Probe cleaning method and jig

Abstract

To provide a probe cleaning method that can minimize deformation of a probe caused by removal of foreign substances to extend the life of the probe.SOLUTION: A probe cleaning method of the present invention is to remove a foreign substance attached to a leading end of a probe, and the probe cleaning method includes passing the leading end of the probe through an insertion hole formed in a jig, and pressing a rotating brush against the leading end of the probe projecting from the insertion hole to remove the foreign substance from the leading end of the probe.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a probe cleaning method and tool, and is applicable to a method and tool for cleaning a probe used in, for example, wafer-level electrical testing. [Background technology]

[0002] The electrical characteristics of test objects such as integrated circuits formed on semiconductor wafers are inspected at each manufacturing stage. In general, electrical inspection of integrated circuits on semiconductor wafers is performed by directly contacting a probe with the electrode pads (made of aluminum or other material) of the integrated circuits formed on the wafer.

[0003] In such electrical testing, in order to achieve good electrical continuity between the probe and the electrode pad, after the probe is brought into contact with the electrode pad, further pressure must be applied to press the probe into the electrode pad, thereby destroying the oxide film on the surface of the electrode pad.

[0004] However, when the probe is brought into contact with the electrode pad as described above, foreign matter (such as aluminum) such as shavings from the electrode pad may adhere to the probe. If such foreign matter is not removed from the probe, poor continuity occurs between the probe and the electrode pad, and electrical contact deteriorates, making it impossible to measure the characteristics accurately.

[0005] For this reason, the contact surface (tip) of the probe is periodically cleaned to remove foreign matter. For example, the probe is cleaned by pressing a cleaning member (cleaning sheet) against the contact surface of the probe to scrape the contact surface (Patent Documents 1 and 2, etc.). [Prior art documents] [Patent documents]

[0006] [Patent Document 1] Japanese Patent Application Publication No. 7-199141 [Patent Document 2] Japanese Patent Application Publication No. 5-209896 Summary of the Invention [Problem to be solved by the invention]

[0007] However, in conventional cleaning methods, when a cleaning member is pressed against the probe, the probe material is scraped off along with the foreign matter, and the life of the probe may be shortened each time cleaning is performed.

[0008] In view of the above problems, the present invention aims to provide a probe cleaning method and tool capable of minimizing deformation of the probe caused by removing foreign matter and thereby extending the life of the probe. [Means for solving the problem]

[0009] The first invention is a probe cleaning method for removing foreign matter adhering to the tip of a probe, characterized in that the tip of the probe is passed through an insertion hole formed in a jig, and a rotating brush is pressed against the tip of the probe protruding from the insertion hole, thereby removing the foreign matter from the tip of the probe.

[0010] A second aspect of the present invention is a jig used for cleaning a probe, characterized in that it is provided with a plurality of insertion holes into which a plurality of probes are respectively inserted. Effect of the Invention

[0011] According to the present invention, deformation of the probe caused by removing foreign matter can be kept to a minimum, thereby extending the life of the probe. [Brief description of the drawings]

[0012] [Figure 1] FIG. 2 is an external perspective view illustrating a configuration of a cleaning device according to the embodiment. [Diagram 2] FIG. 2 is an external perspective view showing a configuration of a probe unit according to the embodiment. [Diagram 3]4 is an explanatory diagram showing an enlarged view of the periphery of a probe attachment surface of the probe unit according to the embodiment. FIG. [Figure 4] 11 is an explanatory diagram showing a state in which the tip portions of the probes are inserted into a plurality of insertion holes of the mask member according to the embodiment. FIG. [Diagram 5] 11 is a diagram showing a state in which a probe is inserted into an insertion hole of a mask member according to the embodiment. FIG. [Figure 6] 1A to 1C are explanatory diagrams illustrating an outline of a method for manufacturing a mask member according to an embodiment. [Figure 7] 5 is a flowchart showing a probe cleaning operation performed by the probe cleaning device according to the embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0013] (A) Main embodiment Hereinafter, this embodiment of the probe cleaning method and tool according to the present invention will be described in detail with reference to the drawings.

[0014] (A-1) Configuration of the embodiment The probe cleaning device according to this embodiment will be described below with reference to the drawings. Fig. 1 shows the overall configuration of the probe cleaning device according to this embodiment. Fig. 2 shows the configuration of the probe unit. In the drawings, the same or corresponding parts are given the same reference numerals.

[0015] (A-1-1) Overall composition The probe cleaning device 1 according to this embodiment removes foreign matter adhering to the tip 31 of the probe 30 and its periphery by contacting an object to be inspected in an electrical characteristic inspection. As shown in FIG. 1, the probe cleaning device 1 has a probe unit 2 and a cleaning unit 3.

[0016] The probe unit 2 is a unit including a probe substrate 20 that supports a plurality of probes 30. The probe substrate 20 is connected to a tester (not shown) during testing, but when cleaning the subject of this embodiment, it is removed from the tester and used after covering the probes 30 supported by the probe substrate 20 with a mask member 40 except for the periphery of the tips of the probes.

[0017] The cleaning unit 3 has a rotatable cylindrical brush 3B. The brush 3B is connected to a rotary drive mechanism having a drive source (not shown) and is configured to be rotatable. The shape of the brush 3B is not particularly limited, and may be formed into a rectangular parallelepiped shape or a sawtooth shape. The material of the brush 3B can be selected according to the type of foreign matter attached around the tip of the probe 30.

[0018] That is, the material of the brush 3B is preferably softer than the tip 31 of the probe 30. The tip 31 is formed by deposition of a highly tough conductive metal material such as nickel-phosphorus alloy (Ni-P), nickel-tungsten alloy (Ni-W), rhodium (Rh), phosphor bronze (Cu-Sn-P), palladium-cobalt alloy (Pd-Co), palladium-nickel-cobalt alloy (Pd-Ni-Co), etc. By using the brush 3B made of such a material, it is possible to prevent the tip 31 of the probe 30 from being damaged when the probe 30 is washed.

[0019] The cleaning unit 3 may include a sandblasting device, a YAG laser irradiation device, or an ion beam irradiation device instead of the brush 3B.

[0020] That is, the cleaning of the probe 30 may be performed by ejecting sand from a sandblasting device onto the probe 30, causing the ejected particles to collide with foreign matter adhering to the probe 30, thereby removing the foreign matter from the probe. In this case, the sand ejected from the sandblasting device may be sand (silica sand), alumina (ceramic), glass, plastic, or carbon. By causing the sand to collide with the probe 30, the foreign matter on the probe 30 can be efficiently removed.

[0021] In addition, in cleaning the probe 30, foreign matter on the probe 30 may be removed by irradiating a YAG laser from a YAG laser irradiation device. The YAG laser is less prone to aging and can oscillate stably compared to liquid lasers such as CO2 lasers, so it is possible to stabilize the accuracy of cleaning the probe 30. In addition, the YAG laser has higher light focusing ability than other lasers, and can oscillate a laser with a strength sufficient to remove foreign matter on the probe 30 with a relatively small applied voltage, which contributes to reducing the running costs of cleaning the probe 30. In addition, since the YAG laser has excellent spreading performance and the laser irradiation range can be easily adjusted, the use of the YAG laser makes it possible to easily adjust the laser irradiation range according to the degree of adhesion of foreign matter on the probe 30. For example, when foreign matter is attached over a wide area around the tip of the probe 30, the laser irradiation range can be enlarged to irradiate the wide area around the tip of the probe 30 with the laser, thereby enabling cleaning in a short time.

[0022] Furthermore, in cleaning the probe 30, foreign matter may be removed from the probe 30 by irradiating it with an ion beam of inert gas ions such as N2 or Ar from an ion beam irradiation device. The output intensity of the ion beam can be adjusted relatively finely, and damage to the probe 30 can be suppressed by irradiating a low-power beam.

[0023] (A-1-2) Probe unit In FIG. 2, the probe unit 2 according to this embodiment includes a support member 10, a probe substrate 20 held by the support member 10 and having a plurality of probes 30, and a mask member 40 having insertion holes 41 into which only the periphery of the tips of the plurality of probes 30 can be inserted.

[0024] <Support member 10> The support member 10 supports the probe unit 2, and can be made of various materials such as nickel alloy, ceramic, etc. The support member 10 and the probe substrate 20 are fixed together using a screw member such as a bolt, but these members are omitted in FIG.

[0025] <Probe board 20> The probe board 20 is used for inspecting the electrical characteristics of IC chips on a semiconductor wafer, and is formed, for example, from a multilayer board with an electrical circuit built in. As shown in Figures 2 and 3, a plurality of probes 30 of approximately equal length dimensions are arranged on the probe mounting surface 21.

[0026] <Probe 30> The probe 30 is made of a conductive material, and in this embodiment, one end of the probe 30 is supported on the probe attachment surface 21 of the probe substrate 20. The tip 31 of the probe 30 is a target for cleaning by the cleaning unit 3.

[0027] In this embodiment, the probe 30 is an example of a cantilever type probe, but other types such as a vertical type probe may also be used.

[0028] <Mask member 40> The mask member 40 is a jig that is attached to the probe board 20 .

[0029] 5, the mask member 40 is provided with a first countersunk portion 42 and a second countersunk portion 43. The mask member 40 has three stepwise different thicknesses d4, d5, and d6, and is formed in a flat plate shape as a whole.

[0030] The mask member 40 is provided with a plurality of insertion holes 41 in a portion having a thickness d4, into which the plurality of probes 30 supported by the probe substrate 20 are respectively inserted. Each insertion hole 41 is formed in a rectangular parallelepiped shape with a substantially square cross section and a side length d4 through which the tip 31 of the probe 30 can protrude. Each insertion hole 41 is arranged at a horizontal position in the mask member 40 corresponding one-to-one to each of the probes 30 of the probe substrate 20. For example, when cleaning the probes 30 arranged in a line on the probe substrate 20, a mask member 40 in which the insertion holes 41 are arranged in a line at horizontal positions corresponding one-to-one to the probes 30 is used.

[0031] When one end of each probe 30 is inserted into the multiple insertion holes 41, the periphery of the tip including the tip portion 31 which is the protruding portion becomes the target for cleaning by the cleaning unit 3. The insertion hole 41 may be rectangular or substantially circular.

[0032] Fig. 4 is a view showing the periphery of the insertion hole 41 of the mask member 40 from an obliquely downward direction. Fig. 5 shows a state in which the probe 30 is inserted into the insertion hole 41.

[0033] The shape of the mask member 40 will be described together with the first countersunk portion 42 and the second countersunk portion 43 provided on the mask member 40. The mask member 40 has a shape in which a region with a side length of d3 and a depth of d8 is carved out (spot-sunk) from a plate-like object with a thickness of d6 and a side length of d10. The mask member 40 also has a shape in which a region with a side length of d2 and a depth of d7 is carved out (spot-sunk) from a plate-like object with a thickness of d5.

[0034] The first countersunk portion 42 refers to an area surrounded by a portion of the mask member 40 with a thickness d5 and a portion of the mask member 40 with a thickness d4. In other words, the first countersunk portion 42 is a groove with a side length of d2 and a depth of d7. When the probe 30 of the probe board 20 is inserted into the insertion hole 41 of the mask member 40 from above (the +Z direction side), the tip 31 and its periphery, i.e., the portion of the probe 30 to be cleaned, protrudes from the insertion hole 41 and is accommodated in the first countersunk portion 42.

[0035] Similarly, the second countersunk portion 43 refers to an area surrounded by the portion with thickness d6 and the portion with thickness d5 in the mask member 40. In other words, the second countersunk portion 43 is a groove with a side length of d3 and a depth of d8.

[0036] As shown in Figure 4, a second countersunk processing portion 43 is provided in the mask member 40 so as to extend in the Y-axis direction, and a plurality of first countersunk processing portions 42 are arranged in parallel along the Y-axis direction in the area in which the second countersunk processing portion 43 extends.

[0037] By providing the mask member 40 with the first countersunk portion 42 and the second countersunk portion 43, a higher strength can be obtained compared to a case where the thickness of the mask member 40 is d4 over its entire area. This makes it possible to prevent the mask member 40 from being damaged when an external force is applied to the mask member 40 when the probes 30 of the probe board 20 are inserted into the mask member 40 and the two are integrated. It is also possible to prevent the mask member 40 from being broken by its own weight.

[0038] The side d2 of the first countersunk portion 42 is small enough to provide the mask member 40 with a strength sufficient to prevent it from being damaged by the external force and its own weight. It is even better if the side d2 is large enough to allow the brush 3B to be inserted from below the mask member 40 (the -Z direction side).

[0039] Next, a manufacturing method of the mask member 40 will be briefly described. In this embodiment, since the probe 30 is assumed to be a microcantilever, the shape of the insertion hole 41 (including the first countersunk portion 42 and the second countersunk portion 43) is also in the order of several tens to several hundreds of μm. The mask member 40 including the insertion hole 41 is manufactured by growing (stacking) a metal by a plating technique. In this case, the manufacturing can be performed by using photolithography.

[0040] 6A and 6B are diagrams showing an outline of a method for manufacturing the mask member 40. Note that the method for manufacturing the mask member 40 described below is one example, and various other manufacturing methods, including modifications thereof, can be used.

[0041] First, as shown in Fig. 6(A), a metal material (e.g., nickel) is deposited on the upper surface of a copper plate 51, which is a substrate for manufacturing a mask member 40, to form a nickel layer 52, and a photoresist is applied to form a resist layer 53. Then, as shown in Fig. 6(B), the resist layer 53 is removed by washing. Then, as shown in Fig. 6(C), the copper plate 51 is peeled off from the nickel layer 52, and the mask member 40 having an insertion hole 41 (including a first countersunk portion 42 and a second countersunk portion 43) can be manufactured.

[0042] (A-2) Operation of the embodiment Next, the operation (procedure) of a cleaning method using the probe cleaning device according to the embodiment will be described.

[0043] FIG. 7 is a flow chart showing the operation (procedure) during cleaning in the probe cleaning device.

[0044] <s101>Alignment process First, the probe 30 supported by the probe substrate 20 shown in FIG. 5 is aligned with the mask member 40 in the horizontal direction (X-axis direction, Y-axis direction). Specifically, while an operator monitors the insertion hole 41 and the probe 30 from below the insertion hole 41 of the mask member 40 using an imaging device (not shown), the probe substrate 20 and the mask member 40 are moved relatively in the horizontal direction to adjust the positional relationship between the two, thereby matching the horizontal positions of the probe 30 and the insertion hole 41. In this way, the horizontal positional relationship between the probe substrate 20 and the mask member 40 is set to an appropriate positional relationship. The relative movement between the probe substrate 20 and the mask member 40 is performed, for example, by attaching the support member 10 supporting the probe substrate 20 to an arm (not shown) that can move horizontally and rise and fall freely, and moving the probe substrate 20 horizontally by controlling the arm.

[0045] In addition, marks may be provided at corresponding positions on the probe mounting surface 21 of the probe board 20 and the upper surface 400 of the mask member 40, and it may be determined that the horizontal positional relationship is appropriate when the two marks match. More specifically, marks may be provided in advance at two positions on the probe mounting surface 21 of the probe board 20 and two positions on the upper surface 400 of the mask member 40 so that the horizontal positions of the two marks match when the horizontal positional relationship between the probe board 20 and the mask member 40 is the appropriate positional relationship, and the horizontal positions of the probe 30 and the insertion hole 41 may be matched by an operator adjusting the horizontal positions of the probe board 20 and the mask member 40 while monitoring each mark.

[0046] <s102>Insertion process Next, as shown in FIG. 5, with the horizontal positions of each probe 30 of the probe substrate 20 and each insertion hole 41 of the mask member 40 aligned, the probe substrate 20 and the mask member 40 are moved relatively in the vertical direction (the Z-axis direction, which is the direction perpendicular to the horizontal plane (XY plane)) to insert each probe 30 of the probe substrate 20 into each insertion hole 41.

[0047] At this time, for example, the mask member 40 is fixed to a table mechanism (not shown), and the support member 10 of the probe unit 2 is gradually lowered by the above-mentioned arm to bring the probe substrate 20 and the mask member 40 closer to each other, and the probe 30 is passed through the insertion hole 41. Then, when the inclined portion 32 of the probe 30 contacts the upper surface 400 of the mask member 40 at the contact point 9 and the probe substrate 20 detects a predetermined pressure, the lowering operation is stopped. In this manner, the tip portion 31 of the probe 30 is caused to protrude from the lower surface 49 of the mask member 40. In the example of FIG. 5, the entire tip portion 31 of the probe 30 protrudes from the lower surface 49 of the mask member 40, and most of the inclined portion 32 of the probe 30 is positioned in the area surrounded by the inner surface 410 of the mask member 40 (the side surface of the insertion hole 41).

[0048] The probe substrate 20 may be moved closer to the mask member 40 by a predetermined distance and then stopped so that the tip portions 31 of the probes 30 protrude from the lower surface 49 of the mask member 40 .

[0049] Also, the tip 31 of the probe 30 may be imaged from below the mask member 40 during the downward movement, and the downward movement may be stopped when the image of the tip 31 of the probe 30 taken reaches a predetermined size.

[0050] In this way, the tips 31 of the probes 30 protrude from the lower surface 49 of the mask member 40, and the probe substrate 20 and the mask member 40 are approximately integrated. For example, a chuck-type connecting mechanism or the like for connecting the probe substrate 20 and the mask member 40 may be provided on one or both of them to connect and fix them. Note that the mask member 40 may be fixed to the probe substrate 20 to such an extent that the probes 30 are not removed from the mask member 40 by the force of the brush 3B during cleaning by the cleaning unit 3 described below, and the fixing means is not particularly limited.

[0051] <s103>Cleaning process Power is supplied to the drive source of the brush 3B to rotate the brush 3B, and the probe unit 2, in which the probe substrate 20 and the mask member 40 are integrated, is moved horizontally by the above-mentioned arm control to position the probe unit 2 above the brush 3B. In this state, the probe unit 2 is lowered, so that the probes 30 and the brush 3B approach each other in the vertical direction (Z-axis direction). Then, the tip 31 of each probe 30 protruding from the insertion hole 41 of the mask member 40 and its periphery come into contact with the rotating brush 3B, and the rotating brush 3B removes foreign matter attached to the tip 31 of the probe 30 and its periphery from the tip 31 of the probe 30.

[0052] At this time, contact at contact point 9 between inclined portion 32 of probe 30 and mask member 40 prevents brush 3B from contacting a portion of probe substrate 20 above upper surface 400 of mask member 40. This makes it possible to prevent brush 3B from damaging portions other than the cleaning target.

[0053] In addition, since the portion of the probe substrate 20 above the upper surface 400 of the mask member 40 at the contact point 9 is protected by the mask member 40, when the cleaning unit 3 is a sandblasting spraying device, it is possible to prevent sand from colliding with and damaging portions of the probe substrate 20 other than the portions to be cleaned.

[0054] In the case of using a YAG laser irradiation device and in the case of using an ion beam irradiation device, it is possible to similarly prevent the portion of the probe substrate 20 protected by the mask member 40 from being irradiated with an irradiating body.

[0055] In addition, the cleaning may be performed by cleaning a plurality of probes 30 at once with the brush 3B, or by cleaning a plurality of probes 30 by area. For example, if there are 2000 probes 30 to be cleaned and the number of probes that can be brushed at once is 400, the area in which the probes 30 are arranged on the probe attachment surface 21 of the probe substrate 20 may be divided into five so that the tips 31 of the 400 probes 30 are present in each area, and the tips 31 of the probes 30 may be cleaned for each divided area.

[0056] (A-3) Effects of the embodiment As described above, according to the present embodiment, by simply removing foreign matter adhering to the periphery of the tip of the probe with a brush, it is possible to prevent the probe material from being scraped off together with the foreign matter as occurs with conventional cleaning sheets, and therefore it is possible to extend the life of the probe compared to conventional methods without deforming the probe.

[0057] In addition, by providing a first countersink processing portion 42 and a second countersink processing portion 43 in the insertion hole 41 in the mask member 40, through which the tip portion 31 of the probe 30 is inserted, the strength of the mask member 40 can be maintained while making it easier for the brush to be inserted.

[0058] For example, while conventional cleaning sheets could only clean the contact surface (the tip) of the probe, this embodiment can clean not only the tip 31 of the probe 30 but also the area around the tip, including the inclined portion 32. That is, in addition to foreign matter (aluminum, aluminum oxide, etc.) that adheres to the tip 31 when it contacts the electrode pad, it can also remove foreign matter such as fine dust present in the air that adheres to the area around the tip.

[0059] (B) Other embodiments Although the modified embodiment of the present invention has been mentioned in the above-described embodiment, the present invention can also be applied to the following embodiment.

[0060] (B-1) In the above-described embodiment, an example was shown in which the probe substrate 20 was removed from the tester (not shown), the probe substrate 20 was incorporated into the probe unit 2, and the probes were cleaned. However, the mask member 40 may be attached while the probe substrate 20 is held in the tester (not shown), and cleaning may be performed by the cleaning unit 3.

[0061] (B-2) As a modified example, the probe cleaning device 1 may use a combination of all or part of the configurations and / or functions of the above-mentioned embodiments and the modified examples described in (B-1). Also, the probe cleaning device 1 may omit at least part of the configurations and / or functions of the above-mentioned embodiments and the modified examples described in (B-1). [Explanation of symbols]

[0062] 1...probe cleaning device, 2...probe unit, 3...cleaning unit, 3B...brush, 9...contact point, 10...support member, 20...probe base plate, 21...probe mounting surface, 30...probe, 31...tip portion, 32...inclined portion, 40...mask member, 41...insertion hole, 42...first countersink processing portion, 43...second countersink processing portion, 49...lower surface, 51...copper plate, 52...nickel layer, 53...resist layer, 400...upper surface, 410...inner surface.

Claims

1. A probe cleaning method for removing foreign matter adhering to a tip of a probe, comprising the steps of: A probe cleaning method comprising the steps of: passing the tip of the probe through an insertion hole formed in a jig; and pressing a rotating brush against the tip of the probe protruding from the insertion hole, thereby removing the foreign matter from the tip of the probe.

2. The jig is provided with a plurality of insertion holes at positions corresponding one-to-one to the plurality of probes.

2. The method of claim 1, wherein the probe is cleaned by a cleaning agent.

3. In the probe cleaning method, instead of pressing a rotating brush against the tip of the probe protruding from the insertion hole, The foreign matter is removed from the tip of the probe by irradiating the tip of the probe protruding from the insertion hole with a laser.

2. The method of claim 1, wherein the probe is cleaned by a cleaning agent.

4. In the probe cleaning method, instead of pressing a rotating brush against the tip of the probe protruding from the insertion hole, The foreign matter is removed from the tip of the probe by irradiating the tip of the probe protruding from the insertion hole with an ion beam.

2. The method of claim 1, wherein the probe is cleaned by a cleaning agent.

5. In the probe cleaning method, instead of pressing a rotating brush against the tip of the probe protruding from the insertion hole, The tip of the probe protruding from the insertion hole is sandblasted to remove the foreign matter from the tip of the probe.

2. The method of claim 1, wherein the probe is cleaned by a cleaning agent.

6. 2. The probe cleaning method according to claim 1, wherein the brush is made of a material softer than the tip of the probe.

7. A tool for use in cleaning a probe, comprising: A jig having a plurality of insertion holes into which a plurality of probes are respectively inserted.

8. The jig according to claim 7, characterized in that the jig is formed in a flat plate shape and is provided with a countersunk portion.

9. 9. The jig according to claim 8, wherein the countersunk portion is formed in a predetermined shape so as to accommodate a portion to be cleaned, including the tip of the probe.

10. The jig is A first step of laminating and forming, on a manufacturing substrate, a resist layer conforming to the shape of the insertion hole and a metal layer conforming to the shape of the jig other than the insertion hole; a second step of removing the resist layer; a third step of removing the manufacturing substrate to take out a jig made of the metal layer; The jig according to any one of claims 7 to 9, characterized in that the jig is manufactured by

Images