Deposition method of metallic film, and deposition apparatus therefor

Abstract

To enable reduction of film formation failure of a metallic film caused by crystals adhered to a wall surface of a penetration part of a masking material.SOLUTION: A deposition apparatus 1 comprises: a container 15 in which a plating solution L is accommodated and is sealed with a polymer electrolyte 13; a linear actuator 70 for moving the container 15 against a substrate B; a pressing mechanism for pressing the substrate B through the polymer electrolyte 13 by applying the liquid pressure of the plating solution L in the container 15 to the polymer electrolyte 13; an anode 11 which is accommodated in the container 15 and is placed apart from the polymer electrolyte 13; a power supply 14 for applying a voltage between the anode 11 and the substrate B; an enclosure member 80A for enclosing a space S between the substrate B and the container 15 in a state in which the substrate B and the container 15 are separated from each other; and a humidification mechanism 80B for letting a humidified gas A flow into the space S enclosed by the enclosure member 80A toward the polymer electrolyte 13.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a film forming method and a film forming apparatus for forming a metal film in a predetermined pattern on the surface of a substrate. [Background technology]

[0002] Conventionally, a metal coating has been formed by precipitating a metal on the surface of a substrate by electrolytic plating (see, for example, Patent Document 1). A film forming apparatus includes a container that contains a plating solution. An opening is formed in the container, and the opening is sealed with an electrolyte membrane. The film forming apparatus further includes a pressing mechanism that presses the electrolyte membrane against the substrate by the hydraulic pressure of the plating solution. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent Publication No. 2022-001658 Summary of the Invention [Problem to be solved by the invention]

[0004] However, when forming a film using the film forming apparatus of Patent Document 1, the electrolyte membrane presses against the substrate due to the hydraulic pressure of the plating solution, and the plating solution (exuded solution) that seeps out from the electrolyte membrane may dry and crystallize. Since the plating solution crystallizes when air is taken in, when attempting to form a metal film in such a state, the crystals may dissolve and air may accumulate between the substrate and the electrolyte membrane. This air may cause poor formation of the metal film. In addition, the remaining crystals may partially dissolve during film formation, causing bleeding in which the boundaries of the metal film become blurred.

[0005] The present invention has been made in consideration of such problems, and an object of the present invention is to provide a metal film forming apparatus that can reduce poor formation of a metal film caused by crystals formed from a plating solution. [Means for solving the problem]

[0006] In view of the above problems, a metal coating forming apparatus according to the present invention is a film forming apparatus that forms a metal coating on a substrate, the metal coating being derived from metal ions that have migrated through an electrolyte membrane by electrolytic plating, and the film forming apparatus is characterized in that it includes: a container that contains a plating solution containing metal ions for film formation and seals the plating solution with the electrolyte membrane; a moving device that moves the container relative to the substrate; a pressing mechanism that applies a hydraulic pressure of the plating solution in the container to the electrolyte membrane to press the substrate via the electrolyte membrane; an anode that is contained in the container and disposed spaced apart from the electrolyte membrane; a power source that applies a voltage between the anode and the substrate in a state in which the substrate is pressed by the pressing mechanism; an enclosure member that surrounds a space between the substrate and the container when the substrate and the container are separated from each other; and a humidification mechanism that flows humidified gas into the space surrounded by the enclosure member toward the electrolyte membrane.

[0007] In a preferred embodiment, a supply port for supplying the gas to the space is formed in a sidewall portion of the surrounding member on the substrate side, and a discharge port for discharging the gas from the space is formed in a sidewall portion of the surrounding member on the electrolyte membrane side, and a suction device for sucking the gas is connected to the discharge port. In a further preferred embodiment, the surrounding member has a plurality of supply ports, and the plurality of supply ports face the sidewall portion of the surrounding member on the substrate side across the space so that the gas supplied to the space from each supply port collides with each other to generate an airflow toward the electrolyte membrane side.

[0008] In addition, it is preferable that the humidification mechanism has a supply source for supplying an inert gas as the gas. Furthermore, it is preferable that the film formation device further includes a masking material attached to the container at a position facing the electrolyte membrane, having a perforated portion with a predetermined pattern formed therein, and covering the base material, and the film formation device is an apparatus for forming a metal coating having the predetermined pattern on the base material by the electrolytic plating in a state in which the masking material is sandwiched between the electrolyte membrane and the base material. Effect of the Invention

[0009] According to the present invention, it is possible to reduce defects in the formation of a metal film caused by crystals formed from a plating solution. [Brief description of the drawings]

[0010] [Figure 1] FIG. 1A is a schematic cross-sectional view showing an example of a metal film forming apparatus according to an embodiment of the present invention, FIG. 1B is a schematic oblique view of a screen mask, and FIG. 1C is a partially enlarged cross-sectional view taken along line AA of FIG. [Diagram 2] FIG. 2 is a flow diagram illustrating an example of a method for forming a metal coating according to an embodiment of the present invention. [Diagram 3] FIG. 3(a) is a schematic cross-sectional view for explaining the film forming process shown in FIG. 2, and FIG. 3(b) is an enlarged cross-sectional view for explaining the precipitated crystals. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] First, a film forming apparatus 1 used in a method for forming a metal film according to an embodiment of the present invention will be described. As shown in Fig. 1, the film forming apparatus 1 is an apparatus that forms a metal film F of a predetermined pattern P on a substrate B by electrolytic plating in a state in which a masking material 60 is sandwiched between an electrolyte membrane 13 and the substrate B. Specifically, the film forming apparatus 1 includes an anode 11, an electrolyte membrane 13, and a power source 14 that applies a voltage between the anode 11 and the substrate B.

[0012] The film forming apparatus 1 includes a container 15 that contains an anode 11 and a plating solution L, a mounting table 40 for mounting a substrate B thereon, and a masking material 60 that is integrally attached to the container 15. Of the masking material 60, a screen mask 62 (described later) is attached to the container 15 at a position facing the electrolyte membrane 13.

[0013] The film forming apparatus 1 includes a linear actuator 70 for raising and lowering the container 15. The linear actuator 70 is a moving device for moving the container 15 so that the screen mask 62 is brought into contact with and separated from the substrate B. The linear actuator 70 corresponds to the "moving device" for moving the substrate B relative to the container 15 in the present invention. The linear actuator 70 has a rod 72 that moves linearly relative to the main body 71, and the container 15 is fixed to the tip of the rod 72. In this embodiment, for convenience of explanation, the electrolyte membrane 13 is disposed below the anode 11, and the masking material 60 and the substrate B are disposed further below the electrolyte membrane 13. The linear actuator 70 is an electric actuator, and converts the rotational motion of a motor into linear motion by a ball screw or the like (not shown).

[0014] The substrate B functions as a cathode. The substrate B is a plate-shaped substrate. In this embodiment, the substrate B is a rectangular substrate. Of the surfaces of the substrate B, the surface facing the electrolyte membrane 13 (screen mask 62) is a film formation surface Ba that functions as a cathode. The substrate B may be made of a metal material such as aluminum or copper. When forming a wiring pattern from the metal film F, the substrate B is a substrate in which a base layer such as copper is formed on the surface of an insulating substrate such as resin. In this case, after the metal film F is formed, the base layer other than the portion on which the metal film F is formed is removed by etching or the like. This allows a wiring pattern made of the metal film F to be formed on the surface of the insulating substrate.

[0015] The anode 11 is, for example, a non-porous anode made of the same metal as the metal of the metal coating. The anode 11 has a block or plate shape. The anode 11 is contained in a container 15 and arranged so as to be spaced apart from the electrolyte membrane 13. The anode 11 may be porous, mesh, or a cage containing a plurality of balls. The anode 11 dissolves when a voltage is applied from a power source 14. However, when the film is formed using only metal ions of the plating solution L, the anode 11 is an anode that is insoluble in the plating solution L.

[0016] The anode 11 is electrically connected to a positive electrode of a power source 14. The negative electrode of the power source 14 is electrically connected to the substrate B via the mounting table 40, and is further connected to a mesh portion 64 of a screen mask 62 described later.

[0017] The plating solution L is a solution containing the metal of the metal film to be formed in an ion state. Examples of the metal include copper, nickel, gold, and silver. The plating solution L is a solution in which these metals are dissolved (ionized) with an acid such as nitric acid, phosphoric acid, succinic acid, sulfuric acid, sulfamic acid, and pyrophosphoric acid. Examples of the solvent of the solution include water and alcohol.

[0018] The electrolyte membrane 13 is a membrane that can be impregnated (contained) with metal ions together with the plating solution L by contacting the electrolyte membrane 13 with the plating solution L. The electrolyte membrane 13 is a flexible membrane. The material of the electrolyte membrane 13 is not particularly limited as long as the metal ions of the plating solution L can migrate to the substrate B side when a voltage is applied from the power source 14. Examples of the material of the electrolyte membrane 13 include resins having an ion exchange function, such as fluororesins such as Nafion (registered trademark) manufactured by DuPont. The thickness of the electrolyte membrane 13 is preferably in the range of 5 μm to 200 μm.

[0019] The container 15 is made of a material insoluble in the plating solution L. The container 15 has a container space 15a for containing the plating solution L. The anode 11 is disposed in the container space 15a of the container 15. An opening 15d is formed on the side of the container space 15a facing the substrate B. The opening 15d of the container 15 is covered with the electrolyte membrane 13, so that the plating solution L in the container space 15a is sealed by the electrolyte membrane 13 when the plating solution L is contained therein.

[0020] 1(a) and 3(a), the linear actuator 70 moves the housing 15 up and down (moves it) by linearly moving the rod 72 so that the electrolyte membrane 13 and the masking material 60 can be brought into contact with and separated from each other. In this embodiment, the mounting table 40 is fixed, and the housing 15 moves up and down by the linear actuator 70.

[0021] The container 15 has a supply port 15b for supplying the plating solution L to the container space 15a and a discharge port 15c for discharging the plating solution L from the container space 15a. The supply port 15b and the discharge port 15c are formed on either side of the container space 15a. The supply port 15b is fluidly connected to a supply pipe 51. The discharge port 15c is fluidly connected to a discharge pipe 52.

[0022] The film forming apparatus 1 further includes a tank 58, a supply pipe 51, a discharge pipe 52, and a circulation pump 59. As shown in FIG. 1, the tank 58 contains a plating solution L. The supply pipe 51 connects the tank 58 to the accommodation body 15. The supply pipe 51 is provided with a circulation pump 59. The circulation pump 59 supplies the plating solution L from the tank 58 to the accommodation body 15. The discharge pipe 52 connects the tank 58 to the accommodation body 15. The discharge pipe 52 is provided with a pressure adjustment valve 54. The pressure adjustment valve 54 adjusts the pressure (liquid pressure) of the plating solution L in the accommodation space 15a to a predetermined pressure.

[0023] In this embodiment, the plating solution L is sucked from the tank 58 into the supply pipe 51 by driving the circulation pump 59. The sucked plating solution L is pumped from the supply port 15b to the accommodation space 15a. The plating solution L in the accommodation space 15a is returned to the tank 58 through the discharge port 15c. A circulation path 50 for circulating the plating solution L can be formed between the tank 58 and the accommodation body 15.

[0024] Furthermore, by continuing to drive the circulation pump 59, the liquid pressure of the plating solution L in the accommodation space 15a can be maintained at a predetermined pressure by the pressure regulating valve 54. The circulation pump 59 applies the liquid pressure of the plating solution L to the electrolyte membrane 13, and presses the substrate B with the screen mask 62 of the masking material 60 through the electrolyte membrane 13. In this embodiment, the circulation pump 59 and the pressure regulating valve 54 correspond to the "pressing mechanism" according to the present invention.

[0025] The masking material 60 is attached to the housing 15 at a position facing the electrolyte membrane 13 on the side facing the mounting table 40. Specifically, the masking material 60 includes a frame body 61 and a screen mask 62 fixed to the frame body 61. The screen mask 62 has through-portions 68 formed therein corresponding to a predetermined pattern P of the metal coating F. The screen mask 62 includes a net-like mesh portion 64 and a mask portion 65 in which the through-portions 68 are formed. The screen mask 62 is a flexible mask.

[0026] Incidentally, when forming the metal coating F, the electrolyte membrane 13 presses the substrate B with the hydraulic pressure of the plating solution L, so that the plating solution (exuded solution) L exuded from the electrolyte membrane 13 may dry and crystallize. The plating solution L crystallizes in a state where air is taken in. For this reason, for example, when forming the metal coating F without using the above-mentioned masking material 60, crystallization progresses on the surface of the electrolyte membrane 13, and when attempting to form the metal coating F on a new substrate B in such a state, the crystals may dissolve and air may accumulate between the substrate and the electrolyte membrane. This air may cause a formation failure of the metal coating. In addition, when the masking material 60 is used, the crystals C adhere to the side wall surface 68a of the through portion 68 as shown in FIG. 3(b). For this reason, when the crystals C dissolve during the film formation, air may remain in the through portion 68, and the metal coating may not be formed in a desired pattern.

[0027] From this viewpoint, as shown in FIG. 1(a), the film forming apparatus 1 includes an enclosure member 80A that encloses the space S between the substrate B and the housing 15 when the substrate B and the housing 15 are separated from each other, and a humidification mechanism 80B that flows humidified gas A into the space S enclosed by the enclosure member 80A toward the electrolyte membrane 13 (specifically, the masking material 60).

[0028] The surrounding member 80A has a cylindrical side wall portion 80a surrounding the space S. A frame-shaped first protruding portion 80b is formed on the end of the side wall portion 80a on the side of the housing body 15 so as to surround the housing body 15 and is attached to the housing body 15. By attaching the first protruding portion 80b to the housing body 15, the space S can be sealed at the upper part of the space S. This allows the humidified gas A to be sucked in from an exhaust port 83B, which will be described later, and prevents the gas A from leaking. For example, the first protruding portion 80b may be attached to the housing body 15 via a sealant to increase the airtightness of the space S.

[0029] Furthermore, a frame-shaped second protruding portion 80c protruding inward is formed on the end of the sidewall portion 80a of the surrounding member 80A on the side of the mounting table 40 (substrate B) so that an opening 80d for accommodating the mounting table 40 is formed during film formation. By providing the second protruding portion 80c, it is possible to reduce leakage of the gas A from below the surrounding member 80A, as shown in Fig. 1. In the state shown in Fig. 1(a), it is preferable that a gap for replacing the substrate B is formed between the second protruding portion 80c and the mounting table 40.

[0030] In this embodiment, a supply port 83A for supplying gas A to space S is formed in sidewall portion 80a on the substrate B side. In this embodiment, a plurality of (for example, two) supply ports 83A are provided in sidewall portion 80a, and each supply port 83A is connected to a supply source 81 via a humidifier 82 that supplies gas A.

[0031] In this embodiment, the supply source 81 is a tank or cylinder that supplies an inert gas, and examples of the inert gas include carbon dioxide gas, argon gas, and helium gas. This makes it possible to suppress an oxidation reaction between the formed metal film F, the plating solution L, or the crystals C of the plating solution L. Note that the supply source 81 may be an air compressor that compresses air (atmosphere) as long as such a reaction can be reduced. The supply source 81 may be provided with a purification filter for purifying the gas, such as a HEPA filter.

[0032] The humidifier 82 is a device that humidifies the gas A supplied from the supply source 81 by turning water into particles or water vapor. This allows the humidified gas A to be supplied to the supply port 83A by adjusting the pressure of the gas A from the supply source 81. The humidifier 82 may be a heating type, ultrasonic type, or spray type humidifier. The humidifier mechanism 80B is composed of the supply source 81, the humidifier 82, and a pipe for sending the gas A to the space S. For example, a nozzle that sends the gas A directly to the space S from below the enclosure member 80A without passing through the supply port 83A may be provided as a part of the humidifier mechanism 80B. For example, when an ultrasonic humidifier is used, the water particles can be made finer than other methods, so that the heat transferred to the film forming apparatus 1 via the plating solution L can be absorbed by the heat of vaporization of the water particles.

[0033] Meanwhile, an exhaust port 83B for exhausting the gas A from the space S is formed in the side wall portion 80a of the enclosing member 80A on the electrolyte membrane 13 side. In this embodiment, a plurality of (for example, two) exhaust ports 83B are provided in the side wall portion 80a, and a suction device 84 for sucking the gas A in the space S is connected to the exhaust ports 83B. The suction device 84 is not particularly limited as long as it can suck the gas A, and examples of the suction device 84 include an air pump and a blower.

[0034] 1(a), in this embodiment, the supply ports 83A face a side wall portion 80a on the base material B side of the enclosing member 80A across the space S so that the gas A supplied from each supply port 83A to the space S collides with each other to generate an airflow toward the electrolyte membrane 13 (masking material 60) side. Each exhaust port 83B is provided at a position coinciding with the supply port 83A when viewed from the direction in which the housing body 15 moves, but the number and positions of the exhaust ports 83B are not particularly limited as long as an airflow toward the electrolyte membrane 13 side can be generated in the space S and the gas A can be sucked in.

[0035] The film forming apparatus 1 further includes a control device 90. In the following film forming method, the control device 90 controls the driving of the linear actuator 70, the energization of the power source 14, the driving of the circulation pump 59, the supply of the gas A by the supply source 81, the humidification by the humidifier 82, and the suction by the suction device 84. However, the film forming method described below may be performed manually or under the control of the control device 90.

[0036] A method for forming a metal film will be described below with reference to Fig. 2. In this method, a screen mask 62 having through-parts 68 of a predetermined pattern P is sandwiched between the electrolyte membrane 13 and a substrate B, and a metal film F of the predetermined pattern P is formed on the surface of the substrate B by electrolytic plating.

[0037] First, in a placing step S1, the substrate B is placed on the placing table 40. Specifically, the substrate B is accommodated in the recess 41 of the placing table 40. Next, in a pressing step S2, the linear actuator 70 is driven to move the housing 15 toward the placing table 40, and the masking material 60 is brought into contact with the surface of the substrate B. This allows the screen mask 62, in which the through-portions 68 of the predetermined pattern P are formed, to be placed on the substrate B. As shown in FIG. 3(a), in a state in which the substrate B is covered with the screen mask 62, the substrate B is pressed by the screen mask 62 through the electrolyte membrane 13 by the liquid pressure of the plating solution L sealed in the housing 15 by the electrolyte membrane 13. This allows the plating solution L to be supplied to the housing space 15a, and the pressure of the plating solution L in the housing space 15a can be set to the pressure set by the pressure regulating valve 54. As a result, the substrate B is pressed by the screen mask 62 through the electrolyte membrane 13 by the liquid pressure of the plating solution L.

[0038] Next, a film-forming step S3 is performed. Here, as shown in FIG. 3(a), a voltage is applied from a power source 14 between the anode 11 in contact with the plating solution L and the substrate B while the substrate B is pressed with a screen mask 62. As a result, metal ions contained in the plating solution L pass through the electrolyte membrane 13, and a metal film F derived from the metal ions is formed on the substrate B in a predetermined pattern P. At this time, a part of the plating solution L contained in the containing space 15a seeps out through the electrolyte membrane 13 to the masking material 60 side.

[0039] In this way, the metal film F can be formed while circulating the plating solution L by driving the circulation pump 59 in the circulation path 50 between the tank 58 in which the plating solution L is stored and the container 15. The liquid pressure of the plating solution L in the container space 15a also acts on the plating solution filled in the through-portion 68, so that a homogeneous metal film F can be formed under a constant liquid pressure. During film formation, a portion of the plating solution L passes through the electrolyte membrane 13 together with the metal ions passing through the electrolyte membrane 13 due to the application of a voltage, so that moisture is stably secured in the through-portion 68 of the screen mask 62. This allows the metal ions to be stably precipitated on the surface of the substrate B. In this embodiment, a heater for heating the plating solution L may be provided in any of the circulation path 50, the tank 58, and the container 15. This allows the plating solution L to be heated to increase the film formation speed of the metal film F.

[0040] In the film forming step S3, a metal film F having a predetermined thickness is formed by energizing for a predetermined time, and then a separation step S4 is performed. In this step, the circulation pump 59 is stopped and the liquid pressure of the plating solution L in the housing body 15 is released (the liquid pressure is lowered to atmospheric pressure). The linear actuator 70 is driven to move the housing body 15 in a direction away from the mounting table 40, and the electrolyte membrane 13 is separated from the masking material 60. Since the masking material 60 is attached to the housing body 15, even if the weight of the plating solution L acts on the electrolyte membrane 13, excessive deformation of the electrolyte membrane 13 can be held by the screen mask 62. As shown in FIG. 1(a), the plating solution L may be discharged from the housing space 15a of the housing body 15 before the separation step S4 is performed.

[0041] Next, a gas supply step S5 is performed. In this step, gas A is supplied from a supply source 81 to a humidifier 82, and the supplied gas A is humidified by the humidifier 82. The humidified gas A is supplied to a space S enclosed by an enclosure member 80A via a supply port 83A. Meanwhile, the gas A supplied to the space S is sucked by a suction device 84 via an exhaust port 83B.

[0042] In this manner, the enclosing member 80A encloses the space S between the substrate B and the housing 15, thereby making it possible to prevent the cleanliness of the substrate B and the masking material 60 adjacent to the space S from being reduced due to contamination from the outside air, etc. As a result, it is possible to prevent poor deposition of the metal coating F.

[0043] Furthermore, the humidifying mechanism 80B causes the humidified gas A to flow into the space S enclosed by the enclosing member 80A toward the masking material 60 (electrolyte membrane 13), thereby suppressing crystallization of the plating solution L on the surface of the masking material 60 (electrolyte membrane 13). In particular, since the masking material 60 is not easily wetted by the plating solution L, the plating solution L is prone to crystallization, but the humidified gas A can suppress such crystallization. This makes it possible to suppress corrosion of the film forming apparatus 1 by the concentrated plating solution caused by dissolving the crystals.

[0044] In particular, in this embodiment, a supply port 83A is formed in the sidewall portion 80a of the enclosing member 80A on the substrate B side, and an exhaust port 83B is formed in the sidewall portion 80a of the enclosing member 80A on the electrolyte membrane 13 side, so that an airflow of gas A toward the masking material 60 is generated. This makes it possible to suppress condensation on the surface of the substrate B after film formation and on the surface of the new substrate B before film formation after replacement. Furthermore, the gas A supplied to the space S from each supply port 83A collides with each other, generating an airflow toward the electrolyte membrane 13 side, so that such an effect can be expected to be even more pronounced.

[0045] The inventors prepared a plating solution of copper sulfate aqueous solution, sprayed it on each of two glass plates, and then left it in an atmosphere of 40°C, with one glass plate left unhumidified (20-23°C x 16-18% RH) and the other left humidified (20-23°C x 50-80% RH). As a result, the water in the plating solution evaporated and crystallized immediately after spraying on the non-humidified plate, but the crystallization progressed slowly on the humidified plate, and the progress of crystallization could be suppressed even after 10 minutes. As a result, it was found that the crystallization of copper sulfate can be suppressed by humidification. [Explanation of symbols]

[0046] 1: film forming device, 13: electrolyte membrane, 14: power source, 15: container, 60: masking material, 70: linear actuator (moving device), 80A: enclosure member, 80B: humidification mechanism, 80a: side wall portion, 81: supply source, 83A: supply port, 83B: exhaust port, 84: suction device, L: plating solution, F: metal film, P: predetermined pattern

Claims

1. A film forming apparatus for forming a metal film on a substrate by electrolytic plating using metal ions that have migrated through an electrolyte membrane, comprising: The film forming apparatus includes: a container in which a plating solution containing metal ions for film formation is contained and sealed with the electrolyte membrane; A moving device that moves the container relative to the base material; a pressing mechanism that applies a liquid pressure of the plating solution in the container to the electrolyte membrane to press the base material via the electrolyte membrane; an anode contained in the container and spaced apart from the electrolyte membrane; a power source that applies a voltage between the anode and the substrate while the substrate is pressed by the pressing mechanism; an enclosure member that encloses a space between the base material and the container when the base material and the container are separated from each other; a humidification mechanism for flowing humidified gas toward the electrolyte membrane in the space enclosed by the enclosing member.

2. a supply port for supplying the gas to the space is formed in a side wall portion of the surrounding member on the base material side, an exhaust port for exhausting the gas from the space is formed in a side wall portion of the enclosure member on the electrolyte membrane side, 2. The metal film forming apparatus according to claim 1, wherein the exhaust port is connected to a suction device that sucks in the gas.

3. The surrounding member has a plurality of supply ports formed therein, The metal coating deposition apparatus according to claim 2, characterized in that the plurality of supply ports are arranged opposite the side wall portion of the enclosing member on the substrate side, across the space, so that the gas supplied to the space from each supply port collides with another gas, thereby generating an airflow toward the electrolyte membrane.

4. 2. The metal film forming apparatus according to claim 1, wherein the humidifying mechanism has a supply source for supplying an inert gas as the gas.

5. the membrane forming apparatus further includes a masking material that is attached to the container at a position facing the electrolyte membrane, has a through-portion having a predetermined pattern, and covers the base material; The metal film forming apparatus according to claim 1, characterized in that the film forming apparatus is an apparatus for forming a metal film having the predetermined pattern on the substrate by electrolytic plating with the masking material sandwiched between the electrolyte membrane and the substrate.

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