Touch sensor and touch panel

Abstract

To provide a touch sensor which can suppress deterioration in the conductivity of the peripheral wiring, and the occurrence of migration between the peripheral wires, and a touch panel having the touch sensor.SOLUTION: A touch sensor comprises a board, and a conductive layer formed on a surface of the board. The conductive layer has a touch detection electrode which is composed of a plurality of fine metal wires arranged in a mesh shape, an electrode connection terminal electrically connected to the touch detection electrode, and peripheral wiring electrically connected to the electrode connection terminal. The peripheral wiring has a layer to be plated, and a metal plating layer covering the layer to be plated. The surface of the board has a water contact angle of 20-50°.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a touch sensor and a touch panel that detect a touch operation. [Background technology]

[0002] Conventionally, in various electronic devices including portable information devices such as tablet computers and smartphones, touch sensors are used to detect a so-called touch operation in which a finger, a stylus pen, or the like is brought into contact with or close to a screen. Such a touch sensor usually has a touch detection electrode formed on the surface of a substrate and detecting the touch operation, an external connection terminal formed on the surface of the substrate and used to electrically connect the touch sensor to an external device, and peripheral wiring that electrically connects the touch detection electrode and the external connection terminal.

[0003] For example, Patent Document 1 discloses a method for producing a conductive substrate having a layer to be plated and a plating layer by using a laminate having, in this order, a substrate, an underlayer, and a precursor layer to be plated arranged in contact with the underlayer. Patent Document 1 also describes that when the conductive substrate is applied to a touch panel sensor, the plating layer functions as a detection electrode or an extraction wiring. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2023-066192 A Summary of the Invention [Problem to be solved by the invention]

[0005] In recent years, attempts have been made to narrow the area of ​​a touch sensor that is outside the area where the detection electrode is arranged, that is, to narrow the frame of the touch sensor. The present inventors have studied narrowing the frame of a touch sensor with reference to the technology disclosed in Patent Document 1, and have found that in a touch sensor with a narrow frame, the conductivity of the peripheral wiring may decrease, such as an increase in resistivity, or migration between the peripheral wiring may be more likely to occur.

[0006] In view of the above circumstances, an object of the present invention is to provide a touch sensor capable of suppressing a decrease in conductivity in peripheral wiring and the occurrence of migration between peripheral wirings. Another object of the present invention is to provide a touch panel having the above touch sensor. [Means for solving the problem]

[0007] The present inventors have conducted extensive research to solve the above problems, and have completed the present invention. That is, they have found that the above problems can be solved by the following configuration.

[0008] [1] A touch sensor comprising: a substrate; and a conductive layer formed on a surface of the substrate, the conductive layer having a touch sensing electrode constituted by a plurality of thin metal wires arranged in a mesh pattern, an electrode connection terminal electrically connected to the touch sensing electrode, and peripheral wiring electrically connected to the electrode connection terminal, the peripheral wiring having a plated layer and a metal plating layer covering the plated layer, and a water contact angle of the surface of the substrate is 20 to 50°. [2] The touch sensor according to [1], wherein the substrate contains a surfactant. [3] The touch sensor according to [2], wherein the surfactant is a nonionic surfactant. [4] The touch sensor according to [3], wherein the surface of the substrate has a water contact angle of 20 to 40°. [5] The touch sensor described in [1], wherein there are multiple peripheral wirings, and in at least a portion of the area on the surface of the substrate in which the peripheral wirings are arranged, the peripheral wirings extend in a first direction and are arranged in a second direction perpendicular to the first direction, and the distance S between two adjacent peripheral wirings is 30 μm or less. [6] The touch sensor described in [5], wherein there are multiple peripheral wirings, and in at least a portion of the area on the surface of the substrate in which the peripheral wirings are arranged, the peripheral wirings extend in a first direction and are arranged in a second direction perpendicular to the first direction, and the distance S between two adjacent peripheral wirings is 15 μm or less. [7] A touch panel having the touch sensor according to any one of [1] to [6]. Effect of the Invention

[0009] According to the present invention, a touch sensor capable of suppressing a decrease in conductivity in peripheral wiring and the occurrence of migration between peripheral wirings can be provided. Also, according to the present invention, a touch panel having the above touch sensor can be provided. [Brief description of the drawings]

[0010] [Figure 1] 1 is a plan view showing an example of a configuration of a touch sensor according to the present invention. [Diagram 2] 4 is an enlarged plan view showing an example of a configuration of peripheral wiring of the touch sensor according to the present invention; FIG. [Diagram 3] 4 is an enlarged plan view showing an example of a configuration of a touch sensing electrode included in the touch sensor according to the present invention. FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] Hereinafter, a touch sensor and a touch panel of the present invention will be described in detail with reference to the drawings. The following description of the components is based on a representative embodiment of the present invention, and the present invention is not limited to such an embodiment. Also, the drawings shown below are illustrative for explaining the present invention, and the present invention is not limited by the drawings shown below. In this specification, a numerical range expressed using "to" means a range that includes the numerical values ​​before and after "to" as the lower and upper limits. In this specification, when two or more types of a component are present, the "content" of the component means the total content of those two or more components. Unless otherwise specified, angles expressed by specific numerical values ​​and angle-related expressions such as "parallel," "perpendicular," and "orthogonal" are intended to include an error range generally accepted in the technical field.

[0012] The term "polymer" or "polymer" refers to a compound having a weight average molecular weight of 2000 or more. Here, the weight average molecular weight is defined as a polystyrene equivalent value measured using gel permeation chromatography (GPC) under the following conditions. Equipment: Tosoh Corporation HLC-8320GPC Column: Tosoh Corporation TSK-GEL G3000PWXL Column temperature: 35℃ ·Flow rate: 0.5mL / min Calibration curve: Poly sodium acetate standard manufactured by Sowa Science Co., Ltd. Eluent: A mixture of sodium dihydrogen phosphate dodecahydrate / disodium hydrogen phosphate dihydrate (34.5g / 46.2g) diluted to 5000g with pure water.

[0013] The term "principal surface" refers to the surface having the largest area in a film-, sheet- or plate-like member. "Transparent" means that the light transmittance in the visible light wavelength region of 400 to 800 nm is 40% or more, preferably 60% or more, more preferably 80% or more, and even more preferably 90% or more. The light transmittance is measured using a known transmittance measuring device according to "Plastics - Determination of total light transmittance and total light reflectance" as specified in JIS K 7375:2008.

[0014] [Touch sensor] The touch sensor of the present invention includes a substrate and a conductive layer formed on a surface of the substrate. The conductive layer includes a touch detection electrode formed of a plurality of thin metal wires arranged in a mesh pattern, an electrode connection terminal electrically connected to the touch detection electrode, and a peripheral wiring electrically connected to the electrode connection terminal, and the peripheral wiring includes a layer to be plated and a metal plating layer covering the layer to be plated. The surface of the substrate included in the touch sensor of the present invention has a water contact angle of 20 to 50°. Hereinafter, the touch sensor of the present invention will be described in detail with reference to the drawings.

[0015] FIG. 1 is a plan view showing an example of the configuration of a touch sensor according to the present invention. The touch sensor 10 includes a substrate 1, a first conductive layer 2 formed on one surface 1A of the substrate 1, and a second conductive layer 3 formed on the other surface 1B of the substrate 1. The first conductive layer 2 has a plurality of touch sensing electrodes 11 extending along a Y direction (first direction) and arranged along an X direction (second direction) perpendicular to the Y direction, a plurality of electrode connection terminals 12 formed at one end of each of the touch sensing electrodes 11, a plurality of peripheral wirings 13 electrically connected to each of the plurality of electrode connection terminals 12, and a plurality of external connection terminals 14 electrically connected to each of the plurality of peripheral wirings 13. The plurality of external connection terminals 14 are used for electrical connection to an external device (not shown). Each of the multiple peripheral wirings 13 has one end connected to a corresponding electrode connection terminal 12 and the other end connected to an external connection terminal 14 .

[0016] The second conductive layer 3 has a plurality of touch sensing electrodes 21 extending along the X direction (first direction) and arranged along the Y direction (second direction), a plurality of electrode connection terminals 22 electrically connected to one ends of the plurality of touch sensing electrodes 21, a plurality of peripheral wirings 23 electrically connected to the plurality of electrode connection terminals 22, and a plurality of external connection terminals 24 electrically connected to the plurality of peripheral wirings 23. The plurality of external connection terminals 24 are used for electrically connecting to an external device (not shown). Each of the multiple peripheral wirings 23 has one end connected to a corresponding electrode connection terminal 22 and the other end connected to an external connection terminal 24 .

[0017] As described later, the touch detection electrodes 11 and 21 function as sensor electrodes for detecting a so-called touch operation, and are made up of a plurality of thin metal wires. 1, a detection region R1 is a region surrounding touch detection electrodes 11 and 21 arranged on the surface of a substrate 1. A peripheral region R2 is a region outside (on the periphery side of) the detection region R1, and a peripheral wiring 13 is arranged in the peripheral region R2.

[0018] Fig. 2 is an enlarged plan view showing an example of the configuration of peripheral wiring in the peripheral region of the touch sensor. In Fig. 2, each of the multiple peripheral wirings 13 extends in the X direction and is arranged in the Y direction perpendicular to the X direction. Each of the multiple peripheral wirings 13 has a line width L, and two adjacent peripheral wirings 13 are arranged at a distance S therebetween.

[0019] Here, the above-mentioned narrowing of the frame is an attempt to enlarge the detection region R1 for detecting a touch operation and to reduce the peripheral region R2 in the touch sensor 10. As a method for realizing a narrowing of the frame of the touch sensor, for example, it is considered to narrow at least one of the distance S between two adjacent peripheral wirings and the line width L of the peripheral wiring in the peripheral region R2 in which the peripheral wirings 13 shown in FIG. The inventors have studied the configuration and arrangement of peripheral wiring for narrowing the frame of a touch sensor, and have found that in areas where the peripheral wiring is arranged, a decrease in conductivity, such as an increase in resistivity, or migration between the peripheral wiring may occur, and that a decrease in conductivity and migration may be more likely to occur in areas where the distance S is narrow.

[0020] In contrast, touch sensor 10 according to the present invention includes substrate 2 having a water contact angle of surface 2A of 20 to 50°. Since the water contact angle of surface 2A of substrate 2 is within the above range, it is possible to suppress a decrease in conductivity of the peripheral wiring and the occurrence of migration between the peripheral wiring in an area where a plurality of peripheral wirings are arranged, particularly in an area where distance S is narrowed to narrow the frame. In other words, by having the above characteristics, the touch sensor according to the present invention is excellent in the effect of suppressing a decrease in conductivity and migration in the peripheral wiring.

[0021] The mechanism by which the touch sensor according to the present invention has excellent performance in suppressing a decrease in conductivity and migration in the peripheral wiring is not necessarily clear, but the present inventors speculate as follows. The peripheral wiring of the touch sensor according to the present invention is composed of a plated layer and a metal plating layer covering the plated layer. Here, in order to form a conductive layer, a plated layer is formed at a position corresponding to the peripheral wiring, and then a plating process is performed on the formed plated layer to deposit metal on the surface of the plated layer, thereby forming a metal plating layer. In the process of forming this conductive layer, it is considered that air bubbles may adhere to the surface of the plated layer due to a reaction between the constituent material of the conductive layer, such as the plating metal, and the components in the plating solution. In this case, metal is not deposited on the surface part of the plated layer where the air bubbles are attached, and as a result, it is presumed that a part of the metal plating layer that is responsible for the conductivity of the peripheral wiring is missing, resulting in a decrease in conductivity. In contrast, in the touch sensor according to the present invention, the water contact angle of the substrate surface is 50° or less, so that air bubbles are less likely to adhere to the exposed substrate area between the plating layers (particularly, the area where the plating layers corresponding to the peripheral wiring with a narrow distance S are formed). As a result, plating can be performed without leaving any air bubbles on the surface of the plating layers, and it is presumed that the decrease in the conductivity of the peripheral wiring can be suppressed. Furthermore, in the touch sensor of the present invention, since the water contact angle on the surface of the substrate is 20° or more, the water content near the substrate surface is low in areas where the peripheral wiring is arranged (especially areas where the peripheral wiring is arranged with a narrow distance S), and it is presumed that this makes it possible to suppress the occurrence of migration in the peripheral wiring.

[0022] Each member included in the touch sensor according to the present invention will be described in detail. Hereinafter, the expression "the effects of the present invention are excellent" means that in a touch sensor, at least one of the effects of suppressing a decrease in conductivity in the peripheral wiring and the effects of suppressing migration in the peripheral wiring is excellent.

[0023] <Substrate> The substrate is a member having a function of supporting the conductive layer.

[0024] As described above, the substrate included in the touch sensor of the present invention is characterized in that the surface on which the conductive layer is formed has a water contact angle of 20 to 50°. The water contact angle of the substrate surface is preferably 40° or less, more preferably 35° or less, and even more preferably 30° or less, in terms of obtaining better effects of the present invention. In addition, the water contact angle of the substrate surface is preferably 22° or more, and more preferably 25° or more, in terms of obtaining better effects of the present invention.

[0025] In this specification, the water contact angle refers to a water contact angle measured by the following method. First, a substrate to be measured is prepared, and pure water (2 μL droplets) is dropped onto the surface of the substrate held horizontally using a contact angle meter (e.g., "DM500" manufactured by Kyowa Interface Science Co., Ltd.). After the drop, the contact angle is measured at 10 points 20 seconds later, and the arithmetic mean value of the measurement results is regarded as the water contact angle (unit: °) of the substrate surface. The above measurement test is performed at room temperature of 20° C. in accordance with the sessile drop method of JIS R 3257:1999.

[0026] The method for preparing a substrate having a surface water contact angle in the above range is not particularly limited, and examples include a method in which the constituent material of the substrate is appropriately selected from the standpoint of hydrophilicity and hydrophobicity to adjust the water contact angle of the substrate to be in the above range. The substrate preferably contains a hydrophilic component as a constituent material, for example, a surfactant, a hydrophilic polymer, and a hydrophilic oligomer, with a surfactant being preferred. Examples of the substrate containing a hydrophilic component (preferably a surfactant) include a substrate having a single mixed layer containing a main component such as a resin and a hydrophilic component, and a substrate having a multilayer structure of a support that mainly functions to support the conductive layer and an underlayer containing a hydrophilic component, and a substrate having a multilayer structure of the support and an underlayer containing a surfactant is preferred.

[0027] Examples of the substrate and the support that constitutes a multilayer structure together with the above-mentioned underlayer (hereinafter, when the two are not distinguished from each other, they are also referred to as "substrate, etc.") include a resin substrate, a glass substrate, a ceramic substrate, and a metal substrate. The substrate may be a transparent substrate having a visible light (wavelength 400 to 800 nm) transmittance of 60% or more. The visible light transmittance of the substrate is preferably 80% or more, more preferably 90% or more. There is no particular upper limit, but it is often less than 100%. Examples of the transparent substrate include a resin substrate, a glass substrate, and a ceramic substrate. In particular, the substrate etc. is preferably flexible in terms of excellent bendability. Examples of the substrate etc. having flexibility include the above-mentioned resin substrate. Furthermore, the substrate etc. may have a three-dimensional shape. That is, the touch sensor may have a three-dimensional shape.

[0028] Materials constituting the substrate are preferably resins with a melting point of about 290°C or less, such as polyethylene terephthalate (PET) (258°C), polycycloolefin (134°C), polycarbonate (250°C), acrylic resin (128°C), polyethylene naphthalate (269°C), polyethylene (135°C), polypropylene (163°C), polystyrene (230°C), polyvinyl chloride (180°C), polyvinylidene chloride (212°C), and triacetyl cellulose (290°C), with PET, polycycloolefin, or polycarbonate being more preferred, and PET being even more preferred. The numbers in parentheses above are melting points or glass transition temperatures. The content of the resin in the substrate is not particularly limited, but is preferably 80% by mass, more preferably 90% by mass or more, based on the total mass of the substrate. The upper limit may be 100% by mass, based on the total mass of the substrate.

[0029] (Surfactant) When the substrate contains a surfactant, the type of surfactant is not particularly limited, and examples thereof include nonionic surfactants, anionic surfactants, cationic surfactants, and amphoteric surfactants, with nonionic surfactants being preferred.

[0030] Examples of nonionic surfactants include polyoxyethylene alkyl ethers, polyoxyethylene alkylaryl ethers, polyoxyethylene alkylphenyl ethers, polyoxyalkylene monoalkyl ethers, propylene oxide-ethylene oxide block polymers, sorbitan fatty acid esters, polyoxyethylene sorbitan fatty acid esters, polyoxyethylene sorbitol fatty acid esters, glycerin fatty acid esters, polyoxyethylene fatty acid esters, and alkyl (poly)glycosides. Commercially available nonionic surfactants include "Polyflow KL-510" manufactured by TEGO (100% solids, component: polyoxyalkylene monoalkyl ether), "SN984" manufactured by San Nopco Ltd. (100% solids, component: polyether compound), "SN366" manufactured by San Nopco Ltd. (100% solids, component: polyoxyethylene fatty acid ester), "Newcol 1004" manufactured by Daiichi Kogyo Seiyaku Co., Ltd. (100% solids, component: polyoxyethylene-2-ethylhexyl ether), "DMH-40" manufactured by Daiichi Kogyo Seiyaku Co., Ltd. (100% solids, component: polyoxyethylene alkyl ether), "Neonogen 140A" manufactured by Daiichi Kogyo Seiyaku Co., Ltd. (100% solids, component: polyoxyethylene-alkylphenyl ether), and "Pluronic (registered trademark) L-44" manufactured by ADEKA Corporation (100% solids, component: propylene oxide-ethylene oxide block polymer).

[0031] The surfactant may be used alone or in combination of two or more kinds.

[0032] (base layer) When the substrate has a multi-layer structure consisting of a support and an underlayer containing a hydrophilic component, the underlayer is not particularly limited as long as it is a layer containing a surfactant. The underlayer is disposed on the surface of the substrate on which the conductive layer is formed. When the substrate has a multi-layer structure of a support and an underlayer, it is preferable that the underlayer containing a surfactant is disposed on both sides of the support.

[0033] The surfactant contained in the undercoat layer is as described above, including preferred embodiments. The content of the surfactant in the undercoat layer is preferably from 0.5 to 20% by mass, and more preferably from 1 to 15% by mass, based on the total mass of the undercoat layer.

[0034] The underlayer may contain a polymer in addition to a surfactant. Examples of the polymer that may be contained in the underlayer include a crosslinked polymer having a crosslinked structure and a linear polymer.

[0035] A crosslinked polymer is a polymer in which polymer chains are bonded to each other through a crosslinked structure to form a two-dimensional or three-dimensional mesh-like network. The type of crosslinked polymer is not particularly limited, and examples thereof include polymers having a urethane structure (-NH-(C=O)-). The molecular weight between crosslinking points of the crosslinked polymer is preferably more than 20000 and not more than 500000. The molecular weight between crosslinking points can be determined by performing solid viscoelasticity measurement.

[0036] A linear polymer is one in which repeating units are bonded one-dimensionally and do not include a branched structure in the bonds between the repeating units. Known polymers can be used as the linear polymer, and examples of such polymers include copolymers of acrylonitrile and 1,3-butadiene (nitrile rubber), hydrogenated nitrile rubber, copolymers containing repeating units derived from acrylic acid and / or methacrylic acid (acrylic polymers), copolymers containing repeating units derived from acrylic acid derivatives and / or methacrylic acid derivatives (acrylic polymers), and urethane polymers. The weight average molecular weight of the linear polymer is, for example, 500 to 500,000, and preferably 1,000 to 100,000. The polymer contained in the undercoat layer may be used alone or in combination of two or more kinds. The content of the polymer in the undercoat layer is not particularly limited, and may be the remainder of the surfactant, and may be, for example, 80 to 99.5% by mass relative to the total mass of the undercoat layer.

[0037] The underlayer may contain components other than the surfactant and the polymer, such as an oligomer and a polymerization initiator.

[0038] The thickness of the underlayer is, for example, 0.3 to 20 μm, preferably 0.5 to 10 μm, and more preferably 1 to 5 μm.

[0039] - Method for forming the base layer - An example of a method for forming the underlayer is a method in which a composition for forming an underlayer containing the components contained in the underlayer is brought into contact with the support to form the underlayer on the surface of the support. The method of contacting the support with the composition for forming an undercoat layer is not particularly limited, and examples thereof include a method of applying the composition for forming an undercoat layer to the surface of the support, and a method of immersing the support in the composition for forming an undercoat layer. If necessary, after contacting the composition for forming an undercoat layer with the support, a drying treatment may be performed to remove the solvent contained in the composition for forming an undercoat layer. In addition, a base layer may be formed on the surface of a temporary support other than the support in the same manner as described above, and then the surface of the base layer formed on the temporary support opposite the temporary support may be laminated to one surface of the support, and the temporary support may be peeled off at the interface between the temporary support and the base layer, thereby placing the base layer on the surface of the support.

[0040] The undercoat layer forming composition may contain a solvent. The type of the solvent is not particularly limited, and examples thereof include water and organic solvents. Examples of the organic solvent include known organic solvents (e.g., alcohol-based solvents, ether-based solvents, ester-based solvents, ketone-based solvents, halogen-based solvents, and hydrocarbon-based solvents).

[0041] The underlayer may be formed by contacting a composition containing a precursor of a polymer that may be contained in the underlayer with the support to form an underlayer precursor layer, and then polymerizing the precursor to form a polymer. Examples of the treatment for polymerizing the precursor include exposure treatment. When the exposure treatment is performed, it is preferable that the undercoat layer forming composition and the undercoat layer precursor layer contain a polymerization initiator. The polymerization initiator is appropriately selected depending on the type of the polymer precursor.

[0042] The thickness of the substrate is not particularly limited, and is preferably from 20 to 1000 μm, more preferably from 25 to 200 μm, in terms of a balance between ease of handling and thinning.

[0043] <Conductive layer> The conductive layer is a layer formed on the surface of the substrate, and has a touch detection electrode composed of a plurality of thin metal wires arranged in a mesh pattern, an electrode connection terminal electrically connected to the touch detection electrode, and peripheral wiring electrically connected to the electrode connection terminal. The first conductive layer 2 and the second conductive layer 3 shown in FIG. 1 are an example of a suitable embodiment of the conductive layer included in the touch sensor according to the present invention.

[0044] The touch sensor according to the present invention is not limited to the embodiment shown in FIG. 1 includes a first conductive layer 2 and a second conductive layer 3 formed on both surfaces 1A and 1B of a substrate 1, but the conductive layers may be formed on only one surface of the substrate. That is, the touch sensor according to the present invention may be a touch sensor including a substrate and a conductive layer formed on only one surface of the substrate, in which the surface of the substrate on which the conductive layer is formed has a water contact angle of 20 to 50°.

[0045] Next, the peripheral wiring and the touch sensing electrodes provided in the conductive layer will be described in more detail.

[0046] (peripheral wiring) The peripheral wiring has a function of transmitting an electrical signal detected in the touch sensing electrode to an external device by electrically connecting the electrode connection terminal and the external connection terminal. 2, all of the multiple peripheral wirings 13 extend in the X direction (first direction) and are arranged in the Y direction (second direction) perpendicular to the X direction, but Fig. 2 shows the arrangement of the peripheral wirings 13 in a partial section of the entire length of the peripheral wirings 13 connecting the electrode connection terminals 12 and the external connection terminals 14. As shown in Fig. 1, the peripheral wirings 13 connect the electrode connection terminals 12 and the external connection terminals 14 while changing the extending direction depending on the arrangement of the electrode connection terminals 12, the external connection terminals 14 and other members.

[0047] In order to facilitate the realization of a narrow frame, it is preferable that, in at least a portion of the area on the surface of the substrate in which the peripheral wiring is arranged, at least one of the distance S between two adjacent peripheral wirings and the line width L of the peripheral wiring is within a predetermined range, and it is more preferable that the distance S between the peripheral wirings is within a predetermined range. Specifically, the distance S between the peripheral wirings is preferably 50 μm or less, more preferably 30 μm or less, and further preferably 15 μm or less. Moreover, the line width L of the peripheral wiring is preferably 50 μm or less, more preferably 30 μm or less, and further preferably 15 μm or less. In the touch sensor of the present invention, by narrowing the frame, in at least a portion of the area in which the peripheral wiring is arranged, a decrease in the conductivity of the peripheral wiring and the occurrence of migration between the peripheral wiring can be suppressed even when the distance S between the peripheral wiring and / or the line width L of the peripheral wiring are within the above-mentioned range.

[0048] The distance S between the peripheral wirings is preferably 5 μm or more, and more preferably 10 μm or more, in that the effect of suppressing migration is more excellent. Moreover, the line width L of the peripheral wiring is preferably 3 μm or more, and more preferably 5 μm or more, in order to ensure sufficient conductivity.

[0049] In this specification, the line width of the peripheral wiring refers to the line width measured by observing the length in a direction perpendicular to the direction in which each member of the touch sensor extends with an optical microscope (for example, a digital microscope "VHX-7000" manufactured by Keyence Corporation). Specifically, the line width is measured by performing the above-mentioned optical microscope observation at 10 arbitrarily selected points on the conductive layer, and the measured values ​​are arithmetically averaged to calculate the line width of the peripheral wiring.

[0050] Also, for example, "the distance S between the peripheral wirings is 30 μm or less in at least a part of the region in which the peripheral wirings are arranged" means that the distance S between the peripheral wirings obtained by the following method for a section of 1000 μm in length in which the multiple peripheral wirings extend in one direction is 30 μm or less. More specifically, in the target section of 1000 μm in length in which the multiple peripheral wirings to be measured extend in one direction, five points that include both ends of the target section and are equally spaced from each other are selected, and optical microscope observation is performed according to the above method. Next, the distance between two adjacent peripheral wirings is measured from the observed image, and the measured values ​​of the five points are arithmetically averaged to calculate the distance S between the peripheral wirings in the target section.

[0051] (touch sensing electrode) Fig. 3 is an enlarged plan view showing an example of the configuration of a touch sensing electrode of a conductive layer of a touch sensor of the present invention. As shown in Fig. 3, the touch sensing electrode 11 is made of a plurality of thin metal wires MW arranged in a mesh shape, and functions as a sensor electrode for detecting a so-called touch operation. The mesh shape refers to a shape including a plurality of openings formed by intersecting thin metal wires MW. The openings are open regions surrounded by the thin metal wires MW. In the touch sensing electrode 11 shown in FIG. 3, a mesh pattern MP having diamond-shaped openings is formed by the thin metal wires MW. Note that the shape of the mesh pattern of the touch sensing electrode is not limited to a diamond shape and may be another shape.

[0052] Examples of the shape of the mesh pattern of the touch sensing electrode include triangles such as equilateral triangles, isosceles triangles, and right-angled triangles, quadrilaterals such as squares, rectangles, rhombus, parallelograms, and trapezoids, (regular) n-gons such as (regular) hexagons and (regular) octagons, circles, ellipses, stars, and geometric shapes that combine these. In addition to a straight line, the shape of one side of the opening may be curved or arc-shaped. In the case of an arc-shaped shape, for example, two opposing sides may be arc-shaped convex outward, and the other two opposing sides may be arc-shaped convex inward. In addition, the shape of each side may be a wavy line shape in which an outwardly convex arc and an inwardly convex arc are continuous. Of course, the shape of each side may be a sine curve. The mesh pattern is not particularly limited, and may be a random pattern or a regular pattern, or may be a regular mesh pattern in which congruent shapes are repeatedly arranged.

[0053] The mesh pattern of the touch detection electrode is preferably a regular mesh pattern having the same diamond lattice. The length of one side of the diamond, i.e., the length of one side of the opening, is preferably 50 to 1500 μm, more preferably 150 to 800 μm, and even more preferably 200 to 600 μm, from the viewpoint of visibility. When the length of one side of the opening is within the above-mentioned range, it is possible to maintain good transparency, and when the touch sensor is attached to the display surface of the image display device, the displayed image can be viewed without any sense of incongruity. The aperture ratio of the mesh pattern of the touch sensing electrode is preferably 90% or more, more preferably 95% or more, in terms of visible light transmittance. The aperture ratio corresponds to the area ratio of the openings excluding the thin metal wires MW in the region where the touch sensing electrode is provided to the entire region where the touch sensing electrode is provided.

[0054] The mesh pattern of the touch sensing electrode can be observed and measured using an optical microscope.

[0055] The line width W of the thin metal wires MW constituting the mesh pattern of the touch sensing electrode is preferably 10 μm or less, more preferably 5 μm or less, and even more preferably 3 μm or less, in terms of better visibility. The lower limit is not particularly limited, but is preferably 0.5 μm or more, and more preferably 1 μm or more, in terms of better conductive properties of the thin metal wires.

[0056] In the touch sensor according to the present invention, the peripheral wiring has a plated layer formed on the surface of the substrate and a metal plating layer covering the plated layer. In addition, it is preferable that the components constituting the conductive layer, such as the touch detection electrodes, electrode connection terminals, and external connection terminals other than the peripheral wiring, i.e., the entire conductive layer, have a plated layer formed on the surface of the substrate and a metal plating layer covering the plated layer.

[0057] (Layer to be plated) The layer to be plated is a layer that is subjected to a plating process to form a metal plating layer covering the surface thereof. Since the conductive layer is formed by the plated layer and the metal plating layer covering the plated layer, it is preferable that the plated layer has a pattern corresponding to the shape of the desired conductive layer pattern, and is disposed on the surface of the substrate. For example, the plated layer disposed in the region where the touch sensing electrode is to be formed preferably has the same mesh pattern as the touch sensing electrode when the touch sensing electrode is mesh-shaped, and preferably has the same stripe pattern as the touch sensing electrode when the touch sensing electrode is stripe-shaped.

[0058] The layer to be plated is not particularly limited as long as it is possible to form a metal plating layer by plating, and may be, for example, a layer containing an organic component as a main component. The term "mainly composed of an organic component" means that the content of the organic component is more than 50% by mass, preferably 80% by mass or more, and more preferably 90% by mass or more, based on the total mass of the layer to be plated. The upper limit is not particularly limited, and may be 99.9% by mass or less.

[0059] The layer to be plated preferably contains a plating catalyst. The plating catalyst is preferably an electroless plating catalyst. The electroless plating catalyst is not particularly limited as long as it can be an active nucleus in the electroless plating process, and examples thereof include metals having catalytic activity in autocatalytic reduction reactions (metals known to have a lower ionization tendency than Ni and to be usable in electroless plating processes). Specific examples thereof include Pd, Ag, Cu, Pt, Au, and Co.

[0060] The organic component contained in the layer to be plated is preferably a compound formed by adsorbing a plating catalyst to a compound having a functional group (hereinafter also referred to as an "interactive group") that interacts with the plating catalyst or its precursor. The interactive group is intended to mean a functional group capable of interacting with a plating catalyst or a precursor thereof applied to the layer to be plated, and examples thereof include functional groups capable of forming electrostatic interactions with a plating catalyst or a precursor thereof, as well as nitrogen-containing functional groups, sulfur-containing functional groups, and oxygen-containing functional groups capable of forming coordination with a plating catalyst or a precursor thereof. As the interactive group, an ionic polar group such as a carboxylic acid group, a sulfonic acid group, a phosphoric acid group, or a boronic acid group, or a cyano group is preferred, since these groups have high polarity and high adsorption ability to a plating catalyst or a precursor thereof, and a carboxylic acid group or a cyano group is more preferred. The compound having an interactive group is preferably a polymer having an interactive group, more preferably a polymer containing a repeating unit having an interactive group. That is, the layer to be plated preferably contains a compound in which a plating catalyst is adsorbed to a polymer having an interactive group (more preferably a polymer containing a repeating unit having an interactive group).

[0061] The thickness of the layer to be plated is not particularly limited, and is preferably 0.05 to 2.0 μm, more preferably 0.1 to 1.0 μm, from the viewpoints of being able to sufficiently support the plating catalyst or its precursor and preventing plating abnormalities. The line width of the layer to be plated is appropriately selected depending on which of the components, such as the touch sensing electrode, the electrode connection terminal, and the peripheral wiring, the conductive layer formed by the plating process constitutes, and the specific method of the plating process, etc.

[0062] -Method of forming plating layer- The method for forming the plateable layer is not particularly limited, and examples include a method in which a plateable layer-forming composition containing the components contained in the plateable layer is contacted with a substrate to form a plateable layer precursor layer, the plateable layer precursor layer is subjected to an exposure treatment and a development treatment to form a patterned plateable layer, and a plating catalyst or a precursor thereof is further applied to the obtained plateable layer.

[0063] Examples of the composition for forming a plateable layer include a composition containing the following compound X or composition Y. Compound X: a compound having an interactable group and a polymerizable group Composition Y: A composition containing a compound having an interactive group and a compound having a polymerizable group Compound X is a compound having an interactive group and a polymerizable group. The definition of the interactive group is as described above. The compound X may have two or more types of interacting groups.

[0064] The polymerizable group is a functional group that can form a chemical bond by applying energy, and examples thereof include a radical polymerizable group and a cationic polymerizable group. Among them, the radical polymerizable group is preferable because of its superior reactivity. As the radical polymerizable group, a methacryloyloxy group, an acryloyloxy group, or a styryl group is more preferable. Compound X may have two or more kinds of polymerizable groups. In addition, the number of polymerizable groups that compound X has is not particularly limited, and may be one or two or more.

[0065] The compound X may be a low molecular weight compound or a high molecular weight compound. A low molecular weight compound refers to a compound having a molecular weight of less than 1000, and a high molecular weight compound refers to a compound having a molecular weight (weight average molecular weight when the molecular weight has a distribution) of 1000 or more. When the compound X is a polymer, the weight average molecular weight of the polymer is not particularly limited, but is preferably from 1,000 to 700,000, and more preferably from 2,000 to 200,000, in terms of better handleability such as solubility. There are no particular limitations on the method for synthesizing such a polymer having a polymerizable group and an interactive group, and known synthesis methods (see paragraphs

[0097] to

[0125] of JP-A-2009-280905) can be used.

[0066] The composition Y is a composition containing a compound having an interactive group and a compound having a polymerizable group. That is, the composition Y contains two kinds of compounds, that is, a compound having an interactive group and a compound having a polymerizable group. The definitions of the interactive group and the polymerizable group are as described above. The compound having an interactive group may be a low molecular weight compound or a high molecular weight compound, and may contain a polymerizable group. A suitable form of the compound having an interactive group is a polymer containing a repeating unit having an interactive group (for example, polyacrylic acid).

[0067] A preferred embodiment of the polymer containing a repeating unit having an interactive group is a polymer X having a repeating unit derived from a conjugated diene compound and a repeating unit derived from an unsaturated carboxylic acid or a derivative thereof, in that a plating layer can be easily formed with a small amount of energy applied (e.g., exposure dose). The conjugated diene compound is not particularly limited as long as it has a molecular structure with two carbon-carbon double bonds separated by one single bond. The repeating unit derived from the conjugated diene compound is preferably a repeating unit derived from a compound having a butadiene skeleton. Examples of the compound having a butadiene skeleton (monomer having a butadiene structure) include 1,3-butadiene, isoprene, 2-ethyl-1,3-butadiene, 2-n-propyl-1,3-butadiene, 2,3-dimethyl-1,3-butadiene, 1-phenyl-1,3-butadiene, 1-α-naphthyl-1,3-butadiene, 1-β-naphthyl-1,3-butadiene, 2-chloro-1,3-butadiene, 1-bromo-1,3-butadiene, 1-chlorobutadiene, 2-fluoro-1,3-butadiene, 2,3-dichloro-1,3-butadiene, 1,1,2-trichloro-1,3-butadiene, and 2-cyano-1,3-butadiene. The content of the repeating unit derived from the conjugated diene compound in the polymer X is preferably 25 to 75 mol % based on the total repeating units. The content of the repeating unit derived from the unsaturated carboxylic acid or a derivative thereof in the polymer X is preferably 25 to 75 mol % based on the total repeating units.

[0068] The compound having a polymerizable group is a so-called monomer, and a polyfunctional monomer having two or more polymerizable groups is preferable in terms of the superior hardness of the patterned plating layer to be formed. Specifically, the polyfunctional monomer is preferably a monomer having 2 to 6 polymerizable groups. From the viewpoint of the mobility of molecules during the crosslinking reaction that affects the reactivity, the molecular weight of the polyfunctional monomer used is preferably 150 to 1000, more preferably 200 to 800.

[0069] The composition for forming a plateable layer may contain components other than the above-mentioned components. For example, the composition for forming a layer to be plated may contain a polymerization initiator. The type of the polymerization initiator is not particularly limited, and examples thereof include known polymerization initiators (preferably photopolymerization initiators). The composition for forming a plateable layer may contain a solvent. The type of the solvent is not particularly limited, and examples thereof include water and organic solvents. Examples of the organic solvent include known organic solvents (e.g., alcohol-based solvents, ester-based solvents, ketone-based solvents, halogen-based solvents, and hydrocarbon-based solvents).

[0070] In the exposure treatment performed on the plated layer precursor layer, the plated layer precursor layer is irradiated with light in a pattern so as to obtain a plated layer having a desired pattern. The type of light used is not particularly limited, and examples thereof include ultraviolet light and visible light. When irradiating with light in a pattern, it is preferable to irradiate with light using a mask having an opening of a predetermined shape. In the exposed portion of the plateable layer precursor layer, polymerizable groups contained in compounds in the plateable layer precursor layer are activated, causing crosslinking between compounds, and hardening of the layer proceeds.

[0071] Next, the plating layer precursor layer that has been subjected to the pattern-wise hardening treatment is subjected to a development treatment to remove the unexposed portions, thereby forming a pattern-wise plating layer. The formed plating layer has a shape corresponding to the conductive layers such as the touch sensing electrodes, the electrode connection terminals, and the peripheral wiring. The method of development is not particularly limited, and an optimal development is carried out depending on the type of material used. Examples of the developer include an organic solvent, pure water, and an aqueous alkaline solution.

[0072] Next, a plating catalyst or a precursor thereof is applied to the formed patterned plating layer. Since the plating layer has the above-mentioned interactive group, the plating catalyst or the precursor thereof applied to the plating layer adheres (adsorbs) to the interactive group according to the function of the interactive group. The plating catalyst or its precursor applied to the layer to be plated functions as a catalyst or an electrode in the plating process described below. Therefore, the type of plating catalyst or its precursor to be used is appropriately determined depending on the type of plating process.

[0073] Methods for applying the plating catalyst or its precursor to the layer to be plated include, for example, a method of preparing a solution in which the plating catalyst or its precursor is dispersed or dissolved in a solvent and applying the solution to the surface of the layer to be plated, and a method of immersing a substrate with a layer to be plated in the solution. The plating catalyst is preferably an electroless plating catalyst. The electroless plating catalyst is as described above. A metal colloid may be used as the electroless plating catalyst. The electroless plating catalyst precursor is not particularly limited as long as it becomes an electroless plating catalyst by chemical reaction, and examples thereof include ions of the metals listed as the electroless plating catalysts. The metal ions of the electroless plating catalyst precursor become zero-valent metals of the electroless plating catalyst by reduction reaction. After being applied to the patterned plating layer, the metal ions of the electroless plating catalyst precursor may be converted to zero-valent metals by a separate reduction reaction before immersion in the electroless plating bath to form the electroless plating catalyst. Alternatively, the electroless plating catalyst precursor may be immersed in the electroless plating bath as it is, and converted to metal (electroless plating catalyst) by a reducing agent in the electroless plating bath. Examples of the solvent include water and organic solvents.

[0074] (Metal plating layer) The metal plating layer is a layer formed by subjecting a layer to a plating treatment. Examples of the metal material contained in the metal plating layer include metals such as gold (Au), silver (Ag), copper (Cu), and aluminum (Al), as well as alloys containing these metals. Among these, the metal plating layer preferably contains silver or copper, and more preferably contains copper, in terms of excellent conductivity of the conductive layer. Examples of the metal plating layer containing copper include a layer made of copper alone (metallic copper) and a layer made of a mixture containing copper and a metal other than copper (copper alloy), and a layer made of copper alone is preferred. Examples of the metal other than copper contained in the copper alloy include silver, gold, aluminum, nickel, molybdenum, chromium, and palladium.

[0075] The metal plating layer is not limited to being composed of a single layer containing a metal, but may be composed of a multi-layer structure consisting of two or more metal layers having different compositions. It is preferable that the metal plating layer does not have a layer containing a compound of a metal and an atom other than the metal, such as a metal oxide.

[0076] The thickness of the metal plating layer and the conductive layer is not particularly limited, but is preferably 0.1 to 5.0 μm, and more preferably 0.2 to 3.0 μm, in terms of lower resistance and better adhesion.

[0077] -Method for forming metal plating layer- The plating method for forming the metal plating layer is not particularly limited, and examples thereof include electroless plating and electrolytic plating (electroplating).

[0078] The method for forming a metal plating layer preferably includes a step of subjecting a layer to be plated, to which a plating catalyst or a precursor thereof has been applied, to an electroless plating treatment. The metal plating layer may be a layer formed by carrying out an electroless plating process alone, or may be a layer formed by carrying out an electroless plating process and then carrying out an electrolytic plating process. The plating process may be repeated several times, and in that case, a plating solution containing a different metal may be used for each plating process. In the plating process, the line width and thickness of the metal plating layer can be adjusted by the composition of the plating solution, the plating temperature, the plating time, and the like.

[0079] Electroless plating is a process in which a solution containing dissolved ions of the metal to be deposited as plating is used to deposit the metal through a chemical reaction. An example of the electroless plating treatment is a method in which a substrate having a layer to be plated to which a plating catalyst has been applied is first washed with water to remove excess plating catalyst, and then immersed in an electroless plating bath. Any known electroless plating bath can be used as the electroless plating bath.

[0080] A typical electroless plating bath mainly contains a solvent (e.g., water), metal ions for plating, a reducing agent, and an additive (stabilizer) for improving the stability of the metal ions. In addition to these, the plating bath may contain known additives such as a plating bath stabilizer. The organic solvent used in the electroless plating bath must be soluble in water, and from this point of view, ketones such as acetone, or alcohols such as methanol, ethanol, or isopropanol are preferably used. The electroless plating bath contains a metal corresponding to the desired metal plating layer. The reducing agent and additives contained in the electroless plating bath are selected to be optimal for the above metal. The immersion time in the electroless plating bath is, for example, about 1 minute to 6 hours, and preferably about 1 minute to 3 hours.

[0081] <Method of manufacturing touch sensor> The touch sensor according to the present invention can be produced, for example, by a production method including the following steps 1 to 4. Step 1: preparing a substrate having a surface water contact angle of 20 to 50°. Step 2: A step of forming a patterned layer to be plated on the surface of the substrate. Step 3: A step of applying a plating catalyst or a precursor thereof to the pattern-shaped plating layer formed on the surface of the substrate. Step 4: A step of performing a plating process on the patterned plating layer to which the plating catalyst or its precursor has been applied, thereby forming a metal plating layer.

[0082] Step 1 has already been described, and it is preferable to prepare a substrate with an underlayer according to the above-mentioned method for forming an underlayer. Steps 2 and 3 are preferably carried out in accordance with the above-mentioned method for forming the plated layer. Step 4 is preferably carried out in accordance with the above-mentioned method for forming a metal plating layer. A touch sensor having conductive layers disposed on both surfaces of a substrate as shown in FIG. 1 can be manufactured by preparing a substrate having a water contact angle of 20 to 50° on both surfaces, and forming a plated layer and a metal plating layer in accordance with steps 2 to 4 above.

[0083] The touch sensor may be used in the form of a laminate having the touch sensor and other members such as an adhesive sheet and a release sheet during handling and transportation. The release sheet functions as a protective sheet for preventing the conductive member from being scratched during transportation of the laminate. The touch sensor may also be handled in the form of a composite having, for example, the touch sensor, the adhesive sheet, and the protective layer in this order.

[0084] [Touch panel] The touch sensor according to the present invention can be preferably applied to a touch panel. A specific embodiment of the touch panel having a touch sensor according to the present invention includes a touch sensor, an image display device arranged on one main surface of the touch sensor, and a cover member arranged on the other main surface of the touch sensor. In the touch panel having such an embodiment, a finger or a stylus pen of a user in contact with or close to the cover member is detected, and a touch operation by the user is detected. EXAMPLES

[0085] The present invention will be described in further detail below with reference to examples. The materials, amounts, ratios, processing contents, processing procedures, etc. shown in the following examples can be appropriately changed without departing from the spirit of the present invention. Therefore, the scope of the present invention should not be interpreted as being limited by the following examples.

[0086] (Preparation of Undercoat Layer-Forming Composition) The raw material components used in the preparation of the undercoat layer-forming composition are shown below. Z913-3: "Z913-3" manufactured by Aica Kogyo Co., Ltd. Weight average molecular weight (Mw): 50,000 HO-250: "Light Ester HO-250(N)" manufactured by Kyoeisha Chemical Co., Ltd., 2-hydroxyethyl methacrylate FOM-03006: "FOM-03006" manufactured by Fujifilm Wako Pure Chemical Industries, Ltd., a crosslinkable compound represented by the following structural formula [ka]

[0087] OXE-02: BASF's "IRGACURE® OXE-02", an oxime ester polymerization initiator Surfactant A: "Pluronic L-44" manufactured by ADEKA Corporation, 100% solids, nonionic surfactant made of propylene oxide-ethylene oxide block polymer Mixed solvent 1: A mixture of methyl ethyl ketone (MEK) and isopropyl alcohol (IPA) in a volume ratio of 1:3 (MEK:IPA). Mixed solvent 2: A mixture of methyl ethyl ketone (MEK) and isopropyl alcohol (IPA) in a volume ratio of 1:1 (MEK:IPA).

[0088] The raw material components were mixed in the amounts shown in Table 1 below to prepare compositions A to H, which are compositions for forming an undercoat layer. For example, composition A was prepared by mixing 3 parts by mass of "Z913-3", 0.015 parts by mass of "OXE-02", 0.065 parts by mass of surfactant A, and 97 parts by mass of mixed solvent 1.

[0089] [Table 1]

[0090] (Preparation of composition for forming plated layer) The following components were mixed to obtain a composition for forming a plateable layer. 38 parts by weight of isopropanol Polybutadiene maleic acid (butadiene-maleic acid alternating copolymer, butadiene-derived repeating unit: maleic acid-derived repeating unit = 1:1 (molar ratio), manufactured by Polysciences Co., Ltd.) 4 parts by mass FAM-201 (bifunctional acrylamide, manufactured by Fujifilm Corporation) 1 part by mass IRGACURE OXE02 (oxime ester polymerization initiator, manufactured by BASF) 0.05 parts by mass

[0091] [Example 1] (Formation of base layer) The above-mentioned composition A was applied by bar coating to one surface of a polyester film (Cosmoshine (registered trademark) A4360, manufactured by Toyobo Co., Ltd.) with an easy-adhesion layer on both sides having a thickness of 50 μm, and the coating film was dried at 120° C. to form a primer layer precursor layer with a thickness of 1.2 μm. The exposure dose of the thus-formed primer layer precursor layer was 500 mJ / cm 2 Thus, a substrate having an underlayer A containing a crosslinked polymer and a surfactant A was prepared.

[0092] (Preparation of substrate with plating layer) The above-mentioned plating layer forming composition was applied to the surface of the undercoat layer A of the prepared substrate by bar coating. The amount of plating layer forming composition applied was adjusted so that the thickness of the layer after drying was about 0.3 μm. The coating film was dried at a temperature of 120° C. for 1 minute to form a plating layer precursor layer. Immediately after the plating layer precursor layer was formed, a polypropylene protective film having a thickness of 12 μm was attached to the surface of the plating layer precursor layer.

[0093] An exposure mask having an exposure pattern corresponding to a plurality of touch sensing electrodes 11, a plurality of electrode connection terminals 12, a plurality of peripheral wirings 13, and a plurality of external connection terminals 14 as shown in FIG. 1 was placed on the substrate with the plating layer precursor to which the protective film was attached. The substrate with the plating layer precursor layer was exposed to 30 mJ / cm 2 of high-pressure mercury lamp through an exposure mask. 2After the ultraviolet irradiation, the protective film was peeled off from the substrate with the plated layer precursor layer. The substrate with the plated layer precursor layer from which the protective film had been peeled off was shower-washed with a 1 mass % aqueous sodium carbonate solution, and subjected to an alkali development treatment to obtain a substrate with a plated layer. The formed plating layer had a shape corresponding to the mesh-like touch sensing electrode 11, the electrode connection terminal 12, the peripheral wiring 13, and the external connection terminal .

[0094] (Preparation of substrate with copper plating layer (touch sensor)) The Pd catalyst imparting solution "Omni-Shield 1573 Activator" (Rohm and Haas Electronic Materials Co., Ltd.) was diluted with pure water to 4.8% by volume, and the pH (hydrogen ion exponent) was adjusted to 4 with 0.1 N hydrochloric acid. In this aqueous solution, the substrate with the plated layer was immersed for 8 minutes at a temperature of 45°C. The substrate with the plated layer was then washed twice with pure water. Next, the substrate with the plated layer was immersed in a 0.8% by volume aqueous solution of the reducing agent "Circuposit PB Oxide Converter 60C" (manufactured by Rohm and Haas Electronic Materials Co., Ltd.) at a temperature of 30°C for 5 minutes. After that, the substrate with the plated layer was washed twice with pure water and subjected to Pd catalyst treatment.

[0095] The substrate with the plated layer that had been subjected to Pd catalyst treatment was immersed for 30 minutes at a temperature of 50°C in an electroless plating solution obtained by mixing 12 volume % of M agent, 6 volume % of A agent, and 10 volume % of B agent of "Circuposit 4500" (manufactured by Rohm and Haas Electronic Materials Co., Ltd.). The substrate that had been treated with the electroless plating solution was then washed with pure water to obtain a substrate with a copper plating layer (touch sensor) having a copper plating layer covering the plated layer. 3, the obtained touch sensor had a conductive layer including a plurality of touch detection electrodes 11, a plurality of electrode connection terminals 12, a plurality of peripheral wirings 13, and a plurality of external connection terminals 14. In the obtained touch sensor, the line width L of each peripheral wiring was 35 μm, and the distance S between two adjacent peripheral wirings was 35 μm.

[0096] [Example 2] The touch sensor of Example 2 was manufactured in the same manner as Example 1, except that in the process of forming the base layer, the base layer B was formed using the above-mentioned composition B as a composition for forming the base layer, and in the process of producing a substrate with a plated layer, a substrate having a base layer B was used.

[0097] [Example 3] The touch sensor of Example 3 was manufactured in the same manner as Example 1, except that in the base layer forming step, base layer C was formed using the above-mentioned composition C as a composition for forming the base layer, and in the production step of the substrate with the plated layer, a substrate having base layer C was used and an exposure mask having an exposure pattern shaped to form a copper plating layer having a conductive pattern in which the line width L and distance S of the peripheral wiring were both 30 μm was used.

[0098] [Example 4] The touch sensor of Example 4 was manufactured in the same manner as Example 1, except that in the base layer forming step, base layer D was formed using the above-mentioned composition D as a composition for forming a base layer, and in the production step of a substrate with a plated layer, a substrate having base layer D was used and an exposure mask having an exposure pattern shaped to form a copper plating layer having a conductive pattern in which the line width L and distance S of the peripheral wiring were both 15 μm was used.

[0099] [Example 5] The touch sensor of Example 5 was manufactured in the same manner as Example 4, except that in the process of preparing the substrate with the plated layer, an exposure mask having an exposure pattern shaped to form a copper plating layer having a conductive pattern with peripheral wiring line width L and distance S both of 10 μm was used.

[0100] [Example 6] The touch sensor of Example 6 was manufactured in the same manner as Example 1, except that in the base layer forming step, base layer E was formed using the above-mentioned composition E as a composition for forming the base layer, and in the production step of the substrate with the plated layer, a substrate having base layer E was used and an exposure mask having an exposure pattern shaped to form a copper plating layer having a conductive pattern in which the line width L and distance S of the peripheral wiring were both 15 μm was used.

[0101] [Comparative Example 1] The touch sensor of Comparative Example 1 was manufactured in the same manner as in Example 1, except that in the process of forming the base layer, the base layer F was formed using the above-mentioned composition F as a composition for forming the base layer, and in the process of producing the substrate with the plated layer, a substrate having the base layer F was used.

[0102] [Comparative Example 2] The touch sensor of Comparative Example 2 was manufactured in the same manner as in Example 1, except that in the base layer forming step, base layer F was formed using the above-mentioned composition F as a composition for forming a base layer, and in the production step of a substrate with a plated layer, a substrate having base layer F was used and an exposure mask having an exposure pattern shaped to form a copper plating layer having a conductive pattern in which the line width L and distance S of the peripheral wiring were both 15 μm was used.

[0103] [Comparative Example 3] The touch sensor of Comparative Example 3 was manufactured in the same manner as in Example 1, except that in the base layer forming step, base layer G was formed using the above-mentioned composition G as a composition for forming the base layer, and in the production step of the substrate with the plated layer, a substrate having base layer G was used and an exposure mask having an exposure pattern shaped to form a copper plating layer having a conductive pattern in which the line width L and distance S of the peripheral wiring were both 15 μm was used.

[0104] [Comparative Example 4] The touch sensor of Comparative Example 4 was manufactured in the same manner as in Example 1, except that in the base layer forming step, base layer H was formed using the above-mentioned composition H as a composition for forming a base layer, and in the production step of a substrate with a plated layer, a substrate having base layer H was used and an exposure mask having an exposure pattern shaped to form a copper plating layer having a conductive pattern in which the line width L and distance S of the peripheral wiring were both 15 μm was used.

[0105] [Measurement, Evaluation] The touch sensors of the examples and comparative examples thus manufactured were subjected to the following measurements and evaluations.

[0106] (Water contact angle on the substrate surface) For the substrates prepared in each of the Examples and Comparative Examples, the water contact angle (unit: °) was measured on the surface on the side on which the conductive layer was formed (i.e., the undercoat layer side). The water contact angle was measured using a contact angle meter ("DM500" manufactured by Kyowa Interface Science Co., Ltd.) according to the above-mentioned sessile drop method. Table 2, which will be described later, shows the measurement results of the water contact angle on the substrate surface in each of the examples and comparative examples.

[0107] (Migration evaluation) In order to evaluate migration in each touch sensor, a migration test sample having conductive thin wires made of a plated layer and a copper plating layer was prepared in the same manner as described in each example, except that a photomask corresponding to a migration test pattern conforming to IPC-TM650 or SM840 was used instead of the exposure mask used in the above (preparation of a substrate with a plated layer). The line width and space width of the conductive thin wire pattern in the migration test sample were the same as the line width L and distance S in each example and each comparative example, and the number of lines was 17 / 18 (hereinafter referred to as a comb-shaped pattern electrode).

[0108] In the migration test sample, both ends of the conductive thin wire were connected to wiring. Next, as a migration test, while the sample was left standing in a humid and hot atmosphere of 85°C and 85% RH, a direct current was continuously passed through the conductive thin wire of the sample via the wiring, thereby applying a voltage of 20 V between both ends of the conductive thin wire. After a specified time had elapsed since the start of the test, the sample was removed from the 85°C, 85% RH atmosphere, and the insulation resistance of the conductive thin wire was measured when a direct current of 18 V was applied using a digital ultra-high resistance / microammeter (Advantest Corporation, "R8340A"). Based on the time elapsed from the start of the test and the measured value of the insulation resistance of the conductive thin wire, the migration of the conductive thin wire in the sample was evaluated according to the following criteria. 10 The longer the time that the resistance is above 10Ω, the better the migration suppression performance. In each of the examples and comparative examples, the insulation resistance value of the sample before the test was measured by the above method was 10 10 It was more than Ω.

[0109] -Migration evaluation criteria- "A": The insulation resistance value is 10 10 It was more than Ω. "B": The insulation resistance value after 500 hours from the start of the test is 10 10 Ω or more, but after 1000 hours the insulation resistance was 10 10 It was less than Ω. "C": The insulation resistance value is 10 500 hours after the start of the test. 10 It was less than Ω.

[0110] (Conductivity evaluation) For each touch sensor manufactured in each example and comparative example, 10 peripheral wires were randomly selected, and the resistance between both ends of the selected peripheral wires was measured. The peripheral wires whose measured resistance value was 1 kΩ or more were determined to be "defective wires," and the number of such wires was counted. For each example and comparative example, 50 touch sensors fabricated in the same manner were measured and evaluated according to the above method, and the failure rate was calculated from the ratio of the number of defective wirings to the total number of measured peripheral wirings. From the resulting failure rate, the conductivity of the touch sensor was evaluated based on the following criteria.

[0111] -Conductivity evaluation criteria- "A": Defective rate is 0.5% or less. "B": Defective rate is more than 0.5% and less than 1.0%. "C": Defective rate is more than 1.0% and less than 1.5%. "D": Defective rate is more than 1.5% and less than 2.0%. "E": Defective rate is over 2.0%.

[0112] Table 2 shows the configuration of each touch sensor and the evaluation results.

[0113] [Table 2]

[0114] From the results in Table 2, it was confirmed that in the touch sensor of the present invention, the decrease in conductivity in the peripheral wiring is suppressed, and the occurrence of migration is also suppressed.

[0115] From a comparison of Examples 1 to 5, it was confirmed that when the water contact angle of the substrate is 40° or less, the conductivity of the peripheral wiring is better, when the water contact angle of the substrate is 35° or less, the conductivity of the peripheral wiring is even better, and when the water contact angle of the substrate is 30° or less, the conductivity of the peripheral wiring is particularly good. Furthermore, a comparison between Example 4 and Example 6 confirmed that when the water contact angle of the substrate was 25° or more, the migration suppression performance of the peripheral wiring was superior. [Explanation of symbols]

[0116] 1 Board 1A,1B surface 2 First conductive layer 3 Second conductive layer 11,21 Touch sensing electrode 12,22 Electrode connection terminal 13,23 Peripheral wiring 14,24 External connection terminal L Line width MW fine metal wire MP Pattern R1 Detection area R2 Surrounding Area S distance

Claims

1. A substrate and a conductive layer formed on a surface of the substrate, the conductive layer includes a touch sensing electrode configured with a plurality of thin metal wires arranged in a mesh pattern, an electrode connection terminal electrically connected to the touch sensing electrode, and a peripheral wiring electrically connected to the electrode connection terminal; The peripheral wiring has a plated layer and a metal plating layer covering the plated layer, The water contact angle of the surface of the substrate is 20 to 50°. Touch sensor.

2. The touch sensor of claim 1 , wherein the substrate contains a surfactant.

3. The touch sensor according to claim 2 , wherein the surfactant is a nonionic surfactant.

4. The touch sensor according to claim 3, wherein the surface of the substrate has a water contact angle of 20 to 40°.

5. There are a plurality of the peripheral wirings, 2. The touch sensor of claim 1, wherein in at least a portion of an area on the surface of the substrate where the peripheral wiring is arranged, the peripheral wiring extends in a first direction and is arranged in a second direction perpendicular to the first direction, and a distance S between two adjacent peripheral wirings is 30 μm or less.

6. There are a plurality of the peripheral wirings, 6. The touch sensor of claim 5, wherein in at least a portion of an area on the surface of the substrate where the peripheral wiring is arranged, the peripheral wiring extends in a first direction and is arranged in a second direction perpendicular to the first direction, and the distance S between two adjacent peripheral wirings is 15 μm or less.

7. A touch panel comprising the touch sensor according to any one of claims 1 to 6.

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