Signal processing device and signal processing system

Abstract

To supply a voltage signal to a merging unit by a non-conventional method.SOLUTION: A signal processing device (1) includes a sensor (10) that outputs a first voltage signal corresponding to an electrical signal generated in a measurement target (ST) in an electric power facility (1000), a merging unit (30) that can be connected to a process bus (PB) in the electric power facility (1000), and a signal conversion unit (20) that is located between the sensor (10) and the merging unit (30). The signal conversion unit (20) converts the first voltage signal acquired from the sensor (10) into a second voltage signal having an amplitude larger than that of the first voltage signal, and supplies the second voltage signal to the merging unit (30).SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] One aspect of the present invention relates to a signal processing device having a merging unit. [Background technology]

[0002] Some technical standards related to electric power equipment propose using a merging unit for monitoring and controlling the electric power equipment. The following Patent Document 1 shows an example of the configuration of a protection and control system having a merging unit. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] International Publication No. 2014 / 188507 Summary of the Invention [Problem to be solved by the invention]

[0004] It is an object of one aspect of the present invention to provide a voltage signal to a merging unit in a non-conventional manner. [Means for solving the problem]

[0005] In order to solve the above problems, a signal processing device according to one embodiment of the present invention includes a sensor that outputs a first voltage signal corresponding to an electrical signal generated in a measured object in an electric power equipment, a merging unit that can be connected to a process bus in the electric power equipment, and a signal conversion unit located between the sensor and the merging unit, and the signal conversion unit converts the first voltage signal obtained from the sensor into a second voltage signal having a larger amplitude than the first voltage signal, and supplies the second voltage signal to the merging unit. Effect of the Invention

[0006] According to one aspect of the present invention, a voltage signal can be provided to a merging unit in a non-conventional manner. [Brief description of the drawings]

[0007] [Figure 1] 2 shows an example of the configuration of a signal processing device according to the first embodiment. [Diagram 2] 4 shows examples of signal waveforms in the first embodiment. [Diagram 3] 1 shows an example of the configuration of a signal processing device as a comparative example. [Figure 4] 13 shows an example of the configuration of a signal processing device according to a second embodiment. [Diagram 5] 13 shows an example of the configuration of a signal processing system according to a third embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0008] [Embodiment 1] Hereinafter, the signal processing device 1 of the embodiment 1 will be described. For convenience of explanation, components having the same functions as those described in the embodiment 1 will be given the same reference numerals in the following embodiments, and the explanations thereof will not be repeated. For the sake of brevity, the explanations of well-known technical matters will also be omitted as appropriate.

[0009] Each component and each numerical value described in this specification is merely an example, unless there is a contradiction in the content. Therefore, unless there is a contradiction in the content, for example, the positional relationship and connection relationship of each component are not limited to the examples in each figure. In addition, each figure is not necessarily illustrated to scale. In this specification, unless there is a contradiction, the notation "A to B" for two numbers A and B means "greater than or equal to A and less than or equal to B."

[0010] (Configuration example of signal processing device 1) Fig. 1 shows a configuration example of a signal processing device 1. In Fig. 1, the signal processing device 1 and its peripheral configuration are shown generally as a block diagram. As shown in Fig. 1, the signal processing device 1, a measurement target ST, and an external calculation device 900 are located inside a power facility 1000. The power facility 1000 may be, for example, a digital substation.

[0011] The measurement object ST may be any object that generates an electrical signal SG0 that can be measured by the signal processing device 1 (more specifically, a sensor 10 described below). As an example, the measurement object ST may be a power line of any electrical device (e.g., switchgear) in the power facility 1000. The external computing device 900 may be any computing device located outside the signal processing device 1. As an example, the external computing device 900 may be an IED (Intelligent Electronic Device).

[0012] 1, the signal processing device 1 includes a sensor 10, a signal converting unit 20, and a merging unit 30. The sensor 10 outputs a first voltage signal SG1 corresponding to an electrical signal SG0 generated in a measurement object ST. In the first embodiment, the electrical signal SG0 is an analog AC signal. For examples of the electrical signal SG0, see FIG. 2 described later.

[0013] In the first embodiment, the electrical signal SG0 is a current flowing through the measurement target ST. Therefore, the sensor 10 in the first embodiment may be a current sensor. As an example, the sensor 10 may be a current transformer (CT).

[0014] The sensor 10 in the first embodiment outputs a first voltage signal SG1 corresponding to a current flowing through the object to be measured ST. As an example, the sensor 10 may be a Rogowski coil type CT. As known to those skilled in the art, the Rogowski coil type CT outputs a differential waveform of the current flowing through the object to be measured ST as the first voltage signal SG1.

[0015] The merging unit 30 only needs to be connectable to the process bus PB in the power equipment 1000. Therefore, as shown in Fig. 1, the external calculation device 900 may be connected to the merging unit 30 via the process bus PB.

[0016] In the signal processing device 1, the signal converting unit 20 is located between the sensor 10 and the merging unit 30. The signal converting unit 20 obtains a first voltage signal SG1 from the sensor 10. Then, the signal converting unit 20 converts the first voltage signal SG1 into a second voltage signal SG2 having a larger amplitude than the first voltage signal SG1 (see also FIG. 2). Then, the signal converting unit 20 provides the second voltage signal SG2 to the merging unit 30.

[0017] As an example, the signal converting unit 20 may convert the first voltage signal SG1 into a current signal SGM, and then the signal converting unit 20 may convert the current signal SGM into a second voltage signal SG2.

[0018] Therefore, for example, the signal converting unit 20 may have a first converting unit 21 and a second converting unit 22. In the example of Fig. 1, the first converting unit 21 converts a first voltage signal SG1 acquired from the sensor 10 into a current signal SGM. The second converting unit 22 converts the current signal SGM acquired from the first converting unit 21 into a second voltage signal SG2. The second converting unit 22 supplies the second voltage signal SG2 to the merging unit 30.

[0019] FIG. 2 shows an example of each signal waveform in the first embodiment. In FIG. 2, examples of the waveforms of the electrical signal SG0, the first voltage signal SG1, the current signal SGM, and the second voltage signal SG2 are shown. As will be apparent to those skilled in the art, the electrical signal SG0 may have a fairly large amplitude. In the example of FIG. 2, the amplitude of the electrical signal SG0 is approximately 1000A.

[0020] In general, the withstand voltage and withstand current performance of the merging unit 30 is not so high. Therefore, in the signal processing device 1, the sensor 10 converts the electrical signal SG0 into a first voltage signal SG1, which is a weaker electrical signal. As an example, the amplitude of the first voltage signal SG1 may be several mV or more and several V or less.

[0021] 2, the sensor 10 is configured to convert an AC current having an amplitude of 1000 A into an AC voltage having an amplitude of 10 mV. The conversion ratio from the input (e.g., the electrical signal SG0) to the output (first voltage signal SG1) in the sensor 10 may be set according to the rated value of the amplitude of the input.

[0022] In the signal processing device 1, the signal conversion unit 20 converts the first voltage signal SG1 into a second voltage signal SG2 that is more suitable for input to the merging unit 30. The merging unit 30 is generally designed to receive a voltage having an amplitude of several volts to several tens of volts.

[0023] Therefore, as described above, in the first embodiment, the amplitude of the second voltage signal SG2 is set to be larger than the amplitude of the first voltage signal SG1. Therefore, the signal converting unit 20 may include any type of amplifier circuit. As an example, the amplitude of the second voltage signal SG2 may be several volts or more and 20 volts or less.

[0024] As described above, the first voltage signal SG1 may be converted into the second voltage signal SG2 through conversion into a current signal SGM. By converting the first voltage signal SG1 into the second voltage signal SG2 through conversion into a current signal SGM, the second voltage signal SG2 in which the influence of noise during signal transmission within the signal converting unit 20 is reduced can be obtained.

[0025] 2, the current signal SGM may be an offset AC signal. Therefore, the first conversion unit 21 may include any type of voltage-to-current conversion circuit. For example, the first conversion unit 21 may be configured to generate an offset AC current based on the first voltage signal SG1.

[0026] 2, the first conversion unit 21 is configured to convert an AC voltage with an amplitude of 10 mV into an AC current with an offset value of 12 mA and an amplitude of 8 mA. Therefore, when a current with an amplitude of 1000 A flows through the measurement object ST, the current signal SGM ideally has a value of 4 mA to 20 mA.

[0027] On the other hand, for example, if an abnormality occurs in the measurement object ST, the absolute value of the electrical signal SG0 may be small. In this case, the value of the current signal SGM may be smaller than 4 mA. As another example, if an abnormality occurs in the measurement object ST, the absolute value of the electrical signal SG0 may be large. In this case, the value of the current signal SGM may be larger than 20 mA.

[0028] Therefore, when the current signal SGM is an offset AC signal, the signal processing device 1 may detect an abnormality in the measurement object ST based on the current signal SGM. For example, when the value of the current signal SGM deviates from a predetermined range, the signal processing device 1 may determine that an abnormality has occurred in the measurement object ST.

[0029] As an example, the signal processing device 1 may have an abnormality detection unit (not shown) that detects an abnormality in the measurement object ST based on the current signal SGM inside the signal converting unit 20. As another example, the signal processing device 1 may have the abnormality detection unit outside the signal converting unit 20.

[0030] The second conversion unit 22 may include any type of current-voltage conversion circuit. The second conversion unit 22 may be configured to generate the second voltage signal SG2 based on the offset AC current. In the example of FIG. 2, the second conversion unit 22 is configured to convert an AC current with an amplitude of 8 mA into an AC voltage with an amplitude of 10 V.

[0031] As described above, the sensor 10 and the signal converting unit 20 can obtain an AC voltage (eg, second voltage signal SG2) with an amplitude of 10V as a signal corresponding to an AC current (eg, electrical signal SG0) with an amplitude of 1000A.

[0032] However, as described above, the first voltage signal SG1 may be a very weak electrical signal, so it is preferable to position the signal converting unit 20 near the sensor 10 in order to reduce the influence of noise on the first voltage signal SG1.

[0033] As an example, the sensor 10 and the signal converting unit 20 may be located in a pipe of a switchgear. The distance between the sensor 10 and the signal converting unit 20 may be 10 cm or less, and preferably a few cm or less.

[0034] Referring again to Fig. 1, the merging unit 30 may include an AD (Analog-Digital) conversion unit 31, a signal processing unit 32, and an output unit 33. In the example of Fig. 1, the output unit 33 is connected to an external computing device 900 via a process bus PB.

[0035] The AD conversion unit 31 obtains the second voltage signal SG2 as an analog signal from the signal conversion unit 20. Then, the AD conversion unit 31 performs AD conversion on the second voltage signal SG2 to digitize the second voltage signal SG2. In this specification, the digitized second voltage signal SG2 is referred to as a digital signal SG2D. In this manner, the AD conversion unit 31 generates a digital signal (e.g., digital signal SG2D) corresponding to the electrical signal SG0 by performing AD conversion on the second voltage signal SG2.

[0036] The signal processing unit 32 acquires the digital signal SG2D from the AD conversion unit 31. Then, the signal processing unit 32 performs signal processing on the digital signal SG2D to generate sampling data SMP of the electrical signal SG0. The signal processing method in the signal processing unit 32 is not particularly limited as long as it is possible to generate sampling data SMP having a format conforming to a predetermined communication standard (e.g., IEC61850) based on the digital signal SG2D.

[0037] As an example, the signal processing unit 32 may generate the sampling data SMP by performing an integration operation and a correction operation as signal processing on the digital signal SG2D. The integration operation is an example of an operation for deriving (restoring) the electrical signal SG0 from the above-mentioned differential waveform.

[0038] The output unit 33 acquires the sampling data SMP from the signal processing unit 32. The output unit 33 outputs the sampling data SMP to the outside of the signal processing device 1 via the process bus PB. Therefore, for example, the output unit 33 may output the sampling data SMP to the external calculation device 900 via the process bus PB. The output unit 33 may be designed to conform to the above-mentioned communication standard. This allows the output unit 33 to output the sampling data SMP to the external calculation device 900 via the process bus PB in accordance with the communication standard.

[0039] As described above, in the power equipment 1000, the sampling data SMP of the electric signal SG0 generated in the measurement object ST is obtained by the signal processing device 1. Therefore, the external calculation device 900 can monitor the state of the measurement object ST based on the sampling data SMP supplied from the signal processing device 1. As an example, the external calculation device 900 may detect an abnormality in the measurement object ST based on the sampling data SMP.

[0040] (Effects of signal processing device 1) Before describing the effects of the signal processing device 1, a signal processing device 1r will be described as a comparative example. The signal processing device 1r is an example of a conventional signal processing device (e.g., a conventional electronic transformer). Fig. 3 shows an example of the configuration of the signal processing device 1r. Fig. 3 is a diagram paired with Fig. 1.

[0041] 3, the signal processing device 1r does not have the signal converting unit 20 located between the sensor 10 and the merging unit 30. Therefore, in the signal processing device 1r, the first voltage signal SG1 is supplied from the sensor 10 to the merging unit 30.

[0042] As described above, the first voltage signal SG1 can be a very weak electrical signal. For this reason, in the signal processing device 1r, it is desirable to position the merging unit 30 near the sensor 10 in order to reduce the effect of noise on the first voltage signal SG1. For this reason, in the signal processing device 1r, the degree of freedom in arranging the merging unit 30 is not very high.

[0043] Furthermore, the first voltage signal SG1 in the signal processing device 1r must be a voltage that can be accepted by the merging unit 30. Therefore, in the signal processing device 1r, the degree of freedom in designing the sensor 10 is limited by the design specifications of the merging unit 30. For this reason, in the signal processing device 1r, the degree of freedom in designing the sensor 10 is not so high.

[0044] On the other hand, the signal processing device 1 has a signal converting unit 20 located between the sensor 10 and the merging unit 30. Therefore, in the signal processing device 1, a second voltage signal SG2 having a larger amplitude than the first voltage signal SG1 is supplied from the signal converting unit 20 to the merging unit 30. In this way, according to the signal processing device 1, it is possible to supply a voltage signal to the merging unit by a method different from the conventional method.

[0045] The signal converting unit 20 serves as a relay device located between the sensor 10 and the merging unit 30. Therefore, unlike the signal processing device 1r, the signal processing device 1 does not require the merging unit 30 to be located near the sensor 10. Therefore, the signal processing device 1 has a higher degree of freedom in arranging the merging unit 30 than the signal processing device 1r.

[0046] Furthermore, in the signal processing device 1, the second voltage signal SG2 only needs to be a voltage that the merging unit 30 can accept. Therefore, the magnitude of the first voltage signal SG1 in the signal processing device 1 is not limited by the design specifications of the merging unit 30. Therefore, in the signal processing device 1, the degree of freedom in designing the sensor 10 is also higher than in the signal processing device 1r.

[0047] [Embodiment 2] Fig. 4 shows a configuration example of a signal processing device 1A in embodiment 2. As shown in Fig. 4, the signal processing device 1A has a sensor 10A instead of the sensor 10. Unlike embodiment 1, embodiment 2 illustrates a case in which the electrical signal SG0 is a voltage applied to the measurement object ST. Therefore, the sensor 10A may be a voltage sensor. As an example, the sensor 10A may be a VT (Voltage Transformer).

[0048] The sensor 10A outputs a first voltage signal SG1 corresponding to a voltage applied to the object to be measured ST. As an example, the sensor 10A may be a VT of a capacitive voltage division type. A VT of a capacitive voltage division type is also called a CVT (Capacitor VT). As known to those skilled in the art, a VT of a capacitive voltage division type outputs a differential waveform of a voltage applied to the object to be measured ST as a first voltage signal SG1.

[0049] As will be apparent to those skilled in the art, the electrical signal SG0 in the second embodiment may also have a fairly large amplitude. As an example, the amplitude of the electrical signal SG0 in the second embodiment is about tens of thousands of volts. In the second embodiment, the electrical signal SG0 is converted by the sensor 10A into a first voltage signal SG1, which is a weaker electrical signal. The amplitude of the first voltage signal SG1 in the second embodiment may also be several mV or more and several V or less.

[0050] As described above, the electrical signal generated in the measurement object in one aspect of the present disclosure may be a current or a voltage. The sensor according to one aspect of the present disclosure may output a first voltage signal corresponding to the electrical signal.

[0051] [Embodiment 3] Fig. 5 shows an example of the configuration of a signal processing system 100 in embodiment 3. The signal processing system 100 includes a signal processing device according to an aspect of the present invention (e.g., signal processing device 1) and a sub-signal converting unit 120 located outside the signal processing device. In the example of Fig. 5, the signal processing system 100 further includes a display device 190.

[0052] 5, the sub-signal converting unit 120 is connected in parallel with the signal converting unit 20 of the signal processing device 1 to the sensor 10 of the signal processing device 1. Therefore, the sub-signal converting unit 120 can obtain the first voltage signal SG1 from the sensor 10.

[0053] The sensor 10 in the signal processing device 1 is a passive component, and therefore is considered to have a relatively low risk of failure. On the other hand, the signal converting unit 20 and the merging unit 30 in the signal processing device 1 are embodied by, for example, electronic components, and therefore are considered to have a higher risk of failure than the sensor 10.

[0054] Alternatively, even if no failure occurs in each part of the signal processing device 1, a failure may occur in the process bus PB connecting the merging unit 30 and the external calculation device 900. Since the process bus PB is a signal line that transmits digital signals (e.g., the above-mentioned sampling data SMP), it is considered that the possibility of failure is higher than that of a general analog signal line. As yet another example, even if no failure occurs in the signal processing device 1 and the process bus PB, a failure may occur in the external calculation device 900.

[0055] For the above reasons, in the configuration example of Fig. 1, if a failure occurs in some of the components located downstream of the sensor 10, for example, an operator at the power facility 1000 cannot grasp the state of the measurement object ST through the external computing device 900. In consideration of such disadvantages that may arise in the configuration example of Fig. 1, the example of Fig. 5 further includes a sub-signal conversion unit 120.

[0056] 5 may be configured to convert the first voltage signal SG1 acquired from the sensor 10 into a monitor signal. The monitor signal may be a signal suitable for monitoring in the display device 190, for example.

[0057] Therefore, the manner of conversion of the first voltage signal SG1 in the sub signal converting unit 120 is not particularly limited. The sub signal converting unit 120 may convert the first voltage signal SG1 in the same manner as the signal converting unit 20, or may convert the first voltage signal SG1 in a manner different from that of the signal converting unit 20.

[0058] In the third embodiment, the sub-signal converting unit 120 converts the first voltage signal SG1 in a similar manner to the signal converting unit 20. Therefore, the sub-signal converting unit 120 in the example of FIG. 5 includes a first sub-converting section 121 and a second sub-converting section 122.

[0059] 5, the first sub-conversion unit 121 acquires a first voltage signal SG1 from the sensor 10. The first sub-conversion unit 121 in the example of FIG. 5 is a component paired with the first sub-conversion unit 21 in the signal conversion unit 20 of the first embodiment.

[0060] Therefore, as an example, the first sub conversion unit 121 converts the first voltage signal SG1 acquired from the sensor 10 into the sub current signal SGM_SUB. For example, the first sub conversion unit 121 is configured to convert an AC voltage with an amplitude of 10 mV into an AC current with an offset value of 12 mA and an amplitude of 8 mA (see the description of the first conversion unit 21 in the first embodiment). In this way, the sub current signal SGM_SUB can also be an offset AC signal, like the above-mentioned current signal SGM.

[0061] The second sub-conversion unit 122 in the example of FIG. 5 is a component paired with the second sub-conversion unit 22 in the signal conversion unit 20 of the first embodiment. Therefore, the second sub-conversion unit 122 is located downstream of the first sub-conversion unit 121. As an example, the second sub-conversion unit 122 converts the sub-current signal SGM_SUB acquired from the first sub-conversion unit 121 into a second sub-voltage signal SG2_SUB. For example, the second sub-conversion unit 122 is configured to convert an AC current with an amplitude of 8 mA into an AC voltage with an amplitude of 10 V. (See the description of the second conversion unit 22 in the first embodiment).

[0062] 5 converts the first voltage signal SG1 acquired from the sensor 10 into the second sub-voltage signal SG2_SUB having a larger amplitude than the first voltage signal SG1. The second sub-voltage signal SG2_SUB is an example of the above-mentioned monitor signal. In this manner, the sub-signal converting unit 120 can generate the second sub-voltage signal SG2_SUB as a monitor signal.

[0063] As can be understood from the example of embodiment 1, by converting the first voltage signal SG1 into the second sub-voltage signal SG2_SUB via conversion into the sub-current signal SGM_SUB, it is possible to obtain the second sub-voltage signal SG2_SUB in which the influence of noise during signal transmission within the sub-signal conversion unit 120 is reduced.

[0064] The second sub-voltage signal SG2_SUB corresponds to the electrical signal SG0. Therefore, as an example, the sub-signal converting unit 120 may output the generated second sub-voltage signal SG2_SUB to the display device 190. This allows an operator at the power equipment 1000 to roughly grasp the state of the measurement object ST by visually checking the second sub-voltage signal SG2_SUB displayed on the display device 190, even if the operator is unable to grasp the state of the measurement object ST through the external computing device 900.

[0065] Therefore, in the third embodiment, even if a failure occurs in at least one of the signal converting unit 20, the merging unit 30, the process bus PB, and the external computing device 900, the worker can roughly grasp the state of the measurement object ST through the display device 190 and then perform a predetermined operation (e.g., operating a switch gear) in the power equipment 1000. Thus, according to the third embodiment, the safety of the operation in the power equipment 1000 can be improved.

[0066] 5, the sub-signal converting unit 120 further includes an effective value derivation section 123 that derives the effective value of a predetermined signal. In the third embodiment, the effective value derivation section 123 obtains the second sub-voltage signal SG2_SUB as a monitor signal from the second sub-conversion section 122, and derives the effective value of the second sub-voltage signal SG2_SUB. Therefore, the sub-signal converting unit 120 can also output the effective value of the monitor signal.

[0067] If it is only necessary to allow the operator to roughly grasp the state of the measurement object ST, it is not necessary to present the waveform of the monitor signal to the operator. Therefore, for example, the sub-signal converting unit 120 may output the effective value of the monitor signal to the display device 190. In this case, the display device 190 displays the effective value. By presenting the effective value to the operator through the display device 190, the operator can more clearly grasp the state of the measurement object ST.

[0068] 2, the waveform of the second sub voltage signal SG2_SUB in the third embodiment corresponds to the differentiated waveform of the electrical signal SG0. However, if it is only necessary to derive the effective value of the second sub voltage signal SG2_SUB, it is not necessary to restore the waveform of the electrical signal SG0 from the waveform of the second sub voltage signal SG2_SUB.

[0069] Therefore, the sub-signal converting unit 120 does not need a predetermined calculation (e.g., integration) for restoring the waveform of the electrical signal SG0 from the waveform of the second sub-voltage signal SG2_SUB. Therefore, the sub-signal converting unit 120 can be realized with a relatively simple configuration.

[0070] As described above, according to the third embodiment, a backup for failure of at least one of the signal converting unit 20, the merging unit 30, the process bus PB, and the external calculation device 900 can be realized with a relatively simple configuration.

[0071] [Software implementation example] The functions of the power equipment 1000 (hereinafter, for convenience, referred to as the "device") can be realized by a program for causing a computer to function as the device, and by a program for causing a computer to function as each control block of the device.

[0072] In this case, the device includes a computer having at least one control device (e.g., a processor) and at least one storage device (e.g., a memory) as hardware for executing the program. The control device and storage device execute the program to realize each function described in each of the above embodiments.

[0073] The program may be non-transitory and may be recorded in one or more computer-readable recording media. The recording media may or may not be included in the device. In the latter case, the program may be provided to the device via any wired or wireless transmission medium.

[0074] In addition, some or all of the functions of each of the control blocks can be realized by a logic circuit. For example, an integrated circuit in which a logic circuit that functions as each of the control blocks is formed is also included in the scope of one aspect of the present invention. In addition, the functions of each of the control blocks can be realized by, for example, a quantum computer.

[0075] Furthermore, each process described in each of the above embodiments may be executed by AI (Artificial Intelligence). In this case, the AI ​​may be executed by the control device or another device (for example, an edge computer or a cloud server).

[0076] 〔summary〕 A signal processing device according to a first aspect of the present invention comprises a sensor that outputs a first voltage signal corresponding to an electrical signal generated in a measured object in an electric power equipment, a merging unit that can be connected to a process bus in the electric power equipment, and a signal conversion unit located between the sensor and the merging unit, wherein the signal conversion unit converts the first voltage signal acquired from the sensor into a second voltage signal having a larger amplitude than the first voltage signal, and supplies the second voltage signal to the merging unit.

[0077] In a signal processing device according to aspect 2 of the present invention, in aspect 1, the signal conversion unit may convert the first voltage signal acquired from the sensor into a current signal, and may convert the current signal into the second voltage signal.

[0078] In a signal processing device according to a third aspect of the present invention, in the second aspect, the current signal may be an offset AC signal.

[0079] The signal processing device according to a fourth aspect of the present invention may be configured in such a manner that, in the third aspect, the signal processing device detects an abnormality in the object to be measured based on the current signal.

[0080] In a signal processing device according to aspect 5 of the present invention, in any one of aspects 1 to 4 above, the sensor may be a Rogowski coil type CT, and the electrical signal may be a current flowing through the object to be measured.

[0081] In the signal processing device according to aspect 6 of the present invention, in any one of aspects 1 to 4, the sensor may be a voltage division type VT, and the electrical signal may be a voltage applied to the object to be measured.

[0082] In the signal processing device according to a seventh aspect of the present invention, in any one of the first to sixth aspects, the distance between the sensor and the signal converting unit may be 10 cm or less.

[0083] In a signal processing device according to aspect 8 of the present invention, in any one of aspects 1 to 7, the merging unit may generate a digital signal corresponding to the electrical signal by performing AD conversion on the second voltage signal as an analog signal, may generate sampling data of the electrical signal by performing signal processing on the digital signal, and may output the sampling data to the outside of the signal processing device via the process bus.

[0084] A signal processing system according to aspect 9 of the present invention may comprise a signal processing device according to any one of claims 1 to 8 and a sub-signal converting unit located outside the signal processing device, wherein the sub-signal converting unit may be connected in parallel with the signal converting unit to the sensor, and the sub-signal converting unit may convert the first voltage signal acquired from the sensor into a monitor signal.

[0085] In a signal processing system according to aspect 10 of the present invention, in aspect 9, the sub-signal conversion unit may generate the second sub-voltage signal as the monitor signal by converting the first voltage signal acquired from the sensor into a second sub-voltage signal having a larger amplitude than the first voltage signal.

[0086] In a signal processing system according to aspect 11 of the present invention, in aspect 10, the sub-signal conversion unit may convert the first voltage signal acquired from the sensor into a sub-current signal, and may convert the sub-current signal into the second sub-voltage signal.

[0087] [Additional Notes] One aspect of the present invention is not limited to the above-described embodiments, and various modifications are possible within the scope of the claims. Embodiments obtained by appropriately combining the technical means disclosed in different embodiments are also included in the technical scope of one aspect of the present invention. [Explanation of symbols]

[0088] 1. 1A Signal Processing Device 10 Sensor (Rogowski coil type CT) 10A sensor (VT using capacitive voltage division method) 20 Signal conversion unit 21 First conversion unit 22 Second conversion section 30 Merging Units 31 AD conversion section 32 Signal Processing Section 33 Output section 100 Signal Processing System 120 Sub-signal conversion unit 121 First sub-conversion unit 122 Second sub-conversion unit 900 External computing device 1000 Power equipment SG0 Electrical signal SG1 First voltage signal SG2 Second voltage signal SGM current signal (offset AC signal) ST Measurement target PB Process Bus

Claims

1. a sensor that outputs a first voltage signal corresponding to an electrical signal generated in a measurement object in the power equipment; a merging unit connectable to a process bus in the power facility; a signal conversion unit located between the sensor and the merging unit, The signal conversion unit includes: converting the first voltage signal obtained from the sensor into a second voltage signal having a greater amplitude than the first voltage signal; A signal processor that provides the second voltage signal to the merging unit.

2. The signal conversion unit includes: converting the first voltage signal obtained from the sensor into a current signal; 2. The signal processing device of claim 1, further comprising: a first input for inputting a current signal to said second voltage signal;

3. 3. The signal processing apparatus of claim 2, wherein the current signal is an offset AC signal.

4. The signal processing device according to claim 3 , further comprising: a detecting section configured to detect an abnormality in the object to be measured based on the current signal.

5. The sensor is a Rogowski coil type CT, The signal processing device according to claim 1 , wherein the electrical signal is a current flowing through the object to be measured.

6. The sensor is a capacitive voltage divider type VT, The signal processing device according to claim 1 , wherein the electrical signal is a voltage applied to the object to be measured.

7. The signal processing device according to claim 1 , wherein the distance between the sensor and the signal converting unit is 10 cm or less.

8. The merging unit is performing AD conversion on the second voltage signal as an analog signal to generate a digital signal corresponding to the electrical signal; generating sampling data of the electrical signal by performing signal processing on the digital signal; 5. The signal processing device according to claim 1, wherein the sampling data is outputted to an outside of the signal processing device via the process bus.

9. A signal processing device according to any one of claims 1 to 4, A sub-signal conversion unit located outside the signal processing device, the sub-signal converting unit is connected in parallel with the signal converting unit to the sensor; The sub-signal conversion unit converts the first voltage signal acquired from the sensor into a monitor signal.

10. The signal processing system of claim 9, wherein the sub-signal conversion unit generates the second sub-voltage signal as the monitor signal by converting the first voltage signal acquired from the sensor into a second sub-voltage signal having a larger amplitude than the first voltage signal.

11. The sub-signal conversion unit includes: converting the first voltage signal obtained from the sensor into a sub-current signal; 11. The signal processing system of claim 10, further comprising: a signal processing unit for converting said sub-current signal into said second sub-voltage signal.

Images