Stacked wire mount wafer connector

Abstract

To provide a stacked wire mount wafer connector and a connector assembly that can reduce the number of parts and size while enhancing operability of insertion and removal.SOLUTION: A stacked wire mount wafer connector includes a latch portion 25 integrally formed with a wafer 40 and extending along the second side 46a of the wafer 40, at least one protrusion 47b extending outward from a first base 47 of the wafer along the Z-axis direction of the wafer 40, and at least one opening into which the protrusion 47b of another stacked wire mount wafer connector 20 is inserted. By inserting the protrusion 47b of the other stacked wire mount wafer connector 20 into the opening of the stacked wire mount wafer connector 20, misalignment in the mating direction (X-axis direction) of the mating connectors between the stacked wire mount wafer connector 20 and the other stacked wire mount wafer connector 20 is suppressed.SELECTED DRAWING: Figure 5

Description

[Technical field]

[0001] One aspect of the present disclosure relates to stacked wire mount wafer connectors and connector assemblies. [Background technology]

[0002] Conventionally, stacked wire mount wafer connectors and connector assemblies have been known. Patent Document 1 describes a multi-stage connector having a first housing, a second housing, and a cover. The multi-stage connector is inserted into a box-shaped mating connector with the first housing, the second housing, and the cover stacked on top of each other. The cover has a lock piece that engages with the mating connector, and the multi-stage connector is mated with the mating connector by the engagement of the lock piece of the cover. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 10-79273 Summary of the Invention [Problem to be solved by the invention]

[0004] In the meantime, in stacked wire-mounted wafer connectors such as the multi-stage connector described above, there is a demand for improved ease of insertion and removal. However, stacked wire-mounted wafer connectors have a large number of parts, and the current situation is that assembly is complicated due to the large number of parts. In the multi-stage connector described above, the cover, not the first housing and the second housing, engages with the mating connector, so that the mating connector cannot be fitted with the cover unless the cover is attached to the second housing. In addition, in the multi-stage connector described above, the first housing or the second housing alone cannot be inserted or removed from the mating connector, and a cover is always required for insertion and removal, so that insertion and removal cannot be easily performed in this respect as well. Furthermore, the current situation is that the connector assembly is large because the first housing and the second housing cannot be inserted or removed individually, and the mating connector requires an area to accommodate the cover.

[0005] One aspect of the present disclosure aims to provide a stacked wire-mount wafer connector and connector assembly that can reduce the number of parts and the size while improving the ease of insertion and removal. [Means for solving the problem]

[0006] A stacked wire mount wafer connector according to one embodiment of the present disclosure is a stacked wire mount wafer connector having electrically insulating wafers for electrically connecting a plurality of wires to a mating connector, the stacked wire mount wafer connector comprising a first base and a second base extending between opposing first and second sides and between opposing first and second ends, the first base and the second base defining a cavity between the first base and the second base, a first end face provided at the first end for receiving the plurality of wires, a second end face provided at the second end for mating with the mating connector, and a second end face provided at the first side for receiving the plurality of wires. the first side surface provided on the first side portion, a latch portion formed integrally with the wafer and extending along the second side surface of the wafer, at least one protrusion extending outward from the first base portion of the wafer along the thickness direction of the wafer (Z-axis), and at least one opening into which a protrusion of another stacked wire mount wafer connector is inserted, and by inserting the protrusion of the other stacked wire mount wafer connector into the opening of the stacked wire mount wafer connector, slippage of the mating connectors between the stacked wire mount wafer connector and the other stacked wire mount wafer connector in the mating direction (X-axis) is suppressed.

[0007] A connector assembly according to one embodiment of the present disclosure comprises a first connector having an open end and defining a receiving area, and a plurality of stackable second connectors, each of which is inserted into the receiving area from the open end and mated with the first connector, each of which has a latch portion that transitions between a latched state in which each second connector latches into the first connector and an unlatched state in which each second connector is unlatched from the first connector, and when the latch portion of each of the stacked plurality of second connectors is not in the unlatched state, none of the stacked plurality of second connectors is unmated from the first connector. Effect of the Invention

[0008] According to one embodiment of the present disclosure, it is possible to reduce the number of parts and the size, while improving the ease of insertion and removal. [Brief description of the drawings]

[0009] [Figure 1] 1 is a perspective view showing an example of a state in which a plurality of connector assemblies according to an embodiment are arranged on a substrate; [Diagram 2] 1 is a perspective view showing a connector assembly according to an embodiment; [Diagram 3] 3 is a longitudinal cross-sectional view of the connector assembly of FIG. 2. [Figure 4] 3 is a perspective view of an example of a first connector of the connector assembly of FIG. 2. [Diagram 5] 3 is a perspective view showing an example of a plurality of second connectors of the connector assembly of FIG. 2. [Figure 6] 6 is a perspective view showing an example of a wafer of the second connector of FIG. 5. FIG. [Figure 7] 7 is a perspective view of the wafer in FIG. 6, seen from a different direction than in FIG. [Figure 8] 6 is a perspective view showing an example of the second connector and terminals of FIG. 5. [Figure 9] FIG. 9 is a perspective view showing the terminal of FIG. 8. [Figure 10] 10 is a perspective view of the terminal of FIG. 9, seen from a different direction than that of FIG. [Figure 11] 8 is a perspective view showing an example of a state in which a wire is attached to the wafer in FIG. 7. FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] Hereinafter, embodiments of a stacked wire mount wafer connector and connector assembly according to the present disclosure will be described with reference to the drawings. In the description of the drawings, the same or corresponding elements are designated by the same reference numerals, and duplicated descriptions will be omitted as appropriate.

[0011] A connector assembly 1 according to this embodiment will be described with reference to FIG. 1. As shown in FIG. 1, for example, the connector assembly 1 is arranged on a substrate B, and a plurality of connector assemblies 1 are arranged on the substrate B so as to be lined up in one direction. The plurality of connector assemblies 1 may be arranged, for example, in a lattice pattern, and the arrangement of the connector assembly 1 can be changed as appropriate. The connector assembly 1 includes a mating connector 10 which is a first connector mounted on the substrate B, and stacked wire-mount wafer connectors 20 which are a plurality of second connectors housed in the mating connector 10. The mating connector 10 is, for example, a board-mounted connector (board-mounted connector) mounted on the substrate B.

[0012] For example, the mating connector 10 is box-shaped, and a plurality of stacked wire-mount wafer connectors 20 can be fitted (inserted and removed) inside the box-shaped mating connector 10. As an example, the mating connector 10 is a bottomed box having a bottom 18. Each stacked wire-mount wafer connector 20 is, for example, plate-shaped, and the plurality of stacked wire-mount wafer connectors 20 are fitted into the mating connector 10 in a state where they are stacked in the thickness direction of the stacked wire-mount wafer connector 20.

[0013] In the following description, the mating direction of the stacked wire mount wafer connector 20 with the mating connector 10 may be referred to as the direction along which the X axis extends (X-axis direction), the direction along which the multiple stacked wire mount wafer connectors 20 are lined up in the mating connector 10 as the direction along which the Z axis extends (Z-axis direction), and the lateral direction intersecting (for example, perpendicular to) both the X axis and the Z axis as the direction along which the Y axis extends (Y-axis direction). Also, the direction in which the connector assembly 1 is viewed from the substrate B may be referred to as the top, and the direction in which the substrate B is viewed from the connector assembly 1 may be referred to as the bottom.

[0014] For example, the X-axis direction corresponds to the thickness direction of the substrate B and the direction in which the substrate B and the connector assembly 1 are arranged side by side. The Y-axis direction corresponds to the direction in which the channels 42 (described later) of each stacked wire-mounted wafer connector 20 are arranged side by side. The Z-axis direction corresponds to the direction in which the multiple mating connectors 10 are arranged side by side and the direction in which the multiple stacked wire-mounted wafer connectors 20 are stacked side by side.

[0015] Fig. 2 is a perspective view showing the connector assembly 1. Fig. 3 is a cross-sectional view of the connector assembly 1 cut along a plane (XY plane) extending along both the X-axis and the Y-axis. As shown in Figs. 2 and 3, a plurality of stacked wire-mount wafer connectors 20 are arranged along the Z-axis inside the mating connector 10, and each stacked wire-mount wafer connector 20 includes a plurality of terminals 30 and an electrically insulating wafer 40 having a cavity 41 in which the plurality of terminals 30 are housed. The cavity 41 is partitioned into a plurality of channels 42.

[0016] For example, a plurality of contacts 11 to be inserted into the substrate B extend from the mating connector 10, and each contact 11 is rod-shaped extending along the X-axis direction. Each contact 11 extends in the X-axis direction inside the cavity 41 of the wafer 40. As an example, the contact 11 has a rod-shaped insertion portion 11a to be inserted into the substrate B, an extension portion 11b that extends from the insertion portion 11a at an end of the insertion portion 11a, and a rod-shaped terminal connection portion 11c that extends from the extension portion 11b to the opposite side of the insertion portion 11a and enters the terminal 30.

[0017] The mating connector 10 has a recess 10b that is recessed downward (toward the board B) on the bottom surface of the bottom 18 of the mating connector 10 and into which the extension portion 11b of the contact 11 fits, and a hole 10c through which the insertion portion 11a of the contact 11 penetrates along the X-axis. The contact 11 is fixed to the mating connector 10 with the insertion portion 11a inserted into the hole 10c and the extension portion 11b fitted into the recess 10b.

[0018] The mating connector 10 has an open end 12 and a receiving area 13 for receiving the stacked wire mount wafer connectors 20. The mating connector 10 defines the receiving area 13 for receiving the multiple stacked wire mount wafer connectors 20. For example, the receiving area 13 is an area inside the box-shaped mating connector 10, and the open end 12 is a portion that opens to the opposite side of the bottom 18 (substrate B). In the receiving area 13, for example, the multiple stacked wire mount wafer connectors 20 are mated with the mating connector 10 along the X-axis, and the terminals 30 inside the stacked wire mount wafer connector 20 connect (contact) with the contacts 11 extending from the mating connector 10.

[0019] For example, four stacked wire-mount wafer connectors 20 are mated with the mating connector 10. Each of the stacked wire-mount wafer connectors 20 has a latch portion 25 that engages with the mating connector 10. The mating connector 10 has a hole portion 10d with which the latch portion 25 engages, and the stacked wire-mount wafer connector 20 is mated with the mating connector 10 by the latch portion 25 engaging with the hole portion 10d.

[0020] The hole 10d of the mating connector 10 penetrates in the Y direction, for example, in a region including the center in the Z-axis direction of the mating connector 10. Furthermore, among the multiple stacked wire-mount wafer connectors 20 lined up in the Z-axis direction, the latch portions 25 of some of the stacked wire-mount wafer connectors 20 engage with the mating connector 10, but the latch portions 25 of the remaining stacked wire-mount wafer connectors 20 do not engage with the mating connector 10.

[0021] For example, of the multiple stacked wire-mount wafer connectors 20 aligned in the Z-axis direction, the latch portion 25 of the stacked wire-mount wafer connector 20 located at the center in the Z-axis direction engages with the mating connector 10, while the latch portions 25 of the stacked wire-mount wafer connectors 20 located at both ends in the Z-axis direction do not engage with the mating connector 10. As an example, of four stacked wire-mount wafer connectors 20 aligned in the Z-axis direction, the latch portions 25 of two stacked wire-mount wafer connectors 20 located at the center in the Z-axis direction engage with the mating connector 10, while the latch portions 25 of two stacked wire-mount wafer connectors 20 located at the ends in the Z-axis direction do not engage with the mating connector 10.

[0022] Fig. 4 is a perspective view showing the mating connector 10. As shown in Fig. 4, the mating connector 10 has a pair of a first side portion 14 and a second side portion 15 aligned along the Y-axis direction, and a pair of a third side portion 16 and a fourth side portion 17 aligned along the Z-axis direction. The receiving area 13 is defined by the bottom portion 18, the first side portion 14, the second side portion 15, the third side portion 16, and the fourth side portion 17 of the mating connector 10 described above, and an open end portion 12 is provided on the opposite side of the bottom portion 18.

[0023] The bottom 18 has, for example, a plurality of protrusions 18a protruding outward (lower side, board B side) in the X-axis direction of the bottom 18, and a board insertion portion 18b (see FIG. 3). For example, the board insertion portion 18b is a metal portion separate from a resin portion of the mating connector 10 (for example, a portion other than the board insertion portion 18b). The bottom 18 has, for example, a rectangular shape, and a protrusion 18a is provided at each of the four corners of the bottom 18. Each of the plurality of protrusions 18a contacts, for example, the upper surface of the board B, and a gap S1 (see FIG. 1) is formed between the portion of the bottom 18 other than the protrusion 18a and the upper surface of the board B. The bottom 18 has, for example, a pair of board insertion portions 18b aligned along the Y-axis direction, and the mating connector 10 is fixed to the board B by inserting each board insertion portion 18b into the board B.

[0024] The first side portion 14 has a first outer surface 14a extending along both the X-axis direction and the Z-axis direction, an inclined surface 14b inclined outward in the Y-axis direction from an end portion of the first outer surface 14a opposite the bottom portion 18, and a second outer surface 14c extending in both the X-axis direction and the Z-axis direction at an end portion of the inclined surface 14b opposite the first outer surface 14a. The first outer surface 14a, the inclined surface 14b, and the second outer surface 14c are, for example, all flat.

[0025] The first outer surface 14a is provided with a protrusion 19 that protrudes outward (outward in the Y-axis direction) of the mating connector 10. The protrusion 19 protrudes, for example, in a rectangular shape in a region including the center of the first outer surface 14a. The protrusion 19 is provided below the hole 10d (latch portion 25) of the mating connector 10. The protrusion 19 functions as a marker when searching with a finger for the mating position of the stacked wire-mount wafer connector 20 that is mated with the mating connector 10.

[0026] The inclined surface 14b and the second outer surface 14c are formed with the aforementioned hole 10d, and the hole 10d penetrates in the Y-axis direction. The hole 10d is formed, for example, in an area including the center in the Z-axis direction of the lower part of the inclined surface 14b and the second outer surface 14c. In the upper part of the second outer surface 14c, a recess 14d recessed downward from the upper end of the second outer surface 14c is formed, and the recess 14d is formed in an area including the center in the Z-axis direction of the second outer surface 14c. Parts (upper parts) of the multiple latch parts 25 are exposed in the recess 14d. By exposing parts of the multiple latch parts 25 in the recess 14d, it is possible to reduce the height of the stacked wire-mount wafer connector 20 accommodated in the mating connector 10, and it is also possible to make each latch part 25 easier to pick up with fingers or the like.

[0027] The second side portion 15, the third side portion 16, and the fourth side portion 17 are, for example, all flat. The height of the upper end 15a of the second side portion 15 is lower than the upper end 16a of the third side portion 16 and the upper end 17a of the fourth side portion 17. The height of the upper end 15a of the second side portion 15 may be, for example, approximately the same as the height of the upper surface (bottom surface) of the recess 14d. A protrusion 26 of the stacked wire-mount wafer connector 20, which will be described later, is exposed at the upper end 15a of the second side portion 15.

[0028] Fig. 5 is a perspective view showing a plurality of stacked stacked wire-mount wafer connectors 20. Fig. 6 is a perspective view of the stacked wire-mount wafer connector 20. Fig. 7 is a perspective view of the stacked wire-mount wafer connector 20 of Fig. 6, seen from a different direction than Fig. 6. As shown in Figs. 5, 6 and 7, for example, a plurality of plate-shaped stacked wire-mount wafer connectors 20 are stacked along the Z-axis direction.

[0029] As described above, each stacked wire-mount wafer connector 20 includes the terminals 30 and an electrically insulating wafer 40. The terminals 30 are not shown in Figs. 6 and 7. The wafer 40 is, for example, in the form of a plate extending in the X-axis direction and the Y-axis direction and having a thickness in the Z-axis direction. The wafer 40 of the stacked wire-mount wafer connector 20 includes a first end 43 and a second end 44 aligned along the X-axis direction, a first side portion 45 and a second side portion 46 aligned along the Y-axis direction, and a first base portion 47 and a second base portion 48 aligned along the Z-axis direction.

[0030] The first end 43 and the second end 44 face each other, and the first base 47 and the second base 48 extend between the first end 43 and the second end 44. The first side 45 and the second side 46 face each other, and the first base 47 and the second base 48 extend between the first side 45 and the second side 46. The cavity 41 described above is defined between the first base 47 and the second base 48.

[0031] The first end 43 has a first end surface 43a that receives a plurality of wires 50, which will be described later. The first end surface 43a is, for example, rectangular in shape facing the X-axis direction and extending long in the Y-axis direction. That is, the first end surface 43a is rectangular in shape having a long side extending in the Y-axis direction and a short side extending in the Z-axis direction. As an example, the first end surface 43a is flat. The first end surface 43a has openings 41a of a plurality of cavities 41 aligned along the Y-axis direction, for example. As an example, each opening 41a is rectangular. The second end 44 is, for example, located on the opposite side of the first end 43 as viewed from the first base 47, and has a second end surface 44a (see FIG. 3) that receives a plurality of contacts 11 extending from the mating connector 10. The second end surface 44a is, for example, rectangular in shape facing the X-axis direction and extending long in the Y-axis direction, similar to the first end surface 43a.

[0032] As shown in Fig. 3, the second end face 44a of the second end 44 has a plurality of holes 44b arranged along the Y-axis direction, and each hole 44b extends in the X-axis direction at the second end 44 and communicates with the cavity 41. The hole 44b is defined by a tapered surface 44c extending obliquely upward from the second end face 44a and an inner side surface 44d extending upward from the upper end of the tapered surface 44c. The upper end of the inner side surface 44d is provided with a bottom surface 41b of the cavity 41, and a mating portion 32 (described later) of the terminal 30 faces the bottom surface 41b of the cavity 41 along the X-axis direction. The upper surface of the extension portion 11b of the contact 11 faces the tapered surface 44c, and the terminal connection portion 11c extending upward from the extension portion 11b faces the inner side surface 44d.

[0033] 5, 6, and 7, the first side portion 45 has a first side surface 45a facing the Y-axis direction, and a protruding portion 26 protruding in the Y-axis direction at one end of the first side surface 45a on the first end portion 43 side. The first side surface 45a is, for example, rectangular and extending long in the X-axis direction, and is flat and extending along both the X-axis direction and the Z-axis direction. The protruding portion 26 has an inclined surface 26a extending obliquely from the first side surface 45a in both the X-axis direction and the Y-axis direction, and a top surface 26b located on the opposite side of the inclined surface 26a to the first side surface 45a.

[0034] The second side portion 46 includes, for example, a second side surface 46a extending from the first end portion 43 along the X-axis direction, a protruding portion 46b protruding in the Y-axis direction from an end portion of the second side surface 46a opposite to the first end portion 43, and a latch portion 25 extending from the protruding portion 46b along the second side surface 46a. The latch portion 25 is integrally formed with the wafer 40. The second side surface 46a is, for example, rectangular in shape having a long side along the X-axis direction and a short side along the Z-axis direction.

[0035] The protruding portion 46b has a side surface 46c extending in the Y-axis direction and the Z-axis direction from the second side surface 46a, and a top surface 46d extending in the X-axis direction and the Z-axis direction at an end of the side surface 46c opposite the second side surface 46a. The latch portion 25 has a plate-shaped base 27 continuous with the top surface 46d, an engagement portion 28 protruding outward in the Y-axis direction from the base 27, and a pressing portion 29 protruding outward in the Y-axis direction at the tip of the base 27 and pressed in the Y-axis direction by a finger or the like.

[0036] The base 27 extends from the side surface 46c of the protruding portion 46b toward the first end 43, and an inclined surface 27a inclined in both the X-axis direction and the Y-axis direction is formed on the opposite side of the pressing portion 29 at the tip of the base 27. Between the base 27 and the side surface 46c, for example, a curved surface 27b that connects the base 27 and the side surface 46c to each other is formed. A gap S2 is formed between the second side surface 46a and the base 27. The pressing portion 29 is a portion that is pressed toward the second side surface 46a, and when the pressing portion 29 is pressed, the base 27 is deflected in the Y-axis direction starting from the side surface 46c, and the deflection of the base 27 in the Y-axis direction engages and disengages the engaging portion 28. Details of the engagement and disengagement by the engaging portion 28 will be described later.

[0037] The engagement portion 28 is provided between the side surface 46c (the base end of the base portion 27) and the pressing portion 29 (the tip end of the base portion 27). The engagement portion 28 has a tapered surface 28a that is inclined from the base portion 27 in both the X-axis direction and the Y-axis direction, a top surface 28b that extends along the X-axis direction and the Z-axis direction at the end portion of the tapered surface 28a on the outer side in the Y-axis direction, and a side surface 28c that extends along the Y-axis direction and the Z-axis direction on the opposite side of the top surface 28b to the tapered surface 28a. The tapered surface 28a is a portion that faces the inner surface 10f (see FIG. 3) of the hole portion 10d, and the top surface 28b and the side surface 28c are portions that engage with the hole portion 10d.

[0038] The pressing portion 29 has a curved surface 29a extending from the base portion 27, a first protruding surface 29b extending from the curved surface 29a, an inclined surface 29c extending from the first protruding surface 29b, a top surface 29d, and a second protruding surface 29e extending from the opposite side of the top surface 29d to the inclined surface 29c. The curved surface 29a is inclined in both the X-axis direction and the Y-axis direction from the base portion 27. The first protruding surface 29b extends in the Y-axis direction and the Z-axis direction from the opposite side of the curved surface 29a from the base portion 27, and the inclined surface 29c is inclined in both the X-axis direction and the Y-axis direction from the end of the first protruding surface 29b opposite to the curved surface 29a.

[0039] Top surface 29d is located on the opposite side of inclined surface 29c to first protruding surface 29b, and second protruding surface 29e extends along the Y-axis direction and the Z-axis direction on the opposite side of inclined surface 29c to top surface 29d. Top surface 29d is a portion to be placed on by a finger or the like, and when top surface 29d is pressed by a finger or the like, base 27 is deflected toward the center of stacked wire-mount wafer connector 20 in the Y-axis direction.

[0040] The first base 47 has, for example, a surface 47a facing another stacked wire mount wafer connector 20 (wafer 40) along the Z-axis direction, and a protrusion 47b extending outward from the surface 47a in the thickness direction of the wafer 40 (along the Z-axis). The surface 47a is, for example, flat, and the protrusion 47b is cylindrical. However, the shape of the protrusion 47b is not limited to a cylindrical shape, and may be, for example, a rectangular column or an oval column, and can be changed as appropriate.

[0041] The protrusions 47b are portions for joining the wafer 40 to another wafer 40 of another stacked wire-mount wafer connector 20, and the first base 47 has, for example, a plurality of protrusions 47b. The plurality of protrusions 47b are disposed at one end of the first base 47 in the Y-axis direction and the other end of the first base 47 in the Y-axis direction. In this manner, by disposing the protrusions 47b at one end of the first base 47 in the Y-axis direction and the other end of the first base 47 in the Y-axis direction, it becomes possible to firmly join another stacked wire-mount wafer connector 20 at both ends in the Y-axis direction.

[0042] For example, at least one end in the Y-axis direction (the end on the protruding portion 26 side, for example) has a plurality of protrusions 47b arranged at one end in the X-axis direction and the other end in the X-axis direction. By arranging the protrusions 47b at one end in the X-axis direction and the other end in the X-axis direction, it is possible to firmly couple other stacked wire-mounted wafer connectors 20 at both ends in the X-axis direction. In this embodiment, a set C of two protrusions 47b is arranged at each of both ends in the X-axis direction at the end on the protruding portion 26 side (opposite the latch portion 25) in the Y-axis direction, and a set C of two protrusions 47b is arranged at the end on the second end 44 side in the X-axis direction at the end on the latch portion 25 side in the Y-axis direction. In each set C, the two protrusions 47b are arranged so as to be aligned along the X-axis direction. Each protrusion 47b has an outer peripheral surface 47c extending upward relative to surface 47a, an inclined surface 47d inclined from the upper end of outer peripheral surface 47c in the direction in which protrusion 47b reduces in diameter, and a top surface 47e extending approximately parallel to surface 47a at the upper end of inclined surface 47d.

[0043] The second base 48 has, for example, a surface 48a facing another stacked wire mount wafer connector 20 (wafer 40) along the Z-axis direction, an opening 48b recessed from the surface 48a in the thickness direction of the wafer 40 and into which the above-mentioned protrusion 47b is inserted, and engaged portions 48c and 48f with which the terminal 30 passing through the cavity 41 engages. The engaged portion 48c is, for example, a through hole with which the terminal 30 engages when the wire connection portion 31 is located inside the wafer 40, and the engaged portion 48f is, for example, a through hole with which the terminal 30 engages when a part of the wire connection portion 31 is located outside the wafer 40. The engaged portions 48c and 48f are, for example, through holes penetrating the second base 48 in the Z-axis direction. As an example, the engaged portions 48c and 48f are rectangular in shape. Surface 48a has a recess 48d that is recessed in the Z-axis direction at the end portion on the protrusion 26 side in the Y-axis direction including the center in the X-axis direction, and recess 48d extends into a portion of the first side surface 45a of the first side portion 45 described above.

[0044] The openings 48b are portions where the wafer 40 of another stacked wire mount wafer connector 20 is bonded to the wafer 40, and the second base 48 has, for example, a plurality of openings 48b. The plurality of openings 48b are disposed at one end of the second base 48 in the Y-axis direction and at the other end of the second base 48 in the Y-axis direction. For example, at least one end of the second base 48 in the Y-axis direction (the end on the protruding portion 26 side, as an example) the openings 48b are disposed at one end of the second base 48 in the X-axis direction and at the other end of the second base 48 in the X-axis direction.

[0045] In this embodiment, an opening 48b is arranged at each of both ends in the X-axis direction at the end on the protruding portion 26 side in the Y-axis direction, and an opening 48b is arranged at the end on the second end 44 side in the X-axis direction at the end on the latch portion 25 side in the Y-axis direction. The opening 48b is, for example, rectangular with a long side in the X-axis direction and a short side in the Y-axis direction, and has an inner side surface 48e against which the outer circumferential surface 47c of the protrusion 47b abuts. The inner side surfaces 48e are provided in a pair along the width direction (Y-axis direction) of the opening 48b, for example.

[0046] The width of the opening 48b (the distance between the pair of inner sides 48e) is set to be approximately the same as the diameter of the outer circumferential surface 47c of the protrusion 47b. Therefore, by pushing the protrusion 47b into the opening 48b, the outer circumferential surface 47c abuts against each inner side surface 48e of the opening 48b, and the protrusion 47b is coupled to the opening 48b. For example, two protrusions 47b forming a set C are inserted into one opening 48b, and the outer circumferential surfaces 47c of the two protrusions 47b abut against each of the pair of inner sides 48e. In this way, by having one opening 48b for multiple protrusions 47b, the number of openings 48b can be reduced. Note that the number, size, shape, and arrangement of the protrusions 47b and the openings 48b are not limited to the above example and can be changed as appropriate.

[0047] Next, the terminals 30 accommodated in the cavities 41 of the wafer 40 will be described. FIG. 8 is a perspective view showing the terminals 30 inserted into the cavities 41. FIG. 9 is a perspective view showing the terminals 30. FIG. 10 is a perspective view of the terminals 30 viewed from a different direction than that of FIG. 9. As shown in FIGS. 8, 9, and 10, a plurality of terminals 30 arranged and spaced apart from each other are accommodated inside the cavity 41. Each terminal 30 includes a wire connecting portion 31 disposed adjacent to a first end portion 43, a fitting portion 32 disposed adjacent to a second end portion 44, and a connecting portion 33 connecting the wire connecting portion 31 and the fitting portion 32 to each other.

[0048] The terminal 30 includes a base portion 34 extending in both the X-axis direction and the Y-axis direction, and a pressure-contact portion 35 extending upward relative to the base portion 34. The base portion 34 is a plate-shaped portion extending in the X-axis direction. A wire connection portion 31 is provided at one end of the base portion 34, and a fitting portion 32 is provided at the other end of the base portion 34. The wire connection portion 31 includes the pressure-contact portion 35 and a first support portion 36, and the first support portion 36 supports the wire 50 and the pressure-contact portion 35 conducts the wire 50 to the terminal 30.

[0049] The mating portion 32 includes a second support portion 37 and a contact arm portion 38. The mating portion 32 has, for example, contact arm portions 38 that face each other and are flexible, and when the mating portion 32 receives a contact 11 of the mating connector 10, the contact 11 is received between the pair of contact arm portions 38 that are spread apart (see FIG. 3). The second support portion 37 is provided on the wire connection portion 31 side of the contact arm portion 38, and the second support portion 37 has a pair of second arm portions 37a that extend upward with respect to the base portion 34 and face each other.

[0050] The ends of the pair of second arm portions 37a are connected to each other by a base portion 34, and a notch 34a and an engaging portion 34b protruding from the notch 34a are formed in a portion of the base portion 34 between the pair of second arm portions 37a. The engaging portion 34b is a portion that engages with engaged portions 48c, 48f that are through holes in the wafer 40, and the terminal 30 is engaged with the wafer 40 by the engaging portion 34b engaging with the engaged portions 48c, 48f.

[0051] The notch 34a is formed by a pair of first slits 34c extending in the X-axis direction and a second slit 34d extending in the Y-axis direction between the ends of the pair of first slits 34c on the wire connection portion 31 side. The engagement portion 34b is a plate-shaped portion surrounded by the pair of first slits 34c and the second slit 34d. The engagement portion 34b has a swing shaft portion 34e extending in the Y-axis direction at the end of the pair of first slits 34c on the fitting portion 32 side, and is swingable in the Z-axis direction around the swing shaft portion 34e. In a state where no external force is applied, the engagement portion 34b extends obliquely from the swing shaft portion 34e. The plate-shaped engagement portion 34b fits into the engaged portions 48c, 48f, which are through holes, so that the engagement portion 34b engages with the engaged portions 48c, 48f.

[0052] A pair of recesses 34f recessed in the width direction (Y-axis direction) of the base 34 are formed on the end side in the X-axis direction of the engagement portion 34b of the base 34, and a plate-shaped portion 34g extending along the X-axis direction and the Y-axis direction at the end side in the X-axis direction of the recesses 34f is formed. The plate-shaped portion 34g has a substantially rectangular shape. The plate-shaped portion 34g has a pair of inclined portions 34h extending obliquely in both the X-axis direction and the Y-axis direction at a corner located opposite the recesses 34f.

[0053] The first support portion 36 includes a pair of first arm portions 36a that receive the wire 50 extending along the X-axis direction, and the pair of first arm portions 36a extend upward relative to the base portion 34 and face each other. For example, the positions of the pair of first arm portions 36a in the X-axis direction are offset from each other. That is, one of the pair of first arm portions 36a (for example, the first arm portion 36a on the right side in FIG. 9) is located closer to the end in the X-axis direction than the other (for example, the first arm portion 36a on the left side in FIG. 9).

[0054] Each first arm portion 36a has a curved portion 36b that curves upward from an end portion in the width direction of the base portion 34, a plate-shaped portion 36c that extends obliquely upward from the opposite end of the curved portion 36b to the base portion 34, and a tip portion 36d that inclines inward in the width direction of the base portion 34 from the end portion of the plate-shaped portion 36c opposite the curved portion 36b. The plate-shaped portion 36c is, for example, a rectangular plate extending upward relative to the base portion 34, and the width of the plate-shaped portion 36c narrows from the curved portion 36b toward the tip portion 36d. The wire 50 is supported by the first support portion 36 by being accommodated between the pair of plate-shaped portions 36c and the pair of tip portions 36d that are aligned along the width direction of the base portion 34.

[0055] Each second arm portion 37a of the second support portion 37 has a curved portion 37b that curves upward from an end portion in the width direction of the base portion 34, and a plate-shaped portion 37c that extends upward from the curved portion 37b opposite the base portion 34. An end face 37d of the plate-shaped portion 37c opposite the curved portion 37b includes two step portions 37e that are aligned in the longitudinal direction (X-axis direction) of the base portion 34. Each step portion 37e has an inclined surface 37f that inclines obliquely upward from the end portion of the end face 37d on the contact arm portion 38 side, a top surface 37g that extends in the longitudinal direction of the base portion 34 from the upper end of the inclined surface 37f, and a step surface 37h that extends downward from the end portion of the top surface 37g opposite the inclined surface 37f.

[0056] The contact arm portion 38 extends from each second support portion 37 toward the end portion in the X-axis direction of the terminal 30. A gap S3 is formed between the contact arm portion 38 and the base portion 34, penetrating the base portion 34 in the width direction. The contact arm portion 38 has a first plate-shaped portion 38a extending from the second support portion 37 toward the end portion in the X-axis direction and extending at an inward angle in the width direction of the base portion 34, a second plate-shaped portion 38b located at the end portion of the first plate-shaped portion 38a opposite the second support portion 37, and a third plate-shaped portion 38c inclined toward the outside in the width direction of the base portion 34 from the end portion of the second plate-shaped portion 38b opposite the first plate-shaped portion 38a.

[0057] The width of the first plate-shaped portion 38a is narrower than the width of the second support portion 37 and the width of the second plate-shaped portion 38b, and the width of the gap S3 between the first plate-shaped portion 38a and the base portion 34 is wider than the width of the gap S3 between the second plate-shaped portion 38b and the base portion 34. The first plate-shaped portion 38a and the second plate-shaped portion 38b are inclined inward in the width direction of the base portion 34 toward the end side in the X-axis direction, and the third plate-shaped portion 38c is inclined outward in the width direction of the base portion 34 toward the end side in the X-axis direction. Therefore, the contact 11 inserted into the contact arm portion 38 enters between the pair of third plate-shaped portions 38c and pushes the pair of third plate-shaped portions 38c and the pair of second plate-shaped portions 38b outward in the width direction of the base portion 34, and is accommodated between the pair of first plate-shaped portions 38a and between the pair of second arm portions 37a.

[0058] The insulation displacement portion 35 is a portion that electrically connects the wire 50 to the terminal 30. Fig. 11 is a perspective view showing an exemplary wire 50 before being accommodated in the terminal 30. As shown in Figs. 9, 10 and 11, the wire 50 is, for example, an insulated wire having a conductor portion 51 and an insulating layer 52 that covers the conductor portion 51. The insulation displacement portion 35 is a portion that penetrates into the insulating layer 52 of the wire 50 that is being pushed in and is electrically connected to the conductor portion 51.

[0059] The pressure-contact portion 35 includes, for example, a pair of conductive arms 35a that are physically and electrically connected to the conductor portion 51 of the wire 50, and the pair of conductive arms 35a face each other along the width direction of the base portion 34. Each conductive arm 35a has a curved portion 35b that curves upward from an end of the base portion 34 in the width direction, a plate-shaped portion 35c that extends upward from the opposite side of the curved portion 35b to the base portion 34, and a blade portion 35d that extends from the plate-shaped portion 35c in the longitudinal direction of the base portion 34 and curves inward in the width direction of the base portion 34. The blade portion 35d extends inward in the width direction of the base portion 34 from one end and the other end of the plate-shaped portion 35c in the X-axis direction, and the interval between the pair of blade portions 35d aligned in the width direction of the base portion 34 is narrower than the interval between the pair of plate-shaped portions 35c. A gap S4 is formed between each blade portion 35d and the base portion 34.

[0060] A curved portion 35e is formed between the pair of blade portions 35d and the plate-shaped portion 35c, and the shape of the pressure-connecting portion 35 as viewed from the out-of-plane direction (Z-axis direction) of the base portion 34 is U-shaped with the pair of blade portions 35d and the plate-shaped portion 35c aligned, and the pair of U-shaped portions are aligned along the width direction of the base portion 34. The pair of U-shaped portions of the pressure-connecting portion 35 face each other. When the wire 50 is pressed into the U-shaped portion of the pressure-connecting portion 35, each blade portion 35d cuts through the insulating layer 52 of the wire 50 and penetrates into the insulating layer 52, and each blade portion 35d comes into contact with the conductor portion 51 of the wire 50. As a result, the wire 50 is firmly held by the terminal 30 and the wire 50 is electrically connected to the terminal 30.

[0061] Next, a method of assembling the connector assembly 1 and the stacked wire-mount wafer connector 20 will be described. The wires 50 held as described above are accommodated in each channel 42 of the cavity 41 of the wafer 40 together with the terminals 30. When the terminals 30 are pushed into each channel 42 along the X-axis direction, as shown in Figures 7 and 10, the back surface 34j of the engaging portion 34b of the terminal 30 moves along the inner wall of the cavity 41 toward the second end 44, and the tip surface 34k of the engaging portion 34b hooks onto the inner wall 48g of the engaged portion 48c, so that the engaging portion 34b engages with the engaged portion 48c, and the terminals 30 engage with the wafer 40. In this state, when an external force is applied to the terminal 30 in a direction to pull it out from the wafer 40, the tip surface 34k of the engaging portion 34b is caught on the inner wall 48g of the engaged portion 48c, and the step surfaces 37h of the step portions 37e of the second support portion 37 are caught on the inner walls that define the cavity 41. In this manner, the terminal 30 is provided so as to resist being pulled out to the outside of the cavity 41.

[0062] After the terminals 30 are accommodated in each channel 42 of the wafer 40 as described above, the assembly of the stacked wire-mount wafer connector 20 is completed. Next, the stacked wire-mount wafer connector 20 is accommodated in the mating connector 10 to assemble the connector assembly 1. The stacked wire-mount wafer connector 20 can be mated with the mating connector 10 either alone or in a state where multiple stacked wire-mount wafer connectors 20 are stacked on top of each other.

[0063] When assembling a plurality of stacked wire-mount wafer connectors 20, for example, in the stacked wire-mount wafer connectors 20 in the state shown in Figures 6 and 7, the positions of the protrusions 47b are aligned with the positions of the openings 48b, and the protrusions 47b of one stacked wire-mount wafer connector 20 are inserted into the openings 48b of another stacked wire-mount wafer connector 20. This prevents the one stacked wire-mount wafer connector 20 and the other stacked wire-mount wafer connector 20 from slipping in the X-axis direction. In addition, the one stacked wire-mount wafer connector 20 and the other stacked wire-mount wafer connector 20 are firmly joined together along the Z-axis direction, and prevents slipping in the Y-axis direction.

[0064] 1, 2 and 3, for example, one or more stacked wire-mount wafer connectors 20 are fitted into the mating connector 10. As an example, a plurality of mating connectors 10 are fixed to the substrate B along the Z-axis direction in advance, and the stacked wire-mount wafer connectors 20 are inserted into and removed from each mating connector 10. The number of stacked wire-mount wafer connectors 20 fitted into one mating connector 10 can be changed as appropriate as long as it is equal to or less than the number of connectors that the mating connector 10 can accommodate (four in this embodiment).

[0065] When the stacked wire mount wafer connector 20 is lowered onto the mating connector 10 along the X-axis direction, the second end 44 of the wafer 40 and the bottom 18 of the mating connector 10 approach each other, and the contacts 11 enter the holes 44b of the second end 44, and the contacts 11 push apart the contact arm portions 38 of the terminals 30 to fit into the mating portions 32 of the terminals 30. In this state, the contacts 11 are held in place by the springiness of the pair of contact arms 38 that sandwich the contacts 11.

[0066] When the stacked wire-mount wafer connector 20 is lowered along the X-axis direction, the latch portion 25 of the stacked wire-mount wafer connector 20 located at the center side of the mating connector 10 in the Z-axis direction engages with the hole portion 10d. Specifically, when the stacked wire-mount wafer connector 20 is lowered, the tapered surface 28a and the top surface 28b move downward while sliding on the inner surface 10f of the mating connector 10, and the latch portion 25 (the pressing portion 29, the engaging portion 28, and the base portion 27) bends toward the second side portion 46. Thereafter, the tapered surface 28a and the top surface 28b are exposed from the hole portion 10d, and the latch portion 25 engages with the hole portion 10d. In addition, the stacked wire-mounted wafer connector 20 located at the end side in the Z-axis direction of the mating connector 10 does not engage with the mating connector 10, and the latch portion 25 (pressure portion 29, engagement portion 28 and base 27) bends toward the second side 46, and is sandwiched between the stacked wire-mounted wafer connector 20 at the center in the Z-axis direction and the inner wall of the mating connector 10.

[0067] As described above, the stacked wire mount wafer connector 20 is fitted to the mating connector 10 by engaging the latch portions 25 of one or more stacked wire mount wafer connectors 20 with the holes 10d of the mating connector 10. The height of the stacked wire mount wafer connector 20 fitted to the mating connector 10 is lower than the height of the mating connector 10 (e.g., upper ends 15a, 16a, and 17a), and the height of the entire connector assembly 1 is reduced, thereby achieving a compact design.

[0068] When pulling out the stacked wire mount wafer connector 20 from the mating connector 10, for example, the mating connector 10 to which the stacked wire mount wafer connector 20 to be pulled out is mated is searched for by hand from among the multiple mating connectors 10 fixed to the substrate B, and the target stacked wire mount wafer connector 20 is pulled out from the mating connector 10 found by hand. At this time, since the mating connector 10 according to this embodiment has the protruding portion 19 located below the latch portion 25 (hole portion 10d), the target stacked wire mount wafer connector 20 can be easily found by searching for the protruding portion 19 by hand. In other words, by recognizing the protruding portion 19 by hand, the position of the connector assembly 1 on the substrate B can be easily recognized, and the target stacked wire mount wafer connector 20 can be easily found.

[0069] After the target stacked wire-mount wafer connector 20 is found, the pressing portion 29 of the latch portion 25 of the target stacked wire-mount wafer connector 20 is pressed against the second side portion 46 to bend the base portion 27 to bring the stacked wire-mount wafer connector 20 into an unlatched state. That is, the stacked wire-mount wafer connector 20 transitions from a latched state in which the stacked wire-mount wafer connector 20 engages with the mating connector 10 to an unlatched state in which the stacked wire-mount wafer connector 20 is unlatched from the mating connector 10. When the stacked wire-mount wafer connector 20 transitions to the unlatched state, the latch portion 25 of the stacked wire-mount wafer connector 20 is not engaged with the hole portion 10d of the mating connector 10, so that the stacked wire-mount wafer connector 20 can be easily pulled out (pulled up) from the mating connector 10.

[0070] Next, the effects of the stacked wire-mounted wafer connector 20 and the connector assembly 1 according to the present embodiment will be described in detail. The stacked wire-mounted wafer connector 20 electrically connects the wires 50 and the mating connector 10 to each other and includes an electrically insulating wafer 40 that can be stacked. As shown in FIG. 5 and FIG. 7, the wafer 40 is formed by a first end 43 having a first end face 43a, a second end 44 having a second end face 44a, a first side portion 45 having a first side face 45a, and a second side portion 46 having a second side face 46a, and receives the wires 50 at the first end face 43a and fits with the mating connector 10 at the second end face 44a. The wafer 40 includes a latch portion 25 extending along the second side face 46a, a protrusion 47b protruding from the first base portion 47, and an opening 48b into which the protrusion 47b of another stacked wire-mounted wafer connector 20 is inserted. Since the protrusion 47b of one stacked wire-mounted wafer connector 20 is inserted into the opening 48b of another stacked wire-mounted wafer connector 20 to suppress sliding in the mating direction (X-axis direction), it is possible to stack multiple stacked wire-mounted wafer connectors 20 in a connected state.

[0071] Furthermore, each of the multiple stacked wire-mount wafer connectors 20 has a latch portion 25, and each latch portion 25 engages with the mating connector 10. Therefore, a separate part such as a cover for holding together the multiple stacked wire-mount wafer connectors 20 is not required, and the stacked wire-mount wafer connectors 20 can be inserted into and removed from the mating connector 10, either individually or in groups. This reduces the number of parts and improves the ease of insertion and removal from the mating connector 10.

[0072] Also, since the stacked wire-mount wafer connector 20 can be inserted and removed individually from the mating connector 10, the number of stacked wire-mount wafer connectors 20 can be easily adjusted according to the wiring density of the device. Furthermore, since a separate part such as a cover for holding together multiple stacked wire-mount wafer connectors 20 is not required, it is not necessary to secure a space for accommodating a separate part such as a cover in the mating connector 10. Therefore, the connector assembly 1 including the mating connector 10 and the stacked wire-mount wafer connector 20 can be made smaller.

[0073] By inserting the protrusion 47b of another stacked wire-mount wafer connector 20 into the opening 48b of the stacked wire-mount wafer connector 20, slippage in the mating direction (X-axis direction) is suppressed, and slippage in the lateral direction (Y-axis direction) intersecting both the mating direction and the thickness direction (Z-axis direction) may also be suppressed. In this case, when multiple stacked wire-mount wafer connectors 20 are stacked, slippage in three directions, the mating direction, the thickness direction, and the lateral direction, is suppressed. Therefore, the engagement between the multiple stacked wire-mount wafer connectors 20 can be strengthened.

[0074] The stacked wire mount wafer connector 20 is disposed within the cavity 41 and includes a plurality of terminals 30 spaced apart from one another, and as illustrated in Figures 3, 7 and 11, each of the plurality of terminals 30 may have a wire connection portion 31 disposed adjacent the first end face 43a and receiving and contacting the wire 50, a mating portion 32 disposed adjacent the second end face 44a and mating with a contact 11 extending from the mating connector 10, and a connection portion 33 connecting the wire connection portion 31 and the mating portion 32 to each other.

[0075] In this case, a plurality of terminals 30 are provided in a cavity 41 inside a wafer 40 of the stacked wire mount wafer connector 20, and each terminal 30 receives a wire 50 at a wire connection portion 31 arranged adjacent to a first end face 43a, and a contact 11 extending from the mating connector 10 is fitted into a fitting portion 32 arranged adjacent to a second end face 44a. Thus, the wire connection portion 31 and the fitting portion 32 are connected to each other via the connection portion 33, so that the wire 50 and the contact 11 can be electrically connected to each other via the terminal 30.

[0076] When the terminal 30 receives the wire 50, at least a portion of the mating portion 32 is located inside the cavity 41 and at least a portion of the wire connection portion 31 is located outside the wafer 40, and when the wire connection portion 31 receives the wire 50 and is in contact with the wire 50, the terminal 30 is inserted into the cavity 41 so that the engaging portion 34b of the terminal 30 engages with the engaged portion 48c of the wafer 40, and when the engaging portion 34b is engaged with the engaged portion 48c, the terminal 30 may be configured to resist being pulled out of the cavity 41.

[0077] In this case, when the terminal 30 receives the wire 50, at least a part of the wire connection portion 31 is exposed to the outside of the wafer 40, and in this state, the wire 50 is connected to the wire connection portion 31. Then, as shown in FIG. 7 and FIG. 10, when the terminal 30 is inserted into the cavity 41, the engaging portion 34b of the terminal 30 engages with the engaged portion 48c of the wafer 40, and in the state in which the engaging portion 34b engages with the engaged portion 48c, resistance is generated when a pulling force to the outside of the cavity 41 acts on the terminal 30. Therefore, in the state in which the terminal 30 is inserted into the cavity 41 with the wire 50 connected to the wire connection portion 31 of the terminal 30, even if a pulling force to the outside acts on the terminal 30, the terminal 30 can be prevented from coming off. As a result, the terminal 30 to which the wire 50 is connected can be prevented from being pulled out to the outside, and the connection of the terminal 30 and the wire 50 to the mating connector 10 can be made stronger.

[0078] 11, the terminal 30 has a base portion 34 and a pressure-contact portion 35 extending upward from the base portion 34, and the pressure-contact portion 35 may be electrically connected to the conductor portion 51 of the insulated wire 50 by penetrating the insulating layer 52 of the wire 50 and being physically and electrically connected to the conductor portion 51 of the wire 50. In this case, when the terminal 30 receives the wire 50, the pressure-contact portion 35 penetrates the insulating layer 52 of the wire 50, thereby making electrical contact between the terminal 30 and the conductor portion 51. Therefore, by pressing the insulated wire 50 into the pressure-contact portion 35 extending from the base portion 34, the pressure-contact portion 35 penetrates the insulating layer 52 and can make electrical contact, so that the wire 50 can be easily arranged in the stacked wire-mount wafer connector 20 by pressing the wire 50.

[0079] 3, the mating portion 32 of the terminal 30 may have a pair of flexible contact arms 38 that face each other, and when the mating portion 32 receives the contact 11 of the mating connector 10, the contact 11 may be accommodated between the pair of spread contact arms 38. In this case, the contact 11 extending from the mating connector 10 spreads the pair of contact arms 38 of the terminal 30 and is received between the pair of contact arms 38. Therefore, since the contact 11 extending from the mating connector 10 is received between the pair of flexible (springy) contact arms 38, the contact 11 can be held in the stacked wire mount wafer connector 20.

[0080] Each of the terminals 30 further includes a first support portion 36 and a second support portion 37. The first support portion 36 has a pair of first arm portions 36a that extend upward relative to the base portion 34 of the terminal 30 and face each other. The second support portion 37 has a pair of second arm portions 37a that extend upward relative to the base portion 34 of the terminal 30 and face each other. When the terminal 30 receives the wire 50 and the contact 11 of the mating connector 10, a part of the wire 50 may be located between the pair of first arm portions 36a of the first support portion 36 and a part of the contact 11 may be located between the pair of second arm portions 37a of the second support portion 37. In this case, a part of the wire 50 is located between the pair of first arm portions 36a of the terminal 30, and a part of the contact 11 extending from the mating connector 10 is located between the pair of second arm portions 37a. Therefore, both the wire 50 and the contact 11 can be connected to the terminal 30.

[0081] The cavity 41 is divided into a plurality of channels 42, and each of the plurality of channels 42 extends along the fitting direction (X-axis direction) of the wafer 40 and may receive each of the plurality of terminals 30 arranged at a distance from each other. In this case, each of the plurality of terminals 30 enters each of the plurality of channels 42 divided in the cavity 41 of the wafer 40. Therefore, a wire 50 can be disposed in each of the plurality of terminals 30 accommodated in one wafer 40.

[0082] 1, 2, and 3, the mating connector 10 may be a board-mount connector. In this case, each of the stacked wire-mount wafer connectors 20 can be easily inserted into and removed from the board-mount connector.

[0083] In the connector assembly 1, a mating connector 10, which is a first connector, has an open end 12 and defines a receiving area 13 for receiving a plurality of stacked wire mount wafer connectors 20, which are second connectors, and each of the stackable stacked wire mount wafer connectors 20 is mated with the mating connector 10. Each of the stacked wire mount wafer connectors 20 has a latch portion 25 that transitions between a latched state with respect to the mating connector 10 and a latched release state with respect to the mating connector 10. Thus, by providing each stacked wire mount wafer connector 20 with the latch portion 25, a separate part such as a cover for holding together the plurality of stacked wire mount wafer connectors 20 is not required, and the stacked wire mount wafer connectors 20 can be inserted into and removed from the mating connector 10, either individually or in a group. Thus, the connector assembly 1 can provide the same effects as the stacked wire mount wafer connector 20.

[0084] None of the stacked multiple stacked wire mount wafer connectors 20 need to be disengaged from the mating connector 10 unless the latch portions 25 of each of the stacked stacked wire mount wafer connectors 20 are in an unlatched state or all of the multiple stacked wire mount wafer connectors 20 are disengaged simultaneously.

[0085] In this case, the stacked wire-mount wafer connectors 20 are not disengaged from the mating connector 10 unless they are in an unlatched state or all of the stacked wire-mount wafer connectors 20 are disengaged simultaneously. This makes it possible to prevent the stacked wire-mount wafer connectors 20 from being unintentionally disengaged from the mating connector 10, and also makes it possible to strengthen the engagement of the stacked wire-mount wafer connectors 20 with the mating connector 10.

[0086] Of the multiple stacked wire mount wafer connectors 20 housed in the mating connector 10, the latch portions 25 of some of the stacked wire mount wafer connectors 20 may engage with the mating connector 10, while the latch portions 25 of the remaining stacked wire mount wafer connectors 20 may not engage with the mating connector 10. In this case, all of the stacked wire mount wafer connectors 20 can be mated and disengaged by engaging or disengaging some of the latch portions 25, so that the stacked wire mount wafer connectors 20 can be easily mated and disengaged with the mating connector 10 (transitioning to a latched state and an unlatched state).

[0087] Of the multiple stacked wire-mount wafer connectors 20 lined up in the Z-axis direction, the latch portion 25 of the stacked wire-mount wafer connector 20 located at the center in the Z-axis direction engages with the mating connector 10, while the latch portions 25 of the stacked wire-mount wafer connectors 20 located at both ends in the Z-axis direction do not have to engage with the mating connector 10. In this case, all of the stacked wire-mount wafer connectors 20 can be pulled out of the mating connector 10 by releasing the latch portion 25 located at the center in the Z-axis direction, so that the multiple stacked wire-mount wafer connectors 20 can be easily pulled out of the mating connector 10.

[0088] 1, when multiple mating connectors 10 are arranged, only the latch portion 25 of the stacked wire mount wafer connector 20 located at the center in the Z-axis direction may engage with the mating connector 10. In this case, the distance between the latch portions 25 arranged among the multiple mating connectors 10 can be increased, thereby reducing the possibility of accidentally pulling out the stacked wire mount wafer connector 20 of an adjacent mating connector 10.

[0089] The mating connector 10 may have a protrusion 19 located adjacent (for example, below) the latch portion 25. In this case, when the connector assembly 1 cannot be directly seen and the stacked wire mount wafer connector 20 to be removed is searched for by touch, the protrusion 19 can be used as a marker for the latch portion 25 of the stacked wire mount wafer connector 20 to be removed. Therefore, by touching the protrusion 19 of the target mating connector 10, the location of the latch portion 25 of the target stacked wire mount wafer connector 20 can be easily identified, making it even easier to remove the stacked wire mount wafer connector 20 from the mating connector 10.

[0090] Although the embodiments of the present disclosure have been described above, the present disclosure is not limited to the above-described embodiments. For example, the shape, size, number, material, and arrangement of each part of the stacked wire-mounted wafer connector and connector assembly according to the present disclosure are not limited to the above-described embodiments and can be changed as appropriate. For example, the shape, size, number, material, and arrangement of each of the mating connector 10, stacked wire-mounted wafer connector 20, terminal 30, wafer 40, and wire 50 are not limited to the above-described embodiments and can be changed as appropriate.

[0091] For example, in the above embodiment, an example has been described in which the latch portions 25 of two of the four stacked wire-mount wafer connectors 20 engage with the holes 10d of the mating connector 10. However, the number of latch portions that engage with the holes 10d of the mating connector 10 is not limited to two, and may be one, three or more. Furthermore, the number of stacked wire-mount wafer connectors accommodated in one mating connector is not limited to four, and may be two, three, five or more.

[0092] In the above embodiment, an example has been described in which the mating connector 10 of the connector assembly 1 is a board mount connector. However, the mating connector (first connector) according to the present disclosure may be a connector other than a board mount connector, for example, a relay connector that connects one electrical connector to another electrical connector. [Explanation of symbols]

[0093] 1...connector assembly, 10...mating connector (first connector), 11...contact, 12...open end, 13...receiving area, 14, 45...first side, 15, 46...second side, 20...stacked wire mount wafer connector (second connector), 25...latch portion, 28, 34b...engagement portion, 30...terminal, 31...wire connection portion, 32...mating portion, 33...connection portion, 34...base portion, 35...insulation contact portion, 36...first support portion, 36a...first a arm portion, 37...second support portion, 37a...second arm portion, 38...contact arm portion, 40...wafer, 41...cavity, 42...channel, 43...first end, 43a...first end face, 44...second end, 44a...second end face, 45...first side, 45a...first side surface, 46...second side, 46a...second side surface, 47...first base, 47b...protrusion, 48...second base, 48b...opening, 48c...engaged portion, 50...wire, 51...conductor portion, 52...insulating layer.

Claims

1. 1. A stacked wire mount wafer connector having stackable, electrically insulating wafers for electrically connecting a plurality of wires to a mating connector, comprising: a first base and a second base extending between opposing first and second sides and between opposing first and second ends, the first base and the second base defining a cavity therebetween; a first end surface at the first end for receiving a plurality of wires; a second end surface provided at the second end and adapted to mate with the mating connector; A first side surface provided on the first side portion; A second side surface provided on the second side portion; a latch portion integrally formed on the wafer, extending along the second side of the wafer and engageable with the mating connector; at least one protrusion extending outward from the first base of the wafer along a thickness direction (Z-axis) of the wafer; At least one opening into which the protrusion of another stacked wire mount wafer connector is inserted; Equipped with By inserting the protrusion of another stacked wire mount wafer connector into the opening of the stacked wire mount wafer connector, slippage of the mating connector between the stacked wire mount wafer connector and the other stacked wire mount wafer connector in a mating direction (X-axis) and in a lateral direction (Y-axis) that intersects both the mating direction (X-axis) and the thickness direction (Z-axis) is suppressed. Stacked wire mount wafer connector.

2. The second side surface has a protruding portion protruding in the lateral direction (Y axis) from the second end surface side, and the at least one protrusion protrudes from the protruding portion in the thickness direction (Z axis).

2. The stacked wire mount wafer connector according to claim 1.

3. the at least one opening has a rectangular shape having a long side in the mating direction and a short side in the horizontal direction, and a set of two projections of another stacked wire mount wafer connector is inserted into the rectangular opening of the stacked wire mount wafer connector; 2. The stacked wire mount wafer connector according to claim 1.

4. The second base portion has a recess that is recessed in the thickness direction (Z axis) at the first side portion and extends into a portion of the first side surface.

2. The stacked wire mount wafer connector according to claim 1.

5. a plurality of terminals disposed within the cavity and spaced apart from one another; Each of the plurality of terminals is a wire connection portion disposed adjacent to the first end surface and adapted to receive the wire and make contact with the wire; a mating portion disposed adjacent to the second end surface and into which a contact extending from the mating connector is mated; a connection portion that connects the wire connection portion and the fitting portion to each other; having 2. The stacked wire mount wafer connector according to claim 1.

6. when the terminal receives the wire, at least a portion of the mating portion is located inside the cavity and at least a portion of the wire connection portion is located outside the wafer; the terminal is inserted into the cavity such that an engaging portion of the terminal engages with an engaged portion of the wafer in a state in which the wire connecting portion receives the wire and contacts the wire; The terminal is provided so as to resist being pulled out of the cavity when the engaging portion is engaged with the engaged portion.

6. The stacked wire mount wafer connector according to claim 5.

7. The terminal has a base portion and a pressure-contact portion extending upward from the base portion, the insulation displacement portion makes electrical contact with the insulated conductor portion of the wire by penetrating an insulation layer of the wire and physically and electrically connecting to the conductor portion of the wire; 6. The stacked wire mount wafer connector according to claim 5.

8. The fitting portion of the terminal has a pair of flexible contact arms facing each other, When the mating portion receives the contact of the mating connector, the contact is received between the pair of contact arm portions that are spread apart.

6. The stacked wire mount wafer connector according to claim 5.

9. Each of the plurality of terminals further includes a first support portion and a second support portion, the first support portion has a pair of first arm portions that extend upward relative to a base portion of the terminal and face each other; the second support portion has a pair of second arm portions that extend upward relative to a base portion of the terminal and face each other, when the terminal receives the wire and the contact of the mating connector, a portion of the wire is located between the pair of first arms of the first support portion, and a portion of the contact is located between the pair of second arms of the second support portion; 6. The stacked wire mount wafer connector according to claim 5.

10. The cavity is partitioned into a plurality of channels; Each of the plurality of channels extends along the mating direction of the wafer and receives each of the plurality of terminals arranged at a distance from each other.

6. The stacked wire mount wafer connector according to claim 5.

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