Multi-Die Interconnect

Abstract

An apparatus is disclosed that includes a molded multi-die high density interconnect including a bridge die having a first plurality of interconnects and a second plurality of interconnects. The apparatus also includes a first die having a first plurality of contacts and a second plurality of contacts, the second plurality of contacts being coupled to the first plurality of interconnects of the bridge die. The apparatus also includes a second die having a first plurality of contacts and a second plurality of contacts, the second plurality of contacts being coupled to the second plurality of interconnects of the bridge die. The coupled second plurality of contacts and interconnects have a height that is smaller than the first plurality of contacts of the first die and the second die.

Description

[Technical field]

[0001] The present disclosure relates generally to semiconductor devices including multi-die interconnects, and more particularly, but not exclusively, to multi-die high density interconnects and multi-die high density interconnect packaged devices and techniques for their manufacture. [Background technology]

[0002] Integrated circuit technology has achieved great advances in increasing computing power by miniaturizing active components. Various packaging technologies, such as multi-die packages, can be found in many electronic devices, including processors, servers, radio frequency (RF) integrated circuits, and the like. High density interconnect technology becomes cost effective in high pin count devices. Advanced packaging and processing techniques, including high density interconnect, support system-on-chip (SOC) devices, which may include multiple functional blocks, each designed to perform a specific function, such as, for example, a microprocessor function, a graphics processing unit (GPU) function, a communication function (e.g., Wi-Fi, Bluetooth, and other communications).

[0003] The industry offers two main technologies that enable high density interconnects in package designs: (1) Chip-on-Wafer-on-Substrate (CoWoS) and (2) Embedded Multi-die Interconnect Bridge (EMIB). Generally, the CoWoS configuration offers an interposer that allows good Si-Si bonding. However, the use of the interposer and through-silicon vias increases the fabrication cost and package size. The EMIB configuration offers limited high density and fine pitch parts, but the yield is low due to the surface conditions in the fine pitch area. Summary of the Invention [Problem to be solved by the invention]

[0004] Therefore, there is a need for systems, devices, and methods that overcome the shortcomings of conventional interconnect designs, including the methods, systems, and devices provided herein in the disclosure that follows. [Means for solving the problem]

[0005] The following provides a simplified summary of one or more aspects and / or examples related to the apparatus and methods disclosed herein. As such, the following summary should not be considered an extensive overview of all contemplated aspects and / or examples, nor should it be considered to identify key or critical elements of all contemplated aspects and / or examples or to delineate the scope related to any particular aspect and / or example. As such, the following summary is intended solely to present certain concepts related to one or more aspects and / or examples related to the apparatus and methods disclosed herein in a simplified form prior to the detailed description presented below.

[0006] According to various aspects disclosed herein, at least one aspect includes an apparatus including a multi-die interconnect. The apparatus also includes a bridge die having a first plurality of interconnects and a second plurality of interconnects. The apparatus also includes a first die having a first plurality of contacts and a second plurality of contacts, the second plurality of contacts of the first die being coupled to the first plurality of interconnects of the bridge die, and both of the second plurality of contacts of the first die having a height smaller than the first plurality of contacts of the first die, and a second die having a first plurality of contacts and a second plurality of contacts, the second plurality of contacts of the second die being coupled to the second plurality of interconnects of the bridge die, and both of the second plurality of contacts of the second die having a height smaller than the first plurality of contacts of the second die.

[0007] According to various aspects disclosed herein, at least one aspect includes a method for making a device having a multi-die interconnect. The method also includes providing a bridge die having a first plurality of interconnects and a second plurality of interconnects, and providing a bridge die having a first plurality of interconnects and a second plurality of interconnects. The method also includes coupling a first die having a first plurality of contacts and a second plurality of contacts to the first plurality of interconnects of the bridge die using the second plurality of contacts of the first die, where both the second plurality of contacts of the first die and the first plurality of interconnects have a height smaller than the first plurality of contacts of the first die. The method also includes coupling a second die having a first plurality of contacts and a second plurality of contacts to the second plurality of interconnects of the bridge die using the second plurality of contacts of the second die, where both the second plurality of contacts of the second die and the second plurality of interconnects have a height smaller than the first plurality of contacts of the second die.

[0008] Other features and advantages associated with the apparatus and methods disclosed herein will become apparent to one with skill in the art based on the following drawings and detailed description.

[0009] A more complete appreciation of the same will be readily obtained as the aspects of the present disclosure and many of its attendant advantages become better understood by reference to the following detailed description, taken in conjunction with the accompanying drawings, which are presented merely to illustrate and not to limit the disclosure, and in which: [Brief description of the drawings]

[0010] [Figure 1] 1 is a partial cross-sectional view of a multi-die high density interconnect in accordance with at least one aspect of the present disclosure. [Diagram 2] FIG. 2 is a partial view of a multi-die package according to at least one aspect of the present disclosure. [Figure 3A] 1A-1D illustrate a portion of a process for making a multi-die package in accordance with at least one aspect of the present disclosure. [Figure 3B] 1A-1D illustrate a portion of a process for making a multi-die package in accordance with at least one aspect of the present disclosure. [Figure 3C] 1A-1D illustrate a portion of a process for making a multi-die package in accordance with at least one aspect of the present disclosure. [Figure 3D] 1A-1D illustrate a portion of a process for making a multi-die package in accordance with at least one aspect of the present disclosure. [Figure 3E] 1A-1D illustrate a portion of a process for making a multi-die package in accordance with at least one aspect of the present disclosure. [Figure 3F] 1A-1D illustrate a portion of a process for making a multi-die package in accordance with at least one aspect of the present disclosure. [Figure 3G] 1A-1D illustrate a portion of a process for making a multi-die package in accordance with at least one aspect of the present disclosure. [Figure 3H] 1A-1D illustrate a portion of a process for making a multi-die package in accordance with at least one aspect of the present disclosure. [Figure 4A] 1A-1C illustrate portions of another process for making a multi-die package in accordance with at least one aspect of the present disclosure. [Figure 4B] FIG. 1 illustrates a portion of another process for making a multi-die package in accordance with at least one aspect of the present disclosure. [Figure 4C] 1A-1C illustrate portions of another process for making a multi-die package in accordance with at least one aspect of the present disclosure. [Diagram 5] FIG. 1 illustrates components of an integrated device according to one or more embodiments of the present disclosure. [Figure 6] FIG. 1 illustrates an example mobile device, in accordance with one or more aspects of the present disclosure. [Figure 7] FIG. 1 illustrates various electronic devices that may be integrated with any of the above devices, according to one or more aspects of the present disclosure. [Figure 8] FIG. 1 illustrates a flowchart of a method for manufacturing a device according to one or more embodiments of the present disclosure. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] In accordance with common practice, features illustrated by the drawings may not be drawn to scale. Thus, dimensions of illustrated features may be arbitrarily expanded or reduced for clarity. In accordance with common practice, some of the drawings have been simplified for clarity. Thus, the drawings may not show all components of a particular apparatus or method. Moreover, like reference numerals denote like features throughout the specification and figures.

[0012] Aspects of the present disclosure are illustrated in the following description and related drawings directed to specific embodiments. Alternative aspects or embodiments may be devised without departing from the scope of the teachings herein. In addition, well-known elements of the exemplary embodiments herein may not be described in detail or may be omitted so as not to obscure the relevant details of the teachings in the present disclosure.

[0013] In some described exemplary implementations, instances are identified where portions of the structure and operation of various components may be derived from known conventional techniques and configured in accordance with one or more exemplary embodiments. In such instances, some internal details of the structure and / or operation of known conventional components may be omitted to help avoid potentially obscuring the concepts illustrated in the exemplary embodiments disclosed herein.

[0014] The terms used herein are for the purpose of describing particular embodiments only and are not intended to be limiting. As used herein, the singular forms "a", "an" and "the" are intended to include the plural unless the context clearly indicates otherwise. It is further understood that the terms "comprises", "comprising", "includes" and / or "including" as used herein specify the presence of stated features, integers, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof.

[0015] Various embodiments disclose a molding process (e.g., using a reusable silicon or glass carrier) that precisely fixes the active / logic die without significant movement (x-axis movement, y-axis movement, and tilt) during the bridge die attach process. This facilitates high yields when attaching the bridge die to multiple dies in a multi-die package. One or more bridge dies can be attached onto the molded and precisely fixed multi-die components to facilitate high density die-to-die interconnection. According to various disclosed embodiments, a process / packaging architecture can be utilized to improve die attach yields when using fine bump pitches (e.g., 55 μm). Various embodiments allow for improved die interconnection and fixation and reduced misalignment, thereby improving yields during fine bump pitch die attach processes.

[0016] In various disclosed aspects, the molded multi-die configuration is utilized in a bridge die attach procedure to form the molded multi-die high density interconnect packaging architecture described herein. The molded and precisely fixed multi-die configuration facilitates attaching the bridge die to the high density interconnect. However, it will be appreciated that the molding process is provided merely to aid in illustration, and the various disclosed aspects should not be construed as limited to these values ​​or example applications.

[0017] In various disclosed embodiments, a bridge die having a fine bump pitch is attached directly to a die to form a molded multi-die high density interconnect packaging architecture as described herein. The bridge die having a fine bump pitch may be used in various applications such as high bandwidth memory. In some embodiments, the fine bump pitch may be in the range of 40 μm to 55 μm. However, it will be appreciated that the exemplary ranges are provided merely to aid in illustration and that the various disclosed and claimed embodiments should not be construed as limited to these values ​​or exemplary applications.

[0018] At least some advantages of the proposed packaging architecture include: (1) precise Si-Si bonding / attach with minimal misalignment (x-axis, y-axis, and tilt) that causes yield loss, (2) high density interconnect (bridge) provided only in limited areas of the bridge, and (3) no through silicon vias, among other advantages as will be appreciated from the disclosure provided herein.

[0019] FIG. 1 illustrates a device having a molded multi-die high density interconnect 100 according to one or more embodiments of the present disclosure. In some embodiments, the molded multi-die high density interconnect 100 includes a bridge die 140 having a first plurality of interconnects 141 and a second plurality of interconnects 142. In some embodiments, the plurality of interconnects may be bonded onto at least one metallization layer of the bridge die. The at least one metallization layer may include traces according to an application-specific routing pattern. The first plurality of interconnects 141 and the second plurality of interconnects 142 may be formed from any highly conductive material, such as copper (Cu), aluminum (Al), silver (Ag), gold (Au), or other conductive materials, alloys, or combinations thereof. Alternatively or additionally, the first plurality of interconnects 141 and the second plurality of interconnects 142 may be formed as die bumps, including, for example, wire stud bumps, plated bumps, and solder bumps.

[0020] The first die 110 has a first plurality of contacts 112 and a second plurality of contacts 114. The second plurality of contacts 114 of the first die 110 may have a height less than the first plurality of contacts 112. In some embodiments, the first plurality of contacts 112 may be copper pillar bumps. In some embodiments, the second plurality of contacts 114 may be pads. In other embodiments, the first plurality of contacts 112 may be solder bumps and the second plurality of contacts 114 may be wire stud bumps. The second plurality of contacts 114 are coupled to the first plurality of interconnects 141 of the bridge die 140. It will be appreciated that the various embodiments disclosed are not limited to a particular configuration of the first die 110 contacts (112, 114) or the bridge die 140.

[0021] The second die 120 has a first plurality of contacts 122 and a second plurality of contacts 124. The second plurality of contacts 124 may have a height less than the first plurality of contacts 122. In some embodiments, the first plurality of contacts 122 may be copper pillar bumps. In some embodiments, the second plurality of contacts 124 may be pads. In other embodiments, the first plurality of contacts 122 may be solder bumps and the second plurality of contacts 124 may be wire stud bumps. The second plurality of contacts 124 are coupled to a second plurality of interconnects 142 of the bridge die 140. It will be appreciated that the various embodiments disclosed are not limited to a particular configuration of the second die 120 contacts (122, 124) or the bridge die 140 interconnects 142.

[0022] In some aspects, the first plurality of interconnects 141 of the bridge die 140 have a smaller height than the first plurality of contacts 112 of the first die 110. Also, the first plurality of interconnects 141 of the bridge die 140 have a smaller height than the first plurality of contacts 122 of the second die 120.

[0023] In some aspects, the first plurality of contacts 112 of the first die 110 and the first plurality of contacts 122 of the second die 120 are coupled to a plurality of connectors (not visible) outside the multi-die package 100. In some aspects, the first plurality of contacts 112 and 122 may be coupled to a package substrate to the connectors outside the multi-die package 100. In other aspects, the first plurality of contacts 112 and 122 may be coupled to an (intermediate) interposer before being coupled to the connectors outside the multi-die package 100. In further aspects, the first plurality of contacts 112 and 122 may be coupled to the connectors outside the multi-die package 100 via a passive network (e.g., resistance, capacitance, and / or inductance).

[0024] The first die 110 and the second die 120 are embedded in a molding compound 130 to prevent misalignment of the bridge die 140. This is done prior to attachment of the bridge die (see the fabrication process description below for details). The first and second plurality of interconnects 141 and 142 of the bridge die 140 may be configured as die bumps (e.g., small copper pillars with solder pads) having a fine pitch in the range of approximately 40μ to 55μm. It will be appreciated that the pitch of the interconnects (141, 142) and associated (logic) die contacts (114, 124) of the bridge die 140 is generally finer (i.e., smaller) than the pitch of the contacts (112, 122) that are not bonded to the bridge die (140).

[0025] 2 illustrates an apparatus having a molded multi-die high density interconnect package 200 according to one or more embodiments of the present disclosure. After attaching the bridge die 140 to the first die 110 and the second die 120, the first plurality of interconnects 141 (not visible) and the second plurality of interconnects 142 (not visible) of the bridge die 140 may be embedded in a first underfill 148. In some embodiments, the first plurality of contacts 112 of the first die 110 are copper pillars, which may have solder bumps 113, and the second plurality of contacts 114 of the first die 110 are bumps having a fine pitch that matches the pitch of the bridge die interconnects (also embedded in the first underfill 148). Similarly, the first plurality of contacts 122 of the second die 120 are copper pillars, which may have solder bumps 123, and the second plurality of contacts 124 of the second die 120 are bumps having a fine pitch that matches the pitch of the bridge die interconnects (also embedded in the first underfill 148). As mentioned above, in an alternative embodiment, the second plurality of contacts 114 and the second plurality of contacts 124 may be pads having a fine pitch that matches the pitch of the bridge die interconnects 141, 142.

[0026] The package 200 may further include a package substrate 160 having a cavity 165 and a plurality of contact pads 162. The bridge die 140 may be embedded in the cavity 165 and attached using an adhesive 166. The plurality of contact pads 162 are coupled to the first plurality of contacts 112 of the first die 110 and the first plurality of contacts 122 of the second die 120. An optional second underfill 150 may be disposed between the molding compound 130 and the package substrate 160. In some aspects, as shown, the second underfill 150 encapsulates the plurality of contact pads 162, the first plurality of contacts 112 of the first die 110, the first plurality of contacts 122 of the second die 120, and at least a portion of the first underfill 148.

[0027] It will be appreciated that the multi-die package 200 has a number of connectors 170 on the outside of the multi-die package 200 that allow the package 200 to be coupled to an external device. The number of connectors 170 are illustrated as ball grid arrays (BGA) with a number of solder balls. It will further be appreciated that at least some of the number of contact pads 162 are electrically coupled to some of the connectors 170 (through internal package routing not shown to simplify the illustration). It will further be appreciated that the number of contact pads 162 are electrically coupled to both the first die 110 and the second die 120, and electrically coupled to the bridge die 140 through the first die 110 and the second die 120. Specifically, the number of contact pads 162 can be coupled to the first number of contacts 112 of the first die 110 using solder pads / bumps 113, and can be coupled to the first number of contacts 122 of the second die 120 using solder pads / bumps 123. The first plurality of contacts 112 of the first die 110 are coupled to pads 111, which may be electrically coupled to a conductive layer (e.g., through internal package routing) within the first die 110 and / or to the bridge die 140 through internal package routing (not shown to simplify the figures) within the multi-die package 200. Similarly, the second plurality of contacts 122 of the second die 120 are coupled to pads 121, which may be electrically coupled to a conductive layer within the second die 120 and / or to the bridge die 140 through internal package routing (not shown to simplify the figures) within the multi-die package 200. Thus, the multi-die package 200 configuration allows signaling and power to be distributed within the multi-die package 200 and to external devices as needed. However, it will be appreciated that the various aspects provided herein are for illustrative purposes only and should not be construed as limiting the various aspects disclosed and claimed.

[0028] Contact pad 162, contacts 112 and 122, and pads 111 and 121 may be formed from any highly conductive material, such as copper (Cu), aluminum (Al), silver (Ag), gold (Au), or other conductive materials, alloys, or combinations thereof. For example, different types of connectors and / or contacts, materials, and configurations may be used, as is known, so long as the configurations allow for functional electrical coupling of the die to devices internal to the package and to external devices.

[0029] In order to fully illustrate the design aspects of the present disclosure, a method of fabrication is provided. Other methods of fabrication are possible, and the described method of fabrication is provided only to aid in understanding the concepts disclosed herein.

[0030] 3A illustrates a portion of a process for making a multi-die package 300, for example, having a molded multi-die high density interconnect package 300 in accordance with at least one embodiment of the present disclosure, which begins with die placement and attachment of a first die 310 and a second die 320 attached to a temporary support film 302 disposed on a carrier 301.

[0031] 3B illustrates a portion of a process for making a multi-die package 300 with molded multi-die high density interconnects according to at least one embodiment of the present disclosure, which continues with attaching a first die 310 and a second die 320 to a temporary support film 302 disposed on a carrier 301. In this portion, a molding process is performed to embed the first die 310 and the second die 320 in a molding compound 330 to prevent die shifting during further processing.

[0032] 3C illustrates a portion of a process for making a multi-die package 300 with molded multi-die high density interconnects according to at least one embodiment of the present disclosure. The process continues by embedding the first die 310 and the second die 320 in a molding compound 330. In this portion, the first die 310 and the second die 320 are attached upside down to a temporary support film 302' disposed on a carrier 301'. In this process, the pads 311 of the first die 310 and the pads 321 of the second die 320 are exposed for further processing.

[0033] 3D illustrates a portion of a process for making a multi-die package 300 with molded multi-die high density interconnects according to at least one embodiment of the present disclosure. The process continues by mounting the first die 310 and the second die 320 embedded in the molding compound 330 upside down onto a temporary support film 302' disposed on a carrier 301'. In this portion, photoresist 345 is deposited on the pads 311 of the first die 310 and the pads 321 of the second die 320 and patterned to provide access to the pads 311 of the first die 310 and the pads 321 of the second die 320 for further processing.

[0034] 3E illustrates a portion of a process for making a multi-die package 300 with molded multi-die high density interconnects according to at least one embodiment of the present disclosure. The process continues by attaching the first die 310 and the second die 320 embedded in the molding compound 330 upside down to a temporary support film 302' disposed on a carrier 301'. In this portion, a first plurality of contacts 312 of the first die 310 are formed in the openings of the photoresist 345 on the pads 311. Also, a first plurality of contacts 322 of the second die 320 are formed in the openings of the photoresist 345 on the pads 321. In some embodiments, the first plurality of contacts 312 of the first die 310 are copper pillars, which may have solder bumps 313. Similarly, the first plurality of contacts 322 of the second die 320 are copper pillars, which may have solder bumps 323. In some aspects, the first plurality of contacts 312 of the first die 310 are formed in the openings in the photoresist 345, thereby ensuring that the second plurality of contacts of the first die 310 (e.g., pads of the first die 310 not exposed by the photoresist 345) have a smaller height than the first plurality of contacts 312. Similarly, the first plurality of contacts 322 of the second die 320 are (also) formed in the openings in the photoresist 345, thereby ensuring that the second plurality of contacts of the second die 320 (e.g., pads of the second die 320 not exposed by the photoresist 345) have a smaller height than the first plurality of contacts 312.

[0035] 3F illustrates a portion of a process for making a multi-die package 300 with molded multi-die high density interconnects according to at least one embodiment of the present disclosure. The process continues by mounting the first die 310 and the second die 320 embedded in the molding compound 330 upside down onto a temporary support film 302' disposed on a carrier 301'. In this portion, the photoresist is removed to expose the first plurality of contacts 312 of the first die 310 and the first plurality of contacts 322 of the second die 320. A bridge die 340 having a first plurality of interconnects 341 and a second plurality of interconnects 342 is bonded to the first die 310 and the second die 320. In some embodiments, the first plurality of interconnects 341 and the second plurality of interconnects 342 may be wire stud bumps, copper pillars that may have solder bumps, or any suitable bumping / connection configuration. In this configuration, the second plurality of contacts 314 of the first die 310 and the second plurality of contacts 324 of the second die 320 may be pads. Coupling of the interconnects 341 and contacts 314 to the interconnects 342 and contacts 324 may be performed by solder reflow, a thermocompression process, or any other suitable process. However, the various aspects disclosed herein are not limited to the illustrated configuration. Any suitable electrical coupling technique may be used to couple the first plurality of interconnects 341 to the second plurality of contacts 314 of the first die 310 and the second plurality of interconnects 342 to the second plurality of contacts 324 of the second die 320. Additionally, a first underfill 348 is applied to fill the electrical bonds and provide additional mechanical stability to the die bridge 340 for further processing. In some aspects, the first plurality of interconnects 341 of the bridge die 340 are formed using a separate processing step (and using a different type of bonding technique), which allows the first plurality of interconnects 341 to have a smaller height than the first plurality of contacts 312 (e.g., copper pillars that may have solder bumps 313) of the first die 310.Similarly, because the second plurality of interconnects 342 of the bridge die 340 are (also) formed using a separate processing step (and using a different type of bonding technique), this enables the second plurality of interconnects 342 to have a smaller height than the first plurality of contacts 322 (e.g., copper pillars that may have solder bumps 323) of the second die 320.

[0036] 3G illustrates a portion of a process for making a multi-die package 300 with molded multi-die high density interconnects according to at least one embodiment of the present disclosure. The process continues by attaching the first die 310 and the second die 320 embedded in the molding compound 330 upside down to a temporary support film 302' disposed on a carrier 301'. A bridge die 340 is bonded to the first die 310 and the second die 320. A package substrate 360 ​​having a cavity 365 is provided in the portion. An adhesive 366 is used to bond the package substrate 360 ​​to the bridge die 340. Also, pads 362 are used to bond the package substrate 360 ​​to the first plurality of contacts 312 of the first die 310 and the first plurality of contacts 322 of the second die 320. The bonding of the pads 362 to the contacts 312 and 322 may be performed by a solder reflow process or any other suitable process. It will be appreciated that the various aspects disclosed herein are not limited to the configurations shown, and that the adhesive and pad bonds described above are provided by way of example only, and that other bonding techniques may be used in accordance with the various aspects disclosed.

[0037] 3H illustrates a portion of a process for making a multi-die package 300 with molded multi-die high density interconnects according to at least one embodiment of the present disclosure. The process continues by embedding the first die 310 and the second die 320 upside down in a molding compound 330. A bridge die 340 is bonded to the first die 310 and the second die 320. A package substrate 360 ​​has a cavity 365 in which the bridge die 340 is embedded. The package substrate 360 ​​is bonded to the first plurality of contacts 312 of the first die 310 and the first plurality of contacts 322 of the second die 320. In this portion, an optional second underfill 350 is disposed between the package substrate 360 ​​and the first die 310 and the second die 320 embedded in the molding compound 330. In this portion of the process, an optional second underfill 350 embeds the contacts (312 and 322) and bridge die 340 along with the first underfill 348. The ball attach process can be used to form external connectors 370 (solder balls, BGA, etc.) that are attached to the package substrate 360 ​​using conventional techniques. However, it will be appreciated that other external connectors 370 can be used and that the various aspects are not limited to the illustrated example. Additionally, the temporary support film 302' and carrier 301' (not shown) are removed. It will be appreciated that the resulting multi-die package 300 is similar to the multi-die package 200 of FIG. 2 except that it is inverted.

[0038] FIG. 4A illustrates a portion of another process for fabricating a multi-die package 400 with molded multi-die high density interconnects according to at least one embodiment of the present disclosure. The initial fabrication process is similar to that described above with respect to FIGS. 3A-3E, and therefore will not be repeated. Thus, the process continues with mounting the first die 410 and the second die 420 embedded in the molding compound 430 upside down onto a temporary support film 402 disposed on a carrier 401. In this portion, the photoresist (not shown) is removed to expose the first plurality of contacts 412 of the first die 410 and the first plurality of contacts 422 of the second die 420. A bridge die 440 having a first plurality of interconnects 441 is bonded to the first die 410, and a second plurality of interconnects 442 of the bridge die 440 is bonded to the second die 420. In some embodiments, the first plurality of interconnects 441 and the second plurality of interconnects 442 may be wire stud bumps, copper pillars that may have solder bumps, or any suitable bumping / connection configuration. In this configuration, the second plurality of contacts 414 of the first die 410 and the second plurality of contacts 424 of the second die may be pads that allow for bonding to the interconnects 441 and 442. Bonding of the interconnects 441 and contacts 414 to the interconnects 442 and contacts 424 may be performed by solder reflow, a thermocompression process, or any other suitable process. However, the various embodiments disclosed herein are not limited to the configuration shown. It will be appreciated that in this configuration, no underfill is applied. In some aspects, the first plurality of interconnects 441 of the bridge die 440 are formed using a separate processing step (and using a different type of bonding technique), which allows the first plurality of interconnects 441 to have a smaller height than the first plurality of contacts 412 (e.g., copper pillars that may have solder bumps) of the first die 410.Similarly, because the second plurality of interconnects 442 of the bridge die 440 are (also) formed using a separate processing step (and using a different type of bonding technique), this allows the second plurality of interconnects 442 to have a smaller height than the first plurality of contacts 422 (e.g., copper pillars that may have solder bumps) of the second die 420.

[0039] 4B illustrates a portion of a process for making a multi-die package 400 with molded multi-die high density interconnects according to at least one embodiment of the present disclosure. The process continues by attaching the first die 410 and the second die 420 embedded in the molding compound 430 upside down to a temporary support film 402 disposed on a carrier 401. A bridge die 440 is bonded to the first die 410 and the second die 420. A package substrate 460 having a cavity 465 is provided in the portion. An adhesive 466 is used to bond the package substrate 460 to the bridge die 440. Also, pads 462 are used to bond the package substrate 460 to the first plurality of contacts 412 of the first die 410 and the first plurality of contacts 422 of the second die 420. The bonding of the pads 462 to the contacts 412 and 422 may be performed by a solder reflow process or any other suitable process. Thus, the various embodiments disclosed herein are not limited to the illustrated configuration. It will be appreciated that the adhesive and pad bonds described above are provided by way of example only, and that other bonding techniques may be used in accordance with various disclosed aspects.

[0040] 4C illustrates a portion of a process for making a multi-die package 400 with molded multi-die high density interconnects according to at least one embodiment of the present disclosure. The process continues by embedding the first die 410 and the second die 420 upside down in a molding compound 430. A bridge die 440 is bonded to the first die 410 and the second die 420. A package substrate 460 has a cavity 465 in which the bridge die 440 is embedded. The package substrate 460 is bonded to the first plurality of contacts 412 of the first die 410 and the first plurality of contacts 422 of the second die 420. In this portion, an underfill 450 is disposed between the package substrate 460 and the first die 410 and the second die 420 embedded in the molding compound 430. The underfill 450 also embeds the contacts (412 and 422) as well as the bridge die 440. Using conventional techniques, the solder balls of the BGA 470 are attached to a package substrate on the outside of the multi-die package 400. Additionally, the temporary support film 402 and carrier 401 are removed. It will be appreciated that the resulting multi-die package 400 is similar to the multi-die package 200 of FIG. 2, except that the bridge die 440 does not have a separate underfill 150 applied and the package is turned upside down.

[0041] It will be appreciated that the above fabrication process is provided merely as a schematic illustration of some of the aspects of the present disclosure, and is not intended to limit the scope of the present disclosure or the appended claims. Furthermore, many details in the fabrication process known to those skilled in the art may be omitted or combined in the outline process section to facilitate understanding of the various aspects disclosed without detailed representation of each detail and / or all possible process variations.

[0042] 5 illustrates components of an integrated device 500 according to one or more embodiments of the present disclosure. It will be appreciated that, despite the various configurations of the above-mentioned packages (e.g., packages 200, 300, and 400), package 501 has similar features and thus details will not be given here. Package 501 may be configured to couple to PCB 590. PCB 590 is also coupled to a power source 580 (e.g., a power management integrated circuit (PMIC)), which allows package 501 to be electrically coupled to PMIC 580. Specifically, one or more power (VDD) lines 591 and one or more ground (GND) lines 592 may be coupled to PMIC 580 to distribute power to PCB 590, package 501 via VDD BGA pin 525 and GND BGA pin 527. Each of the VDD line 591 and the GND line 592 may be formed from traces, shapes, or patterns in one or more metal layers (e.g., layers 1-6) of the PCB 590 coupled through one or more vias that penetrate an insulating layer that separates the metal layers 1-6 in the PCB 590. The PCB 590 may have one or more PCB capacitors (PCB caps) 595, which may be used to condition a power signal, as known to those skilled in the art. Additional connections and devices may be coupled to the package 501 through one or more additional BGA pins on the package 501 and / or may reach the package 501 through one or more additional BGA pins through the PCB 590. It will be appreciated that the illustrated configurations and descriptions are provided merely to aid in the description of various aspects disclosed herein. For example, the PCB 590 may have a greater or lesser number of metal and insulating layers, there may be multiple lines supplying power to various components, etc. Therefore, the above illustrative examples and associated figures should not be construed as limiting the various aspects disclosed and claimed herein.

[0043] FIG. 6 illustrates an exemplary mobile device according to some examples of the disclosure. Referring now to FIG. 6, a block diagram of a mobile device configured according to an exemplary aspect is depicted, generally designated as mobile device 600. In some aspects, the mobile device 600 may be configured as a wireless communication device. As shown, the mobile device 600 includes a processor 601. The processor 601 is communicatively coupled to a memory 632 via a link, which may be an inter-die link or an inter-chip link. The mobile device 600 also includes a display 628 and a display controller 626, which is coupled to the processor 601 and the display 628.

[0044] In some aspects, FIG. 6 may include a coder / decoder (codec) 634 (e.g., an audio and / or voice codec) coupled to the processor 601, a speaker 636 and a microphone 638 coupled to the codec 634, and a wireless controller 640 (which may include a modem, RF circuitry, filters, etc.) coupled to a wireless antenna 642 and the processor 601.

[0045] In certain aspects where one or more of the above-mentioned blocks are present, the processor 601, the display controller 626, the memory 632, the codec 634, and the wireless circuitry 640 can be included in a system-in-package or system-on-chip device 622, which may be implemented in whole or in part using the molded multi-die high density interconnect packages (e.g., 200, 300, 400) and techniques disclosed herein. The input device 630 (e.g., a physical or virtual keyboard), the power source 644 (e.g., a battery), the display 628, the input device 630, the speaker 636, the microphone 638, the wireless antenna 642, and the power source 644 may be external to the system-on-chip device 622 or may be coupled to components of the system-on-chip device 622, such as an interface or controller.

[0046] It should be noted that although FIG. 6 shows a mobile device 600, the processor 601 and memory 632 may also be incorporated into a set-top box, a music player, a video player, an entertainment unit, a navigation device, a personal digital assistant (PDA), a stationary data unit, a computer, a laptop, a tablet, a communications device, a mobile phone, or other similar device.

[0047] 7 illustrates various electronic devices that may be integrated with any of the above integrated devices, packages, or semiconductor devices according to various examples of the present disclosure. For example, a mobile phone device 702, a laptop computer device 704, and a stationary terminal device 706 may each be generally considered user equipment (UE) and may include a multi-die package 700 as described herein, which may be similar to the molded multi-die packages 200, 300, and 400 as described herein. The devices 702, 704, 706 illustrated in FIG. 7 are merely examples. Other electronic devices may also feature the molded multi-die high density interconnect device 700 including, but not limited to, a group of devices (e.g., electronic devices) including mobile devices, handheld personal communications system (PCS) units, portable data units such as personal digital assistants, global positioning system (GPS) enabled devices, navigation devices, set-top boxes, music players, video players, entertainment units, stationary data units such as meter reading equipment, communications devices, smartphones, tablet computers, computers, wearable devices, servers, routers, electronic devices implemented within automotive vehicles (e.g., autonomous vehicles), Internet of Things (IoT) devices, or any other device that stores or retrieves data or computer instructions, or any combination thereof.

[0048] The devices and functions disclosed above may be designed and configured in computer files (e.g., Register Transfer Level (RTL), Geometric Data Stream (GDS) Gerber, etc.) stored on a computer readable medium. Some or all of such files may be provided to a manufacturer who produces devices based on such files. The resulting products may include semiconductor wafers, which are then cut into semiconductor dies and packaged as semiconductor packages, integrated devices, system-on-chip devices, etc., which may then be used in the various devices described herein.

[0049] It will be appreciated that the various aspects disclosed herein may be described as functional equivalents of structures, materials, and / or devices described and / or recognized by those skilled in the art. For example, in one aspect, an apparatus may comprise means for performing the various functions described above. It will be appreciated that the foregoing aspects are provided by way of example only, and that the various aspects claimed are not limited to the specific content and / or figures cited as examples.

[0050] According to various aspects disclosed herein, at least one aspect includes an apparatus comprising a molded multi-die high density interconnect (e.g., 100, 200, 300, 400, and 501) including a bridge die (e.g., 140, 340, 440) having a first plurality of interconnects (e.g., 141, 341, 441) and a second plurality of interconnects (e.g., 142, 342, 442), and a first die (e.g., 110, 310, 410) having a first plurality of contacts (e.g., 112, 312, 412) and a second plurality of contacts (e.g., 114, 314, 414). The second plurality of contacts are coupled to the first plurality of interconnects of the bridge die. The coupled second plurality of contacts and the first plurality of interconnects have a height smaller than the first plurality of contacts of the first die. A second die (e.g., 120, 320, 420) having a first plurality of contacts (e.g., 122, 322, 422) and a second plurality of contacts (e.g., 124, 324, 424). The second plurality of contacts are coupled to the second plurality of interconnects of the bridge die. The coupled second plurality of contacts and the second plurality of interconnects have a height smaller than the first plurality of contacts of the second die.

[0051] Among other technical advantages, the various disclosed embodiments, at least in some embodiments, can reduce the height of the connections between the bridge die and the first and second dies when the bridge die is directly bonded to the first and second dies. Furthermore, precise placement of the bridge die, first and second dies allows for finer pitch of the connections. Furthermore, the package height can be further reduced by embedding the bridge die (e.g., 140, 340, 440) in a cavity of the substrate. Other technical advantages can be recognized from the various embodiments disclosed herein. These technical advantages are provided by way of example only and should not be construed as limiting the various embodiments disclosed herein.

[0052] From the above, it will be appreciated that there are various methods for fabricating the multi-die package disclosed herein. FIG. 8 shows a flow chart of a method 800 for fabricating a device having a molded multi-die high density interconnect package. The method includes, at block 802, providing a bridge die (e.g., 140) having a first plurality of interconnects (e.g., 141) and a second plurality of interconnects (e.g., 142). At block 804, the process continues by bonding a first die (e.g., 110) having a first plurality of contacts (e.g., 112) and a second plurality of contacts (e.g., 114) to the first plurality of interconnects of the bridge die. The bonded second plurality of contacts and the first plurality of interconnects have a height smaller than the first plurality of contacts of the first die. At block 806, the process continues by coupling a second die (e.g., 120) having a first plurality of contacts (e.g., 122) and a second plurality of contacts (e.g., 124) to the second plurality of interconnects of the bridge die, the coupled second plurality of contacts and second plurality of interconnects having a smaller height than the first plurality of contacts of the second die.

[0053] Thus, it will be appreciated that from the above disclosure, additional processes for manufacturing the various embodiments disclosed herein will be apparent to one of ordinary skill in the art, and that literal representations of the above processes have not been presented or shown in the accompanying drawings.

[0054] One or more of the components, processes, features, and / or functions shown in FIGS. 1-8 may be rearranged and / or combined as a single component, process, feature, or function, or may be incorporated as several components, processes, or functions. Additional elements, components, processes, and / or functions may be further added without departing from this disclosure. It is also noted that FIGS. 1-8 and the corresponding description in this disclosure are not limited to dies and / or ICs. In some implementations, FIGS. 1-8 and the corresponding description may be used to manufacture, make, provide, and / or produce an integrated device. In some implementations, the device may include a die, an integrated device, a die package, an integrated circuit (IC), a device package, an integrated circuit (IC) package, a wafer, a semiconductor device, or a package-on-package (PoP) device.

[0055] As used herein, terms such as "user equipment" (or "UE"), "user device," "user terminal," "client device," "communication device," "wireless device," "wireless communication device," "handheld device," "mobile device," "mobile terminal," "mobile station," "handset," "access terminal," "subscriber device," "subscriber terminal," "subscriber station," "terminal," and variations thereof, may interchangeably refer to any suitable mobile or fixed device capable of receiving wireless communication and / or navigation signals. These terms include, but are not limited to, music players, video players, entertainment units, navigation devices, communication devices, smartphones, personal digital assistants, stationary terminals, tablet computers, computers, wearable devices, laptop computers, servers, automotive devices in automotive vehicles, and / or other types of portable electronic devices that are typically carried by a person and / or have communication capabilities (e.g., wireless, cellular, infrared, short-range radio, etc.). These terms are also intended to include a device that communicates with another device capable of receiving wireless communication and / or navigation signals by a short-range wireless connection, an infrared connection, a wired connection, or other connection, etc., regardless of whether the satellite signal reception, assistance data reception, and / or location-related processing is performed on that device or on the other device. A UE may be embodied by any of several types of devices, including, but not limited to, a printed circuit (PC) card, a compact flash device, an external or internal modem, a wireless or wired phone, a smartphone, a tablet, a consumer tracking device, an asset tag, etc.

[0056] Wireless communication between electronic devices may be based on various technologies, such as Code Division Multiple Access (CDMA), W-CDMA, Time Division Multiple Access (TDMA), Frequency Division Multiple Access (FDMA), Orthogonal Frequency Division Multiplexing (OFDM), Global System for Mobile Communications (GSM), 3GPP Long Term Evolution (LTE), 5G New Radio, Bluetooth (BT), Bluetooth Low Energy (BLE), IEEE 802.11 (WiFi), and IEEE 802.15.4 (Zigbee / Thread) or other protocols that may be used within a wireless or data communication network. Bluetooth Low Energy (also called Bluetooth LE, BLE, and Bluetooth Smart).

[0057] The word "exemplary" is used herein to mean "serving as an example, instance, or illustration." Any detail described herein as "exemplary" should not be construed as advantageous over other examples. Likewise, the term "example" does not imply that all examples include the described features, advantages or modes of operation. Furthermore, particular features and / or structures may be combined with one or more other features and / or structures. Moreover, at least a portion of the apparatus described herein may be configured to perform at least a portion of the methods described herein.

[0058] It should be noted that the terms "connected" and "coupled," or any variation thereof, mean any direct or indirect connection or coupling between elements, unless the connection is expressly disclosed as being directly connected, and may encompass the presence of intermediate elements between two elements that are "connected" or "coupled" together through intermediary elements.

[0059] Any reference herein to an element using a designation such as "first," "second," etc. is not intended to limit the quantity and / or order of those elements. Rather, these designations are used as a convenient method of distinguishing between two or more elements and / or instances of an element. Also, unless otherwise stated, a set of elements can comprise one or more elements.

[0060] Those skilled in the art will appreciate that information and signals may be represented using any of a variety of different technologies and techniques. For example, the data, instructions, commands, information, signals, bits, symbols, and chips that may be referred to throughout the above description may be represented by voltages, currents, electromagnetic waves, magnetic fields or particles, optical fields or particles, or any combination thereof.

[0061] Nothing described, illustrated, or shown in this application is intended to publicly disclose any element, act, feature, benefit, advantage, or equivalent, whether or not that element, act, feature, benefit, advantage, or equivalent is recited in a claim.

[0062] Moreover, those skilled in the art will appreciate that the various example logical blocks, modules, circuits, and algorithmic actions described in connection with the examples disclosed herein can be implemented as electronic hardware, computer software, or a combination of both. To clearly illustrate this interchangeability of hardware and software, the various example components, blocks, modules, circuits, and actions have been described above generally in terms of their functionality. Whether such functionality is implemented as hardware or software depends on the particular application and design constraints imposed on the overall system. Those skilled in the art may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present disclosure.

[0063] Although some aspects have been described with respect to devices, it will be understood that these aspects also constitute a description of the corresponding methods, and thus blocks or components of the devices should also be understood as corresponding method actions or features of method actions. Similarly, aspects described with respect to or as method actions also constitute a description of corresponding blocks, or details or features of the corresponding devices. Some or all of the method actions can be performed by (or using) a hardware apparatus, such as, for example, a microprocessor, a programmable computer, or an electronic circuit. In some examples, some or more of the most important method actions can be performed by such an apparatus.

[0064] In the above detailed description, it is seen that various features are grouped together in the examples. This manner of disclosure should not be understood as an intention that the exemplary clauses have more features than are expressly stated in each clause. Rather, various aspects of the disclosure may include fewer than all features of each disclosed exemplary clause. Thus, the following clauses should be considered to be incorporated in the description, and each clause may stand alone as a separate example. Although each dependent clause may refer to a specific combination with one of the other clauses in the clause, the aspects of that dependent clause are not limited to that specific combination. It will be appreciated that other exemplary clauses may also include combinations of aspects of the dependent clause with the subject matter of any other dependent clause or independent clause, or combinations of any features with other dependent clauses and independent clauses. Unless a specific combination is not intended (e.g., conflicting aspects such as defining an element as both an insulator and a conductor) is expressly expressed or can be easily inferred, the various aspects disclosed herein expressly include these combinations. It is further contemplated that aspects of a clause may be included in any other independent clause, even if the clause is not directly dependent on an independent clause.

[0065] Example implementations are described in the following numbered clauses. Clause 1. An apparatus having a multi-die interconnect, the multi-die interconnect comprising: a bridge die having a first plurality of interconnects and a second plurality of interconnects; a first die having a first plurality of contacts and a second plurality of contacts, wherein the second plurality of contacts of the first die are coupled to the first plurality of interconnects of the bridge die, and both of the second plurality of contacts of the first die have a height smaller than the first plurality of contacts of the first die; and a second die having a first plurality of contacts and a second plurality of contacts, wherein the second plurality of contacts of the second die are coupled to the second plurality of interconnects of the bridge die, and both of the second plurality of contacts of the second die have a height smaller than the first plurality of contacts of the second die. Clause 2. The apparatus of clause 1, wherein the first die and the second die are embedded in a molding compound. Clause 3. The apparatus of clause 1 or 2, wherein the first plurality of interconnects and the second plurality of interconnects of the bridge die have a smaller pitch than the first plurality of contacts of the first die and the first plurality of contacts of the second die. Clause 4. The apparatus of clause 3, wherein the first plurality of interconnects and the second plurality of interconnects of the bridge die are configured as die bumps having a pitch in the range of 40 μm to 55 μm. Clause 5. The apparatus of clause 4, wherein the second plurality of contacts of the first die are pads and the second plurality of contacts of the second die are pads. Clause 6. The apparatus of any of clauses 1 to 5, wherein the first plurality of interconnects and the second plurality of interconnects of the bridge die are embedded in a first underfill. Clause 7. The apparatus of any of clauses 1 to 6, further comprising a package substrate having a cavity and a plurality of pads, the bridge die being at least partially disposed within the cavity, the plurality of pads being coupled to the first plurality of contacts of the first die and the first plurality of contacts of the second die. Clause 8. The apparatus of clause 7, further comprising a second underfill, wherein the first plurality of contacts of the first die and the first plurality of contacts of the second die are embedded in the second underfill. Clause 9. The apparatus of clause 7 or 8, further comprising a plurality of connectors external to the package substrate, at least one of the plurality of pads being. Clause 10. The apparatus of any of clauses 1 to 9, wherein a total height of the first plurality of interconnects of the bridge die and the second plurality of contacts of the first die is less than a height of the first plurality of contacts of the first die. Clause 11. The apparatus of any of clauses 1-10, wherein a total height of the second plurality of interconnects of the bridge die and the second plurality of contacts of the second die is less than a height of the first plurality of contacts of the second die. Clause 12. The apparatus of any of clauses 1 to 11, wherein the apparatus is selected from the group consisting of a music player, a video player, an entertainment unit, a navigation device, a communications device, a mobile device, a mobile phone, a smartphone, a personal digital assistant, an access point, a stationary terminal, a tablet computer, a computer, a wearable device, an Internet of Things (IoT) device, a laptop computer, a server, a base station, and a device in an automotive vehicle. Clause 13. A method for making a device having multi-die interconnects, the method comprising: providing a bridge die having a first plurality of interconnects and a second plurality of interconnects; providing a bridge die having the first plurality of interconnects and the second plurality of interconnects; coupling a first die having a first plurality of contacts and a second plurality of contacts to the first plurality of interconnects of the bridge die using the second plurality of contacts of the first die, where the second plurality of contacts of the first die and the first plurality of interconnects both have a height smaller than the first plurality of contacts of the first die; and coupling a second die having a first plurality of contacts and a second plurality of contacts to the second plurality of interconnects of the bridge die using the second plurality of contacts of the second die, where the second plurality of contacts of the second die and the second plurality of interconnects both have a height smaller than the first plurality of contacts of the second die. Clause 14. The method of clause 13, further comprising embedding the first die and the second die in a molding compound. Clause 15. The method of clause 13 or 14, wherein the first plurality of interconnects and the second plurality of interconnects of the bridge die have a smaller pitch than the first plurality of contacts of the first die and the first plurality of contacts of the second die. Clause 16. The method of clause 15, wherein the first plurality of interconnects and the second plurality of interconnects of the bridge die are configured as die bumps having a pitch in the range of 40 μm to 55 μm. Clause 17. The method of clause 16, wherein the second plurality of contacts of the first die are pads and the second plurality of contacts of the second die are pads. Clause 18. The method of any of clauses 13-17, further comprising embedding the first plurality of interconnects and the second plurality of interconnects of the bridge die in a first underfill. Clause 19. The method of any of clauses 13 to 18, further comprising: providing a package substrate having a cavity and a plurality of pads; embedding a bridge die at least partially in the cavity; and coupling the plurality of pads to the first plurality of contacts of the first die and the first plurality of contacts of the second die. Clause 20. The method of clause 19, further comprising embedding the first plurality of contacts of the first die and the first plurality of contacts of the second die in a second underfill. Clause 21. The method of clause 19 or 20, further comprising forming a plurality of connectors on the package substrate opposite the plurality of pads. Clause 22. The method of any of clauses 13-21, wherein the first plurality of interconnects of the bridge die have a height smaller than the first plurality of contacts of the first die. Clause 23. The method of any of clauses 13 to 22, wherein the second plurality of contacts of the coupled first die and the first plurality of interconnects of the bridge die have a smaller height than the first plurality of contacts of the first die, and the second plurality of contacts of the coupled second die and the second plurality of interconnects of the bridge die have a smaller height than the first plurality of contacts of the second die. Clause 24. The method of any of clauses 13 to 23, wherein the apparatus is selected from the group consisting of a music player, a video player, an entertainment unit, a navigation device, a communications device, a mobile device, a mobile phone, a smartphone, a personal digital assistant, an access point, a stationary terminal, a tablet computer, a computer, a wearable device, an Internet of Things (IoT) device, a laptop computer, a server, a base station, and a device in an automotive vehicle.

[0066] Additionally, in some examples, an individual action may be subdivided into or include multiple sub-actions, and such sub-actions may be included in and become part of the disclosure of the individual action.

[0067] Although the above disclosure shows examples of the present disclosure, it should be noted that various modifications and changes can be made herein without departing from the scope of the present disclosure as defined by the appended claims. The functions and / or acts of the method claims according to the examples of the present disclosure described herein need not be performed in any particular order. In addition, well-known elements may not be described in detail or may be omitted so as not to obscure the relevant details of the aspects and examples disclosed herein. Furthermore, although elements of the present disclosure may be described or claimed in the singular, the plural is contemplated unless limitation to the singular is explicitly stated. [Explanation of symbols]

[0068] 100, 200 Molded Multi-Die High Density Interconnects 110 First Die 111 Pad 112 First multiple contacts 113 Solder Pads / Bumps 114 Secondary Multiple Contacts 120 Second Die 121 Pad 122 First Multiple Contacts 123 Solder Bumps 124 Secondary Multiple Contacts 130 Molding Compound 140 Bridge Die 141 first plurality of interconnects 142 second plurality of interconnects 148 First Underfill 150 Second Underfill 160 Package Substrate 162 Contact Pad 165 Cavity 166 Adhesive 170 Connector 300, 400 Multi-die packages 301, 301' Carrier 302, 302' Temporary support membrane 310 First Die 311 Pad 312 First multiple contacts 313 Solder Bumps 314 Secondary Multiple Contacts 320 Second Die 321 Pad 322 First Multiple Contacts 323 Solder Bumps 324 Secondary Multiple Contacts 330 Molding Compound 340 Bridge Die 341 first plurality of interconnects 342 second plurality of interconnects 345 Photoresist 348 First Underfill 350 Second Underfill 360 Package Substrate 362 Pad 365 Cavity 370 External Connector 401 Career 402 Temporary support membrane 410 First Die 412 First Multiple Contacts 414 Secondary Multiple Contacts 420 Second Die 422 First Multiple Contacts 424 Secondary Multiple Contacts 430 Molding Compound 440 Bridge Die 441 first plurality of interconnects 442 second plurality of interconnects 460 Package Substrate 462 Pad 465 Cavity 466 Adhesive 470 BGA 500 Integrated Devices 501 Package 525 VDD BGA pin 527 GND BGA pin 580 PMIC 590 PCB 591 Power supply (VDD) line 592 Ground (GND) wire 600 Mobile Devices 601 Processor 622 System-on-chip Device 626 Display Controller 628 Display 632 Memory 634 Coder / Decoder (Codec) 636 Speakers 638 Microphone 640 Wireless Circuits 644 Power supply 702 Mobile Phone Devices 704 Laptop Computer Devices 706 Fixed Terminal Device 800 ways

Claims

1. 1. An apparatus comprising a multi-die interconnect, the multi-die interconnect comprising: a bridge die having a first plurality of interconnects and a second plurality of interconnects; a first die having a first plurality of contacts and a second plurality of contacts, the second plurality of contacts of the first die being coupled to the first plurality of interconnects of the bridge die, and the second plurality of contacts of the first die both having a height less than the first plurality of contacts of the first die; a second die having a first plurality of contacts and a second plurality of contacts, the second plurality of contacts of the second die being coupled to the second plurality of interconnects of the bridge die, and the second plurality of contacts of the second die both having a height less than the first plurality of contacts of the second die; a first underfill in which the first plurality of interconnects and the second plurality of interconnects of the bridge die are embedded; a second underfill in which the first plurality of contacts of the first die and the first plurality of contacts of the second die are embedded; An apparatus comprising:

2. The apparatus of claim 1 , wherein the first die and the second die are embedded in a molding compound.

3. 2. The apparatus of claim 1 , wherein the first and second interconnects of the bridge die have a smaller pitch than the first and second contacts of the first and second die.

4. 4. The apparatus of claim 3, wherein the first and second plurality of interconnects of the bridge die are configured as die bumps having a pitch in the range of 40 μm to 55 μm.

5. The apparatus of claim 4 , wherein the second plurality of contacts of the first die are pads and the second plurality of contacts of the second die are pads.

6. a package substrate having a cavity and a plurality of pads; the bridge die is disposed at least partially within the cavity; The apparatus of claim 1 , wherein the plurality of pads are coupled to the first plurality of contacts of the first die and to the first plurality of contacts of the second die.

7. a total height of the first plurality of interconnects of the bridge die and the second plurality of contacts of the first die is less than a height of the first plurality of contacts of the first die; and / or 2. The apparatus of claim 1, wherein a total height of the second plurality of interconnects of the bridge die and the second plurality of contacts of the second die is less than a height of the first plurality of contacts of the second die.

8. 10. The apparatus of claim 1, wherein the apparatus is selected from the group consisting of a music player, a video player, an entertainment unit, a navigation device, a communications device, a mobile device, a mobile phone, a smart phone, a personal digital assistant, an access point, a stationary terminal, a tablet computer, a computer, a wearable device, an Internet of Things device, a laptop computer, a server, a base station, and a device in an automotive vehicle.

9. 1. A method for fabricating a device having multi-die interconnects, comprising: providing a bridge die having a first plurality of interconnects and a second plurality of interconnects; providing a bridge die having the first plurality of interconnects and a second plurality of interconnects; coupling a first die having a first plurality of contacts and a second plurality of contacts to the first plurality of interconnects of the bridge die using the second plurality of contacts of the first die, wherein the second plurality of contacts and the first plurality of interconnects of the first die both have a height smaller than the first plurality of contacts of the first die; coupling a second die having a first plurality of contacts and a second plurality of contacts to the second plurality of interconnects of the bridge die using the second plurality of contacts of the second die, wherein the second plurality of contacts and the second plurality of interconnects of the second die both have a height smaller than the first plurality of contacts of the second die; embedding the first plurality of interconnects and the second plurality of interconnects of the bridge die in a first underfill; embedding the first plurality of contacts of the first die and the first plurality of contacts of the second die in a second underfill; The method includes:

10. The method of claim 9 , further comprising embedding the first die and the second die in a molding compound.

11. 10. The method of claim 9, wherein the first plurality of interconnects and the second plurality of interconnects of the bridge die have a smaller pitch than the first plurality of contacts of the first die and the first plurality of contacts of the second die.

12. 12. The method of claim 11, wherein the first and second plurality of interconnects of the bridge die are configured as die bumps having a pitch in the range of 40 μm to 55 μm.

13. The method of claim 12 , wherein the second plurality of contacts of the first die are pads and the second plurality of contacts of the second die are pads.

14. providing a package substrate having a cavity and a plurality of pads; embedding the bridge die at least partially in the cavity; 10. The method of claim 9, further comprising: coupling the plurality of pads to the first plurality of contacts of the first die and to the first plurality of contacts of the second die.

15. The method of claim 14 , further comprising forming a plurality of connectors on the package substrate opposite the plurality of pads.

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