Processing tool

Abstract

To provide a processing tool whose protective member can protect a surface without intruding into the pores of a grindstone.SOLUTION: A processing tool (for example, a cutting blade 10) for processing a workpiece includes: a grindstone (for example, a cutting grindstone 11) formed by containing abrasive grains and a binding material; and a protective member 12 containing feather-like nanoparticles covering a surface of the grindstone.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present invention relates to a processing tool. [Background technology]

[0002] In the manufacturing process of semiconductor devices, for example, a plurality of circuit elements such as ICs (Integrated Circuits) and LSIs (Large Scale Integrations) are formed on the front surface of a wafer, the back surface is ground with a grinding device to thin the wafer to a predetermined thickness, and the thinned wafer is then cut with a cutting device to manufacture individual semiconductor devices. The cutting device or grinding device used here uses a cutting blade or grinding wheel attached to a spindle as a processing tool to process the wafer held on a chuck table.

[0003] Processing tools such as cutting blades and grinding wheels are equipped with grindstones that contain pores and have abrasive grains fixed with a binder, and processing is performed while wearing down the processing point (tip) of the grindstone to constantly maintain the condition of the grindstone. Such grindstones are consumables, and when they wear down to a certain extent, they need to be replaced with new ones, but when replacing the processing tool, there is a possibility that they may come into contact with peripheral units of the processing device and be damaged. In response to this, Patent Document 1 discloses a cutting blade in which a liquid resin is applied to the surface of the grindstone, which is then hardened to cover the grindstone as a protective member (Patent Document 1). [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2009-095888 A Summary of the Invention [Problem to be solved by the invention]

[0005] However, grinding wheels have many pores because the abrasive grains are fixed with a binder, so when liquid resin is applied, it penetrates not only the surface of the grinding wheel but also the internal pores and fills them up, which can lead to a decrease in the ability to remove contaminants and poor water circulation (poor cooling) to the processing point.

[0006] The present invention has been made in consideration of the above problems, and an object of the present invention is to provide a processing tool capable of protecting the surface without the protective member penetrating into the pores of the grinding wheel. [Means for solving the problem]

[0007] In order to solve the above-mentioned problems and achieve the object, the processing tool of the present invention is a processing tool for processing a workpiece, and is characterized in that it comprises a grinding wheel formed containing abrasive grains and a binder, and a protective member containing feathery nanoparticles that covers the surface of the grinding wheel.

[0008] In the processing tool of the present invention, the feathery nanoparticles preferably have a longitudinal length of 100 nm or more and 300 nm or less, and a lateral length of 10 nm or more and 50 nm or less.

[0009] The processing tool may also be a cutting blade having an opening at the axial center for attachment to the spindle, a ring-shaped base formed surrounding the opening, and a ring-shaped grinding wheel arranged with its outer periphery protruding radially outward from the outer periphery of the circular base.

[0010] The processing tool may also be a grinding wheel having a circular wheel base with a circular groove formed in its end face, and the grinding wheel having one end embedded in the groove and the other end protruding from the end face. Effect of the Invention

[0011] The present invention can protect the surface without the protective member penetrating into the pores of the grinding wheel. [Brief description of the drawings]

[0012] [Figure 1] FIG. 1 is a perspective view showing an example of the configuration of a processing tool according to a first embodiment. [Diagram 2] FIG. 2 is an enlarged cross-sectional view of a portion of the processing tool shown in FIG. [Diagram 3] FIG. 3 is a perspective view showing a configuration example of a cutting device on which the processing tool shown in FIG. 1 is mounted. [Figure 4] 4 is a side view showing how the processing tool shown in FIG. 1 is attached to the cutting device shown in FIG. [Diagram 5] FIG. 5 is a perspective view showing an example of the configuration of a processing tool according to the second embodiment. [Figure 6] FIG. 6 is an enlarged cross-sectional view of a portion of the processing tool shown in FIG. [Figure 7] FIG. 7 is a perspective view showing a configuration example of a grinding device on which the processing tool shown in FIG. 5 is mounted. [Figure 8] 8 is a side view showing how the processing tool shown in FIG. 5 is attached to the grinding device shown in FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0013] The form (embodiment) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited to the contents described in the following embodiment. Furthermore, the components described below include those that a person skilled in the art can easily imagine and those that are substantially the same. Furthermore, the configurations described below can be appropriately combined. Furthermore, various omissions, substitutions, or modifications of the configurations can be made without departing from the gist of the present invention.

[0014] [First embodiment] A processing tool according to a first embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view showing a configuration example of the processing tool (cutting blade 10) according to the first embodiment. FIG. 2 is a partially enlarged cross-sectional view of the processing tool (cutting blade 10) shown in FIG. 1. FIG. 3 is a perspective view showing a configuration example of a cutting device 101 that mounts the processing tool (cutting blade 10) shown in FIG. 1. FIG. 4 is a side view showing a state in which the processing tool (cutting blade 10) shown in FIG. 1 is attached to the cutting device 101 shown in FIG. 3.

[0015] 1 to 4, the processing tool of the first embodiment is a cutting blade 10 that is mounted on a cutting device 101 and cuts a workpiece 1 to be processed. The cutting blade 10 of the first embodiment has a cutting grindstone 11 (grindstone), a protective member 12, and a circular base 13.

[0016] The cutting wheel 11 is an extremely thin, substantially annular cutting-blade-like grindstone formed to a predetermined thickness, which contains abrasive grains such as diamond or CBN (Cubic Boron Nitride) and a bond material such as metal bond, resin bond, or vitrified bond. The grinding wheel 21 contains many pores. In the grinding wheel 21 of the first embodiment, the size of the pores is 200 μm or less. The cutting wheel 11 is provided such that its inner periphery is fixed to the outer periphery of the circular base 13.

[0017] The protective member 12 includes feathery nanoparticles that cover the surface of the cutting grindstone 11. The feathery nanoparticles have a length in the longitudinal direction of 100 nm to 300 nm and a length in the lateral direction of 10 nm to 50 nm. The length refers to the length in the curved state. That is, the feathery nanoparticles are sized to fit inside a rectangular parallelepiped with a long side of 100 nm to 300 nm and a short side of 10 nm to 50 nm. The thickness of the protective member 12 that covers the surface of the cutting grindstone 11 is 1 μm to 20 μm, preferably about 4 μm. The protective member 12 is formed by applying a solution containing a liquid and feathery nanoparticles dispersed in the liquid to the cutting grindstone 11 fixed to the circular base 13, and then evaporating the liquid by burning or the like, so that the protective member 12, which is the remaining feathery nanoparticles, covers the surface of the cutting grindstone 11.

[0018] The feathery nanoparticles include, for example, nanoparticles of silica such as alumina (Al2O3) and silicon dioxide (SiO2). The feathery nanoparticles preferably have a longitudinal length of 100 nm to 300 nm and a lateral length of 10 nm to 50 nm. The solution containing the liquid and the feathery nanoparticles dispersed in the liquid is, for example, an alumina sol, which is a colloidal solution of alumina hydrate with water as a dispersion medium, such as AS-200 manufactured by Nissan Chemical Co., Ltd.

[0019] The circular base 13 has an opening 14 at its axial center and is an annular base formed surrounding the opening 14. The opening 14 is attached to a spindle 122 (see FIGS. 3 and 4) of a cutting unit 120 (described later) to which the cutting blade 10 is attached. When the circular base 13 is attached to the spindle 122 at the opening 14, the axis of the circular base 13 coincides with the axis of the spindle 122.

[0020] An annular cutting wheel 11 is provided on the outer periphery of the circular base 13. In this case, an outer periphery 16 of the cutting wheel 11 is provided protruding radially outward from an outer periphery 15 of the circular base 13 so that the axis of the cutting wheel 11 coincides with the axis of the circular base 13. The cutting blade 10 of the first embodiment is a so-called hub blade that includes the annular circular base 13 and an annular cutting blade (cutting wheel 11) provided on the outer periphery of the circular base 13, but in the present invention, it may be a so-called washer blade that is composed of only the cutting blade.

[0021] As shown in Figure 3, the cutting device 101 on which the cutting blade 10 shown in Figures 1 and 2 is mounted is a machine tool that cuts the workpiece 1, and includes a holding table 110, a cutting unit 120 having the cutting blade 10, a moving unit 130, an imaging unit 140, and a control unit (not shown) that controls each part of the cutting device 101.

[0022] The cutting device 101 has a processing feed direction along the X-axis, an indexing feed direction along the Y-axis, and a cutting feed direction along the Z-axis. The X-axis direction is one direction on a horizontal plane. The Y-axis direction is a direction perpendicular to the X-axis direction on the horizontal plane. The Z-axis direction is a direction perpendicular to the X-axis and Y-axis directions. The Z-axis direction is a direction perpendicular to the X-axis and Y-axis directions.

[0023] The workpiece 1 to be processed is, for example, a disk-shaped semiconductor wafer, an optical device wafer, or other wafer, whose substrate is made of silicon (Si), silicon carbide (SiC), gallium nitride (GaN), gallium arsenide (GaAs), or other semiconductor material. Alternatively, the workpiece 1 is a disk-shaped wafer whose substrate is made of a material such as sapphire (Al2O3), glass, or quartz. Examples of glass include alkali glass, non-alkali glass, soda-lime glass, lead glass, borosilicate glass, and quartz glass.

[0024] The workpiece 1 has, for example, a plurality of division lines set in a grid pattern on the surface of a substrate, and devices formed in areas partitioned by the division lines. The devices are, for example, integrated circuits such as ICs (Integrated Circuits) or LSIs (Large Scale Integrations), image sensors such as CCDs (Charge Coupled Devices) or CMOSs ​​(Complementary Metal Oxide Semiconductors), or MEMS (Micro Electro Mechanical Systems).

[0025] For example, the workpiece 1 is supported within an opening of the frame 2 with a ring-shaped frame 2 attached thereto and a tape 3 having a diameter larger than the outer diameter of the workpiece 1 attached to the rear surface of the workpiece 1, and is transported and processed in this state. The workpiece 1 is divided into individual devices along the planned division lines and singulated into chips. Note that the workpiece 1 is not limited to a disk shape, and may be a resin package substrate, a metal substrate, or other plate shape. The chips are not limited to a square shape, and may be rectangular or polygonal.

[0026] The holding table 110 holds the workpiece 1 on a holding surface 111. The holding surface 111 is in a disk shape formed from porous ceramics or the like. The holding surface 111 is connected to a vacuum suction source, for example, via a vacuum suction path. The holding table 110 suction-holds the workpiece 1 placed on the holding surface 111. A plurality of clamp members 112 are arranged around the holding table 110 to clamp an annular frame 2 that supports the workpiece 1.

[0027] The holding table 110 is provided so as to be freely movable by a processing feed unit 131 of the moving unit 130 between a processing area which is an area below the cutting unit 120 and a carry-in / out area which is an area separated from below the cutting unit 120 and where the workpiece 1 is carried in and out. The holding table 110 is provided so as to be freely rotatable about an axis parallel to the Z-axis direction by a rotation unit 134 of the moving unit 130.

[0028] The cutting unit 120 is a unit that cuts the workpiece 1 held on the holding table 110. The cutting unit 120 is provided so as to be movable in the Y-axis direction by an indexing feed unit 132 of the moving unit 130 and movable in the Z-axis direction by a cutting feed unit 133 of the moving unit 130 with respect to the workpiece 1 held on the holding table 110. The detailed configuration and mounting operation of the cutting unit 120 will be described later.

[0029] The moving unit 130 includes a processing feed unit 131, an indexing feed unit 132, a cutting feed unit 133, and a rotation unit 134. The processing feed unit 131 relatively moves the holding table 110 and the cutting unit 120 in the X-axis direction, which is the processing feed direction. The processing feed unit 131 of the first embodiment moves the holding table 110 in the X-axis direction relative to the device body 102 by a well-known ball screw type moving mechanism.

[0030] The indexing feed unit 132 relatively moves the holding table 110 and the cutting unit 120 in the Y-axis direction, which is the indexing feed direction. The indexing feed unit 132 of the first embodiment moves the cutting unit 120 and the cutting feed unit 133 in the Y-axis direction relative to the standing wall portion 103 erected from the device body 102 by a well-known ball screw type moving mechanism.

[0031] The cutting feed unit 133 relatively moves the holding table 110 and the cutting unit 120 in the Z-axis direction, which is the cutting feed direction. The cutting feed unit 133 of the first embodiment moves the cutting unit 120 in the Z-axis direction relative to the indexing feed unit 132 by a well-known ball screw type moving mechanism.

[0032] The rotation unit 134 rotates the holding table 110 and the cutting unit 120 around an axis parallel to the Z-axis direction. The rotation unit 134 in the first embodiment rotates the holding table 110 relative to the processing feed unit 131 around an axis parallel to the Z-axis direction.

[0033] The imaging unit 140 is a unit that images the workpiece 1 held on the holding table 110. The imaging unit 140 has an imaging element such as a CCD imaging element or a CMOS imaging element. The imaging unit 140 is disposed above the holding table 110 that moves between a processing area and a carry-in / out area. The imaging unit 140 images an area to be cut of the workpiece 1 before cutting held on the holding table 110, acquires an image, and outputs the acquired image to a control unit (not shown).

[0034] As shown in FIG. 4, the cutting unit 120 includes the cutting blade 10 shown in FIGS. 1 and 2, a spindle 122, a spindle housing 123, a mount 124, and a nut 125.

[0035] The spindle 122 is rotatably provided with respect to the spindle housing 123 so that the axis of the spindle 122 is parallel to the Y-axis direction. The cutting blade 10 is attached to the tip of the spindle 122. The spindle 122 rotates about the axis of the spindle 122 by a spindle motor (not shown), thereby rotating the cutting blade 10 about the axis of the spindle 122 parallel to the Y-axis direction.

[0036] The spindle housing 123 accommodates the spindle 122 therein. The spindle housing 123 is provided so as to be movable in the Y-axis direction by an indexing feed unit 132 and movable in the Z-axis direction by a cutting feed unit 133. The cutting unit 120 is capable of positioning the cutting blade 10 at any position on the holding surface 111 of the holding table 110 by the indexing feed unit 132 and the cutting feed unit 133.

[0037] The mount 124 is fixed to the tip of the spindle 122. The mount 124 includes a cylindrical boss portion 126 extending in the Y-axis direction, and a receiving flange portion 127 provided at one end of the boss portion 126 closer to the spindle housing 123.

[0038] The boss portion 126 extends in the Y-axis direction, and has an outer diameter over its entire length that is substantially equal to the inner diameter of the opening 14 of the cutting blade 10. Note that the outer diameter of the boss portion 126 being substantially equal to the inner diameter of the opening 14 of the cutting blade 10 means that the outer diameter and the inner diameter are equal to such an extent that the outer peripheral surface of the boss portion 126 and the inner peripheral surface of the opening 14 can come into contact with each other at least at a plurality of points.

[0039] The receiving flange portion 127 protrudes radially from the axial rear end of the boss portion 126 near the spindle housing 123 toward the outer periphery and is formed in a circular ring shape with a diameter larger than the outer diameter of the boss portion 126. The receiving flange portion 127 supports the cutting blade 10 with a flat end surface along the XZ plane at the outer edge portion. The boss portion 126 and the receiving flange portion 127 are arranged coaxially. In addition, the mount 124 has a male thread 128 formed on the outer periphery of the other end portion of the boss portion 126.

[0040] The cutting blade 10 is attached to the spindle 122 by fitting the opening 14 of the circular base 13 onto the outer periphery of a cylindrical boss portion 126 of the mount 124. The cutting blade 10 attached to the mount 124 is fixed to the spindle 122 via the mount 124 by screwing the nut 125 into a male thread 128 formed on the cylindrical boss portion 126 while being sandwiched between the nut 125 and the mount 124.

[0041] After the cutting blade 10 is attached to the cutting device 101, a dress board, which is a consumable item, is held on a holding table 110, and the dress board is cut by the cutting blade 10 to remove the protective member 12 at the tip of the cutting grindstone 11. The dress board sharpens the cutting blade 10, which has become clogged or dulled and has reduced cutting ability, thereby recovering the cutting ability of the cutting blade 10. The dress board is made of abrasive grains such as WA (white alundum, alumina-based) and GC (green carbonite, silicon carbide-based) mixed into a resin or ceramic bond material.

[0042] Second Embodiment A processing tool according to a second embodiment of the present invention will be described with reference to the drawings. Fig. 5 is a perspective view showing a configuration example of the processing tool (grinding wheel 20) according to the second embodiment. Fig. 6 is a partially enlarged cross-sectional view of the processing tool (grinding wheel 20) shown in Fig. 5. Fig. 7 is a perspective view showing a configuration example of a grinding device 201 equipped with the processing tool (grinding wheel 20) shown in Fig. 5. Fig. 8 is a side view showing a state in which the processing tool (grinding wheel 20) shown in Fig. 5 is attached to the grinding device 201 shown in Fig. 7.

[0043] 5 to 8, the processing tool of the second embodiment is a grinding wheel 20 mounted on a grinding device 201 for cutting a workpiece 1 to be processed. The grinding wheel 20 of the second embodiment has a grinding stone 21 (grindstone), a protective member 22, and a wheel base 23.

[0044] The grinding wheel 21 is a grinding wheel that contains abrasive grains such as diamond or CBN and a bond material such as metal bond, resin bond, or vitrified bond, and is formed into an arc shape having a certain width in a plan view. The grinding wheel 21 contains many pores. In the grinding wheel 21 of the second embodiment, the size of the pores is 200 μm or less. A plurality of grinding wheels 21 are attached to one wheel base 23. One end of the grinding wheel 21 is embedded in a groove portion 25 of the wheel base 23, and the other end is disposed so as to protrude from an end face 24 of the wheel base 23.

[0045] The protective member 22 is the same as that in the first embodiment, and includes feathery nanoparticles covering the surface of the grinding wheel 21. The feathery nanoparticles have a longitudinal length of 100 nm to 300 nm and a lateral length of 10 nm to 50 nm. The length refers to the length in a curved state. That is, the feathery nanoparticles are sized to fit inside a rectangular parallelepiped with a long side of 100 nm to 300 nm and a short side of 10 nm to 50 nm. The thickness of the protective member 22 covering the surface of the grinding wheel 21 is 1 μm to 20 μm, preferably about 4 μm. The protective member 22 is a liquid protective member 22 composed of a liquid and feathery nanoparticles dispersed in the liquid, which is applied to the grinding wheel 21 fixed to the wheel base 23 with an adhesive 26, and then the liquid is evaporated by burning or the like, so that the remaining feathery nanoparticles cover the surface of the grinding wheel 21.

[0046] The wheel base 23 is an annular base having an end surface 24 formed with an annular groove 25. In the second embodiment, the wheel base 23 is formed using a metal such as stainless steel or aluminum. The annular groove 25 is formed so that the diameter of the inner surface along the circumferential direction is smaller than the diameter of the inner surface of the grinding wheel 21, the diameter of the outer surface along the circumferential direction is larger than the diameter of the outer surface of the grinding wheel 21, and the radial width is slightly larger than the radial width of the grinding wheel 21, so that the grinding wheel 21 can be inserted.

[0047] The annular groove 25 is formed so that its depth is shallower than the height of the grinding wheel 21, so that the grinding wheel 21 can be inserted into the groove 25 such that one end side (the lower side in FIG. 6) of the grinding wheel 21 in the height direction is embedded in the groove 25 and the other end side (the upper side in FIG. 6) of the grinding wheel 21 in the height direction protrudes from the end face 24. The annular groove 25 has a flat bottom surface that is parallel to the end face 24 and has a U-shaped cross section in a radial cross section, so that the grinding wheel 21 can be placed on the bottom surface of the groove 25 via an appropriate amount of adhesive 26 so as not to fall radially inward or outward.

[0048] The adhesive 26 is, for example, a thermosetting resin, an ultraviolet curing resin, or a mixture of an ultraviolet curing resin and an anaerobic resin. The adhesive 26 is filled into the annular groove 25, and the grinding wheel 21 is placed in the annular groove 25, and then the adhesive 26 is cured to fix the grinding wheel 21 to the wheel base 23.

[0049] As shown in Figure 7, the grinding device 201 on which the grinding wheel 20 shown in Figures 5 and 6 is mounted is a machine tool that grinds the workpiece 1, and is equipped with a holding table 210, a grinding unit 220 having the grinding wheel 20, a moving unit 230, a thickness detection unit 240, and a height position detection unit 250.

[0050] The holding table 210 holds the workpiece 1 on a holding surface 211. The holding surface 211 has a disk shape formed from porous ceramics or the like. The holding surface 211 is connected to a vacuum suction source via a vacuum suction path, for example. The holding table 210 holds the workpiece 1 placed on the holding surface 211 by suction.

[0051] The holding table 210 is provided so as to be freely movable by a carry-in / out unit 231 of the moving unit 230 between a processing area which is an area below the grinding unit 220 and a carry-in / out area which is an area separated from below the grinding unit 220 and where the workpiece 1 is carried in and out. The holding table 210 is provided so as to be freely rotatable about a vertical axis by a rotation unit 232 of the moving unit 230, and is rotationally driven in a horizontal plane by a rotation drive mechanism (not shown).

[0052] The grinding unit 220 is a unit that cuts the workpiece 1 held on the holding table 210. The grinding unit 220 is provided so as to be movable in the vertical direction by the lifting unit 233 of the moving unit 230 relative to the workpiece 1 held on the holding table 210. The detailed configuration and installation operation of the grinding unit 220 will be described later.

[0053] The moving unit 230 includes a carry-in / out unit 231, a rotation unit 232, and a lifting unit 233. The carry-in / out unit 231 moves the holding table 210 in one direction horizontal to the device body 202 between the processing area and the carry-in / out area. The rotation unit 232 rotates the holding table 210 in the processing area about a vertical axis. The lifting unit 233 moves the grinding unit 220 in the vertical direction relative to the support part 203 erected from the device body 202 by a well-known ball screw type moving mechanism.

[0054] The thickness detection unit 240 detects the thickness of the workpiece 1 held on the holding table 210 in the processing area. In addition, when the workpiece 1 is formed by stacking a plurality of plate-like members, the thickness detection unit 240 detects the thickness of each of the plurality of plate-like members constituting the workpiece 1. The thickness detection unit 240 has an inverted L-shaped arm unit 241 erected from the upper surface of the device body 202 adjacent to the processing area, and a laser head unit 242 provided at the tip of the arm unit 241.

[0055] The thickness detection unit 240 irradiates the surface of the workpiece 1 with laser light from the laser head unit 242, and receives interference light caused by the laser light reflected from the upper surface of the workpiece 1 and the bonding surfaces of the plate-like members. The thickness detection unit 240 analyzes the waveform of the received interference wave using a detection circuit, and obtains a numerical value (e.g., an electrical signal) according to the waveform as a thickness detection value, thereby detecting the thickness of each of the multiple plate-like members constituting the workpiece 1.

[0056] The height position detection unit 250 detects the height position of the workpiece 1 held on the holding table 210 in the machining area. The height position detection unit 250 has an inverted L-shaped arm unit 251 erected from the upper surface of the device body 202 adjacent to the machining area, and a detection light irradiator 252 provided at the tip of the arm unit 251. The height position detection unit 250 detects the height position of the upper surface of the workpiece 1 by irradiating the upper surface of the workpiece 1 with detection light from the detection light irradiator 252 and receiving the detection light reflected by the upper surface of the workpiece 1.

[0057] As shown in FIG. 8, the grinding unit 220 includes the grinding wheel 20 shown in FIGS.

[0058] The spindle 222 is rotatably provided with respect to the spindle housing 223 so that the axis of the spindle 222 is parallel to the vertical direction. The grinding wheel 20 is attached to the tip of the spindle 222. The spindle 222 rotates about the axis of the spindle 222 by a spindle motor (not shown), thereby rotating the grinding wheel 20 about the axis of the spindle 222 that is parallel to the vertical direction.

[0059] The spindle housing 223 accommodates the spindle 222 therein. The spindle housing 223 is provided so as to be movable in the vertical direction by a lifting unit 233. The grinding unit 220 is capable of positioning the grinding wheel 20 at any position on the holding surface 111 of the holding table 110 by the lifting unit 233.

[0060] The mount 224 is fixed to the lower end of the spindle 222. The grinding wheel 20 is attached to the lower surface of the mount 224. The outer diameter of the mount 224 is equal to the outer diameter of the wheel base 23 of the grinding wheel 20. The grinding wheel 20 is attached to the spindle 222 by fixing the upper surface of the wheel base 23 to the lower surface of the mount 224.

[0061] After the grinding wheel 20 is mounted on the grinding device 201, a dress board, which is a consumable item, is held on a holding table 210, and the dress board is cut by the grinding wheel 20 to remove the protective member 22 at the tip of the grinding stone 21. The dress board sharpens the grinding wheel 20, which has become clogged or dulled and has reduced grinding ability, thereby recovering the grinding ability of the grinding wheel 20.

[0062] As described above, when replacing the processing tool (cutting blade 10, grinding wheel 20) attached to the device (cutting device 101, grinding device 201) according to each embodiment, the grindstone (cutting grindstone 11 and grinding grindstone 21) is covered with the protective member 12, 22. The protective member 12, 22 is formed by applying the liquid protective member 12, 22, which contains a liquid and feathery nanoparticles dispersed in the liquid, to the grindstone, and then evaporating the liquid, so that the remaining feathery nanoparticles cover the surface of the grindstone.

[0063] When the liquid protective member 12, 22 is applied to the grindstone, the liquid flows out even if it penetrates into the pores of the grindstone. In addition, since the protective member 12, 22 that covers the surface of the grindstone is made of feathery nanoparticles, it does not penetrate into the pores of the grindstone and is formed in a filter shape. Therefore, the protective member 12, 22 can protect the surface without penetrating into the pores of the grindstone. Furthermore, since the protective member 12, 22 is made of feathery nanoparticles, it can pass the processing water during processing into the inside, and it is possible to suppress the interruption of the supply of processing water to the processing point.

[0064] It should be noted that the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the gist of the present invention. [Explanation of symbols]

[0065] 10 Cutting blade (tool) 11 Cutting wheel (grindstone) 12 Protective materials 13 Circular base 14 Openings 15, 16 Outer circumference 20 Grinding wheel (tool) 21 Grinding wheel (grinding wheel) 22 Protective materials 23 Wheel base 24 End face 25 Groove 26 Adhesive 101 Cutting equipment 110 Holding table 120 Cutting unit 122 Spindle 123 Spindle housing 124 Mount 125 Nut 126 Boss 127 Receiving flange 128 Male thread 130 Mobile Unit 140 Imaging unit 201 Grinding equipment 210 Holding Table 220 Grinding Unit 222 Spindle 223 Spindle housing 224 Mount 230 Mobile Unit 240 Thickness detector 250 Height position detection unit

Claims

1. A processing tool for processing a workpiece, a grinding wheel formed containing abrasive grains and a binder; a protective member including feathery nanoparticles covering the surface of the grindstone; Equipped A processing tool characterized by:

2. The feathery nanoparticles are The length in the longitudinal direction is 100 nm or more and 300 nm or less, The length in the short direction is 10 nm or more and 50 nm or less.

2. The processing tool according to claim 1 ,

3. The processing tool is a circular base having an opening at its axial center for receiving the spindle and surrounding the opening; The grindstone has an annular shape and is disposed so that its outer periphery protrudes radially outward from the outer periphery of the circular base; A cutting blade comprising: The processing tool according to claim 1 or 2, characterized in that

4. The processing tool is An annular wheel base having an annular groove formed on an end surface thereof; the grindstone, one end of which is embedded in the groove and the other end of which is disposed so as to protrude from the end surface; A grinding wheel comprising: The processing tool according to claim 1 or 2, characterized in that

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