Edge finder for wafer

Abstract

The utility model relates to an edge finder for wafers, each wafer is provided with a flat edge part and a curved edge part, the edge finder is used for adjusting the direction of a plurality of wafers, and comprises a carrying table, a positioning seat, a calibration rod and a driving piece, the positioning seat is fixed on the carrying table and is provided with a positioning edge parallel to the flat edge part, and the positioning edge is fixed on the carrying table and is provided with a curved edge part. The plurality of wafers are supported on the positioning seat; the calibration rod is arranged in the positioning seat and is rotatably mounted on the carrying table, and friction exists between the calibration rod and the wafer; the driving piece is in transmission connection with the calibration rod so as to drive the calibration rod to drive the wafer to rotate until the flat edge part of the wafer is in contact with the positioning edge; and the calibration rod rotates to drive the curved edge part to rotate until the flat edge part is in contact with the positioning seat and is parallel to the positioning seat. The edge finder solves the problem that the time consumed for adjusting the directions of a plurality of wafers is long.

Description

Technical Field

[0001] The present disclosure relates to the technical field of semiconductor wafer production and processing, and in particular, to an edge finder for a wafer. Background Art

[0002] In the production process of semiconductor devices, chips (such as LED chips) need to be sorted. However, the on-site sorting machine can only measure and sort chips with the same direction. Since the flat edge directions of the chips placed in the chip box are not consistent, if the direction of the chips is adjusted by employees alone, due to the large number of chips and the inconvenience of operation during the adjustment process, the process of adjusting the direction of each chip is time-consuming, affecting production efficiency. Utility Model Content

[0003] The purpose of the present disclosure is to provide an edge finder which solves the problem of time-consuming adjustment of directions of multiple wafers.

[0004] In order to achieve the above-mentioned purpose, the present disclosure provides an edge finder for a chip, wherein the chip has a flat edge portion and a curved edge portion, and the edge finder is used to adjust the directions of multiple chips, and includes: a carrier; a positioning seat, wherein the positioning seat is fixed to the carrier, and the positioning seat has a positioning edge parallel to the flat edge portion, and multiple chips are supported on the positioning seat; a calibration rod, wherein the calibration rod is arranged in the positioning seat and rotatably mounted on the carrier, and there is friction between the calibration rod and the chips; and a driving member, wherein the driving member is transmission-connected to the calibration rod to drive the calibration rod to drive the chip to rotate until the flat edge portion of the chip contacts the positioning edge; the rotation of the calibration rod drives the curved edge portion to rotate until the flat edge portion contacts and is parallel to the positioning seat.

[0005] Optionally, the driving member includes a rotating shaft and a handpiece, the calibration rod is provided with a connecting blind hole, the rotating shaft is fixedly installed in the connecting blind hole, and the handpiece is fixedly connected to the rotating shaft.

[0006] Optionally, the hand piece includes a connecting rod and a handle, one end of the connecting rod is fixedly connected to the rotating shaft, and the other end is connected to the handle.

[0007] Optionally, the carrier includes a first baffle and a second baffle, and the positioning seat is fixedly connected between the first baffle and the second baffle.

[0008] Optionally, the carrier further includes two limit members disposed between the first baffle plate and the second baffle plate, and the two limit members are respectively in contact with the wafer.

[0009] Optionally, the limiting member includes a connecting rod and a flexible roller, the two ends of the connecting rod are respectively connected to the first baffle plate and the second baffle plate, the flexible roller is rotatably sleeved on the connecting rod, and the flexible roller is used for rolling contact with the wafer.

[0010] Optionally, the distance between the two limiting members matches the diameter of the wafer.

[0011] Optionally, the positioning seat is provided with a mounting groove, and the notch of the mounting groove faces upward, so that the calibration rod can be arranged in the mounting groove.

[0012] Optionally, the positioning seat includes a first plate body, a second plate body and a third plate body, the second plate body and the third plate body are connected to the first plate body and extend toward the same side of the first plate body to form the mounting groove, and the second plate body is flush with the end of the third plate body to form the positioning edge.

[0013] Optionally, the calibration rod does not extend beyond the positioning edge.

[0014] Through the above technical solution, when the edge finder for wafers provided by the present disclosure is used, multiple wafers are placed on the carrier and arranged on the positioning seat, so that the multiple wafers are supported by the positioning seat, and the calibration rod is driven to rotate by the driving member. Since the calibration rod arranged in the positioning seat contacts multiple wafers at the same time, and there is friction between the calibration rod and the wafer, the rotation of the calibration rod can drive the curved edge of the wafer to rotate until the flat edge of the wafer rotates to contact and be parallel to the positioning edge on the positioning seat. At this time, since the flat edge is in contact with the positioning edge, the rotation of the calibration rod cannot continue to drive the flat edge to rotate relative to the positioning seat, thereby achieving the adjustment of the direction of a single wafer. Then continue to drive the calibration rod to rotate through the driving member to drive the wafers that have not completed the direction adjustment to rotate, until the flat edges of all wafers can be parallel to and contact the positioning edge, thereby achieving the adjustment of the directions of all wafers on the carrier. The edge finder provided by the present disclosure can conveniently adjust the directions of multiple wafers, thereby solving the problem of time-consuming adjustment of the directions of multiple wafers.

[0015] Other features and advantages of the present disclosure will be described in detail in the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The accompanying drawings are used to provide a further understanding of the present disclosure and constitute a part of the specification. Together with the following specific embodiments, they are used to explain the present disclosure but do not constitute a limitation of the present disclosure. In the accompanying drawings:

[0017] Figure 1 is a schematic diagram of the structure of an edge finder for a wafer provided in an embodiment of the present disclosure;

[0018] Figure 2is a cross-sectional view of an edge finder for a wafer provided by an embodiment of the present disclosure;

[0019] Figure 3 is a partial cross-sectional view of an edge finder for a wafer provided by an embodiment of the present disclosure;

[0020] Figure 4 It is a schematic diagram of the chip structure provided by an embodiment of the present disclosure.

[0021] Description of Reference Numerals

[0022] 1-carrier; 11-first baffle; 12-second baffle; 2-positioning seat; 21-positioning edge; 22-first plate; 23-second plate; 24-third plate; 25-installation slot; 3-calibration rod; 31-connecting blind hole; 4-driving member; 41-rotating shaft; 42-hand piece; 421-connecting rod; 422-handle; 5-limiting member; 51-connecting rod; 52-flexible roller; 10-wafer; 101-flat edge; 102-curved edge. DETAILED DESCRIPTION

[0023] The specific implementation of the present disclosure is described in detail below in conjunction with the accompanying drawings. It should be understood that the specific implementation described herein is only used to illustrate and explain the present disclosure, and is not used to limit the present disclosure.

[0024] In the present disclosure, unless otherwise stated, the directional words "upper" and "lower" used generally refer to the "upper" and "lower" relative to each other in the direction of gravity when the corresponding components are in use. In addition, the use of words such as "first" and "second" is intended to distinguish different components and does not have order and importance. In addition, when referring to the drawings in the following description, the same symbols in different drawings represent the same elements. It should be understood by those skilled in the art that the above definitions are only used to explain and illustrate the present disclosure and should not be construed as limitations on the present disclosure.

[0025] According to the specific implementation of the present disclosure, Figures 1 to 4 As shown, an edge finder for a wafer is provided, wherein the wafer 10 has a flat edge portion 101 and a curved edge portion 102, and the edge finder is used to adjust the direction of a plurality of wafers 10, and comprises a stage 1, a positioning seat 2, a calibration rod 3 and a driving member 4, wherein the positioning seat 2 is fixed to the stage 1, and the positioning seat 2 has a positioning edge 21 parallel to the flat edge portion 101, and a plurality of wafers 10 are supported on the positioning seat 2; the calibration rod 3 is arranged in the positioning seat 2 and rotatably mounted on the stage 1, and there is friction between the calibration rod 3 and the wafer 10; the driving member 4 is transmission-connected to the calibration rod 3, so as to drive the calibration rod 3 to drive the wafer 10 to rotate until the flat edge portion 101 of the wafer 10 contacts the positioning edge 21. The rotation of the calibration rod 3 drives the curved edge portion 102 to rotate until the flat edge portion 101 contacts and is parallel to the positioning seat 2.

[0026] Through the above technical solution, when the edge finder for a wafer provided by the present disclosure is used, multiple wafers 10 are placed on the stage 1 and arranged on the positioning seat 2, so that the multiple wafers 10 are supported by the positioning seat 2, and the calibration rod 3 is driven to rotate by the driving member 4. Since the calibration rod 3 arranged in the positioning seat 2 is in contact with multiple wafers 10 at the same time, and there is friction between the calibration rod 3 and the wafer 10, the rotation of the calibration rod 3 can drive the curved edge 102 of the wafer 10 to rotate until the flat edge 101 of the wafer 10 rotates to contact and be parallel to the positioning edge 21 on the positioning seat 2. At this time, since the flat edge 101 is in contact with the positioning edge 21, the rotation of the calibration rod 3 cannot continue to drive the flat edge 101 to rotate relative to the positioning seat 2, thereby achieving the adjustment of the direction of a single wafer 10. Then continue to drive the calibration rod 3 to rotate through the driving member 4 to drive the wafer 10 that has not completed the direction adjustment to rotate, until the flat edge 101 of all wafers 10 can be parallel to and contact the positioning edge 21, thereby achieving the adjustment of the direction of all wafers 10 on the stage 1. The edge finder provided by the present disclosure can conveniently adjust the directions of multiple chips, thereby solving the problem of time-consuming direction adjustment of multiple chips 10.

[0027] In some embodiments of the present disclosure, the driving member 4 can be constructed in any suitable manner. For example, the driving member 4 can be constructed as a motor. In this case, the calibration rod 3 and the output shaft of the motor can be connected by a transmission structure such as a coupling, so that the calibration rod 3 is driven to rotate by the output shaft of the motor.

[0028] In some other embodiments of the present disclosure, reference Figure 1 and Figure 2 As shown, the driving member 4 may include a rotating shaft 41 and a hand piece 42, the calibration rod 3 is provided with a connecting blind hole 31, the rotating shaft 41 is fixedly installed in the connecting blind hole 31, and the hand piece 42 is fixedly connected to the rotating shaft 41. In this way, the rotating shaft 41 can be driven to rotate by rotating the hand piece 42, and since the rotating shaft 41 is fixedly connected to the calibration rod 3 through the connecting blind hole 31, the calibration rod 3 can be driven to rotate by rotating the hand piece 42, thereby realizing manual operation of the rotation of the calibration rod 3.

[0029] Among them, reference Figure 1 and Figure 2 As shown, the handpiece 42 includes a connecting rod 421 and a handle 422, one end of the connecting rod 421 is fixedly connected to the rotating shaft 41, and the other end is connected to the handle 422. In this way, the connecting rod 421 can be driven to rotate around the central axis of the rotating shaft 41 by operating the handle 422, so that the rotating shaft 41 can be driven to rotate by rotating the handle 422. In some embodiments of the present disclosure, the extension direction of the central axis of the handle 422 is parallel to the extension direction of the rotating shaft 41, so that a force is applied to the handle 422 to drive the connecting rod 421 and the rotating shaft 41 to rotate.

[0030] In some embodiments of the present disclosure, reference Figures 1 to 3 As shown, the stage 1 may include a first baffle 11 and a second baffle 12, and the positioning seat 2 is fixedly connected between the first baffle 11 and the second baffle 12. In this way, when multiple wafers 10 are supported on the positioning seat 2, they can be placed between the first baffle 11 and the second baffle 12 at the same time, and the multiple wafers 10 can be clamped by the first baffle 11 and the second baffle 12, thereby limiting the movement of the wafers 10 in the extension direction of the positioning seat 2, ensuring that the wafers 10 can be stably supported on the positioning seat 2 during the adjustment process.

[0031] In some embodiments of the present disclosure, reference Figures 1 to 3 As shown, the stage 1 may further include two stoppers 5 disposed between the first baffle 11 and the second baffle 12, and the two stoppers 5 are respectively in contact with the wafer 10. In this way, the two stoppers 5 can respectively contact different sides of the wafer 10 to prevent the wafer 10 from shifting during the rotation process relative to the positioning seat 2, and prevent the wafer 10 from falling from the positioning seat 2.

[0032] Among them, reference Figure 1 As shown, the stopper 5 may include a connecting rod 51 and a flexible roller 52. The two ends of the connecting rod 51 are respectively connected to the first baffle 11 and the second baffle 12. The flexible roller 52 is rotatably sleeved on the connecting rod 51, and the flexible roller 52 is used to roll in contact with the wafer 10. In this way, the flexible roller 52 that can rotate relative to the connecting rod 51 is sleeved on the connecting rod 51, and the flexible roller 52 abuts against the wafer 10, so that the rotation of the wafer 10 can synchronously drive the flexible roller 52 to rotate relative to the connecting rod 51. Since the flexible roller 52 is flexible, the wafer 10 will not rub against the flexible roller 52 when rotating, thereby preventing damage to the wafer 10. In this embodiment, the flexible roller 52 can be made of flexible materials such as sponge and rubber, and the present disclosure does not make specific restrictions on this.

[0033] In some embodiments of the present disclosure, reference Figure 1 and Figure 3 As shown, the distance between the two stoppers 5 matches the diameter of the wafer 10. In this way, the two stoppers 5 can be respectively arranged on both sides of the wafer 10 in the diameter direction, so that the wafer 10 can be placed on the positioning seat 2 from above the carrier 1 and placed between the two stoppers 5, so that the wafer 10 can be limited while being placed, which is convenient for taking and positioning the wafer 10.

[0034] In other embodiments of the present disclosure, the stopper 5 can be detachably connected to the first baffle 11 and the second baffle 12, so that the stopper 5 can be connected to different positions of the first baffle 11 and the second baffle 12, and the distance between the two stoppers 5 can be adjusted to adapt to wafers 10 of different sizes, thereby improving the compatibility of the edge finder. Among them, a plurality of mounting holes can be correspondingly provided on the first baffle 11 and the second baffle 12 to connect the stopper 5, or the detachable connection of the stopper 5 can be achieved by other means, and the present disclosure does not make specific restrictions on this.

[0035] In some embodiments of the present disclosure, reference Figure 3 As shown, the positioning seat 2 may be provided with a mounting groove 25, the notch of the mounting groove 25 facing upward, so that the calibration rod 3 can be arranged in the mounting groove 25. In this way, the calibration rod 3 can be placed in the mounting groove 25 from the notch, which facilitates the installation of the calibration rod 3. When the wafer 10 is placed on the positioning seat 2, the wafer 10 is placed on the notch, and the calibration rod 3 in the mounting groove 25 can contact the wafer 10 through the notch, so that rotating the calibration rod 3 can drive the wafer 10 to rotate.

[0036] In some embodiments of the present disclosure, reference Figure 3 As shown, the positioning seat 2 may include a first plate body 22, a second plate body 23 and a third plate body 24, the second plate body 23 and the third plate body 24 are connected to the first plate body 22 and extend toward the same side of the first plate body 22 to form a mounting groove 25, and the ends of the second plate body 23 and the third plate body 24 are flush to form a positioning edge 21. In this way, the calibration rod 3 placed in the installation groove 25 can be placed between the second plate 23 and the third plate 24. When the chip 10 is driven to rotate by the calibration rod 3 until the flat edge 101 contacts the positioning seat 2, the ends of the second plate 23 and the third plate 24 facing away from the first plate 22 can serve as the positioning edges 21 to be parallel to and contact the flat edge 101 of the chip 10, thereby limiting the rotation of the chip 10 through the fit between the ends of the second plate 23 and the third plate 24 and the flat edge 101, thereby maintaining the posture of the chip 10. When the flat edges 101 of all the chips 10 on the positioning seat 2 are parallel to and fit with the positioning edges 21, the direction adjustment of multiple chips 10 is completed.

[0037] In some embodiments of the present disclosure, reference Figures 2 to 4 As shown, the calibration rod 3 does not exceed the positioning edge 21. In this way, the calibration rod 3 can contact the curved edge 102 of the wafer 10, and the wafer 10 is driven to rotate by the rotation of the calibration rod 3, so that the flat edge 101 of the wafer 10 is parallel to the positioning edge 21. When the flat edge 101 contacts and fits with the positioning edge 21, due to the friction between the flat edge 101 and the positioning edge 21, the positioning edge 21 can limit the rotation of the wafer 10.

[0038] It should be explained here that “calibration rod 3 does not exceed positioning edge 21” means that calibration rod 3 is accommodated in mounting groove 25 formed by positioning seat 2, and calibration rod 3 does not protrude beyond the notch of mounting groove 25. Among them, calibration rod 3 can be lower than positioning edge 21, or flush with positioning edge 21, as long as the rotation of calibration rod 3 can drive wafer 10 to rotate, and the present disclosure does not impose any specific restrictions on this.

[0039] Below, reference Figures 1 to 4 As shown, the present disclosure will combine the above specific implementation methods to introduce in detail the specific use process of the edge finder for the wafer. When it is necessary to adjust the directions of multiple wafers 10 at the same time, the multiple wafers 10 are placed on the carrier 1 and arranged on the positioning seat 2. The positioning seat 2 supports the multiple wafers 10, and the first baffle 11 and the second baffle 12 limit the movement of the multiple wafers 10 in the extension direction of the positioning seat 2. Then, the handle 422 is held and rotated to drive the connecting rod 421 to rotate around the central axis of the rotating shaft 41, thereby driving the rotating shaft 41 and the calibration rod 3 connected to the rotating shaft 41 to rotate. Since there is friction between the calibration rod 3 and the curved edge 102 of the chip 10, the rotation of the calibration rod 3 can drive the chip 10 to rotate. At the same time, the chip 10 is limited to be offset during the rotation by the limit member 5, and the flexible roller 52 abuts against the chip. In this way, the rotation of the chip 10 can drive the flexible roller 52 to rotate relative to the connecting rod 51 to prevent the chip 10 from being worn due to the friction between the chip 10 and the limit member 5, until the flat edge 101 rotates to be parallel to and fits with the positioning edge 21. In this way, the positioning edge 21 can limit the chip 10 from continuing to rotate. When all the chips 10 arranged on the positioning seat 2 are parallel to and fit with the positioning edge 21, the positioning of the directions of multiple chips 10 is completed.

[0040] The preferred embodiments of the present disclosure are described in detail above in conjunction with the accompanying drawings; however, the present disclosure is not limited to the specific details in the above embodiments. Within the technical concept of the present disclosure, a variety of simple modifications can be made to the technical solution of the present disclosure, and these simple modifications all fall within the protection scope of the present disclosure.

[0041] It should also be noted that the various specific technical features described in the above specific embodiments can be combined in any suitable manner without contradiction. In order to avoid unnecessary repetition, the present disclosure will not further describe various possible combinations.

[0042] In addition, various embodiments of the present disclosure may be arbitrarily combined, and as long as they do not violate the concept of the present disclosure, they should also be regarded as the contents disclosed by the present disclosure.

Claims

1. An edge finder for a wafer, the wafer having a flat edge portion and a curved edge portion, characterized in that: The edge finder is used to adjust the directions of the plurality of wafers, and comprises: Carrier; A positioning seat, the positioning seat is fixed to the carrier, and the positioning seat has a positioning edge parallel to the flat edge portion, and a plurality of the wafers are supported on the positioning seat; a calibration rod, the calibration rod being arranged in the positioning seat and rotatably mounted on the carrier, and having friction between the calibration rod and the wafer; and A driving member, the driving member is drivingly connected to the calibration rod to drive the calibration rod to drive the wafer to rotate until the flat edge of the wafer contacts the positioning edge; The rotation of the calibration rod drives the curved edge portion to rotate until the flat edge portion contacts and is parallel to the positioning seat.

2. The edge finder for a wafer according to claim 1, characterized in that: The driving member comprises a rotating shaft and a hand piece, the calibration rod is provided with a connecting blind hole, the rotating shaft is fixedly installed in the connecting blind hole, and the hand piece is fixedly connected to the rotating shaft.

3. The edge finder for a wafer according to claim 2, characterized in that: The hand piece comprises a connecting rod and a handle, one end of the connecting rod is fixedly connected to the rotating shaft, and the other end is connected to the handle.

4. The edge finder for a wafer according to any one of claims 1 to 3, characterized in that: The carrier includes a first baffle and a second baffle, and the positioning seat is fixedly connected between the first baffle and the second baffle.

5. The edge finder for a wafer according to claim 4, characterized in that: The carrier also includes two limit members arranged between the first baffle plate and the second baffle plate, and the two limit members are respectively in contact with the wafer.

6. The edge finder for a wafer according to claim 5, characterized in that: The limiting member includes a connecting rod and a flexible roller, wherein two ends of the connecting rod are respectively connected to the first baffle plate and the second baffle plate, and the flexible roller is rotatably sleeved on the connecting rod, and the flexible roller is used for rolling contact with the wafer.

7. The edge finder for a wafer according to claim 5, characterized in that: The distance between the two limiting members matches the diameter of the wafer.

8. The edge finder for a wafer according to claim 1, characterized in that: The positioning seat is provided with a mounting groove, and the notch of the mounting groove faces upwards so that the calibration rod can be arranged in the mounting groove.

9. The edge finder for a wafer according to claim 8, characterized in that: The positioning seat includes a first plate body, a second plate body and a third plate body, the second plate body and the third plate body are connected to the first plate body and extend toward the same side of the first plate body to form the installation groove, and the second plate body is flush with the end of the third plate body to form the positioning edge.

10. The edge finder for a wafer according to claim 9, characterized in that: The calibration rod does not extend beyond the positioning edge.

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