplary DI RFID device of Figure 8A in cross section through line 8B-8B after encapsulation of the chip layer, and Figure 8C is a schematic exemplary end view of the exemplary DI RFID device of Figure 8B. [Figure 9A-9B] 9A and 9B are schematic plan view illustrations of a front side and a back side of an example transaction card including a plurality of discontinuities, respectively. [Figure 9C] FIG. 9C is a schematic cross-sectional illustration of the example transaction card of FIG. 9A. [Figure 9D] FIG. 9D is a schematic cross-sectional illustration of another exemplary transaction card formed from a prefabricated FR-4 / metal laminate. [Figure 9E]FIG. 9E is an illustration of a schematic cross-sectional view of a portion of a transaction card including separate FR-4 layers adhesively attached to metal layers with metallization disposed on the inner surface of one of the FR-4 layers. [Figure 9F] FIG. 9F is an illustration of a schematic cross-sectional view of a portion of a transaction card including FR-4 layers bonded directly to metal layers with metallization etched onto the exterior surface of one of the FR-4 layers, and an additional layer covering the metallization. [Figure 10] FIG. 10 illustrates an exemplary method for producing a transaction card. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0018] Aspects of the invention relate to transaction cards, methods of manufacturing transaction cards, and transaction cards produced by the disclosed methods.

[0019] 1 shows a flow diagram depicting selected steps of a method 100 for producing a transaction card according to an embodiment of the present invention. With respect to the methods described herein, it should be noted that it is understood that one or more steps may be omitted from the description herein and / or performed out of the order of the method as described and still obtain desirable results.

[0020] In step 110, an opening is formed in the card body of the transaction card. The opening may be sized to accommodate one or more molded electronic components. The opening may extend partially (thus forming, for example, a pocket) or completely (thus forming a hole) through the card body. In some embodiments, the hole formed through the card body may then be completely or partially covered on one side, for example with an applied material, for example an adhesively secured plastic material such as element 307c shown in FIG. 3D. As depicted in FIG. 3D, element 307c overlaps the area surrounding the hole to form a pocket bounded at its periphery by the edge of the hole in the card body and on its bottom end by the applied material 307c. The applied material may be the same or a compatible material as the molded material to be filled later into the pocket. In some embodiments, as shown in FIG. 3D , the applied material 307c overlapping the area surrounding the hole in the card body can have a through hole 308 having a smaller area than the hole in the card body so as to provide a “shelf” 309 of applied material inside the periphery of the hole in the card body.

[0021] The card bodies of the present invention may be constructed of any suitable material, including any suitable metal such as stainless steel, bronze, copper, titanium, tungsten carbide, nickel, palladium, silver, gold, platinum, aluminum, or any alloy that provides the card with the majority of its body (structure) and weight. Additionally or alternatively, the card bodies described herein may be constructed of any suitable polymeric material (e.g., polycarbonate, polyester) or inorganic material (e.g., glass, ceramic), or any combination of any of the foregoing materials.

[0022] In step 120, an electronic component is inserted into the opening in the card body.

[0023] The molding material is molded around the electronic component in step 130. It should be noted that the order of steps 120 and 130 can be varied depending on the particular application.

[0024] In one embodiment, step 130 includes an overmolding process. During an overmolding process, a molding material is molded around (and typically over) the electronic component in a manner that covers at least a portion of a surface of the electronic component. Overmolding of electronic components can be accomplished using conventional commercially available equipment, such as ENGLE inserts (Engel Austria GmbH, Austria) and CavistMoldMan™ (Reno, NV).

[0025] An electronic component 201 is shown before (in FIG. 2A) and after (in FIG. 2B) the overmolding process. Although the overmolded component 200 is depicted as having molding material 205 completely covering the electronic component 201, one skilled in the art will appreciate that various degrees of overmolding can be used to achieve the desired structural rigidity, functionality, and aesthetics of the transaction card. In particular, as shown in FIGS. 2A and 2B, electrical contacts in the form of wires 210 and 220 connected to the component 200 each have an unencapsulated end that protrudes from the overmolding to allow electrical connection to the component. Although depicted as wires in FIGS. 2A and 2B, it should be understood that the electrical contacts or other unencapsulated portions are not limited to electrical contacts and can take any shape or form. Additionally, it should be understood that in some embodiments, such as those in which a technically desirable degree of bonding between the unencapsulated and encapsulated components can be achieved through the encapsulation layer, the components may be fully encapsulated.

[0026] Returning to FIG. 1 where an overmolding process is utilized, step 130 may be performed prior to the performance of step 120. That is, the electronic component may be separately overmolded prior to insertion into the opening in the card body. Prior to insertion of the overmolded electronic component, the overmolded component may be further machined to remove excess molding material and / or create features in the molding material that may be used to secure the overmolded electronic component within the opening in the card body. For example, referring to FIG. 2B, a lip may be machined into the molding material 205 to secure the overmolded component 200 within the opening in the card body.

[0027] Alternatively, step 120 may be performed before the overmolding step 130. In this embodiment, the electronic component is inserted into an opening in the card body. The molding material is then forced into the opening in the card body and molded over one or more exposed surfaces, including at least the top surface, of the electronic component. One skilled in the art will appreciate that when the molding material is forced into the opening in the card body, the card body material may be selected to withstand the pressure and heat associated with overmolding without substantial deformation.

[0028] If an insert molding process is utilized, step 130 may be performed prior to performing step 120. A conventional insert molding process includes inserting an electronic component into a mold followed by injecting a molding material into the mold cavity to form a molded electronic component. The molded electronic component may be fully or partially encapsulated by the molding material after the insert molding process.

[0029] Turning now to Figures 3A-D, schematic illustrations of selected steps of an insert molding process for producing a transaction card according to an embodiment of the present invention are depicted. In the figures, areas 305 and 308 in Figures 3A-3D represent holes through the card. Areas 307a, b in Figure 3A and area 307c in Figures 3B and 3D represent partially covered holes (pockets) in the card body for the molding material to bond and access. Figure 3B depicts the finished molded card with the insert molded material of molded component 310 visible. Although the insert molded material is shown contrasting with the background card material for illustrative purposes, the molded component is not limited to any particular degree of contrast in color or shading relative to the background card and can include the same material as the front side of the card or a material selected to have color or shading selected to match the color or shading of the front side to minimize its visibility in the finished card. For example, in a card body that includes a material different from the molding material (e.g., a metal or ceramic body and a thermoplastic molding material), the coloring of the molding material may be selected to have a color and tone that matches the body material as closely as possible, including the use of a component in the molding material that is the same or similar to the card body material (e.g., the inclusion of a powdered metal in the molding material that is the same as the body metal). In other embodiments, a molding material that contrasts with the body of the card may be used. FIG. 3A depicts a front side of a transaction card 300 that includes an opening 305 that extends through the card body 302. A plurality of fastening features 307a,b provide areas to which the molding material can adhere or otherwise bond. In the depicted embodiment, the fastening features 307a,b are blind holes (e.g., pockets). A similar set of fastening features 307c is seen on the opposing back side of the transaction card 300 in FIG. 3B. The geometry of the opening 305 and fastening features 307 a,b,c were selected to improve the RF performance of the metal transaction card 300 .The fastening features 307a, b, c can comprise a material that is the same as or otherwise compatible with the molding material and different from the card body material, such that the molding material and the fastening feature material melt or otherwise bond with a relatively stronger bond than any bond created between the molding material and the card body.

[0030] 3C depicts the front side of the transaction card 300 after the insert molded electronic component 310 has been placed within the opening 305. In the depicted embodiment, the molded electronic component 310 would be visible on the transaction card 300. The geometry of the molded electronic component 310 allows the molded electronic component 310 to be securely secured to the transaction card 300 through the biasing action created by the fastening features 307a,b,c. Alternatively or additionally, the molded electronic component 310 can be adhered to the opening 305 of the transaction card 300 using an epoxy resin such as bisphenol, novolac, aliphatic and glycidyl amine.

[0031] Excess molding material may be removed (eg, by milling or machining) from molded electronic component 310 to accommodate additional electronic components or other desired components.

[0032] 4A depicts an exemplary overmolding process in which a pocket 403 is machined into a card body 402 to accommodate an electronic component 405. In the depicted embodiment, the electronic component 405 is a printed circuit board (PCB), specifically an RFID module. Although the pocket 403 is depicted as traversing a substantial portion of the back surface of the card body 402, one skilled in the art will appreciate that smaller openings of various geometries may be suitable depending on the electronic component to be incorporated.

[0033] Pocket 403 may be sized to receive and secure electronic component 405 in place, or may be sized to allow excess molding material between the interior lip of pocket 403 and the exterior edge of electronic component 405. Electronic component 405 may additionally or alternatively be glued to pocket 403 with an epoxy as described above.

[0034] An overmolded faceplate 410 creates the back side of the transaction card 400. The overmolded faceplate 410 can fully or partially encapsulate the electronic components 405. The overmolded faceplate 410 may be prepared separately and then attached to the pocket 403 (e.g., with a suitable epoxy as described above), or may be formed by overmolding a layer of molding material directly into the pocket 403.

[0035] In an exemplary embodiment, the molding material used in the overmolded faceplate is a plastic material that may enhance RF transmission when the transaction card 400 is constructed of metal or other RF interfering materials.

[0036] As is known in the art, transaction cards with an RFID chip module for inductive coupling with a card reader of a point of sale (POS) terminal also typically have an embedded booster antenna structure configured to inductively couple the embedded antenna to the RFID chip module, with the combined antenna, RFID module and card reader forming a circuit for transmitting information from the card to the card reader. Thus, in exemplary embodiments where the RFID module is an encapsulated or partially encapsulated component (or one of multiple electronic components fabricated as described herein), the antenna structure can be provided in any number of ways. In one embodiment, the antenna structure can be embedded within a layer that is applied to the card after the molding process described herein. The antenna carrying layer may be laminated to the card using a non-heating process (e.g., with an adhesive) or a thermal lamination process carried out at a temperature, pressure and duration that does not re-melt, deform or otherwise detrimentally disturb the molded article over the electronic components, or may be provided with a backing sheet (comprising metal or some other material that is not affected by thermal lamination) to prevent any re-melted or deformed portions of the molded article from protruding from the opposing surface on which the lamination step is being performed during such a thermal lamination process.

[0037] In another embodiment, the molding step may include an overmolding step that covers not only the electronic components described herein, but also at least a portion of the card surface in which the antenna structure will later be placed. For example, in addition to encapsulating or partially encapsulating the RFID module, it is possible to perform a flood overmolding step that covers at least one entire surface (typically the back surface, but also or alternatively the front surface) in a layer having a desired thickness. The antenna can then be embedded in this overmolded layer using ultrasonic processes known in the art. Any content to be printed on the surface of the card can also be printed on the surface of the overmolded layer, or an additional printed layer can be attached, such as by adhesive or lamination. In other embodiments, the antenna can be printed on the surface of the molded article or applied as a separate layer that is attached, for example, by adhesive or lamination, over the entire molded surface. It should be understood that the above are non-limiting examples, and that there are endless possibilities for downstream processing of the product resulting from the methods described herein to provide electronic components molded into the card, and that some aspects of the invention are not limited in any way by the subsequent method steps.

[0038] In another embodiment illustrated in Figures 5A-5C, a booster antenna 502 for inductively coupling with an antenna of a payment module can take the form of an annular metal frame that generally surrounds the payment module (e.g., a dual interface (DI) RFID chip). As depicted in Figures 5A-5C, the antenna has a discontinuity or slit 506 that extends from the inner edge to the outer edge of the annular antenna. Such antennas are generally described and characterized as "amplifiers" in U.S. Patent No. 8,608,082 to Le Garrec et al. (the '082 patent) and as "coupling frames" in U.S. Patent No. 9,812,782 to Finn et al. (and others), both of which are incorporated herein by reference. As explained above, and in U.S. patent application Ser. No. 15 / 928,813, filed Mar. 22, 2018, entitled "DI Capacitive Embedded Metal Card" (the '813 application), which is assigned to the common assignee of the present invention and incorporated herein by reference, the metal card itself can function as such an antenna or amplifier, with a discontinuity (such as 504 depicted in Figures 5A and 5B) extending from the periphery of the card to the pocket in which the payment module is assembled. The discontinuity can have any geometry, including, but not limited to, the stepped shape depicted in Figures 5A and 5B, any of the geometries described in the '813 application and related applications, or any of the geometries disclosed in the references listed above.

[0039] The '813 application also discloses using a free-standing layer, such as FR-4 material (a thermosetting laminate made of epoxy resin and woven fiberglass) or polyimide, on the backside of the card to reinforce the card with discontinuities. Printing layers for various indicia, magnetic stripes, etc. can be assembled with the FR-4 layer or printed directly on the FR-4 layer. For example, the '813 application describes one embodiment in which a relatively thin (e.g., 0.009 inch thick) stainless steel substrate is used with an FR-4 backing layer, and another embodiment that includes an 18 mil stainless steel layer with a 4 mil FR-4 layer attached to the backside of the steel layer with a 2 mil adhesive layer, a 5 mil printed sheet on the backside of the FR-4 layer (attached via another 2 mil adhesive layer), and a 2 mil overlay layer including a magnetic stripe laminated to the backside of the printed sheet layer. The '813 application describes a free-standing (e.g., FR-4) layer that can be referenced, with a resistance of 80 MPa·m 3 ~40 GPa m 3 It is disclosed that the stiffness of the

[0040] In some embodiments described in more detail below herein, a booster antenna may be provided as well. In some embodiments, particularly those including a booster antenna, the metal card body may be isolated from the payment circuitry for communicating with the card reader, where the circuitry houses the transponder module and the booster antenna. In such embodiments, the payment circuitry may not function as an antenna or amplifier. In other embodiments, the metal card body may serve as part of the payment circuitry that houses the transponder module, along with the booster antenna. In still other embodiments, the metal card body may be part of a different circuit that harvests energy from the card reader, but may or may not actually communicate with the card reader, as discussed in more detail in U.S. Patent Application No. 16 / 751,285, entitled "Metal, Ceramic or Ceramic Coated Transaction Card with Window or Window Pattern and Optional Backlighting," filed January 24, 2020, which is incorporated herein by reference.

[0041] As shown in FIG. 5C, the metal antenna 502 is surrounded by an encapsulating material to form an outer perimeter 520 and an inner region 522, which also fills the slit 506 connecting the inner region to the outer perimeter. For illustrative purposes, the antenna is depicted in FIG. 5C without the encapsulating material covering it in the Z direction so that the antenna remains visible in the depiction. In embodiments where the card's metal body 500 is utilized for signal amplification, the encapsulating material may also fill the slit 504 in the metal body. However, it should be understood that the slit 504 may not be present in all embodiments. Furthermore, it should be understood that the card body may have more than one slit. Exemplary alternative additional slit locations 554, 564, 574 are depicted in dashed lines. For example, in one embodiment, the combination of slits 504 and 554 intersecting the chip pocket can form a bisecting section along the entire length of the card, or the combination of slits 564 and 574 intersecting the chip pocket can together form a bisecting section along the entire width of the card. It should be noted that the term "bisect" is intended to mean that a line divides the card into two sections, but that these sections are not necessarily equal in size. Although depicted as aligned on the same line on opposite sides of the antenna and generally centered on the antenna, the combined slits can have any relationship to the antenna and to each other, including slits on different sides of the antenna being on parallel or non-parallel lines, slits connecting adjacent sides of the antenna rather than opposite sides, slits not parallel to the edges of the card, or one or both slits not linear. For embodiments in which the card is bisected, the remaining components of the card can be secured together by overmolding or by other non-conductive adhesives or fillers. Although the preferred embodiment involves only a single bisection of the card body into two separate portions, multiple body slits are possible dividing the card into three or more separate portions.The bisected arrangement generally minimizes eddy currents.

[0042] Thus, the encapsulated antenna 502 as depicted in FIG. 5C defines a metal-containing plug 550 that may be created as a whole and then inserted into an opening in the card body, or may be created in situ in the opening in the card body, for example, by overmolding. After the plug is inserted or molded in situ into the pocket, a pocket may be created in the interior region 522 of the plug (e.g., by milling or any process known in the art). An advantage of such a design is that the metal card body may be formed with a through hole to accommodate the plug 550. Preferably, the through hole may be formed by methods other than milling, such as stamping, etching, laser cutting, etc. Alternatively, the card body can be initially formed with a through hole, which can be highly advantageous for card bodies made of ceramic, cast metal, or metal-doped epoxy (e.g., as described in U.S. PCT Application No. 2019 / 50592, filed September 11, 2019, claiming priority from U.S. Provisional Patent Application No. 62 / 730,282, filed September 12, 2018, entitled "Metal-Doped Epoxy Resin Transaction Card and Method for Manufacturing Thereof," assigned to the co-assignee of the present application and incorporated herein by reference). In this case, only a milling step to create a pocket for accommodating the payment module needs to be performed in a non-metallic encapsulating material, which is easier and takes less time to mill than metal. As is known in the art, the pocket for accommodating the payment module can be a stepped hole having a first relatively larger area on the front surface of the card and a second relatively smaller area on the back surface of the card. By enlarging the area of ​​the pocket in the card body into which the payment module is inserted, the overall length of the slit 504 that must be cut in the metal card body (in embodiments where a slit is present) can be minimized, likewise saving manufacturing time. The above improvements result in increased production yields and efficiency.

[0043] In some embodiments, it may not be necessary or desirable for the card body to function as part of the booster antenna. In such embodiments, the opening in the card body may be relatively larger than depicted in Figures 5A-5C, such that the outer perimeter 520 has a width W that separates the metal of the antenna 502 in the plug 550 from the card body, which is operable to acceptably minimize electrical / magnetic interference from the card body. The geometry of the plug 550 in such embodiments may be more rectangular, with the innermost edge 560 of the plug positioned further toward the center of the card body 500 to direct a portion of the RF signal toward the center of the card, while the location of the DI payment module remains essentially unchanged as depicted to comply with relevant standards for contact location.

[0044] Although described herein in relation to metal card bodies, similar geometries can also be utilized in non-metallic cards. In addition to the manufacturing methods described herein, which are suitable for card bodies of any material (although highly advantageous for metal, ceramic, and ceramic-coated metal bodies), it is possible to deploy an antenna 502 in a plastic (e.g., PVC) card body, for example, by ultrasonically (or otherwise) embedding a metal component in the plastic as an inlay inside the card, thus replacing a copper wire or etched antenna inlay. The depicted antenna geometry 502 can be described as a planar annular member having a substantially closed periphery, with a slit 506 connecting the inner and outer peripheries of the annulus. Although depicted as a single member in the exemplary embodiment, the antenna structure is not so limited and can include two or more members. In contrast, a copper wire or etched antenna inlay typically creates a helical pattern of lines or wires, with the turns of the helix being radially separated by spaces.

[0045] Those skilled in the art will appreciate that suitable molding materials will depend on the type of molding process used in step 130. For example, if insert molding or overmolding is utilized, thermoplastic materials such as Techno Melt® meltable adhesives (Henkel), which may include one or more materials in the group consisting of EVA, metallocene polyalphaolefins, polyolefins including atactic polyalphaolefins, block copolymers, polyurethane hot melts, epoxies, and polyamides, and thermosetting materials such as fiberglass reinforced polyester, polyurethane, bakelite, duroplast, melamine, diallyl phthalate, and polyimides, may be used. Those skilled in the art will appreciate that other materials that may flow in an overmolding or insert molding process may be used as well, including epoxies containing powdered metals including, but not limited to, any of the above, including rhodium, aluminum, titanium, magnesium, copper, brass, nickel, Monel, Inconel, steel, and alloys of the above. Epoxies containing ceramic materials may be used as well.

[0046] In another embodiment, the molding material used in the overmolding or insert molding process is a plastic material that has a molding temperature range of approximately 150-300C.

[0047] 6A-6C depict a particular embodiment 600 of a metallic RFID device including a body in the form of a metal frame 610 having an outer perimeter 611, an opening in the card body defining an inner perimeter 612 of the metal frame. At least one body discontinuity 620 extends from the outer perimeter to the inner perimeter of the metal frame. At least one electronic component is disposed within the opening, and a layer of non-conductive material 640, 642 is disposed around the electronic component. The electronic component includes an RFID chip 632 disposed within a substrate 634, and an antenna 636, also disposed within the substrate, is coupled to the RFID chip. The RFID chip, antenna, and substrate may collectively be referred to as an RFID module. Thus, the RFID device 600 includes a metal frame 610 having opposing surfaces 614, 615, an outer perimeter 611, and an opening in the metal frame that defines the inner perimeter 612 and extends a certain depth from at least one of the opposing surfaces 614, 615. As depicted in FIGS. 6A-6C, the opening has a depth consistent with the thickness T of the metal frame from the top surface 614 to the bottom surface 615. A chip layer 630 (including a non-conductive substrate 634, an RFID transponder chip 632 assembled to the substrate 634, and a module antenna 636 in the substrate connected to the RFID transponder chip) is disposed within the opening. The module antenna may be etched or have any structure known in the art for placement in a substrate. One or more filler layers 640, 642 may be disposed within the frame opening between the chip layer and one of the surfaces of the metal frame. One or more layers 650, 652 may be stacked across at least one surface of the metal frame. One through hole 660 is preferably aligned across a portion of the device positioned between the inner surface 611 and outer surface 612 of the metal layer, and extends between the top and bottom surfaces of the device, between the top surface of top layer 650 and the bottom surface of bottom layer 652 as depicted in FIG. 6B.Although shown in FIGS. 6A-6C with both an antenna 636 in the chip layer and a discontinuity 620 in the metal frame, some components may have only one or the other but not both, while other embodiments may have both as depicted.

[0048] One process for making device 600 may include affixing layer 652 to bottom surface 615 of metal frame 610 prior to stacking layers 642, 630, and 640 within the openings, and then placing layer 650 across the openings and laminating the stack such that layers 640 and 642 encase chip layer 630. The metal frame may be constructed by cutting an opening in a metal blank, forming metal into the desired shape, or cutting a section from an extruded bar. Although depicted as having dimensions extending to inner perimeter 612 of metal frame 610, it should be understood that chip layer 630 may have a substantially smaller footprint such that layers 640 and 642 completely encase chip layer 630 on all sides. It should further be understood that an intermediate layer of non-conductive material (not shown) may be disposed between layers 640 and 642 with a notch to accommodate the periphery of substrate 634 in a configuration in which the outer periphery of substrate 634 is smaller than the inner periphery 612 of the frame.

[0049] In another embodiment depicted in Figures 7A-7C, an RFID device 700 includes a metal frame 710 having opposing surfaces 714, 715, an outer perimeter 711, and an opening in the metal frame that defines an inner perimeter 712 and extends a depth D from the surface 714. As depicted in Figures 7A-7C, the opening has a depth D that is less than a thickness T of the metal frame from the top surface 714 to the bottom surface 715. A chip layer 730 (including a substrate 734, an RFID transponder chip 732 assembled to the substrate 734, and a module antenna 736 in the substrate connected to the RFID transponder chip) is disposed within the opening. Thus, the opening includes a pocket having a bottom and a ferrite layer 742 disposed between the chip layer and the pocket bottom, with a filler layer 740 disposed within the pocket between the top surface 714 of the metal frame and the chip layer 730. A layer 750 is laminated across the top surface 714 of the metal frame 710 and the filler layer 740.

[0050] One method of making device 700 includes making a pocket opening (by milling, etching, laser) in a metal blank to define metal frame 710, stacking layers 742, 730, and 740 within the opening, placing layer 750 across the opening, and laminating the stacked components together. As depicted in Figures 7A-7C, RFID device 700 has through holes 760 aligned within the portion of the device between the top and bottom surfaces of the device, preferably between the inner surface 711 and the outer surface 712 of the metal layers, and extending between the top surface of top layer 750 and the bottom 715 surface of the metal layers as depicted in Figure 7A. As further depicted in Figure 7B (not shown in Figures 7A or 7C to reduce clutter, and although similarly applicable to the designs of Figures 6A-6C and 8A-8C), hole 760 may be particularly suitable for accommodating a member 780, such as a component of a device configured to hold one or more keys, such as a key ring or key chain. Thus, devices 600 and 700 may be of a size smaller than that typically associated with a credit card, and may have a suitable size that makes them more suitable for functioning as a key fob or key tag.

[0051] Although Figures 6A-6C and 7A-7C depict contactless-only RFID devices, it should be understood that the RFID device in any of the above may be a dual interface device capable of interfacing with both contactless and contact type readers. Thus, as depicted in Figures 8A-8C, RFID device 800 includes a metal frame 810 having opposing surfaces 814, 815, an outer perimeter 811, and an opening in the metal frame that defines an inner perimeter 812 and extends a depth from surface 814. A chip layer 830 (including a substrate 834, an RFID transponder chip 832 assembled to substrate 834, and a module antenna 836 in the substrate connected to the RFID transponder chip) is disposed within the opening. Thus, in the embodiment depicted in Figure 8B where the opening includes a pocket having a bottom, a ferrite layer 842 is disposed between the chip layer and the bottom of the pocket, and a filler layer 840 is disposed within the pocket between a top surface 814 of the metal frame and chip layer 830. Layer 850 is laminated over the top surface 814 of metal frame 810 and over fill layer 840. The DI chip extends to the top surface of top layer 850 since it has contact type functionality.

[0052] One process for device 800 can include making a pocket opening (by milling, etching, laser) in a metal blank to define metal frame 810, stacking layers 842, 830, and 840 (with a notch to accommodate chip 832) within the opening, placing layer 850 (with a notch to accommodate chip 832) across the opening, and laminating the stacked components together. In another embodiment, when the stack of layers 842, 830, 840, and 850 is laminated together, only antenna 836 can be on substrate 830, after which a hole is created to accommodate chip 832 and chip 832 is inserted. The subsequent lamination step can be performed at a temperature suitable to reflow the fusible layer to encase all but the top contact surface of chip 832.

[0053] Although depicted as a pocket having a depth less than the thickness of the metal frame in Figure 8B, it should be understood that the DI tip (or contact only) design may be similarly suitable for use in designs in which the opening extends the entire thickness of the metal frame, such as the embodiment depicted in Figures 6A-6C. Additionally, permutations of such embodiments include those with only antenna 836, those with antenna 836 and a slit similar to slit 620, and those with both an antenna and a slit.

[0054] To maintain functionality within a standard card reader intended for credit card sized payment devices, the orientation of the DI chip (short edge of the contact pads of chip 832 parallel to leading edge 870 of the device), location of DI chip 832 (left of center) and dimensions of metal frame 810 are identical to those of the leftmost portion of a standard DI credit card (as viewed from the front or top surface of the card). This configuration allows the device to be inserted into a contact card reader in the direction of arrow P with leading edge 870 oriented first, making device 800 indistinguishable from a standard credit card when viewed from the perspective of the card reader.

[0055] While none of the embodiments 600, 700, 800 are limited to any particular location for the through-hole for receiving the key carrier components, it should be understood that in a DI (or contact only) device, the hole must be located in a location that does not cause interference with insertion into a card reader. Although a location in the upper left or upper right corner of the device (e.g., where hole 860a is shown in FIG. 8A) may be acceptable, in a configuration where the hole is located on an appendage 874 that protrudes from the trailing edge 872 of the card, such as where hole 860b is depicted in FIG. 8A, the overall dimension of the device in the card insertion direction can be reduced. Although the geometry depicted in FIG. 8A is semicircular, appendage 874 can have any geometry desired. Although only a single through-hole may be required per device, some devices may have more than one. Although depicted in the drawings with through holes 660, 760, 860a, 860b in specific locations, the holes may be located anywhere that does not interfere with the functional elements of the device (or the intended use of the device, e.g., for a card reader, contact containing module, etc.), however, location at the metal corners of the frame is highly desirable.

[0056] Although depicted as rectangular, devices 600, 700, 800 (most particularly devices 600 and 700 not depicted with contact functionality) can have any desired geometric shape. Although device 800 requires a geometric shape for insertion into a card reader within the relevant portion, its overall geometric shape is not limited.

[0057] Although described herein in specific embodiments including an opening and a non-conductive laminate and / or substrate surrounding the RFID transceiver chip, it should be understood that the RFID chip and / or antenna can be encapsulated using any of the techniques described herein. Additionally, although some embodiments herein refer to a "card" and other embodiments refer to a "device" suitable for use on a key holder, it should be understood that any of the designs disclosed herein can be suitable for use in any size, not limited to the size of a standard transaction card or the smaller sizes intended to be attached to a key holder. As is known in the art, a standard transaction card (e.g., credit card, debit card, gift card) conforms to the CR80 or ISO / IEC7810:2003 standard and has nominal dimensions of approximately 3.5 inches by 2 inches, or more specifically 3.37 inches (85.6 mm) by 2.125 (53.98 mm), with rounded corners of 3.18 millimeter radius, and a thickness of 0.03125 inches (0.76 millimeters). As one of ordinary skill in the art would understand, the above dimensions are nominal dimensions with a tolerance range for each. Although referred to herein as a "key holder," it should be understood that the devices with through holes discussed herein can be attached to any type of member suitable for passing through a hole, with or without a key attached to the same member, including chains, rings, lanyards, ropes, necklaces, bracelets, posts, etc.

[0058] In yet another embodiment depicted in Figures 9A-9C, the card includes a metal layer 950, which may be formed from a metal foil, a metal sheet, bulk metal, or other known metal. The metal layer 950 may include a plurality of discontinuities extending from a front surface 902 to a back surface 904 of the metal layer, including at least one first discontinuity 920 that defines a passageway from the card periphery to an opening 912 in the metal layer for receiving a transponder chip module 910. In the embodiment depicted in Figures 9A-9C, other discontinuities 922, 924, 928 extend from the periphery to an end point that does not coincide with the opening 912. Another discontinuity 926 extends from an intersection with the discontinuity 920 to an end point that is neither in the opening nor at the periphery. Metal layer 950 may further include additional discontinuities, such as a second discontinuity that defines a path from the periphery of the card to an opening (not shown in FIGS. 9A-9C but similar to the combination of slits 504 and 554 or slits 564 and 574, respectively, depicted in FIG. 5A) and bisects the card into two separate portions. The discontinuities may have any shape and may include discontinuities incorporated into the aesthetic design appearance or formed in the shape of alphanumeric characters, symbols, and the like on one or both sides of the card, including integral with printed features.

[0059] In the embodiment depicted in FIG. 9C, the booster antenna layer 942 includes a plurality of metallizations 940, 944 on a substrate (e.g., polyester) that form the booster antenna. A suitable booster antenna may also include a metal wire antenna disposed on a non-metallic substrate. The metal portion of the antenna is insulated from the metal layer 950 by an adhesive layer 952 that separates the booster antenna and the metal layer. The booster antenna 942 is configured to communicate with the transponder chip module 910, both of which include components in a circuit configured for wireless communication with a card reader (not shown). The booster antenna may be connected to the transponder chip module inductively or with a physical connection (e.g., wire, trace, contact). In an exemplary embodiment, the booster antenna layer 942 includes a solid polyester layer (e.g., approximately 25 microns thick) that may be asymmetrically metallized on both sides, with vias through the polyester connecting the respective metallizations disposed on the opposing surfaces.

[0060] A reinforcing layer 982, such as a fiberglass reinforced epoxy laminate, such as FR-4, is disposed over the front surface 902 of the metal layer 950, and a reinforcing layer 984 of similar construction is disposed over the back surface 904 of the metal layer 950 and the booster antenna layer 942. However, the reinforcing layer is not limited to any particular type of glass reinforced epoxy laminate material, including both flame retardant (henceforth the designation "FR") and non-flame retardant glass reinforced epoxy laminates. The term "FR-4" may be used herein as shorthand to mean a reinforcing layer of any construction, including but not limited to flame retardant and non-flame retardant fiber reinforced epoxy laminates. The fibers in the fiber reinforced laminate may include fiberglass, polymeric fibers, or any other type of fiber known in the art for making fiber reinforced structures. The term fiber, as used herein, may include any type of structure that includes fibers or filamentary members, including but not limited to mesh or grit structures, woven structures, structures with randomly oriented fibers, and the like. The FR-4 layers may be adhered to their respective layers by adhesive layers 981 and 983. Adhesive from the adhesive layers may penetrate and partially or completely fill the discontinuities 924, 926, 928 during formation of the card. In some embodiments (not shown), the antenna layer 942 and FR-4 layer 984 may be reversed, with layer 984 being the outermost layer, and printed material printed directly onto the outer printed sheet layer. In embodiments in which the antenna layer is adjacent to a metal layer, the antenna metallization may be disposed on a surface of the antenna substrate opposite the metal layer, or an insulating material (e.g., adhesive and / or a non-metallic layer, such as an adhesive disposed on a non-metallic substrate) may be disposed between the metallization and the metal layer. In other embodiments, the metallization may be embedded within the FR-4 layer, for example, using ultrasonic techniques.

[0061] Although the term "metallization" may typically be understood to mean a coating on the exterior surface of a substrate, as used throughout this application, the term refers to any type of metal structure, and when referring to a booster antenna structure, refers to the metal construction of the antenna regardless of its form, including but not limited to structures created using etched films, coatings, depositions, printing, embedded wires, and the like.

[0062] Disposed above the top FR-4 layer 982, for example adhered by adhesive layer 991, is an optional RF friendly metal foil 990 (preferably configured with a metallic appearance) onto which a plastic layer 994 is adhered (attached by adhesive 993). Notably, the adhesive layer is preformed with the foil as a composite, and the foil composite is hot stamped onto the FR-4 or rolled onto the FR-4. In embodiments where the foil is rolled on, the foil composite includes a release layer that is then removed before attaching the next layer. Printed content 995 is disposed on the plastic layer 994. In other embodiments, printed content is printed directly onto the foil 990, and the plastic layer 994 / adhesive 993 is omitted. Other printed content 996 and / or a magnetic stripe (not shown) can be disposed on the bottom FR-4 layer 986. Embodiments may also be provided in which the positions of layers 994 and 990 in the stack are reversed relative to one another (eg, layer 900 is in an interchanged position such that it is set relatively higher in the stack than layer 994).

[0063] In the embodiment depicted in FIG. 9C, the opening 912 extends through all of the top layers of the composite card such that the contact surface 911 of the transponder 910 is accessible from the top surface of the card. Such a configuration is preferred in embodiments in which the transponder has contacts configured to be physically contacted by a card reader, such as a dual interface (DI) module. However, it is also possible to provide configurations incorporating contactless only modules in which the opening 912 does not extend to the top surface of the card. The opening 912 may be filled with a non-metallic plug 913 that insulates the transponder from the metal layers. The plug 913 may have a hole 915 in the bottom to accommodate a downwardly protruding region 914 of the transponder having a periphery relatively smaller than the periphery of the widest portion of the module. The configuration of the plugs in the metal layer may be in accordance with the teachings in U.S. Pat. No. 9,390,366, entitled "Metal Smart Card with Dual Interface Capability," and / or U.S. Pat. No. 10,318,859, entitled "Dual Interface Metal Smart Card with Booster Antenna," or related applications thereof, which are incorporated herein by reference.

[0064] Although not limited to any particular dimensions, exemplary embodiments of the aspect of the invention depicted in FIG. 9C may include exemplary thicknesses and compositions set forth in Table 1 below:

[0065] [Table 1]

[0066] Although depicted in FIG. 9C, it should be understood that at many of the interfaces between layers, adhesive may be optional (or may not be a separate layer relative to the layer above or below). For example, as described herein, the FR-4 layer may be cast directly onto the metal layer. Non-metal layers may be laminated together such that the material of the layer adheres to the adjacent layer with or without adhesive. The antenna layer may be a separate free-standing layer, or may include metallization, as described further herein, e.g., via an etched metal foil, printed with a metallic ink placed directly on the FR-4, or wires embedded (e.g., ultrasonically) in the FR-4 layer. In embodiments where the foil 990 is a "transfer foil," the adhesive layer 991 may be optional or represent an adhesive layer integrated into the matrix of the transfer foil 990 that adheres directly to the underlying layer. The positions of the antenna layer 942 and the FR-4 layer 984 in the stack may be reversed relative to one another, in which case the plastic layer 997 may be omitted and the ink layer 996 may be printed directly onto the FR-4 layer 984. In particular, only one embodiment is shown above and other embodiments may include more or fewer layers.

[0067] 9A-9C, the booster antenna 942 includes a plurality of nested semicircular metallizations 944 that focus induction to facilitate inductive coupling to the transponder 910. Although shown with inductive coupling, in other arrangements the booster antenna can have a physical connection to the transponder.

[0068] A magnetic stripe 930 may be disposed across the bottom FR-4 layer 984. The card design may also incorporate other card features such as holograms, printing, 2D codes (e.g., barcodes or QR codes), typically disposed across the bottom FR-4 layer or on the top plastic layer.

[0069] Referring now to FIG. 10, an exemplary process for making cards described herein, such as the embodiment depicted in FIGS. 9A-9B, may include first providing a metal sheet 1000 to serve as metal layer 950 in cross section as illustrated herein. The sheet is sized to be cut into cards along lines 1002, 1004, 1006, 1008. Although FIG. 10 depicts only a portion of a sheet having only four cards, it should be understood that the sheet can be sized to be cut into any number of cards. What is important is that, regardless of the number of cards per sheet, the size of the sheet is preferably larger than the size of the card or cards to be cut from the sheet, so that the sheet remains intact when cutting into the sheet to form the desired discontinuities.

[0070] The sheet may be inserted into a mold with a fiberglass or plastic mesh layer disposed over the metal layer, and then epoxy may be filled into the mold to cast the epoxy over the top and / or bottom surfaces of the metal sheet to form FR-4 layers 982, 984 directly bonded to the metal layer, as in the embodiment depicted in Figure 9E. In other embodiments, preformed FR-4 layers 982, 984 may be adhesively bonded to the top and / or bottom surfaces of the metal sheet, as in the embodiment depicted in Figure 9F.

[0071] It is possible to have more or fewer layers than those shown in Figures 9E and 9F, including but not limited to layers described in connection with other embodiments herein. Similarly, it is possible to have more or fewer layers for any of the other embodiments discussed in any section of this disclosure. The similar element numbers for the various layers shown in Figures 9E and 9F are intended to refer to layers having the same function and / or configuration as those referenced by the same numbers in other figures, but the functions, layers and locations in any of the depicted embodiments are not limited to the illustrated arrangement. Those skilled in the art will recognize that while many different arrangements are possible, some of the embodiments discussed herein may be particularly advantageous with respect to considerations such as cost, durability, aesthetics, thickness minimization, etc. The thicknesses of the layers depicted in any of the figures should not be interpreted as an indication of the relative thicknesses of the layers in the actual configuration, as some features may be exaggerated or enhanced in the figures for illustrative purposes only.

[0072] Metallization 940 for the booster antenna may be included in the stack as part of a separate layer (e.g., 942) as depicted in Figures 9C and 9D, or it may be placed directly on or embedded under one of the surfaces of the FR-4 layer (not shown), as depicted in Figures 9E and 9F. One method for creating an etched booster antenna layer involves adhesively attaching a metal (e.g., copper) foil layer to one surface of the FR-4 layer, and then etching away the unwanted portions of the foil to leave the desired antenna pattern. Other methods for placing the antenna directly on or in the FR-4 include pattern deposition, printing with conductive ink, and embedding copper wires in the FR-4 (e.g., using ultrasonic methods known in the art).

[0073] In embodiments where a preformed layer of FR-4 is adhesively affixed to the metal layer, as depicted in FIG. 9F, the direct placement antenna may be disposed on the inner surface of the FR-4 and attached to the metal layer with a sufficient adhesive layer to insulate the metallization 940 from the metal layer 950 (e.g., with layer 960 including adhesive layers 962, 964 disposed on the opposing surface of a non-metallic substrate 966). In embodiments where the metallization for the antenna includes wires embedded within the FR-4, such an insulating layer may be omitted. In other embodiments, including embodiments where the FR-4 layer is cast directly onto the metal layer, such as the embodiment depicted in FIG. 9E, the metallization 940 for the antenna may be formed on the outer surface of the FR-4 layer 984 and covered with another non-metallic layer 997e. Embodiments where one FR-4 layer is cast directly and the other FR-4 layer is attached later are similarly possible. Embodiments in which the metallized FR-4 layer is added to the metal as a separate layer rather than cast directly onto the metal can have metallization on both sides of the FR-4 (optionally connected with vias through the FR-4 layer), in which case the configuration depicted in FIG. 9F can include an additional layer 997e on the outer surface of layer 984, as depicted in FIG. 9E. The cover layer 997e is typically an opaque plastic layer, such as a plastic laminated (as depicted in FIG. 9F) or adhesively affixed (not shown) to the FR-4 layer, although the outer layer can have any configuration, including but not limited to a decorative layer of ceramic, wood, leather, or even another metal layer, such as an anodized metal, especially when adhesively affixed to the FR-4. In embodiments in which the metallization for the antenna includes wires embedded within the FR-4, the additional non-metallic layer 997 can be omitted. Insulation can be omitted.

[0074] An opening 1010 for accommodating a transponder (corresponding to opening 912 shown in other figures) can be milled, partially or entirely, into the metal sheet depicted in FIG. 10 at any time during the assembly process. For example, the metal can be pre-cut prior to the step of casting a metal layer directly into the epoxy to form the FR-4, so that the epoxy fills the opening in the metal. In such a configuration, the opening in the metal can be large enough than the transponder to form a plug that can be milled in a later step to accommodate the module, with the epoxy disposed between the transponder and the metal (and the adhesive disposed between the transponder and the epoxy). In embodiments in which a pre-formed FR-4 layer is bonded to the metal, the metal can be cut at the same time as the discontinuities and the remaining layers can have pre-cut holes that register with the holes in the metal, or the opening 1010 in the metal can be milled after the remaining layers are added, or the opening can be pre-cut in the metal and milled in the other layers in a subsequent step.

[0075] Inserting the transponder into the opening includes inserting a plug of non-metallic material into the opening that surrounds the transponder. The non-metallic material plug may include an adhesive or a combination of an adhesive and another non-metallic substance. In one embodiment, the plug and transponder may be pre-assembled and adhesively secured within the opening. In another embodiment, the plug may first be placed into the opening and then milled to accommodate the transponder. The opening-transponder interface and the process for creating it are not limited to any particular configuration.

[0076] After the layer stack is assembled and the transponders are inserted, the card sheet can then be cut into a plurality of individual card blanks, which can then be further processed, including customization, as desired. It should be understood that the transaction cards of any of the embodiments discussed herein can have any shape and size, including in the case of a key fob configuration as described herein in connection with Figures 8A-8B.

[0077] Although various concepts have been illustrated using specific exemplary embodiments, features of each embodiment may be mixed and matched as desired by one of ordinary skill in the art. For example, the FR-4 and multi-discontinuity architecture described in connection with Figures 9A-9C may be applied to keychain embodiments such as those illustrated in Figures 6A-8A. Similarly, aspects of the construction as described herein in connection with Figures 9A-9C in the fiber reinforced epoxy embodiment (particularly the absence of a metal layer from the payment circuitry) may also be featured, alone or in combination, in other constructions known in the art, including, but not limited to, constructions with other types of overmolding materials or laminated layers.

[0078] The above embodiments are merely exemplary embodiments, and other embodiments may include fewer or more layers stacked in different orders and attached to one another by any method known in the art, including but not limited to adhesive bonding. One or more of the functional layers may be formed of an adhesive coated sheet and a peelable release layer. In other embodiments, the adhesive layer may include an adhesive disposed on both sides of a very thin sheet of polyester, with a release layer disposed over both adhesive layers. In such embodiments, the relevant steps in the process for forming the card include removing the first release layer, attaching the exposed adhesive layer to an adjacent layer, and then removing the second release layer for attachment of the subsequent layer.

[0079] In the exemplary embodiment depicted in FIG. 9D, the exemplary card can be formed from a prefabricated laminate material including a metal layer 950 with an upper FR-4 layer 982 and a lower FR-4 layer 984 attached to both surfaces, for example, by casting an epoxy around a structural mesh placed over the metal layer. In one method for assembling the card, a prefabricated laminate as described above is processed to create discontinuities 924, 926, and 928 and openings 912 from the bottom of the card. For example, a laser can be used to cut through the metal layer 950 from the lower FR-4 layer 984 without penetrating the upper FR-4 layer, leaving the upper FR-4 layer 982 with sufficient integrity to provide reinforcement to the card with the corresponding discontinuities. Additional layers can be added as described in any embodiment herein, without being limited to the stack depicted in FIG. 9D. For example, an RF friendly foil 990 can be placed over a pre-made laminate by rolling or hot stamping process as described herein above, the remaining non-inked layers (e.g., booster antenna layer 942, optional bottom plastic layer 997, and optional adhesive layers 983, 985 between adjacent layers) are added, and then the stack is laminated. A graphics layer 995 or 996 is printed on the outer surface of the laminated stack. The transponder module can be added before or after printing, including milling the opening 912, inserting the plug 913 in the opening 912, milling the opening in the plug, and inserting the module 910 in the plug. The plug and module can include a pre-made assembly or can be assembled in situ. It should be understood that the combination, order of layers in the stack, and the method of attaching the layers to each other (e.g., by adhesive or by adhesive-free lamination between certain adjacent layers, depending on the composition of the layers) can be varied in any manner known in the art.

[0080] One layer assembly method depicted in the embodiments disclosed herein may include creating a metal layer with openings and discontinuities to accommodate the transponder, separately preparing an FR-4 layer without metallization and an FR-4 layer with an etched and metallized antenna, and sandwiching the metal layer between the FR-4 layers resulting in a structure including layers 982, 960, 950, 960, 940, 984 depicted in FIG. 9F. The FR-4 layer disposed on the top surface of the metal may have pre-cut openings that align with the openings in the metal layer for the transponder, or the FR-4 layer may be milled after attachment to the metal layer to extend the openings to the top surface of the FR-4 layer. Plugs are then placed in the openings and other non-ink layers (e.g., a plastic layer over one or both of the FR-4 layers) are added and the cards are laminated together.

[0081] In another embodiment, the method may include providing a prefabricated FR-4 laminate on both sides of the metal (e.g., layers 982, 950, 984 depicted in FIG. 9E), and then creating an opening 912 and one or more discontinuities (e.g., 920, 922, 924, 926, and 928) in the prefabricated laminate. If desired, the discontinuities may be formed only through layers 984 and 950 and not through layer 982 (as shown in FIG. 9D). In yet another embodiment, the method may include providing a metal body 950, creating the opening 912 and one or more discontinuities (e.g., 920, 922, 924, 926, and 928), placing a mesh layer on the opposing surface of the metal layer, and then casting an epoxy over the mesh layer to form FR-4 layers 982, 984 bonded to the metal layer 950. The resulting layers 982, 950, 984 formed by any of the above processes are then further processed, for example by placing copper foil on one side of the FR-4, and the unnecessary parts are etched away to form the metallization 940. In particular, when starting from a prefabricated laminate with discontinuities passing through only one FR-4 layer and the metal layer (as depicted in FIG. 9D), the foil is preferably placed on the FR-4 layer that does not have the discontinuity. In a variant, the discontinuities can be filled (e.g. with a coating or another non-metallic layer) prior to forming the metallization. The above preferences may be more desirable for etched or printed metallizations in order to optimize the integrity of the metallization than in the case of embedded wire metallizations, which can be placed in any FR-4 layer with less technical challenges. Layer 997e is added to cover the metallization (particularly in embodiments where the metallization is exposed outside the FR-4), resulting in the composition of layers 982, 950, 940, 984, 997e depicted in Figure 9E. Additional layers, including but not limited to layers 995 and 996, can optionally be included, as further described herein.

[0082] Although the invention is illustrated and described herein with reference to specific embodiments, the invention is not intended to be limited to the details shown, but rather various modifications can be made in the details within the scope and range of equivalents of the claims and without departing from the invention.

Claims

1. a metal layer having a front surface, a back surface, a periphery, an opening in the metal layer, and one or more discontinuities in the metal layer, each discontinuity defining a gap in the metal layer extending from the front surface to the back surface, including at least one discontinuity defining a passageway from the device periphery to the opening; a transponder chip module disposed within the opening in the metal layer; a booster antenna in communication with the transponder chip module, the transponder chip module and the booster antenna including a component in a circuit configured for wireless communication with a device reader, the metal layer being neither part of the booster antenna nor a component in the circuit; A transaction device including:

2. 2. The device of claim 1, comprising at least two body discontinuities defining respective passages from the device periphery to the opening, the at least two body discontinuities and the opening collectively bisecting the device body into at least two separate portions.

3. The device of claim 1 or 2, further comprising a non-metallic molding material within the one or more discontinuities in the metal layer.

4. The device of claim 3 , wherein the non-metallic molding material comprises an adhesive or an epoxy.

5. The device of claim 3 , further comprising a stiffening layer disposed over the metal layer.

6. The device of claim 5 , wherein the reinforcing layer comprises fiberglass.

7. The device of claim 6 , wherein the reinforcing layer comprises a fiber reinforced epoxy laminate material.

8. The device of claim 6 including a fiber reinforced epoxy laminate material layer disposed on at least one of the front surface and the back surface of the metal layer.

9. The device of claim 8 , wherein the metal layer is sandwiched between opposing layers of fiber reinforced epoxy laminate material.

10. 10. A device according to claim 1, comprising at least one discontinuity in the metal layer that extends from the device periphery to a location other than within the opening.

11. The device of claim 1 , wherein at least two of the discontinuities in the metal layer intersect each other.

12. 12. The device of claim 11, wherein the intersecting discontinuities include a first discontinuity defining a path from the device periphery to the opening, and a second discontinuity extending from an intersection with the first discontinuity to an end point that is neither within the opening nor at the periphery.

13. 13. The device of claim 1, wherein the booster antenna comprises a booster antenna layer including a plurality of metallizations.

14. The device of claim 13 , wherein each of the plurality of metallizations is electrically isolated from the metal layer.

15. 15. The device of claim 1, further comprising a magnetic stripe disposed on a back layer of the device.

16. 16. The device of claim 1, further comprising a first fiber reinforced epoxy laminate material layer over the entire top surface of the metal layer, but not over the transponder chip module in the opening.

17. 17. The device of claim 16 including a second fiber reinforced epoxy laminate material layer over the entire bottom surface of the metal layer, including over the opening and over the booster antenna.

18. 20. The device of claim 17, further comprising a magnetic stripe disposed throughout the booster antenna.

19. 19. A device according to any preceding claim, comprising a transaction card compliant with at least one of the CR80 or ISO / IEC 7810:2003 standards.

20. 19. The device of claim 1, further comprising an aperture extending between a top surface and a bottom surface of the device, the aperture being sized to accommodate a ring member configured to hold one or more keys.

21. 21. The device of claim 20, further comprising a ring member disposed within said aperture, said ring member comprising a key ring or key chain component.

22. 22. The device of claim 1, wherein the transponder chip module comprises a dual interface module.

23. 23. The device of claim 1, further comprising a layer of an RF friendly metal foil layer disposed over the metal layer.

24. 10. The device of claim 9, further comprising one layer of an RF friendly metal foil layer disposed over one of the layers of fiber reinforced epoxy laminate material.

25. 25. The device of claim 24, further comprising a booster antenna layer disposed over the other of the fiber reinforced epoxy laminate material layers or disposed between the metal layer and the other of the fiber reinforced epoxy laminate material layers.

26. 26. The device of claim 25, further comprising an ink on at least one of the exterior surfaces of the device.

27. a metal layer having a front surface, a back surface, a periphery, and one or more discontinuities in the metal layer, each discontinuity defining a gap in the metal layer extending from the front surface to the back surface, including at least one discontinuity extending to the periphery of the metal layer; a first non-metallic reinforcing layer disposed over the front surface of the metallic layer; a booster antenna including a plurality of metallizations disposed across the back surface of the metal layer and insulated from the metal layer; a second non-metallic reinforcing layer disposed over the rear surface of the metallic layer; an opening in the metallic layer extending through the first non-metallic reinforcing layer; a transponder chip module disposed within the opening and in communication with the booster antenna, the transponder chip module including payment circuitry configured with the booster antenna for wireless communication with a device reader; A transaction device including:

28. 30. The transaction device of claim 27, wherein at least a first one of the discontinuities extends from the periphery to the opening in the metal layer.

29. 30. The transaction device of claim 28, wherein at least a second one of the discontinuities extends from the periphery to an end point that is not within the opening in the metal layer.

30. 30. The transaction device of claim 29, wherein at least a third of the discontinuities extends from an intersection with the first discontinuity to an end point that is not within the opening or at the periphery.

31. 31. A transaction device according to any one of claims 27 to 30, wherein the metal layer is electrically isolated from the payment circuitry.

32. 31. A transaction device according to any one of claims 27 to 30, wherein the metal layer is part of the payment circuitry.

33. 31. The transaction card of any one of claims 27 to 30, wherein the first non-metallic layer and the second non-metallic layer each comprise a fiber reinforced epoxy laminate material.

34. a metal layer having a front surface, a back surface and a periphery; an opening in the metal layer extending from the metal layer to a top surface of the device; one or more discontinuities in the metal layer, each discontinuity defining a gap in the metal layer extending from the front surface to the back surface, including at least one discontinuity extending between the periphery of the metal layer and the opening in the metal layer; a backside fiber reinforced epoxy laminate material layer disposed over the backside surface of the metal layer; A booster antenna; a transponder chip module disposed within the opening and having a top surface accessible from the top surface of the device, the transponder chip module being in communication with the booster antenna and including payment circuitry configured, together with the booster antenna, for wireless communication with a device reader; A transaction device including:

35. 35. The device of claim 34, wherein the booster antenna comprises the metal layer.

36. 35. The device of claim 34 including a booster antenna separate from the metal layer, the metal layer being insulated from the payment circuitry.

37. 37. The device of any one of claims 34-36, further comprising a top fiber reinforced epoxy laminate material layer disposed over the top surface of the metal layer.

38. 38. The device of claim 37, wherein the front and back fiber reinforced epoxy laminate material layers are each bonded directly to the metal layer by the epoxy of the front and back fiber reinforced epoxy laminate material layers.

39. 39. The device of any one of claims 34 to 38, wherein the metal layer is insulated from the payment circuitry and the booster antenna and includes a plurality of metallizations on or embedded within the backside fiber reinforced epoxy laminate material layer.

40. 40. The device of claim 39, wherein the plurality of metallizations are disposed on a back surface of the back fiber reinforced epoxy laminate material layer, the device including a non-metallic layer disposed over the plurality of metallizations.

41. 38. The device of claim 37, wherein each of the fiber reinforced epoxy laminate material layers disposed across the front and back sides of the metal layer is a separate layer secured to the metal layer by an adhesive other than the epoxy of the fiber reinforced epoxy laminate material layer.

42. 42. The device of claim 41, wherein the metal layer is electrically isolated from the payment circuitry, and the booster antenna includes a plurality of metallizations on or embedded within the backside fiber reinforced epoxy laminate material layer.

43. 43. The device of claim 42, wherein at least a portion of the plurality of metallizations are disposed on a back surface of the back fiber reinforced epoxy laminate material layer, the device including a non-metallic layer disposed over the plurality of metallizations.

44. 43. The device of claim 42, wherein at least a portion of the plurality of metallizations are disposed on a front surface of the backside fiber reinforced epoxy laminate material layer and separated from the metal layer by a non-metallic layer disposed between the fiber reinforced epoxy laminate material layer and the metal layer.

45. 45. The device of claim 44, wherein the non-metallic layer comprises a substrate of an adhesive layer.

46. 1. A method of manufacturing a transaction device, comprising: (a) providing a metal layer having a front surface, a back surface, and a periphery; (b) forming one or more discontinuities in the metal layer, each discontinuity defining a gap in the metal layer extending from the front surface to the back surface, including at least one discontinuity extending to the periphery of the metal layer; (c) disposing a booster antenna over the back surface of the metal layer, the booster antenna including a plurality of metallizations; (d) disposing a first fiberglass over the front surface of the metal layer; (e) disposing a second fiberglass layer over the back surface of the metal layer; (f) forming an opening in the metal layer that extends through the first fiberglass layer to a top surface of the device; (h) placing a transponder chip module within the opening; The method includes:

47. 47. The method of claim 46, including configuring the transponder chip module to be in electrical communication with the booster antenna so as to together form part of a payment circuit configured for wireless communication with a device reader.

48. 47. The method of claim 46, comprising disposing the booster antenna layer over the back surface of the metal layer with the metallization electrically isolated from the metal layer, and configuring the device with the metal layer not included in the payment circuitry.

49. 47. The method of claim 46, wherein the step of disposing the booster antenna across the back surface of the metal layer includes forming the plurality of metallizations on or embedded within the second fiberglass layer.

50. 50. The method of claim 49, further comprising disposing an additional non-metallic layer over the metallization.

51. 51. The method of any one of claims 46-50, wherein the step of disposing the first and second fiberglass layers over the front and back surfaces of the metal layer includes casting the first and second fiberglass layers with epoxy to form first and second fiber reinforced epoxy laminate material layers bonded directly to the metal layer.

52. 51. The method of any one of claims 46-50, wherein the step of disposing the first and second fiberglass layers over the front and back surfaces of the metal layer includes the steps of attaching a first cured fiber reinforced epoxy laminate material layer to the front surface of the metal layer with a first adhesive layer, and attaching a second cured fiber reinforced epoxy laminate material layer to the back surface of the metal layer with a second adhesive layer.

53. 53. The method of claim 52, further comprising forming the booster antenna across the back surface of the metal layer by forming a plurality of metallizations on or embedded within the second cured fiber reinforced epoxy laminate material layer.

54. 53. The method of claim 52, wherein forming the plurality of metallizations comprises embedding wires within the second cured fiber reinforced epoxy laminate material.

55. 53. The method of claim 52, wherein forming the plurality of metallizations comprises printing a metallized ink onto a surface of the second cured fiber reinforced epoxy laminate material.

56. 53. The method of claim 52, wherein forming the plurality of metallizations comprises disposing a metal layer over the second layer of cured fiber reinforced epoxy laminate material and etching away a portion of the metal layer to leave the metallization.

57. 57. The method of claim 55 or 56, comprising forming the plurality of metallizations on an interior surface of the second cured fiber reinforced epoxy laminate material layer facing the metal layer.

58. 58. The method of claim 57, wherein the second adhesive layer comprises a non-metallic substrate layer.

59. 57. The method of claim 55 or 56, comprising forming the plurality of metallizations on an exterior surface of the second cured fiber reinforced epoxy laminate material layer facing away from the metal layer.

60. 60. The method of claim 59, including disposing a non-metallic layer over the exterior surface of the second cured fiber reinforced epoxy laminate material and a plurality of metallizations disposed thereon.

61. 61. The method of any one of claims 46 to 60, wherein the opening in the metal layer is created in the same step as the discontinuity in the metal layer.

62. 1. A method for manufacturing a transaction device, comprising: (a) a metal layer having a front surface, a back surface, and a periphery; a first cured fiber reinforced epoxy laminate layer secured to the front surface of the metal layer; a second cured fiber reinforced epoxy laminate layer secured to the back surface of the metal layer; providing a prefabricated laminate comprising: (b) forming one or more discontinuities in the metal layer of the prefabricated laminate, each discontinuity defining a gap in the metal layer extending from the front surface to the back surface, including at least one discontinuity extending to the periphery of the metal layer, each of the one or more discontinuities similarly extending through at least one of the first cured fiber reinforced epoxy laminate layer or the second cured fiber reinforced epoxy laminate layer; (c) disposing a booster antenna over an outer surface of one of the first cured fiber reinforced epoxy laminate layer or the second cured fiber reinforced epoxy laminate layer, the booster antenna including a plurality of metallizations; (d) forming an opening in the metal layer that extends through the first fiberglass layer to a top surface of the device; (h) placing a transponder chip module within the opening; A method comprising:

63. 63. The method of claim 62, further comprising forming the booster antenna by forming a plurality of metallizations on the outer surface or embedded within one of the first cured fiber reinforced epoxy laminate layer or the second cured fiber reinforced epoxy laminate layer.

64. 63. The method of claim 62, wherein forming the plurality of metallizations comprises disposing a metal layer on the exterior surface of each of the cured fiber reinforced epoxy laminate material layers and etching away a portion of the metal layer to leave a metallization.

65. 63. The method of claim 62, including disposing a non-metallic layer over each exterior surface of the cured fiber reinforced epoxy laminate material and the plurality of metallizations disposed thereon.

66. 63. The method of claim 62, wherein forming the plurality of metallizations comprises embedding wires within each of the first or second cured fiber reinforced epoxy laminate layers.

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