Heating device and camera module

Abstract

To provide a heating device.SOLUTION: A heating device according to the present embodiment comprises a substrate, a connection terminal electrically connected to the substrate, and a heating member electrically connected to the connection terminal. The connection terminal includes a first region including an inner portion and an outer portion, a third region electrically connected to the substrate, and a second region disposed between the first region and the third region. The heating member is related to the heating device disposed between the inner portion and the outer portion of the connection terminal.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present invention relates to a heating device and a camera module. [Background technology]

[0002] In recent years, ultra-miniature camera modules have been developed and are widely used in small electronic products such as smartphones, notebooks, game consoles, etc.

[0003] As automobiles become more widespread, ultra-small cameras are being used not only in small electronic products but also in vehicles, such as black box cameras for vehicle protection or objective data on traffic accidents, rear monitoring cameras that allow drivers to monitor blind spots at the rear of the vehicle through a screen to ensure safety when reversing the vehicle, and surrounding detection cameras that can monitor the surroundings of the vehicle.

[0004] The camera includes a lens, a lens barrel that houses the lens, an image sensor that converts an image of a subject gathered by the lens into an electrical signal, and a printed circuit board on which the image sensor is mounted. The housing that defines the exterior of the camera has a completely sealed structure to prevent internal components from being contaminated by foreign substances including moisture.

[0005] Due to the nature of automobiles being installed outdoors, the temperature inside and outside the automobile varies depending on the season. For example, the temperature inside the automobile may be higher than the temperature outside in summer and may drop below zero in winter. Therefore, the sudden temperature change may cause condensation including frost on the camera lens and glass. This may result in unsatisfactory photographs or cause product failure. Summary of the Invention [Problem to be solved by the invention]

[0006] An object of the present invention is to provide a heating device and a camera module capable of preventing the occurrence of a condensation phenomenon including frost on a lens.

[0007] SUMMARY OF THE PRESENT EMBODIMENT An object of the present invention is to provide a humidity controller for a camera device and a camera device capable of preventing the occurrence of a condensation phenomenon including frost on a lens. [Means for solving the problem]

[0008] To achieve the above object, a heating device according to one aspect of the present invention includes a substrate, a connecting terminal electrically connected to the substrate, and a heating member electrically connected to the connecting terminal, the connecting terminal includes a first region including an inner portion and an outer portion, a third region electrically connected to the substrate, and a second region disposed between the first region and the third region, and the heating member is disposed between the inner portion and the outer portion of the connecting terminal.

[0009] Also, the inner portion may be folded and extended from a middle region at one end of the second region, and the outer portion may be folded and extended from an outer region at the one end of the second region.

[0010] Additionally, the inner portion and the outer portion may be spaced apart from each other.

[0011] Additionally, the inner and outer portions may include curved regions.

[0012] Also, the heating member may be formed in a ring shape.

[0013] The heating member may include a body and a heat generating material disposed on the body.

[0014] The heat generating material may include a first heat generating material disposed on an upper surface of the body of the heating member, and a second heat generating material disposed on a lower surface of the body of the heating member.

[0015] Also, the inner portion may be disposed on an upper surface of the heating member, and the outer portion may be disposed on a lower surface of the heating member.

[0016] Also, the height at which the inner portion is positioned in the optical axis direction may be different from the height at which the outer portion is positioned.

[0017] To achieve the above object, a camera module according to one aspect of the present invention includes a substrate, a lens barrel disposed on the substrate, a first lens disposed on the lens barrel, a heating member disposed between the first lens and the lens barrel, and a connecting terminal electrically connected to the heating member, the heating member including a main body and a heat generating material disposed on the main body, and the connecting terminal including a first region connected to the heat generating material of the heating member, a third region electrically connected to the substrate, and a second region disposed between the first region and the third region.

[0018] In addition, the heat-generating material may include a first heat-generating material disposed on an upper surface of the body of the heating member and a second heat-generating material disposed on a lower surface of the body of the heating member, and the first region of the connecting terminal may include a first connecting portion connected to the first heat-generating material and a second connecting portion connected to the second heat-generating material.

[0019] Also, the first lens may be a lens disposed at the outermost corner, and the first region of the connection terminal and the heat generating material may be connected to a lower surface of the first lens.

[0020] The lens barrel may also include a retainer disposed on the lens barrel to fix the first lens.

[0021] The substrate may also include a control unit and a resistor disposed between the connection terminal and the control unit.

[0022] In addition, the resistor may include a first resistor and a second resistor, the first resistor being electrically connected to the first connection portion of the connection terminal, and the second resistor being electrically connected to the second connection portion of the connection terminal.

[0023] In addition, the first connecting portion may include a first electrode portion having a first voltage and a second electrode portion having a second voltage that is a voltage lower than the first voltage, the second connecting portion may include a third electrode portion having a third voltage and a fourth electrode portion having a fourth voltage that is a voltage lower than the third voltage, the first resistor may be electrically connected to the second electrode portion of the first connecting portion, and the second resistor may be electrically connected to the fourth electrode portion of the second connecting portion.

[0024] To achieve the above object, a humidity controller for a camera device according to one aspect of the present invention includes a connection terminal connected to a power source, a heater connected to the connection terminal, and a desiccant disposed on the heater, wherein the desiccant and the heater have a closed-loop shape.

[0025] In addition, the connection terminal may be a flexible substrate, the heater may include a hot wire electrically connected to the flexible substrate and having a closed loop shape, and the desiccant may include silica gel and be attached to one surface of the heater.

[0026] The heater may also include a heat insulating material bonded to the other surface of the heater.

[0027] To achieve the above object, a camera device according to one aspect of the present invention includes a housing, a lens module disposed in the housing, a substrate disposed in the housing, a connecting terminal connected to the substrate, a heater connected to the connecting terminal, and a desiccant disposed on the heater, wherein the heater and the desiccant are disposed within the housing.

[0028] Also, the heater and the desiccant may be disposed on an inner surface of the substrate or the housing.

[0029] The display device may also include a connector that penetrates the housing and is coupled to the board, and an image sensor that is disposed on the board, and the desiccant may be disposed around at least one of the image sensor, the connector, and the lens module.

[0030] Additionally, the desiccant and the heater may include an opening, and a portion of the image sensor or the connector may be disposed within the opening.

[0031] Also, the desiccant and the heater may have a closed loop configuration.

[0032] Also, the substrate may include a first substrate and a second substrate disposed below the first substrate, the heater may be disposed on the first substrate, and the connection terminal may be connected to the second substrate.

[0033] It may also include sensors disposed on the substrate for measuring temperature and humidity.

[0034] To achieve the above object, a camera device according to one aspect of the present invention includes a housing, an image sensor disposed in the housing, a connector disposed in the housing, a desiccant disposed adjacent to the image sensor or the connector, a heater coupled to the desiccant; a substrate electrically connected to the heater, and a control unit for controlling the heater, wherein the desiccant absorbs moisture when an internal temperature of the housing is equal to or lower than a first reference value, and the control unit activates the heater when the internal temperature of the housing is equal to or higher than a second reference value.

[0035] The housing may also include a sensor for measuring an internal temperature of the housing, and the control unit may control the heater to be turned on or off in response to the measured temperature. Effect of the Invention

[0036] According to the present embodiment, it is possible to provide a heating device and a camera module capable of preventing the occurrence of condensation including frost on a lens.

[0037] According to the present embodiment, a humidity controller for a camera device and a camera device capable of preventing the occurrence of condensation including frost on a lens can be provided. [Brief description of the drawings]

[0038] [Figure 1] 1 is a perspective view of a camera module according to a first embodiment of the present invention; [Diagram 2] 1 is an exploded perspective view of a camera module according to a first embodiment of the present invention; [Diagram 3] 1 is a cross-sectional view of a camera module according to a first embodiment of the present invention. [Figure 4] 1 is a perspective view of a connecting terminal of a camera module in accordance with a first embodiment of the present invention. [Diagram 5] 1 is a perspective view of a heating member of a camera module in accordance with a first embodiment of the present invention; [Figure 6] 2 is a perspective view of a connecting terminal and a heating member of the camera module in accordance with the first embodiment of the present invention; FIG. [Figure 7] 1 is a partial cross-sectional view of a camera module according to a first embodiment of the present invention. [Figure 8] 1 is a schematic circuit diagram of a camera module according to a first embodiment of the present invention. [Figure 9] 1 is a schematic circuit diagram of a camera module according to a first embodiment of the present invention. [Figure 10] 10 is a perspective view of a connecting terminal and a heating member of a camera module according to another embodiment of the first embodiment of the present invention. FIG. [Figure 11] FIG. 4 is a partial cross-sectional view of a camera module according to another embodiment of the first embodiment of the present invention. [Figure 12] FIG. 4 is a schematic circuit diagram of a camera module according to another embodiment of the first embodiment of the present invention. [Figure 13]FIG. 4 is a schematic circuit diagram of a camera module according to another embodiment of the first embodiment of the present invention. [Figure 14] FIG. 11 is a perspective view of a camera device according to a second embodiment of the present invention. [Figure 15] FIG. 11 is an exploded perspective view of a camera device according to a second embodiment of the present invention. [Figure 16] FIG. 11 is a partial cross-sectional view of a camera device according to a second embodiment of the present invention. [Figure 17] FIG. 11 is a perspective view of a partial configuration of a camera device according to a second embodiment of the present invention. [Figure 18] FIG. 11 is a perspective view of a partial configuration of a camera device according to a second embodiment of the present invention. [Figure 19] FIG. 11 is a block diagram of a camera device according to a second embodiment of the present invention. [Figure 20] 10 is a flowchart of a camera device according to a second embodiment of the present invention. [Figure 21] 10 is a graph illustrating the operation of a camera device according to a second embodiment of the present invention. [Figure 22] FIG. 11 is a perspective view of a camera device according to another embodiment of the second embodiment of the present invention. [Figure 23] FIG. 11 is an exploded perspective view of a camera device according to another embodiment of the second embodiment of the present invention. [Figure 24] FIG. 11 is a partial cross-sectional view of a camera device according to another embodiment of the second embodiment of the present invention. [Diagram 25] FIG. 11 is a perspective view of a partial configuration of a camera device according to another embodiment of the second embodiment of the present invention. [Figure 26] FIG. 11 is a perspective view of a partial configuration of a camera device according to another embodiment of the second embodiment of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0039] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0040] However, the technical concept of the present invention is not limited to the embodiments described, but may be embodied in various different forms, and one or more of the components of the embodiments may be selectively combined or substituted within the scope of the technical concept of the present invention.

[0041] Furthermore, unless otherwise clearly and specifically defined, terms (including technical and scientific terms) used in the embodiments of the present invention shall be interpreted as having a meaning that is commonly understood by a person having ordinary knowledge in the technical field to which the present invention belongs, and terms commonly used together with predefined terms shall be interpreted in light of the contextual meaning of the relevant art.

[0042] Furthermore, the terms used in the embodiments of the present invention are intended to describe the embodiments and are not intended to limit the present invention.

[0043] In this specification, the singular can include the plural unless otherwise specified in the context, and when referring to "A and / or at least one of B and C," it can include one or more of all possible combinations of A, B, and C.

[0044] In addition, in describing components of the embodiments of the present invention, terms such as first, second, A, B, (a), (b), etc. are used only to distinguish the components from other components, and the terms do not limit the nature, order, or sequence of the components.

[0045] Furthermore, when a component is described as being 'coupled', 'coupled', or 'connected' to another component, this includes not only the case where the component is directly 'coupled', 'coupled', or 'connected' to the other component, but also the case where the component is 'coupled', 'coupled', or 'connected' by another component between the component and the other component.

[0046] In addition, when described as being formed or disposed "above" or "below" each component, "above" or "below" includes not only the case where two components are in direct contact with each other, but also the case where one or more additional components are formed or disposed between the two components. Furthermore, when expressed as "above" or "below," it can include not only the upper direction but also the lower direction based on one component.

[0047] The term "optical axis direction" used below is defined as the optical axis direction of a lens coupled to a lens driving device. Meanwhile, the term "optical axis direction" may correspond to "up and down direction", "z-axis direction", etc.

[0048] Hereinafter, a first embodiment of the present invention will be described in detail with reference to the accompanying drawings.

[0049] FIG. 1 is a perspective view of a camera module according to a first embodiment of the present invention. FIG. 2 is an exploded perspective view of a camera module according to a first embodiment of the present invention. FIG. 3 is a cross-sectional view of a camera module according to a first embodiment of the present invention. FIG. 4 is a perspective view of a connecting terminal of a camera module according to a first embodiment of the present invention. FIG. 5 is a perspective view of a heating member of a camera module according to a first embodiment of the present invention. FIG. 6 is a perspective view of a connecting terminal and a heating member of a camera module according to a first embodiment of the present invention. FIG. 7 is a partial cross-sectional view of a camera module according to a first embodiment of the present invention. FIGS. 8 and 9 are schematic circuit diagrams of a camera module according to a first embodiment of the present invention.

[0050] 1 to 9, the camera module 10 according to the first embodiment of the present invention may include a housing 100, a lens barrel 200, a lens module 300, a connecting terminal 400, a substrate 510, a connector 520, a heating member 600, and a retainer 700, but may be implemented without excluding some of the configurations, and additional configurations are not excluded.

[0051] In addition, the camera module 10 according to the first embodiment of the present invention may include a heating device. The heating device according to the first embodiment of the present invention may include a substrate 510, a connecting terminal 400, and a heating member 600, but additional components may also be included.

[0052] The camera module 10 may include a housing 100. The housing 100 may form the exterior of the camera module 10. The housing 100 may include a lens barrel 200, a lens module 300, a connection terminal 400, a substrate 510, a connector 520, a heating member 600, and a retainer 700. The housing 100 may include an upper housing and a lower housing.

[0053] The camera module 10 may include a lens barrel 200. The lens barrel 200 may be disposed in the housing 100. The lens barrel 200 may be disposed in the housing 100. The lens barrel 200 may be coupled to the housing 100. The lens barrel 200 may be coupled to the front of the housing 100. The lens module 300 may be disposed in the lens barrel 200. The lens barrel 200 may accommodate at least a portion of the lens module 300. The lens barrel 200 may include an opening in which the lens module 300 is disposed. A first lens 310 of the lens module 300, i.e., an outermost lens, may be exposed at an upper portion of the lens barrel 200. The center position of the lens barrel 200 may correspond to the center position of the lens module 300. At least a portion of the lens barrel 200 may overlap the connecting terminal 400 in a direction perpendicular to the optical axis. At least a portion of the connecting terminal 400 may be disposed in a space between the lens barrel 200 and the housing 100. A retainer 700 may be coupled to the lens barrel 200. The retainer 700 may be coupled to the front of the lens barrel 200. The lens barrel 200 is made of a non-metallic material such as a synthetic resin material using a plastic injection or die casting method, but is not limited thereto and the material of the lens barrel 200 may be changed in various ways.

[0054] The camera module 10 may include a lens module 300. The lens module 300 may be accommodated in the lens barrel 200. The lens module 300 may be disposed in an opening of the lens barrel 200. The lens module 300 may pass through the opening of the lens barrel 200. The lens module 300 may be screwed to an inner peripheral surface of the lens barrel 200. The lens module 300 may have a screw thread formed on an outer peripheral surface thereof, which corresponds to a screw thread formed on the inner peripheral surface of the lens barrel 200. The lens module 300 may include a first lens 310, which is an outermost lens, and at least one lens disposed below the first lens 310. The first lens 310 of the lens module 300 may be exposed above the lens barrel 200. At least a portion of the first lens 310 of the lens module 300 may be disposed above the lens barrel 200. At least one lens of the lens module 300 may be disposed below the first lens 310. Each lens of the lens module 300 is made of a synthetic resin material, a glass material, a quartz material, or the like, but is not limited thereto and may be made of various materials.

[0055] The camera module 10 may include a connecting terminal 400. The connecting terminal 400 may be electrically connected to the substrate 510. The connecting terminal 400 may be electrically connected to the heating member 600. The connecting terminal 400 may electrically connect the heating member 600 and the substrate 510. The connecting terminal 400 may be electrically connected to the connector 520. The connecting terminal 400 may electrically connect the heating member 600 and the connector 520. The connecting terminal 400 may supply a current from the substrate 510 to the heating member 600. The connecting terminal 400 may include a first region 410 arranged adjacent to the first lens 310, a third region 430 arranged adjacent to the substrate 510, and a second region 420 connecting the first region 410 and the third region 430.

[0056] The connection terminal 400 may include a first region 410. The first region 410 may be disposed on the second region 420 and the third region 430. The first region 410 may be disposed between the lens barrel 200 and the lens module 300. The first region 410 may be disposed in the lens barrel 200. The first region 410 may be disposed in the lens module 300. The first region 410 may be disposed between the first lens 310 and at least one lens of the lens module 300. The first region 410 may be disposed between the first lens 310 and the lens barrel 200. The first region 410 may include an inner portion 412 and an outer portion 414. The first region 410 may be coupled to the heating member 600. The first region 410 may be coupled to the heating member 600 via contact means 610 and 620. The first region 410 may be electrically connected to the heating member 600.

[0057] The inner part 412 may be formed by extending from one end 421 of the second region 420. The inner part 412 may be formed by extending from a central region of one end 421 of the second region 420. The inner part 412 may be bent and extended from a central region of one end 421 of the second region 420. The inner part 412 may include a curved region. The inner part 412 is made of a curved region. The inner part 412 may be formed in a ring shape. The inner part 412 may be formed in a half-ring shape. The inner part 412 may be formed in a horse hoof shape. The inner part 412 may be separated from the outer part 414. The inner part 412 may be disposed at a higher position than the outer part 414. The inner part 412 may be disposed on an upper surface of the heating member 600. A lower surface of the inner part 412 may be coupled to an upper surface of the heating member 600. The lower surface of the inner part 412 may be electrically connected to the upper surface of the heating member 600. The lower surface of the inner part 412 may be ACF bonded to the upper surface of the heating member 600. The lower surface of the inner part 412 may be coupled to the first heat generating material of the heating member 600. The lower surface of the inner part 412 may be electrically connected to the first heat generating material of the heating member 600. The lower surface of the inner part 412 may be ACF bonded to the first heat generating material of the heating member 600. The inner part 412 may be a first connection part connected to the first heat generating material. The upper surface of the inner part 412 may be coupled to the lower surface of the first lens 310. At least a portion of the upper surface of the inner part 412 may be coupled to at least a portion of the lower surface of the first lens 310.

[0058] The outer portion 414 may be formed by extending from one end 421 of the second region 420. The outer portion 414 may be formed by extending from an outer region of one end 421 of the second region 420. The outer portion 414 may be bent and extended from the outer region of one end 421 of the second region 420. The outer portion 414 may include a curved region. The outer portion 414 is made of a curved region. The outer portion 414 may be formed in a ring shape. The outer portion 414 may be formed in a half-ring shape. The outer portion 414 may be formed in a horse hoof shape. The outer portion 414 may be separated from the inner portion 412. The outer portion 414 may be disposed at a lower position than the inner portion 412. The outer portion 414 may be disposed on the lower surface of the heating member 600. The upper surface of the outer portion 414 may be coupled to the lower surface of the heating member 600. The upper surface of the outer part 414 may be electrically connected to the lower surface of the heating member 600. The upper surface of the outer part 414 may be ACF bonded to the lower surface of the heating member 600. The upper surface of the outer part 414 may be coupled to the second heat generating material of the heating member 600. The upper surface of the outer part 414 may be electrically connected to the second heat generating material of the heating member 600. The upper surface of the outer part 414 may be ACF bonded to the second heat generating material of the heating member 600. The outer part 414 may be a second connection part connected to the second heat generating material. The lower surface of the outer part 414 may be fixed to the inner surface of the lens barrel 200. The lower surface of the outer part 414 may be fixed to the upper part of at least one lens.

[0059] In the first embodiment of the present invention, an example is described in which the height at which the inner part 412 is positioned is higher than the height at which the outer part 414 is positioned, but this is not limited to the example, and the height at which the outer part 414 is positioned may be higher than the height at which the inner part 412 is positioned.

[0060] The connecting terminal 400 may include a second region 420. The second region 420 may connect the first region 410 and the third region 430. The second region 420 may be bent at least once. The second region 420 may penetrate at least one region of the housing 100, the lens barrel 200, and the retainer 700. Specifically, the second region 420 may pass through a space between the retainer 700 and the lens module 300, a space between the lens barrel 200 and the lens module 300, and a space between the housing 100 and the lens module 300. The second region 420 may include one end 421 connected to the first region 410, a first curved region 422 extending downward from the one end 421, a second curved region 423 extending downward from the first curved region 422, a third curved region 424 extending downward from the second curved region 423, a fourth curved region 425 extending downward from the third curved region 424, and the other end 426 connecting the fourth curved region 425 to the third region 430. In this case, the widths of the first to fourth curved regions 422, 423, 424, and 425 may be the same. The first to fourth curved regions 422, 423, 424, and 425 may have different lengths. The first to fourth curved regions 422, 423, 424, and 425 may have different curvatures. The second region 420 may be formed generally in an 'S' shape.

[0061] The connecting terminal 400 may include a third region 430. The third region 430 may be formed to extend from the second region 420. The third region 430 may be bent from the other end 426 of the second region 420. The third region 430 may be connected to the substrate 510. The third region 430 may be connected to the connector 520. The third region 430 may be electrically connected to the substrate 510. The third region 430 may be electrically connected to the substrate 510 via the connector 520. The third region 430 may have a flat plate shape. The third region 430 may be formed to extend in a direction perpendicular to the optical axis.

[0062] The camera module 10 may include a substrate 510. The camera module 10 may include a substrate 510. The substrate 510 may be disposed in the housing 100. The substrate 510 may include a printed circuit board (PCB) or a flexible printed circuit board (FPCB). The substrate 510 may be coupled to the connecting terminal 400. The substrate 510 may be electrically connected to the connecting terminal 400. The substrate 510 may be electrically connected to the third region 430 of the connecting terminal 400.

[0063] The substrate 510 may include a plurality of substrates 512 and 514. The substrate 510 may include a first substrate 512 on which an image sensor 502 is disposed, and a second substrate 514 disposed under the first substrate 512 and electrically connected to the first substrate. The first and second substrates 512 and 514 may be spaced apart from each other in the optical axis direction (vertical direction) and may be arranged in parallel to each other to improve space efficiency. A connector 520 may be disposed between the first substrate 512 and the second substrate 514. Referring to FIG. 2, the embodiment of the present invention will be described with reference to an example in which the number of substrates is four, but the number of substrates is not limited thereto and may be variously changed.

[0064] The substrate 510 according to the embodiment of the present invention may be replaced with a printed circuit board or a circuit board. The image sensor 502 may be mounted on the substrate 510. At this time, the image sensor 502 may be electrically connected to the substrate 510. For example, the image sensor 502 may be coupled to the substrate 510 by a surface mounting technology (SMT). As another example, the image sensor 502 may be coupled to the substrate 510 by a flip chip technology.

[0065] The substrate 510 includes a control unit and a resistor (R- -01 , R02 ) can be included. -01 , R 02 ) is the first resistor (R- -01 ) and the second resistor (R 02 ) may include a first resistor (R 01 ) may be electrically connected to the first connection portion 412 of the connection terminal 400. 02 ) may be electrically connected to the second connection part 414 of the connection terminal 400. Here, the first resistor (R- -01 ) is the first heat generating material and the second resistor (R 02 ) may be, but is not limited to, a second heat generating material, and a first resistor (R- -01 ) is a second resistor (R 02 ) may refer to the bottom surface of the heating member 600. In the first embodiment of the present invention, the control unit is an MCU, but the control unit is not limited thereto and may be variously configured.

[0066] In addition, a sensing resistor (R- -sense1 , R sense2 ) and a ground resistor (R1, R2) disposed between the connection terminal 400 and the ground (RND) or between the control unit (MCU) and the ground (RND). In this case, the sensing resistor (R -sense1 , R sense2 ) is the first resistor (R 01 A first sensing resistor (R sense2 ) and the second resistor (R 02 ) and the control unit (MCU). sense2 ) can be included. The ground resistors (R1, R2) are the first resistor (R 01 ) and ground (RND). 02 ) and ground (RND).

[0067] The first connection part 412 is connected to a first voltage (V -in1 ) and a first electrode portion having a first voltage (V -in1 ) having a second voltage (V R01 The second electrode portion may include a first resistor (R 01 ) may be electrically connected to the second electrode of the first connection part 412. The second connection part 414 may be electrically connected to the second electrode of the first connection part 412. -in2 ) and a third electrode portion having a third voltage (V -in2 ) is a fourth voltage (V R02 ) may include a fourth electrode portion having a second resistor (R 02 ) may be electrically connected to the fourth electrode portion of the second connection portion 414. In this case, the first resistor (R 01 The voltage applied to the second resistor (R 02 ) can satisfy mathematical formula 2.

[0068]

number

[0069]

number

[0070] First voltage (V -in1 ) and the second voltage (V R01 ) satisfies mathematical formula 3, and the third voltage (V -in2 ) and the fourth voltage (V R02 ) can satisfy mathematical formula 4.

[0071]

number

[0072]

number

[0073] First resistance (R 01 If the voltage V 1 decreases from the initial value, the control unit (MCU) controls the second voltage (V R01 ) value to reduce the first resistor (R 01 If the voltage V 1 increases from the initial value, the control unit (MCU) controls the second voltage (VR 01 ) value is incremented to supply a constant power, thereby maintaining the heating temperature of the heating member 600 constant.

[0074] In addition, the second resistor (R 02 If the voltage V 1 decreases from the initial value, the control unit (MCU) controls the fourth voltage (V R02 ) value to reduce the second resistor (R 02 If the voltage V 1 increases from the initial value, the control unit (MCU) controls the fourth voltage (V R02 ) value is incremented to supply a constant power, thereby maintaining the heating temperature of the heating member 600 constant.

[0075] For this purpose, the camera module 10 according to the first embodiment of the present invention has a first sensing resistor (R sense1 ) and the second voltage (V R01) and the second sensing resistor (R sense2 ) and the fourth voltage (V R02 ) may include a second sensor for sensing the

[0076] The camera module 10 may include a connector 520. The connector 520 may be disposed on the substrate 510. The connector 520 may be electrically connected to the substrate 510. The connector 520 may be disposed between the first substrate 512 and the second substrate 514. The connector 520 may be coupled to the connecting terminal 400. The connector 520 may be electrically connected to the connecting terminal 400. The connector 520 may be electrically connected to the third region 430 of the connecting terminal 400. The connector 520 may electrically connect the substrate 510 and the connecting terminal 400.

[0077] The camera module 10 may include a heating member 600. The heating member 600 may be disposed in the lens module 300. The heating member 600 may be disposed between the lens barrel 200 and the lens module 300. The heating member 600 may be disposed between the first lens 310 and at least one lens in the lens module 300. The heating member 600 may be disposed below the first lens 310. The heating member 600 may be disposed in a region adjacent to the lower surface of the first lens 310. The heating member 600 may be coupled to the connecting terminal 400. The heating member 600 may be coupled to the first region 410 of the connecting terminal 400. The heating member 600 may be disposed between the inner portion 412 and the outer portion 414 of the first region 410 of the connecting terminal 400. The heating member 600 may be coupled to the connecting terminal 400 via an adhesive means 610 such as an adhesive. The heating member 600 may be attached to a region 412 of the first region 410 via a first adhesive means 610 such as an adhesive, and may be attached to a region 414 of the first region 410 via a second adhesive means 620. The heating member 600 may be a heating wrap including a heating sheet and a heating wire disposed on the heating sheet. In this case, the heating wire may include a plurality of heating wires.

[0078] The heating member 600 may be electrically connected to the substrate 510 through the connecting terminal 400. The heating member 600 may generate heat by receiving a current from the substrate 510. At this time, the heating member 600 may be electrically connected to the connecting terminal 400 by anisotropic conductive film bonding (ACF bonding). The heating member 600 may be a transparent heating film coated with indium tin oxide (ITO) having conductivity capable of generating heat due to its own resistance component. The heating member 600 may be formed by, for example, a coating process or a deposition process of an indium tin oxide material. However, this is merely an example, and the material of the heating member 600 is not limited thereto and may be variously changed as long as it is a material capable of generating heat by the supply of a current. The heating member 600 may be disposed in the connecting terminal 400. The heating member 600 may be disposed between an inner portion 412 and an outer portion 414 of the connecting terminal 400. The heating member 600 may include a body and a heat generating material disposed on the body. The heat generating material may include a first heat generating material disposed on an upper surface of the body and a second heat generating material disposed on a lower surface of the body. The body may be disposed between the inner part 412 and the outer part 414 of the connecting terminal 400. The first heat generating material may be disposed on a lower surface of the inner part 412. An upper surface of the first heat generating material may be electrically coupled to a lower surface of the inner part 412. An upper surface of the first heat generating material may be ACF bonded to the lower surface of the inner part 412 via a first contact means 610. A second heat generating material may be disposed on an upper surface of the outer part 414. A lower surface of the second heat generating material may be electrically coupled to an upper surface of the outer part 414. A lower surface of the second heat generating material may be ACF bonded to the upper surface of the outer part 414 via a second contact means 620.

[0079] The camera module 10 may include a retainer 700. The retainer 700 may be disposed on the top or front of the housing 100. The retainer 700 may be coupled to the lens barrel 200. The retainer 700 may be disposed outside the lens barrel 200. The retainer 700 may be disposed on the first lens 310 of the lens module 300 to fix the lens module 300 and the lens barrel 200 to the housing 100. The retainer 700 may be coupled to the lens barrel 200 to fix the lens module 300 accommodated in the lens barrel 200. At this time, an end of the retainer 700 may be formed in a '┐' (inverted L) shape to press the lens module 300 accommodated in the lens barrel 200 downward to fix it, and may be coupled to the lens barrel 200 using an adhesive such as epoxy. That is, the retainer 700 may be disposed on the lens barrel 200 to fix the first lens 310, which is the outermost lens. An O-ring 710 may be disposed between the retainer 700 and the lens module 300 to eliminate a space formed between the retainer 700 and the lens module 300. An O-ring 710 may be disposed between the retainer 700 and the first lens 310 to eliminate a space formed between the retainer 700 and the first lens 310.

[0080] Fig. 10 is a perspective view of a connection terminal and a heating member of a camera module according to another embodiment of the first embodiment of the present invention. Fig. 11 is a partial cross-sectional view of a camera module according to another embodiment of the first embodiment of the present invention. Figs. 12 and 13 are schematic circuit diagrams of a camera module according to another embodiment of the first embodiment of the present invention.

[0081] 10 to 13, a camera module 10 according to another embodiment of the first embodiment of the present invention may include a housing 100, a lens barrel 200, a lens module 300, a connecting terminal 400, a substrate 510, a connector 520, a heating member 600, and a retainer 700, but may be implemented without excluding some of the configurations, and additional configurations are not excluded.

[0082] Also, the camera module 10 according to another embodiment of the first embodiment of the present invention may include a heating device. The heating device according to another embodiment of the first embodiment of the present invention may include a substrate 510, a connecting terminal 400, and a heating member 600, but additional configurations are not excluded.

[0083] It can be understood that, except for the configuration described below, the detailed configuration of the camera module 10 according to another embodiment of the first embodiment of the present invention is the same as the detailed configuration of the camera module 10 according to the first embodiment of the present invention.

[0084] The first region 412 of the camera module 10 according to another embodiment of the first embodiment of the present invention does not have to be divided into an outer portion and an inner portion, that is, the first region 412 may have the same shape as the outer portion 412 or the outer portion 414 of the first region 410 according to the first embodiment of the present invention.

[0085] The first region 412 is disposed on the lower surface of the first lens 310, which is the outermost lens, and the first region 412 may be bonded to the upper surface of the heating member 600. At this time, the lower surface of the first region 412 may be electrically connected to the upper surface of the heating member 600 through a contact means 610, for example, by ACF bonding.

[0086] In this case, the circuit configuration of the camera module 10 according to another embodiment of the first embodiment of the present invention can satisfy the mathematical formula 1 and the mathematical formula 3 of the circuit configuration of the camera module 10 according to the first embodiment of the present invention.

[0087] That is, the first resistor (R 01 ) is changed, but the first resistor (R 01 A first sensing resistor (R sense2 ) can compensate for this.

[0088] Specifically, the first sensing resistor (R sense1 ) and the second voltage (V R01 ) and the first resistor (R 01 ) change value is known, and the second sensing resistor (R sense2 ) and the fourth voltage (V R02 ) and senses the second resistor (R 02 ) change value can be seen.

[0089] First resistance (R 01 If the voltage V 1 decreases from the initial value, the control unit (MCU) controls the second voltage (V R01 ) value to reduce the first resistor (R 01 If the voltage V increases from the initial value, the control unit (MCU) controls the second voltage (V R01 ) value is incremented to supply a constant power, thereby maintaining the heating temperature of the heating member 600 constant.

[0090] In another embodiment of the first embodiment of the present invention, the first region 412 is disposed on the underside of the first lens 310, which is the outermost lens, and the first region 412 is bonded to the upper surface of the heating member 600. However, alternatively, the heating member 600 can be disposed on the underside of the first lens 310, which is the outermost lens, and the first region 412 can be bonded to the underside of the heating member 600.

[0091] Hereinafter, a second embodiment of the present invention will be described in more detail with reference to the accompanying drawings.

[0092] Fig. 14 is a perspective view of a camera device according to a second embodiment of the present invention. Fig. 15 is an exploded perspective view of a camera device according to a second embodiment of the present invention. Fig. 16 is a partial cross-sectional view of a camera device according to a second embodiment of the present invention. Figs. 17 and 18 are perspective views of a partial configuration of a camera device according to a second embodiment of the present invention. Fig. 19 is a block diagram of a camera device according to a second embodiment of the present invention. Fig. 20 is a flowchart of the camera device according to the second embodiment of the present invention. Fig. 21 is a graph for explaining the drive of the camera device according to the second embodiment of the present invention.

[0093] 14 to 21, the camera device 1010 according to the second embodiment of the present invention may include a lens module 1100, a housing 1200, a substrate 1300, an image sensor 1310, a heater 1410, a connecting terminal 1420, a desiccant 1500, a control unit 1910, and a sensor unit 1920, but may be implemented without including some of the configurations, and additional configurations are not excluded.

[0094] Also, referring to FIGS. 14 to 21, the humidity controller of the camera device 1010 according to the second embodiment of the present invention may include a heater 1410, a connecting terminal 1420, and a desiccant 1500, but may be implemented without including some of these components, and additional components are not excluded.

[0095] The camera device 1010 may include a lens module 1100. The lens module 1100 may be disposed in a housing 1200. At least a portion of the lens module 1100 may be accommodated in the housing 1200. At least a portion of the lens module 1100 may be disposed in front of or on the upper side of the housing 1200 through an opening of the housing 1200. The lens module 1100 may be screwed to an inner peripheral surface of the housing 1200. The lens module 1100 may have a thread formed on an outer peripheral surface thereof corresponding to a thread formed on the inner peripheral surface of the housing 1200. The lens module 1100 may include at least one lens. Each lens of the lens module 1100 may be made of a synthetic resin material, a glass material, a quartz material, or the like, but is not limited thereto, and may be made of various materials.

[0096] The camera device 1010 may include a housing 1200. The housing 1200 may form the exterior of the camera device 1010. The lens module 1100, the substrate 1300, the heater 1410, the connection terminal 1420, and the desiccant 1500 may be disposed in the housing 1200. The housing 1200 may include an upper housing and a lower housing. In the second embodiment of the present invention, the housing 1200 is described taking a hexahedral shape as an example, but is not limited thereto.

[0097] The camera device 1010 may include a substrate 1300. The substrate 1300 may be disposed in the housing 1200. The substrate 1300 may be disposed under the lens module 1100. The substrate 1300 may include a printed circuit board (PCB) or a flexible printed circuit board (FPCB). The substrate 1300 may be coupled to the connection terminal 1420. The substrate 1300 may be electrically connected to the connection terminal 1420. The substrate 1300 may be electrically connected to the third region 1426 of the connection terminal 1420. The substrate 1300 may be electrically connected to the connection terminal 1420 via the connection member 1320. The image sensor 1310 may be mounted on the substrate 1300. The substrate 1300 may be electrically connected to the image sensor 1310.

[0098] The substrate 1300 may include a plurality of substrates 1302, 1304, 1306, and 1308. The substrate 1300 may include a first substrate 1302 on which an image sensor 1310 is disposed, a second substrate 1304 disposed under the first substrate 1302 and electrically connected to the first substrate 1302, a third substrate 1306 disposed under the second substrate 1304 and electrically connected to the second substrate 1304, and a fourth substrate 1308 disposed under the third substrate 1306 and electrically connected to the third substrate 1306. In this case, the first to fourth substrates 1302, 1304, 1306, and 1308 may be disposed apart from each other in the optical axis direction (vertical direction) and may be disposed in parallel to each other to improve space efficiency. A connection member 1320 may be disposed between the first substrate 1302 and the second substrate 1304. In the second embodiment of the present invention, the number of substrates 1302, 1304, 1306, and 1308 is four, but the number of substrates 1302, 1304, 1306, and 1308 is not limited thereto and may be changed in various ways.

[0099] The camera device 1010 may include an image sensor 1310. The image sensor 1310 may be disposed in the housing 1200. The image sensor 1310 may be disposed in the housing 1200. The image sensor 1310 may be disposed on the substrate 1300. The image sensor 1310 may be electrically connected to the substrate 1300. The image sensor 1310 may be disposed on the entire surface or upper surface of the first substrate 1302. The image sensor 1310 may be disposed in the opening 1412 of the heater 1410 and / or the opening of the desiccant 1500. The image sensor 1310 may be mounted on one surface of the first substrate 1302. The image sensor 1310 may be electrically connected to the first substrate 1302. For example, the image sensor 1310 may be coupled to the substrate 1300 by surface mounting technology (SMT). In another example, the image sensor 1310 may be coupled to the substrate 1300 by flip chip technology. The optical axis of the image sensor 1310 may be aligned with the optical axis of the lens module 1100.

[0100] The camera device 1010 may include a heating element 1400. The heating element 1400 may include a connection terminal 1420 and a heater 1410. At least a portion of the heating element 1400 may be formed of a flexible printed circuit board or a flexible substrate. The heating element 1400 may emit heat when a current is applied from the substrate 1300. The heating element 1400 may be a transparent heating film coated with indium tin oxide (ITO) having conductivity capable of generating heat due to its own resistance component. The heating element 1400 may be formed by, for example, a coating process or a deposition process of an indium tin oxide material. However, this is merely an example, and the material of the heating element 1400 may be variously changed without being limited thereto as long as it is a material capable of generating heat by the supply of current.

[0101] The camera device 1010 may include a connecting terminal 1420. The connecting terminal 1420 may be coupled to the substrate 1300. The connecting terminal 1420 may be electrically connected to the substrate 1300. The connecting terminal 1420 may be coupled to the second substrate 1304. The connecting terminal 1420 may be electrically connected to the second substrate 1304. The connecting terminal 1420 may be coupled to a connecting member 1320. The connecting terminal 1420 may be electrically connected to the substrate 1300 via the connecting member 1320. The connecting terminal 1420 may be connected to a power source disposed on the substrate 1300. The connecting terminal 1420 may be coupled to the heater 1410. The connecting terminal 1420 may be formed of a flexible printed circuit board or a flexible substrate. The connecting terminal 1420 may be formed in an overall '⊂' (horizontal U) shape.

[0102] The connection terminal 1420 may include a first region 1422 coupled to the heater 1410, a third region 1426 coupled to the substrate 1300, and a second region 1424 connecting the first region 1422 and the third region 1426. One side of the first region 1422 may be connected to the heater 1410, and at least a portion of the first region 1422 may be bent downward, and the other side of the first region 1422 may be connected to the second region 1424. The first region 1422 may extend generally in a horizontal direction. One side of the second region 1424 may be connected to the first region 1422, and the other side may be connected to the third region 1426. At least a portion of the second region 1424 may be bent. The second region 1424 may extend generally in a vertical direction. One side of the third region 1426 may be connected to the second region 1424 and the other side may be connected to the substrate 1300. The other side of the third region 1426 may be directly connected to the second substrate 1304 or may be electrically connected to the first substrate 1302 and / or the second substrate 1304 through a connecting member 1320.

[0103] The camera device 1010 may include a heater 1410. The heater 1410 may be connected to the connecting terminal 1420. The heater 1410 may be electrically connected to the connecting terminal 1420. The heater 1410 may be connected to a first region 1422 of the connecting terminal 1420. The heater 1410 may be electrically connected to the first region 1422 of the connecting terminal 1420. The heater 1410 may have a closed-loop shape. The heater 1410 may be disposed on the substrate 1300. The heater 1410 may be disposed on the first substrate 1302. The heater 1410 may be disposed on the entire surface or the upper surface of the first substrate 1302. The heater 1410 may be bonded to the entire surface or the upper surface of the first substrate 1302. The heater 1410 may be disposed in a region adjacent to the image sensor 1310. The heater 1410 may be disposed in a region surrounding the image sensor 1310. The heater 1410 may include an opening 1412. The image sensor 1310 may be disposed in the opening 1412 of the heater 1410. The heater 1410 may be formed in a square shape. Alternatively, the heater 1410 may be formed in a donut or triangular band shape corresponding to the shape of the image sensor 1310. The heater 1410 may include a hot wire having a closed loop shape. As a result, when a current is supplied to the heater 1410, it may emit more heat than the connection terminal 1420. That is, when a current is supplied through the connection terminal 1420, the heater 1410 may generate heat to remove moisture from the desiccant 1500.

[0104] The camera device 1010 may include a desiccant 1500. The desiccant 1500 may be disposed on the heater 1410. The desiccant 1500 may be disposed on one side of the heater 1410. The desiccant 1500 may be attached to one side of the heater 1410. The desiccant 1500 may be attached to the entire surface or the upper surface of the heater 1410. The desiccant 1500 may be attached to one side of the heater 1410 via an adhesive or the like. The desiccant 1500 may also be attached via an adhesive film or the like attached to one side of the desiccant 1500. The desiccant 1500 may be disposed in a region adjacent to the image sensor 1310. The desiccant 1500 may be disposed in a region surrounding the image sensor 1310. The desiccant 1500 may be formed in a shape corresponding to the shape of the heater 1410. The desiccant 1500 may include an opening. The image sensor 1310 may be disposed in the opening of the desiccant 1500. The desiccant 1500 may be formed in a square shape. The desiccant 1500 may have a closed-loop shape. The desiccant 1500 may include silica gel. The desiccant 1500 is preferably formed to have a width of 25 mm, a length of 25 mm, and a thickness of 1.3 mm. In this case, interference with other components in the camera device 1010 can be prevented. In addition, the desiccant 1500 may be disposed on both sides of the heater 1510 since the contact area with the heater 1510 is important.

[0105] The desiccant 1500 can absorb moisture generated from within the housing 1200. Specifically, the desiccant 1500 can absorb moisture when the internal temperature of the housing 1200 is equal to or lower than a first reference value. In this case, the first reference value means a value predetermined by a designer. For example, the first reference value can be room temperature or a value between 25° C. and 30° C. Alternatively, the desiccant 1500 can absorb moisture when the internal humidity of the housing 1200 is equal to or higher than a third reference value.

[0106] 15 to 18, the heater 1410 and the desiccant 1500 are illustrated as being shaped like a square, but the heater 1410 and the desiccant 1500 may be shaped like a square, circle, or triangle. In this case, the heater 1410 and the desiccant 1500 may be disposed on the inner surface of the substrate 1300 or the housing 1200.

[0107] In addition, in Figures 15 to 18, the heater 1410 and the desiccant 1500 are described as being arranged in the area surrounding the image sensor 1310 as an example, but this is not limited thereto, and the heater 1410 and the desiccant 1500 can also be arranged in the area surrounding the lens module 1100.

[0108] The camera device 1010 may include a sensor unit 1920. The sensor unit 1920 may be disposed in the housing 1200. The sensor unit 1920 may be disposed on the substrate 1300. The sensor unit 1920 may be electrically connected to the substrate 1300. The sensor unit 1920 may measure temperature and / or humidity in the housing 1200. The sensor unit 1920 may be electrically connected to the control unit 1910. Temperature and / or humidity information measured by the sensor unit 1920 may be transferred to the control unit 1910. The sensor unit 1920 may include a sensor that measures temperature and / or humidity. Alternatively, the sensor unit 1920 may include a first sensor that measures temperature and a second sensor that measures humidity.

[0109] The camera device 1010 may include a control unit 1910. The control unit 1910 may be disposed on the substrate 1300. The control unit 1910 may be electrically connected to the sensor unit 1920 and the heating unit 1930. The control unit 1910 may control the heating unit 1930 based on temperature and / or humidity information inside the housing 1200 measured by the sensor unit 1920. Here, the heating unit 1930 may refer to the heating element 1400. The heating unit 1930 may include a connection terminal 1420 and a heater 1410. Alternatively, the heating unit 1930 may refer to only the heater 1410. The control unit 1910 may control the on / off of the heater 1410. Specifically, the control unit 1910 may operate the heater 1410 when the internal temperature of the housing 1200 is equal to or higher than a second reference value. At this time, the second reference value refers to a value predetermined by a designer. For example, the second reference value may be a value between 85° C. and 100° C. Alternatively, the control unit 1910 may operate the heater 1410 when the internal humidity of the housing 1200 is equal to or lower than the fourth reference value. For example, in the second embodiment of the present invention, it is preferable that the control unit 1910 operates the heater 1410 at 120° C. for about 1 to 2 minutes to remove moisture from the desiccant 1500.

[0110] Hereinafter, a method for adjusting the humidity adjuster of the camera device 1010 according to the second embodiment of the present invention will be described with reference to FIG.

[0111] In the temperature and / or humidity sensing process (S101), the sensor unit 1920 senses the temperature and / or humidity in the housing and transmits the information to the control unit 1910.

[0112] In the step of checking whether the condensation conditions are satisfied (S102), if the condensation conditions are satisfied, the control unit 1910 performs a heat generation signal generating step (S103), and if the condensation conditions are not satisfied, the control unit 1910 performs the temperature and / or humidity sensing step (S101) again.

[0113] Here, whether or not the condensation condition exists can be determined based on the area where the temperature and humidity values ​​measured by the sensor unit 1920 are located based on the temperature and humidity graph of Fig. 21. Here, the horizontal axis represents temperature and the vertical axis represents humidity.

[0114] In the heating signal generating step (S103), the control unit 1910 transmits a heating signal to the heating element 1400 to cause the heating element 1400 to generate heat. In this case, the heating element 1400 may refer to the heater 1410 excluding the connection terminal 1420.

[0115] In an improvement confirmation step (S104), whether the internal temperature and humidity environment of the housing 1200 has improved is measured via the sensor unit 1920. If the internal temperature and humidity environment has improved, the control unit 1910 generates an end signal, and if the internal temperature and humidity environment has not improved, the control unit 1910 continues to generate a heat generation signal.

[0116] In the end signal generating step (S105), if the internal temperature and humidity environment of the housing 1200 measured through the sensor unit 1920 is improved, the control unit 1910 ends the generation of the heat generation signal.

[0117] Therefore, the camera device 1010 according to the second embodiment of the present invention can prevent the occurrence of condensation including frost on the lens of the lens module 1100 and appropriately maintain the humidity inside the housing 1200.

[0118] Fig. 22 is a perspective view of a camera device according to another embodiment of the second embodiment of the present invention. Fig. 23 is an exploded perspective view of a camera device according to another embodiment of the second embodiment of the present invention. Fig. 24 is a partial cross-sectional view of a camera device according to another embodiment of the second embodiment of the present invention. Figs. 25 and 26 are perspective views of a partial configuration of a camera device according to another embodiment of the second embodiment of the present invention.

[0119] 22 to 26, a camera device 1020 according to another embodiment of the second embodiment of the present invention may include a lens module 1100, a housing 1200, a substrate 1300, an image sensor 1310, a connector 1600, a heater 1710, a connecting terminal 1720, a desiccant 1800, a control unit 1910, and a sensor unit 1920, but may be implemented without including some of the configurations, and additional configurations are not excluded.

[0120] Also, referring to Figures 22 to 26, the humidity controller of the camera device 1020 according to another embodiment of the second embodiment of the present invention may include a heater 1710, a connecting terminal 1720, and a desiccant 1800, but may be implemented without excluding some of the components, and additional components are not excluded.

[0121] It can be understood that the configuration of a camera device 1020 according to another embodiment of the second embodiment of the present invention, which is not described below, is the same as the configuration of the camera device 1010 according to the second embodiment of the present invention within the same drawing range.

[0122] The camera device 1020 may include a connector 1600. The connector 1600 may be disposed in the housing 1200. The connector 1600 may be coupled to the board 1300. The connector 1600 may be coupled to the board 1300 through the housing 1200. The connector 1600 may be electrically connected to the board 1300. The connector 1600 may supply an external power source to the inside of the camera device 1020. The cross section of the connector 1600 may be formed in a circular shape. Alternatively, the cross section of the connector 1600 may be variously changed to an elliptical or rectangular shape. The camera device 1010 according to the second embodiment of the present invention may also include the connector 1600. An O-ring 1610 may be disposed in a space between the connector 1600 and the housing 1200 to seal the space between the connector 1600 and the housing 1200.

[0123] The camera device 1020 may include a heating element 1700. The heating element 1700 may include a connection terminal 1720 and a heater 1710. At least a portion of the heating element 1700 may be formed of a flexible printed circuit board or a flexible substrate. The heating element 1700 may emit heat when a current is applied from the substrate 1300. The heating element 1700 may be a transparent heating film coated with indium tin oxide (ITO) having conductivity capable of generating heat due to its own resistance component. The heating element 1700 may be formed by, for example, a coating process or a deposition process of an indium tin oxide material. However, this is merely an example, and the material of the heating element 1700 may be variously changed without being limited thereto as long as it is a material capable of generating heat when a current is supplied thereto.

[0124] The camera device 1020 may include a connecting terminal 1720. The connecting terminal 1720 may be coupled to the substrate 1300. The connecting terminal 1720 may be electrically connected to the substrate 1300. The connecting terminal 1720 may be coupled to the second substrate 1304. The connecting terminal 1720 may be electrically connected to the second substrate 1304. The connecting terminal 1720 may be coupled to the connecting member 1320. The connecting terminal 1720 may be electrically connected to the substrate 1300 via the connecting member 1320. The connecting terminal 1720 may be connected to a power source disposed on the substrate 1300. The connecting terminal 1720 may be coupled to the heater 1410. The connecting terminal 1720 may be formed of a flexible printed circuit board or a flexible substrate. The connecting terminal 1720 may be formed in an overall '⊂' shape.

[0125] The connection terminal 1720 may include a first region 1722 disposed adjacent to the connector 1600 and coupled to the heater 1710, a fourth region 1728 coupled to the substrate 1300, and second and third regions 1724 and 1726 connecting the first region 1722 and the fourth region 1728. One side of the first region 1722 may be connected to the heater 1710, and the other side of the first region 1722 may be connected to the second region 1724. At least a portion of the first region 1722 may be bent. The first region 1722 may extend generally in a horizontal direction. One side of the second region 1724 may be connected to the first region 1722, and the other side of the second region 1724 may be connected to the third region 1726. The second region 1724 may extend generally in a vertical direction. One side of the third region 1726 may be connected to the second region 1724, and the other side of the third region 1726 may be connected to the fourth region 1728. At least a portion of the third region 1726 may be folded. The third region 1726 may extend generally in a horizontal direction. One side of the fourth region 1728 may be connected to the third region 1726. The fourth region 1728 may be coupled to the substrate 1300. Specifically, the fourth region 1728 may be directly coupled to the second substrate 1304, or may be electrically coupled to the substrate 1300 and / or the second substrate 1304 via the connecting member 1320.

[0126] The camera device 1020 may include a heater 1710. The heater 1710 may be connected to a connection terminal 1720. The heater 1710 may be electrically connected to the connection terminal 1720. The heater 1710 may be connected to a first region 1722 of the connection terminal 1720. The heater 1710 may be electrically connected to the first region 1722 of the connection terminal 1720. The heater 1710 may have a closed-loop shape. The heater 1710 may be disposed adjacent to an inner surface of the housing 1200. The heater 1710 may be disposed adjacent to a lower surface of the inner surface of the housing 1200. The heater 1710 may be disposed in a region adjacent to the connector 1600. The heater 1710 may include an opening 1712. At least a portion of the connector 1600 may be disposed in the opening 1712 of the heater 1710. The heater 1710 may be disposed in a region surrounding the connector 1600. The heater 1710 may be formed in an 'O' shape or a donut shape. Alternatively, the heater 1710 may be formed in a square or triangular shape corresponding to the cross-sectional shape of the connector 1600. The heater 1710 may include a hot wire having a closed loop shape. As a result, when a current is supplied to the heater 1710, it may emit more heat than the connection terminal 1420. That is, when a current is supplied through the connection terminal 1720, the heater 1710 generates heat to remove moisture from the desiccant 1700.

[0127] The camera device 1020 may include a desiccant 1800. The desiccant 1800 may be disposed on the heater 1710. The desiccant 1800 may be disposed on one side of the heater 1710. The desiccant 1800 may be attached to one side of the heater 1710. The desiccant 1800 may be attached to an upper surface of the heater 1410. The desiccant 1800 may be attached to the upper surface of the heater 1410 via an adhesive or the like. The desiccant 1800 may be disposed in a region adjacent to the connector 1600. The desiccant 1800 may be disposed around the connector 1600. The desiccant 1800 may be disposed in a region surrounding the connector 1600. The desiccant 1800 may be disposed adjacent to an inner surface of the housing 1200. The desiccant 1800 may be disposed adjacent to a lower surface of the inner surface of the housing 1200. The desiccant 1800 may include an opening. At least a part of the connector 1600 may be disposed in the opening of the desiccant 1800. The desiccant 1800 may be formed in the same shape as the heater 1710. The desiccant 1800 may be formed in an 'O' shape or a donut shape. Alternatively, the shape of the desiccant 1800 may be formed in a square band or a triangular band shape corresponding to the shape of the heater 1710. The desiccant 1800 may include silica gel. The desiccant 1800 is preferably formed to have a width of 25 mm, a length of 25 mm, and a thickness of 1.3 mm. In this case, interference with other components in the camera device 1020 may be prevented. In addition, the desiccant 1800 may be disposed on both sides of the heater 1710 since the contact area with the heater 1710 is important. In this case, the insulating agent 1820 may be disposed between the desiccant 1800 disposed on the lower surface of the heater 1710 and the inner surface of the housing 1200, or may be omitted from the configuration.

[0128] The desiccant 1800 may absorb moisture generated from within the housing 1200. Specifically, the desiccant 1800 may absorb moisture when the internal temperature of the housing 1200 is equal to or lower than a first reference value. At this time, the first reference value means a value predetermined by a designer. Alternatively, the desiccant 1800 may absorb moisture when the internal humidity of the housing 1200 is equal to or higher than a third reference value.

[0129] 23 to 26, the heater 1710 and the desiccant 1800 are illustrated as being O-shaped, but the heater 1710 and the desiccant 1800 may be rectangular, circular, or triangular. In this case, the heater 1710 and the desiccant 1800 may be disposed on the inner surface of the substrate 1300 or the housing 1200.

[0130] The camera device 1020 may include a heat insulator 1820. The heat insulator 1820 may be disposed on the other side of the heater 1710. The heat insulator 1820 may be attached to the other side of the heater 1710 via an adhesive 1810. The heat insulator 1820 may be disposed between the heater 1710 and an inner surface of the housing 1200. In this way, when the housing 1200 is made of an aluminum material, it is possible to prevent the heat generated from the heater 1710 from being lost through the housing 1200. That is, it is possible to improve the efficiency with which the heat generated from the heater 1710 is transferred to the desiccant 1800. The shape of the heat insulator 1820 may be formed to correspond to the shape of the heater 1710.

[0131] The camera device 1020 according to another embodiment of the second embodiment of the present invention can achieve the same effects as the camera device 1010 according to the second embodiment of the present invention.

[0132] Although the first and second embodiments of the present invention have been described separately above, the third embodiment of the present invention may include at least a portion of the configuration of the first embodiment and at least a portion of the configuration of the second embodiment. For example, the third embodiment may include both the heating member 600 and the desiccant 1500.

[0133] Although the embodiments of the present invention have been described above with reference to the attached drawings, it should be understood by those skilled in the art that the present invention can be embodied in other specific forms without changing the technical concept or essential features of the present invention. Therefore, it should be understood that the embodiments described above are illustrative in all respects and are not limiting.

Claims

1. A substrate; a connection terminal electrically connected to the substrate; a heating member electrically connected to the connection terminal, the connecting terminal includes a first region having an inner portion and an outer portion, a third region electrically connected to the substrate, and a second region disposed between the first region and the third region, the heating member is disposed between the inner portion and the outer portion of the connecting terminal; A heating device, wherein a height at which the inner portion is positioned in an optical axis direction is different from a height at which the outer portion is positioned.

2. The inner portion is folded and extends at a middle region at one end of the second region, The heating device according to claim 1 , wherein the outer portion extends by being folded at an outer region of the one end of the second region.

3. The heating device according to claim 1 or 2, wherein the inner portion and the outer portion are spaced apart from each other.

4. 4. The heating device of claim 1, wherein the inner portion and the outer portion include curved areas.

5. The heating device according to claim 1 , wherein the heating member is formed in a closed loop shape.

6. The heating device according to claim 1 , wherein the heating member includes a body and a heat generating material disposed on the body.

7. The heating device of claim 6 , wherein the heat generating material includes a first heat generating material disposed on an upper surface of the body of the heating member and a second heat generating material disposed on a lower surface of the body of the heating member.

8. The inner portion is disposed on an upper surface of the heating member, The heating device according to claim 6 , wherein the outer portion is disposed on a lower surface of the heating member.

9. A substrate; a lens barrel disposed on the substrate; A first lens disposed on the lens barrel; a heating member disposed between the first lens and the lens barrel; a connection terminal electrically connected to the heating member, The heating member includes a body and a heat generating material disposed in the body. the connecting terminal includes a first region connected to the heat generating material of the heating member and including an inner portion and an outer portion, a third region electrically connected to the substrate, and a second region disposed between the first region and the third region; the heating member is disposed between the inner portion and the outer portion of the connecting terminal; A camera module, wherein a height at which the inner portion is located and a height at which the outer portion is located in an optical axis direction are different from each other.

Images