Inductor component

Abstract

To provide an inductor component which has improved connectability between a via wiring layer and coil wiring layers.SOLUTION: An inductor component 1 comprises: an element assembly 10; a coil 20 which is spirally wound along an axis AX inside the element assembly; and a first external electrode 30 and a second external electrode 40 which are connected to the coil. The element assembly includes: first and second end surfaces 15, 16; first and second lateral surfaces 13, 14; a bottom surface 17; and a top surface 18. The axis is parallel to the bottom surface, and intersects the first and second lateral surfaces. The coil has: first and second coil wiring layers 501, 502 which are stacked in an axial direction; and a via wiring layer 601 which connects the first and second coil wiring layers to each other. The first coil wiring layer has a first coil end E11. The via wiring layer has via ends. A first via end E21 of the via wiring layer is connected to a portion on the first coil end side of the first coil wiring layer. Viewed from the axial direction, the first coil end of the first coil wiring layer does not overlap the first via end of the via wiring layer but is spaced away therefrom.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present disclosure relates to inductor components. [Background technology]

[0002] A conventional inductor component is described in Japanese Patent Laid-Open Publication No. 2000-286125 (Patent Document 1). This inductor component includes an element body, a coil provided in the element body and wound in a spiral shape along an axis, and a first external electrode and a second external electrode provided in the element body and electrically connected to the coil, and the coil has a plurality of coil wiring layers stacked adjacent to each other in the axial direction, and a plurality of via wiring layers located between adjacent coil wiring layers in the axial direction and connecting adjacent coil wiring layers in the axial direction. In a conventional inductor component, during manufacturing, a first insulating layer is provided on a layer including a second coil wiring layer, the first insulating layer is processed to provide a first opening for the first via wiring layer, and then a second insulating layer is provided on the first insulating layer, the second insulating layer is processed to provide a second opening for the first coil wiring layer, and a conductive material is filled in the first and second openings to form a first via wiring layer and a first coil wiring layer. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2000-286125 A Summary of the Invention [Problem to be solved by the invention]

[0004] However, in the past, when simultaneously filling the first opening and the second opening with paste to simultaneously form a first via wiring layer and a first coil wiring layer connected to the first via wiring layer, the filling property of the magnetic paste in the first and second openings was poor, the volume of the first via wiring layer was reduced, and poor formation of the first via wiring layer occurred, resulting in poor connectivity between the first via wiring layer and the second coil wiring layer.

[0005] Therefore, an object of the present disclosure is to provide an inductor component with improved connectivity between a via wiring layer and a coil wiring layer. [Means for solving the problem]

[0006] In order to solve the above problems, an inductor component according to one aspect of the present disclosure comprises: The body and a coil provided within the element body and wound helically along an axis; a first external electrode and a second external electrode provided on the element body and electrically connected to the coil; Equipped with the element body includes a first end face and a second end face opposing each other, a first side face and a second side face opposing each other, a bottom face connected between the first end face and the second end face and between the first side face and the second side face, and a top face opposing the bottom face, the axis is parallel to the bottom surface and intersects the first side surface and the second side surface; the coil includes a first coil wiring layer and a second coil wiring layer stacked adjacent to each other in the axial direction, and a first via wiring layer connecting the first coil wiring layer and the second coil wiring layer; the first coil wiring layer has a first coil end, the first via wiring layer has a first via end, At least the first via end of the first via wiring layer is connected to a portion of the first coil wiring layer on the first coil end side, When viewed in the axial direction, the first coil end of the first coil wiring layer is separated from the first via end of the first via wiring layer without overlapping therewith.

[0007] By separating the first coil end of the first coil wiring layer from the first via end of the first via wiring layer without overlapping it when viewed in the axial direction, the filling ability of the first via wiring layer is improved, the contact area between the second coil wiring layer and the first via wiring layer is secured, and the connectivity between the first via wiring layer and the second coil wiring layer is improved.

[0008] In order to solve the above problems, an inductor component according to one aspect of the present disclosure comprises: The body and a coil provided within the element body and wound helically along an axis; a first external electrode and a second external electrode provided on the element body and electrically connected to the coil; Equipped with the element body includes a first end face and a second end face opposing each other, a first side face and a second side face opposing each other, a bottom face connected between the first end face and the second end face and between the first side face and the second side face, and a top face opposing the bottom face, the axis is parallel to the bottom surface and intersects the first side surface and the second side surface; the coil includes a first coil wiring layer and a second coil wiring layer stacked adjacent to each other in the axial direction, and a first via wiring layer connecting the first coil wiring layer and the second coil wiring layer; the first coil wiring layer has a first coil end portion, the first coil end portion being located at an end in an extension direction of the first coil wiring layer; the first via wiring layer has a first via end portion, the first via end portion having a first via outermost end portion located at an outermost end in an extension direction of the first via wiring layer; At least the first via end of the first via wiring layer is connected to a portion of the first coil wiring layer on the first coil end side, The distance between the outermost end of the first coil in the first coil wiring layer and the outermost end of the first via in the first via wiring layer is 10 μm or more.

[0009] Here, the first coil end of the first coil wiring layer is a region surrounded by an end connecting the ends of the inner peripheral surface and the outer peripheral surface, which are parallel to each other, and a straight line passing through the end of the inner peripheral surface and the end of the outer peripheral surface, as viewed from the axial direction. The portion on the first coil end side of the first coil wiring layer refers to a portion of the first coil wiring layer that is closer to the first coil end side than a center line that passes through the center of the length of the first coil wiring layer in the extension direction and is perpendicular to the extension direction of the first coil wiring layer. The first coil end of the first coil wiring layer is a point located at the end in the extension direction of the first coil wiring layer, as viewed from the axial direction. The same applies to the first via end of the first via wiring layer and the first via end of the first via wiring layer.

[0010] By setting the distance between the end of the first coil of the first coil wiring layer and the end of the first via of the first via wiring layer to 10 μm or more, the filling ability of the first via wiring layer is improved, the contact area between the second coil wiring layer and the first via wiring layer is ensured, and the connectivity between the first via wiring layer and the second coil wiring layer is good. Effect of the Invention

[0011] According to an inductor component according to one aspect of the present disclosure, it is possible to provide an inductor component having improved connectivity between a via wiring layer and a coil wiring layer. [Brief description of the drawings]

[0012] [Figure 1] FIG. 1 is a perspective view showing a first embodiment of an inductor component. [Diagram 2] 2 is a see-through front view of the inductor component as viewed from a first side surface side. FIG. [Diagram 3] FIG. 3 is a partially enlarged view of FIG. [Figure 4] FIG. 2 is an exploded plan view of the inductor component. [Diagram 5] FIG. 2 is a cross-sectional view of an inductor component. [Figure 6] 11 is a see-through front view of an inductor component according to a third embodiment, seen from a first side surface side of the inductor component. FIG. [Figure 7] FIG. 2 is an exploded plan view of the inductor component. [Figure 8] FIG. 2 is a cross-sectional view of an inductor component. [Figure 9] FIG. 1 is an explanatory diagram for explaining a conventional technique. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0013] Hereinafter, an inductor component according to an embodiment of the present disclosure will be described in detail with reference to the drawings. Note that the drawings include some schematic views and may not reflect actual dimensions or proportions.

[0014] (First embodiment) FIG. 1 is a perspective view showing a first embodiment of the inductor component. FIG. 2 is a see-through front view of the inductor component as seen from a first side surface side. FIG. 3 is a partially enlarged view of FIG. 2. FIG. 4 is an exploded plan view of the inductor component. FIG. 5 is a cross-sectional view of the inductor component taken along a center line along the extension direction of a via wiring layer. As shown in FIGS. 1, 2, 3, 4, and 5, the inductor component 1 has an element body 10, a coil 20 provided in the element body 10 and wound in a spiral shape along an axis AX, and a first external electrode 30 and a second external electrode 40 provided in the element body 10 and electrically connected to the coil 20. For convenience, the element body and the coil are drawn transparently in FIGS. 2 and 3 so that the structure can be easily understood, but they may be semi-transparent or opaque.

[0015] The inductor component 1 is electrically connected to wiring on a circuit board (not shown) via first and second external electrodes 30, 40. The inductor component 1 is used, for example, as an impedance matching coil (matching coil) for high-frequency circuits, and is used in electronic devices such as personal computers, DVD players, digital cameras, TVs, mobile phones, car electronics, and medical and industrial machinery. However, the uses of the inductor component 1 are not limited to this, and it can also be used, for example, in tuning circuits, filter circuits, and rectifying and smoothing circuits.

[0016] The element body 10 is formed in a substantially rectangular parallelepiped shape. The surfaces of the element body 10 include a first end face 15 and a second end face 16 that face each other, a first side face 13 and a second side face 14 that face each other, a bottom face 17 that is connected between the first end face 15 and the second end face 16 and between the first side face 13 and the second side face 14, and a top face 18 that faces the bottom face 17. The bottom face 17 is the face that faces the mounting board when the inductor component 1 is mounted on a mounting board (not shown).

[0017] As shown in the figure, the X direction is perpendicular to the first end face 15 and the second end face 16, and is the direction from the first end face 15 to the second end face 16. The Y direction is perpendicular to the first side face 13 and the second side face 14, and is the direction from the second side face 14 to the first side face 13. The Z direction is perpendicular to the bottom face 17 and the top face 18, and is the direction from the bottom face 17 to the top face 18. The X direction is also called the length direction of the element body 10, the Y direction is also called the width direction of the element body 10, and the Z direction is also called the height direction of the element body 10. The X direction, the Y direction, and the Z direction are perpendicular to each other, and when arranged in the order of X, Y, Z, they form a left-handed system.

[0018] The X direction is also referred to as the length direction of the element body 10, the Y direction is also referred to as the width direction of the element body 10, and the Z direction is also referred to as the height direction of the element body 10. The length direction is the direction in which the first end face 15 and the second end face 16 face each other, and is a direction parallel to the straight line connecting the first end face 15 and the second end face 16 at the shortest distance. The width direction is the direction in which the first side face 13 and the second side face 14 face each other, and is a direction parallel to the straight line connecting the first side face 13 and the second side face 14 at the shortest distance. The height direction is the direction in which the top face 18 and the bottom face 17 face each other, and is a direction parallel to the straight line connecting the top face 18 and the bottom face 17 at the shortest distance.

[0019] The element body 10 is formed by stacking a plurality of insulating layers 11. The insulating layers 11 are made of, for example, a material mainly composed of borosilicate glass, ferrite, resin, or the like. The stacking direction of the insulating layers 11 is a direction (Y direction) parallel to the first and second end faces 15, 16 and the bottom face 17 of the element body 10. That is, the insulating layers 11 are in a layered form spreading on the XZ plane. In this application, "parallel" is not limited to a strict parallel relationship, but also includes a substantial parallel relationship in consideration of a realistic range of variation. Note that in the element body 10, the interfaces between the plurality of insulating layers 11 may not be clear due to firing, etc. Note that in FIG. 4, the stacking direction (Y direction) is the direction from the upper left to the lower right.

[0020] The first external electrode 30 and the second external electrode 40 are made of a conductive material, for example, Ag, Cu, Au, or an alloy containing these as a main component. The surfaces of the first external electrode 30 and the second external electrode 40 exposed from the element body 10 may be covered with plating such as Ni, Sn, or the like.

[0021] The first external electrode 30 has an L-shape extending from the first end face 15 to the bottom face 17. The first external electrode 30 is embedded in the element body 10 so as to be exposed from the first end face 15 and the bottom face 17. The first external electrode 30 has a first end face portion 31 extending along the first end face 15, and a first bottom face portion 32 connected to the first end face portion 31 and extending along the bottom face 17.

[0022] The second external electrode 40 has an L-shape extending from the second end face 16 to the bottom face 17. The second external electrode 40 is embedded in the element body 10 so as to be exposed from the second end face 16 and the bottom face 17. The second external electrode 40 has a second end face portion 41 extending along the second end face 16, and a second bottom face portion 42 connected to the second end face portion 41 and extending along the bottom face 17.

[0023] The first external electrode 30 has a configuration in which a plurality of first external electrode conductor layers 33 embedded in the element body 10 (insulating layer 11) are laminated. The second external electrode 40 has a configuration in which a plurality of second external electrode conductor layers 43 embedded in the element body 10 (insulating layer 11) are laminated. The first external electrode conductor layer 33 extends along the first end face 15 and the bottom face 17, and the second external electrode conductor layer 43 extends along the second end face 16 and the bottom face 17.

[0024] This allows the first and second external electrodes 30, 40 to be embedded in the element body 10, making it possible to reduce the size of the inductor component compared to a configuration in which external electrodes are externally attached to the element body 10. Furthermore, the coil 20 and the first and second external electrodes 30, 40 can be formed in the same process, and by reducing variation in the positional relationship between the coil 20 and the first and second external electrodes 30, 40, variation in the electrical characteristics of the inductor component 1 can be reduced.

[0025] The first external electrode 30 may not have a first end surface portion 31 and may be composed of a first bottom surface portion 32, and similarly, the second external electrode 40 may not have a second end surface portion 41 and may be composed of a second bottom surface portion 42. In other words, it is sufficient that the first external electrode 30 and the second external electrode 40 are provided at least on the bottom surface 17 of the element body 10.

[0026] The coil 20 is made of, for example, the same conductive material as the first and second external electrodes 30, 40. The coil 20 is wound in a spiral shape along the lamination direction of the insulating layers 11. A first end of the coil 20 is connected to the first external electrode 30, and a second end of the coil 20 is connected to the second external electrode 40. In this embodiment, the coil 20 and the first and second external electrodes 30, 40 are integrated and no clear boundary exists between them, but this is not limited thereto, and a boundary may exist between them by forming the coil and the external electrodes using different materials or different construction methods.

[0027] The coil 20 is wound along the axis AX such that the axis AX is parallel to the bottom surface 17 and intersects the first side surface 13 and the second side surface 14. The axis AX of the coil 20 coincides with the lamination direction (Y direction) of the insulating layers 11. In other words, the multiple insulating layers 11 are laminated along the axis AX. The axis AX of the coil 20 refers to the central axis of the spiral shape of the coil 20. Specifically, the axis AX refers to the center of the innermost circumference of the coil 20.

[0028] The coil 20 has a winding portion 20a, a first lead portion 20b connected between a first end of the winding portion 20a and the first external electrode 30, and a second lead portion 20c connected between a second end of the winding portion 20a and the second external electrode 40. In this embodiment, the winding portion 20a and the first and second lead portions 20b, 20c are integrated together and no clear boundary exists, but this is not limited thereto, and a boundary may exist by forming the winding portion and the lead portions using different materials or different construction methods.

[0029] The winding portion 20a is wound in a spiral shape along the axis AX. In other words, the winding portion 20a refers to the portion of the coils 20 that are wound in a spiral shape and overlap each other when viewed in a direction parallel to the axis AX. The first and second lead-out portions 20b and 20c refer to the portions that are not overlapped.

[0030] When viewed in the direction of the axis AX of the coil 20, the shape of the coil 20 is symmetrical with respect to a line that passes through the axis AX of the coil 20 and is parallel to the Z direction. This makes it possible to suppress variations in the characteristics of the inductor component 1.

[0031] As shown in FIG. 4, the coil 20 has two second coil wiring layers 502 and a first coil wiring layer 501 stacked along the axis AX, and a first via wiring layer 601 located between the first and second coil wiring layers 501, 502 adjacent in the axis AX direction and connecting the first and second coil wiring layers 501, 502 adjacent in the axis AX direction. The second coil wiring layer 502 is provided on the first insulating layer 11a, the first via wiring layer 601 on the second insulating layer 11b, and the first coil wiring layer 501 on the third insulating layer 11c. Note that the number of coil wiring layers is two in this embodiment, but may be three or more. The number of turns of the coil wiring layer is less than one turn, but may be one turn or more.

[0032] The first and second coil wiring layers 501, 502 are each wound along a plane and electrically connected in series to form a spiral. The coil wiring layers are wound along an XZ plane (the main surface of the insulating layer 11) perpendicular to the axial direction AX (Y direction). Each of the coil wiring layers 501, 502 has a constant width along the extension direction.

[0033] The first coil wiring layer 501 has a first coil end E11 and a second coil end E11 opposite to the first coil end E11. The first coil end E11 is a region surrounded by a coil end 20f connecting the ends of the inner circumferential surface 20d and the outer circumferential surface 20e, which are parallel to each other, and a virtual straight line 20g passing through the end of the inner circumferential surface 20d and the end of the outer circumferential surface 20e, when viewed from the axis AX direction.

[0034] The second coil wiring layer 502 has a first coil end E13 and a second coil end opposite the first coil end E13. The first coil end E13 is a region defined similarly to the first coil end E11 of the first coil wiring layer 501.

[0035] Specifically, the second coil wiring layer 502 and the first coil wiring layer 501 are laminated in this order along the Y direction. A second coil end of the second coil wiring layer 502 is connected to the first external electrode conductor layer 33 of the first external electrode 30. A second coil end of the first coil wiring layer 501 is connected to the second external electrode conductor layer 43 of the second external electrode 40.

[0036] The first via wiring layer 601 penetrates the second insulating layer 11b in the thickness direction (Y direction). The coil wiring layers adjacent to each other in the stacking direction are electrically connected in series via the via wiring layer. In this manner, the first and second coil wiring layers 501, 502 are electrically connected in series to each other via the first via wiring layer 601 and form the spiral of the coil 20.

[0037] The first via wiring layer 601 is located between the first coil wiring layer 501 and the second coil wiring layer 502 in the axial direction AX, and connects the first coil wiring layer 501 and the second coil wiring layer 502.

[0038] The first via wiring layer 601 is a longitudinal via wiring layer extending along the spiral direction of the coil 20 as viewed from the axis AX direction. The first via wiring layer 601 has a constant width along the extending direction. According to the above configuration, the contact area between the first and second coil wiring layers 501, 502 and the first via wiring layer 601 can be increased, and the DC resistance of the coil 20 can be reduced. In addition, even if a lamination shift occurs between the first and second coil wiring layers 501, 502 and the first via wiring layer 601 during the manufacture of the inductor component 1, the area of ​​the surface of the first via wiring layer 601 facing the first and second coil wiring layers 501, 502 is large, so that the contact probability between the first and second coil wiring layers 501, 502 and the first via wiring layer 601 is increased, and the possibility of a conduction failure between the first and second coil wiring layers 501, 502 and the first via wiring layer 601 can be reduced. Moreover, disconnection of the first via wiring layer 601 can be prevented.

[0039] The first via wiring layer 601 has a first via end E21 and a second via end E23. In the first via wiring layer 601, the direction from the first via end E21 to the second via end E23 is the same as the direction from the first coil end E11 to the second coil end of the first coil wiring layer 501. Here, the first via end E21 is a region surrounded by via ends connecting the respective ends of the inner peripheral surface 20d and the outer peripheral surface 20e parallel to each other when viewed from the axis AX direction, and a virtual straight line passing through the end of the inner peripheral surface 20d and the end of the outer peripheral surface 20e. The second via end E23 is a region defined similarly to the first via end E21.

[0040] The first via end E21 of the first via wiring layer 601 is connected to a portion of the first coil wiring layer 501 on the first coil end E11 side, and the first coil end E11 of the first coil wiring layer 501 is separated from the first via end E21 of the first via wiring layer 601 without overlapping it when viewed from the axis AX direction. With the above configuration, the filling of the first coil wiring layer 501 and the first via wiring layer 601 is improved, the contact area between the first via wiring layer 601 and the second coil wiring layer 502 can be secured, and the connectivity between the first via wiring layer 601 and the second coil wiring layer 502 is improved. Here, the portion of the first coil wiring layer 501 on the first coil end E11 side refers to a portion of the first coil wiring layer 501 on the first coil end E11 side from a center line that passes through the center of the length of the first coil wiring layer 501 in the extension direction and is perpendicular to the extension direction of the first coil wiring layer 501.

[0041] Conventionally, the inductor component 1P has been formed as follows. As shown in FIG. 9, in the cross-sectional view, the second coil wiring layer 502P, the first via wiring layer 601P, and the first coil wiring layer 501P are laminated in this order. Specifically, the second insulating layer 11B is first provided on a layer having the first insulating layer 11A and the second coil wiring layer 502P, and a first opening is provided in the second insulating layer 11B. Furthermore, the third insulating layer 11C having a second opening is provided on the second insulating layer 11B. At this time, as viewed from the lamination direction (axis AX direction), the end of the third insulating layer 11C includes the position P, and the end of the second insulating layer 11B also includes the position P. That is, as viewed from the lamination direction, the position of the end of the third insulating layer 11C and the position of the end of the second insulating layer 11B overlapped. The first opening and the second opening were filled with a conductive paste containing a conductive material to simultaneously form the first via wiring layer 601P and the first coil wiring layer 501P connected to the first via wiring layer 601P. However, the third insulating layer 11C prevented filling, and the conductive paste was not filled in a portion of the first via wiring layer 601P that was distant from the filling direction (axis AX direction) and close to the second insulating layer 11B, and air bubbles V were generated. As a result, the first via wiring layer 601P was difficult to fill, and the connectivity between the second coil wiring layer 502P and the first via wiring layer 601P was sometimes deteriorated. In addition, because the end of the second insulating layer 11B and the end of the third insulating layer 11C overlap, a large recess is formed in a portion adjacent to the third insulating layer 11C on the surface of the first coil wiring layer 501P opposite to the first via wiring layer 601P above the bubble V, and further, a large protrusion of a conductive material may be formed on the third insulating layer 11C adjacent to the recess. When another material collides with the protrusion, there is a risk that the first coil wiring layer 501P will peel off from the third insulating layer 11C.

[0042] In contrast, in this embodiment, as shown in FIG. 5, in a cross-sectional view taken along a center line along the extension direction of the first via wiring layer 601, a first insulating layer 11a and a second coil wiring layer 502 are provided, a second insulating layer 11b is provided thereon, and a first opening is provided in the second insulating layer 11b. Furthermore, a third insulating layer 11c having a second opening is provided on the second insulating layer 11b. At this time, as viewed from the stacking direction (axis AX direction), the end of the third insulating layer 11c and the end of the second insulating layer 11b are separated without overlapping. When the first opening and the second opening are filled with a conductive paste to simultaneously form the first via wiring layer 601 and the first coil wiring layer 501, the first coil end E11 of the first coil wiring layer 501 and the first via end E21 of the first via wiring layer 601 are separated without overlapping. Unlike the conventional method, the third insulating layer 11c does not prevent filling, so that the generation of bubbles V in the first via wiring layer 601 can be suppressed, and the filling property of the first via wiring layer 601 is improved. Since the filling property is improved, the contact area between the second coil wiring layer 502 and the first via wiring layer 601 can be secured, and the connectivity between the first via wiring layer 601 and the second coil wiring layer 502 is improved. In addition, in this embodiment, the first coil end portion of the first coil wiring layer 501 is separated from the first via end portion of the first via wiring layer 601 without overlapping, so that a small recess is generated on the surface of the first coil wiring layer 501 opposite to the first via wiring layer 601, or no recess is generated. As a result, no convex portion of the conductive material is formed on the third insulating layer 11c, or even if it is formed, a small convex portion is formed. Therefore, collision with other materials is unlikely to occur, and the first coil wiring layer 501 is unlikely to peel off from the third insulating layer 11c. Although the case where the first coil wiring layer 501 and the first via wiring layer 601 are formed simultaneously has been described, the first via wiring layer 601 and the second coil wiring layer 502 may be formed simultaneously. The first coil wiring layer 501 may be on the second side surface 14 side or the first side surface 13 side during manufacturing.Furthermore, if the position of the end of the second insulating layer 11b is separated from the end of the third insulating layer 11c without overlapping it, without moving the position of the end of the third insulating layer 11c, the volume of the first via wiring layer 601 is reduced, and as a result, the difference in linear expansion coefficient between the first via wiring layer 601 and the second insulating layer 11b is reduced, and the thermal stress associated with the first via wiring layer 601 is reduced. This makes it possible to suppress the occurrence of cracks in the first via wiring layer 601.

[0043] Preferably, the second coil wiring layer 502 has a first coil end E13, the first via wiring layer 601 has a second via end E23 which is an end opposite to the first via end E21, at least the second via end E23 of the first via wiring layer 601 is connected to a portion of the second coil wiring layer 502 on the first coil end E13 side, and the first coil end E13 of the second coil wiring layer 502 is separated from the second via end E23 of the first via wiring layer 601 without overlapping when viewed from the axis AX direction. By separating the first coil end E13 of the second coil wiring layer 502 from the second via end E23 of the first via wiring layer 601 without overlapping, contact between the second coil wiring layer 502 and the first via wiring layer 601 can be ensured even if misalignment of the first via wiring layer 601 with respect to the second coil wiring layer 502 occurs during manufacturing of the inductor component 1.

[0044] Preferably, the first coil end E11 of the first coil wiring layer 501 has a first coil end E12 located at the end of the first coil wiring layer 501 in the extension direction, the first via end E21 of the first via wiring layer 601 has a first via end E22 located at the end of the first via wiring layer 601 in the extension direction, and the distance between the first coil end E12 of the first coil wiring layer 501 and the first via end E22 of the first via wiring layer 601 is 10 μm or more. Note that the first coil end E12 of the first coil wiring layer 501 is a point located at the end in the extension direction of the first coil wiring layer 501 as viewed from the axis AX direction. The first via end E22 of the first via wiring layer 601 is a point located at the end in the extension direction of the first via wiring layer 601 as viewed from the axis AX direction.

[0045] Preferably, the distance between the first coil outermost end E12 of the first coil wiring layer 501 and the first via outermost end E22 of the first via wiring layer 601 is equal to or greater than the width of the first coil wiring layer 501. The width of the first coil wiring layer 501 refers to the dimension in a direction passing through the center of the extension direction of the first coil wiring layer 501 and perpendicular to the extension direction of the first coil wiring layer 501 when viewed from the axis AX direction.

[0046] Preferably, the distance between the first coil end E12 of the first coil wiring layer 501 and the first via end E22 of the first via wiring layer 601 is equal to or greater than the length of the first via wiring layer 601. Here, the length of the first via wiring layer 601 is the length L1 of the center line along the direction in which the first via wiring layer 601 extends.

[0047] Preferably, when viewed from the axis AX direction, the first coil wiring layer 501 and the second coil wiring layer 502 have an overlapping portion where they at least partially overlap, and the area S2 of the first via wiring layer 601 is 95% or less of the area S1 of the overlapping portion. The area S2 of the first via wiring layer 601 is not particularly limited, but may be 2% or more of the area S1 of the overlapping portion. Here, the area D1 of the overlapping portion between the first coil wiring layer 501 and the second coil wiring layer 502 is the area of ​​the overlapping portion when viewed from the axial direction. The area S2 of the first via wiring layer is the area when viewed from the axis AX direction. With the above configuration, the area of ​​the first via wiring layer can be made smaller than that of a conventional inductor component, and the inductance value (L value) can be adjusted.

[0048] Preferably, in a cross section taken along a center line along the extension direction of the first via wiring layer 601, a length L22 of a contact portion between the first via wiring layer 601 and the first coil wiring layer 501 is greater than a length L21 of a contact portion between the first via wiring layer 601 and the second coil wiring layer 502. That is, in a cross section taken along a center line along the extension direction of the first via wiring layer 601, the first via wiring layer 601 has an inverse tapered shape. Since the length L22 is greater than the length L21, even if the positions of the second coil wiring layer 502 and the first via wiring layer 601 are slightly shifted, the first via wiring layer 601 can be easily formed on the first coil wiring layer 501, and the connectivity between the first via wiring layer 601 and the second coil wiring layer 502 can be ensured.

[0049] The first coil end E13 and the first coil outermost end E14 of the second coil wiring layer 502 may also have a similar configuration.

[0050] For example, the first coil end E13 of the second coil wiring layer 502 has a first coil end E14 located at the end of the extension direction of the second coil wiring layer 502, and the second via end E23 of the first via wiring layer 601 has a second via end E24 located at the end of the extension direction of the first via wiring layer 601, and the distance between the first coil end E14 of the second coil wiring layer 502 and the second via end E24 of the first via wiring layer 601 may be 10 μm or more. The first coil end E14 of the second coil wiring layer 502 and the second via end E24 of the first via wiring layer 601 are determined in the same manner as the first coil end E12 of the first coil wiring layer 501.

[0051] The distance between the first coil outermost end E14 of the second coil wiring layer 502 and the second via outermost end E24 of the first via wiring layer 601 may be equal to or greater than the width of the second coil wiring layer 502. The width of the second coil wiring layer 502 refers to the dimension in a direction passing through the center of the extension direction of the second coil wiring layer 502 and perpendicular to the extension direction of the first coil wiring layer 501 when viewed from the axis AX direction.

[0052] The distance between the first coil outermost end E14 of the second coil wiring layer 502 and the second via outermost end E24 of the first via wiring layer 601 may be equal to or greater than the length of the first via wiring layer 601.

[0053] In this embodiment, the number of via wiring layers is one, but multiple via wiring layers may be present. When multiple via wiring layers are present, all of the via wiring layers may be longitudinal via wiring layers. When multiple via wiring layers are present, at least one of the via wiring layers may be a longitudinal via wiring layer, and the other via wiring layers may be circular (or rectangular) via wiring layers as viewed from the axis AX direction. In this case, the coil end of the coil wiring layer connected to the circular via wiring layer forms a circular pad portion as viewed from the axial direction, and the diameter of the circular pad portion is larger than the line width of the middle portion of the coil wiring layer. When multiple via wiring layers are present, at least one of the via wiring layers may have a configuration in which they are spaced apart.

[0054] (Manufacturing method) Next, a method for manufacturing the inductor component 1 will be described.

[0055] 4, from the upper left to the lower right in the figure, the second coil wiring layer 502, the first via wiring layer 601, and the first coil wiring layer 501 are alternately laminated together with the insulating layer 11 to manufacture the inductor component 1. The first and second coil wiring layers 501, 502 are provided on the insulating layer 11 by, for example, screen printing. An opening is provided in the insulating layer 11 by, for example, photolithography or laser processing, and the first via wiring layer 601 is provided in the opening by, for example, screen printing.

[0056] Second embodiment In the first embodiment, the first coil end of the first coil wiring layer is separated from the first via end of the first via wiring layer without overlapping, but in the second embodiment, regardless of whether the first coil end of the first coil wiring layer and the first via end of the first via wiring layer are separated from each other, it is sufficient that the coil end of the first coil wiring layer and the via end of the first via wiring layer are separated by 10 μm or more. This different configuration will be described below. The other configurations are the same as those of the first embodiment, and the description thereof will be omitted. The same drawings as those of the first embodiment will be used.

[0057] The distance between the first coil end E12 of the first coil wiring layer 501 and the first via end E22 of the first via wiring layer 601 is 10 μm or more. With the above configuration, the generation of bubbles V in the first via wiring layer 601 is suppressed, and the filling property of the first via wiring layer 601 is improved. Since the filling property is improved, the contact area between the second coil wiring layer 502 and the first via wiring layer 601 can be secured, and the connectivity between the first via wiring layer 601 and the second coil wiring layer 502 is improved. In addition, with the above configuration, a small recess is formed on the surface of the first coil wiring layer 501 opposite to the first via wiring layer 601, or no recess is formed. As a result, no convex portion of the conductive material is formed on the third insulating layer 11c, or even if it is formed, a small convex portion is formed. Therefore, collision with other materials is unlikely to occur, and the first coil wiring layer 501 is unlikely to peel off from the third insulating layer 11c.

[0058] In addition, even if the first coil end E11 of the first coil wiring layer 501 and the first via end E21 of the first via wiring layer 601 are separated and do not overlap, or even if the first coil end E11 of the first coil wiring layer 501 and the first via end E21 of the first via wiring layer 601 overlap, the distance between the first coil end E12 of the first coil wiring layer 501 and the first via end E22 of the first via wiring layer 601 only needs to be 10 μm or more.

[0059] Third embodiment In the first embodiment, the via wiring layer overlaps with the coil wiring layer when viewed from the axial direction, but in the third embodiment, the via wiring layer has an area where it does not overlap with the coil wiring layer. This difference in configuration will be described below. The other configurations are the same as those in the first embodiment, so the same reference numerals as in the first embodiment are used and the description thereof will be omitted.

[0060] Fig. 6 is a see-through front view of a third embodiment of the inductor component as viewed from a first side surface side. Fig. 7 is an exploded plan view of the inductor component. Fig. 8 is a cross-sectional view of the inductor component taken along a center line along an extension direction of a via wiring layer. For convenience, the element body and coil are depicted as transparent in Fig. 6 so that the structure can be easily understood, but they may be semi-transparent or opaque.

[0061] 6, 7, and 8, in the inductor component 1A, a part of the first coil wiring layer 501 has a first contact portion R1 in contact with the first via wiring layer 601. In this embodiment, the number of turns of the first coil wiring layer 501 is smaller than that of the first embodiment. The first coil end portion E11 of the first coil wiring layer 501 does not overlap with the second coil wiring layer 502.

[0062] The second coil wiring layer 502 has a second contact portion R3 in contact with the first via wiring layer 601. In this embodiment, the number of turns of the second coil wiring layer 502 is smaller than that of the first embodiment. The first coil end E13 of the second coil wiring layer 502 does not overlap with the first coil wiring layer 501 when viewed from the axis AX direction.

[0063] The first via wiring layer 601 has a first contact portion R1 in contact with the first coil wiring layer 501, a first non-contact portion R2 not in contact with the first coil wiring layer 501 or the second coil wiring layer 502, and a second contact portion R3 in contact with the second coil wiring layer 502. In the first via wiring layer 601, the direction from the first via end E21 to the second via end E23 is opposite to the direction from the first coil end E11 to the second coil end of the first coil wiring layer 501.

[0064] 8, in a cross section taken along a center line in the extending direction of the first via wiring layer 601, the height of the first via wiring layer 601 in the first non-contact portion R2 is smaller than the height of the first coil wiring layer 501 and the first via wiring layer 601 in the first contact portion R1 and the height of the first via wiring layer 601 and the second coil wiring layer 502 in the second contact portion R3. As a result, in the first non-contact portion R2, the difference in linear expansion coefficient between the first via wiring layer 601 and the first and third insulating layers 11a and 11c becomes smaller, and the thermal stress associated with the first via wiring layer 601 becomes smaller. As a result, it is possible to suppress the occurrence of cracks in the first via wiring layer 601.

[0065] Preferably, the width of the first non-contact portion R2 is greater than the width of the first contact portion R1 in a cross section taken along the center line in the extending direction of the first via wiring layer 601. In the first non-contact portion R2, the difference in linear expansion coefficient between the first via wiring layer 601 and the first and third insulating layers 11a and 11c becomes smaller, and the thermal stress associated with the first via wiring layer 601 becomes smaller. This makes it possible to further suppress the occurrence of cracks in the first via wiring layer 601.

[0066] The length of the first via wiring layer 601 may be the same as that of the first embodiment, or may be shorter than that of the first embodiment. The number of turns of the first coil wiring layer 501 may be the same as that of the first embodiment, or may be larger than that of the first embodiment. The number of turns of the second coil wiring layer 502 may be the same as that of the first embodiment, or may be larger than that of the first embodiment.

[0067] The present disclosure is not limited to the above-described embodiments, and design modifications are possible within the scope of the present disclosure. For example, the features of the first to third embodiments may be combined in various ways. The number of coil wiring layers may be increased or decreased, and the number of via wiring layers may be increased or decreased. The top surface and connection parts of the coil wiring layers may include straight lines or may be curved.

[0068] The present disclosure includes the following aspects. <1> The body and a coil provided within the element body and wound helically along an axis; a first external electrode and a second external electrode provided on the element body and electrically connected to the coil; Equipped with the element body includes a first end face and a second end face opposing each other, a first side face and a second side face opposing each other, a bottom face connected between the first end face and the second end face and between the first side face and the second side face, and a top face opposing the bottom face, the axis is parallel to the bottom surface and intersects the first side surface and the second side surface; the coil includes a first coil wiring layer and a second coil wiring layer stacked adjacent to each other in the axial direction, and a first via wiring layer connecting the first coil wiring layer and the second coil wiring layer; the first coil wiring layer has a first coil end, the first via wiring layer has a first via end, At least the first via end of the first via wiring layer is connected to a portion of the first coil wiring layer on the first coil end side, When viewed in the axial direction, the first coil end of the first coil wiring layer is separated from the first via end of the first via wiring layer without overlapping therewith. Inductor components. <2> the second coil wiring layer has a first coil end, the first via wiring layer has a second via end portion that is an end portion opposite to the first via end portion; At least the second via end of the first via wiring layer is connected to a portion of the second coil wiring layer on the first coil end side, When viewed in the axial direction, the first coil end of the second coil wiring layer is separated from the second via end of the first via wiring layer without overlapping therewith. <1> 2. An inductor component according to claim 1 . <3> the first coil end portion of the first coil wiring layer has a first coil outermost portion located at an outermost end in an extension direction of the first coil wiring layer, the first via end of the first via wiring layer has a first via outermost end located at an outermost end in an extension direction of the first via wiring layer, The distance between the first coil end of the first coil wiring layer and the first via end of the first via wiring layer is 10 μm or more. <1> or <2> 2. An inductor component according to claim 1 . <4> The body and a coil provided within the element body and wound helically along an axis; a first external electrode and a second external electrode provided on the element body and electrically connected to the coil; Equipped with the element body includes a first end face and a second end face opposing each other, a first side face and a second side face opposing each other, a bottom face connected between the first end face and the second end face and between the first side face and the second side face, and a top face opposing the bottom face, the axis is parallel to the bottom surface and intersects the first side surface and the second side surface; the coil includes a first coil wiring layer and a second coil wiring layer stacked adjacent to each other in the axial direction, and a first via wiring layer connecting the first coil wiring layer and the second coil wiring layer; the first coil wiring layer has a first coil end portion, the first coil end portion being located at an end in an extension direction of the first coil wiring layer; the first via wiring layer has a first via end portion, the first via end portion having a first via outermost end portion located at an outermost end in an extension direction of the first via wiring layer; At least the first via end of the first via wiring layer is connected to a portion of the first coil wiring layer on the first coil end side, The distance between the first coil end of the first coil wiring layer and the first via end of the first via wiring layer is 10 μm or more. Inductor components. <5> A distance between the first coil end of the first coil wiring layer and the first via end of the first via wiring layer is equal to or greater than a width of the first coil wiring layer. <3> or <4> 2. An inductor component according to claim 1 . <6> A distance between the first coil end of the first coil wiring layer and the first via end of the first via wiring layer is equal to or greater than a length of the first via wiring layer. <3> from <5> 2. An inductor component according to claim 1 . <7> When viewed from the axial direction, the first coil wiring layer and the second coil wiring layer have an overlapping portion where at least a portion of the first coil wiring layer overlaps with the second coil wiring layer, The area of ​​the first via wiring layer is 95% or less of the area of ​​the overlapping portion. <1> from <6> 2. An inductor component according to claim 1 . <8> In a cross section in an extension direction of the first via wiring layer, a contact portion between the first via wiring layer and the first coil wiring layer is larger than a contact portion between the first via wiring layer and the second coil wiring layer. <1> from <7> 2. An inductor component according to claim 1 . <9> When viewed from the axial direction, the first via wiring layer has a contact portion that contacts at least one of the first coil wiring layer and the second coil wiring layer, and a non-contact portion that does not contact the first coil wiring layer and the second coil wiring layer. <1> from <8> 2. An inductor component according to claim 1 . [Explanation of symbols]

[0069] 1. 1A inductor components 10 Base 11, 11a to 11c Insulating layer 13 First aspect 14 Second aspect 15 First end surface 16 Second end face 17 Bottom 18 Top 20, 20A coil 20a Winding section 20b 1st drawer 20c 2nd drawer 20d Inner surface 20e Outer surface 30 1st external electrode 31 First end section 32 1st bottom part 33 First external electrode conductor layer 40 2nd external electrode 41 Second end section 42 2nd bottom part 43 Second external electrode conductor layer 501~502 Coil wiring layer 601 Via wiring layer AX axis E11, E13 coil ends E21, E23 via ends

Claims

1. The body and a coil provided within the element body and wound helically along an axis; a first external electrode and a second external electrode provided on the element body and electrically connected to the coil; Equipped with the element body includes a first end face and a second end face opposing each other, a first side face and a second side face opposing each other, a bottom face connected between the first end face and the second end face and between the first side face and the second side face, and a top face opposing the bottom face, the axis is parallel to the bottom surface and intersects the first side surface and the second side surface; the coil includes a first coil wiring layer and a second coil wiring layer stacked adjacent to each other in the axial direction, and a first via wiring layer connecting the first coil wiring layer and the second coil wiring layer; the first coil wiring layer has a first coil end, the first via wiring layer has a first via end; At least the first via end of the first via wiring layer is connected to a portion of the first coil wiring layer on the first coil end side, When viewed in the axial direction, the first coil end of the first coil wiring layer is separated from the first via end of the first via wiring layer without overlapping therewith. Inductor components.

2. the second coil wiring layer has a first coil end, the first via wiring layer has a second via end portion that is an end portion opposite to the first via end portion; At least the second via end of the first via wiring layer is connected to a portion of the second coil wiring layer on the first coil end side, When viewed in the axial direction, the first coil end of the second coil wiring layer is separated from the second via end of the first via wiring layer without overlapping therewith. The inductor component according to claim 1 .

3. the first coil end portion of the first coil wiring layer has a first coil outermost portion located at an outermost end in an extension direction of the first coil wiring layer, the first via end of the first via wiring layer has a first via outermost end located at an outermost end in an extension direction of the first via wiring layer, The distance between the outermost end of the first coil in the first coil wiring layer and the outermost end of the first via in the first via wiring layer is 10 μm or more. The inductor component according to claim 1 .

4. The body and a coil provided within the element body and wound helically along an axis; a first external electrode and a second external electrode provided on the element body and electrically connected to the coil; Equipped with the element body includes a first end face and a second end face opposing each other, a first side face and a second side face opposing each other, a bottom face connected between the first end face and the second end face and between the first side face and the second side face, and a top face opposing the bottom face, the axis is parallel to the bottom surface and intersects the first side surface and the second side surface; the coil includes a first coil wiring layer and a second coil wiring layer stacked adjacent to each other in the axial direction, and a first via wiring layer connecting the first coil wiring layer and the second coil wiring layer; the first coil wiring layer has a first coil end portion, the first coil end portion having a first coil outermost portion located at an end in an extension direction of the first coil wiring layer; the first via wiring layer has a first via end portion, the first via end portion having a first via outermost end portion located at an outermost end in an extension direction of the first via wiring layer; At least the first via end of the first via wiring layer is connected to a portion of the first coil wiring layer on the first coil end side, The distance between the outermost end of the first coil in the first coil wiring layer and the outermost end of the first via in the first via wiring layer is 10 μm or more. Inductor components.

5. a distance between an outermost end of the first coil in the first coil wiring layer and an outermost end of the first via in the first via wiring layer is equal to or greater than a width of the first coil wiring layer; The inductor component according to claim 3 or 4.

6. a distance between an outermost end of the first coil in the first coil wiring layer and an outermost end of the first via in the first via wiring layer is equal to or greater than a length of the first via wiring layer; The inductor component according to claim 3 or 4.

7. When viewed in the axial direction, the first coil wiring layer and the second coil wiring layer have an overlapping portion where at least a portion of the first coil wiring layer overlaps with the second coil wiring layer, an area of ​​the first via wiring layer is 95% or less of an area of ​​the overlapping portion; The inductor component according to claim 1 .

8. In a cross section in an extension direction of the first via wiring layer, a contact portion between the first via wiring layer and the first coil wiring layer is larger than a contact portion between the first via wiring layer and the second coil wiring layer. The inductor component according to claim 1 .

9. When viewed from the axial direction, the first via wiring layer has a contact portion that contacts at least one of the first coil wiring layer and the second coil wiring layer, and a non-contact portion that does not contact the first coil wiring layer and the second coil wiring layer. The inductor component according to claim 1 .

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