Coated component and method for producing coated component

Abstract

To provide a method for producing a coated component regardless of the heat resistance of an electronic component.SOLUTION: The present invention provides a method for producing a coated component by applying a coating to an electronic component. The method includes the steps for: applying a coating agent containing polyolefin to an electronic component with a siloxane-containing member so as to cover the member; and chemically bonding the siloxane and polyolefin through oxygen by emitting light of a specific wavelength to the electronic component with the coating agent applied thereto.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present disclosure relates to a coated component in which a coating is applied to an electronic component, and a method for manufacturing the coated component. [Background technology]

[0002] Patent Document 1 discloses a method for producing a coated part with a curable coating having low sulfur-containing gas permeability. In the production method described in Patent Document 1, a composition containing polyolefin and siloxane is first applied to an electronic part. Next, the electronic part to which the composition has been applied is heated to cause a curing reaction of the composition. The reaction product produced by this curing reaction becomes a protective coating for the electronic part, coating the electronic part. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2012-082429 A Summary of the Invention [Problem to be solved by the invention]

[0004] In the manufacturing method described in the above Patent Document 1, a step of heating (baking) the composition is required to generate a reaction product from the composition containing polyolefin and siloxane (to adhere as a coating). Therefore, this manufacturing method may not be able to apply a coating depending on the heat resistance of the electronic components.

[0005] The present disclosure has been made in consideration of the above-mentioned problems, and aims to provide a method for producing a coated component that is coated without relying on the heat resistance of an electronic component, and the coated component. [Means for solving the problem]

[0006] In order to solve the above problems, one aspect of the disclosed technology is a method for producing a coated part in which an electronic component is coated, the method including the steps of: applying a coating agent containing polyolefin to an electronic component having a member containing siloxane so as to cover the member; and irradiating the electronic component to which the coating agent has been applied with light of a specific wavelength, thereby chemically bonding the siloxane and the polyolefin via oxygen. Effect of the Invention

[0007] According to the present disclosure, by chemically bonding the siloxane contained in the components of the electronic component and the polyolefin contained in the coating agent via oxygen, it is possible to produce coated components regardless of the heat resistance of the electronic component. [Brief description of the drawings]

[0008] [Figure 1] A flowchart illustrating steps of a method for manufacturing a coated part according to an embodiment of the present disclosure. [Diagram 2] Image of the manufacturing method for coated parts [Diagram 3] Cross-section of the coated electronic component (LED) DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] The method of manufacturing a coated part according to the present disclosure chemically bonds, via oxygen, siloxane originally contained in the material of the electronic part with a coating agent containing polyolefin that is applied to the electronic part, thereby making it possible to coat the electronic part with a coating agent that does not contain siloxane. Hereinafter, an embodiment of the present disclosure will be described in detail with reference to the drawings.

[0010] <Embodiment> Fig. 1 is a flow chart illustrating steps of a method for producing a coated part according to an embodiment of the present disclosure, Fig. 2 is an image diagram illustrating the state of an electronic part and the like in each step illustrated in Fig. 1.

[0011] In this embodiment, an example will be described in which a coating process is performed on an electronic component 200 mounted on a substrate 100 ((a) of FIG. 2) to turn the electronic component 200 into a coated component. Note that the substrate 100 on which the electronic component 200 is mounted is not particularly limited.

[0012] (Step S11) In step S11, one or more electronic components 200 to be subjected to the coating process to be turned into coated components are mounted on the substrate 100 (FIG. 2(b)). The electronic component 200 in this embodiment is a component equipped with a member containing siloxane. For example, as shown in FIG. 3, the electronic component 200 can be a surface-mounted LED in which a chip 220 is sealed with a member 210 such as a resin (silicone) containing a phosphor containing siloxane.

[0013] When mounting of electronic component 200 onto substrate 100 is completed, processing proceeds to step S12.

[0014] (Process S12) In step S12, a coating agent 300 is applied to the substrate 100 so as to cover the surface of the electronic component 200 mounted on the substrate 100 (FIG. 2(c)). The coating agent 300 in this embodiment is a coating agent containing polyolefin. The state of the electronic component 200 after the coating agent 300 is applied is shown in FIG. 3.

[0015] At the stage where this step S12 is completed, there is a gap between the siloxane-containing member 210 (silicone) of the electronic component 200 and the polyolefin-containing coating agent 300 applied from above the member 210, and oxygen (air) is present in the gap. This image is expressed by the structural formula [Chemical Formula 1] below.

[0016] [ka]

[0017] When application of coating agent 300 onto substrate 100 is completed, processing proceeds to step S13.

[0018] (Step S13) In step S13, light of a specific wavelength is irradiated from a light source 400 toward the coating agent 300 applied to the substrate 100 (FIG. 2(c)). The light of a specific wavelength generated by the light source 400 in this embodiment is invisible light with a wavelength of 380 nm or less. As an example, the light source 400 can be a black light.

[0019] When the coating agent 300 is irradiated with light of this specific wavelength, the double bond of oxygen is broken by the photoelectric effect of the light energy. This is represented by the structural formula [Chemical formula 2] below.

[0020] [ka]

[0021] The oxygen with the double bond broken forms single bonds with the siloxane-containing member 210 (silicone) and the polyolefin-containing coating agent 300. This image is expressed by the structural formula of [Chemical Formula 3] below.

[0022] [ka]

[0023] In this manner, by irradiating coating agent 300 with light of a specific wavelength from light source 400, the siloxane contained in member 210 and the polyolefin contained in coating agent 300 are chemically bonded via oxygen (oxygen bond).

[0024] <Actions and Effects> As described above, according to the present disclosure, a coating agent 300 containing polyolefin is applied to an electronic component 200 having a member 210 containing siloxane so as to cover the member 210, and the electronic component 200 to which the coating agent 300 has been applied is irradiated with light of a specific wavelength from a light source 400, thereby chemically bonding the siloxane and the polyolefin via oxygen, thereby producing a coated component in which the electronic component 200 is coated. This manufacturing method makes it possible to manufacture a coated component that is coated on the electronic component 200, regardless of the heat resistance of the electronic component 200.

[0025] Moreover, in the coated component of the present disclosure, the electronic component 200 is coated with a film of the coating agent 300 that is oxygen-bonded to the member 210. This makes it possible to prevent the silver used in the electronic component 200, such as an LED, from being corroded by sulfur-containing gases (exhaust gas, hydrogen sulfide, etc.). This makes it possible to suppress the occurrence of a decrease in the amount of light of the LED or the LED going out due to sulfur corrosion.

[0026] Furthermore, according to the method of producing a coated part of the present disclosure, it is only necessary to apply coating agent 300 containing only polyolefin (containing no siloxane) to electronic component 200, which is expected to enable the thickness of the coating to be reduced.

[0027] Furthermore, the manufacturing method for the coated part disclosed herein does not require the step of heating the substrate 100 (baking step) that was previously required, which is expected to result in various benefits such as reducing the scale of manufacturing equipment, shortening manufacturing time, and reducing manufacturing costs. [Industrial Applicability]

[0028] The technology disclosed herein can be used when it is desired to manufacture coated electronic components regardless of the heat resistance of the electronic components. [Explanation of symbols]

[0029] 100 Substrates 200 Electronic Components 210 Components 220 Chip 300 Coating Agent 400 light sources

Claims

1. A method for producing a coated component by applying a coating to an electronic component, comprising the steps of: A step of applying a coating agent containing polyolefin to an electronic component having a member containing siloxane so as to cover the member; and and irradiating the electronic component coated with the coating agent with light of a specific wavelength, thereby chemically bonding the siloxane and the polyolefin via oxygen.

2. The method for producing a coated part according to claim 1 , wherein the electronic part is an LED having a chip sealed with a resin containing a phosphor containing siloxane as the member.

3. The method for manufacturing a coated part according to claim 1 or 2, wherein the light of the specific wavelength emitted by the light source is invisible light having a wavelength of 380 nm or less.

4. The method for producing a coated part according to claim 1 , wherein the coating agent does not contain the siloxane.

5. A coated part obtained by applying a coating to an electronic component, A coated part, in which the siloxane of a siloxane-containing member provided in the electronic part and the polyolefin of a polyolefin-containing coating agent applied to cover the part are chemically bonded via oxygen.

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