Manufacturing method of RF tags and packaging

Abstract

To provide an RF tag that is difficult to be detected by both magnetic field metal detection and X-ray metal detection, a method for manufacturing packaging using the same, and a method related to product distribution.SOLUTION: An RF tag includes a substrate, an antenna portion disposed on the substrate, and a semiconductor element disposed on the substrate and electrically connected to the antenna portion, and the antenna portion is made of a thin metal wire having a line width of 0.25 μm or more and 200 μm or less, and the electrical conductivity of the antenna portion is 4.2×102 S / m or more and 4.2×106 S / m or less.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a method for manufacturing an RF tag and a package. [Background technology]

[0002] Transparent antennas are used in various situations. For example, a film antenna that is installed on the windshield of an automobile is known as an antenna for receiving various radio waves such as television radio waves and FM radio waves, and radio waves related to position coordinate information from GPS (Global Positioning System) satellites used in car navigation systems.

[0003] Film antennas are also used in radio frequency identification (RFID), which is widely used in many industries, including transportation, delivery, manufacturing, waste management, mail tracking, baggage matching on airplanes, and toll management on toll roads. RF tags are useful for tracking deliveries from source to customer and through the customer's supply chain.

[0004] Patent Document 1 discloses an RFID device in which a conductive structure having a metal mass below the standard detection threshold is connected to an RFID chip, with the aim of providing an RF tag that is resistant to metal detectors when using RF tags in relation to food. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Special Publication No. 2023-509436 Summary of the Invention [Problem to be solved by the invention]

[0006] From the viewpoint of product traceability and efficient inventory management, management using RF tags is desirable. However, RF tags are detected as foreign objects in the metal detection process, which is one of the quality assurance inspections, so RF tags cannot be affixed to products or their packaging before the metal detection process. Therefore, there is a need to develop RF tags that cannot be detected by metal detectors.

[0007] There are two types of metal detection methods: magnetic field metal detection, which mainly detects metals, and X-ray metal detection, which can detect non-metals as well. It is highly likely that both types of metal detection methods will be used during product distribution, so in order to prevent products from being regarded as foreign objects during distribution, it is desirable to develop RF tags that are difficult to detect by both magnetic field metal detection and X-ray metal detection.

[0008] The present invention has been made in consideration of the above-mentioned problems, and aims to provide an RF tag that is difficult to detect by both magnetic field metal detection and X-ray metal detection, as well as a method for manufacturing packaging and a method for product distribution that use the same. [Means for solving the problem]

[0009] That is, the present invention is as follows. [1] A substrate; An antenna portion disposed on the substrate; a semiconductor element disposed on the base material and electrically connected to the antenna portion, The antenna portion is made of a thin metal wire having a line width of 0.25 μm or more and 200 μm or less, The electrical conductivity of the antenna portion is 4.2×10 2 S / m or more 4.2×10 6 S / m or less, RF tag. [2] The thin metal wire contains at least one metal selected from copper, aluminum, silver, gold, and zinc. The RF tag described in [1]. [3] The thin metal wires form a mesh pattern. An RF tag according to [1] or [2]. [4] The pitch of the metal thin wire is 1.0 μm or more and 300 μm or less. The RF tag according to any one of [1] to [3]. [5] The method includes a step of performing a metal detection inspection on a package containing an RF tag according to any one of [1] to [4] and an item sealed therein. Method of manufacturing packaging. [6] Prior to the step of conducting the metal detection inspection, Attaching the RF tag to a packaging material; and further comprising a step of enclosing the contents in the packaging material to which the RF tag is attached to obtain the package. A method for producing the packaging material described in [5]. [7] The contents are oral products. A method for producing the packaging material described in [5] or [6]. [8] Prior to the step of conducting the metal detection inspection, Encapsulating the contents in a packaging material to obtain the package; and attaching the RF tag to the package. A method for producing the package described in any one of [5] to [7]. [9] A step of acquiring a metal detection inspection result for a package having an RF tag according to any one of [1] to [4] and containing a content; acquiring IC information of the RF tag attached to the package; and recording the inspection result and the IC information in association with each other. method.

[10] A step of acquiring a metal detection inspection result for a package having an RF tag according to any one of [1] to [4] and containing a content; and writing the inspection result into the EPC memory of the RF tag attached to the package. method. Effect of the Invention

[0010] According to the present invention, it is possible to provide an RF tag that is difficult to detect by both magnetic field metal detection and X-ray metal detection, and a method for manufacturing packaging and a method for product distribution that use the same. [Brief description of the drawings]

[0011] [Figure 1] FIG. 1 is a perspective view showing one aspect of an RF tag according to an embodiment of the present invention. [Diagram 2] FIG. 2 is an enlarged view of a portion S in FIG. [Diagram 3] FIG. 1 is a perspective view showing one aspect of a packaging body according to an embodiment of the present invention. [Figure 4] FIG. 1 is a diagram illustrating an example of a configuration of a system according to an embodiment of the present invention. [Diagram 5] FIG. 2 is a schematic diagram showing one aspect of a gate terminal in the present embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0012] Hereinafter, an embodiment of the present invention (hereinafter referred to as "the present embodiment") will be described in detail with reference to the drawings as necessary, but the present invention is not limited to this, and various modifications are possible without departing from the gist of the present invention. In the drawings, the same elements are given the same reference numerals, and duplicated explanations will be omitted. Furthermore, positional relationships such as up, down, left, and right are based on the positional relationships shown in the drawings, unless otherwise specified. Furthermore, the dimensional ratios of the drawings are not limited to those shown in the drawings.

[0013] In this embodiment, "magnetic metal detection" refers to a method that uses electromagnetic induction to detect the presence and size of metal objects by measuring the change in the strength and phase of a magnetic field. In magnetic metal detection, when the magnetic field lines passing through a coil change over time, a current flows through the coil, generating an electromotive force.

[0014] In this embodiment, "X-ray metal detection" refers to a method of irradiating an object with X-rays, detecting the X-rays that hit the object with a sensor, and detecting metal objects from the resulting transmission image.

[0015] In this embodiment, "RF tag" is an abbreviation for "Radio Frequency tag." Note that RF tags may also be called by other names, such as electronic tags, IC tags, wireless tags, and RF tags. In this embodiment, "RF tag" refers to a tag that is used together with a corresponding reader and can transmit or receive data between the reader and the tag in a non-contact manner. Such non-contact transmission or transmission is preferably performed by radio waves. Note that the reader may also function as a writer.

[0016] In this embodiment, an RF tag refers to a tag that has an antenna and is capable of transmitting and receiving a specific frequency. Therefore, even if it is called an IC tag, it is included in the RF tag in this embodiment as long as it satisfies the above configuration.

[0017] Furthermore, RF tags are not particularly limited, but examples include passive tags that do not have a built-in battery and operate using radio waves received from a reader / writer as an energy source, active tags that have a built-in battery (not shown) and use the power for transmission and reception and as a power source for the internal circuits, and semi-passive tags that have a built-in sensor and a battery that serves as a power source for the sensor.

[0018] 1. RF tags The RF tag of this embodiment includes a substrate, an antenna portion disposed on the substrate, and a semiconductor element disposed on the substrate and electrically connected to the antenna portion. The antenna portion is made of a thin metal wire having a line width of 0.25 μm or more and 200 μm or less, and the electrical conductivity of the antenna portion is 4.2×10 2 S / m or more 4.2×10 6 S / m or less.

[0019] As mentioned above, foreign objects are generally detected by using either magnetic metal detection or X-ray metal detection, or by using both. On the other hand, even items such as RF tags that are not foreign objects but are intentionally attached to products can be detected as foreign objects when the product is subjected to magnetic metal detection or X-ray metal detection. For this reason, it was previously necessary to attach an RF tag to a product after it has been subjected to magnetic metal detection or X-ray metal detection, which creates the problem of restricting the manufacturing procedure.

[0020] In addition, when RF tags are attached to packaging bags containing soft products (such as oral products) using an automatic labeling device after magnetic metal detection or X-ray metal detection, there is a problem that the contents are deformed. Therefore, RF tags must be attached manually to products after the metal detection process, but this takes a long time and increases labor costs.

[0021] With the above configuration, this embodiment can provide an RF tag that is difficult to detect in a magnetic metal detector by adjusting the conductivity of the antenna portion, and difficult to detect in an X-ray metal detector by narrowing the line width of the thin metal wire that constitutes the antenna portion. This makes it difficult for an error to occur in which the RF tag is detected even if a magnetic metal detector or an X-ray metal detector is performed after the RF tag attachment process. Therefore, the degree of freedom of the procedure of the RF tag attachment process and the metal detection process can be increased. In addition, in the case of packaging a product with soft contents, the RF tag attachment process can be performed first, so that deformation of the contents due to the later RF tag attachment process can be avoided.

[0022] 1 is a perspective view showing one aspect of the RF tag of this embodiment. The RF tag 100 includes a substrate 110, an antenna unit 120 disposed on the substrate 110, a semiconductor element 130 electrically connected to the antenna unit 120, and a protective layer 140 covering the antenna unit 120. Electricity generated by the antenna unit 120 in response to a predetermined frequency is transmitted toward the semiconductor element 130.

[0023] 1.1.Semiconductor Devices The semiconductor element 130 is not particularly limited, but may be an integrated circuit such as a memory element. Any known semiconductor element 130 may be used depending on the application of the RF tag 100. The configuration of the semiconductor element 130 is not particularly limited, but may include functional units such as a memory unit, a power supply rectifier, a receiver, a controller, and a transmitter.

[0024] 1.2.Antenna section The antenna unit 120 of the RF tag 100 of this embodiment is not limited to the configuration of a λ / 2 dipole antenna, and may have other antenna configurations such as a grounded λ / 4 monopole antenna, etc. Among these, the λ / 2 dipole antenna configuration is preferable.

[0025] Fig. 2 is an enlarged view of portion S of antenna unit 120 in Fig. 1. As shown in Fig. 2, antenna unit 120 may have thin metal wire pattern 121 and an opening 122. The outer edge shape of thin metal wire pattern 121 may be designed so that antenna unit 120 responds to a predetermined frequency. The thin metal wires that make up thin metal wire pattern 121 are electrically conductive to each other within the region of antenna unit 120.

[0026] The pattern shape of the thin metal wire pattern 121 can be designed according to the intended use of the electronic device, and is not particularly limited. For example, the thin metal wire pattern may be a mesh pattern formed by a plurality of thin metal wires crossing each other in a mesh pattern, or a line pattern formed with a plurality of approximately parallel thin metal wires. The thin metal wire pattern may be a combination of a mesh pattern and a line pattern. The mesh of the mesh pattern may be a square or a rectangle as shown in FIG. 1, a polygon such as a rhombus, a lattice pattern, or a honeycomb pattern. The thin metal wires constituting the line pattern may be straight or curved. Furthermore, the thin metal wires constituting the mesh pattern may also be curved.

[0027] Among these, it is preferable that the thin metal wire pattern 121 is a mesh pattern. The unit shape of one grid of the mesh pattern is not particularly limited, but examples thereof include a triangle, a rectangle, and a hexagon. Fig. 2 shows a grid whose unit shape is a rectangle. Note that the thin metal wire pattern 121 may be a regular pattern or an irregular pattern.

[0028] The thin metal wire may contain a non-conductive component in addition to the conductive component that contains conductive metal atoms and is responsible for the conductivity. The conductive metal atoms that constitute the thin metal wire are not particularly limited, but may be at least one selected from copper, aluminum, silver, gold, and zinc. Among these, a non-magnetic material is preferable, copper or silver is preferable, and copper is more preferable. By using a non-magnetic material, it becomes difficult to detect by a magnetic field metal detector. In addition, these metals also contribute to improving the conductivity of the antenna unit 120.

[0029] The non-conductive component is not particularly limited, but may be, for example, a metal oxide, a metal compound, or an organic compound. Note that these non-conductive components are derived from components contained in the ink described below, and may include metal oxides, metal compounds, and organic compounds that remain in the thin metal wires after baking among the components contained in the ink.

[0030] The content of the conductive component is preferably 50% by mass or more, 60% by mass or more, or 70% by mass or more. The upper limit of the content of the conductive component is not particularly limited, but is 100% by mass. The content of the non-conductive component is preferably 50% by mass or less, 40% by mass or less, or 30% by mass or less. The lower limit of the content of the non-conductive component is not particularly limited, but is 0% by mass.

[0031] Conductivity The electrical conductivity of the antenna portion 120 is 4.2×10 2 S / m or more 4.2×10 6 S / m or less, preferably 8.4×10 2 S / m or more 4.2×106 S / m or less, 1.3×10 3 S / m or more 4.2×10 6 S / m or less, 2.1×10 3 S / m or more 4.2×10 6 S / m or less, 4.2×10 3 S / m or more 4.2×10 6 S / m or less, 2.1×10 4 S / m or more 4.2×10 6 S / m or less, 4.2×10 4 S / m or more 4.2×10 6 S / m or less.

[0032] The electrical conductivity of the antenna portion 120 is 4.2×10 2 When the electrical conductivity of the antenna unit 120 is 4.2×10 S / m or more, the electrical conductivity tends to be higher, so that the power loss tends to be suppressed, and the sensitivity of the antenna can be improved. 6 By making the resistance value equal to or less than S / m, the antenna sensitivity of the RF tag can be suppressed, and erroneous reading of adjacent tags during inspection can be suppressed, which is preferable.

[0033] The conductivity of the antenna portion 120 can be measured using, for example, "Loresta GP" (product name, manufactured by Mitsubishi Chemical Corporation) on a measurement sample obtained by cutting the antenna portion 120 into a rectangular shape. More specifically, the resistivity of the measurement sample may be measured by a four-terminal method in accordance with JIS K 7194:1994, and the conductivity may be calculated from the resistivity.

[0034] The conductivity of the antenna section 120 can be adjusted by the composition of the thin metal wires constituting the thin metal wire pattern 121, the line width and pitch of the thin metal wires, and the aspect ratio (thickness) of the thin metal wires. For example, when the thin metal wires contain a conductive component and a non-conductive component, the conductivity tends to improve by increasing the ratio of the conductive component or by using a metal with high conductivity as the conductive component. In addition, the conductivity tends to improve by making the line width thicker, increasing the thickness, or narrowing the pitch.

[0035] 1.2.2. Line width W1 The line width W1 of the thin metal wires constituting the thin metal wire pattern 121 may be 0.25 μm or more and 200 μm or less, preferably 0.25 μm or more and 150 μm or less, 0.25 μm or more and 100 μm or less, 0.25 μm or more and 50 μm or less, 0.25 μm or more and 25 μm or less, 0.25 μm or more and 10 μm or less, 0.25 μm or more and 5.0 μm or less, 0.5 μm or more and 4.0 μm or less, or 1.0 μm or more and 3.0 μm or less.

[0036] When the line width W1 of the thin metal wire is 200 μm or less, the visibility of the thin metal wire pattern 121 decreases. Therefore, the RF tag 100 of this embodiment is unlikely to spoil the appearance of a product or package when attached to the product or package. Also, when the line width W1 of the thin metal wire is 200 μm or less, it is unlikely to be detected by an X-ray metal detector. Furthermore, when the line width W1 of the thin metal wire is 0.25 μm or more, the conductivity of the antenna section 120 is further improved, and the sensitivity as an antenna can be increased.

[0037] In this embodiment, "line width W1" refers to the line width of the thin metal wires when the thin metal wires are projected onto the surface of base material 110 from the side of base material 110 on which thin metal wire pattern 121 is arranged. Furthermore, in thin metal wire pattern 121, line width W1 of the thin metal wires may be uniform or may vary partially. Even if line width W1 of the thin metal wires varies partially, it is preferable that line width W1 of the thin metal wires satisfies the above range.

[0038] 1.2.3.Opening width W2 The opening width W2 of the opening 122 of the thin metal line pattern 121 is preferably 25 μm or more and 1000 μm or less, 50 μm or more and 750 μm or less, 75 μm or more and 500 μm or less, or 100 μm or more and 300 μm or less.

[0039] When the opening width W2 is 25 μm or more, the visibility of the thin metal line pattern 121 decreases, and the pattern tends to be difficult to detect by an X-ray detection type metal detector. When the opening width W2 is 1000 μm or less, the conductivity of the antenna portion 120 is improved, and the sensitivity as an antenna can be increased.

[0040] "Opening width W2" refers to the width in the short direction of opening 122. Specifically, when opening 122 is a polygon or ellipse, "opening width" refers to the shortest length of the line segment passing through the center of gravity of the shape. When the opening is a square, the width of one of the sides and opening width W2 have the same value.

[0041] 1.2.4.Pitch P The pitch P of the thin metal line pattern 121 is preferably 1.0 μm or more and 1000 μm or less, 25 μm or more and 750 μm or less, 50 μm or more and 500 μm or less, or 75 μm or more and 300 μm or less.

[0042] When the pitch P of the thin metal line pattern 121 is 25 μm or more, the visibility of the thin metal line pattern 121 decreases, and the pattern tends to be difficult to detect by an X-ray detection type metal detector. Also, when the pitch P of the thin metal line pattern 121 is 1000 μm or less, the conductivity of the antenna portion 120 is further improved, and the sensitivity as an antenna can be increased.

[0043] "Pitch P" means the sum of line width W1 and opening width W2. In the case of a square grid pattern of thin metal line patterns 121, the opening ratio can be made 99% by setting pitch P of thin metal line patterns 121 with a line width of 1 μm to 200 μm.

[0044] 1.2.5. Thickness H The thickness H of the thin metal wires constituting the thin metal wire pattern 121 is preferably 10 nm or more and 1000 nm or less, more preferably 50 nm or more and 750 nm or less, and even more preferably 75 nm or more and 500 nm or less.

[0045] When the thickness H of the thin metal wire is 10 nm or more, the conductivity of the antenna portion 120 is improved, and the sensitivity as an antenna can be increased. On the other hand, when the thickness H of the thin metal wire is 1000 nm or less, the visibility of the thin metal wire pattern 121 decreases, and it tends to become difficult to detect with an X-ray detection type metal detector.

[0046] The thickness H of the thin metal wires may vary partially in the thin metal wire pattern 121. Even if the thickness H of the thin metal wires varies partially, it is preferable that the thickness H of the thin metal wires satisfies the above range.

[0047] Aspect Ratio The aspect ratio (W1 / H), which is expressed by the thickness H of the thin metal wire relative to the line width W1 of the thin metal wire, is preferably 0.05 to 1.00, 0.08 to 0.95, or 0.10 to 0.90. Adjusting the aspect ratio tends to make it possible to adjust the visibility, electrical conductivity, and detectability in an X-ray detection type metal detector.

[0048] 1.2.7.Occupied area ratio The occupied area ratio is preferably 0.5% to 15%, more preferably 1.0% to 10%, more preferably 2% to 7%. When the occupied area ratio is 0.5% or more, the electrical conductivity of the antenna section 120 is further improved, and the sensitivity as an antenna can be increased. When the occupied area ratio is 15% or less, the visibility of the thin metal line pattern 121 decreases, and the thin metal line pattern 121 tends to be difficult to detect by an X-ray detection type metal detector.

[0049] The "occupancy area ratio" can be calculated by the following formula for the region on the base material 110 where the thin metal line pattern 121 is formed. Occupancy rate (%)=(area occupied by metal thin line pattern 121 per unit area / unit area)×100

[0050] 1.2.8.Visible light transmittance The visible light transmittance T1 of the antenna unit 120 is preferably 80% or more and 99.0% or less, and more preferably 85% or more and 95% or less. When the visible light transmittance T1 is 80% or more, the visibility of the thin metal line pattern 121 decreases, and the pattern tends to be difficult to detect by an X-ray detection type metal detector. Also, when the visible light transmittance T1 is 99.0% or less, the conductivity of the antenna unit 120 is further improved, and the sensitivity as an antenna can be increased. The visible light transmittance can be measured by calculating the transmittance in the visible light range (360 to 830 nm) in accordance with the total light transmittance specified in JIS K 7361-1:1997.

[0051] The visible light transmittance T1 of the antenna portion 120 tends to be improved by reducing the line width of the thin metal wires and by improving the occupied area rate.

[0052] 1.3. Base material The substrate 110 may be either a transparent substrate or an opaque substrate. Among these, a transparent substrate is preferable. This tends to reduce the visibility of the RF tag. The "transparent" of a transparent substrate means that the visible light transmittance is preferably 80% or more, more preferably 90% or more, and even more preferably 95% or more. The visible light transmittance can be measured in accordance with JIS K 7361-1:1997.

[0053] The material of the substrate 110 is not particularly limited, and examples thereof include transparent inorganic substrates such as glass; and transparent organic substrates such as acrylic acid esters, methacrylic acid esters, polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, polycarbonate, polyarylate, polyvinyl chloride, polyethylene, polypropylene, polystyrene, nylon, aromatic polyamide, polyether ether ketone, polysulfone, polyether sulfone, polyimide, and polyether imide. Among these, the use of polyethylene terephthalate provides better productivity (cost reduction effect) for manufacturing the conductive film. Furthermore, the use of polyimide provides better heat resistance of the conductive film. Furthermore, the use of polyethylene terephthalate and / or polyethylene naphthalate provides better adhesion between the transparent substrate and the thin metal wire.

[0054] The substrate 110 may be made of one material or may be a laminate of two or more materials. When the substrate 110 is a multilayer body in which two or more materials are laminated, the substrate 110 may be a laminate of organic substrates or inorganic substrates, or a laminate of an organic substrate and an inorganic substrate.

[0055] The thickness of the substrate 110 is preferably 5 μm or more and 500 μm or less, and more preferably 10 μm or more and 100 μm or less.

[0056] 1.4. Middle Tier The RF tag may have an intermediate layer (not shown) between the substrate 110 and the thin metal line pattern 121 to improve adhesion.

[0057] The components contained in the intermediate layer are not particularly limited, but examples thereof include silicon compounds (e.g., (poly)silanes, (poly)silazanes, (poly)silthians, (poly)siloxanes, silicon, silicon carbide, silicon oxide, silicon nitride, silicon chloride, silicates, zeolites, silicides, etc.), aluminum compounds (e.g., aluminum oxide, etc.), magnesium compounds (e.g., magnesium fluoride), etc.

[0058] Among these, at least one selected from the group consisting of silicon oxide, silicon nitride, aluminum oxide, and magnesium fluoride is preferred. By using such a component, the transparency and durability of the conductive film tend to be further improved, and the productivity (cost reduction effect) for manufacturing the conductive film is more excellent. The intermediate layer can be formed by a gas phase film formation method such as PVD or CVD, or a method of applying and drying an intermediate forming composition in which the components contained in the intermediate layer are dispersed in a dispersion medium. The intermediate forming composition may contain a dispersant, a surfactant, a binder, etc., as necessary.

[0059] The thickness of the intermediate layer may be, for example, not less than 0.01 μm and not more than 500 μm.

[0060] 2. Manufacturing method of RF tags The method for manufacturing an RF tag may include a pattern forming step of forming a pattern on the substrate 110 using ink containing a metal component, and a firing step of firing the ink to form the thin metal line pattern 121. The method for manufacturing an RF tag may also include an intermediate layer forming step and a semiconductor element bonding step, if necessary.

[0061] 2.1. Intermediate layer formation process A specific example of the intermediate layer forming step is a method of forming an intermediate layer by forming a film of components forming the intermediate layer on the surface of a transparent substrate using a vapor phase film forming method such as PVD, CVD, etc. Another specific example of the intermediate layer forming step is a method of forming an intermediate layer by applying an intermediate forming composition, in which components forming the intermediate layer are dispersed in a dispersion medium, to the surface of a transparent substrate and drying the composition.

[0062] 2.2.Pattern formation process The pattern forming process is a process of forming a pattern using an ink containing a metal component. The pattern forming method is not particularly limited, but may be, for example, a plate printing method using a plate having grooves of a desired metal thin line pattern. For example, the process may include a process of coating the surface of a transfer medium with ink, a process of placing the ink-coated transfer medium surface against the convex surface of a relief plate, pressing and contacting the surface to transfer the ink on the transfer medium surface to the convex surface of the relief plate, and a process of placing the ink-coated transfer medium surface against the surface of a transparent substrate, pressing and contacting the surface to transfer the ink remaining on the transfer medium surface to the surface of the transparent substrate. In addition, when an intermediate layer is formed on the transparent substrate, the ink is transferred to the surface of the intermediate layer.

[0063] The ink contains a metal component containing conductive metal atoms M and a solvent, and may contain a surfactant, a dispersant, a reducing agent, etc., as necessary. The metal component may be contained in the ink as metal particles or as a metal complex.

[0064] The average primary particle size of the metal particles is preferably 100 nm or less, more preferably 50 nm or less, and further preferably 30 nm or less. The lower limit of the average primary particle size of the metal particles is not particularly limited, but may be 1 nm or more. By making the average primary particle size of the metal particles 100 nm or less, the line width W1 of the obtained thin metal wire can be made thinner. In this embodiment, the "average primary particle size" refers to the particle size of each individual metal particle (so-called primary particle), and is distinguished from the average secondary particle size, which is the particle size of an aggregate (so-called secondary particle) formed by gathering a plurality of metal particles.

[0065] The metal particles may be in the form of a metal oxide such as copper oxide, a metal compound, or a core / shell particle in which the core part is copper and the shell part is copper oxide, so long as they contain a conductive metal atom M. The form of the metal particles can be appropriately determined from the viewpoints of dispersibility and sinterability.

[0066] 2.3. Firing process In the firing step, for example, the metal components in the ink transferred to the surface of the base material or intermediate layer are sintered, thereby forming the antenna section 120 composed of a thin metal line pattern.

[0067] The firing method is not particularly limited as long as the metal component can be fused to form a metal component sintered film. For example, firing may be performed in a firing furnace, or may be performed using plasma, a heating catalyst, ultraviolet light, vacuum ultraviolet light, an electron beam, infrared lamp annealing, flash lamp annealing, a laser, or the like. If the resulting sintered film is easily oxidized, it is preferable to fire in a non-oxidizing atmosphere. In addition, if the metal oxide or the like is not easily reduced by only the reducing agent that may be contained in the ink, it is preferable to fire in a reducing atmosphere.

[0068] A non-oxidizing atmosphere is an atmosphere that does not contain an oxidizing gas such as oxygen, and includes an inert atmosphere and a reducing atmosphere. An inert atmosphere is, for example, an atmosphere filled with an inert gas such as argon, helium, neon, or nitrogen. A reducing atmosphere refers to an atmosphere in which a reducing gas such as hydrogen or carbon monoxide is present. The ink coating film may be baked by filling the baking furnace with these gases to form a closed system. The baking furnace may also be a flow system to bake the coating film while flowing these gases. When the coating film is baked in a non-oxidizing atmosphere, it is preferable to once evacuate the baking furnace to remove oxygen in the baking furnace and replace it with a non-oxidizing gas. The baking may be performed in a pressurized atmosphere or a reduced pressure atmosphere.

[0069] The baking temperature is not particularly limited, but is preferably 20°C to 400°C, more preferably 50°C to 300°C, and even more preferably 80°C to 200°C. A baking temperature of 400°C or less is preferable because a substrate with low heat resistance can be used. Also, a baking temperature of 20°C or more is preferable because the formation of the sintered film proceeds sufficiently and the conductivity tends to be good. The obtained sintered film contains a conductive component derived from the metal component, and may also contain a non-conductive component depending on the components used in the ink and the baking temperature.

[0070] 2.4.Joining process The bonding step is a step of bonding the semiconductor element 130 so as to be electrically bonded to the antenna unit 120 configured as described above. The bonding can be performed by any method, and for example, an anisotropic conductive film (ACF) or the like may be used.

[0071] 2.5. Sealing process The sealing step is a step of sealing the antenna portion 120 and the semiconductor element 130 joined as described above with a protective layer 140. The sealing material to be the protective layer 140 is not particularly limited as long as it is a known curable resin such as a thermosetting or photosetting resin, but for example, a transparent sealing material is preferable.

[0072] 3. Packaging manufacturing method The method for producing a package according to the present embodiment includes a step of subjecting the package to a metal detection inspection, and may further include, as necessary, a step of attaching an RF tag to a packaging material and a step of enclosing the contents in the packaging material to which the RF tag is attached to obtain a package, before the step of performing a metal detection inspection. The method for producing a package according to the present embodiment may further include a step of enclosing the contents in a packaging material to obtain a package, and a step of attaching an RF tag to the package, before the step of performing a metal detection inspection.

[0073] A schematic diagram of a package is shown in Fig. 3. Package 200 refers to a state in which contents 220 are packaged in packaging material 210. Furthermore, packaging material 210 refers to a material used for packaging at a stage before the contents 220 are enclosed. Furthermore, examples of metal detection inspection include X-ray metal detection and magnetic field metal detection.

[0074] The RF tag of this embodiment is difficult to detect by both magnetic metal detection and X-ray metal detection. Therefore, the RF tag 100 may be attached to the packaging material 210 either before or after the contents 220 are enclosed in the packaging material 210.

[0075] The "contents" are not particularly limited, but include, for example, oral products, medicinal topical drugs, quasi-drugs for topical use, and other products that are normally packaged and distributed. Here, oral products are not particularly limited, but include, for example, not only various foods, but also oral medicines such as tablets and granules, and orally ingested products such as health foods and supplements.

[0076] 4. Method The method of this embodiment is an example of a method for performing a metal detection process, which is one type of quality assurance inspection, and managing the results in association with RF tags, and is a method used for product traceability and inventory management.

[0077] The RF tag of this embodiment is difficult to detect by both magnetic metal detection and X-ray metal detection. Therefore, the inspection result obtained by metal detection performed on a package to which the RF tag of this embodiment is attached is the result of whether or not other metallic foreign objects are mixed in the package. Then, by managing the inspection result thus obtained in association with the IC information of the RF tag, it is possible to confirm that the product is safe and free of foreign objects each time metal detection is performed at each distribution point of the product. Two aspects will be described below.

[0078] 4.1. First Aspect The first aspect of the method of the present embodiment is mainly an aspect in which the IC information of the RF tag and the inspection result are associated and managed by an external server. The first aspect includes a step of acquiring the metal detection inspection result of the package to which the RF tag is attached and in which the contents are enclosed, a step of acquiring the IC information of the RF tag attached to the package, and a step of recording the inspection result and the IC information in association with each other. Here, the "IC information" is code information for identifying the RF tag, and may include the TID memory, the read date and time, the read position information, etc.

[0079] We will now explain the system configuration for implementing the first aspect. The system includes, for example, a metal detector and an RFID reader terminal installed at the sender of the product and at a warehouse in the distribution process, and a server configured to be able to communicate with the metal detector and the RFID reader terminal.

[0080] An example of the configuration of the system 1 of the first embodiment is shown in Fig. 4. Fig. 4 shows an embodiment using a gate terminal 300 having a metal detection function and an RFID reader function. The gate terminals 300A-300D are provided at each base where products are carried in and out, such as a shipping base for the package 200 of a manufacturer, a logistics base for a distributor, and a logistics base for a retailer, and each of the gate terminals 300A-300D is connected to a server 400 via a network N.

[0081] As a result, each of the gate terminals 300A-300D performs metal detection and reads the IC information of the RF tag every time a package 200 passes through a gate terminal, and transmits the inspection results and the IC information to the server 400. As a result, the server 400 can guarantee that there are no abnormalities when a package 200 with certain IC information passes through each of the gate terminals 300A-300D.

[0082] Fig. 5 shows the configuration of the gate terminal 300. Fig. 5(a) is a perspective view showing an example of a state in which a package 200 with an RF tag 100 attached passes through the gate terminal 300, and Fig. 5(b) is a cross-sectional view showing the state. As shown in Fig. 5, the gate terminal 300 acquires information recorded on the RF tag 100 attached to the passing package 200 using an RFID reader 310, and also performs a metal detection inspection using a metal detector 320.

[0083] 4, one gate terminal 300 is shown at each base, but the number of gate terminals 300 is not limited to this, and a gate terminal 300 may be installed at each of the product carry-in gate and carry-out gate at each base. This allows authenticity determination to be performed using the gate terminal 300 at the time of carry-in and carry-out. When no particular distinction is made between the gate terminals 300A to 300D, they will simply be referred to as gate terminals 300.

[0084] 4 and 5, the gate terminal 300 is shown as an example of an integrated device having a metal detection function and an RFID reader, but the present invention is not limited to this, and the metal detector and the RFID reader terminal may be separate devices. Also, when the metal detector and the RFID reader terminal are separate devices, the two may be connected to each other so that they can transmit and receive the inspection results and IC information to each other.

[0085] In addition, the server 400 is not particularly limited as long as it corresponds and records and manages the received IC information and the test results, and may be a general-purpose computer, and may be composed of a single computer or multiple computers distributed over the network N.

[0086] 4.2. Second Aspect The second aspect of the method of this embodiment is mainly a mode in which the inspection results are recorded and managed in the EPC memory of the RF tag. The second aspect includes a step of acquiring the inspection results of a metal detection for a package to which the RF tag is attached and in which contents are enclosed, and a step of writing the inspection results in the EPC memory of the RF tag attached to the package. Here, the "EPC memory" refers to a memory area in the IC chip of the RF tag.

[0087] The RF tag of this embodiment is difficult to detect by both magnetic metal detection and X-ray metal detection. Therefore, the inspection result obtained by metal detection performed on a package to which the RF tag of this embodiment is attached is the result of whether or not other metallic foreign objects are mixed in the package. Then, by managing the inspection result thus obtained in association with the IC information of the RF tag, it is possible to confirm that the product is safe and free of foreign objects each time a metal detection is performed at each distribution point of the product.

[0088] The system configuration for implementing the second aspect will be described. The system includes, for example, a metal detector and an RFID writer terminal installed at the sender of the product and in a warehouse in the distribution process. Information written to the EPC memory is not particularly limited, but may include, for example, a product code, a manufacturing factory code, and a lot number.

[0089] In the first embodiment, the server 400 managed the inspection results, but in the second embodiment, no server is used and the inspection results are recorded in the EPC memory of the RF tag 100. As the gate terminal used in the second embodiment, one having the same configuration as above in Fig. 5 can be used, except that the RFID reader 310 in Fig. 5 is replaced with an RFID writer. [Industrial Applicability]

[0090] 1...system, 100...RF tag, 110...substrate, 120...antenna section, 121...metal fine line pattern, 122...opening, 130...semiconductor element, 140...protective layer, 200...packaging, 210...packaging material, 220...contents, 300...gate terminal, 300A...gate terminal, 300B...gate terminal, 300C...gate terminal, 300D...gate terminal, 310...RFID reader, 320...metal detection device, 400...server

Claims

1. A substrate; An antenna portion disposed on the substrate; a semiconductor element disposed on the base material and electrically connected to the antenna portion, The antenna portion is made of a thin metal wire having a line width of 0.25 μm or more and 200 μm or less, The electrical conductivity of the antenna portion is 4.2×10 2 S / m or more 4.2×10 6 S / m or less, RF tag.

2. The thin metal wire contains at least one metal selected from copper, aluminum, silver, gold, and zinc. The RF tag according to claim 1.

3. The thin metal wires form a mesh pattern. The RF tag according to claim 1.

4. The pitch of the metal thin wire is 1.0 μm or more and 300 μm or less. The RF tag according to claim 1.

5. The method includes a step of subjecting a package containing an RF tag according to any one of claims 1 to 4 to a metal detection inspection. Method of manufacturing packaging.

6. Prior to the step of conducting the metal detection inspection, Attaching the RF tag to a packaging material; and further comprising a step of enclosing the contents in the packaging material to which the RF tag is attached to obtain the package. A method for producing the packaging material according to claim 5.

7. The contents are oral products. A method for producing the packaging material according to claim 6.

8. Prior to the step of conducting the metal detection inspection, Encapsulating the contents in a packaging material to obtain the package; and attaching the RF tag to the package. A method for producing the packaging material according to claim 5.

9. A step of acquiring a metal detection inspection result for a package to which the RF tag according to any one of claims 1 to 4 is attached and in which contents are enclosed; acquiring IC information of the RF tag attached to the package; and recording the inspection result and the IC information in association with each other. method.

10. A step of acquiring a metal detection inspection result for a package to which the RF tag according to any one of claims 1 to 4 is attached and in which contents are enclosed; and writing the inspection result into an EPC memory of the RF tag attached to the package. method.

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