System

The system addresses cooling inefficiencies by integrating a cold plate, radiator, and heat exchanger to enhance heat transfer and air circulation, resulting in improved cooling performance for electronic equipment in racks.

JP2025006986APending Publication Date: 2025-01-17NIDEC CORP(JP)
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Patent Information

Application Number
JP2023108080
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Filing Date
2023-06-30
Publication Date
2025-01-17

AI Technical Summary

Technical Problem

Existing cooling systems for electronic equipment in racks suffer from reduced cooling performance due to local heat concentration, necessitating an improvement in cooling efficiency.

Method used

A system incorporating a cold plate in thermal contact with the heat source, a radiator in contact with air, and a heat exchanger that exchanges heat between two different refrigerants to enhance cooling performance.

Benefits of technology

The system effectively improves cooling performance by utilizing a refrigerant loop that enhances heat transfer and air circulation, effectively managing heat dissipation from both high and low heat sources within the rack.

✦ Generated by Eureka AI based on patent content.

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Abstract

To provide a system that cools a heat source within a rack.SOLUTION: A system 100 includes a cold plate 16, a radiator 11, and a heat exchanger 137. The cold plate is in thermal contact with a heat source, and a first refrigerant flows through the cold plate. The radiator is in contact with air in the rack, and a second refrigerant different from the first refrigerant flows through the radiator. The heat exchanger exchanges heat between the radiator, the first refrigerant flowing out of the cold plate, and the second refrigerant.SELECTED DRAWING: Figure 4
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Description

[Technical field]

[0001] The present disclosure relates to a system. [Background technology]

[0002] A rack according to the background art is provided with a system for cooling electronic devices as heat sources. The system includes a radiator on the rear door of the rack. A plurality of fans are provided on the exhaust side of the radiator. In addition, a plurality of heat pipes are provided on the intake side of the radiator. The heat pipes smooth out the heat distribution, thereby suppressing a decrease in cooling capacity due to localized heat concentration (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2012-118781 A Summary of the Invention [Problem to be solved by the invention]

[0004] This type of system requires further improvement in cooling performance (i.e., performance in cooling the heat source).

[0005] It is an object of the present disclosure to provide a system with improved cooling performance. [Means for solving the problem]

[0006] One aspect of the present disclosure is directed to a system for cooling a heat source in a rack. The system includes a cold plate, a radiator, and a heat exchanger. The cold plate is in thermal contact with the heat source. A first refrigerant flows through the cold plate. The radiator is in contact with air in the rack. A second refrigerant different from the first refrigerant flows through the radiator. The system includes a radiator and a heat exchanger that exchanges heat between the first refrigerant flowing out of the cold plate and the second refrigerant.

[0007] Another aspect of the present disclosure is directed to a system for cooling a heat source in a rack. The system includes a cold plate and a radiator. The cold plate is in thermal contact with the heat source. A first refrigerant flows through the cold plate. The radiator is in contact with air in the rack. The first refrigerant flows through the radiator after exiting the cold plate. Effect of the Invention

[0008] According to the present disclosure, the cooling performance of the system is improved. [Brief description of the drawings]

[0009] [Figure 1] FIG. 1 is a diagram showing a system and a cooling device according to a first embodiment. [Diagram 2] FIG. 2 is a plan view of the system and rack shown in FIG. 1 as viewed from one side in a first direction. [Diagram 3] FIG. 3 is a diagram showing a detailed configuration of the rear door and the radiator shown in FIG. [Figure 4] FIG. 4 is a diagram showing a detailed configuration of the system shown in FIG. [Diagram 5] FIG. 5 is a diagram showing a detailed configuration of a system according to a modified example of the first embodiment. [Figure 6] FIG. 6 is a diagram showing a detailed configuration of the system according to the second embodiment. [Figure 7]FIG. 7 is a diagram showing a detailed configuration of a system according to a modified example of the second embodiment. [Figure 8] FIG. 8 is a diagram showing a detailed configuration of a system according to another modified example of the second embodiment. [Figure 9] FIG. 9 is a diagram showing a first configuration example of a first flow passage that connects the radiator and the heat exchanger. [Figure 10] FIG. 10 is a diagram showing a second configuration example of the first flow passage connecting the radiator and the heat exchanger. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] Hereinafter, exemplary embodiments of the present disclosure will be described with reference to the drawings. In the drawings, the same or corresponding parts are designated by the same reference characters and description thereof will not be repeated.

[0011] In each embodiment, for ease of understanding, a first direction Z, a second direction X, and a third direction Y that intersect with each other are appropriately used. In each embodiment, the term "intersect" includes lines, surfaces, or a line and a surface intersecting with each other at a right angle, and intersecting at a non-right angle within a small difference range including tolerances, errors, and the like.

[0012] The first direction Z, the second direction X, and the third direction Y are defined based on a state in which the rack 300 (see FIG. 1) is installed on the installation surface P01 so as to be usable (hereinafter, referred to as a "used state"). In detail, the first direction Z is a direction intersecting the installation surface P01, and is a vertical direction of the rack 300 in the used state. The second direction X is a direction intersecting the front opening 314 and the rear opening 315 formed in the rack 300, and is a front-rear direction of the rack 300. The third direction Y is a direction intersecting each of the first direction Z and the second direction X, and is a left-right direction toward the front opening 314. However, the first direction Z, the second direction X, and the third direction Y are defined merely for convenience of explanation.

[0013] Moreover, one side and the other side of the first direction Z are respectively described as one first direction Z1 and the other first direction Z2. In detail, one side of the first direction Z1 is the upward direction, and the other side of the first direction Z2 is the downward direction. One side and the other side of the second direction X are respectively described as one second direction X1 and the other second direction X2. One side of the second direction X1 is the forward direction, and the other side of the second direction X2 is the backward direction. One side and the other side of the third direction Y are respectively described as one third direction Y1 and the other third direction Y2. One side of the third direction Y1 is the leftward direction, and the other side of the third direction Y2 is the rightward direction.

[0014] Fig. 1 is a diagram showing a system 100 according to a first embodiment and a cooling device 200. Fig. 2 is a plan view of the system 100 and a rack 300 shown in Fig. 1 as viewed from one side Z1 in the first direction. Note that, for ease of understanding, only a part of the system 100 is shown in Fig. 2.

[0015] As shown in FIG. 1 and FIG. 2, the system 100 is typically installed in a space A01 such as a server room. More specifically, the system 100 is provided in a rack 300. The rack 300 has at least a housing 310 and a rear door 320. The housing 310 defines a space A02. A plurality of heat sources 400 (see FIG. 1) are accommodated in the space A02. More specifically, the plurality of heat sources 400 are accommodated so as to be aligned in a first direction Z in the space A02. However, this is not limited to the above, and the plurality of heat sources 400 may be accommodated so as to be aligned in a third direction Y. Furthermore, the number of heat sources 400 is not limited to a plurality, and may be one.

[0016] The heat source 400 is an electronic device such as a rack mount server or a blade server, and includes at least one of a first heat source 401 and a second heat source 402. In an embodiment, the heat source 400 includes both the first heat source 401 and the second heat source 402. Each of the first heat source 401 and the second heat source 402 operates by receiving power and generates heat. The heat value of the first heat source 401 is greater than that of the second heat source 402, and is, for example, a central processing unit (so-called CPU), an electrolytic capacitor, or a power semiconductor module. The second heat source 402 is, for example, a transistor or a diode. The electronic device may be a projector, a personal computer, or a display.

[0017] In this embodiment, the housing 310 has, for example, a bottom wall 311, an upper wall 312, and a pair of side walls 313A and 313B. The bottom wall 311 and the upper wall 312 have the same rectangular shape in a plan view from the first direction Z. The bottom wall 311 and the upper wall 312 are separated from each other in the first direction Z. The side wall 313A is located between an end of the bottom wall 311 in one third direction Y1 and an end of the upper wall 312 in one third direction Y1, and connects the bottom wall 311 and the upper wall 312 to each other. The side wall 313B is located between an end of the bottom wall 311 in the other third direction Y2 and an end of the upper wall 312 in the other third direction Y2, and connects the bottom wall 311 and the upper wall 312 to each other. Note that only a part of the side wall 313B is shown in FIG. 1 to show the inside of the space A02.

[0018] 1 and 2, the housing 310 has a front opening 314 and a rear opening 315. The front opening 314 and the rear opening 315 are spaces surrounded by a front end 316 and a rear end 317 of the housing 310, respectively. Through the front opening 314 and the rear opening 315, the space A02 is opened toward one side X1 of the second direction and the other side X2 of the second direction, respectively. The rear opening 315 is an example of an "opening" in the present disclosure.

[0019] The rear door 320 is provided with the radiator 11. The rear door 320 rotates around a rotation shaft 321 in a circumferential direction θ of the rotation shaft 321 (see FIG. 2). In this way, the rear door 320 opens and closes the rear opening 315. In the embodiment, the rotation shaft 321 extends along a first direction Z. However, this is not limited thereto, and the rotation shaft 321 may extend along a second direction X. In detail, the rear door 320 is attached to a rear end 317 or in the vicinity thereof so that the rear door 320 can rotate in the circumferential direction θ between a closed position P11 (see FIG. 2) and an open position P12.

[0020] In FIG. 2, the rear door 320 in the closed position P11 is indicated by a solid line. On the other hand, the rear door 320 in the open position P12 is indicated by a dashed line. When the rear door 320 is in the closed position P11, the leading end 322 of the rear door 320 abuts against the rear end 317. The leading end 322 is the leading end of the rear door 320 in the centrifugal direction φ1 of the rotation shaft 321 from the rotation shaft 321. The centrifugal direction φ1 is the direction away from the rotation shaft 321 in the radial direction φ of the rotation shaft 321. The centripetal direction φ2 is opposite to the centrifugal direction φ1. When the rear door 320 is in the open position P12, the leading end 322 of the rear door 320 moves away from the rear end 317 in one circumferential direction θ1, which is one of the circumferential directions θ. The other circumferential direction θ2 is opposite to the one circumferential direction θ1.

[0021] The cooling device 200 (see FIG. 1) is installed, for example, outside the space A01. The cooling device 200 may be installed either inside or outside the space A01. The cooling device 200 is, for example, a chiller or a cooling tower. The cooling device 200 includes ports 210 and 220 for a primary refrigerant, a cooling unit 240, and a pump 250.

[0022] The primary refrigerant is, for example, a cooling liquid. Examples of the cooling liquid include an antifreeze liquid or pure water. A typical example of the antifreeze liquid is an ethylene glycol aqueous solution or a propylene glycol aqueous solution. The primary refrigerant may be a gas refrigerant. The primary refrigerant is an example of the "second refrigerant" of the present disclosure.

[0023] In this embodiment, the ports 210 and 220 are an inlet and an outlet of the primary refrigerant. The primary refrigerant that flows into the port 210 flows into the cooling unit 240 through a flow path. The cooling unit 240 cools the primary refrigerant that flows into the cooling unit 240. The cooling method in the cooling unit 240 may be either an air-cooling method or a water-cooling method. The primary refrigerant that flows out of the cooling unit 240 flows into the pump 250 through a flow path. The pump 250 pumps the primary refrigerant that flows into the pump 250 toward the port 220. In FIG. 1, the pump 250 is located between the cooling unit 240 and the port 220 in the flow path of the primary refrigerant. However, the pump 250 may be located between the port 210 and the cooling unit 240 in the flow path of the primary refrigerant.

[0024] The system 100 cools a heat source 400 in a rack 300. The system 100 includes a radiator 11, a fan 12, a CDU 13, a distribution manifold 14, a collection manifold 15, and a cold plate 16. The radiator 11 and the fan 12 are mounted on a rear door 320. The CDU 13, the distribution manifold 14, and the collection manifold 15 are preferably provided in a housing 310 of the rack 300. However, the CDU 13, the distribution manifold 14, and the collection manifold 15 may be provided outside the housing 310. The cold plate 16 is provided so as to be in thermal contact with a first heat source 401.

[0025] Fig. 3 is a diagram showing a detailed configuration of the rear door 320 and the radiator 11 shown in Fig. 1. As shown in Fig. 3, the radiator 11 is built into the rear door 320. In detail, the rear door 320 is formed with a hole 323 penetrating the rear door 320 in a direction D01 intersecting with the radial direction φ (hereinafter referred to as the "intersecting direction").

[0026] The radiator 11 comes into contact with the air (high temperature) inside the rack 300. A primary refrigerant (low temperature) different from the secondary refrigerant flows inside the radiator 11. This allows the radiator 11 to cool the air inside the rack 300. Here, the air inside the rack 300 also means the air exhausted from inside the rack 300 by the operation of the fan 12 (described in detail later).

[0027] In detail, the radiator 11 includes ports 111 and 112 for the primary coolant, a flow passage 113 and a number of fins 114 .

[0028] In this embodiment, the ports 111 and 112 are an inlet and an outlet for the primary refrigerant. The port 111 is connected to a port 220 (see FIG. 1) of the cooling device 200 through a flow path. The port 112 is connected to a port 131 through a flow path. The flow path 113 is a pipe provided in the hole 323. The flow path 113 is made of a material with a relatively high thermal conductivity (e.g., copper or aluminum). The flow path 113 connects the ports 111 and 112 to each other so that the primary refrigerant can flow between them. In detail, the flow path 113 has common flow paths 1131 and 1132 and a plurality of branch flow paths 1133.

[0029] The common flow path 1131 extends, for example, along an end of the rear door 320 on one side in the first direction Z1. The common flow path 1132 extends, for example, along an end of the rear door 320 on the other side in the first direction Z2. Each of the multiple branch flow paths 1133 extends in the first direction Z between the common flow paths 1131, 1132. Furthermore, among the multiple branch flow paths 1133, two branch flow paths 1133 adjacent to each other in the radial direction φ are arranged with an interval in between in the radial direction φ.

[0030] Each of the multiple fins 114 is made of a thin metal plate or the like and is formed, for example, in a corrugated shape. The multiple fins 114 are arranged at intervals in the first direction Z and are in physical contact with the multiple branch flow paths 1133. In addition, each fin 114 and the multiple branch flow paths 1133 define an air passage 115 that penetrates in the intersecting direction D01. Air flows through the multiple air passages 115.

[0031] In Fig. 3, only two branch flow paths are given the reference symbol "1133". Only one fin is given the reference symbol "114". Only one ventilation path is given the reference symbol "115".

[0032] The primary refrigerant that has flowed into port 111 flows in common flow path 1131. Then, the primary refrigerant flows through each branch flow path 1133, and then flows into common flow path 1132. Then, the primary refrigerant flows through common flow path 1132, and then flows out from port 112.

[0033] The fan 12 is, for example, an axial flow fan, and is attached to the rear door 320. The fan 12 rotates an impeller of the fan 12 under the control of the control unit 139. As a result, the fan 12 generates an airflow passing through the ventilation passage 115 (i.e., the radiator 11). That is, the fan 12 exhausts the air inside the housing 310 to the outside of the housing 310 through the ventilation passage 115. As a result, the heat trapped inside the housing 310 by the first heat source 401 and the second heat source 402 moves to the outside of the housing 310. This air-cools the first heat source 401 and the second heat source 402. The performance of the radiator 11 cooling the air inside the rack 300 by the fan 12 is improved compared to the case where the fan 12 is not provided. In detail, this airflow passes through a plurality of branch flow paths 1133 of the radiator 11. That is, the air (high temperature) inside the rack 300 comes into contact with the radiator 11 by the operation of the fan 12.

[0034] The fan 12 may be attached to a portion of the housing 310 other than the rear door 320. The fan 12 may be attached inside the housing 310. By attaching the fan 12 to a plurality of positions in the housing 310, the first heat source 401 and the second heat source 402 are air-cooled satisfactorily.

[0035] Fig. 4 is a diagram showing a detailed configuration of the system 100 shown in Fig. 1. In Fig. 4, a cooling device 200 is shown in addition to the system 100. For ease of understanding, only one cold plate 16 is shown in Fig. 4, and the heat source 400 is not shown.

[0036] 4, the CDU 13 cools the secondary refrigerant and circulates the cooled secondary refrigerant within the system 100. The CDU 13 has, as its components, a housing 130, four ports 131 to 134, a heat exchanger 137, a pump 138, and a control unit 139.

[0037] The housing 130 houses the heat exchanger 137, the pump 138, and the control unit 139. Since the heat exchanger 137, the pump 138, and the control unit 139 are housed together in the housing 130, the installation of the system 100 becomes easy.

[0038] In this embodiment, the ports 131 and 132 are an inlet and an outlet for the primary refrigerant, and are provided in the housing 130. The port 131 is connected to a port 112 of the radiator 11 through a flow path. The port 132 is connected to a port 210 of the cooling device 200 through a flow path.

[0039] The primary refrigerant that has flowed out from port 112 flows into port 131. The primary refrigerant flows through a flow path and from port 1371 of heat exchanger 137 into flow path 1375 of heat exchanger 137. The primary refrigerant then flows through flow path 1375 and flows out from port 1372 of heat exchanger 137. The primary refrigerant further flows out from port 132 through the flow path.

[0040] In this embodiment, ports 133, 134 are an inlet and an outlet for the secondary refrigerant and are provided in the housing 130. The secondary refrigerant may be the same type of refrigerant as the primary refrigerant. However, the secondary refrigerant may be different from the primary refrigerant. The secondary refrigerant is an example of a "first refrigerant" in the present disclosure.

[0041] The port 133 is connected to the outlet of the collection manifold 15. The port 134 is connected to the cold plate 16 through the distribution manifold 14.

[0042] A relatively high temperature secondary refrigerant flows into port 133 from the outlet of collection manifold 15. The secondary refrigerant flows from port 133 through a flow path and into port 1373 of heat exchanger 137. The secondary refrigerant flows from port 1373 through flow path 1376, and then flows out of port 1374 of heat exchanger 137.

[0043] The heat exchanger 137 exchanges heat between the secondary refrigerant flowing out from the cold plate 16 and the primary refrigerant, thereby improving the ability to cool the first heat source 401.

[0044] In detail, the heat exchanger 137 exchanges heat between the secondary refrigerant flowing out from the cold plate 16 and the primary refrigerant flowing out from the radiator 11. In other words, the primary refrigerant at a relatively low temperature flows in the radiator 11. Therefore, the air in the rack 300 is cooled to a relatively low temperature by the primary refrigerant and discharged.

[0045] Specifically, the heat exchanger 137 is, for example, a plate-type heat exchanger, and is provided inside the housing 130. The heat exchanger 137 has ports 1371-1374, flow paths 1375 and 1376, and a plurality of heat transfer plates 1377.

[0046] In this embodiment, the ports 1371 and 1372 are an inlet and an outlet of the primary refrigerant. The flow path 1375 is a pipe provided inside the heat exchanger 137. The flow path 1375 connects the ports 1371 and 1372 to each other so that a medium-temperature primary refrigerant can flow between them. Therefore, in this embodiment, the primary refrigerant (medium temperature) flowing out from the radiator 11 flows through the flow path 1375.

[0047] In this embodiment, the ports 1373 and 1374 are an inlet and an outlet of the secondary refrigerant. The flow path 1376 is a pipe provided inside the heat exchanger 137. The flow path 1376 connects the ports 1373 and 1374 to each other so that the primary refrigerant (high temperature) can flow between them. Therefore, in this embodiment, the secondary refrigerant (high temperature) flowing out from each cold plate 16 flows through the flow path 1376.

[0048] The heat transfer plates 1377 are arranged at intervals from one another in the heat exchanger 137. The flow paths 1375 and 1376 are inserted through through holes formed in the heat transfer plates 1377 while being physically isolated from one another in the heat exchanger 137. Thus, heat exchange is performed between the primary refrigerant (medium temperature) flowing through the flow path 1375 and the secondary refrigerant (high temperature) flowing through the flow path 1376 through the heat transfer plates 1377. As a result, the secondary refrigerant is cooled to a lower temperature when it flows out of the port 1374 compared to when it flows into the port 1373. On the other hand, the primary refrigerant is heated to a higher temperature when it flows out of the port 1372 compared to when it flows into the port 1371.

[0049] The secondary refrigerant (low temperature) flowing out from port 1374 flows into pump 138. Under the control of control unit 139, pump 138 pumps the secondary refrigerant that has flowed into pump 138 toward port 134. Thus, the secondary refrigerant circulates within system 100. In FIG. 1, pump 138 is located between heat exchanger 137 and port 134 in the flow path of the secondary refrigerant. However, pump 138 may be located between port 133 and heat exchanger 137 in the flow path of the secondary refrigerant.

[0050] The distribution manifold 14 has a common flow path 141 and a plurality of individual flow paths 142 (see FIG. 1). In FIG. 1, for ease of understanding, only two individual flow paths are denoted by the reference symbol "142". A secondary refrigerant can flow through each of the common flow path 141 and the plurality of individual flow paths 142. One end of each individual flow path 142 is connected to the common flow path 141 so that the secondary refrigerant can flow through it. The other end of one of the plurality of individual flow paths 142 is used as an inlet for the secondary refrigerant in the distribution manifold 14 and is connected to the port 134 (see FIG. 4). The other ends of the remaining individual flow paths 142 are used as outlets for the secondary refrigerant in the distribution manifold 14 and are individually connected to the cold plate 16 (see FIG. 4). Therefore, the secondary refrigerant (low temperature) that flows into the inlet flows from one of all the individual flow paths 142 to the common flow path 141, is divided by the remaining individual flow paths 142, and then flows out from each outlet.

[0051] The collection manifold 15 has a plurality of individual flow paths 151 and a common flow path 152. A secondary refrigerant can flow through each of the plurality of individual flow paths 151 and the common flow path 152. One end of each individual flow path 151 is connected to the common flow path 152 so that the secondary refrigerant can flow through it (see FIG. 4). The other end of one of all the individual flow paths 151 is used as an outlet of the secondary refrigerant in the collection manifold 15 and is connected to the port 133. The other ends of the remaining individual flow paths 151 are individually connected to the cold plate 16 as inlets of the secondary refrigerant in the collection manifold 15. Therefore, the secondary refrigerant that flows from the cold plate 16 into each inlet of the individual flow paths 151 joins in the common flow path 152 and flows out from the outlet of the individual flow path 151 toward the port 133.

[0052] Each cold plate 16 is in thermal contact with at least one first heat source 401. Each cold plate 16 may be in thermal contact with a plurality of first heat sources 401. Also, each cold plate 16 may be in thermal contact with the first heat source 401 and the second heat source 402. A secondary refrigerant flows through each cold plate 16. In detail, each cold plate 16 is arranged so as to be in direct thermal contact with the first heat source 401 (see FIG. 1). Each cold plate 16 may be arranged so as to be in thermal contact with the first heat source 401 via a heat conductive sheet (not shown). That is, the term "thermal contact" includes the meanings of "thermal direct contact" and "thermal indirect contact".

[0053] Each cold plate 16 has an inlet and an outlet for the secondary refrigerant. A refrigerant flow path (not shown) is provided inside the cold plate 16 from the inlet to the outlet. The secondary refrigerant (low temperature) flows into the inlet from the individual flow paths 142 connected to the outlet. The secondary refrigerant flows through the flow paths in the cold plate 16 toward the outlet. Therefore, heat generated in the first heat source 401 is transferred to the secondary refrigerant flowing through the cold plate 16 in thermal contact with the first heat source 401. As a result, the first heat source 401 is cooled and the secondary refrigerant becomes hot. The secondary refrigerant (high temperature) flows out from the outlet into the individual flow paths 151 of the collection manifold 15.

[0054] In the embodiment, the first heat source 401, which generates more heat than the second heat source 402, is cooled by the cold plate 16. The airflow generated by the fan 12 exhausts heat inside the rack 300 to the outside of the rack 300. This allows both the first heat source 401 and the second heat source 402 to be air-cooled. That is, the first heat source 401, which is difficult to sufficiently cool by the fan 12 alone, is cooled by the cold plate 16. Therefore, according to the embodiment, it is possible to provide a system 100 with improved cooling performance.

[0055] The control unit 139 includes a microcomputer and a memory. In the control unit 139, the microcomputer operates according to a program stored in the memory. In this way, the control unit 139 controls the operations of the pump 138 and the fan 12. This simplifies the configuration of the system 100 compared to a case in which a control unit for controlling the operation of the pump 138 and a control unit for controlling the operation of the fan 12 are provided separately.

[0056] The system 100 and the cooling device 200 may be provided with temperature sensors (not shown) for detecting the temperatures of the primary refrigerant and the secondary refrigerant. In addition, another temperature sensor (not shown) for detecting the temperature inside the rack 300 may be provided. The control unit 139 controls the operation of at least one of the pump 138 and the fan 12 based on the temperatures detected by the temperature sensors. This makes it easy to adjust the cooling capacity of the system 100.

[0057] Fig. 5 is a diagram showing a detailed configuration of a system 100 according to a modification of the first embodiment (hereinafter, referred to as "first modification"). In Fig. 5, for ease of understanding, only one cold plate 16 is shown, and the heat source 400 is not shown.

[0058] As shown in Fig. 5, the CDU 13 of the first modified example is similar in terms of components to the CDU 13 of the first embodiment. In Fig. 5, a cooling device 200 is shown in addition to the system 100.

[0059] In this modification, ports 131 and 132 in the CDU 13 are an outlet and an inlet for the primary refrigerant. The port 132 is connected to a port 220 of the cooling device 200 through a flow path. The port 131 is connected to a port 111 of the radiator 11 through a flow path.

[0060] The primary refrigerant that has flowed out from port 220 flows into port 132. The primary refrigerant flows through a flow path and from port 1372 of heat exchanger 137 into flow path 1375 of heat exchanger 137. The primary refrigerant then flows through flow path 1375 and flows out from port 1371 of heat exchanger 137. The primary refrigerant further flows out from port 131 through the flow path.

[0061] The heat exchanger 137 exchanges heat between the secondary refrigerant flowing out from the cold plate 16 and the primary refrigerant. In particular, the heat exchanger 137 exchanges heat between the secondary refrigerant flowing out from the cold plate 16 and the primary refrigerant flowing out from the cooling device 200. In other words, the primary refrigerant at a relatively low temperature flows in the flow path 1375 of the heat exchanger 137. Therefore, the secondary refrigerant flowing out from the cold plate 16 and flowing in the flow path 1376 is cooled to a relatively low temperature by the primary refrigerant and discharged. As a result, the ability of the system 100 to cool the first heat source 401 in thermal contact with the cold plate 16 is improved.

[0062] In this embodiment, the ports 111 and 112 are an inlet and an outlet of the primary refrigerant. The port 111 is connected to a port 131 of the CDU 13 through a flow path. The port 112 is connected to a port 210 of the cooling device 200 through a flow path. The primary refrigerant that has flowed into the port 111 flows through the common flow path 1131 of the radiator 11. The primary refrigerant then flows through each branch flow path 1133, and then flows into the common flow path 1132. The primary refrigerant then flows through the common flow path 1132, and then flows out of the port 112.

[0063] The fan 12 generates an airflow in the multiple ventilation paths 115, which passes through the ventilation paths 115 (i.e., the radiator 11). Here, the primary refrigerant flowing through the radiator 11 is cooled or heated by the air in the rack 300. When the temperature of the primary refrigerant is raised, the cooled air is discharged outside the rack 300. Therefore, it is possible to suppress a temperature rise in the space A01. On the other hand, when the primary refrigerant is cooled, the primary refrigerant is cooled more efficiently in the cooling device 200.

[0064] The air inside the rack 300 is exhausted to the outside of the rack 300 together with the heat inside the rack 300 by the fan 12. As a result, both the first heat source 401 and the second heat source 402 are air-cooled. The first heat source 401, which is difficult to sufficiently cool by the fan 12 alone, is cooled by the cold plate 16. Therefore, by combining the fan 12 and the cold plate 16, it is possible to provide a system 100 with improved cooling performance.

[0065] Fig. 6 is a diagram showing a detailed configuration of the system 100 according to the second embodiment. In Fig. 6, for ease of understanding, only one cold plate 16 is shown, and the heat source 400 is not shown.

[0066] As shown in FIG. 6, the system 100 of the second embodiment differs from the system 100 of the first embodiment in that the system 100 does not include a cooling device 200 and that the CDU 13 does not include a heat exchanger 137.

[0067] The ports 133 and 134 are an inlet and an outlet of the secondary refrigerant in this embodiment, similarly to the first embodiment. The port 133 is connected to the port 112 of the radiator 11 through a flow passage. The port 134 is connected to the inlet of the distribution manifold 14.

[0068] The collection manifold 15 has a plurality of individual flow paths 151 and a common flow path 152. The secondary refrigerant can flow through each of the plurality of individual flow paths 151 and the common flow path 152. One end of each individual flow path 151 is connected to the common flow path 152 so that the secondary refrigerant can flow through it (see FIG. 4). The other end of one of all the individual flow paths 151 is used as an outlet of the secondary refrigerant in the collection manifold 15 and is connected to the port 111 of the radiator 11. The other ends of the remaining individual flow paths 151 are individually connected to the cold plate 16 as inlets of the secondary refrigerant in the collection manifold 15. Therefore, the secondary refrigerant that flows from the cold plate 16 into each inlet of the individual flow paths 151 joins in the common flow path 152 and flows out from the outlet of the individual flow path 151 toward the port 111.

[0069] The pump 138, under the control of the control unit 139, pumps the secondary refrigerant (low temperature) cooled by the radiator 11 toward the port 134 (i.e., the cold plate 16). Therefore, the secondary refrigerant at a relatively low temperature flows through the cold plate 16, improving the ability of the system 100 to cool the first heat source 401 (see FIG. 1).

[0070] Fig. 7 is a diagram showing a detailed configuration of a system 100 according to a modified example of the second embodiment (hereinafter, referred to as "second modified example"). In Fig. 7, a cooling device 200 is shown in addition to the system 100. In Fig. 7, for ease of understanding, only one cold plate 16 is shown, and the heat source 400 is not shown.

[0071] As shown in FIG. 7, the CDU 13 of the second modified example is similar in components to the CDU 13 of the first embodiment.

[0072] In this embodiment, the ports 131 and 132 are an inlet and an outlet of the primary refrigerant, and are connected to ports 220 and 210 of the cooling device 200, respectively, through flow paths.

[0073] The primary refrigerant that has flowed out from port 220 flows into port 131. The primary refrigerant flows through a flow path and from port 1371 of heat exchanger 137 into flow path 1375 of heat exchanger 137. The primary refrigerant then flows through flow path 1375 and flows out from port 1372 of heat exchanger 137. The primary refrigerant further flows out from port 132 through the flow path.

[0074] In the second modified example, ports 133 and 134 are an inlet and an outlet of the secondary refrigerant, similar to the first embodiment. The port 133 is connected to the port 112 of the radiator 11 through a flow path. The port 134 is connected to the inlet of the distribution manifold 14. Therefore, the secondary refrigerant flows through the heat exchanger 137, similar to the first embodiment.

[0075] The collection manifold 15 has a plurality of individual flow paths 151 and a common flow path 152. The secondary refrigerant can flow through each of the plurality of individual flow paths 151 and the common flow path 152. One end of each individual flow path 151 is connected to the common flow path 152 so that the secondary refrigerant can flow through it (see FIG. 4). The other end of one of all the individual flow paths 151 is used as an outlet of the secondary refrigerant in the collection manifold 15 and is connected to the port 111 of the radiator 11. The other ends of the remaining individual flow paths 151 are individually connected to the cold plate 16 as inlets of the secondary refrigerant in the collection manifold 15. Therefore, the secondary refrigerant that flows from the cold plate 16 into each inlet of the individual flow paths 151 joins in the common flow path 152 and flows out from the outlet of the individual flow path 151 toward the port 111.

[0076] The heat exchanger 137 is located downstream of the radiator 11 and upstream of the cold plate 16 in the flow path of the secondary refrigerant. The heat exchanger 137 exchanges heat between the secondary refrigerant (high temperature) flowing out from the radiator 11 and a primary refrigerant different from the secondary refrigerant. In this embodiment, the primary refrigerant flows out from the cooling device 200. Therefore, in the heat exchanger 137, the secondary refrigerant from the radiator 11 is cooled to a relatively low temperature by the primary refrigerant. Since the relatively low-temperature secondary refrigerant flows through the cold plate 16, the ability of the system 100 to cool the first heat source 401 is improved.

[0077] The pump 138, under the control of the control unit 139, pumps the secondary refrigerant (low temperature) flowing out of the heat exchanger 137 toward the port 134 (i.e., the cold plate 16). Therefore, since a relatively low-temperature secondary refrigerant flows through the cold plate 16, the ability of the system 100 to cool the first heat source 401 is improved.

[0078] Fig. 8 is a diagram showing a detailed configuration of a system 100 according to another modified example (hereinafter, referred to as a "third modified example") of the second embodiment. In Fig. 8, a cooling device 200 is shown in addition to the system 100. In Fig. 8, for ease of understanding, only one cold plate 16 is shown, and the heat source 400 is not shown.

[0079] As shown in FIG. 8, the CDU 13 of the second modified example is similar in components to the CDU 13 of the first embodiment.

[0080] In this modification, the ports 131 and 132 are an inlet and an outlet for the primary refrigerant, and are connected to ports 220 and 210 of the cooling device 200, respectively, through flow paths.

[0081] The primary refrigerant that has flowed out from port 220 flows into port 131. The primary refrigerant flows through a flow path and from port 1371 of heat exchanger 137 into flow path 1375 of heat exchanger 137. The primary refrigerant then flows through flow path 1375 and flows out from port 1372 of heat exchanger 137. The primary refrigerant further flows out from port 132 through the flow path.

[0082] The ports 133 and 134 are an inlet and an outlet of the secondary refrigerant, similar to the first embodiment. The port 133 is connected to an inlet of the distribution manifold 14. The port 134 is connected to the port 112 of the radiator 11 through a flow path. Therefore, the secondary refrigerant flows through the heat exchanger 137, similar to the first embodiment.

[0083] In the distribution manifold 14, the secondary refrigerant can flow through each of the common flow path 141 and the multiple individual flow paths 142. Note that, for ease of viewing, FIG. 7 shows only two individual flow paths 142. One end of each individual flow path 142 is connected to the common flow path 141 so that the secondary refrigerant can flow through it. The other end of one of the multiple individual flow paths 142 is used as an inlet for the secondary refrigerant in the distribution manifold 14 and is connected to the port 112 of the radiator 11. The other ends of the remaining individual flow paths 142 are used as outlets for the secondary refrigerant in the distribution manifold 14 and are individually connected to the cold plate 16. Therefore, the secondary refrigerant (low temperature) that flows into the inlet flows from one of all the individual flow paths 142 to the common flow path 141, is diverted by the remaining individual flow paths 142, and then flows out from each outlet.

[0084] In the collection manifold 15, the secondary refrigerant can flow through each of the multiple individual flow paths 151 and the common flow path 152. Note that, for ease of illustration, only two individual flow paths 151 are shown in FIG. 7. One end of each individual flow path 151 is connected to the common flow path 152 so that the secondary refrigerant can flow through it. The other end of one of all the individual flow paths 151 is used as an outlet for the secondary refrigerant in the collection manifold 15 and is connected to the port 133 of the CDU 13. The other ends of the remaining individual flow paths 151 are individually connected to the cold plate 16 as inlets for the secondary refrigerant in the collection manifold 15. Therefore, the secondary refrigerant that flows from the cold plate 16 into each inlet of the individual flow paths 151 joins with the common flow path 152 and flows out from the outlet of the individual flow path 151 toward the port 133.

[0085] The heat exchanger 137 is located downstream of the cold plate 16 and upstream of the radiator 11 in the flow path of the secondary refrigerant. The heat exchanger 137 exchanges heat between the secondary refrigerant (high temperature) flowing out from the cold plate 16 and a primary refrigerant different from the secondary refrigerant. In this modification, the primary refrigerant flows out from the cooling device 200. Therefore, in the heat exchanger 137, the secondary refrigerant from the cold plate 16 is cooled to a relatively low temperature by the primary refrigerant. As a result, the primary refrigerant (low temperature) flows through the radiator 11, and thus the discharge of high-temperature air outside the rack 300 is suppressed.

[0086] FIG. 9 is a diagram showing a first configuration example of the first flow passage 17 connecting the radiator 11 and the heat exchanger 137 shown in FIG.

[0087] As shown in FIG. 9, the system 100 further includes a first flow path 17. The first flow path 17 is connected to the radiator 11. A primary refrigerant flows through the first flow path 17. The first flow path 17 has an upstream portion 171 and a downstream portion 172. The upstream portion 171 and the downstream portion 172 are examples of "portions" in the present disclosure. The upstream portion 171 and the downstream portion 172 are made of hard resin or metal. One end of the upstream portion 171 and the downstream portion 172 are connected to the common flow paths 1131 and 1132 of the radiator 11 so that the radiator 11 can rotate around the rotation axis 321. The other end of the upstream portion 171 is connected to the port 220 of the cooling device 200. The other end of the downstream portion 172 is connected to the port 131 of the CDU 13. The upstream portion 171 and the downstream portion 172 are realized by, for example, a swivel joint. The upstream portion 171 and the downstream portion 172 allow the primary refrigerant to be circulated between the cooling device 200 , the radiator 11 and the heat exchanger 137 .

[0088] FIG. 10 is a diagram showing a second configuration example of the first flow passage 17 connecting the radiator 11 and the heat exchanger 137 shown in FIG.

[0089] As shown in FIG. 10, the system 100 further includes a first flow path 17. The first flow path 17 is connected to the radiator 11. A primary refrigerant flows through the first flow path 17. The first flow path 17 has an upstream portion 171 and a downstream portion 172. The upstream portion 171 and the downstream portion 172 are other examples of a "portion" in the present disclosure. The upstream portion 171 and the downstream portion 172 are made of flexible resin or metal, and are portions that bend in response to the opening and closing of the rear door 320. One end of the upstream portion 171 and the downstream portion 172 are connected to the common flow paths 1131 and 1132 of the radiator 11. The other end of the upstream portion 171 is connected to the port 220 of the cooling device 200. The other end of the downstream portion 172 is connected to the port 131 of the CDU 13. The upstream portion 171 and the downstream portion 172 allow the primary refrigerant to be circulated between the cooling device 200 , the radiator 11 and the heat exchanger 137 .

[0090] In the first and second configuration examples, assuming that the primary refrigerant leaks from the upstream portion 171 and the downstream portion 172 and that condensation occurs in the upstream portion 171 and the downstream portion 172, it is preferable to place, for example, a tray-shaped receiving member at a position on the other side Z2 of the first direction of the upstream portion 171 and the downstream portion 172.

[0091] In addition, the drawings are mainly schematic illustrations of each component to facilitate understanding of the present disclosure, and the thickness, length, number, spacing, etc. of each illustrated component may differ from the actual ones due to the convenience of creating the drawings. In addition, the configurations of each component shown in the above embodiment are merely examples and are not particularly limited, and it goes without saying that various modifications are possible within a range that does not substantially deviate from the effects of the present disclosure.

[0092] In each of the embodiments and modifications, the radiator 11 is provided in the rear door 320. However, this is not limiting, and the radiator 11 may be provided in the housing 310.

[0093] The present technology can also adopt the following configuration.

[0094] (1) A system for cooling a heat source in a rack, comprising: a cold plate in thermal contact with the heat source and through which a first refrigerant flows; a radiator that contacts the air in the rack and through which a second refrigerant different from the first refrigerant flows; a heat exchanger for exchanging heat between the first refrigerant flowing out from the cold plate and the second refrigerant; A system comprising:

[0095] (2) The system described in (1), wherein the heat exchanger exchanges heat between the first refrigerant flowing out of the cold plate and the second refrigerant flowing out of the radiator.

[0096] (3) the heat exchanger performs heat exchange between the first refrigerant flowing out of the cold plate and the second refrigerant, The system according to (1), wherein the second refrigerant flowing out of the heat exchanger flows through the radiator.

[0097] (4) The rack is A housing having an opening; a door provided with the radiator and configured to rotate about a rotation axis to open and close the opening; Equipped with A first flow passage connecting the radiator and the heat exchanger and through which the second refrigerant flows is further provided. The system according to any one of (1) to (3), wherein the first flow path has a portion that connects the radiator and the heat exchanger so that the radiator can rotate around the rotation axis.

[0098] (5) The rack is A housing having an opening; a door provided with the radiator and configured to rotate about a rotation axis to open and close the opening; Equipped with A first flow passage connecting the radiator and the heat exchanger and through which the second refrigerant flows is further provided. The system according to any one of (1) to (3), wherein the first flow path includes a portion between the radiator and the heat exchanger that bends in response to opening and closing of the door.

[0099] (6) A system for cooling a heat source in a rack, comprising: a cold plate in thermal contact with the heat source and through which a first refrigerant flows; a radiator that comes into contact with the air in the rack and through which the first refrigerant that flows out from the cold plate flows; A system comprising:

[0100] (7) The system described in (6), further comprising a heat exchanger located downstream of the radiator and upstream of the cold plate in a flow path of the first refrigerant, performing heat exchange between the first refrigerant flowing out of the radiator and a second refrigerant different from the first refrigerant.

[0101] (8) The system described in (7), further comprising a pump that pumps the first refrigerant flowing out of the heat exchanger to the cold plate.

[0102] (9) The system described in (6), further comprising a heat exchanger located downstream of the cold plate and upstream of the radiator in a flow path of the first refrigerant, the heat exchanger performing heat exchange between the first refrigerant flowing out of the cold plate and a second refrigerant flowing therethrough.

[0103] (10) a pump that pumps the first refrigerant; a housing that houses the pump and the heat exchanger; The system according to any one of (1) to (9), further comprising: (11) The system described in any one of (1) to (10), further comprising a fan that generates an airflow passing through the radiator.

[0104] (12) a pump that pumps the first refrigerant; a fan that generates an airflow that passes through the radiator; a control unit for controlling the operation of the pump and the fan; The system according to any one of (1) to (12), further comprising: [Industrial Applicability]

[0105] The system according to the present disclosure is capable of cooling a heat source and has industrial applicability. [Explanation of symbols]

[0106] 100: System 11: Radiator 12: Fan 13 :CDU 130: Housing 137:Heat exchanger 138: Pump 139: Control section 16: Cold plate 300: Rack 310: Housing 311: Bottom wall 312: Upper wall 313A: Side wall 313B: Side wall 314: Front opening 315: Rear opening 320: Rear door 321: Rotation axis 322: Tip 323 :hole 400: Heat source

Claims

1. 1. A system for cooling a heat source in a rack, comprising: a cold plate in thermal contact with the heat source and through which a first refrigerant flows; a radiator that contacts the air in the rack and through which a second refrigerant different from the first refrigerant flows; a heat exchanger for exchanging heat between the first refrigerant flowing out from the cold plate and the second refrigerant; A system comprising:

2. The system of claim 1 , wherein the heat exchanger exchanges heat between the first refrigerant exiting the cold plate and the second refrigerant exiting the radiator.

3. The heat exchanger performs heat exchange between the first refrigerant flowing out of the cold plate and the second refrigerant, The system of claim 1 , wherein the radiator has the second refrigerant flowing therethrough from the heat exchanger.

4. The rack is A housing having an opening; a door provided with the radiator and configured to rotate about a rotation axis to open and close the opening; Equipped with A first flow path connected to the radiator through which the second refrigerant flows, The system of claim 1 , wherein the first flow path has a portion to which the radiator is rotatably connected about the axis of rotation.

5. The rack is A housing having an opening; a door provided with the radiator and configured to rotate about a rotation axis to open and close the opening; Equipped with A first flow path connected to the radiator through which the second refrigerant flows, The system of claim 1 , wherein the first flow path includes a portion that bends in response to opening and closing of the door.

6. 1. A system for cooling a heat source in a rack, comprising: a cold plate in thermal contact with the heat source and through which a first refrigerant flows; a radiator that comes into contact with the air in the rack and through which the first refrigerant that flows out from the cold plate flows; A system comprising:

7. 7. The system according to claim 6, further comprising a heat exchanger located downstream of the radiator and upstream of the cold plate in a flow path of the first refrigerant, the heat exchanger performing heat exchange between the first refrigerant flowing out of the radiator and a second refrigerant different from the first refrigerant.

8. The system of claim 7 further comprising a pump for pumping the first refrigerant exiting the heat exchanger to the cold plate.

9. 7. The system according to claim 6, further comprising a heat exchanger located downstream of the cold plate and upstream of the radiator in a flow path of the first refrigerant, the heat exchanger performing heat exchange between the first refrigerant flowing out of the cold plate and a second refrigerant different from the first refrigerant.

10. A pump that pumps the first refrigerant; a housing that houses the pump and the heat exchanger; The system according to any one of claims 1 to 3, 6 and 7, further comprising:

11. 8. The system of claim 1, further comprising a fan for generating airflow through the radiator.

12. A pump that pumps the first refrigerant; a fan that generates an airflow that passes through the radiator; a control unit for controlling the operation of the pump and the fan; The system of any one of claims 1 to 3, claim 6 and claim 7, further comprising:

Citation Information

Patent Citations

  • Rack for electronic equipment and data center

    JP2012118781A