RFID apparatus having multi-layer reactive strap, and associated system and method

Abstract

To provide an RFID apparatus that includes a reactive strap for providing greater inductance.SOLUTION: An RFID apparatus comprises a multi-layer reactive strap 10 that includes a first substrate 14, a first conductor unit 18, a second conductor unit 22, and a first connecting unit 58. The first conductor unit 18 surrounds a first region and is disposed on a first side of the first substrate 14. The second conductor unit 22 surrounds a second region and is disposed on a second side of the first substrate 14. The first connector unit 58 couples the first conductor unit 18 and the second conductor unit 22 together, thereby forming a multi-turn coil including both the first conductor unit 18 and the second conductor unit 22.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] (CROSS REFERENCE TO RELATED APPLICATIONS) This application claims the benefit of U.S. Provisional Patent Application No. 62 / 954,476, filed December 28, 2019, the entirety of which is incorporated herein by reference. [Background technology]

[0002] Devices incorporating wireless communication approaches, including RFID technology, are widely used in a variety of different applications, including incorporation into merchandise labels or tags for tracking and security purposes. Such systems are well known in the retail industry, including in association with items such as clothing, for inventory control and security against theft and other loss.

[0003] An RFID device integrated into a merchandise label or tag may have various integrated components, including an RFID chip that contains data such as an identification code for the type of product and an identification code for the exact item associated with the unique identification code. Other components may include an antenna electrically connected to the RFID chip, which serves to transmit and / or receive signals to other RFID devices, such as an RFID reader system.

[0004] Clothing labels or tags may include RFID devices. As an article of clothing is worn and used, the RFID devices may be subjected to stresses such as washing, folding, or otherwise handling the associated article of clothing. Furthermore, labels or tags incorporating wirelessly communicating RFID devices may affect the comfort of the user. Thus, improvements may be made to conventional systems, such as to improve durability or comfort. Summary of the Invention

[0005] There are various aspects of the invention that may be implemented separately or together in the wireless communication devices and systems described and claimed herein. These aspects may be used alone or in combination with other aspects of the invention described herein, and describing these aspects together is not intended to exclude using these aspects separately or claiming such aspects separately or in different combinations as expressly set forth in the claims appended hereto.

[0006] In some embodiments, reactive RFID straps designed to couple to an antenna to form a long-range RFID tag can be improved by using two or more layers to increase the inductance in a particular area, which can make the reactive strap smaller for a particular resonant frequency. The smaller size offers many advantages. For example, a smaller reactive RFID strap can be less noticeable in a woven RFID label used on clothing. Smaller reactive RFID straps can also be more robust and provide additional options for controlling the coupling between the reactive strap and the antenna.

[0007] In some embodiments, an RFID device may include a multi-layer reactive strap having a first substrate, a first conductor portion, a second conductor portion, and a first connector portion. The first conductor portion may surround a first region and may be disposed on a first side of the first substrate. The second conductor portion may surround a second region and may be disposed on a second side of the first substrate. The first connector portion may couple the first conductor portion and the second conductor portion together, thereby forming a multi-turn coil including both the first conductor portion and the second conductor portion.

[0008] In some embodiments, the first substrate may be at least partially formed of a dielectric. The RFID device may include a radio frequency identification (RFID) chip coupled to the first conductor portion. The RFID device may include an antenna configured to be reactively coupled to the multi-layer reactive strap. The RFID device may include a device substrate having a first side attached to the multi-layer reactive strap and the antenna. The RFID device may include a second connector portion coupling the first conductor portion and the second conductor portion together. The first connector portion may extend through the first substrate. The first dielectric substrate may include a flexible material.

[0009] In some embodiments, at least one of the first and second conductor portions may include a multi-turn coil. Each of the first and second conductor portions may include a multi-turn coil or a single-turn coil. The multi-turn coil of the connected first and second conductor portions may provide a greater inductance in a particular area than a conductor having a single turn surrounding the same area. The first and second conductor portions include different numbers of turns.

[0010] In various embodiments, the balance of the number of turns between the first and second conductor portions and the relative positions of the first and second conductor portions can affect the near magnetic field of the multi-layer reactive strap and the coupling between the antenna and the multi-layer strap. The number of turns of the first and second conductor portions can be evenly distributed on the first and second sides of the first dielectric substrate.

[0011] In some embodiments, the first conductor portion may be connected to the second conductor portion by one or more of crimping, welding, or forming plated-through holes. The first conductor portion may be connected to the second conductor portion by using a coupling capacitance between two areas of metal on opposite sides of the first dielectric substrate. The RFID chip may have a capacitance that is less than the coupling capacitance.

[0012] In some embodiments, the RFID device includes a second substrate and a third conductor. The second conductor may include a first side that contacts the second side of the first substrate, and the second conductor may include a second side that contacts the first side of the second substrate. The third conductor may include a first side that contacts the second side of the second substrate. The RFID device may include a third substrate and a fourth conductor. The third conductor may include a second side that contacts the first side of the third substrate, and the fourth conductor may include a first side that contacts the second side of the third substrate. The RFID device may include an antenna disposed on the device substrate and configured to be reactively coupled to the multi-layer reactive strap. The device substrate may form any one of the first substrate, the second substrate, or the third substrate.

[0013] In various embodiments, a method of forming an RFID device may include forming a multi-layer reactive strap by disposing a first conductor portion surrounding a first region on a first side of a first substrate and a second conductor portion surrounding a second region on a second side of the first substrate, and forming a multi-turn coil including both the first conductor portion and the second conductor portion by coupling the first conductor portion and the second conductor portion together with a first connection portion.

[0014] In various embodiments, the first substrate may be at least partially formed of a dielectric. The method may include coupling a radio frequency identification (RFID) chip to the first conductor portion. The method may include attaching an antenna to the device substrate and attaching a multi-layer reactive strap to the device substrate. The antenna may be configured to be reactively coupled to the multi-layer reactive strap. Both the multi-layer reactive strap and the antenna may be attached to a first side of the device substrate. The method may include coupling the first conductor portion and the second conductor portion together with a second connection portion.

[0015] In some embodiments, at least one of the first conductor portion and the second conductor portion may include a multi-turn coil. Each of the first conductor portion and the second conductor portion may include a multi-turn coil. The first conductor portion and the second conductor portion may include a different number of turns. The number of turns of the first conductor portion and the second conductor portion may be evenly distributed on the first and second sides of the first dielectric substrate. The first conductor portion may be connected to the second conductor portion by one or more of crimping, welding, or forming a plated-through hole. The first conductor portion may be connected to the second conductor portion by using capacitance.

[0016] In some embodiments, the method may include attaching a first side of the second substrate to a second side of the second conductor and attaching a first side of the third conductor to the second side of the second substrate. The method may include attaching a first side of the third substrate to the second side of the third conductor and attaching a first side of the fourth conductor to the second side of the third conductor. The device substrate may form any one of the first substrate, the second substrate, or the third substrate. [Brief description of the drawings]

[0017] [Figure 1] FIG. 2 is a schematic diagram of a prior art reactive strap having a single layer, provided for comparison purposes. [Diagram 2] 1 is a schematic diagram of a portion of a multi-layer reactive strap, according to some embodiments. [Diagram 3] 3A and 3B are schematic diagrams illustrating the reduced area footprint of a multi-layer reactive strap compared to a single layer reactive strap, according to some embodiments. [Figure 4] 4A and 4B are schematic diagrams illustrating the reduced area footprint of a multi-layer reactive strap compared to a single layer reactive strap, according to some embodiments. [Diagram 5] 5A and 5B are schematic diagrams illustrating possible differences in size of a device using a multi-layer reactive strap compared to a device using a single layer reactive strap, according to some embodiments. [Figure 6] 6A and 6B are schematic diagrams illustrating implementation configurations for multi-layer reactive straps, according to some embodiments. [Figure 7] 7A, 7B, and 7C are schematic partial cross-sectional views of a multi-layer reactive strap, according to some embodiments. [Figure 8] 1 is a schematic cross-sectional view illustrating components of an RFID device according to some embodiments. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0018] As necessary, detailed embodiments of the present invention are disclosed herein; however, it is to be understood that the disclosed embodiments are merely exemplary of the present invention, which may be embodied in various forms. Accordingly, the specific details disclosed herein should not be construed as limiting, but rather as a basis for the claims and as a representative basis for teaching one of ordinary skill in the art to employ the present invention in its various forms in substantially any suitable manner.

[0019] FIG. 1 is a schematic diagram showing the configuration of a prior art reactive strap 1 to establish some basic parameters. Prior art reactive strap 1 includes a circular conductor 2 coupled to an RFID chip 3. Conductor 2 has a conductor width w and a diameter d. The loop can be considered to include a curve with an inductance per unit length α that varies with conductor width w. For a simple circular shape, the length of the loop is πd. Combining the inductance per unit length with the length of the loop results in an inductance that resonates with the capacitance of the RFID chip 3 at a desired frequency. When the loop is coupled to an antenna, an RFID response can be provided.

[0020] In various embodiments, such as FIG. 2, the multi-layer reactive strap 10 includes an RFID chip 12. The multi-layer reactive strap 10 may include a first dielectric substrate 14 (e.g., at least one thin dielectric-based substrate), a first layer 16 including a first conductor portion 18 disposed on at least a first side of the first substrate 14, and a second layer 20 including a second conductor portion 22 disposed on at least a second side of the first substrate 14. One or both of the first conductor portion 18 and the second conductor portion 22 may surround at least an enclosed area 56. The areas surrounded by the first conductor portion 18 and the second conductor portion 22 may be the same or different.

[0021] The first conductor portion 18 and the second conductor portion 22 may be coupled via one or both of the first connection portion 58 and the second connection portion 60 to form a multi-turn coil or to form a larger multi-turn coil. For example, one or both of the first conductor portion 18 and the second conductor portion 22 may be or include a multi-turn coil, and the connection between the first conductor portion 18 and the second conductor portion 22 may form a larger multi-turn coil. One or both of the first conductor portion 18 and the second conductor portion 22 may have a generally circular shape or any other shape capable of enclosing the enclosed area 56, such as a triangular shape, a square shape, a hexagonal shape, an octagonal shape, a circular shape, and any other planar shape.

[0022] In Figure 2, a two layer reactive strap 10 includes first and second conductor portions 18, 22 on first and second layers 16, 20. In this example, the inductance varies with the inductance per unit length α' and diameter d' as in Figure 1, but also with the number of turns n of the coil when the first conductor portion 18 and the second conductor portion 22 are combined. Thus, the inductance L may be determined by the formula L = α' · π · d' · n. The inductance L may vary depending on the formation of the first and second conductor portions 18, 22.

[0023] In various embodiments, the desired number of turns n can be distributed between the two layers; for example, if four turns are required, the turns can be distributed evenly with two turns located on each side of the base substrate 14, or asymmetrically with three turns on one side and one turn on the opposite side. The balance of the turns and their position relative to each other will affect the characteristics of the near magnetic field of the multi-layer reactive strap 10 and thus the coupling with the antenna. Thus, it will be appreciated that at least one of the first and second conductor portions can include a multi-turn coil, the first and second conductor portions can include different numbers of turns, and / or both the first and second conductor portions can include multi-turn coils. Thus, the number of turns of the first and second conductor portions can be distributed evenly on the first and second sides of the base substrate, or asymmetrically on the first and second sides of the base substrate.

[0024] 3A and 3B provide schematic diagrams of exemplary devices La and Lb (e.g., textile labels, RFID tags) including antennas Aa and Ab, respectively. Antennas Aa, Ab may be constructed of conductive materials, such as aluminum foil, conductive ink, graphene, or other suitable conductive materials, such as other metals. Also, the schematic diagram of FIG. 3A shows a conventional single layer reactive strap 110a having a relatively large area and / or diameter d. According to some embodiments, such as FIG. 3B, a multi-layer reactive strap 110b may occupy a smaller area and / or diameter d' that may provide the same or greater inductance as the single layer reactive strap 110a.

[0025] In various embodiments, the device La may have a width 62a extending along the Y axis and a length 64a extending along the X axis. The single layer reactive strap 110a may be spaced from the antenna Aa by a distance 52a measured along the Y axis and substantially aligned with the center of the antenna Aa measured along the X axis. The single layer reactive strap 110a may be disposed between the antenna Aa and an edge of the device La that extends along the X axis and is distal to the antenna Aa and may be a distance 54a from the edge.

[0026] In various embodiments, the multi-layer reactive strap 110b may have a distance 52b from the antenna Ab that is equal to or less than the distance 52a. The multi-layer reactive strap 110b may be disposed between the antenna Ab (e.g., measured along the Y axis) and an edge of the device Lb that extends along the X axis and is distal to the antenna Ab. The multi-layer reactive strap 110b may be a distance 54b from the edge. In some embodiments, the distance 54b may be greater than the distance 54a, taking into account the reduced area occupied by the multi-layer reactive strap 110b compared to the area occupied by the single layer reactive strap 110a.

[0027] In some embodiments, the reduction in occupied diameter and / or area of ​​multi-layer reactive strap 110b can be such that a dimension of device La is a fraction of a corresponding dimension of device Lb, e.g., 100-90%, 90-80%, 80-70%, 70-60%, 60-40%, 40-20%, 20-5% of a dimension of device La. For example, width 62b can be a fraction of width 62a and / or length 64b can be a fraction of length 64a based on the reduction in size of the occupied area of ​​multi-layer reactive strap 110b from the occupied area of ​​single layer reactive strap 110a. Similarly, diameter d' can be a fraction of diameter d and / or the occupied area of ​​multi-layer reactive strap 110b can be a fraction of the occupied area of ​​single layer reactive strap 110a.

[0028] If the textile label is intended to be placed inside a garment, the smaller multi-layer reactive strap 110b may provide the advantage of facilitating the construction of a smaller label that is less likely to cause discomfort or irritation. In some embodiments, the multi-layer reactive strap 110b may be thicker and / or stiffer than the single layer reactive strap 110a, which may help prevent wear and tear or damage from washing. In some embodiments, the reduced area footprint of the multi-layer reactive strap 110b may reduce the overall stiffness of the device Lb of FIG. 3B compared to the device La of FIG. 3A. The stiffness of the device Lb may be reduced compared to the stiffness of the device La in terms of bending stiffness around the X-axis, Y-axis, or other axis in the XY plane. The devices La and Lb may each include a substrate 44a or 44b constructed of any one or more of plastic, metal, fabric, mesh, glass, ceramic, paper, or cardboard.

[0029] In some embodiments, the distance 52b can be 0.8-1.2 mm, 0.6-1.4 mm, 0.4-1.6 mm, 0-1.8 mm, 1.8-3 mm, 3-6 mm, 6-10 mm, 0 mm to up to 2 times the diameter d', or more. In some embodiments, the multi-layer reactive strap 110b can overlap and / or directly contact the antenna Ab by 0-0.3 mm, 0.3-0.7 mm, 0.7-1.1 mm, or 1.1-3 mm.

[0030] 4A and 4B provide schematic diagrams of alternative exemplary devices La' and Lb' (e.g., textile labels) including antennas Aa' and Ab', respectively. Antennas Aa' and Ab' may be constructed of conductive materials similar to those of the antennas of FIGS. 3A and 3B. The schematic diagram of FIG. 4A also shows a conventional single-layer reactive strap 110a having a relatively large area or diameter, while FIG. 4B shows a multi-layer reactive strap 110b having a relatively small area due to a multi-turn coil of smaller diameter. In this example, devices La' and Lb' are upright, and the multi-layer reactive strap offers the advantage of a narrower label structure, which can be understood to allow device Lb' to be used in a wider range of applications than La'.

[0031] 5A and 5B are schematic diagrams showing the difference in size of a multi-layer reactive strap (e.g., strap 10, strap 110b) compared to a single-layer reactive strap (e.g., strap 110a) according to some embodiments. For example, FIG. 5A provides a simplified diagram of a conventional device La shown in FIG. 3A. When label La is subjected to a bending force F and bent about an axis (e.g., Y-axis or X-axis), a relatively large deflection from a flat state occurs. FIG. 5B provides a simplified diagram of device Lb shown in FIG. 3B. In contrast, considering that the size of device Lb can be reduced, when device Lb is subjected to the same bending force F and bent about an axis (e.g., Y-axis or X-axis), the deflection from a flat state is reduced. As a result, the stress applied to a smaller multi-layer reactive strap can be smaller than that of a larger single-layer reactive strap, which makes device Lb more robust and able to withstand processes such as washing and rough handling. Also, by having more turns of the conductor, the inductance of a wider single layer coil can be the same or greater than a smaller multi-turn coil. Additionally, by having two conductor sections on opposite sides of the dielectric, the overall physical strength, robustness and / or stiffness of the multi-layer reactive strap can be improved.

[0032] 6A and 6B are schematic diagrams illustrating implementation configurations of multi-layer reactive straps according to some embodiments. For example, FIG. 6A shows a schematic top view and side view of the base substrate 14 and the first conductor portion 18' and the second conductor portion 22' for the antenna Aa'', while FIG. 6B shows a schematic top view and side view of the base substrate and the first conductor portion 18' and the second conductor portion 22' for the antenna Aa''. This example illustrates that for multi-layer reactive straps, there may be at least two ways to orient and / or configure the multi-layer reactive strap in an upright or relative position to the antenna, depending on the vertical position and number of turns of each layer. For example, the multi-layer reactive strap may have layers formed in the XY plane and may be configured to couple with the antenna in the XY plane. Considering that different layers of the multi-layer reactive strap may have differences, such as the number of turns of the coil in each layer, the order of the layers may be changed to create different effects on the antenna. Also, considering that there may be heights associated with the stack of layers of the multi-layer reactive strap, different layers may be positioned at different heights relative to the antenna, or the entire multi-layer reactive strap may be raised or lowered in the Z-axis direction relative to the XY plane in which the antenna is formed, for example, by incorporating a device substrate at a higher or lower level within the stack of layers of the multi-layer reactive strap. In various embodiments, the number of layers in the multi-layer reactive strap may be 3, 5, 7, 9, 11 or more, such as 11-20, 20-50, or 50-100 layers. In some embodiments, each layer may include a dielectric and / or at least one conductor coil.

[0033] 7A-7C are schematic partial cross-sectional views of a multi-layer reactive strap, according to some embodiments. In FIG. 7A, a first conductor portion 18 and a second conductor portion 22 are shown on opposing sides of a substrate 14. Although FIG. 7A shows a structural connection between the first conductor portion 18 and the second conductor portion 22 (e.g., first connection portion 58 or second connection portion 60) provided through a weld 30 or a via, it should be understood that the connection may be formed by methods such as crimping, welding, forming plated-through holes, or other suitable known connection methods. In various embodiments, different layers are formed, so that vias may be formed, for example, by conductive ink for relatively thin layers, or through different mechanisms. For example, one or more foil layers may fill holes in a dielectric layer to provide electrical connection between the first conductor portion 18 and the second conductor portion 22. Other conductive materials, such as various forms of metal, graphene, and / or conductive inks, may be used as part of, instead of, or in addition to the weld 30.

[0034] 7B shows a side view, while FIG. 7C shows a top view of an alternative connection method particularly applicable to UHF RFID tags. The connection is based on a top-to-bottom connection using capacitance between two areas of metal, such as between a portion of a first conductor portion 18 and a corresponding second conductor portion 22 on opposite sides of the base substrate 14, which are in an overlapping relationship. For example, there may be an overlapping area where a downward projection through the Z axis of the footprint of the first conductor portion 18 overlaps with a portion of the second conductor portion 22.

[0035] The coupling capacitance may vary depending on the parallel and / or overlapping plate area, fringe capacitance, substrate thickness, substrate dielectric constant, and RFID chip capacitance. In some embodiments, the coupling capacitance may be greater than the RFID chip capacitance for improved or optimal performance. In some embodiments, the substrate 14 of the multi-layer reactive strap may include at least one thin dielectric-based substrate comprising a flexible material.

[0036] In some embodiments, such as FIG. 8, device Lc includes antenna Aa''', device substrate 44, and multi-layer reactive strap 110c. Antenna Aa''' and multi-layer reactive strap 110c may be attached to device substrate 44. Antenna Aa''' and multi-layer reactive strap 110c may be separated by distance 42 or may overlap to the same extent as described for distance 52b in FIG. 3B.

[0037] The multi-layer reactive strap 110c may include two or more layers. In some embodiments, such as FIG. 8, the multi-layer reactive strap 110c may include a plurality of dielectric substrates 66, 68, and 70, a first conductor portion 32, a second conductor portion 34, a third conductor portion 36, a fourth conductor portion 38, and a connecting portion 40.

[0038] In various embodiments, the first side of the first conductor portion 32 may be exposed to air, the environment, or one or more covering layers (not shown), such as plastic, fabric, or other material. The second side of the first conductor portion 32 may be attached to a first side of the first substrate 66. The second side of the first substrate 66 may be attached to a first side of the second conductor portion 34. The first conductor portion 32 and the second conductor portion 34 may be connected via one, two, or more connections 40, such as welds 30, vias, conductive ink, or other connection methods as described above with respect to Figures 2 and 7A.

[0039] In various embodiments, the second side of the second conductor portion 34 may be attached to a first side of the second substrate 68. The second side of the second substrate 68 may be attached to a first side of the third conductor portion 36. The second conductor portion 34 and the third conductor portion 36 may be connected via a number of methods using one, two or more connectors 40 as described above.

[0040] In various embodiments, the second side of the third conductor portion 36 may be attached to a first side of the third substrate 70. The second side of the third substrate 70 may be attached to a first side of the fourth conductor portion 38. The third conductor portion 36 and the fourth conductor portion 38 may be connected via a number of methods using one, two or more connectors 40 as described above.

[0041] A second side of the fourth conductor 38 may be attached to a first side of a device substrate 44. In various embodiments, more or fewer layers of conductors, substrates, and connections may be used as desired. In some embodiments, the device substrate 44 may be used as an intermediate layer separating two conductors, each on opposite sides of the device substrate 44.

[0042] From the above description of various embodiments, one skilled in the art will appreciate that a multi-turn coil formed by the combination of a first conductor portion and a second conductor portion can provide a greater inductance in a particular area than a single-turn, generally circular conductor. Also, the balance of the number of turns in each of the first conductor portion and the second conductor portion, and the relative positions of the first conductor portion and the second conductor portion can affect the near-field and coupling of the multi-layer reactive strap. Furthermore, the multi-layer reactive strap can be coupled to a conductive antenna to provide a wireless communication device useful as a long-range RFID tag.

[0043] The above-described embodiments illustrate some applications of the principles of the present invention. Multiple modifications may be made by those skilled in the art without departing from the spirit and scope of the invention as claimed, including any combination of features individually disclosed or claimed herein. For these reasons, the scope of the present specification is not limited to the above description, but is understood to be as set forth in the following claims, which relate to any feature of the present specification, including any combination of features individually disclosed or claimed herein.

[0044] (Additional note 1) A first substrate; a first conductor portion surrounding a first region and disposed on a first side of the first substrate; a second conductor portion surrounding a second region and disposed on a second side of the first substrate; and a first connecting portion coupling the first conductor portion and the second conductor portion together to form a multi-turn coil including both the first conductor portion and the second conductor portion. (Additional note 2) 2. The RFID device according to claim 1, wherein the first substrate is at least partially formed of a dielectric material. (Additional note 3) 3. The RFID device of claim 1 or 2, further comprising a radio frequency identification (RFID) chip coupled to the first conductor portion. (Additional note 4) 4. The RFID device according to any one of claims 1 to 3, further comprising an antenna configured to be reactively coupled to the multi-layer reactive strap. (Additional note 5) 5. The RFID device of any one of claims 1 to 4, further comprising a device substrate having a first side attached to the multi-layer reactive strap and the antenna. (Additional note 6) 6. The RFID device according to any one of claims 1 to 5, further comprising a second connection portion that couples the first conductor portion and the second conductor portion together. (Additional note 7) 7. The RFID device according to any one of claims 1 to 6, wherein the first connection portion extends through the first substrate. (Additional note 8) 8. The RFID device according to any one of claims 1 to 7, wherein the first dielectric substrate further includes a flexible material. (Additional note 9) 9. The RFID device according to any one of claims 1 to 8, wherein at least one of the first conductor portion and the second conductor portion includes a multi-turn coil. (Additional note 10) 10. The RFID device according to any one of claims 1 to 9, wherein each of the first conductor and the second conductor includes a multi-turn coil. (Additional note 11) An RFID device as described in any one of appended claims 1 to 10, wherein a multi-turn coil of the connected first and second conductor portions provides a greater inductance within a particular area than a conductor having a single turn surrounding the same area. (Additional note 12) 12. The RFID device according to any one of claims 1 to 11, wherein the first conductor portion and the second conductor portion include different numbers of turns. (Additional note 13) The RFID device according to any one of appended claims 1 to 12, wherein the balance in the number of turns between the first conductor portion and the second conductor portion and the relative positions of the first conductor portion and the second conductor portion affect the near magnetic field of the multi-layer reactive strap and the coupling between the antenna and the multi-layer strap. (Additional note 14) 14. The RFID device according to any one of claims 1 to 13, wherein the number of turns of the first conductor portion and the second conductor portion are evenly allocated on the first and second side surfaces of the first dielectric substrate. (Additional note 15) 15. The RFID device according to any one of claims 1 to 14, wherein the first conductor is connected to the second conductor by one or more of crimping, welding, and forming a plated through hole. (Additional note 16) The RFID device according to any one of claims 1 to 15, wherein the first conductor portion is connected to the second conductor portion by using a coupling capacitance between two regions of metal on both sides of a first dielectric substrate. (Additional note 17) 17. The RFID device according to claim 16, wherein the RFID chip has a capacitance smaller than the coupling capacitance. (Additional note 18) A second substrate; a third conductor portion, the second conductor portion includes a first side surface in contact with a second side surface of the first substrate, the second conductor portion includes a second side surface in contact with the first side surface of the second substrate, 18. The RFID device according to any one of claims 1 to 17, wherein the third conductor includes a first side surface in contact with the second side surface of the second substrate. (Additional note 19) A third substrate; and a fourth conductor portion, the third conductor portion includes a second side surface in contact with the first side surface of the third substrate; 19. The RFID device according to claim 18, wherein the fourth conductor portion includes a first side surface in contact with a second side surface of the third substrate. (Additional note 20) 20. The RFID device of claim 19, further comprising an antenna disposed on the device substrate and configured to be reactively coupled to the multi-layer reactive strap. (Additional note 21) 21. The RFID device according to claim 20, wherein the device substrate forms one of a first substrate, a second substrate, or a third substrate. (Additional note 22) a first conductor portion surrounding the first region is disposed on a first side surface of the first substrate; forming a multi-layer reactive strap by disposing a second conductor on a second side of the first substrate surrounding a second region; and coupling the first conductor portion and the second conductor portion together using a first connecting portion to form a multi-turn coil including both the first conductor portion and the second conductor portion. (Additional note 23) 23. The method of claim 22, wherein the first substrate is at least partially formed of a dielectric. (Additional note 24) 24. The method of claim 22 or 23, further comprising coupling a radio frequency identification (RFID) chip to the first conductor portion. (Additional note 25) Attaching an antenna to a device substrate; and attaching the multi-layer reactive strap to the device substrate; 25. The method of any one of claims 22 to 24, wherein the antenna is configured to be reactively coupled to the multi-layer reactive strap. (Additional note 26) 26. The method of claim 25, wherein both the multi-layer reactive strap and the antenna are attached to a first side of the device substrate. (Additional note 27) 27. The method according to any one of claims 22 to 26, further comprising the step of coupling together the first conductor and the second conductor using a second connection portion. (Additional note 28) 28. The method according to any one of claims 22 to 27, wherein at least one of the first conductor portion and the second conductor portion includes a multi-turn coil. (Additional note 29) The method according to any one of claims 22 to 28, wherein each of the first conductor portion and the second conductor portion includes a multi-turn coil. (Additional note 30) 30. The method according to any one of appended items 22 to 29, wherein the first conductor portion and the second conductor portion include different numbers of turns. (Additional note 31) The method according to any one of claims 22 to 30, wherein the number of turns of the first conductor portion and the second conductor portion are evenly allocated on the first and second side surfaces of the first dielectric substrate. (Additional note 32) 32. The method according to any one of claims 22 to 31, wherein the first conductor is connected to the second conductor by one or more of crimping, welding, or forming a plated through hole. (Additional note 33) 33. The method according to any one of claims 22 to 32, wherein the first conductor is connected to the second conductor by using a coupling capacitance. (Additional note 34) attaching a first side of a second substrate to a second side of the second conductor; The method according to any one of claims 22 to 33, further comprising the step of attaching a first side surface of a third conductor portion to a second side surface of the second substrate. (Additional note 35) attaching a first side of a third substrate to a second side of the third conductor; 35. The method of claim 34, further comprising the step of attaching a first side of a fourth conductor portion to a second side of the third conductor portion. (Additional note 36) 36. The method of claim 35, wherein the device substrate forms one of a first substrate, a second substrate, or a third substrate.

Claims

1. A first substrate; a first conductor portion surrounding a first region and disposed on a first side of the first substrate; a second conductor portion surrounding a second region and disposed on a second side of the first substrate; a first connection portion coupling the first conductor portion and the second conductor portion together to form a multi-turn coil including both the first conductor portion and the second conductor portion; a multi-layer reactive strap having An RFID device, wherein a multi-turn coil of the connected first and second conductor portions provides a greater inductance in a particular area than a conductor having a single turn surrounding the same area.

2. The RFID device of claim 1 , wherein the first substrate is at least partially formed of a dielectric material.

3. The RFID device of claim 1 or 2, further comprising a radio frequency identification (RFID) chip coupled to the first conductor portion.

4. The RFID device of any one of claims 1 to 3, further comprising an antenna configured to be reactively coupled to the multi-layer reactive strap.

5. The RFID device of claim 4 further comprising a device substrate having a first side attached to said multi-layer reactive strap and said antenna.

6. The RFID device of any one of claims 1 to 5, further comprising a second connection portion coupling together the first conductor portion and the second conductor portion.

7. The RFID device according to any one of claims 1 to 6, wherein the first connection portion extends through the first substrate.

8. The RFID device of claim 1 , wherein the first substrate further comprises a flexible material.

9. The RFID device of claim 1 , wherein at least one of the first conductor portion and the second conductor portion includes a multi-turn coil.

10. The RFID device according to claim 1 , wherein each of the first conductor portion and the second conductor portion includes a multi-turn coil.

11. The RFID device according to any one of claims 1 to 10, wherein the first conductor portion and the second conductor portion include different numbers of turns.

12. 12. The RFID device of claim 1, wherein the balance of the number of turns between the first and second conductor portions and the relative positions of the first and second conductor portions affect the near magnetic field of the multi-layer reactive strap and the coupling between an antenna and the multi-layer strap.

13. The RFID device according to any one of claims 1 to 12, wherein the number of turns of the first conductor portion and the second conductor portion are evenly allocated on the first and second side surfaces of the first dielectric substrate.

14. The RFID device according to any one of claims 1 to 13, wherein the first conductor portion is connected to the second conductor portion by one or more of crimping, welding, or forming a plated through hole.

15. The RFID device of any one of claims 1 to 14, wherein the first conductor portion is connected to the second conductor portion by using a coupling capacitance between two regions of metal on both sides of a first dielectric substrate.

16. 16. The RFID device of claim 15, wherein the RFID chip has a capacitance less than the coupling capacitance.

17. A second substrate; a third conductor portion, the second conductor portion includes a first side surface in contact with a second side surface of the first substrate, the second conductor portion includes a second side surface in contact with the first side surface of the second substrate, The RFID device according to claim 1 , wherein the third conductor portion includes a first side surface that contacts a second side surface of the second substrate.

18. A third substrate; and a fourth conductor portion, the third conductor portion includes a second side surface in contact with the first side surface of the third substrate; The RFID device of claim 17 , wherein the fourth conductor portion includes a first side in contact with a second side of the third substrate.

19. 20. The RFID device of claim 18, further comprising an antenna disposed on the device substrate and configured to be reactively coupled to the multi-layer reactive strap.

20. 20. The RFID device of claim 19, wherein the device substrate forms one of a first substrate, a second substrate, or a third substrate.

21. a first conductor portion surrounding the first region is disposed on a first side of the first substrate; a second conductor portion surrounding a second region is disposed on a second side of the first substrate; forming a multi-layer reactive strap by coupling the first conductor portion and the second conductor portion together with a first connection portion to form a multi-turn coil including both the first conductor portion and the second conductor portion; The method of forming an RFID device, wherein the first conductor portion is coupled to the second conductor portion using a coupling capacitance.

22. 22. The method of claim 21, wherein the first substrate is at least partially formed of a dielectric.

23. 23. The method of claim 21 or 22, further comprising coupling a radio frequency identification (RFID) chip to the first conductor portion.

24. Attaching an antenna to a device substrate; and attaching the multi-layer reactive strap to the device substrate; The method of any one of claims 21 to 23, wherein the antenna is configured to be reactively coupled to the multi-layer reactive strap.

25. 25. The method of claim 24, wherein both the multi-layer reactive strap and the antenna are attached to a first side of the device substrate.

26. The method of any one of claims 21 to 25, further comprising coupling the first conductor portion and the second conductor portion together with a second connection portion.

27. The method of any one of claims 21 to 26, wherein at least one of the first conductor portion and the second conductor portion comprises a multi-turn coil.

28. The method of any one of claims 21 to 27, wherein each of the first conductor portion and the second conductor portion comprises a multi-turn coil.

29. The method of any one of claims 21 to 28, wherein the first conductor portion and the second conductor portion include different numbers of turns.

30. The method according to any one of claims 21 to 29, wherein the number of turns of the first conductor portion and the second conductor portion are evenly distributed on the first and second sides of the first dielectric substrate.

31. 31. The method of any one of claims 21 to 30, wherein the first conductor portion is connected to the second conductor portion by one or more of crimping, welding, or forming a plated-through hole.

32. attaching a first side of a second substrate to a second side of the second conductor; The method of any one of claims 21 to 31, further comprising the step of: attaching a first side of a third conductor to a second side of the second substrate.

33. attaching a first side of a third substrate to a second side of the third conductor; 33. The method of claim 32, further comprising attaching a first side of a fourth conductor portion to a second side of the third conductor portion.

34. 26. A method according to claim 24 or 25, wherein the device substrate forms any one of a first substrate, a second substrate or a third substrate.

Images